CN104754862A - Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate - Google Patents
Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate Download PDFInfo
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- CN104754862A CN104754862A CN201510169388.2A CN201510169388A CN104754862A CN 104754862 A CN104754862 A CN 104754862A CN 201510169388 A CN201510169388 A CN 201510169388A CN 104754862 A CN104754862 A CN 104754862A
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- Prior art keywords
- aluminium foil
- dielectric film
- substrate
- copper facing
- copper
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses an aluminum foil copper plating substrate for a flexible circuit board and a manufacturing method of the aluminum foil copper plating substrate. The aluminum foil copper plating substrate comprises an insulating film, an adhesive layer, an aluminum foil and a copper plating layer. The copper plating layer is coated on the surface of the aluminum foil which is adhered to the surface of the insulating film through the adhesive layer. The insulating film is 5-200 micrometers, the adhesive layer is 5-50 micrometers, the aluminum foil is 5-200 micrometers, and the copper plating layer is 1-5 micrometers. The aluminum foil copper plating substrate can be made into a single-aluminum-foil copper plating substrate or a copper plating substrate with aluminum foils on double faces according to needs. Since copper foils are partially replaced by the aluminum foil, cost is reduced while heat conductivity and reflection performance are improved; due to a copper foil on the surface of the substrate, oxidation of the aluminum foil is prevented while weldability is improved. In addition, the aluminum foil copper plating substrate has the advantages of high flexibility, high heat conductivity, high reflectivity, low cost, easiness in production and the like.
Description
Technical field
The present invention relates to a kind of copper clad laminate, be specifically related to a kind of high flexibility substrate for flexible circuit board.
Background technology
The progress of information, communication industry has driven the high speed development of microelectronics industry, flexible print wiring (FPC) arises at the historic moment and obtains fast development, is widely used in fields such as smart mobile phone, notebook computer, panel computer, LCDs, car lights.Current electronic system is towards compact, high-fire resistance, multi-functional, densification, high reliability and the future development of low cost, and therefore selecting of substrate just becomes very important influencing factor.At present, substrate major part is copper clad laminate, also has some for the aluminium base of LED.
Aluminium, because of thermal conductivity, light weight, the reflectivity of its excellence, flexibility has been widely used in electronic material.Aluminium has high reverse--bias degree, and quality is soft, ductility is good, has argenteous gloss, low cost and other advantages.
Summary of the invention
In order to solve the problems of the technologies described above, the invention provides a kind of the aluminium foil copper facing substrate and the manufacture method that are applicable to flexible circuit board, the aluminium foil copper facing substrate that the present invention is used for flexible circuit board adopts aluminium foil to instead of part Copper Foil, not only reduce cost, also improve heat conductivility and reflecting properties, and substrate surface is Copper Foil, aluminium foil is not only prevented to be oxidized, also add weldability, the aluminium foil copper facing substrate being applicable to flexible circuit board of the present invention has high flexibility, high-termal conductivity, high reflective and low cost, is easy to the advantages such as production.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of aluminium foil copper facing substrate for flexible circuit board, comprise dielectric film, adhesive layer, aluminium foil and copper plate, described aluminium foil passes through described adhesive layer then in described insulating film surface, described copper plate is plated on described aluminium foil surface, the thickness of described dielectric film is 5 μm-200 μm, the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described aluminium foil is 5 μm-200 μm, and the thickness of described copper plate is 1 μm-5 μm.
Say further, described dielectric film is the one in polyimide film, PET film, thermoplastic polyimides's film.
Say further, described adhesive layer is at least one in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.
Furthermore, described adhesive layer can be the heat-conducting glue adhensive layer containing heat radiation powder, and described heat radiation powder is AL
2o
3or B
2o
3, described heat radiation powder accounts for the 30%-80% of resin solid content.
Say further, described copper plate is the one in electro-coppering or sputter copper.
