WO2022089232A1 - Manufacturing equipment and manufacturing method for lead frame surface roughness - Google Patents

Manufacturing equipment and manufacturing method for lead frame surface roughness Download PDF

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Publication number
WO2022089232A1
WO2022089232A1 PCT/CN2021/124340 CN2021124340W WO2022089232A1 WO 2022089232 A1 WO2022089232 A1 WO 2022089232A1 CN 2021124340 W CN2021124340 W CN 2021124340W WO 2022089232 A1 WO2022089232 A1 WO 2022089232A1
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Prior art keywords
lead frame
pulse
surface roughness
electrolytic copper
reverse
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PCT/CN2021/124340
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French (fr)
Chinese (zh)
Inventor
门松明珠
周爱和
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昆山一鼎工业科技有限公司
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Priority to JP2022519585A priority Critical patent/JP2022547336A/en
Publication of WO2022089232A1 publication Critical patent/WO2022089232A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4835—Cleaning, e.g. removing of solder

Definitions

  • the invention belongs to the technical field of continuous lead frame surface treatment and manufacture, and in particular relates to a manufacturing equipment and a manufacturing method for the surface roughness of a lead frame.
  • Precision integrated circuits encapsulated by high-precision chips and lead frames are important core electronic products in the modern electronic information industry.
  • the important role of the lead frame is to support the chip, protect the internal components, and connect the external circuit, which is the key material in the integrated circuit.
  • lead frame materials are being developed in the direction of miniaturization and high density of lead pitches. This not only puts forward higher requirements on the strength and conductivity of the lead frame material, but also puts forward higher requirements on the processing performance of the material.
  • lead frame materials should not allow defects such as scratches, peeling, oxidation, water marks and uneven color appearance.
  • the lead frame material manufacturing method for semiconductor integrated circuits has become the mainstream by using the photosensitive dry film hot pressing process on the surface of the lead frame material.
  • the requirements for the surface quality of lead frame materials have become higher and higher. That is to say, the surface roughness of the lead frame material is an important factor affecting the dry film hot pressing process, and it is also a key factor for the packaging process to be closely combined with the packaging material. Therefore, research and development of cleaning and production equipment for the surface of lead frame materials has become a very important issue, and in particular, research and development of manufacturing methods and manufacturing equipment for the surface roughness of lead frame materials has become an urgent issue to be solved.
  • Patent Document 1 (CN 101864586 B): It is described that after the metal material is pre-treated by degreasing and pickling and dried, the upper and lower sides of the metal material are subjected to hot pressing with photosensitive films, and ultraviolet light is used to pass through a special lead wire.
  • the frame pattern mold exposes the lead frame attached with the photosensitive film, and then treats it with a developing solution, and then performs etching and electroplating treatment to prepare the lead frame material.
  • this method has the defect that the photosensitive film and the surface of the metal material are not firmly bonded, so that the electroplating solution is immersed in the gap between the photosensitive film and the metal to be plated and a small part of the etched area is not etched or completely removed by etching. The problem.
  • Patent Document 2 JP 6406711 B2: describes a method for manufacturing a chip lead frame, the first plating step includes forming Ni plating, Pd plating and Au plating in sequence at predetermined positions on the front and back surfaces of the metal plate.
  • the second plating layer is preferably a method of forming an Ag plating layer.
  • the manufacturing method is a sheet-type production process, which has the defects of low production efficiency and uneven product quality; in addition, the paper does not describe the cleaning process of the metal material.
  • Patent Document 3 JP 4431860 B2 Describes a method for roughening the surface of copper and copper alloy materials to provide lead frame materials by surface roughening agent hydrogen peroxide and sulfuric acid system.
  • the requirements for the thermal compression bonding strength between the metal material surface and the photosensitive dry film are getting higher and higher, and the bonding strength of the metal surface provided by the surface roughening agent method is insufficient.
  • the copper surface roughened by this method has defects that are very easy to oxidize.
  • Patent Document 4 JP 1997-298265 A: A technique is proposed to form multiple layers of nickel plating layers with different densities on the surface of the lead frame to improve the bonding strength with the packaging material.
  • the lower layer using the multi-layer nickel plating layer is formed of a nickel plating layer that forms a smooth and dense layer
  • the upper layer is formed of a pulsed nickel plating layer that prioritizes crystal growth in the vertical direction.
  • this multi-plating technique sufficient surface roughness of the upper nickel plating layer cannot be obtained, so that the bonding force with the packaging material is weak. Therefore, this technology has the disadvantage of insufficient bonding strength with the packaging material.
  • Patent Document 5 Provides a technique of forming a variety of different metal plating layers on the surface of the lead frame to improve the bonding strength with the packaging material.
  • Two nickel plating layers with different thicknesses are successively plated through two different nickel plating conditions to make the total thickness of 1.0 ⁇ m, and then a 0.03 ⁇ m palladium plating layer is performed thereon, and a 0.01 ⁇ m gold plating layer is further performed on the palladium plating layer.
  • the pulse reverse electrolysis technology is used to obtain a lead frame with suitable surface roughness, and the bonding strength with the packaging material can meet the requirements of various product specifications.
  • the gold electrolytically desorbed from the surface is a precious metal with extremely high chemical stability, which will not cause oxidation to roughen the surface, thus reducing the bonding performance with the packaging material; at the same time, the production process requirements of lead frames with various metal coatings High, the precious metals used are expensive, and the product cost increases, which is difficult to achieve in actual production.
  • Patent Documents 1 to 5 provide a variety of production and processing methods for lead frames.
  • Document 1 has the defect that the photosensitive dry film and the surface of the lead frame material are not firmly bonded, resulting in the plating solution immersed in the gap between the photosensitive film and the metal and is Electroplating and lead to the problem that a small part of the etched area is not etched or not removed at all;
  • Document 2 has the defects of low production efficiency and uneven product quality; in addition, the paper does not describe the cleaning process of metal materials;
  • the bonding strength of the metal surface provided by the surface roughening method with chemical solution is insufficient, and in addition, the roughened surface of the lead frame material has the defect that it is very easy to oxidize.
  • the above-mentioned problems are major issues to be solved urgently in the lead frame surface treatment production line manufacturing industry.
  • the bandwidth of lead frame materials is generally more than 100mm, or even 300-400mm, while the bandwidth of terminal materials is generally less than 20mm. It is more difficult to ensure uniform film thickness for surface treatment of lead frame materials with higher widths.
  • the combination is firm to ensure the quality and production efficiency of integrated circuit products; 3) To solve the defect of uneven quality of lead frame products; 4) The surface roughness of the lead frame material should meet the hot-pressing combination with the packaging material. At the same time, the surface of the lead frame material should be The thickness of the electrolytic copper film also needs to be homogenized; 5) It is necessary to solve the defects that the surface of the lead frame and the photosensitive dry film of the chemical solution roughening process are insufficient in hot-pressing bonding strength and the surface of the material is very easy to oxidize. 6) To provide lead frame products with excellent corrosion resistance.
  • the present invention aims to solve at least one of the technical problems existing in the prior art.
  • the present invention proposes a manufacturing equipment for the surface roughness of a wire frame, which improves the uniformity of the electrolytic copper film thickness of the lead frame material produced by the manufacturing equipment for the surface roughness of the wire frame, and enhances the surface of the lead frame material and the photosensitive dryness.
  • the bonding strength of the film not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also guarantees product quality.
  • the manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
  • the present invention also proposes a method for manufacturing the surface roughness of the wire frame, which has the advantages of high product quality and high production efficiency.
  • a discharging device from front to back in the production process sequence, there are: a discharging device, a cleaning device, an electrolytic copper device and a receiving device, and the discharging device can The lead frame material on the tray is discharged; the cleaning device can clean the lead frame material to remove surface impurities; the receiving device can rewind the processed lead frame material; the electrolytic copper device The surface roughness of the lead frame material can be regulated by the pulse reverse electrolysis technology.
  • the electrolytic copper device includes: a pulse reverse power supply, which can output pulse forward and reverse current and forward and reverse pulse time; electrolytic copper Process tank, the number of the electrolytic copper process tanks is multiple, the lead frame material can pass through the multiple electrolytic copper process tanks, and the lead frame material continuously moves forward to form a moving path; the electrolytic copper potion, The electrolytic copper potion is arranged in the electrolytic copper process tank, and the lead frame material can be immersed in the electrolytic copper potion.
  • the manufacturing equipment for the surface roughness of the lead frame according to the embodiment of the present invention is mainly composed of a discharging device, a cleaning device, an electrolytic copper device and a receiving device, and a clean lead frame material can be obtained through the cleaning device.
  • the pulse reverse electrolysis technology to adjust and control the surface roughness of the lead frame material can not only increase the grain size and surface roughness of the Cu plating layer, but also produce a strong bonding effect between the lead frame material and the packaging material. There are few defects such as pinholes in the desorption layer, and it has good corrosion resistance.
  • the uniformity of the electrolytic copper film thickness of the lead frame material produced by this equipment is improved, and the bonding strength between the surface of the lead frame material and the photosensitive dry film is enhanced. It not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also products Quality is guaranteed.
  • the manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
  • each of the electrolytic copper process tanks is provided with two electrode plates, the two electrode plates are oppositely arranged on both sides of the lead frame material, and the moving path is located in the two electrode plates. between the electrode plates.
  • the ratio of the surface area of the electrode plate to the surface area of the lead frame material immersed in each electrolytic copper process tank is 5:1.
  • the shape of the electrode plate is formed as one-sided, mesh or special shape, and the two electrode plates in each of the electrolytic copper process tanks are of the same shape or a combination of different shapes.
  • the surface roughness of the lead frame is regulated by the pulse reverse electrolysis technology, and it is characterized in that, it includes the following steps:
  • Electrolytic copper plating section According to the surface roughness of electrolytic copper, determine the pulse forward and reverse current and forward and reverse pulse time output by the pulse reverse power supply;
  • the surface roughness of the electrolytic copper the surface roughness of the lead frame material required for the product ⁇ the surface roughness of the lead frame material.
  • the arithmetic mean of the surface roughness of the electrolytic copper ranges from 0.05 ⁇ m to 5.0 ⁇ m.
  • the pulse forward current range output by the pulse reverse power supply is 5A ⁇ 500A, and the reverse current range output by the pulse reverse power supply is 20A ⁇ 1000A.
  • the time range of the pulse forward pulse output by the pulse reverse power supply is 5ms-100ms; the pulse reverse pulse time range of the pulse reverse power supply is 1ms-30ms.
