CN205017685U - Aluminium base board of flexible composite - Google Patents
Aluminium base board of flexible composite Download PDFInfo
- Publication number
- CN205017685U CN205017685U CN201520577875.8U CN201520577875U CN205017685U CN 205017685 U CN205017685 U CN 205017685U CN 201520577875 U CN201520577875 U CN 201520577875U CN 205017685 U CN205017685 U CN 205017685U
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- China
- Prior art keywords
- silver bromide
- flexible
- insulating barrier
- photosensitive layer
- aluminium base
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Abstract
The utility model provides an aluminium base board of flexible composite, is including connecting gradually flexible thermal adhesive layer of copper foil conducting layer, first flexible thermal adhesive layer, insulating layer, second and flexible heat dissipation aluminium foil, be equipped with first silver bromide photolayer between insulating layer and the first flexible thermal adhesive layer, be equipped with second silver bromide photolayer between the flexible thermal adhesive layer of insulating layer and second, the whole area of first silver bromide photolayer and second silver bromide photolayer is the 15 -23 of insulating layer. Preparation method is simple to start the technological space of aluminium base board of flexible composite's information storage, improved the utilization ratio of product.
Description
Technical field
Basis is novel belongs to electronic product raw material field, particularly
oneplant flexible compound aluminium base.
Background technology
Along with electronic product is to future development that is light, little, thin and flexing, flexible circuit board demand is a dark horse, and advancing by leaps and bounds of LED market in recent years, traditional rigid aluminium base cannot meet the demand in market.The structure of current conventional aluminum substrate is aluminium sheet+glue-line+Copper Foil.Utility model patent publication number: CN204157157U implements to be coat thermal insulation layer in aluminium foil one side, and another side coats anticorrosive coat, then on thermal insulation layer, be coated with last layer flexible insulation heat-conducting layer, and thermal insulation layer arranges Copper Foil again.This flexible embodiment relies on the flexible heat-conducting layer of one deck, and this flexibility is poor, frangible easy fracture.And insulation is comparatively really poor.For this problem, the present embodiment fundamentally solves flexibility, and the material used because of this case is flexible material, all selects flexible material from raw material aluminium foil/Copper Foil.Aluminium foil selects thickness to be no more than the flexible aluminium foil of 0.15MM, and the high ductibility Copper Foil of thickness not 0.070MM selected by Copper Foil.Insulating barrier selects insulation property to reach the polyimide film of more than F level, and heat-conducting layer selects flexible rubber and Heat Conduction Material aluminium oxide and boron oxide, to reach flexible and heat-conducting effect.
But flexible PCB shorter mention information storage at present, nobody expects utilizing it to improve information capacity, and small size Large Copacity is the developing direction of current electronic product.
novel content
In order to solve point to be modified of the prior art, this novel object is to provide
oneplant flexible compound aluminium base, while can ensuring the quality of products, increase the information capacity of product.
For realizing above object, this novel technical scheme is:
A kind of flexible compound aluminium base, comprise connection copper foil conductive layer, the first flexible heat conduction glue-line, insulating barrier, the second flexible heat conduction glue-line and flexible heat sink aluminium foil successively, the first silver bromide photosensitive layer is provided with between described insulating barrier and the first flexible heat conduction glue-line, be provided with the second silver bromide photosensitive layer between insulating barrier and the second flexible heat conduction glue-line, the gross area of described first silver bromide photosensitive layer and the second silver bromide photosensitive layer is the 1/5-2/3 of insulating barrier.
Described first silver bromide photosensitive layer and the second silver bromide photosensitive layer thickness are 0.1-5 μm.
Described insulating barrier is the polyimide film of thickness 1-20 μm.
The gross area of described first silver bromide photosensitive layer and the second silver bromide photosensitive layer is the 1/3-2/3 of insulating barrier.
Described first silver bromide photosensitive layer and the second silver bromide photosensitive layer are mal-distribution on the two sides of insulating barrier.