The present invention provides two kinds of aluminium foil copper facing board structures meeting foregoing invention and conceive below to solve its technical problem:
The first aluminium foil copper facing board structure: one side aluminium foil copper facing substrate, and be made up of one deck dielectric film, one deck adhesive layer, one deck aluminium foil and one deck copper plate four layer of material, described dielectric film has two relative surfaces, described aluminium foil is by described adhesive layer then in a surface of described dielectric film, and described copper plate is plated on described aluminium foil surface.
The manufacture method of above-mentioned one side aluminium foil copper facing substrate has two kinds below:
Method A. is coating adhesive adhensive layer on a surface of dielectric film, through prebake conditions, then pressing aluminium foil, the pressure given by the gap between roller and roller, makes dielectric film and aluminium foil by middle adhesive layer close adhesion, to form aluminum foil substrate; Then, toast this aluminum foil substrate, resin bed is solidified; Finally, in the aluminium foil surface copper facing of aluminum foil substrate, form one side aluminium foil copper facing substrate;
Method B. is coating adhesive adhensive layer on a surface of dielectric film, through prebake conditions, then the aluminium foil surface of the copper-plated aluminium foil of pressing, the pressure given by the gap between roller and roller, make dielectric film and aluminium foil by middle adhesive layer close adhesion, to form one side aluminium foil copper facing substrate; Finally, toast this one side aluminium foil copper facing substrate, resin bed is solidified, form final one side aluminium foil copper facing substrate.
The second aluminium foil copper facing board structure: double-sided aluminum foil copper facing substrate, be made up of one deck dielectric film, two-layer adhesive layer, two-layer aluminium foil and two-layer copper plate seven layer of material, described dielectric film has two relative surfaces, described two-layer aluminium foil is respectively by described adhesive layer then in two surfaces of described dielectric film, and described two-layer copper plate is plated on two-layer aluminium foil surface respectively.
The manufacture method of above-mentioned double-sided aluminum foil copper facing substrate has two kinds below:
Method A. is coating adhesive adhensive layer on a surface of dielectric film, through prebake conditions, then pressing aluminium foil, the pressure given by the gap between roller and roller, makes dielectric film and aluminium foil by middle adhesive layer close adhesion, to form one side aluminum foil substrate; Then, at another coating adhesive adhensive layer more on the surface of the dielectric film of this one side aluminum foil substrate, through prebake conditions, pressing aluminium foil again, by the pressure that the gap between roller and roller give, dielectric film and aluminium foil pass through middle adhesive layer close adhesion, to form double-sided aluminum foil substrate; Then, toast this double-sided aluminum foil substrate, resin bed is solidified; Finally, in the aluminium foil surface copper facing of double-sided aluminum foil substrate, form double-sided aluminum foil copper facing substrate;
Method B. is coating adhesive adhensive layer on a surface of dielectric film, through prebake conditions, the aluminium foil surface of the copper-plated aluminium foil of pressing again, by the pressure that the gap between roller and roller give, make dielectric film and copper facing aluminium foil by middle adhesive layer close adhesion, to form one side aluminium foil copper facing substrate; Then at another coating adhesive adhensive layer more on the surface of the dielectric film of this one side aluminium foil copper facing substrate, through prebake conditions, the aluminium foil surface of the copper-plated aluminium foil of pressing again, by the pressure that the gap between roller and roller give, dielectric film and aluminium foil pass through middle adhesive layer close adhesion, to form double-sided aluminum foil copper facing substrate; Finally, toast this double-sided aluminum foil copper facing substrate, resin bed is solidified, form final double-sided aluminum foil copper facing substrate.