  • the electrolytic copper process tank is provided with an electrolytic copper potion, and the electrolytic copper potion needs to meet the usage range of the pulse forward and reverse current density output by the pulse reverse power supply.
  • the pulse forward current density ranges from 2A/dm 2 to 70A/dm 2
  • the pulse reverse current density ranges from 5A/dm 2 to 170A/dm 2 .
  • FIG. 1 is a flow chart of steps of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • Fig. 2 is the overall process flow chart of lead frame surface treatment
  • FIG. 3 is an output waveform diagram of a pulse reverse power supply of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 4 is an apparatus for manufacturing the surface roughness of a lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 5 is an implementation 1 continuous lead frame material of a method of manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 6 is a diagram of an apparatus for manufacturing the surface roughness of a lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 7 is a drawing of the implementation 2 continuous lead frame material of the method for manufacturing the surface roughness of the lead frame according to the embodiment of the present invention.
  • FIG. 8 is a structural diagram of a manufacturing equipment for the surface roughness of a chip lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • FIG. 9 is a material structure diagram of a chip lead frame in implementation 3 of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
  • Pulse reverse power supply 300 Pulse reverse power supply 300; Pulse reverse power supply 310-370;
  • the discharging device 10 the discharging guide wheel 11; the cathode conduction 13a at the inlet; the cathode conduction 13b at the outlet;
  • Electrolytic copper process tank 30 electrolytic copper process tank 30a-30g;
  • electrode plate 40 upper anode plate 40a; lower anode plate 40b;
  • Receiving guide wheel 50 Receiving device 51.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • the manufacturing equipment for the surface roughness of the lead frame includes: a discharging device 10 , a cleaning device, an electrolytic copper device and a receiving device 51 .
  • the discharging device 10 can discharge the lead frame material on the tray; the cleaning device can clean the lead frame material to remove surface impurities;
  • the copper device can control the surface roughness of the lead frame material through the pulse reverse electrolysis technology, including: the pulse reverse power supply 300, the pulse reverse power supply 300 can output pulse forward and reverse current and forward and reverse pulse time; electrolytic copper process tank 30 , the number of electrolytic copper process tanks 30 is multiple, the lead frame material can pass through multiple electrolytic copper process tanks 30, and the lead frame material moves forward continuously to form a moving path; electrolytic copper syrup, electrolytic copper syrup is set in the electrolytic copper process Inside the tank 30, the lead frame material can be immersed in the electrolytic copper potion.
  • the rewinding device 51 can rewind the processed lead frame material.
  • each electrolytic copper process tank 30 is provided with two electrode plates 40 , the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, and the moving path is located between the two electrode plates 40 .
  • the electrode plate 40 is the anode plate, and the number of electrolytic copper process tanks 30 can be multiple.
  • the electrolytic copper process tank 30 is provided with a channel extending through the running direction of the lead frame material, and the lead frame material can pass through the electrolytic copper process tank 30. out.
  • the lead frame material is the cathode, and the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, so that electrolysis can occur on both sides of the lead frame material.
  • the surface of the lead frame material can precipitate copper or strip copper.
  • the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1, preferably 3:1, more preferably 2:1.
  • the electrode plate 40 is the anode plate
  • the lead frame material is the cathode, that is to say, the requirement of the ratio of the area of the anode material to the area of the cathode material is 5:1.
  • the shape of the electrode plates 40 is formed in one-sided, mesh or different shapes, and the two electrode plates 40 in each electrolytic copper process tank 30 are of the same shape or a combination of different shapes.
  • the electrode plate 40 can be a combination of soluble metal and insoluble metal, or the insoluble electrode plate 40 can be used to electrolyze the precious metal on the surface of the electrode plate 40.
  • the electrode plate 40 can be a flat plate bent into an arc shape, and a mesh bent into an arc shape, as long as the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1 requirements.
  • the shapes of the two electrode plates 40 can be a combination of different shapes, one can be a sheet, the other is a special shape, or one is a mesh and the other is a sheet, which can be set according to actual needs. It has high applicability to determine its size, shape and combination.
  • the requirement of the ratio of the area of the anode material to the area of the cathode material of 5:1 can be met, the uniformity of the electrolytic copper film thickness on the surface of the lead frame material is improved, the product quality is guaranteed, and the lead frame surface treatment production line is improved. production efficiency.
  • the lead frame material is transported horizontally through the electrolytic copper process tank, because the bandwidth of the lead frame material is much larger than that of the terminal material, and vertical transport cannot ensure the smoothness of the lead frame material during operation. properties, which in turn affects the treatment of surface roughness.
  • the horizontal conveying method is more stable, which is convenient for surface roughness treatment.
  • the manufacturing equipment for the surface roughness of the lead frame is mainly composed of a discharging device 10, a cleaning device, an electrolytic copper device and a receiving device 51.
  • the cleaning device can obtain clean lead frame material.
  • the electrolytic copper device the pulse reverse electrolysis technology is used to adjust and control the roughness of the surface of the lead frame material.
  • the uniformity of the electrolytic copper film thickness of the lead frame material produced by this equipment is improved, and the bonding strength between the surface of the lead frame material and the photosensitive dry film is enhanced. It not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also products Quality is guaranteed.
  • the manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
  • the electrode plate 40 is also an anode plate, and the anode plate includes an upper anode plate 40a and a lower anode plate 40b.
  • the surface roughness of the lead frame is regulated by the pulse reverse electrolysis technique, including the following steps:
  • Electrolytic copper plating section According to the surface roughness of electrolytic copper, determine the pulse forward and reverse current and the forward and reverse pulse time output by the pulse reverse power supply 300;
  • the optimal combination of the pulse forward and reverse currents and the forward and reverse pulse times output by the pulse reverse power supply 300 can be determined.
  • the lead frame material After the lead frame material is led out from the discharge 10 and passed through the discharge guide wheel 11, it enters the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enters the acid activation tank to clean and remove the rust and oxide on the surface of the metal material.
  • lead frame material Then enter the electrolytic copper plating section, in the electrolytic copper process tank 30, the electrode plate 40 is the anode, the lead frame material in the electrolytic copper syrup is the cathode, and electrolysis occurs under the action of the pulse reverse power supply 300, and the surface roughness of the lead frame material changes happened. Specifically, the applied forward and reverse pulse currents and the forward and reverse pulse times are different, and the electrolysis on the surface of the lead frame material is also different.
  • the current applied to the lead frame output by the pulse reverse power supply 300 changes periodically.
  • the pulse reverse power supply 300 applies a forward pulse current
  • copper is electrolytically dissociated on the surface of the lead frame, showing a pulse forward waveform
  • the pulse reverse power supply 300 applies a reverse pulse current
  • the surface of the lead frame material is electrolytically stripped of copper, showing a pulse reverse waveform.
  • copper is continuously precipitated and stripped on the surface of the lead frame material.
  • the forward pulse time when the forward pulse time is long, more copper is precipitated on the surface of the lead frame material, and the thickness of the copper film is relatively thick.
  • the reverse pulse time when the reverse pulse time is long, the surface of the lead frame material peels off more copper. , the copper film thickness will be thinner. Not only can the thickness of the Cu plating layer be uniform, but also the surface roughness of the lead frame material can be varied according to different requirements.
  • the copper is electrolytically stripped by the reverse pulse current, the hydrogen atoms absorbed in the Cu plating layer on the surface of the lead frame can be removed, the brittleness of the Cu plating layer caused by the hydrogen atoms contained in the copper layer is eliminated, and the workability such as bending is improved. .
  • the pulsed reverse power supply 300 electrolytic copper process when the pulsed reverse power supply 300 electrolytic copper process is performed, the metal copper is precipitated faster in the epitaxial growth of the crystal than in the generation of the crystal nucleus, which increases the grain size and surface roughness of the Cu coating. Due to this irregularly shaped, rough surface morphology, a strong adhesive effect is produced between the lead frame material and the encapsulation material, and the encapsulation material obtained has strong adhesive properties.
  • the current waveform of the reverse polarity is applied alternately and repeatedly, the strain in the copper layer due to hydrogen absorption and the mixing ratio of impurities are electrolytically desorbed in the copper layer. There is less mixing of strain and impurities.
  • the electrolytic copper process is implemented by the pulse reverse electrolysis technology, which can not only increase the grain size and surface roughness of the Cu plating layer, but also make the lead frame material and packaging material. There is a strong adhesion effect between them, and there are few defects such as pinholes in the electro-desorption layer, which has good corrosion resistance.
  • the method can replace the chemical potion roughening process, can greatly improve the production efficiency of the surface treatment of the lead frame, the uniformity of the electrolytic copper film is improved, and the product quality is guaranteed.
  • the surface roughness Ra1 of the electrolytic copper the surface roughness Ra2 of the lead frame material required for the product - the surface roughness Ra of the lead frame material.
  • the setting and adjustment of the pulse forward and reverse current and the forward and reverse pulse time output by the pulse reverse power supply 300 are closely related to the distribution of the surface roughness of the electrolytic copper and the arithmetic mean value of the surface roughness of the electrolytic copper. It is determined that the control of the surface roughness of the lead frame by the pulse reverse electrolysis technology plays a great role.
  • the arithmetic mean ranges of the surface roughness of the electrolytic copper, the surface roughness of the lead frame material required for the product, and the surface roughness of the lead frame material are all in the range of 0.05 ⁇ m to 5.0 ⁇ m.
  • the pulse forward current output by the pulse reverse power supply 300 ranges from 5A to 500A, and the reverse current output from the pulse reverse power supply 300 ranges from 20A to 1000A.
  • the optional range of the pulse forward pulse time output by the pulse reverse power supply 300 is 5ms ⁇ 100ms; the pulse reverse pulse time range output by the pulse reverse power supply 300 is 1ms ⁇ 30ms.
  • the electrolytic copper process tank 30 is provided with electrolytic copper syrup, and the electrolytic copper syrup needs to meet the pulse forward and reverse current density usage ranges output by the pulse reverse power supply 300 .
  • the pulse forward current density ranges from 2A/dm 2 to 70A/dm 2
  • the pulse reverse current density ranges from 5A/dm 2 to 170A/dm 2
  • Pulse reverse power supply 300 output current A electrolytic copper potion current density A/dm 2 ⁇ material surface area dm 2
  • pulse forward current density preferably ranges from 5A/dm 2 to 60A/dm 2 , and more preferably ranges from 10A/dm 2 to 50A/ dm 2
  • the pulse reverse current density preferably ranges from 10A/dm 2 to 160A/dm 2 , and more preferably ranges from 20A/dm 2 to 150A/dm 2 .
