CN105101626A - Flexible composite aluminum substrate and preparation method thereof - Google Patents
Flexible composite aluminum substrate and preparation method thereof Download PDFInfo
- Publication number
- CN105101626A CN105101626A CN201510469867.6A CN201510469867A CN105101626A CN 105101626 A CN105101626 A CN 105101626A CN 201510469867 A CN201510469867 A CN 201510469867A CN 105101626 A CN105101626 A CN 105101626A
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- CN
- China
- Prior art keywords
- silver bromide
- flexible
- insulating barrier
- photosensitive layer
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a flexible composite aluminum substrate and a preparation method thereof. The flexible composite aluminum substrate comprises a copper foil conducting layer, a first flexible heat conducting glue layer, an insulation layer, a second flexible heat conducting glue layer and a flexible radiating aluminum foil which are connected successively, a first silver bromide photosensitive layer is arranged between the insulation layer and the first flexible heat conducting glue layer, a second silver bromide photosensitive layer is arranged between the insulation layer and the second flexible heat conducting glue layer, and the total area of the first and second silver bromide photosensitive layers is 1/5 to 2/3 that of the insulation layer. The preparation method is simple, the flexible composite aluminum substrate can be used for information storage innovatively, and the utilization rate of the products is improved.
Description
Technical field
The invention belongs to electronic product raw material field, particularly
oneplant flexible compound aluminium base and preparation method thereof.
Background technology
Along with electronic product is to future development that is light, little, thin and flexing, flexible circuit board demand is a dark horse, and advancing by leaps and bounds of LED market in recent years, traditional rigid aluminium base cannot meet the demand in market.The structure of current conventional aluminum substrate is aluminium sheet+glue-line+Copper Foil.Utility model patent publication number: CN204157157U implements to be coat thermal insulation layer in aluminium foil one side, and another side coats anticorrosive coat, then on thermal insulation layer, be coated with last layer flexible insulation heat-conducting layer, and thermal insulation layer arranges Copper Foil again.This flexible embodiment relies on the flexible heat-conducting layer of one deck, and this flexibility is poor, frangible easy fracture.And insulation is comparatively really poor.For this problem, the present embodiment fundamentally solves flexibility, and the material used because of this case is flexible material, all selects flexible material from raw material aluminium foil/Copper Foil.Aluminium foil selects thickness to be no more than the flexible aluminium foil of 0.15MM, and the high ductibility Copper Foil of thickness not 0.070MM selected by Copper Foil.Insulating barrier selects insulation property to reach the polyimide film of more than F level, and heat-conducting layer selects flexible rubber and Heat Conduction Material aluminium oxide and boron oxide, to reach flexible and heat-conducting effect.
But flexible PCB shorter mention information storage at present, nobody expects utilizing it to improve information capacity, and small size Large Copacity is the developing direction of current electronic product.
Summary of the invention
In order to solve point to be modified of the prior art, the object of this invention is to provide
oneplant flexible compound aluminium base, while can ensuring the quality of products, increase the information capacity of product.
Another object of the present invention is to provide
oneplant the preparation method of flexible compound aluminium base.
For realizing above object, technical scheme of the present invention is:
A kind of flexible compound aluminium base, comprise connection copper foil conductive layer, the first flexible heat conduction glue-line, insulating barrier, the second flexible heat conduction glue-line and flexible heat sink aluminium foil successively, the first silver bromide photosensitive layer is provided with between described insulating barrier and the first flexible heat conduction glue-line, be provided with the second silver bromide photosensitive layer between insulating barrier and the second flexible heat conduction glue-line, the gross area of described first silver bromide photosensitive layer and the second silver bromide photosensitive layer is the 1/5-2/3 of insulating barrier.
Described first silver bromide photosensitive layer and the second silver bromide photosensitive layer thickness are 0.1-5 μm.
Described insulating barrier is the polyimide film of thickness 1-20 μm.
The gross area of described first silver bromide photosensitive layer and the second silver bromide photosensitive layer is the 1/3-2/3 of insulating barrier.
Described first silver bromide photosensitive layer and the second silver bromide photosensitive layer are mal-distribution on the two sides of insulating barrier.
A preparation method for flexible compound aluminium base, comprising: a, prepare flexible heat conduction glue; B, flexible heat conduction glue is uniformly coated in release liners, baking; C, the release liners being coated with flexible heat conduction glue-line that step b is obtained and Copper Foil compound, obtained Copper Foil composite bed; The release liners being coated with flexible heat conduction glue-line that step b is obtained and aluminium foil compound, obtained aluminium foil composite bed; D, by insulating barrier two face portion coating silver bromide; Put between the obtained Copper Foil composite bed of step c and aluminium foil composite bed by the insulating barrier of two face portion coating silver bromides, compound again, obtains flexible compound aluminium base of the present invention.
