CN204204837U - A kind of chip cooling structure - Google Patents
A kind of chip cooling structure Download PDFInfo
- Publication number
- CN204204837U CN204204837U CN201420689825.4U CN201420689825U CN204204837U CN 204204837 U CN204204837 U CN 204204837U CN 201420689825 U CN201420689825 U CN 201420689825U CN 204204837 U CN204204837 U CN 204204837U
- Authority
- CN
- China
- Prior art keywords
- metal throuth
- throuth hole
- chip
- cooling structure
- ground pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to electronic technology field, be specifically related to a kind of chip cooling structure, for the syndeton of chip and printed circuit board, printed circuit board is provided with the ground pad for connecting chip, ground pad is provided with at least one metal throuth hole, opposingly with ground pad on printed circuit board show out Copper Foil district, metal throuth hole UNICOM ground pad and Copper Foil district.The utility model does not additionally increase cost, and by changing chip cooling structure, simplicity of design, easy to operate, radiating effect is more obvious.
Description
Technical field
The utility model relates to electronic technology field, is specifically related to a kind of chip cooling structure.
Background technology
Electronic consumer products outward appearance is more and more miniaturized and frivolous, PCB (the Printed CircuitBoard of the inside, printed circuit board) board area is more and more less, chip integration increases substantially, the plastic casing adopted under adding cost pressure, the while of bringing product attractive in appearance and high performance, works for a long time under relative high temperature, the stability of system receives challenge, and the heat radiation of product becomes problem demanding prompt solution.
Existing product heat radiation solves mainly through the mode that hot hole is broken up in product casing appropriate location, fin or provided with fan are installed in high power consuming devices surface, and the solution of louvre belongs to heat loss through convection, is only applicable to indoor type, cannot realize waterproof requirement; And high power consuming devices surface installation fin belongs to heat loss through conduction, effectively can only reduce the temperature of local, and easily by the restriction of structure, increase hardware cost simultaneously; The mode of provided with fan belongs to forced convertion heat radiation, can increase product size, generally be applicable to indoor large frame or frame-type product.
Utility model content
The purpose of this utility model is, provides a kind of chip cooling structure, solves above technical problem.
The technical problem that the utility model solves can realize by the following technical solutions:
A kind of chip cooling structure, for the syndeton of chip and printed circuit board, wherein, described printed circuit board is provided with the ground pad for connecting chip, described ground pad is provided with at least one metal throuth hole, opposingly with described ground pad on described printed circuit board show out Copper Foil district, ground pad described in described metal throuth hole UNICOM and described Copper Foil district.
Chip cooling structure of the present utility model, presumptive area coating tin cream in described Copper Foil district.
Chip cooling structure of the present utility model, described metal throuth hole comprises first kind metal throuth hole, and described first kind metal throuth hole is just to the center in the region corresponding to described ground pad.
Chip cooling structure of the present utility model, described metal throuth hole comprises multiple Equations of The Second Kind metal throuth hole, and the diameter of described Equations of The Second Kind metal throuth hole is less than the diameter of described first kind metal throuth hole, and described Equations of The Second Kind metal throuth hole is arranged around described first kind metal throuth hole.
Chip cooling structure of the present utility model, the diameter of described metal throuth hole is 2 mm to 5mm.
Chip cooling structure of the present utility model, the diameter of described metal throuth hole is 3 mm.
Chip cooling structure of the present utility model, described chip is square flat pin-free packaging structure.
Beneficial effect: owing to adopting above technical scheme, the utility model does not additionally increase cost, by changing chip cooling structure, simplicity of design, easy to operate, radiating effect is more obvious.
Accompanying drawing explanation
Fig. 1 is the concrete distribution schematic diagram of one of pad and metal throuth hole on printed circuit board of the present utility model;
Fig. 2 is the schematic diagram in the opposing face of printed circuit board of the present utility model and ground pad.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite of not making creative work, all belongs to the scope of the utility model protection.