  • each electrolytic copper process tank 30 is provided with two electrode plates 40 , the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, and the moving path is located between the two electrode plates 40 .
  • the electrode plate 40 is the anode plate, and the number of electrolytic copper process tanks 30 can be multiple.
  • the electrolytic copper process tank 30 is provided with a channel extending through the running direction of the lead frame material, and the lead frame material can pass through the electrolytic copper process tank 30. out.
  • the lead frame material is the cathode, and the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, so that electrolysis can occur on both sides of the lead frame material.
  • the surface of the lead frame material can precipitate copper or strip copper.
  • the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1, preferably 3:1, more preferably 2:1.
  • the electrode plate 40 is the anode plate
  • the lead frame material is the cathode, that is to say, the requirement of the ratio of the area of the anode material to the area of the cathode material is 5:1.
  • the shape of the electrode plate 40 is formed in one-sided, meshed or irregular shape.
  • the electrode plate 40 can be a combination of soluble metal and insoluble metal, or the insoluble electrode plate 40 can be used to electrolyze the precious metal on the surface of the electrode plate 40 .
  • the electrode plate 40 can be a flat plate bent into an arc shape, and a mesh bent into an arc shape, as long as the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1 requirements.
  • the two electrode plates 40 in each electrolytic copper process tank 30 are of the same shape or a combination of different shapes. That is to say, the shapes of the two electrode plates 40 can be a combination of different shapes, one can be a sheet, the other is a special shape, or one is a mesh and the other is a sheet, which can be set according to actual needs. It has high applicability to determine its size, shape and combination. Through the adjustment of the size and shape of the anode, the requirement of the ratio of the area of the anode material to the area of the cathode material of 5:1 can be met, the uniformity of the electrolytic copper film thickness on the surface of the lead frame material is improved, the product quality is guaranteed, and the lead frame surface treatment production line is improved. production efficiency.
  • production by the method for producing the surface roughness of the lead frame can meet the following requirements: 1) the bonding between the surface of the lead frame material and the photosensitive dry film must be firm; 2) the surface roughness of the lead frame material must meet the thermal resistance of the packaging material.
  • the pressure bonding is firm to ensure the quality and production efficiency of integrated circuit products; 3) To solve the defect of uneven quality of lead frame products; 4)
  • the surface roughness of the lead frame material should meet the requirements of the thermal compression bonding with the packaging material.
  • the lead frame material The thickness of the electrolytic copper film on the surface also needs to be uniform; 5) It is necessary to solve the problem that the surface of the lead frame and the photosensitive dry film of the chemical solution roughening process are insufficient in hot-pressing bonding strength and the surface of the material is very easy to oxidize. 6) To provide lead frame products with excellent corrosion resistance.
  • pulse reverse electrolysis technology based on pulse reverse power supply 300, selective metal anode, adjustment of anode size and shape, and copper potion for pulse electrolysis, it is realized to provide high-quality and high-performance lead frame materials for the integrated circuit industry. And continue to challenge the important foundation of high-end lead frame manufacturing technology. It can not only improve the uniformity of the electrolytic copper film thickness on the surface of the lead frame material, but also have excellent corrosion resistance and excellent adhesion to the packaging material, but also ensure the product quality and improve the production efficiency of the lead frame surface treatment production line.
  • the lead frame material of the present invention can be a metal material, and the metal material can be any single selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc or copper, nickel, cobalt, Alloys composed of any two or more selected from phosphorus, tungsten, arsenic, molybdenum, chromium and zinc; also can be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips , can also be continuous lead frame material.
  • any material with metal foil on the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness production; for example, materials with metal film attached to one or both sides of various plastic films All materials with the required surface roughness can be manufactured;
  • the optional width of metal materials ranges from 10mm to 1000mm; the optional thickness of metal materials ranges from 0.03mm to 0.30mm; the optional range of arithmetic mean of surface roughness of metal materials is 0.06 ⁇ m to 2.0 ⁇ m
  • the lead frame material of the present invention can be a metal material, and the metal material can be any single element selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc, or copper, nickel, cobalt, phosphorus, tungsten, arsenic, Alloys composed of any two or more selected from molybdenum, chromium and zinc; it can also be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips or continuous leads frame material.
  • any material with metal foil on the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness production; for example, materials with metal film attached to one or both sides of various plastic films All materials with the required surface roughness can be manufactured;
  • the optional width of metal materials ranges from 10mm to 1000mm; the optional thickness of metal materials ranges from 0.03mm to 0.30mm;
  • the arithmetic mean value of the surface roughness of the metal material can be selected in the range of 0.1 ⁇ m to 10.0 ⁇ m.
  • the surface of the photosensitive dry film and the surface of the metal material are subjected to hot pressing to obtain a film-coated metal material with firm adhesion and uniform surface quality.
  • Optional range of thickness of photosensitive dry film raw material 20 ⁇ 60 ⁇ m; optional range of surface roughness of photosensitive dry film raw material: 0.75 ⁇ 1.87 ⁇ m; optional range of material thickness after lamination of metal material and photosensitive dry film: 0.05 ⁇ 0.36mm ; Optional range of one side roughness of photosensitive dry film: 0.85 ⁇ 2.35 ⁇ m;
  • the electrolytic copper potion used should be able to meet the following requirements: the forward current density can be selected from 2A/dm 2 to 70A/dm 2 ; the reverse current density can be selected from 5A/dm 2 to 170A/dm 2 ; The special requirements for the electrolytic stripping of copper on the surface of the lead frame material under the current condition and the electrolytic stripping of the copper on the surface of the lead frame material under the reverse current condition.
  • the raw material copper tape C19400 has a width of 350mm and a thickness of 0.12mm.
  • the roughness Ra is 0.08-0.15 ⁇ m by the shape measuring and testing instrument VK-X series, and the average value calculated from multiple sets of data is 0.11 ⁇ m.
  • the surface roughness Ra of the metal material is 1.3-1.5 ⁇ m.
  • the metal raw materials are led out from the discharge 10 through the discharge guide wheel 11, then enter the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enter the acid activation tank to clean and remove the rust and oxidation on the surface of the metal material. objects, etc., to obtain clean metal materials.
  • an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 .
  • the connection manner of the second electrolytic copper area to the seventh copper plating area is the same as the connection manner of the first electrolytic copper area. As shown in Figure 1 and Figure 4.
  • the width of the raw material copper tape is 350mm, the surface area is large, and the surface roughness of the lead frame material required by the product is Ra 1.30 ⁇ 1.50 ⁇ m and the raw material roughness Ra 0.08 ⁇ 0.15 ⁇ m is relatively large, preferably 7 units
  • the electrolytic copper process is used to process the surface roughness; the total surface roughness of the lead frame manufactured by the seven pulse reverse power supplies 310 to 370 is set to 21 equal parts, and the surface roughness of each equal part is 0.06-0.07 ⁇ m;
  • the surface roughness range Ra 0.92 ⁇ 1.07 ⁇ m needs to be achieved after treatment, and the six pulse reverse power supplies 300 of the pulse reverse power supply 320 to 370 each occupy 1 part. After the pulse reverse power supply 300 is processed, the surface roughness of the material must meet Ra 0.06 ⁇ 0.07 ⁇ m.
  • the operating speed of the lead frame material surface roughness manufacturing line is preferably 1.5 m/min.
  • the seven pulse reverse power supplies 300 use the condition No. 7 in Table 1, the roughness of the electrolytic copper layer for the seven times is in the range of 0.18-0.21 ⁇ m, that is, the forward and reverse pulse currents set by the seven pulse reverse power supplies 300 and The forward and reverse pulse time conditions are the same, the obtained surface roughness and density from the bottom layer to the surface layer have little difference, and the surface characteristics of the lead frame material are uniform.
  • the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current.
  • the obtained electrolytic copper has a large roughness and a poor density
  • the set conditions of the subsequent six pulse reverse power supplies 320 to 370 are compared with the condition No. 7, which is a smaller forward pulse current and a longer forward pulse time, and the set value of the reverse pulse current is slightly larger than that of the condition No.7, and the reverse pulse time is much shorter than that of No.7; therefore, the obtained surface roughness meets the product specification and is similar to the condition No. 7. .7 is better than the surface density.
  • the surface roughness of the lead frame material meets the requirements, and the density range is between the conditions No. 1 and No. 7.
  • the six pulse reverse power supplies 310 to 360 need to be set with a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse current. Pulse time; the resulting copper layer has less roughness and better density.
  • the setting conditions of the last pulse reverse power supply 370 are larger forward pulse current and longer forward pulse time, and set larger reverse pulse current and shorter reverse pulse time, so the obtained While reaching the product specification, the surface roughness is inferior to that of Condition No. 7.
  • the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 7 and No. 13.
  • the surface roughness of the lead frame is analyzed and tested with the shape measuring instrument VK-X series.
  • the lead frame blister copper material is used as the raw material for subsequent silver plating, and it must be able to form a dense and strong bonding layer with the silver plating layer, which is the standard for judging the surface specifications of the lead frame.
  • the shape measuring instrument VK-X series After selecting the brand and model of the photosensitive dry film, use the shape measuring instrument VK-X series to analyze and test the roughness Ra of 1.3 ⁇ 1.85 ⁇ m, and the average value of multiple sets of data Ra is 1.58 ⁇ m;
  • the surface roughness specification range of the film machine after hot pressing is 1.57-1.93 ⁇ m. With this specification range as the inspection standard, the metal materials produced under the above conditions and the photosensitive dry film autoclaved products are tested by the shape measuring detector VK-X, which can determine the best manufacturing method for the surface roughness of metal materials and the optimal pulse reverse power supply 300 setting conditions.
  • the roll lead frame has a width of 115mm and a thickness of 0.15mm, and the metal raw material is C14410.
  • the roughness Ra is 0.12-0.21 ⁇ m, and the average value calculated from multiple sets of data is 0.17 ⁇ m.
  • the surface roughness of the lead frame needs to be in the range of 2.5 to 3.7 ⁇ m
  • the metal raw materials are led out from the discharge 10 through the discharge guide wheel 11, then enter the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enter the acid activation tank to clean and remove the rust and oxidation on the surface of the metal material. objects, etc., to obtain clean metal materials.
