CN110167258A - A kind of aluminium plating copper substrate structure and its preparation process - Google Patents
A kind of aluminium plating copper substrate structure and its preparation process Download PDFInfo
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- CN110167258A CN110167258A CN201910437385.0A CN201910437385A CN110167258A CN 110167258 A CN110167258 A CN 110167258A CN 201910437385 A CN201910437385 A CN 201910437385A CN 110167258 A CN110167258 A CN 110167258A
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- Prior art keywords
- copper
- layer
- aluminium
- copper foil
- foil layer
- Prior art date
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 104
- 239000010949 copper Substances 0.000 title claims abstract description 64
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 61
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 239000004411 aluminium Substances 0.000 title claims abstract description 30
- 238000007747 plating Methods 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000011889 copper foil Substances 0.000 claims abstract description 43
- 239000004743 Polypropylene Substances 0.000 claims abstract description 29
- -1 polypropylene Polymers 0.000 claims abstract description 29
- 229920001155 polypropylene Polymers 0.000 claims abstract description 29
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims abstract description 19
- 238000004519 manufacturing process Methods 0.000 claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 17
- 238000003466 welding Methods 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 230000001680 brushing effect Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 8
- 238000005488 sandblasting Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 6
- 235000011121 sodium hydroxide Nutrition 0.000 claims description 6
- 238000012546 transfer Methods 0.000 claims description 6
- 238000003486 chemical etching Methods 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 238000007639 printing Methods 0.000 claims description 4
- 230000008569 process Effects 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- ZGTMUACCHSMWAC-UHFFFAOYSA-L EDTA disodium salt (anhydrous) Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O ZGTMUACCHSMWAC-UHFFFAOYSA-L 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000010431 corundum Substances 0.000 claims description 2
- 229910052593 corundum Inorganic materials 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 238000003698 laser cutting Methods 0.000 claims description 2
- 230000007246 mechanism Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 claims description 2
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 claims description 2
- 239000003921 oil Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000004576 sand Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 229940124274 edetate disodium Drugs 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 238000012986 modification Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 238000013526 transfer learning Methods 0.000 claims 1
- 238000005406 washing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000003109 Disodium ethylene diamine tetraacetate Substances 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000019301 disodium ethylene diamine tetraacetate Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000035800 maturation Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of aluminium plating copper substrate structure and its preparation process, structure include: aluminium plating Copper base material matter, polypropylene layer and copper foil layer structure, and aluminium plating Copper base material matter, polypropylene layer and copper foil layer structure are sequentially connected from bottom to up.Wherein, copper foil layer structure includes: copper foil layer, wire line, ink layer and copper foil layer hollow hole.The present invention plates copper base using aluminium by design and replaces pure Cu substrate as Metal Substrate heat-conducting layer, have high thermal conductivity, meet thermally conductive demand, while aluminium copper facing substrate manufacture is convenient, production cost is low, reduces the consumption of metal resource compared with traditional technology.
Description
Technical field
The present invention relates to electronic technology fields, and in particular to a kind of aluminium plating copper substrate structure and its preparation process.
Background technique
With the increasingly maturation of current LED car lamp technology, LED car lamp application is popularized, and existing heat dissipation technology is not only
Based on encapsulating structure and material, and there are also be based on energy transfer process.With regard to the circuit base plate material in encapsulating material close several
The new development of Nian Zhongyou, recent tendency have been directed toward straight-through radiating copper base circuit board as car light is to the integrated demand of high brightness,
Thermally conductive demand is higher and higher, and straight-through radiating copper base circuit board demand gradually increases, lead directly to radiating copper base circuit board manufacture craft with
Fine copper needs thicker copper sheet as heat carrier as Metal Substrate heat-conducting layer, no matter from cost or manufacture craft in future
Compete it is increasing under the premise of be difficult to be received by market.
To solve the above-mentioned problems, we are made that a series of improvement.