The invention has the beneficial effects as follows: the aluminium foil copper facing substrate for flexible circuit board of the present invention comprises dielectric film, adhesive layer, aluminium foil and copper plate, aluminium foil passes through adhesive layer then in insulating film surface, copper plate is plated on aluminium foil surface, aluminium foil copper facing substrate of the present invention adopts aluminium foil to instead of part Copper Foil, not only reduce cost, also due to reflectivity and the thermal conductivity of aluminium foil excellence, the copper clad laminate making the present invention more conventional improves heat conductivility and reflecting properties; And substrate surface is Copper Foil, not only prevents aluminium foil to be oxidized, also add weldability; The present invention, owing to adopting dielectric film pressing aluminium foil, has high flexibility; Due to the reflectivity of aluminium foil excellence, the flexible circuit board of production can be used for the fields such as auto lamp; The aluminum foil substrate that the present invention adopts dielectric film pressing aluminium foil to produce, again at its copper coating, technique achieves simplification, be conducive to cost-saving and improve yield, cost has price advantage, and adjust dielectric film, adhesive and aluminium foil layer thickness in the scope that can specify if necessary in the present invention, to have excellent radiating effect, adhesive layer can also add heat radiation powder to promote heat conductivility further simultaneously.
Accompanying drawing explanation
Fig. 1 is one side aluminium foil copper facing board structure schematic diagram of the present invention;
Fig. 2 is double-sided aluminum foil copper facing board structure schematic diagram of the present invention.
Embodiment
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: a kind of one side aluminium foil copper facing substrate for flexible circuit board, as shown in Figure 1, be made up of one deck dielectric film 104, one deck adhesive layer 103, one deck aluminium foil 102 and one deck copper plate 101 4 layer of material, described dielectric film has two relative surfaces, described aluminium foil is by described adhesive layer then in a surface of described dielectric film, and described copper plate is plated on described aluminium foil surface.The thickness of described dielectric film is 5 μm-200 μm, and the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described aluminium foil is 5 μm-200 μm, and the thickness of described copper plate is 1 μm-5 μm.
Wherein, described dielectric film is the one in polyimide film, PET film, thermoplastic polyimides's film.
Described adhesive layer is at least one in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.In order to increase the heat conductivility of adhesive layer, described adhesive layer can be the heat-conducting glue adhensive layer containing heat radiation powder, and described heat radiation powder is AL
2o
3or B
2o
3, described heat radiation powder accounts for the 30%-80% of resin solid content.
Described copper plate is the one in electro-coppering or sputter copper.
Embodiment 1: at thickness be 25um dielectric film on coating thickness be the adhesive layer of 15um, through short time prebake conditions, then pressing aluminium foil, the pressure given by the gap between roller and roller, make dielectric film and aluminium foil by middle adhesive layer close adhesion, to form aluminum foil substrate; Then, toast this aluminum foil substrate, resin bed is solidified; Finally, at aluminum foil substrate copper coating, form final one side aluminium foil copper facing substrate.Wherein adhesive layer can be self-control modified epoxy glue.
Embodiment 2: at thickness be 12.5um dielectric film on coating thickness be the heat-conducting glue adhensive layer of 13um, through short time prebake conditions, the aluminium foil that pressing 15um is thick again, by the pressure that the gap between roller and roller give, dielectric film and aluminium foil pass through middle adhesive layer close adhesion, to form aluminum foil substrate; Then, toast this aluminum foil substrate, resin bed is solidified; Finally, at aluminum foil substrate copper coating, form final one side aluminium foil copper facing substrate.Wherein adhesive layer can be self-control modification heat-conduction epoxy resin glue.
Embodiment 3: at thickness be 25um dielectric film on coating thickness be the adhesive layer of 15um, through short time prebake conditions, pressing thickness is the aluminium foil of copper facing of 18 μm again, by the pressure that the gap between roller and roller give, the aluminium foil surface of dielectric film and copper facing aluminium foil passes through middle adhesive layer close adhesion, to form aluminium foil copper facing substrate; Then, toast this aluminium foil copper facing substrate, resin bed is solidified; Form final one side aluminium foil copper facing substrate.Wherein adhesive layer can be self-control modification heat-conduction epoxy resin glue.