  • an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 .
  • the connection manner of the second electrolytic copper region to the sixth electrolytic copper region is the same as that of the first electrolytic copper region, as shown in FIG. 6 .
  • the width of the rolled lead frame material is 115mm, and the surface area is less than one-third of that of Example 1.
  • the 6-unit electrolytic copper process is used for surface roughness treatment; the surface roughness of the material required by the product is Ra2 .38 ⁇ 3.49 ⁇ m; the total surface roughness of the manufactured metal of the six pulse reverse power sources 310 to 360 is set to 18 equal parts, and the surface roughness of each equal part is 0.132 ⁇ 0.193 ⁇ m; for example, the experimental condition No.1
  • the pulse reverse power supply 310 accounts for 11 parts, the surface roughness range that needs to be reached after treatment is Ra 1.454 ⁇ 2.132 ⁇ m, the pulse reverse power supply 320 occupies 3 parts, and the surface roughness range that needs to be achieved after processing Ra 0.396 ⁇ 0.581 ⁇ m, the pulse reverse power supply 4 sets of pulse reverse power supply 300 from 320 to 360 each account for one part. After processing with each pulse reverse power supply 300, the surface roughness of the material must meet Ra 0.132 ⁇ 0.193 ⁇ m.
  • the running speed of the production line for the surface roughness of the lead frame material is preferably 2.0m/min; when the condition No. 9 in Table 2 is used for 6 sets of pulse reverse power supplies 300, the roughness of the 6 times electrolytic copper layer is in the range of 0.396 ⁇ 0.581 ⁇ m , that is, the forward and reverse pulse currents and the forward and reverse pulse time conditions set by the 6 pulse reverse power supplies 300 are the same, and the obtained surface roughness and density from the bottom layer to the surface layer are very small, and the surface characteristics of the lead frame material are very small. uniform.
  • the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current.
  • the obtained electrolytic copper has large roughness and poor density
  • the conditions required for the pulse reverse power supply 320 to be set are the same as those used for the 6 pulse reverse power supply 300 in No. 9, and then the four pulse reverse power supplies 330
  • the setting conditions to 360 are smaller forward pulse current and longer forward pulse time compared with condition No.9, while the setting value of reverse pulse current is slightly larger than that of condition No.9, reverse The pulse time is much shorter than that of No. 9; therefore, the surface roughness of the obtained electrolytic copper meets the requirements of product specifications, and the surface density is better than that of Condition No. 9.
  • the surface roughness of the lead frame material meets the requirements and the density is at No. Between 1 and No.9.
  • the four pulse reverse power supplies 310 to 340 need to set a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse Pulse time; the resulting copper layer has less roughness and better density.
  • the conditions for the pulse reverse power supply 350 to be set are the same as those used for the 6 pulse reverse power supply 300 in No. 9.
  • the setting conditions for the last pulse reverse power supply 360 are a larger forward pulse current and a longer pulse reverse current.
  • the forward pulse time is set, and the reverse pulse current is larger and the reverse pulse time is shorter. Therefore, the obtained surface roughness meets the product specification and the surface density is lower than that of Condition No. 9. .
  • the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 9 and No. 17.
  • the chip lead frame has a width of 105mm and a thickness of 0.20mm, and the metal raw material is C14410.
  • the roughness Ra is 0.15-0.23 ⁇ m, and the average value Ra of multiple sets of data is 0.19 ⁇ m.
  • the surface roughness requirements of the lead frame are in the range of Ra of 3.5 to 4.9 ⁇ m.
  • the lead frame material is led out from the discharge 10 through the discharge guide wheel 11, then enters the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enters the acid activation tank to clean and remove the rust and stains on the surface of the metal material. oxides, etc., to obtain clean metal materials.
  • an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 .
  • the connection manner of the second electrolytic copper region to the sixth electrolytic copper region is the same as that of the first electrolytic copper region, as shown in FIG. 3 and FIG. 8 .
  • the chip lead frame has a width of 105mm, and its surface area is less than one-third of that of Example 1. It is preferable to use a 5-unit electrolytic copper process for surface roughness treatment; the surface roughness of the material required by the product is Ra3 .35 ⁇ 4.67 ⁇ m; the total surface roughness of the metal produced by the five pulse reverse power sources 310 to 350 is set to 20 equal parts, and the surface roughness of each equal part is 0.167 ⁇ 0.233 ⁇ m; for example, the experimental condition No.1
  • the pulse reverse power supply 310 accounts for 15 parts, the surface roughness range to be achieved after treatment is Ra 2.512 ⁇ 3.503 ⁇ m, the pulse reverse power supply 320 occupies 2 parts, the surface roughness range to be achieved after treatment is Ra 0.335 ⁇ 0.467 ⁇ m, the pulse reverse power supply 3 sets of pulse reverse power supply 300 from 320 to 350 each account for 1 part. After processing with each pulse reverse power supply 300, the surface roughness of the material must meet Ra 0.167 ⁇ 0.233 ⁇ m.
  • the running speed of the production line for the surface roughness of the chip lead frame material is preferably 1.5m/min; when the five pulse reverse power supplies 300 use the condition No. 9 in Table 3, the roughness of the five electrolytic copper layers is in the range of 0.670 ⁇ 0.934 ⁇ m, that is, the forward and reverse pulse current and the forward and reverse pulse time conditions set by the 6 sets of pulse reverse power supply 300 are the same, and the obtained surface roughness and density from the bottom layer to the surface layer are very small, and the lead frame material The surface properties are uniform.
  • the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current. Short; the obtained electrolytic copper has large roughness and poor density; the conditions required for the pulse reverse power supply 320 to be set are different from those used by the five pulse reverse power supplies 300 of No.
  • the surface roughness of the lead frame material meets the requirements and the density is at No. Between 1 and No.9.
  • the three pulse reverse power supplies 310 to 330 need to be set with a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse current. Pulse time; the resulting copper coating
  • the roughness is less and the density is better.
  • the conditions required for the pulse reverse power supply 340 to be set are different from the conditions used by the 5 pulse reverse power supply 300 in No. 9. It adopts a smaller forward pulse current and a longer forward pulse time, while the reverse pulse
  • the setting value of current is slightly larger than that of condition No.9, and the reverse pulse time is much shorter than that of No.9; the setting conditions of the last pulse reverse power supply 350 are larger forward pulse current and longer pulse duration.
  • the forward pulse time is longer, and a larger reverse pulse current and a shorter reverse pulse time are set. Therefore, the obtained surface roughness meets the product specification and the surface density is worse than that of Condition No. 9. .
  • the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 9 and No. 17.
  • Table 1, Table 2, and Table 3 are respectively the allocation quota of lead frame surface roughness corresponding to 7 sets of pulse reverse power supply 300, the allocation quota of lead frame surface roughness corresponding to 6 sets of pulse reverse power supply 300, and the allocation quota of lead frame surface roughness corresponding to 5 sets of pulse reverse power supply 300, respectively.
  • the assigned amount of the corresponding lead frame surface roughness It includes the assigned number of each pulse reverse power supply 300 and the specific surface roughness range.
  • Table 1 Allocation quota of lead frame surface roughness corresponding to 7 sets of pulse reverse power supply unit: ⁇ m
  • Table 2 Allocation quota of lead frame surface roughness corresponding to 6 pulse reverse power supplies Unit: ⁇ m
  • the output current of the optional pulse reverse power supply 300 of each unit of adjustment and control is different, and at the same time, the output pulse time of the optional pulse reverse power supply 300 of each unit of adjustment and control is also different.
  • the electrolytic copper process for adjusting and controlling the surface roughness of the lead frame material can be selected in the range of 3 units to 12 units, preferably in the range of 4 units to 11 units, and more preferably in the range of 5 units to 10 units.
  • the lead frame material can be electrolytically processed into the surface roughness required for the product.
  • the continuous lead frame materials 200, 500 and 700 are surface treated by pulsed reverse electrolysis techniques and preferably electrolytic copper potions.
  • the production and processing conditions of the surface roughness of the lead frame material can be determined by designing a test plan for the required range of surface roughness, and optimizing the experimental results to optimize the manufacturing method of the best material surface roughness, which has continuous production and processing efficiency. High, increase the bonding strength between the surface of the lead frame material and the photosensitive dry film and the bonding strength with the packaging material, and improve the quality of the lead frame product.
  • the lead frame material of the present invention can be a metal material, and the metal material can be any single element selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc, or copper, nickel, cobalt, phosphorus, tungsten, arsenic, Alloys composed of any two or more selected from molybdenum, chromium and zinc; it can also be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips or continuous leads frame material.
  • any material with metal foil attached to the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness. For example, materials with metal films attached to one or both sides of various plastic films can produce the required surface roughness materials.
  • the thickness of the lead frame material can be selected in the range of 0.03mm to 0.80mm, preferably in the range of 0.05mm to 0.55mm, and more preferably in the range of 0.07mm to 0.35mm; the width of the metal material can be selected in the range of 50mm to 1000mm, preferably in the range of 80mm to 700mm , the more preferred range is 100mm to 500mm.
  • the surface of the photosensitive dry film and the surface of the lead frame material should be subjected to hot pressing treatment to obtain a film lead frame material with strong bonding and uniform surface thickness.
  • the thickness of the photosensitive dry film raw material can be selected in the range of 20-100 ⁇ m, preferably in the range of 20-80 ⁇ m, and more preferably in the range of 20-80 ⁇ m.
  • the surface roughness of the photosensitive dry film raw material can be selected in the range of 0.65-2.17 ⁇ m, preferably in the range of 0.55-2.07 ⁇ m, and more preferably in the range of 0.50-1.97 ⁇ m.
  • the optional range of one side roughness of the photosensitive dry film after the photosensitive dry film and the lead frame material are thermocompressed is 1.05-2.65 ⁇ m, preferably 0.95-2.50 ⁇ m, and more preferably 0.85-2.30 ⁇ m.
  • the pulse reverse electrolysis technology is composed of the forward pulse waveform and reverse pulse waveform outputted by the pulse reverse power supply 300, which are transmitted to the surface of the lead frame material through the anode plate and the electrolytic copper solution, and the forward pulse time and the reverse pulse time.
  • the double-pulse forward current output by the pulse reverse power supply 300 can be selected in the range of 5A-500A, preferably in the range of 10A-450A, and more preferably in the range of 20A-430A;
  • the reverse current output by the double-pulse rectifier can be selected in the range of 20A-1000A, preferably The range is 30A ⁇ 900A, and the more preferred range is 50A ⁇ 850A;
  • the double-pulse forward pulse time output by the pulse reverse power supply 300 can be selected in the range of 5ms ⁇ 100ms, preferably in the range of 7ms ⁇ 70ms, more preferably in the range of 10ms ⁇ 50ms;
  • the reverse pulse time can be selected in the range of 1ms-30ms, preferably in the range of 3ms-20ms, and more preferably in the range of 5ms-10ms.
  • the forward current density of the electrolytic copper potion can be selected in the range of 2A/dm 2 -70A/dm 2 , preferably in the range of 5A/dm 2 -60A/dm 2 , and more preferably in the range of 10A/dm 2 -50A/dm 2 ;
  • the reverse current density of the liquid medicine can be selected in the range of 5A/dm 2 -170A/dm 2 , preferably in the range of 10A/dm 2 -160A/dm 2 , and more preferably in the range of 20A/dm 2 -150A/dm 2 .
  • the ratio of the surface area of the anode plate to the surface area of the lead frame material immersed in each electrolytic copper bath can be selected as 5:1, preferably 3:1, more preferably 2:1; and the anode plate can be made of soluble metal and insoluble metals, the method of electrolyzing precious metals on the surface of insoluble anode plates can also be used; the shape of the anode can be sheet-shaped, mesh-shaped, or special-shaped, for example, the flat plate is bent into an arc shape, or the mesh is bent into an arc Another example is various combinations of different sizes and distributions of holes on the flat plate according to different positions. A combination of more than one species.
  • the optional range of the arithmetic mean value of the surface roughness of the lead frame is 0.05 ⁇ m to 5.0 ⁇ m, preferably 0.07 ⁇ m to 4.5 ⁇ m, and more preferably 0.09 ⁇ m to 3.9 ⁇ m.

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Abstract

Disclosed are manufacturing equipment and a manufacturing method for lead frame surface roughness. The manufacturing equipment for lead frame surface roughness comprises: a material dispensing apparatus, a cleaning apparatus, a copper electrolysis apparatus, and a material retrieving apparatus. The copper electrolysis apparatus is capable of regulating the surface roughness of a lead frame material by means of a pulse-reverse electrolysis technique. The copper electrolysis apparatus comprises: a pulse-reverse power supply, the pulse-reverse power supply being capable of outputting forward and reverse pulse currents and forward and reverse pulse times; copper electrolysis process tanks, the number of the copper electrolysis tanks being a plurality, the lead frame material being allowed to run through the multiple copper electrolysis tanks, and the lead frame material continuously moving forward to form a path of movement; and a copper electrolysis solution, the lead frame material being submerged in the copper electrolysis solution. The equipment increases the uniformity of the thickness of an electrolytic copper film of the lead frame material produced, enhances the strength of bonding between the surface of the lead frame material and a photosensitive dry film, and has the advantages of high production efficiency and high product quality.

Description

引线框架表面粗糙度的制造设备及制造方法Manufacturing equipment and manufacturing method for surface roughness of lead frame 技术领域technical field
本发明属于连续引线框架表面处理制造技术领域，具体涉及一种引线框架表面粗糙度的制造设备及制造方法。The invention belongs to the technical field of continuous lead frame surface treatment and manufacture, and in particular relates to a manufacturing equipment and a manufacturing method for the surface roughness of a lead frame.
背景技术Background technique
由高精密芯片和引线框架封装而成的精密集成电路是现代电子信息产业的重要核心电子产品。其中，引线框架的重要作用是支撑芯片、保护内部元件、连接外部电路，是集成电路中的关键材料。随着电子信息高新技术的迅速发展，产品向微型化、多功能和智能化发展。因此，促使引线框架材料向着引线节距微细化、高密度的方向发展。这不仅对引线框架材料的强度和导电性提出了更高的要求，而且对材料的加工性能也提出了更高的要求。例如，引线框架材料不允许出现擦伤、脱皮、氧化、水迹和外观颜色不均匀等缺陷。Precision integrated circuits encapsulated by high-precision chips and lead frames are important core electronic products in the modern electronic information industry. Among them, the important role of the lead frame is to support the chip, protect the internal components, and connect the external circuit, which is the key material in the integrated circuit. With the rapid development of high-tech electronic information, products are developing towards miniaturization, multi-function and intelligence. Therefore, lead frame materials are being developed in the direction of miniaturization and high density of lead pitches. This not only puts forward higher requirements on the strength and conductivity of the lead frame material, but also puts forward higher requirements on the processing performance of the material. For example, lead frame materials should not allow defects such as scratches, peeling, oxidation, water marks and uneven color appearance.
半导体集成电路的引线框架材料制造方法以引线框架材料表面采用感光干膜热压工艺已经成为主流。近年来，随着半导体的高集成化，由于半导体封装基板和印刷布线基板电路的微细化发展，对引线框架材料表面质量的要求越来越高。也就是说，引线框架材料表面粗糙度是影响干膜热压工艺的重要因素，也是封装过程能否与封装材料紧密结合的关键要素。因此，研究开发引线框架材料表面的清洗生产设备成为十分重要的课题，特别是研究开发引线框架材料表面粗糙度的制造方法以及制造设备成为亟待解决的课题。The lead frame material manufacturing method for semiconductor integrated circuits has become the mainstream by using the photosensitive dry film hot pressing process on the surface of the lead frame material. In recent years, with the high integration of semiconductors, due to the development of miniaturization of semiconductor packaging substrates and printed wiring substrate circuits, the requirements for the surface quality of lead frame materials have become higher and higher. That is to say, the surface roughness of the lead frame material is an important factor affecting the dry film hot pressing process, and it is also a key factor for the packaging process to be closely combined with the packaging material. Therefore, research and development of cleaning and production equipment for the surface of lead frame materials has become a very important issue, and in particular, research and development of manufacturing methods and manufacturing equipment for the surface roughness of lead frame materials has become an urgent issue to be solved.
专利文献1(CN 101864586 B)：记载了将金属材料通过脱脂和酸洗进行前处理并烘干后，在金属材料的上下两面用感光膜通过热压处理后，用紫外光穿过特制的引线框架图案的模具对贴有感光膜引线框架进行曝光，并用显影溶液处理后进行蚀刻和电镀处理制备引线框架材料的方法。然而，该方法存在着感光膜与金属材料表面有结合不牢固的缺陷，导致电镀溶液浸入感光膜与金属之间的间隙而被电镀并导致蚀刻区域的微小部分没有被蚀刻或完全没被蚀刻去除的问题。Patent Document 1 (CN 101864586 B): It is described that after the metal material is pre-treated by degreasing and pickling and dried, the upper and lower sides of the metal material are subjected to hot pressing with photosensitive films, and ultraviolet light is used to pass through a special lead wire. The frame pattern mold exposes the lead frame attached with the photosensitive film, and then treats it with a developing solution, and then performs etching and electroplating treatment to prepare the lead frame material. However, this method has the defect that the photosensitive film and the surface of the metal material are not firmly bonded, so that the electroplating solution is immersed in the gap between the photosensitive film and the metal to be plated and a small part of the etched area is not etched or completely removed by etching. The problem.
专利文献2(JP 6406711 B2)：叙述了片式引线框架的制造方法，第一镀层的步骤包括在金属板的正面和背面的预定位置依次形成Ni镀层，Pd镀层和Au镀层。第二镀层优选为形成Ag镀层的方法。然而，所述制造方法是片式生产工艺，存在生产效率低，产品质量不均匀的缺陷；此外，文中没有记载金属材料的清洗工艺流程。Patent Document 2 (JP 6406711 B2): describes a method for manufacturing a chip lead frame, the first plating step includes forming Ni plating, Pd plating and Au plating in sequence at predetermined positions on the front and back surfaces of the metal plate. The second plating layer is preferably a method of forming an Ag plating layer. However, the manufacturing method is a sheet-type production process, which has the defects of low production efficiency and uneven product quality; in addition, the paper does not describe the cleaning process of the metal material.
专利文献3(JP 4431860 B2)：描述了表面粗化剂过氧化氢与硫酸体系对铜以及铜合金材料表面进行粗化提供引线框架材料的方法。但是，近年来，由于蚀刻图案的微细化，因此对金属材料表面与感光干膜热压结合强度的要求越来越高，表面粗化剂方法所提供的金属表面的结合强度不充分。此外，用该方法粗化后的铜表面具有非常容易氧化的缺陷。Patent Document 3 (JP 4431860 B2): Describes a method for roughening the surface of copper and copper alloy materials to provide lead frame materials by surface roughening agent hydrogen peroxide and sulfuric acid system. However, in recent years, due to the miniaturization of etching patterns, the requirements for the thermal compression bonding strength between the metal material surface and the photosensitive dry film are getting higher and higher, and the bonding strength of the metal surface provided by the surface roughening agent method is insufficient. In addition, the copper surface roughened by this method has defects that are very easy to oxidize.
专利文献4(JP 1997-298265 A)：提出了在引线框架表面形成多层不同密度的镍镀层来提高与封装材料结合强度的技术。采用多层镍镀层的下层由形成平滑且致密的层的镍镀层形成，其上层由使垂直方向的晶体生长优先的脉冲镍镀层形成。但是，在该多镀层技术中，无法得到上部镍镀层的足够的表面粗糙度，致使与封装材料的结合力弱。因此，该技术存在着与封装材料结合强度不足的缺陷。Patent Document 4 (JP 1997-298265 A): A technique is proposed to form multiple layers of nickel plating layers with different densities on the surface of the lead frame to improve the bonding strength with the packaging material. The lower layer using the multi-layer nickel plating layer is formed of a nickel plating layer that forms a smooth and dense layer, and the upper layer is formed of a pulsed nickel plating layer that prioritizes crystal growth in the vertical direction. However, in this multi-plating technique, sufficient surface roughness of the upper nickel plating layer cannot be obtained, so that the bonding force with the packaging material is weak. Therefore, this technology has the disadvantage of insufficient bonding strength with the packaging material.
专利文献5(JP 2004-339584 A)：提供了在引线框架表面形成多种不同金属镀层提高与封装材料结合强度的技术。通过两种不同的镀镍条件先后镀上两种不同厚度的镍镀层并使其总厚度为1.0μm，再在其上进行0.03μm的钯镀层，并且在该钯镀层上进一步进行0.01μm的金镀层；虽然，在第二层镍的形成工艺中采用脉冲逆向电解技术得到适宜表面粗糙度的引线框架，能与封装材料的粘合强度达到各种产品规格要求。但是，表面电解析出的金是化学稳定性极高的贵金属，不会产生氧化使表面粗化，因此会使与封装材料结合性能降低；同时，多种不同金属镀层的引线框架的生产工艺要求高，使用的贵金属价格昂贵产品成本增加，在实际生产中难于实现。Patent Document 5 (JP 2004-339584 A): Provides a technique of forming a variety of different metal plating layers on the surface of the lead frame to improve the bonding strength with the packaging material. Two nickel plating layers with different thicknesses are successively plated through two different nickel plating conditions to make the total thickness of 1.0 μm, and then a 0.03 μm palladium plating layer is performed thereon, and a 0.01 μm gold plating layer is further performed on the palladium plating layer. Although, in the formation process of the second layer of nickel, the pulse reverse electrolysis technology is used to obtain a lead frame with suitable surface roughness, and the bonding strength with the packaging material can meet the requirements of various product specifications. However, the gold electrolytically desorbed from the surface is a precious metal with extremely high chemical stability, which will not cause oxidation to roughen the surface, thus reducing the bonding performance with the packaging material; at the same time, the production process requirements of lead frames with various metal coatings High, the precious metals used are expensive, and the product cost increases, which is difficult to achieve in actual production.
专利文献1～5提供了多种引线框架的生产加工方法，然而文献1存在着感光干膜与引线框架材料表面有结合不牢固的缺陷，导致电镀溶液浸入感光膜与金属之间的间隙而被电镀并导致蚀刻区域的微小部分没有被蚀刻或完全没被蚀刻去除的问题；文献2存在生产效率低，产品质量不均匀的缺陷；此外，文中也没有记载金属材料的清洗工艺流程；文献3用化学药水进行表面粗化方法所提供的金属表面的结合强度不充分，另外，粗化后的引线框架材料表面具有非常容易氧化的缺陷。文献4存在多镀层技术中，无法得到足够的表面粗糙度，致使与封装材料的结合力弱；因此，该技术存在着与封装材料结合强度不足的缺陷。文献5存在多种不同贵金属镀层的引线框架与封装材料结合性能降低并且生产工艺要求高，使用的贵金属价格昂贵产品成本增加，在实际生产制造难于实现。Patent Documents 1 to 5 provide a variety of production and processing methods for lead frames. However, Document 1 has the defect that the photosensitive dry film and the surface of the lead frame material are not firmly bonded, resulting in the plating solution immersed in the gap between the photosensitive film and the metal and is Electroplating and lead to the problem that a small part of the etched area is not etched or not removed at all; Document 2 has the defects of low production efficiency and uneven product quality; in addition, the paper does not describe the cleaning process of metal materials; The bonding strength of the metal surface provided by the surface roughening method with chemical solution is insufficient, and in addition, the roughened surface of the lead frame material has the defect that it is very easy to oxidize. In the multi-plating technology in Document 4, sufficient surface roughness cannot be obtained, resulting in weak bonding force with the packaging material; therefore, this technology has the defect of insufficient bonding strength with the packaging material. In Document 5, there are many kinds of lead frames with different noble metal plating layers and packaging materials have low bonding performance and high production process requirements.
以上所述问题是引线框架表面处理生产线制造行业亟待解决的重大课题。引线框架材料的带宽一般在100mm以上，甚至是带宽在300-400mm，而端子材料的带宽一般在20mm以下，针对宽度较高的引线框架材料进行表面处理要保证膜厚度均匀具有更高的难度。首先，在引线框架材料表面处理生产线的连续生产中要能满足以下要求：1)引线框架材料表面与感光干膜的结合要牢固；2)引线框架材料表面粗糙度要满足与封装材料的热压结合牢固，保证集成电路产品质量和生产效率；3)要解决引线框架产品质量不均匀的缺陷；4)引线框架材料表面粗糙度要满足与封装材料的热压结合牢固的同时，引线框架材料表面的电解铜膜厚也需要达到均匀化；5)需要解决化学药水粗化工艺的引线框架表面与感光干膜热压结合强度不足及材料表面有非常容易氧化的缺陷。6)要提供具有优异耐腐蚀性能的引线框架产品。The above-mentioned problems are major issues to be solved urgently in the lead frame surface treatment production line manufacturing industry. The bandwidth of lead frame materials is generally more than 100mm, or even 300-400mm, while the bandwidth of terminal materials is generally less than 20mm. It is more difficult to ensure uniform film thickness for surface treatment of lead frame materials with higher widths. First of all, in the continuous production of the lead frame material surface treatment production line, the following requirements must be met: 1) The surface of the lead frame material and the photosensitive dry film must be firmly bonded; 2) The surface roughness of the lead frame material must meet the hot pressing with the packaging material. The combination is firm to ensure the quality and production efficiency of integrated circuit products; 3) To solve the defect of uneven quality of lead frame products; 4) The surface roughness of the lead frame material should meet the hot-pressing combination with the packaging material. At the same time, the surface of the lead frame material should be The thickness of the electrolytic copper film also needs to be homogenized; 5) It is necessary to solve the defects that the surface of the lead frame and the photosensitive dry film of the chemical solution roughening process are insufficient in hot-pressing bonding strength and the surface of the material is very easy to oxidize. 6) To provide lead frame products with excellent corrosion resistance.
发明内容SUMMARY OF THE INVENTION
本发明旨在至少解决现有技术中存在的技术问题之一。The present invention aims to solve at least one of the technical problems existing in the prior art.
为此，本发明提出一种线框架表面粗糙度的制造设备，该线框架表面粗糙度的制造设备生产的引线框架材料的电解铜膜厚均匀性得到提高，增强了引线框架材料表面与感光干膜的结合强度，不仅具有优异的耐腐蚀性，与封装材料的优异粘合力，而且产品质量得到保障。该引线框架表面粗糙度的制造设备具有生产效率高、产品质量高、成品率高等优点。To this end, the present invention proposes a manufacturing equipment for the surface roughness of a wire frame, which improves the uniformity of the electrolytic copper film thickness of the lead frame material produced by the manufacturing equipment for the surface roughness of the wire frame, and enhances the surface of the lead frame material and the photosensitive dryness. The bonding strength of the film not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also guarantees product quality. The manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
为此，本发明还提出一种线框架表面粗糙度的制造方法，该方法具有产品质量高、生产效率高等优点。Therefore, the present invention also proposes a method for manufacturing the surface roughness of the wire frame, which has the advantages of high product quality and high production efficiency.
根据本发明第一方面实施例的引线框架表面粗糙度的制造设备，按生产工艺顺序从前至后依次设置有：放料装置、清洗装置、电解铜装置和收料装置，所述放料装置能够对 料盘上的引线框架材料进行放料；所述清洗装置能够对引线框架材料进行清洗，去除表面杂质；所述收料装置能够将处理好的引线框架材料进行收卷；所述电解铜装置能够通过脉冲逆向电解技术对引线框架材料的表面粗糙度进行调控，所述电解铜装置包括：脉冲逆向电源，所述脉冲逆向电源能够输出脉冲正、反向电流和正、反向脉冲时间；电解铜工艺槽，所述电解铜工艺槽的数量为多个，所述引线框架材料可以从多个所述电解铜工艺槽穿过，所述引线框架材料不断向前移动形成移动路径；电解铜药水，所述电解铜药水设在所述电解铜工艺槽内，所述引线框架材料能够浸在所述电解铜药水中。According to the manufacturing equipment for the surface roughness of the lead frame according to the embodiment of the first aspect of the present invention, from front to back in the production process sequence, there are: a discharging device, a cleaning device, an electrolytic copper device and a receiving device, and the discharging device can The lead frame material on the tray is discharged; the cleaning device can clean the lead frame material to remove surface impurities; the receiving device can rewind the processed lead frame material; the electrolytic copper device The surface roughness of the lead frame material can be regulated by the pulse reverse electrolysis technology. The electrolytic copper device includes: a pulse reverse power supply, which can output pulse forward and reverse current and forward and reverse pulse time; electrolytic copper Process tank, the number of the electrolytic copper process tanks is multiple, the lead frame material can pass through the multiple electrolytic copper process tanks, and the lead frame material continuously moves forward to form a moving path; the electrolytic copper potion, The electrolytic copper potion is arranged in the electrolytic copper process tank, and the lead frame material can be immersed in the electrolytic copper potion.
根据本发明实施例的引线框架表面粗糙度的制造设备，主要由放料装置、清洗装置、电解铜装置和收料装置组成，通过清洗装置能够得到清洁的引线框架材料，在电解铜装置中采用脉冲逆向电解技术来调节控制引线框架材料表面的粗糙度，不仅能够增加Cu镀层的晶粒尺寸和表面粗糙度，使在引线框架材料和封装材料之间产生了很强的粘合效应，而且电解析出层中的诸如针孔之类的缺陷很少，具有良好的耐腐蚀性能。该设备生产的引线框架材料的电解铜膜厚均匀性得到提高，增强了引线框架材料表面与感光干膜的结合强度，不仅具有优异的耐腐蚀性，与封装材料的优异粘合力，而且产品质量得到保障。该引线框架表面粗糙度的制造设备具有生产效率高、产品质量高、成品率高等优点。The manufacturing equipment for the surface roughness of the lead frame according to the embodiment of the present invention is mainly composed of a discharging device, a cleaning device, an electrolytic copper device and a receiving device, and a clean lead frame material can be obtained through the cleaning device. The pulse reverse electrolysis technology to adjust and control the surface roughness of the lead frame material can not only increase the grain size and surface roughness of the Cu plating layer, but also produce a strong bonding effect between the lead frame material and the packaging material. There are few defects such as pinholes in the desorption layer, and it has good corrosion resistance. The uniformity of the electrolytic copper film thickness of the lead frame material produced by this equipment is improved, and the bonding strength between the surface of the lead frame material and the photosensitive dry film is enhanced. It not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also products Quality is guaranteed. The manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
根据本发明一个实施例，每个所述电解铜工艺槽内均设有两个电极板，两个所述电极板相对设置在所述引线框架材料的两侧，所述移动路径位于两个所述电极板之间。According to an embodiment of the present invention, each of the electrolytic copper process tanks is provided with two electrode plates, the two electrode plates are oppositely arranged on both sides of the lead frame material, and the moving path is located in the two electrode plates. between the electrode plates.