Summary of the invention
The object of the present invention is to provide a kind of aluminium plating copper substrate structure and its preparation processes, to overcome prior art institute
Existing disadvantages mentioned above and deficiency.
A kind of aluminium plating copper substrate structure characterized by comprising aluminium copper facing substrate layer, polypropylene layer and copper foil layer structure,
The aluminium copper facing substrate layer, polypropylene layer and copper foil layer structure are sequentially connected from bottom to up；
Wherein, the copper foil layer structure includes: copper foil layer, wire line, ink layer and copper foil layer hollow hole, the conducting wire
Route is connect with copper foil layer upper surface, and the ink layer is covered in the upper surface of copper foil layer, and the ink layer and wire line are not
The boss of contact, the copper foil layer hollow hole and aluminium copper facing substrate layer is socketed.
Further, the aluminium copper facing substrate layer is equipped with several structure holes and boss, the structure hole from bottom to up one
Polypropylene layer and copper foil layer structure are run through in side, and the boss is set on aluminium copper facing substrate layer.
Further, the polypropylene layer is equipped with polypropylene hollow hole, and the polypropylene hollow hole and boss are socketed.
A kind of aluminium plating copper base preparation process, it is characterised in that: the following steps are included:
Step 1: surface of aluminum plate processing production, it is by the way of horizontal line machinery brushing that aluminum flake surface removal surface is dirty
Dirty and oxidation by the way of horizontal line physics brushing corundum sandblasting forms aluminum flake surface coarse, using tank liquor hydroxide
Sodium cleans the aluminium flake after brushing sandblasting, established thick by brushing and sandblasting to surface by micro corrosive effect
It is rough sufficiently to be modified, the aluminum flake surface residual alkaline matter after sodium hydroxide cleaning is neutralized using tank liquor sulfuric acid, water
After horizontal line washes abundant clean the surface, by treated, aluminum flake surface is dried, and keeps aluminum flake surface coarse；
Step 2: aluminium flake chemical nickel plating uses the mode of chemical nickel plating to plate a layer thickness in aluminum flake surface as the thin of-um
Nickel；
Step 3: aluminium flake electroless copper, it is chemical on the nickel layer that aluminum flake surface has been formed by the way of electroless copper
One layer of thin copper is plated, thin copper thickness is-um；
Step 4: aluminium flake plating plus copper facing make aluminum flake surface form the surface of chemical copper by the way of electro-coppering
Add the thick copper of plating, forms aluminium copper facing substrate layer；
Step 5: boss production, aluminium copper facing substrate layer surface attach etching resisting ink, are etched by image transfer fiting chemical
Mode makes the boss for needing to weld LED location；
Step 6: punching hollow out, on the surface of polypropylene layer and copper foil layer, by phase by the way of punching and laser cutting
The position of corresponding boss is punched to form hollow out；
Step 7: aluminium copper facing substrate layer, polypropylene layer and copper foil layer are successively combined by pressing in sequence, are combined
Triplicity is set to form entirety by the way of temperature-pressure afterwards, the product after combination is by middle layer polypropylene layer as insulating layer
It separates LED lug boss position with surface lines copper foil layer, realizes the structure of straight-through independent heat dissipation and wire line separation；
Step 8: wire line production, copper foil layer surface attach etching resisting ink, pass through image transfer fiting chemical etching side
Formula makes wire line；
Step 9: ink printing is hindered, the position of welding will not be needed, the layer of ink that oils is printed, is fixedly welded position, avoids
Connect tin or other bad in welding process, protects substrate layer；
Step 10: molding makes mechanism orifice and shape by way of punching or CNC；
Step 11: surface treatment, avoiding the exposure of welding copper face, oxidation influences welding in air, improves welding quality,
Complete finished product.
Further, during the brushing in the step 1, brusher rod is one group of one group of 500 mesh and 2000 mesh, pressure
For 2KG, harness is 2m/ minutes；
In sandblasting procedures, sand is diamond dust, and the Grains of diamond dust is 200, and linear speed is 3m/ minutes；
During surface clean, use tank liquor sodium hydrate content for 2%, linear speed is 3m/ minutes；
In the N-process of surface, use tank liquor sulfuric acid content for 1%, linear speed is 3m/ minutes；
During clean the surface, linear speed is 3m/ minutes；
In drying course, drying temperature is 90 degrees Celsius, and linear velocity is 3m/ minutes.
Further, in the step 2, chemical nickel plating, as additive, handles the time using the nickel sulfate of 20-50 grams per liter
It is 3-5 minutes.
Further, in the step 3, electroless copper is using 10-20 grams/every liter of sulfuric acid, the hydroxide of 10-25 grams per liter
The disodium ethylene diamine tetraacetate of sodium, the formaldehyde of 3-5 grams per liter, 0.5-2 grams per liter is processed, and is handled time 10-15 minutes.
Further, in the step 4, surface adds the copper thickness for plating thick copper to be 0.1mm-5 millimeters, current density 1.5-
2.0ASD。
Beneficial effects of the present invention:
The present invention plates copper base using aluminium by design and replaces pure Cu substrate thermally conductive as Metal Substrate compared with traditional technology
Layer has high thermal conductivity, meets thermally conductive demand, while aluminium copper facing substrate manufacture is convenient, and production cost is low, reduces metal money
The consumption in source.
Detailed description of the invention:
Fig. 1 is the structural schematic diagram that aluminium of the invention plates copper base.
Fig. 2 is the structural schematic diagram that aluminium of the invention plates copper base boss.
Fig. 3 is the structural schematic diagram of polypropylene layer of the invention.
Fig. 4 is the structural schematic diagram of copper foil layer of the invention.
Fig. 5 is the structural schematic diagram after completion step 4 of the invention.
Fig. 6 is the structural schematic diagram after completion step 5 of the invention.
Fig. 7 is structural schematic diagram of the invention.
Appended drawing reference:
Aluminium plates Copper base material matter 100, structure hole 110 and boss 120.
Polypropylene layer 200 and polypropylene hollow hole 210.
Copper foil layer structure 300, copper foil layer 310, wire line 320, ink layer 330 and copper foil layer hollow hole 340.
Specific embodiment
Below in conjunction with specific embodiment, progress explanation is made to the present invention.It should be understood that following embodiment is merely to illustrate this hair
It is bright not for limiting the scope of the invention.
Embodiment 1
Fig. 1 is the structural schematic diagram that aluminium of the invention plates copper base.Fig. 2 is the structure that aluminium of the invention plates copper base boss
Schematic diagram.Fig. 3 is the structural schematic diagram of polypropylene layer of the invention.Fig. 4 is the structural schematic diagram of copper foil layer of the invention.Fig. 5
For the structural schematic diagram after completion step 4 of the invention.Fig. 6 is the structural schematic diagram after completion step 5 of the invention.Fig. 7
For structural schematic diagram of the invention.
As shown in Figure 1, the main material that aluminium plating Copper base material matter 100 is conducted as LED heat, aluminium plate Copper base material matter 100
Making step be progress surface of aluminum plate processing first, then aluminium sheet chemical nickel plating, then on nickel layer it is one layer thin in chemical plating
Copper, the surface for making aluminum flake surface form chemical copper by the way of electro-coppering add the thick copper of plating.It is finally plated as shown in Figure 2 in aluminium
The surface of copper-based material 100 attaches etching resisting ink, makes to need to weld LED location by image transfer fiting chemical etching mode
Boss 120 is made.Meanwhile as shown in Figure 3 and Figure 4, respectively on polypropylene layer 200 and copper foil layer structure 300 using punching
The mode cut and be cut by laser is punched corresponding " position of LED boss " and copper foil to form corresponding polypropylene hollow hole
210 and copper foil layer hollow hole 340.Then, as shown in figure 5, successively plating Copper base material matter 100, polypropylene layer 200, copper foil according to aluminium
The sequence of layer structure 300 is combined, and polypropylene hollow hole 210 and copper foil layer hollow hole 340 and boss 120 are socketed.
Triplicity is set to form entirety by the way of temperature-pressure after combination, the product after combination is by intermediate layer polypropylene
Layer 200 separates LED lug boss position with surface lines copper foil layer 310 as insulating layer, realizes straight-through independent heat dissipation and wire
The isolated structure in road 320.As shown in fig. 6, attaching etching resisting ink on 310 surface of copper foil layer, cooperated by way of image transfer
Chemical etching mode makes wire line 320.As shown in fig. 7, the position of welding will do not needed on copper foil layer 310, in printing
Ink layer 330, is fixedly welded position, avoids connecting tin or other bad, protective substrate in welding process.Finally successively by structure hole
110 and shape made by way of punching, structure hole while being surface-treated to install connection, avoid welding
Oxidation influences welding in air for copper face exposure, improves welding quality.
The present invention plates copper base using aluminium by design and replaces pure Cu substrate as Metal Substrate heat-conducting layer, has high-termal conductivity
Can, meet thermally conductive demand, while aluminium copper facing substrate manufacture is convenient, production cost is low, reduces the consumption of metal resource.
A specific embodiment of the invention is illustrated above, but the present invention is not limited thereto, without departing from
Spirit of the invention, the present invention can also have various change.
Claims (8)
1. a kind of aluminium plates copper substrate structure characterized by comprising aluminium copper facing substrate layer (100), polypropylene layer (200) and copper
Layers of foil structure (300), the aluminium copper facing substrate layer (100), polypropylene layer (200) and copper foil layer structure (300) from bottom to up according to
Secondary connection；
Wherein, the copper foil layer structure (300) includes: copper foil layer (310), wire line (320), ink layer (330) and copper foil
Layer hollow hole (340), the wire line (320) connect with copper foil layer (310) upper surface, and the ink layer (330) is covered in
The upper surface of copper foil layer (310), the ink layer (330) do not contact with wire line (320), the copper foil layer hollow hole
(340) it is socketed with the boss of aluminium copper facing substrate layer (100).
2. a kind of aluminium according to claim 1 plates copper substrate structure, which is characterized in that the aluminium copper facing substrate layer (100)
It is equipped with several structure holes (110) and boss (120), polypropylene layer is run through in side to the structure hole (110) from bottom to up
(200) it is set on aluminium copper facing substrate layer (100) with copper foil layer structure (300), the boss (120).
3. a kind of aluminium according to claim 1 plates copper substrate structure, which is characterized in that set on the polypropylene layer (200)
Have polypropylene hollow hole (210), the polypropylene hollow hole (210) and boss (120) are socketed.
4. a kind of aluminium plates copper base preparation process, it is characterised in that: the following steps are included:
Step 1: surface of aluminum plate processing production, by the way of horizontal line machinery brushing by aluminum flake surface removal surface it is dirty and
It aoxidizes, forms aluminum flake surface by the way of horizontal line physics brushing corundum sandblasting coarse, using tank liquor sodium hydroxide pair
Aluminium flake after brushing sandblasting is cleaned, by micro corrosive effect to surface by brushing and sandblasting it is established it is coarse into
Row sufficiently modification neutralizes the aluminum flake surface residual alkaline matter after sodium hydroxide cleaning using tank liquor sulfuric acid, horizontal line
After washing abundant clean the surface, by treated, aluminum flake surface is dried, and keeps aluminum flake surface coarse；
Step 2: aluminium flake chemical nickel plating uses the mode of chemical nickel plating to plate a layer thickness in aluminum flake surface as the thin of 1-2um
Nickel；
Step 3: aluminium flake electroless copper, by the way of electroless copper on the nickel layer that aluminum flake surface has been formed in chemical plating
One layer of thin copper, thin copper thickness are 1-2um；
Step 4: aluminium flake plating plus copper facing, the surface for making aluminum flake surface form chemical copper by the way of electro-coppering adds plating
Thick copper is formed aluminium copper facing substrate layer (100)；
Step 5: boss (120) production, aluminium copper facing substrate layer (100) surface attach etching resisting ink, match combination by image transfer
Learning etching mode makes the boss (120) for needing to weld LED location；
Step 6: punching hollow out, on the surface of polypropylene layer (200) and copper foil layer (310), using the side of punching and laser cutting
Formula is punched the position of corresponding boss (120) to form hollow out；
Step 7: pressing, successively in sequence by aluminium copper facing substrate layer (100), polypropylene layer (200) and copper foil layer (310) into
Row combination, makes triplicity form entirety, the product after combination is by intermediate layer polypropylene after combination by the way of temperature-pressure
Layer (200) separates LED lug boss position with surface lines copper foil layer (310) as insulating layer, realizes to lead directly to and independently radiates and lead
The structure of line route (320) separation；
Step 8: wire line (320) production, copper foil layer (310) surface attach etching resisting ink, pass through image transfer fiting chemical
Etching mode makes wire line (320)；
Step 9: hindering ink printing, will not need the position of welding, and printing oils layer of ink (330), is fixedly welded position, keeps away
Connect tin or other bad during no-welding, protects substrate layer；
Step 10: molding makes mechanism orifice and shape by way of punching or CNC；
Step 11: surface treatment, avoiding the exposure of welding copper face, oxidation influences welding in air, improves welding quality, completes
Finished product.
5. a kind of aluminium according to claim 4 plates copper base preparation process, which is characterized in that the brushing in the step 1
In the process, brusher rod is one group of 500 mesh and one group, pressure 2KG of 2000 mesh, and linear speed is 2m/ minutes；
In sandblasting procedures, sand is diamond dust, and the Grains of diamond dust is 200, and linear speed is 3m/ minutes；
During surface clean, use tank liquor sodium hydrate content for 2%, linear speed is 3m/ minutes；
In the N-process of surface, use tank liquor sulfuric acid content for 1%, linear speed is 3m/ minutes；
During clean the surface, linear speed is 3m/ minutes；
In drying course, drying temperature is 90 degrees Celsius, and linear speed is 3m/ minutes.
6. a kind of aluminium according to claim 4 plates copper base preparation process, which is characterized in that in the step 2, chemistry
Using the nickel sulfate of 20-50 grams per liter as additive, handling the time is 3-5 minutes for nickel plating.
7. a kind of aluminium according to claim 4 plates copper base preparation process, which is characterized in that in the step 3, chemistry
Copper facing is using 10-20 grams/every liter of sulfuric acid, the sodium hydroxide of 10-25 grams per liter, the formaldehyde of 3-5 grams per liter, the second of 0.5-2 grams per liter
Edetate disodium is processed, and is handled time 10-15 minutes.
8. a kind of aluminium according to claim 4 plates copper base preparation process, which is characterized in that in the step 4, surface
Adding the copper thickness for plating thick copper is 0.1mm-5 millimeters, current density 1.5-2.0ASD.
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| CN201910437385.0A CN110167258B (en) | 2019-05-24 | 2019-05-24 | Aluminum copper-plated substrate structure and preparation process thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910437385.0A CN110167258B (en) | 2019-05-24 | 2019-05-24 | Aluminum copper-plated substrate structure and preparation process thereof |
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| CN110167258B CN110167258B (en) | 2024-06-25 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114058995A (en) * | 2021-11-19 | 2022-02-18 | 江苏华旺新材料有限公司 | Copper-aluminum composite sheet and composite process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114058995A (en) * | 2021-11-19 | 2022-02-18 | 江苏华旺新材料有限公司 | Copper-aluminum composite sheet and composite process thereof |
| CN114058995B (en) * | 2021-11-19 | 2022-08-16 | 江苏华旺新材料有限公司 | Copper-aluminum composite sheet and composite process thereof |
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