Embodiment: a kind of double-sided aluminum foil copper facing substrate for flexible circuit board, as shown in Figure 2, be made up of one deck dielectric film 104, two-layer adhesive layer 103, two-layer aluminium foil 102 and two-layer copper plate 101 7 layer of material, described dielectric film has two relative surfaces, described two-layer aluminium foil is respectively by described adhesive layer then in two surfaces of described dielectric film, and described two-layer copper plate is plated on two-layer aluminium foil surface respectively.The thickness of described dielectric film is 5 μm-200 μm, and the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described aluminium foil is 5 μm-200 μm, and the thickness of described copper plate is 1 μm-5 μm.
Wherein, described dielectric film is the one in polyimide film, PET film, thermoplastic polyimides's film.
Described adhesive layer is at least one in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system, preferably epoxy resin or esters of acrylic acid.In order to increase the heat conductivility of adhesive layer, described adhesive layer can be the heat-conducting glue adhensive layer containing heat radiation powder, and described heat radiation powder is AL
2o
3or B
2o
3, described heat radiation powder accounts for the 30%-80% of resin solid content.
Described copper plate is the one in electro-coppering or sputter copper.
Embodiment 4: at thickness be 12.5um dielectric film on coating thickness be the thermal paste adhensive layer of 13um, through short time prebake conditions, pressing aluminium foil again, by the pressure that the gap between roller and roller give, dielectric film and aluminium foil pass through middle adhesive layer close adhesion, to form one side aluminum foil substrate; Then, on the insulation film face of this one side aluminum foil substrate, coating thickness is the thermal paste adhensive layer of 13um again, through short time prebake conditions, pressing aluminium foil again, by the pressure that the gap between roller and roller give, make dielectric film and aluminium foil by middle adhesive layer close adhesion, form double-sided aluminum foil substrate; Then, toast this double-sided aluminum foil substrate, resin bed is solidified; Finally, in the copper facing of double-sided aluminum foil substrate surface, form final double-sided aluminum foil copper facing substrate.Wherein adhesive layer can be self-control modification heat radiation epoxide-resin glue.
Embodiment 5: the dielectric film that a 25um is provided, in one surface, coating thickness is the adhesive layer of 15um, through short time prebake conditions, pressing thickness is the aluminium foil of copper facing of 18 μm again, by the pressure that the gap between roller and roller give, the aluminium foil surface of dielectric film and copper facing aluminium foil, by middle adhesive layer close adhesion, forms one side aluminium foil copper facing substrate; Then, in dielectric film another on the surface coating thickness be the adhesive layer of 15um, through short time prebake conditions, the aluminium foil of copper facing of pressing 18 μm again, by the pressure that the gap between roller and roller give, make the aluminium foil surface of dielectric film and copper facing aluminium foil by middle adhesive layer close adhesion, form double-sided aluminum foil copper facing substrate; Then, toast this double-sided aluminum foil copper facing substrate, resin bed is solidified; Finally, final double-sided aluminum foil copper facing substrate is formed.
The bounce Experimental Comparison of the copper clad laminate of aluminium foil copper facing substrate of the present invention and prior art is as shown in table 1 below:
Table 1:
By the bounce experimental data recorded in table 1, can prove that aluminium foil copper facing substrate of the present invention has preferably flexibility.
Claims (10)
1. the aluminium foil copper facing substrate for flexible circuit board, it is characterized in that: comprise dielectric film, adhesive layer, aluminium foil and copper plate, described aluminium foil passes through described adhesive layer then in described insulating film surface, described copper plate is plated on described aluminium foil surface, the thickness of described dielectric film is 5 μm-200 μm, the thickness of described adhesive layer is 5 μm-50 μm, and the thickness of described aluminium foil is 5 μm-200 μm, and the thickness of described copper plate is 1 μm-5 μm.