By the detailed step of insulating barrier two face portion coating silver bromide be: first-selection prepares silver bromide film, release liners is put into silver bromide solution 1-5 minute, then takes out oven dry, cut to required size; With release liners and the insulating barrier compound of silver bromide thin layer, after compound, bromination silver layer is attached on insulating barrier, takes off the release liners cut.
The invention has the beneficial effects as follows:
1. the area of silver bromide photosensitive layer accounts for less than 2/3 of insulating barrier, ensure that the adhesion firmness between heat conduction adhesive-layer and insulating barrier.
2. preparation method is simple, and has started the technology space of the information storage of flexible compound aluminium base, improves the utilance of product.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention 1.
In figure: 1, Copper Foil conductive layer; 2, the first flexible heat conduction glue-line; 3, insulating barrier; 4, the second flexible heat conduction glue-line; 5, flexible heat sink aluminium foil; 6, the first silver bromide photosensitive layer; 7, the second silver bromide photosensitive layer.
Embodiment
Further illustrate one embodiment of the present invention with reference to the accompanying drawings.
Embodiment 1: as shown in Figure 1,
A kind of flexible compound aluminium base, comprise the flexible heat conduction glue-line 2 of connection copper foil conductive layer 1, first, insulating barrier 3, second flexible heat conduction glue-line 4 and flexible heat sink aluminium foil 5 successively, the first silver bromide photosensitive layer 6 is provided with between described insulating barrier 3 and the first flexible heat conduction glue-line 2, be provided with the second silver bromide photosensitive layer 7 between insulating barrier 3 and the second flexible heat conduction glue-line 4, the gross area of described first silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 is 1/3 of insulating barrier 3.
First silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 thickness are 1 μm.
Insulating barrier 3 is the polyimide film of thickness 10 μm.
First silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 are mal-distribution on the two sides of insulating barrier.
A preparation method for flexible compound aluminium base, comprising: a, prepare flexible heat conduction glue; B, flexible heat conduction glue is uniformly coated in release liners, baking; C, the release liners being coated with flexible heat conduction glue-line that step b is obtained and Copper Foil compound, obtained Copper Foil composite bed; The release liners being coated with flexible heat conduction glue-line that step b is obtained and aluminium foil compound, obtained aluminium foil composite bed; D, by insulating barrier two face portion coating silver bromide; Put between the obtained Copper Foil composite bed of step c and aluminium foil composite bed by the insulating barrier of two face portion coating silver bromides, compound again, obtains flexible compound aluminium base of the present invention.
By the detailed step of insulating barrier two face portion coating silver bromide be: first-selection prepares silver bromide film, release liners is put into silver bromide solution 1-5 minute, then takes out oven dry, cut to required size; With release liners and the insulating barrier compound of silver bromide thin layer, after compound, bromination silver layer is attached on insulating barrier, takes off the release liners cut.
Embodiment 2:
A kind of flexible compound aluminium base, comprise the flexible heat conduction glue-line 2 of connection copper foil conductive layer 1, first, insulating barrier 3, second flexible heat conduction glue-line 4 and flexible heat sink aluminium foil 5 successively, the first silver bromide photosensitive layer 6 is provided with between described insulating barrier 3 and the first flexible heat conduction glue-line 2, be provided with the second silver bromide photosensitive layer 7 between insulating barrier 3 and the second flexible heat conduction glue-line 4, the gross area of described first silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 is 2/3 of insulating barrier 3.
First silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 thickness are 0.5 μm.
Insulating barrier 3 is the polyimide film of thickness 20 μm.
First silver bromide photosensitive layer 6 and the second silver bromide photosensitive layer 7 are mal-distribution on the two sides of insulating barrier.
A preparation method for flexible compound aluminium base, comprising: a, prepare flexible heat conduction glue; B, flexible heat conduction glue is uniformly coated in release liners, baking; C, the release liners being coated with flexible heat conduction glue-line that step b is obtained and Copper Foil compound, obtained Copper Foil composite bed; The release liners being coated with flexible heat conduction glue-line that step b is obtained and aluminium foil compound, obtained aluminium foil composite bed; D, by insulating barrier two face portion coating silver bromide; Put between the obtained Copper Foil composite bed of step c and aluminium foil composite bed by the insulating barrier of two face portion coating silver bromides, compound again, obtains flexible compound aluminium base of the present invention.
By the detailed step of insulating barrier two face portion coating silver bromide be: first-selection prepares silver bromide film, release liners is put into silver bromide solution 1-5 minute, then takes out oven dry, cut to required size; With release liners and the insulating barrier compound of silver bromide thin layer, after compound, bromination silver layer is attached on insulating barrier, takes off the release liners cut.
The above not imposes any restrictions technical scope of the present invention, all above embodiment is done according to the technology of the present invention essence any amendment, equivalent variations and modification, all still belong in the scope of technical scheme of the present invention.
