CN102345145A - Method for electroplating surface of molybdenum and copper alloy - Google Patents

Method for electroplating surface of molybdenum and copper alloy Download PDF

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CN102345145A
CN102345145A CN2011102932064A CN201110293206A CN102345145A CN 102345145 A CN102345145 A CN 102345145A CN 2011102932064 A CN2011102932064 A CN 2011102932064A CN 201110293206 A CN201110293206 A CN 201110293206A CN 102345145 A CN102345145 A CN 102345145A
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solution
concentration
oil
molybdenum
volume
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CN2011102932064A
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CN102345145B (en
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李忠宝
陈天军
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成都四威高科技产业园有限公司
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Abstract

The invention discloses a method for electroplating the surface of a molybdenum and copper alloy. The method comprises the following steps of: 1, removing oil; 2, scouring; 3, activating; 4, planting nickel; 5, carrying out vacuum heat treatment; 6, removing oil; 7, activating; and 8, carrying out subsequent electroplating. An oxide film on the surface of the molybdenum and copper alloy can be completely removed through steps of scouring and activating, a thin nickel layer is electroplated on the surface of the molybdenum and copper alloy through steps of plating nickel and carrying out vacuum heat treatment, and then the vacuum heat treatment is carried out, so that a diffusion layer with better bonding force is formed by a nickel plating layer and a base material and then is activated, and a required plating layer can be electroplated continuously. According to the method, the problem of poor bonding force of the electroplating layer of the molybdenum and copper alloy is solved, the oxide film before the molybdenum and copper alloy is electroplated is removed, process parameters of nickel pre-plating and vacuum heat treatment are determined, and an activating method of electroplating on a nickel-plated base layer is determined.

Description

The method of molybdenum-copper electroplating surface
Technical field
The present invention relates to belong to field of surface treatment, relate to a kind of method of molybdenum-copper electroplating surface,, can obtain the good coating of bonding force on the molybdenum-copper surface through this method.
Background technology
Molybdenum-copper is a kind of mmaterial, is mainly used in the making of high temperature resistant device, because its heat conduction, conductivity are better, thermal expansivity and pottery coupling also have more application in the micro-electronics metal Packaging Industry.In order to improve the performances such as anti-oxidation and soldering of piece surface, need electroplate it.
Mainly there is following problem in the electroplating technology of existing molybdenum-copper: 1. the molybdenum-copper surface is prone to form oxide film and is difficult to remove, and can not effectively activate base material before electroplating, thereby influence the bonding force of coating; 2. existing oxide film removal method mainly contains sand-blast, anodic etching and chromic acid facture etc., but sand-blast is only applicable to simple shape, part that volume is bigger, and is inapplicable for the part complex-shaped, that volume is less; Anodic etching causes the excessive erosion of copper easily when handling molybdenum-copper; The chromic acid facture need be used high-load chromic acid, and technical process is loaded down with trivial details, cause environmental pollution and personal injury easily, and yield rate is lower.3. directly on the molybdenum-copper base material, electroplate and to obtain coating thicker, that bonding force is good.
The difficulty that overcomes the above problems existence is: 1, molybdenum-copper is a kind of mmaterial; Rather than the alloy of real meaning; And the chemical property difference of molybdenum and copper is very big; Find a kind of reliable oxide film to remove technology; In the oxide film of removing molybdenum, can not cause the excessive erosion of copper.2, secular process practice proves, directly on the molybdenum-copper base material, electroplates and can not obtain coating thicker, that bonding force is good.
Summary of the invention
The technical problem that the present invention will solve is: to above-mentioned situation, a kind of method of molybdenum-copper electroplating surface is provided.Through this method, can obtain the good coating of bonding force on the molybdenum-copper surface.