2., as claimed in claim 1 for the aluminium foil copper facing substrate of flexible circuit board, it is characterized in that: described dielectric film is the one in polyimide film, PET film, thermoplastic polyimides's film; Described adhesive layer is at least one in epoxy resin, acrylic acid series, poly-silica system, phenolic resins system and polyurethane system.
3. as claimed in claim 2 for the aluminium foil copper facing substrate of flexible circuit board, it is characterized in that: described adhesive layer is the heat-conducting glue adhensive layer containing heat radiation powder, and described heat radiation powder is AL
2o
3or B
2o
3, described heat radiation powder accounts for the 30%-80% of resin solid content.
4. as claimed in claim 1 for the aluminium foil copper facing substrate of flexible circuit board, it is characterized in that: described copper plate is the one in electro-coppering or sputter copper.
5. the aluminium foil copper facing substrate for flexible circuit board according to any one of Claims 1-4, it is characterized in that: described aluminium foil copper facing substrate is one side aluminium foil copper facing substrate, and be made up of one deck dielectric film, one deck adhesive layer, one deck aluminium foil and one deck copper plate four layer of material, described dielectric film has two relative surfaces, described aluminium foil is by described adhesive layer then in a surface of described dielectric film, and described copper plate is plated on described aluminium foil surface.
6. the aluminium foil copper facing substrate for flexible circuit board according to any one of Claims 1-4, it is characterized in that: described aluminium foil copper facing substrate is double-sided aluminum foil copper facing substrate, and be made up of one deck dielectric film, two-layer adhesive layer, two-layer aluminium foil and two-layer copper plate seven layer of material, described dielectric film has two relative surfaces, described two-layer aluminium foil is respectively by described adhesive layer then in two surfaces of described dielectric film, and described two-layer copper plate is plated on two-layer aluminium foil surface respectively.
7. the manufacture method for the aluminium foil copper facing substrate of flexible circuit board as claimed in claim 5, it is characterized in that: coating adhesive adhensive layer on a surface of dielectric film, through prebake conditions, pressing aluminium foil again, by the pressure that the gap between roller and roller give, make dielectric film and aluminium foil by middle adhesive layer close adhesion, to form aluminum foil substrate; Then, toast this aluminum foil substrate, resin bed is solidified; Finally, in the aluminium foil surface copper facing of aluminum foil substrate, form one side aluminium foil copper facing substrate.
8. the manufacture method for the aluminium foil copper facing substrate of flexible circuit board as claimed in claim 5, it is characterized in that: coating adhesive adhensive layer on a surface of dielectric film, through prebake conditions, the aluminium foil surface of the copper-plated aluminium foil of pressing again, by the pressure that the gap between roller and roller give, make dielectric film and aluminium foil by middle adhesive layer close adhesion, to form one side aluminium foil copper facing substrate; Finally, toast this one side aluminium foil copper facing substrate, resin bed is solidified, form final one side aluminium foil copper facing substrate.
9. the manufacture method for the aluminium foil copper facing substrate of flexible circuit board as claimed in claim 6, it is characterized in that: coating adhesive adhensive layer on a surface of dielectric film, through prebake conditions, pressing aluminium foil again, by the pressure that the gap between roller and roller give, make dielectric film and aluminium foil by middle adhesive layer close adhesion, to form one side aluminum foil substrate; Then, at another coating adhesive adhensive layer more on the surface of the dielectric film of this one side aluminum foil substrate, through prebake conditions, pressing aluminium foil again, by the pressure that the gap between roller and roller give, dielectric film and aluminium foil pass through middle adhesive layer close adhesion, to form double-sided aluminum foil substrate; Then, toast this double-sided aluminum foil substrate, resin bed is solidified; Finally, in the aluminium foil surface copper facing of double-sided aluminum foil substrate, form double-sided aluminum foil copper facing substrate.