It should be noted that, when not conflicting, the embodiment in the utility model and the feature in embodiment can combine mutually.
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail, but not as restriction of the present utility model.
With reference to Fig. 1, Fig. 2, a kind of chip cooling structure, for the syndeton of chip and printed circuit board 2, wherein, printed circuit board 2 is provided with the ground pad 11 for connecting chip, ground pad 11 is provided with at least one metal throuth hole 21, opposingly with ground pad on printed circuit board 2 shows out Copper Foil district 23, metal throuth hole 21 UNICOM's ground pad and Copper Foil district 23.
The utility model is by printed circuit board 2 offers metal throuth hole 21, Copper Foil district 23 of ground connection large bonding pad on chip and printed circuit board 2 back side skin being windowed is connected to increase heat-sinking capability, ventilation and heat effect is played in metal throuth hole 21 1 aspect and the direct conducting of ground pad, and Copper Foil of windowing with the back side is on the other hand connected and utilizes Copper Foil auxiliary heat dissipation.
Chip cooling structure of the present utility model, in Copper Foil district 23, presumptive area can apply tin cream.By manually going up tin, or forming thickness to a certain degree by tin on machine, utilizing tin cream to carry out efficiently radiates heat.Placing tin cream by steel mesh in Copper Foil district 23 makes area of dissipation become large, because tin cream has height, can form certain volume, be equivalent to one piece of small heat dissipating plate, make radiating effect more obvious.
Chip cooling structure of the present utility model, metal throuth hole 21 can comprise first kind metal throuth hole 211, and first kind metal throuth hole 211 is positioned at the center of ground pad 11.
Chip cooling structure of the present utility model, metal throuth hole 21 can also comprise multiple Equations of The Second Kind metal throuth hole 212, the diameter of Equations of The Second Kind metal throuth hole 212 is less than the diameter of first kind metal throuth hole 211, and Equations of The Second Kind metal throuth hole 212 is arranged around first kind metal throuth hole 211.
Chip cooling structure of the present utility model, the diameter of metal throuth hole 21 can be 2 to 5mm.Can be preferably 3mm.Chip is uniformly distributed the louvre in 3mm aperture on the region of printed circuit board, and the size in aperture determines printed circuit board 2 draught capacity, and the louvre ventilation and heat ability in 3mm aperture is comparatively outstanding, directly can reduce the physical temperature of printed circuit board 2.3mm aperture is comparatively reasonable frequently for printed circuit board 2 aperture of conventional 1.6mm and 1.0mm thickness of slab simultaneously, lower to the loss ratio of drill bit in lithography process, can controlled working cost.
Chip cooling structure of the present utility model, chip is square flat pin-free packaging structure (Quad FlatNo-lead Package, QFN).
In printed circuit board board making process, a procedure is brush solder mask.After lamination completes, last layer welding resistance is coated with on the surface (comprising upper surface and lower surface) of printed circuit board, by exposure imaging, expose the dish (comprising SMD and DIP pad) and hole that will weld, other does not have the place of pad to need brush one deck solder mask.Solder mask is a kind of protective layer, is also a kind of insulating barrier, be coated in printed board do not need weld base material and circuit on.Object produces bridge joint between circuit when preventing welding, provides the protective layer of permanent electric circumstance and chemical resistance, heat-resisting, insulation simultaneously.But, cover solder mask by shortcoming be the heat radiation being unfavorable for printed circuit board plate.The utility model passes through printed circuit board 2 surface treatment, ground pad 11 is arranged metal throuth hole 21, the ground connection large bonding pad in chip is utilized to be connected by metal throuth hole 21 and printed circuit board 2 back side skin Copper Foil of windowing, through hole can make printed circuit board 2 and metal throuth hole 21 form heat loss through convection, add printed circuit board 2 outer copper foil face auxiliary heat dissipation simultaneously, open steel mesh design and increase heat-sinking capability by upper tin cream simultaneously, additionally do not increase hardware cost, do not affect outward appearance, ventilated by via hole and chip conductive heat transfer radiating mode, reduce chip temperature, strengthen the cooling-down effect during running of product high-performance.Thisly do not increase flaggy, the basis not increasing cost increases chip convection channel, increases radiating mode, effectively strengthen the heat-sinking capability of chip.When product case break up hot hole, high power dissipating chip surface paste the means such as fin can't meet cooling requirements time, the utility model becomes the effective means strengthening heat radiation.