The object of the invention realizes through following technical proposals:
1, a kind of method of molybdenum-copper electroplating surface may further comprise the steps:
1. oil removing
Remove the greasy dirt of molybdenum-copper piece surface;
2. pickling
The employed solution of pickling comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 400~420ml/L is the sulfuric acid of 400~420ml/L; The temperature of said solution is 10~25 ℃; To rock 10~15S in this solution of molybdenum-copper part immersion; The oxide film of flush away piece surface and spot; Obtain evenly clean metallic surface, after the pickling molybdenum-copper part is put into tap water immediately and clean up; This operation is the oxide film and the spot of flush away piece surface fast, obtains evenly clean metallic surface;
3. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 90~110ml/L is the sulfuric acid of 110~130ml/L; The temperature of said solution is 20~30 ℃; The molybdenum-copper part immersed treat behind 3~5min in this solution that piece surface evenly separates out bubble, take out part and put into tap water rapidly and clean up;
4. nickel plating:
The employed solution of nickel plating comprises: concentration is the nickel sulfamic acid Ni[NH of 300~350 g/L 2SO 3] 2, concentration is the sodium-chlor of 5~20 g/L, the boric acid H that concentration is 30~45 g/L 3BO 3, the pH value of said solution is 3.8~4.2, cathode current density 0.5~1 A/dm 2, solution temperature is 50~55 ℃, anode employing purity is 99.99% sheet nickel; The nickel plating time is 15~20 min; Strict control thickness of coating is 1~3 μ m, after the nickel plating molybdenum-copper part is cleaned up with deionized water, and is dry under 80~100 ℃ of conditions then;
This operation should strict control thickness of coating be 1~3 μ m, and nickel layer is too thick, can influence the sticking power of nickel layer, in follow-up vacuum heat treatment process, the foaming phenomenon can occur, if coating is too thin, then can influence the bonding force of follow-up electrolytic coating;
5. vacuum heat treatment:
Part after the nickel plating is put into vacuum heat treatment furnace, be evacuated to vacuum tightness and reach 3 * 10- 3Pa rises to temperature 780~800 ℃ then, insulation 30min, and the speed with 5 ℃/min is cooled to below 650 ℃ then, takes out part but cool to blow-on below 100 ℃ again with the furnace; This operation can make nickel layer and base material diffuse to form diffusion layer, and nickel layer and matrix are interlocked;
6. oil removing: adopt the electrochemical deoiling method, be used to remove the adherent dirt of piece surface, remove oil solution and must not corrode nickel layer;
7. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 380~420ml/L is the hydrochloric acid of 180~220ml/L; The temperature of said solution is 10~25 ℃, is 10~15 seconds with also strict control soak time in this solution of molybdenum-copper part immersion; This operation is wanted strict control soak time, if soak time is oversize, can cause nickel layer to be destroyed, the too short oxide film that then can't effectively remove the nickel layer surface of time.
As preferably, 1. described step further is:
1. oil removing: adopt the catholyte oil removing, the employed solution of oil removing comprises that concentration is the sodium hydroxide of 5~25 g/L, the yellow soda ash that concentration is 20~100 g/L, the tertiary sodium phosphate Na that concentration is 40~80 g/L 3PO 4,Concentration is the water glass Na of 5~15 g/L 2SiO 3, 70~80 ℃ of said solution temperatures, cathode current density 3~6 A/dm 2, oil removing time 5~15min cleans up with tap water after the oil removing.
As preferably, 6. described step further is:
6. oil removing: adopt concentration be 20~40g/L remove oil-bound distemper solution, 40~60 ℃ of temperature place part except that oil-bound distemper solution and soak 10~15 min.
As preferably, 8. described step also comprises step after 7.:
8. follow-up plating, other coating that the piece surface plating after activated needs.
Beneficial effect of the present invention is following: the oxide film that can remove the molybdenum-copper surface through pickling and activation step fully; First through nickel plating and vacuum heat treatment step at molybdenum-copper electroplating surface skim nickel; Carry out vacuum heat treatment then; Make nickel layer and base material form the good diffusion layer of bonding force; Then it is activated, can continue to electroplate the coating that needs.Present method has solved the bad problem of molybdenum-copper electrolytic coating bonding force, has removed molybdenum-copper and has electroplated preceding oxide film, has confirmed nickel preplating and VACUUM HEAT-TREATMENT processing parameter, has confirmed galvanized activation method in nickel plating basic unit.
Embodiment
Following non-limiting examples is used to illustrate the present invention.