Claims (7)
1. a flexible compound aluminium base, it is characterized in that: comprise connection copper foil conductive layer, the first flexible heat conduction glue-line, insulating barrier, the second flexible heat conduction glue-line and flexible heat sink aluminium foil successively, the first silver bromide photosensitive layer is provided with between described insulating barrier and the first flexible heat conduction glue-line, be provided with the second silver bromide photosensitive layer between insulating barrier and the second flexible heat conduction glue-line, the gross area of described first silver bromide photosensitive layer and the second silver bromide photosensitive layer is the 1/5-2/3 of insulating barrier.
2. flexible compound aluminium base according to claim 1, is characterized in that: described first silver bromide photosensitive layer and the second silver bromide photosensitive layer thickness are 0.1-5 μm.
3. flexible compound aluminium base according to claim 1, is characterized in that: described insulating barrier is the polyimide film of thickness 1-20 μm.
4. flexible compound aluminium base according to claim 1, is characterized in that: the gross area of described first silver bromide photosensitive layer and the second silver bromide photosensitive layer is the 1/3-2/3 of insulating barrier.
5. flexible compound aluminium base according to claim 1, is characterized in that: described first silver bromide photosensitive layer and the second silver bromide photosensitive layer are mal-distribution on the two sides of insulating barrier.
6. a preparation method for flexible compound aluminium base, comprising: a, prepare flexible heat conduction glue; B, flexible heat conduction glue is uniformly coated in release liners, baking; C, the release liners being coated with flexible heat conduction glue-line that step b is obtained and Copper Foil compound, obtained Copper Foil composite bed; The release liners being coated with flexible heat conduction glue-line that step b is obtained and aluminium foil compound, obtained aluminium foil composite bed; D, by insulating barrier two face portion coating silver bromide; Put between the obtained Copper Foil composite bed of step c and aluminium foil composite bed by the insulating barrier of two face portion coating silver bromides, compound again, obtains the flexible compound aluminium base described in any one of the claims in the present invention 1-5.
7. the preparation method of flexible compound aluminium base according to claim 6, by the detailed step of insulating barrier two face portion coating silver bromide be: first-selection prepares silver bromide film, release liners is put into silver bromide solution 1-5 minute, then take out oven dry, cut to required size; With release liners and the insulating barrier compound of silver bromide thin layer, after compound, bromination silver layer is attached on insulating barrier, takes off the release liners cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510469867.6A CN105101626B (en) | 2015-08-04 | 2015-08-04 | A kind of flexible compound aluminum substrate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510469867.6A CN105101626B (en) | 2015-08-04 | 2015-08-04 | A kind of flexible compound aluminum substrate and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105101626A true CN105101626A (en) | 2015-11-25 |
| CN105101626B CN105101626B (en) | 2018-04-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510469867.6A Active CN105101626B (en) | 2015-08-04 | 2015-08-04 | A kind of flexible compound aluminum substrate and preparation method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109361050A (en) * | 2018-10-09 | 2019-02-19 | 合肥联宝信息技术有限公司 | The production method of composite substrate, shell and composite substrate |
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| US20060188701A1 (en) * | 2005-02-22 | 2006-08-24 | Andresakis John A | Multilayered construction for resistor and capacitor formation |
| CN103066186A (en) * | 2013-01-07 | 2013-04-24 | 浙江华正新材料股份有限公司 | Insulating layer and aluminum substrate of ceramic chip composite structure and manufacturing method of the same |
| CN203700246U (en) * | 2013-12-04 | 2014-07-09 | 天津大学 | Structure of nanometer silver bromide-polyimide composite film |
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN205017685U (en) * | 2015-08-04 | 2016-02-03 | 东莞市毅联电子科技有限公司 | Aluminium base board of flexible composite |
-
2015
- 2015-08-04 CN CN201510469867.6A patent/CN105101626B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060188701A1 (en) * | 2005-02-22 | 2006-08-24 | Andresakis John A | Multilayered construction for resistor and capacitor formation |
| CN103066186A (en) * | 2013-01-07 | 2013-04-24 | 浙江华正新材料股份有限公司 | Insulating layer and aluminum substrate of ceramic chip composite structure and manufacturing method of the same |
| CN203700246U (en) * | 2013-12-04 | 2014-07-09 | 天津大学 | Structure of nanometer silver bromide-polyimide composite film |
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN205017685U (en) * | 2015-08-04 | 2016-02-03 | 东莞市毅联电子科技有限公司 | Aluminium base board of flexible composite |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109361050A (en) * | 2018-10-09 | 2019-02-19 | 合肥联宝信息技术有限公司 | The production method of composite substrate, shell and composite substrate |
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| CN105101626B (en) | 2018-04-24 |
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