The foregoing is only the utility model preferred embodiment; not thereby execution mode of the present utility model and protection range is limited; to those skilled in the art; should recognize and all should be included in the scheme that equivalent replacement done by all utilization the utility model specifications and diagramatic content and apparent change obtain in protection range of the present utility model.
Claims (7)
1. a chip cooling structure, for the syndeton of chip and printed circuit board, it is characterized in that, described printed circuit board is provided with the ground pad for connecting chip, described ground pad is provided with at least one metal throuth hole, opposingly with described ground pad on described printed circuit board show out Copper Foil district, ground pad described in described metal throuth hole UNICOM and described Copper Foil district.
2. chip cooling structure according to claim 1, is characterized in that, presumptive area coating tin cream in described Copper Foil district.
3. chip cooling structure according to claim 1, is characterized in that, described metal throuth hole comprises first kind metal throuth hole, and described first kind metal throuth hole is just to the center in the region corresponding to described ground pad.
4. chip cooling structure according to claim 3, it is characterized in that, described metal throuth hole comprises multiple Equations of The Second Kind metal throuth hole, and the diameter of described Equations of The Second Kind metal throuth hole is less than the diameter of described first kind metal throuth hole, and described Equations of The Second Kind metal throuth hole is arranged around described first kind metal throuth hole.
5. chip cooling structure according to claim 1, is characterized in that, the diameter of described metal throuth hole is 2mm to 5mm.
6. chip cooling structure according to claim 5, is characterized in that, the diameter of described metal throuth hole is 3mm.
7. chip cooling structure according to claim 1, is characterized in that, described chip is square flat pin-free packaging structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420689825.4U CN204204837U (en) | 2014-11-17 | 2014-11-17 | A kind of chip cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420689825.4U CN204204837U (en) | 2014-11-17 | 2014-11-17 | A kind of chip cooling structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204204837U true CN204204837U (en) | 2015-03-11 |
Family
ID=52662763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420689825.4U Expired - Fee Related CN204204837U (en) | 2014-11-17 | 2014-11-17 | A kind of chip cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204204837U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934383A (en) * | 2015-07-13 | 2015-09-23 | 上海斐讯数据通信技术有限公司 | PCB packaging design method of QFN chip and the QFN chip |
| CN109121457A (en) * | 2016-03-24 | 2019-01-01 | 三电汽车部件株式会社 | Electronic-circuit device and inverter-integrated type electric compressor including the electronic-circuit device |
| CN111263506A (en) * | 2018-11-30 | 2020-06-09 | 浙江宇视科技有限公司 | Circuit board and electronic equipment |
-
2014
- 2014-11-17 CN CN201420689825.4U patent/CN204204837U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104934383A (en) * | 2015-07-13 | 2015-09-23 | 上海斐讯数据通信技术有限公司 | PCB packaging design method of QFN chip and the QFN chip |
| CN109121457A (en) * | 2016-03-24 | 2019-01-01 | 三电汽车部件株式会社 | Electronic-circuit device and inverter-integrated type electric compressor including the electronic-circuit device |
| CN109121457B (en) * | 2016-03-24 | 2020-09-22 | 三电汽车部件株式会社 | Electronic circuit device and inverter-integrated electric compressor including the same |
| CN111263506A (en) * | 2018-11-30 | 2020-06-09 | 浙江宇视科技有限公司 | Circuit board and electronic equipment |
| CN111263506B (en) * | 2018-11-30 | 2021-06-01 | 浙江宇视科技有限公司 | Circuit board and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150311 Termination date: 20181117 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |