CN105112896A - Chemical silver plating technology of PCBs - Google Patents
Chemical silver plating technology of PCBs Download PDFInfo
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- CN105112896A CN105112896A CN201510468695.0A CN201510468695A CN105112896A CN 105112896 A CN105112896 A CN 105112896A CN 201510468695 A CN201510468695 A CN 201510468695A CN 105112896 A CN105112896 A CN 105112896A
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- silver plating
- wiring board
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- plating technology
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Abstract
The invention discloses a chemical silver plating technology of PCBs, and relates to the technical field of PCB manufacturing. The chemical silver plating technology comprises the following steps: performing chemical degreasing; performing microetching, performing presoaking; and performing chemical silver plating and the like. According to the chemical silver plating technology disclosed by the invention, a plating solution is even to plate and can relieve deposition; the obtained plated layer is even, silver and bright, and does not have yellow spots; the thickness of the plated layer reaches 0.17mum. The binding force of the obtained silver layer and a substrate is good.
Description
Technical field
The present invention relates to PCB manufacture technology field, is more particularly a kind of PCB Electroless Silver Plating.
Background technology
The final operation that printed circuit board (PCB) manufactures is that effects on surface carries out weldability process.Silver layer have good to weld, weather-proof and conductivity.Existing defects in widely used hot air leveling technology now, can not meet society to hi-tech and eco-friendly requirement.
Summary of the invention
The object of the invention is to make up the deficiencies in the prior art, a kind of PCB Electroless Silver Plating is provided.
The object of the invention is to be achieved through the following technical solutions:
A kind of PCB Electroless Silver Plating, comprises the following steps:
(1) electrochemical deoiling: the wiring board after boring is put into the alkaline degreaser of 5%, processes 5 minutes, cleans up after taking-up with hot water at 50 DEG C;
(2) microetch: the mixing solutions under room temperature, the wiring board behind whole hole being put into 80g/L Sodium Persulfate and 3% sulfuric acid, processes taking-up after 2 minutes and washes twice with distilled water;
(3) preimpregnation: under room temperature, the wiring board after microetch is put into stannous sulfate 1-50g/L, hydrochloric acid 1-100ml/L, fluorochemical 0.1-5g/L mixing solutions process 1 minute;
(4) wiring board after preimpregnation is put into chemical plating liquid, adjustment pH value is 0.5-1, at 15 DEG C, deposit 8 minutes, takes out after washing twice and dries up.
Described a kind of PCB Electroless Silver Plating, is characterized in that: described chemical plating liquid be by 2.5g/LAgNO3,12% methylsulphonic acid, 1g/L Polyethylene Glycol-600,1.5g/L thiocarbamide, 2.5g/L ammonium citrate and deionized water formulated.
The invention has the advantages that:
Silver plating process plating solution energy of the present invention evenly plating, relax deposition, the coating obtained is even, is silvery white in color, bright, without macula lutea, thickness reaches 0.17 μm.The good bonding strength of silver layer and matrix.
Embodiment
A kind of PCB Electroless Silver Plating, comprises the following steps:
(1) electrochemical deoiling: the wiring board after boring is put into the alkaline degreaser of 5%, processes 5 minutes, cleans up after taking-up with hot water at 50 DEG C;
(2) microetch: the mixing solutions under room temperature, the wiring board behind whole hole being put into 80g/L Sodium Persulfate and 3% sulfuric acid, processes taking-up after 2 minutes and washes twice with distilled water;
(3) preimpregnation: under room temperature, the wiring board after microetch is put into stannous sulfate 25g/L, hydrochloric acid 50ml/L, fluorochemical 3g/L mixing solutions process 1 minute;
(4) wiring board after preimpregnation is put into chemical plating liquid, regulate pH value to be 0.8, at 15 DEG C, deposit 8 minutes, take out after washing twice and dry up.
Described chemical plating liquid be by 2.5g/LAgNO3,12% methylsulphonic acid, 1g/L Polyethylene Glycol-600,1.5g/L thiocarbamide, 2.5g/L ammonium citrate and deionized water formulated.