根据本发明一个实施例，电极板的表面积与浸在每个电解铜工艺槽中的所述引线框架材料的表面积比为5：1。According to one embodiment of the present invention, the ratio of the surface area of the electrode plate to the surface area of the lead frame material immersed in each electrolytic copper process tank is 5:1.
根据本发明一个实施例，所述电极板的形状形成为片面、网状或者异形状，每个所述电解铜工艺槽内的两个电极板为相同形状或者不同形状的组合。According to an embodiment of the present invention, the shape of the electrode plate is formed as one-sided, mesh or special shape, and the two electrode plates in each of the electrolytic copper process tanks are of the same shape or a combination of different shapes.
根据本发明第二方面实施例的引线框架表面粗糙度的制造设备，通过脉冲逆向电解技术对引线框架表面粗糙度进行调控，其特征在于，包括以下步骤：According to the manufacturing equipment for the surface roughness of the lead frame according to the embodiment of the second aspect of the present invention, the surface roughness of the lead frame is regulated by the pulse reverse electrolysis technology, and it is characterized in that, it includes the following steps:
S1、分析测试引线框架表面粗糙度，计算得出引线框架表面粗糙度算数平均值；S1. Analyze and test the surface roughness of the lead frame, and calculate the arithmetic mean value of the surface roughness of the lead frame;
S2、将引线框架材料从放料机导出，进入电解脱脂槽清洗，然后再进入酸活化槽清洗，得到清洁的引线框架材料；S2, export the lead frame material from the unwinder, enter the electrolytic degreasing tank for cleaning, and then enter the acid activation tank for cleaning to obtain clean lead frame material;
S3、电解镀铜工段：根据电解铜表面粗糙度，确定脉冲逆向电源输出的脉冲正、反向电流和正、反向脉冲时间；S3. Electrolytic copper plating section: According to the surface roughness of electrolytic copper, determine the pulse forward and reverse current and forward and reverse pulse time output by the pulse reverse power supply;
S4、将所述脉冲正、反向电流通过电极板施加在所述引线框架材料表面，并使施加在所述引线框架材料上的电流方向朝向电极板面；S4, applying the pulsed forward and reverse currents on the surface of the lead frame material through the electrode plate, and making the direction of the current applied on the lead frame material toward the electrode plate surface;
S5、开启脉冲逆向电源，预热后，控制施加正反向脉冲电流和所述正、反向脉冲时间按引线框架材料的移动路径依次经过多个电解铜工艺槽的处理后得到产品所需引线框架表面粗糙度。S5. Turn on the pulse reverse power supply, and after preheating, control the application of forward and reverse pulse currents and the forward and reverse pulse times according to the movement path of the lead frame material, and then obtain the lead wires required for the product after being processed by a plurality of electrolytic copper process tanks in turn. Frame surface roughness.
根据本发明一个实施例，电解铜表面粗糙度＝产品所需引线框架材料表面粗糙度-引线框架材料表面粗糙度。According to an embodiment of the present invention, the surface roughness of the electrolytic copper=the surface roughness of the lead frame material required for the product−the surface roughness of the lead frame material.
根据本发明一个实施例，所述电解铜表面粗糙度的算数平均值范围均为0.05μm～5.0μm。According to an embodiment of the present invention, the arithmetic mean of the surface roughness of the electrolytic copper ranges from 0.05 μm to 5.0 μm.
根据本发明一个实施例，所述脉冲逆向电源输出的脉冲正向电流范围为5A～500A，所述脉冲逆向电源输出的反向电流范围为20A～1000A。According to an embodiment of the present invention, the pulse forward current range output by the pulse reverse power supply is 5A˜500A, and the reverse current range output by the pulse reverse power supply is 20A˜1000A.
根据本发明一个实施例，所述脉冲逆向电源输出的脉冲正向脉冲时间可选范围为5ms～100ms；所述脉冲逆向电源输出的脉冲反向脉冲时间范围为1ms～30ms。According to an embodiment of the present invention, the time range of the pulse forward pulse output by the pulse reverse power supply is 5ms-100ms; the pulse reverse pulse time range of the pulse reverse power supply is 1ms-30ms.
根据本发明一个实施例，所述电解铜工艺槽内设有电解铜药水，所述电解铜药水需要满足所述脉冲逆向电源输出的脉冲正、反向电流密度使用范围。According to an embodiment of the present invention, the electrolytic copper process tank is provided with an electrolytic copper potion, and the electrolytic copper potion needs to meet the usage range of the pulse forward and reverse current density output by the pulse reverse power supply.
根据本发明一个实施例，脉冲正向电流密度范围为2A/dm 2～70A/dm 2，脉冲反向电流密度范围为5A/dm 2～170A/dm 2。 According to an embodiment of the present invention, the pulse forward current density ranges from 2A/dm 2 to 70A/dm 2 , and the pulse reverse current density ranges from 5A/dm 2 to 170A/dm 2 .
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。Additional aspects and advantages of the present invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or may be learned by practice of the invention.
附图说明Description of drawings
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:
图1是根据本发明实施例的引线框架表面粗糙度的制造方法的步骤流程图。FIG. 1 is a flow chart of steps of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
图2是引线框架表面处理的整体工艺流程图；Fig. 2 is the overall process flow chart of lead frame surface treatment;
图3是根据本发明实施例的引线框架表面粗糙度的制造方法的脉冲逆向电源输出波形图。3 is an output waveform diagram of a pulse reverse power supply of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
图4是根据本发明实施例的引线框架表面粗糙度的制造方法的引线框架材料表面粗糙度制造设备。4 is an apparatus for manufacturing the surface roughness of a lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
图5是根据本发明实施例的引线框架表面粗糙度的制造方法的实施1连续引线框架材料。FIG. 5 is an implementation 1 continuous lead frame material of a method of manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
图6是根据本发明实施例的引线框架表面粗糙度的制造方法的引线框架材料表面粗糙度制造设备图。FIG. 6 is a diagram of an apparatus for manufacturing the surface roughness of a lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
图7是根据本发明实施例的引线框架表面粗糙度的制造方法的实施2连续引线框架材料附图。FIG. 7 is a drawing of the implementation 2 continuous lead frame material of the method for manufacturing the surface roughness of the lead frame according to the embodiment of the present invention.
图8是根据本发明实施例的引线框架表面粗糙度的制造方法的片式引线框架材料表面粗糙度的制造设备结构图。8 is a structural diagram of a manufacturing equipment for the surface roughness of a chip lead frame material according to a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
图9是根据本发明实施例的引线框架表面粗糙度的制造方法的实施3的片式引线框架材料结构图。FIG. 9 is a material structure diagram of a chip lead frame in implementation 3 of a method for manufacturing the surface roughness of a lead frame according to an embodiment of the present invention.
附图标记：Reference number:
脉冲逆向电源300；脉冲逆向电源310-370；Pulse reverse power supply 300; Pulse reverse power supply 310-370;
连续引线框架材料200；Continuous lead frame material 200;
连续引线框架材料500；Continuous lead frame material 500;
连续引线框架材料700；Continuous lead frame material 700;
放料装置10；放料导轮11；进口处阴极导电13a；出口处阴极导电13b；The discharging device 10; the discharging guide wheel 11; the cathode conduction 13a at the inlet; the cathode conduction 13b at the outlet;
电解铜工艺槽30；电解铜工艺槽30a-30g；Electrolytic copper process tank 30; electrolytic copper process tank 30a-30g;
电极板40；上阳极板40a；下阳极板40b； electrode plate 40; upper anode plate 40a; lower anode plate 40b;
收料导轮50；收料装置51。Receiving guide wheel 50; Receiving device 51.
具体实施方式Detailed ways
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention.
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Clockwise, Counterclockwise, Axial, The orientations or positional relationships indicated by "radial direction", "circumferential direction", etc. are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the indicated devices or elements. It must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, features delimited with "first", "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "plurality" means two or more.
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.
下面参考附图具体描述根据本发明实施例的引线框架表面粗糙度的制造设备。Hereinafter, a manufacturing apparatus for the surface roughness of a lead frame according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.
如图4所示，根据本发明实施例的引线框架表面粗糙度的制造设备，包括：放料装置10、清洗装置、电解铜装置和收料装置51。As shown in FIG. 4 , the manufacturing equipment for the surface roughness of the lead frame according to the embodiment of the present invention includes: a discharging device 10 , a cleaning device, an electrolytic copper device and a receiving device 51 .
具体地，根据本发明实施例的引线框架表面粗糙度的制造设备，放料装置10能够对料盘上的引线框架材料进行放料；清洗装置能够对引线框架材料进行清洗，去除表面杂质；电解铜装置能够通过脉冲逆向电解技术对引线框架材料的表面粗糙度进行调控，包括：脉冲逆向电源300，脉冲逆向电源300能够输出脉冲正、反向电流和正、反向脉冲时间；电解铜工艺槽30，电解铜工艺槽30的数量为多个，引线框架材料可以从多个电解铜工艺槽30穿过，引线框架材料不断向前移动形成移动路径；电解铜药水，电解铜药水设在电解铜工艺槽30内，引线框架材料能够浸在电解铜药水中。收料装置51能够将处理好的引线框架材料进行收卷。Specifically, according to the manufacturing equipment for the surface roughness of the lead frame according to the embodiment of the present invention, the discharging device 10 can discharge the lead frame material on the tray; the cleaning device can clean the lead frame material to remove surface impurities; The copper device can control the surface roughness of the lead frame material through the pulse reverse electrolysis technology, including: the pulse reverse power supply 300, the pulse reverse power supply 300 can output pulse forward and reverse current and forward and reverse pulse time; electrolytic copper process tank 30 , the number of electrolytic copper process tanks 30 is multiple, the lead frame material can pass through multiple electrolytic copper process tanks 30, and the lead frame material moves forward continuously to form a moving path; electrolytic copper syrup, electrolytic copper syrup is set in the electrolytic copper process Inside the tank 30, the lead frame material can be immersed in the electrolytic copper potion. The rewinding device 51 can rewind the processed lead frame material.