The preparation method of flexible compound aluminium base, comprising: a, prepare flexible heat conduction glue; B, flexible heat conduction glue is uniformly coated in release liners, baking; C, the release liners being coated with flexible heat conduction glue-line that step b is obtained and Copper Foil compound, obtained Copper Foil composite bed; The release liners being coated with flexible heat conduction glue-line that step b is obtained and aluminium foil compound, obtained aluminium foil composite bed; D, by insulating barrier two face portion coating silver bromide; Put between the obtained Copper Foil composite bed of step c and aluminium foil composite bed by the insulating barrier of two face portion coating silver bromides, compound again, obtains the flexible compound aluminium base that this is novel.
By the detailed step of insulating barrier two face portion coating silver bromide be: first-selection prepares silver bromide film, release liners is put into silver bromide solution 1-5 minute, then takes out oven dry, cut to required size; With release liners and the insulating barrier compound of silver bromide thin layer, after compound, bromination silver layer is attached on insulating barrier, takes off the release liners cut.
This novel beneficial effect is:
1. the area of silver bromide photosensitive layer accounts for less than 2/3 of insulating barrier, ensure that the adhesion firmness between heat conduction adhesive-layer and insulating barrier.
2. preparation method is simple, and has started the technology space of the information storage of flexible compound aluminium base, improves the utilance of product.
Accompanying drawing explanation
Fig. 1 is the structural representation of this new embodiment 1.
In figure: 1, Copper Foil conductive layer; 2, the first flexible heat conduction glue-line; 3, insulating barrier; 4, the second flexible heat conduction glue-line; 5, flexible heat sink aluminium foil; 6, the first silver bromide photosensitive layer; 7, the second silver bromide photosensitive layer.
Embodiment
Further illustrate a kind of execution mode that this is novel with reference to the accompanying drawings.
Embodiment 1: as shown in Figure 1,
A kind of flexible compound aluminium base, comprise the flexible heat conduction glue-line 2 of connection copper foil conductive layer 1, first, insulating barrier 3, second flexible heat conduction glue-line 4 and flexible heat sink aluminium foil 5 successively, the first silver bromide photosensitive layer 6 is provided with between described insulating barrier 3 and the first flexible heat conduction glue-line 2, be provided with the second silver bromide photosensitive layer 7 between insulating barrier 3 and the second flexible heat conduction glue-line 4, the gross area of described first silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 is 1/3 of insulating barrier 3.
First silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 thickness are 1 μm.
Insulating barrier 3 is the polyimide film of thickness 10 μm.
First silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 are mal-distribution on the two sides of insulating barrier.
A preparation method for flexible compound aluminium base, comprising: a, prepare flexible heat conduction glue; B, flexible heat conduction glue is uniformly coated in release liners, baking; C, the release liners being coated with flexible heat conduction glue-line that step b is obtained and Copper Foil compound, obtained Copper Foil composite bed; The release liners being coated with flexible heat conduction glue-line that step b is obtained and aluminium foil compound, obtained aluminium foil composite bed; D, by insulating barrier two face portion coating silver bromide; Put between the obtained Copper Foil composite bed of step c and aluminium foil composite bed by the insulating barrier of two face portion coating silver bromides, compound again, obtains the flexible compound aluminium base that this is novel.
By the detailed step of insulating barrier two face portion coating silver bromide be: first-selection prepares silver bromide film, release liners is put into silver bromide solution 1-5 minute, then takes out oven dry, cut to required size; With release liners and the insulating barrier compound of silver bromide thin layer, after compound, bromination silver layer is attached on insulating barrier, takes off the release liners cut.
Embodiment 2:
A kind of flexible compound aluminium base, comprise the flexible heat conduction glue-line 2 of connection copper foil conductive layer 1, first, insulating barrier 3, second flexible heat conduction glue-line 4 and flexible heat sink aluminium foil 5 successively, the first silver bromide photosensitive layer 6 is provided with between described insulating barrier 3 and the first flexible heat conduction glue-line 2, be provided with the second silver bromide photosensitive layer 7 between insulating barrier 3 and the second flexible heat conduction glue-line 4, the gross area of described first silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 is 2/3 of insulating barrier 3.
First silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 thickness are 0.5 μm.
Insulating barrier 3 is the polyimide film of thickness 20 μm.
First silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 are mal-distribution on the two sides of insulating barrier.
A preparation method for flexible compound aluminium base, comprising: a, prepare flexible heat conduction glue; B, flexible heat conduction glue is uniformly coated in release liners, baking; C, the release liners being coated with flexible heat conduction glue-line that step b is obtained and Copper Foil compound, obtained Copper Foil composite bed; The release liners being coated with flexible heat conduction glue-line that step b is obtained and aluminium foil compound, obtained aluminium foil composite bed; D, by insulating barrier two face portion coating silver bromide; Put between the obtained Copper Foil composite bed of step c and aluminium foil composite bed by the insulating barrier of two face portion coating silver bromides, compound again, obtains the flexible compound aluminium base that this is novel.
By the detailed step of insulating barrier two face portion coating silver bromide be: first-selection prepares silver bromide film, release liners is put into silver bromide solution 1-5 minute, then takes out oven dry, cut to required size; With release liners and the insulating barrier compound of silver bromide thin layer, after compound, bromination silver layer is attached on insulating barrier, takes off the release liners cut.
The above not imposes any restrictions this novel technical scope, all above embodiment is done according to this new technique essence any amendment, equivalent variations and modification, all still belong in the scope of this novel technical scheme.
Claims (5)
1. a flexible compound aluminium base, it is characterized in that: comprise connection copper foil conductive layer, the first flexible heat conduction glue-line, insulating barrier, the second flexible heat conduction glue-line and flexible heat sink aluminium foil successively, the first silver bromide photosensitive layer is provided with between described insulating barrier and the first flexible heat conduction glue-line, be provided with the second silver bromide photosensitive layer between insulating barrier and the second flexible heat conduction glue-line, the gross area of described first silver bromide photosensitive layer and the second silver bromide photosensitive layer is the 1/5-2/3 of insulating barrier.
2. flexible compound aluminium base according to claim 1, is characterized in that: described first silver bromide photosensitive layer and the second silver bromide photosensitive layer thickness are 0.1-5 μm.
3. flexible compound aluminium base according to claim 1, is characterized in that: described insulating barrier is the polyimide film of thickness 1-20 μm.
4. flexible compound aluminium base according to claim 1, is characterized in that: the gross area of described first silver bromide photosensitive layer and the second silver bromide photosensitive layer is the 1/3-2/3 of insulating barrier.
5. flexible compound aluminium base according to claim 1, is characterized in that: described first silver bromide photosensitive layer and the second silver bromide photosensitive layer are mal-distribution on the two sides of insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520577875.8U CN205017685U (en) | 2015-08-04 | 2015-08-04 | Aluminium base board of flexible composite |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520577875.8U CN205017685U (en) | 2015-08-04 | 2015-08-04 | Aluminium base board of flexible composite |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205017685U true CN205017685U (en) | 2016-02-03 |
Family
ID=55216266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520577875.8U Withdrawn - After Issue CN205017685U (en) | 2015-08-04 | 2015-08-04 | Aluminium base board of flexible composite |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205017685U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101626A (en) * | 2015-08-04 | 2015-11-25 | 东莞市毅联电子科技有限公司 | Flexible composite aluminum substrate and preparation method thereof |
-
2015
- 2015-08-04 CN CN201520577875.8U patent/CN205017685U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101626A (en) * | 2015-08-04 | 2015-11-25 | 东莞市毅联电子科技有限公司 | Flexible composite aluminum substrate and preparation method thereof |
| CN105101626B (en) * | 2015-08-04 | 2018-04-24 | 东莞市毅联电子科技有限公司 | A kind of flexible compound aluminum substrate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20160203 Effective date of abandoning: 20180424 |