Claims (2)
1. a PCB Electroless Silver Plating, is characterized in that: comprise the following steps:
(1) electrochemical deoiling: the wiring board after boring is put into the alkaline degreaser of 5%, processes 5 minutes, cleans up after taking-up with hot water at 50 DEG C;
(2) microetch: the mixing solutions under room temperature, the wiring board behind whole hole being put into 80g/L Sodium Persulfate and 3% sulfuric acid, processes taking-up after 2 minutes and washes twice with distilled water;
(3) preimpregnation: under room temperature, the wiring board after microetch is put into stannous sulfate 1-50g/L, hydrochloric acid 1-100ml/L, fluorochemical 0.1-5g/L mixing solutions process 1 minute;
(4) wiring board after preimpregnation is put into chemical plating liquid, adjustment pH value is 0.5-1, at 15 DEG C, deposit 8 minutes, takes out after washing twice and dries up.
2. a kind of PCB Electroless Silver Plating according to claim 1, is characterized in that: described chemical plating liquid be by 2.5g/LAgNO3,12% methylsulphonic acid, 1g/L Polyethylene Glycol-600,1.5g/L thiocarbamide, 2.5g/L ammonium citrate and deionized water formulated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510468695.0A CN105112896A (en) | 2015-08-04 | 2015-08-04 | Chemical silver plating technology of PCBs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510468695.0A CN105112896A (en) | 2015-08-04 | 2015-08-04 | Chemical silver plating technology of PCBs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105112896A true CN105112896A (en) | 2015-12-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510468695.0A Pending CN105112896A (en) | 2015-08-04 | 2015-08-04 | Chemical silver plating technology of PCBs |
Country Status (1)
| Country | Link |
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| CN (1) | CN105112896A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108823556A (en) * | 2018-07-12 | 2018-11-16 | 江苏虹扬光电有限公司 | A kind of no cyanogen chemical plating liquid and its preparation method and application |
| CN109560439A (en) * | 2018-11-12 | 2019-04-02 | 中国科学院电工研究所 | A kind of preparation method of high-temperature superconductor belt lacing |
| CN110670053A (en) * | 2019-10-18 | 2020-01-10 | 北京曙光航空电气有限责任公司 | Silver plating method for metal surface |
| CN113766760A (en) * | 2021-09-29 | 2021-12-07 | 深圳市虹喜科技发展有限公司 | Chemical silver plating method for printed circuit board |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101033550A (en) * | 2007-03-27 | 2007-09-12 | 广东东硕科技有限公司 | Micro-corrosion liquid and application thereof in printing wiring board silver aggradation pretreatment |
| CN101182637A (en) * | 2006-11-16 | 2008-05-21 | 方景礼 | Alkalescent chemical silver plating solution |
| CN101979709A (en) * | 2010-11-15 | 2011-02-23 | 深圳市成功科技有限公司 | Novel chemical copper plating method |
| CN104342643A (en) * | 2013-07-23 | 2015-02-11 | 比亚迪股份有限公司 | A chemical silvering solution and a silvering method |
-
2015
- 2015-08-04 CN CN201510468695.0A patent/CN105112896A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101182637A (en) * | 2006-11-16 | 2008-05-21 | 方景礼 | Alkalescent chemical silver plating solution |
| CN101033550A (en) * | 2007-03-27 | 2007-09-12 | 广东东硕科技有限公司 | Micro-corrosion liquid and application thereof in printing wiring board silver aggradation pretreatment |
| CN101979709A (en) * | 2010-11-15 | 2011-02-23 | 深圳市成功科技有限公司 | Novel chemical copper plating method |
| CN104342643A (en) * | 2013-07-23 | 2015-02-11 | 比亚迪股份有限公司 | A chemical silvering solution and a silvering method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108823556A (en) * | 2018-07-12 | 2018-11-16 | 江苏虹扬光电有限公司 | A kind of no cyanogen chemical plating liquid and its preparation method and application |
| CN109560439A (en) * | 2018-11-12 | 2019-04-02 | 中国科学院电工研究所 | A kind of preparation method of high-temperature superconductor belt lacing |
| CN110670053A (en) * | 2019-10-18 | 2020-01-10 | 北京曙光航空电气有限责任公司 | Silver plating method for metal surface |
| CN113766760A (en) * | 2021-09-29 | 2021-12-07 | 深圳市虹喜科技发展有限公司 | Chemical silver plating method for printed circuit board |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151202 |
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| RJ01 | Rejection of invention patent application after publication |