Embodiment 1
A kind of method of molybdenum-copper electroplating surface may further comprise the steps:
1. oil removing
Adopt the catholyte oil removing, remove the greasy dirt of molybdenum-copper piece surface; , the employed solution of oil removing comprises that concentration is the sodium hydroxide of 5 g/L, the yellow soda ash that concentration is 20 g/L, the tertiary sodium phosphate Na that concentration is 40 g/L 3PO 4,Concentration is the water glass Na of 5 g/L 2SiO 3, 70 ℃ of said solution temperatures, cathode current density 3 A/dm 2, oil removing time 5min cleans up with tap water after the oil removing;
2. pickling
The employed solution of pickling comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 400ml/L is the sulfuric acid of 400ml/L; The temperature of said solution is 10 ℃; To rock 10S in this solution of molybdenum-copper part immersion; The oxide film of flush away piece surface and spot; Obtain evenly clean metallic surface, after the pickling molybdenum-copper part is put into tap water immediately and clean up; This operation is the oxide film and the spot of flush away piece surface fast, obtains evenly clean metallic surface;
3. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 90ml/L is the sulfuric acid of 110ml/L; The temperature of said solution is 20 ℃; The molybdenum-copper part is immersed 3min in this solution; Treat behind the 3min that piece surface evenly separates out bubble, take out part and put into tap water rapidly and clean up;
4. nickel plating:
The employed solution of nickel plating comprises: concentration is the nickel sulfamic acid Ni[NH of 300 g/L 2SO 3] 2, concentration is the sodium-chlor of 5 g/L, the boric acid H that concentration is 30 g/L 3BO 3, the pH value of said solution is 3.8, cathode current density 0.5 A/dm 2, solution temperature is 505 ℃, and anode employing purity is 99.99% sheet nickel, and the nickel plating time is 15 min, and strict control thickness of coating is 1 μ m, after the nickel plating molybdenum-copper part is cleaned up with deionized water, and is dry under 80 ℃ of conditions then;
This operation should strict control thickness of coating be 1 μ m, and nickel layer is too thick, can influence the sticking power of nickel layer, in follow-up vacuum heat treatment process, the foaming phenomenon can occur, if coating is too thin, then can influence the bonding force of follow-up electrolytic coating;
5. vacuum heat treatment:
Part after the nickel plating is put into vacuum heat treatment furnace, be evacuated to vacuum tightness and reach 3 * 10- 3Pa rises to temperature 780 ℃ then, insulation 30min, and the speed with 5 ℃/min is cooled to below 650 ℃ then, takes out part but cool to blow-on below 100 ℃ again with the furnace; This operation can make nickel layer and base material diffuse to form diffusion layer, and nickel layer and matrix are interlocked;
6. oil removing: adopt the electrochemical deoiling method to remove the adherent dirt of piece surface; Remove oil solution and need not corrode nickel layer, adopt concentration be 20g/L remove oil-bound distemper solution, removing oil-bound distemper is the commercially available oil-bound distemper that removes; Remove 40 ℃ of oil-bound distemper solution temperatures, part is placed except that oil-bound distemper solution immersion 10 min;
7. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 380ml/L is the hydrochloric acid of 180ml/L, and the temperature of said solution is 10 ℃, is 10 seconds with also strict control soak time in this solution of molybdenum-copper part immersion; This operation is wanted strict control soak time, if soak time is oversize, can cause nickel layer to be destroyed, the too short oxide film that then can't effectively remove the nickel layer surface of time;
8. follow-up plating, other coating that the piece surface plating after activated needs.
Embodiment 2
A kind of method of molybdenum-copper electroplating surface may further comprise the steps:
1. oil removing
Adopt the catholyte oil removing, remove the greasy dirt of molybdenum-copper piece surface; , the employed solution of oil removing comprises that concentration is the sodium hydroxide of 25 g/L, the yellow soda ash that concentration is 100 g/L, the tertiary sodium phosphate Na that concentration is 80 g/L 3PO 4,Concentration is the water glass Na of 15 g/L 2SiO 3, 80 ℃ of said solution temperatures, cathode current density 6 A/dm 2, oil removing time 15min cleans up with tap water after the oil removing;
2. pickling
The employed solution of pickling comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 420ml/L is the sulfuric acid of 420ml/L; The temperature of said solution is 25 ℃; To rock 15S in this solution of molybdenum-copper part immersion; The oxide film of flush away piece surface and spot; Obtain evenly clean metallic surface, after the pickling molybdenum-copper part is put into tap water immediately and clean up; This operation is the oxide film and the spot of flush away piece surface fast, obtains evenly clean metallic surface;
3. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 110ml/L is the sulfuric acid of 130ml/L; The temperature of said solution is 30 ℃; The molybdenum-copper part is immersed 5min in this solution; Treat behind the 5min that piece surface evenly separates out bubble, take out part and put into tap water rapidly and clean up;
4. nickel plating:
The employed solution of nickel plating comprises: concentration is the nickel sulfamic acid Ni[NH of 350 g/L 2SO 3] 2, concentration is the sodium-chlor of 20 g/L, the boric acid H that concentration is 45 g/L 3BO 3, the pH value of said solution is 4.2, cathode current density 1 A/dm 2, solution temperature is 55 ℃, and anode employing purity is 99.99% sheet nickel, and the nickel plating time is 20 min, and strict control thickness of coating is 3 μ m, after the nickel plating molybdenum-copper part is cleaned up with deionized water, and is dry under 100 ℃ of conditions then;
This operation should strict control thickness of coating be 3 μ m, and nickel layer is too thick, can influence the sticking power of nickel layer, in follow-up vacuum heat treatment process, the foaming phenomenon can occur, if coating is too thin, then can influence the bonding force of follow-up electrolytic coating;
5. vacuum heat treatment:
Part after the nickel plating is put into vacuum heat treatment furnace, be evacuated to vacuum tightness and reach 3 * 10- 3Pa rises to temperature 800 ℃ then, insulation 30min, and the speed with 5 ℃/min is cooled to below 650 ℃ then, takes out part but cool to blow-on below 100 ℃ again with the furnace; This operation can make nickel layer and base material diffuse to form diffusion layer, and nickel layer and matrix are interlocked;
6. oil removing: adopt the electrochemical deoiling method to remove the adherent dirt of piece surface; Remove oil solution and need not corrode nickel layer, adopt concentration be 40g/L remove oil-bound distemper solution, removing oil-bound distemper is the commercially available oil-bound distemper that removes; Remove 60 ℃ of oil-bound distemper solution temperatures, part is placed except that oil-bound distemper solution immersion 15 min;
7. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 420ml/L is the hydrochloric acid of 220ml/L, and the temperature of said solution is 25 ℃, is 15 seconds with also strict control soak time in this solution of molybdenum-copper part immersion; This operation is wanted strict control soak time, if soak time is oversize, can cause nickel layer to be destroyed, the too short oxide film that then can't effectively remove the nickel layer surface of time;
8. follow-up plating, other coating that the piece surface plating after activated needs.
Embodiment 3
A kind of method of molybdenum-copper electroplating surface may further comprise the steps:
1. oil removing
Adopt the catholyte oil removing, remove the greasy dirt of molybdenum-copper piece surface; , the employed solution of oil removing comprises that concentration is the sodium hydroxide of 15 g/L, the yellow soda ash that concentration is 50 g/L, the tertiary sodium phosphate Na that concentration is 60 g/L 3PO 4,Concentration is the water glass Na of 10 g/L 2SiO 3, 75 ℃ of said solution temperatures, cathode current density 5 A/dm 2, oil removing time 10min cleans up with tap water after the oil removing;
2. pickling
The employed solution of pickling comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 410ml/L is the sulfuric acid of 410ml/L; The temperature of said solution is 20 ℃; To rock 12S in this solution of molybdenum-copper part immersion; The oxide film of flush away piece surface and spot; Obtain evenly clean metallic surface, after the pickling molybdenum-copper part is put into tap water immediately and clean up; This operation is the oxide film and the spot of flush away piece surface fast, obtains evenly clean metallic surface;
3. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 100ml/L is the sulfuric acid of 120ml/L; The temperature of said solution is 25 ℃; The molybdenum-copper part is immersed 4min in this solution; Treat behind the 4min that piece surface evenly separates out bubble, take out part and put into tap water rapidly and clean up;
4. nickel plating:
The employed solution of nickel plating comprises: concentration is the nickel sulfamic acid Ni[NH of 320 g/L 2SO 3] 2, concentration is the sodium-chlor of 15 g/L, the boric acid H that concentration is 40g/L 3BO 3, the pH value of said solution is 4.0, cathode current density 0.8 A/dm 2, solution temperature is 52 ℃, and anode employing purity is 99.99% sheet nickel, and the nickel plating time is 18 min, and strict control thickness of coating is 2 μ m, after the nickel plating molybdenum-copper part is cleaned up with deionized water, and is dry under 90 ℃ of conditions then;
This operation should strict control thickness of coating be 2 μ m, and nickel layer is too thick, can influence the sticking power of nickel layer, in follow-up vacuum heat treatment process, the foaming phenomenon can occur, if coating is too thin, then can influence the bonding force of follow-up electrolytic coating;
5. vacuum heat treatment:
Part after the nickel plating is put into vacuum heat treatment furnace, be evacuated to vacuum tightness and reach 3 * 10- 3Pa rises to temperature 790 ℃ then, insulation 30min, and the speed with 5 ℃/min is cooled to below 650 ℃ then, takes out part but cool to blow-on below 100 ℃ again with the furnace; This operation can make nickel layer and base material diffuse to form diffusion layer, and nickel layer and matrix are interlocked;
6. oil removing: adopt the electrochemical deoiling method to remove the adherent dirt of piece surface; Remove oil solution and need not corrode nickel layer, adopt concentration be 30g/L remove oil-bound distemper solution, removing oil-bound distemper is the commercially available oil-bound distemper that removes; Remove 50 ℃ of oil-bound distemper solution temperatures, part is placed except that oil-bound distemper solution immersion 12 min;
7. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 400ml/L is the hydrochloric acid of 200ml/L, and the temperature of said solution is 20 ℃, is 12 seconds with also strict control soak time in this solution of molybdenum-copper part immersion; This operation is wanted strict control soak time, if soak time is oversize, can cause nickel layer to be destroyed, the too short oxide film that then can't effectively remove the nickel layer surface of time;
8. follow-up plating, other coating that the piece surface plating after activated needs.
Embodiment 4
A kind of method of molybdenum-copper electroplating surface may further comprise the steps:
1. oil removing
Adopt the catholyte oil removing, remove the greasy dirt of molybdenum-copper piece surface; , the employed solution of oil removing comprises that concentration is the sodium hydroxide of 10 g/L, the yellow soda ash that concentration is 80 g/L, the tertiary sodium phosphate Na that concentration is 70 g/L 3PO 4,Concentration is the water glass Na of 13 g/L 2SiO 3, 75 ℃ of said solution temperatures, cathode current density 4 A/dm 2, oil removing time 12min cleans up with tap water after the oil removing;
2. pickling
The employed solution of pickling comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 415ml/L is the sulfuric acid of 415ml/L; The temperature of said solution is 15 ℃; To rock 13S in this solution of molybdenum-copper part immersion; The oxide film of flush away piece surface and spot; Obtain evenly clean metallic surface, after the pickling molybdenum-copper part is put into tap water immediately and clean up; This operation is the oxide film and the spot of flush away piece surface fast, obtains evenly clean metallic surface;
3. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 105ml/L is the sulfuric acid of 125ml/L; The temperature of said solution is 28 ℃; The molybdenum-copper part is immersed 3.5min in this solution; 3.5min after treat that piece surface evenly separates out bubble, take out part and put into tap water rapidly and clean up;
4. nickel plating:
The employed solution of nickel plating comprises: concentration is the nickel sulfamic acid Ni[NH of 340 g/L 2SO 3] 2, concentration is the sodium-chlor of 10 g/L, the boric acid H that concentration is 35g/L 3BO 3, the pH value of said solution is 4.1, cathode current density 0.6 A/dm 2, solution temperature is 54 ℃, and anode employing purity is 99.99% sheet nickel, and the nickel plating time is 16 min, and strict control thickness of coating is 2.5 μ m, after the nickel plating molybdenum-copper part is cleaned up with deionized water, and is dry under 95 ℃ of conditions then;
This operation should strict control thickness of coating be 2.5 μ m, and nickel layer is too thick, can influence the sticking power of nickel layer, in follow-up vacuum heat treatment process, the foaming phenomenon can occur, if coating is too thin, then can influence the bonding force of follow-up electrolytic coating;
5. vacuum heat treatment:
Part after the nickel plating is put into vacuum heat treatment furnace, be evacuated to vacuum tightness and reach 3 * 10- 3Pa rises to temperature 795 ℃ then, insulation 30min, and the speed with 5 ℃/min is cooled to below 650 ℃ then, takes out part but cool to blow-on below 100 ℃ again with the furnace; This operation can make nickel layer and base material diffuse to form diffusion layer, and nickel layer and matrix are interlocked;
6. oil removing: adopt the electrochemical deoiling method to remove the adherent dirt of piece surface; Remove oil solution and need not corrode nickel layer, adopt concentration be 30g/L remove oil-bound distemper solution, removing oil-bound distemper is the commercially available oil-bound distemper that removes; Remove 50 ℃ of oil-bound distemper solution temperatures, part is placed except that oil-bound distemper solution immersion 12 min;
7. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 410ml/L is the hydrochloric acid of 210ml/L, and the temperature of said solution is 22 ℃, is 14 seconds with also strict control soak time in this solution of molybdenum-copper part immersion; This operation is wanted strict control soak time, if soak time is oversize, can cause nickel layer to be destroyed, the too short oxide film that then can't effectively remove the nickel layer surface of time.

Claims (4)

1. the method for a molybdenum-copper electroplating surface is characterized in that: may further comprise the steps:
1. oil removing
Remove the greasy dirt of molybdenum-copper piece surface;
2. pickling
The employed solution of pickling comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 400~420ml/L is the sulfuric acid of 400~420ml/L; The temperature of said solution is 10~25 ℃; To rock 10~15S in this solution of molybdenum-copper part immersion; The oxide film of flush away piece surface and spot; Obtain evenly clean metallic surface, after the pickling molybdenum-copper part is put into tap water immediately and clean up;
3. activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 90~110ml/L is the sulfuric acid of 110~130ml/L; The temperature of said solution is 20~30 ℃; The molybdenum-copper part immersed treat behind 3~5min in this solution that piece surface evenly separates out bubble, take out part and put into tap water rapidly and clean up;
4. nickel plating:
The employed solution of nickel plating comprises: concentration is the nickel sulfamic acid Ni[NH of 300~350 g/L 2SO 3] 2, concentration is the sodium-chlor of 5~20 g/L, the boric acid H that concentration is 30~45 g/L 3BO 3, the pH value of said solution is 3.8~4.2, cathode current density 0.5~1 A/dm 2, solution temperature is 50~55 ℃, anode employing purity is 99.99% sheet nickel; The nickel plating time is 15~20 min; Strict control thickness of coating is 1~3 μ m, after the nickel plating molybdenum-copper part is cleaned up with deionized water, and is dry under 80~100 ℃ of conditions then;
5. vacuum heat treatment:
Part after the nickel plating is put into vacuum heat treatment furnace, be evacuated to vacuum tightness and reach 3 * 10- 3Pa rises to temperature 780~800 ℃ then, insulation 30min, and the speed with 5 ℃/min is cooled to below 650 ℃ then, takes out part but cool to blow-on below 100 ℃ again with the furnace;
6. oil removing:
Adopt the electrochemical deoiling method, be used to remove the adherent dirt of piece surface, remove oil solution and must not corrode nickel layer;
7.Activation:
Activating employed solution comprises: volume by volume concentration is that nitric acid, the volume by volume concentration of 380~420ml/L is the hydrochloric acid of 180~220ml/L; The temperature of said solution is 10~25 ℃, is 10~15 seconds with also strict control soak time in this solution of molybdenum-copper part immersion.
2. the method for claim 1, it is characterized in that: 1. described step further is:
1. oil removing: adopt the catholyte oil removing, the employed solution of oil removing comprises that concentration is the sodium hydroxide of 5~25 g/L, the yellow soda ash that concentration is 20~100 g/L, the tertiary sodium phosphate Na that concentration is 40~80 g/L 3PO 4,Concentration is the water glass Na of 5~15 g/L 2SiO 3, 70~80 ℃ of said solution temperatures, cathode current density 3~6 A/dm 2, oil removing time 5~15min cleans up with tap water after the oil removing.
3. the method for claim 1, it is characterized in that: 6. described step further is:
6. oil removing: adopt concentration be 20~40g/L remove oil-bound distemper solution, 40~60 ℃ of temperature place part except that oil-bound distemper solution and soak 10~15 min.
4. the method for claim 1 is characterized in that: described step also comprises step after 7.:
8. follow-up plating
Other coating that piece surface plating after activated needs.
CN 201110293206 2011-09-30 2011-09-30 Method for electroplating surface of molybdenum and copper alloy CN102345145B (en)

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CN103757674A (en) * 2013-12-20 2014-04-30 中国电子科技集团公司第五十五研究所 Nickel plating method for tungsten-copper composite material
CN103911634A (en) * 2014-03-06 2014-07-09 中国电子科技集团公司第五十五研究所 Surface nickel plating method for molybdenum-based composite material
CN104593842A (en) * 2015-01-07 2015-05-06 上海应用技术学院 Method for preparing metal coating on molybdenum substrate
CN104846410A (en) * 2015-06-16 2015-08-19 沈阳飞机工业(集团)有限公司 Method for electroplating nickel on brass and red copper alloy
CN105483784A (en) * 2015-12-30 2016-04-13 无锡透平叶片有限公司 Turbine blade and surface pretreatment method thereof
CN105671607A (en) * 2016-04-01 2016-06-15 中国电子科技集团公司第三十八研究所 Pretreatment method of molybdenum copper carrier before electroplating
CN106086968A (en) * 2016-07-29 2016-11-09 成都立威讯科技有限公司 A kind of electroplating technology of IGBT molybdenio plate surface-coated noble metal
CN106191942A (en) * 2016-07-29 2016-12-07 成都立威讯科技有限公司 A kind of rhodanizing technique of semiconductor chip nickel preplating
CN109183087A (en) * 2018-10-24 2019-01-11 尼尔金属(苏州)有限公司 A method of the nickel plating on copper and copper alloy coiled material
CN109507191A (en) * 2018-09-29 2019-03-22 中国人民解放军第五七九工厂 A kind of corrosion detecting method of powdered metallurgical material surface metallurgic defect
CN109957822A (en) * 2019-05-05 2019-07-02 东莞市康圣精密合金材料有限公司 Copper alloy electroplating technology
CN110565093A (en) * 2019-10-16 2019-12-13 中电国基南方集团有限公司 molybdenum-copper composite material plating method
CN110712419A (en) * 2019-09-24 2020-01-21 无锡乐普金属科技有限公司 Preparation method of copper-molybdenum-copper alloy material
CN111020657A (en) * 2019-12-31 2020-04-17 中国工程物理研究院机械制造工艺研究所 Method for electroplating molybdenum part with gold
CN111468910A (en) * 2020-05-29 2020-07-31 全椒县众联机械有限公司 Antirust processing technology of cylindrical gear

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CN103173821A (en) * 2013-03-26 2013-06-26 浙江天嘉电子有限公司 Treatment technology for improving coating layer bonding strength of tungsten alloy
CN103334151A (en) * 2013-07-22 2013-10-02 苏州昕皓新材料科技有限公司 Method for plating nickel by improving additive adding sequence
CN103757674B (en) * 2013-12-20 2017-01-04 中国电子科技集团公司第五十五研究所 A kind of nickel plating process of tungsten-copper composite material
CN103757674A (en) * 2013-12-20 2014-04-30 中国电子科技集团公司第五十五研究所 Nickel plating method for tungsten-copper composite material
CN103911634A (en) * 2014-03-06 2014-07-09 中国电子科技集团公司第五十五研究所 Surface nickel plating method for molybdenum-based composite material
CN103911634B (en) * 2014-03-06 2016-09-21 中国电子科技集团公司第五十五研究所 A kind of plating nickel on surface method of molybdenum-base composite material
CN104593842A (en) * 2015-01-07 2015-05-06 上海应用技术学院 Method for preparing metal coating on molybdenum substrate
CN104846410A (en) * 2015-06-16 2015-08-19 沈阳飞机工业(集团)有限公司 Method for electroplating nickel on brass and red copper alloy
CN105483784A (en) * 2015-12-30 2016-04-13 无锡透平叶片有限公司 Turbine blade and surface pretreatment method thereof
CN105671607A (en) * 2016-04-01 2016-06-15 中国电子科技集团公司第三十八研究所 Pretreatment method of molybdenum copper carrier before electroplating
CN106086968A (en) * 2016-07-29 2016-11-09 成都立威讯科技有限公司 A kind of electroplating technology of IGBT molybdenio plate surface-coated noble metal
CN106191942A (en) * 2016-07-29 2016-12-07 成都立威讯科技有限公司 A kind of rhodanizing technique of semiconductor chip nickel preplating
CN109507191A (en) * 2018-09-29 2019-03-22 中国人民解放军第五七九工厂 A kind of corrosion detecting method of powdered metallurgical material surface metallurgic defect
CN109183087A (en) * 2018-10-24 2019-01-11 尼尔金属(苏州)有限公司 A method of the nickel plating on copper and copper alloy coiled material
CN109957822A (en) * 2019-05-05 2019-07-02 东莞市康圣精密合金材料有限公司 Copper alloy electroplating technology
CN110712419A (en) * 2019-09-24 2020-01-21 无锡乐普金属科技有限公司 Preparation method of copper-molybdenum-copper alloy material
CN110565093A (en) * 2019-10-16 2019-12-13 中电国基南方集团有限公司 molybdenum-copper composite material plating method
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