10. the manufacture method for the aluminium foil copper facing substrate of flexible circuit board as claimed in claim 6, it is characterized in that: coating adhesive adhensive layer on a surface of dielectric film, through prebake conditions, the aluminium foil surface of the copper-plated aluminium foil of pressing again, by the pressure that the gap between roller and roller give, make dielectric film and copper facing aluminium foil by middle adhesive layer close adhesion, to form one side aluminium foil copper facing substrate; Then at another coating adhesive adhensive layer more on the surface of the dielectric film of this one side aluminium foil copper facing substrate, through prebake conditions, the aluminium foil surface of the copper-plated aluminium foil of pressing again, by the pressure that the gap between roller and roller give, dielectric film and aluminium foil pass through middle adhesive layer close adhesion, to form double-sided aluminum foil copper facing substrate; Finally, toast this double-sided aluminum foil copper facing substrate, resin bed is solidified, form final double-sided aluminum foil copper facing substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510169388.2A CN104754862A (en) | 2015-04-10 | 2015-04-10 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510169388.2A CN104754862A (en) | 2015-04-10 | 2015-04-10 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101626A (en) * | 2015-08-04 | 2015-11-25 | 东莞市毅联电子科技有限公司 | Flexible composite aluminum substrate and preparation method thereof |
| CN106113803A (en) * | 2016-06-16 | 2016-11-16 | 常州市超顺电子技术有限公司 | A kind of aluminum-based copper-clad plate and application thereof and preparation method |
| CN110167258A (en) * | 2019-05-24 | 2019-08-23 | 上海温良昌平电器科技股份有限公司 | A kind of aluminium plating copper substrate structure and its preparation process |
| CN110809360A (en) * | 2019-07-22 | 2020-02-18 | 新余市木林森线路板有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
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| WO2014104559A1 (en) * | 2012-12-28 | 2014-07-03 | 하이쎌 주식회사 | Led heat-dissipation flexible module using carbon fiber substrate and method for manufacturing same |
| CN104039079A (en) * | 2013-12-01 | 2014-09-10 | 吴祖 | Integrated circuit board |
| CN204206600U (en) * | 2014-11-22 | 2015-03-11 | 王言新 | copper foil composite base material for circuit board |
| CN204518216U (en) * | 2015-04-10 | 2015-07-29 | 松扬电子材料(昆山)有限公司 | For the aluminium foil copper facing substrate of flexible circuit board |
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2015
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014104559A1 (en) * | 2012-12-28 | 2014-07-03 | 하이쎌 주식회사 | Led heat-dissipation flexible module using carbon fiber substrate and method for manufacturing same |
| CN104039079A (en) * | 2013-12-01 | 2014-09-10 | 吴祖 | Integrated circuit board |
| CN204206600U (en) * | 2014-11-22 | 2015-03-11 | 王言新 | copper foil composite base material for circuit board |
| CN204518216U (en) * | 2015-04-10 | 2015-07-29 | 松扬电子材料(昆山)有限公司 | For the aluminium foil copper facing substrate of flexible circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105101626A (en) * | 2015-08-04 | 2015-11-25 | 东莞市毅联电子科技有限公司 | Flexible composite aluminum substrate and preparation method thereof |
| CN105101626B (en) * | 2015-08-04 | 2018-04-24 | 东莞市毅联电子科技有限公司 | A kind of flexible compound aluminum substrate and preparation method thereof |
| CN106113803A (en) * | 2016-06-16 | 2016-11-16 | 常州市超顺电子技术有限公司 | A kind of aluminum-based copper-clad plate and application thereof and preparation method |
| CN110167258A (en) * | 2019-05-24 | 2019-08-23 | 上海温良昌平电器科技股份有限公司 | A kind of aluminium plating copper substrate structure and its preparation process |
| CN110809360A (en) * | 2019-07-22 | 2020-02-18 | 新余市木林森线路板有限公司 | Double-sided flexible circuit board and manufacturing method thereof |
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