根据本发明的一个实施例，每个电解铜工艺槽30内均设有两个电极板40，两个电极板40相对设置在引线框架材料的两侧，移动路径位于两个电极板40之间。该电极板40即为阳极板，电解铜工艺槽30的数量可以为多个，电解铜工艺槽30上设有延引线框架材料运行方向贯通的通道，引线框架材料可以从电解铜工艺槽30穿出。在脉冲逆向电源300的作用下，电解铜工艺槽30内发生电解作用，引线框架材料为阴极，两个电极板40相对设置在引线框架材料的两侧，可使引线框架材料两面都发生电解作用，根据电流方向的不同，引线框架材料表面能够析出铜或者剥离铜。According to an embodiment of the present invention, each electrolytic copper process tank 30 is provided with two electrode plates 40 , the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, and the moving path is located between the two electrode plates 40 . The electrode plate 40 is the anode plate, and the number of electrolytic copper process tanks 30 can be multiple. The electrolytic copper process tank 30 is provided with a channel extending through the running direction of the lead frame material, and the lead frame material can pass through the electrolytic copper process tank 30. out. Under the action of the pulse reverse power supply 300, electrolysis occurs in the electrolytic copper process tank 30, the lead frame material is the cathode, and the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, so that electrolysis can occur on both sides of the lead frame material. , depending on the direction of the current, the surface of the lead frame material can precipitate copper or strip copper.
进一步地，电极板40的表面积与浸在每个电解铜工艺槽30中的引线框架材料的表面积比为5：1，优选为3：1，更优选为2：1。在电解铜工艺槽30中，该电极板40即为阳极板，引线框架材料为阴极，也就是说要满足阳极材料面积与阴极材料面积比5：1的要求。Further, the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1, preferably 3:1, more preferably 2:1. In the electrolytic copper process tank 30, the electrode plate 40 is the anode plate, and the lead frame material is the cathode, that is to say, the requirement of the ratio of the area of the anode material to the area of the cathode material is 5:1.
优选地，电极板40的形状形成为片面、网状或者异形状，每个电解铜工艺槽30内的两个电极板40为相同形状或者不同形状的组合。电极板40可采用可溶性金属和非可溶性金 属的组合，也可采用在非可溶性电极板40，在电极板40表面电解贵金属。电极板40可以是平板弯曲成圆弧形、网状弯曲成圆弧形，只要可以满足电极板40的表面积与浸在每个电解铜工艺槽30中的引线框架材料的表面积比为5：1的要求即可。也就是说，两个电极板40的形状可以是不同形状的组合，可以一个是片状，另一个是异形状，也可以是一个为网状，另一个为片状，可以根据实际需求来设定其大小、形状及组合，具有很高的适用性。通过阳极大小和形状的调节，可以满足阳极材料面积与阴极材料面积比5：1的要求，使引线框架材料表面电解铜膜厚均匀性得到提高，产品质量得到保障，提高了引线框架表面处理生产线的生产效率。Preferably, the shape of the electrode plates 40 is formed in one-sided, mesh or different shapes, and the two electrode plates 40 in each electrolytic copper process tank 30 are of the same shape or a combination of different shapes. The electrode plate 40 can be a combination of soluble metal and insoluble metal, or the insoluble electrode plate 40 can be used to electrolyze the precious metal on the surface of the electrode plate 40. The electrode plate 40 can be a flat plate bent into an arc shape, and a mesh bent into an arc shape, as long as the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1 requirements. That is to say, the shapes of the two electrode plates 40 can be a combination of different shapes, one can be a sheet, the other is a special shape, or one is a mesh and the other is a sheet, which can be set according to actual needs. It has high applicability to determine its size, shape and combination. Through the adjustment of the size and shape of the anode, the requirement of the ratio of the area of the anode material to the area of the cathode material of 5:1 can be met, the uniformity of the electrolytic copper film thickness on the surface of the lead frame material is improved, the product quality is guaranteed, and the lead frame surface treatment production line is improved. production efficiency.
其中需要说明的是，引线框架材料采用水平输送的方式通过电解铜工艺槽，因为引线框架材料的带宽相对于端子材料的带宽要大的多，竖直输送无法保证引线框架材料运行过程中的平稳性，进而影响表面粗糙度的处理。水平输送的方式更加的稳定，便于进行表面粗糙度的处理。It should be noted that the lead frame material is transported horizontally through the electrolytic copper process tank, because the bandwidth of the lead frame material is much larger than that of the terminal material, and vertical transport cannot ensure the smoothness of the lead frame material during operation. properties, which in turn affects the treatment of surface roughness. The horizontal conveying method is more stable, which is convenient for surface roughness treatment.
由此，根据本发明实施例的引线框架表面粗糙度的制造设备，主要由放料装置10、清洗装置、电解铜装置和收料装置51组成，通过清洗装置能够得到清洁的引线框架材料，在电解铜装置中采用脉冲逆向电解技术来调节控制引线框架材料表面的粗糙度。该设备生产的引线框架材料的电解铜膜厚均匀性得到提高，增强了引线框架材料表面与感光干膜的结合强度，不仅具有优异的耐腐蚀性，与封装材料的优异粘合力，而且产品质量得到保障。该引线框架表面粗糙度的制造设备具有生产效率高、产品质量高、成品率高等优点。Therefore, the manufacturing equipment for the surface roughness of the lead frame according to the embodiment of the present invention is mainly composed of a discharging device 10, a cleaning device, an electrolytic copper device and a receiving device 51. The cleaning device can obtain clean lead frame material. In the electrolytic copper device, the pulse reverse electrolysis technology is used to adjust and control the roughness of the surface of the lead frame material. The uniformity of the electrolytic copper film thickness of the lead frame material produced by this equipment is improved, and the bonding strength between the surface of the lead frame material and the photosensitive dry film is enhanced. It not only has excellent corrosion resistance, excellent adhesion with packaging materials, but also products Quality is guaranteed. The manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality and high yield.
需要说明的是，电极板40也为阳极板，阳极板包括上阳极板40a和下阳极板40b。It should be noted that the electrode plate 40 is also an anode plate, and the anode plate includes an upper anode plate 40a and a lower anode plate 40b.
下面参考附图具体描述根据本发明实施例的引线框架表面粗糙度的制造方法。The method for manufacturing the surface roughness of the lead frame according to the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
如图1和图2所示，根据本发明实施例的引线框架表面粗糙度的制造方法，通过脉冲逆向电解技术对引线框架表面粗糙度进行调控，包括以下步骤：As shown in FIG. 1 and FIG. 2 , according to the method for manufacturing the surface roughness of the lead frame according to the embodiment of the present invention, the surface roughness of the lead frame is regulated by the pulse reverse electrolysis technique, including the following steps:
S1、分析测试引线框架表面粗糙度，计算得出引线框架表面粗糙度算数平均值；S1. Analyze and test the surface roughness of the lead frame, and calculate the arithmetic mean value of the surface roughness of the lead frame;
S2、将引线框架材料从放料机导出，进入电解脱脂槽清洗，然后再进入酸活化槽清洗，得到清洁的引线框架材料；S2, export the lead frame material from the unwinder, enter the electrolytic degreasing tank for cleaning, and then enter the acid activation tank for cleaning to obtain clean lead frame material;
S3、电解镀铜工段：根据电解铜表面粗糙度，确定脉冲逆向电源300输出的脉冲正、反向电流和正、反向脉冲时间；S3. Electrolytic copper plating section: According to the surface roughness of electrolytic copper, determine the pulse forward and reverse current and the forward and reverse pulse time output by the pulse reverse power supply 300;
S4、将脉冲正、反向电流通过电极板40施加在引线框架材料表面，并使施加在引线框架材料上的电流方向朝向电极板40面；S4, applying the pulsed forward and reverse currents on the surface of the lead frame material through the electrode plate 40, and making the direction of the current applied on the lead frame material toward the surface of the electrode plate 40;
S5、开启脉冲逆向电源300，预热后，控制施加正反向脉冲电流和正、反向脉冲时间按引线框架材料的移动路径依次经过多个电解铜工艺槽30的处理后得到产品所需引线框架表面粗糙度。S5. Turn on the pulse reverse power supply 300, and after preheating, control the application of forward and reverse pulse currents and the forward and reverse pulse times according to the moving path of the lead frame material, and then process a plurality of electrolytic copper process tanks 30 to obtain the lead frame required for the product. Surface roughness.
换言之，根据本发明实施例的引线框架表面粗糙度的制造方法，通过脉冲逆向电解技术对引线框架表面粗糙度进行调控，通过分析测试引线框架表面粗糙度，可以得出电解铜表面粗糙度，即电解铜表面粗糙度Ra1＝产品所需引线框架材料表面粗糙度Ra2-引线框架材料表面粗糙度Ra。根据电解铜表面粗糙度，可确定脉冲逆向电源300输出的脉冲正、反向电流和正、反向脉冲时间的最佳组合。In other words, according to the method for manufacturing the surface roughness of the lead frame according to the embodiment of the present invention, the surface roughness of the lead frame is regulated by the pulse reverse electrolysis technique, and the surface roughness of the electrolytic copper can be obtained by analyzing and testing the surface roughness of the lead frame, that is, Electrolytic copper surface roughness Ra1 = surface roughness Ra2 of lead frame material required for the product - surface roughness Ra of lead frame material. According to the surface roughness of the electrolytic copper, the optimal combination of the pulse forward and reverse currents and the forward and reverse pulse times output by the pulse reverse power supply 300 can be determined.
首先，引线框架材料从放料10导出通过放料导轮11后，进入电解脱脂槽清洗除去金属材料表面的油脂等，然后进入酸活化槽清洗除去金属材料表面的锈斑及氧化物等，得 到清洁的引线框架材料。然后进入电解镀铜工段，在电解铜工艺槽30内，电极板40为阳极，在电解铜药水中的引线框架材料为阴极，脉冲逆向电源300作用下发生电解作用，引线框架材料表面的粗糙度发生改变。具体地，施加的正、反向脉冲电流和正、反向脉冲时间不同，引线框架材料表面发生的电解作用也就不同。First, after the lead frame material is led out from the discharge 10 and passed through the discharge guide wheel 11, it enters the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enters the acid activation tank to clean and remove the rust and oxide on the surface of the metal material. lead frame material. Then enter the electrolytic copper plating section, in the electrolytic copper process tank 30, the electrode plate 40 is the anode, the lead frame material in the electrolytic copper syrup is the cathode, and electrolysis occurs under the action of the pulse reverse power supply 300, and the surface roughness of the lead frame material changes happened. Specifically, the applied forward and reverse pulse currents and the forward and reverse pulse times are different, and the electrolysis on the surface of the lead frame material is also different.
也就是说，在脉冲逆向电解铜工艺中，由脉冲逆向电源300输出的施加在引线框架的电流进行周期性变化。当脉冲逆向电源300施加正向脉冲电流时，在引线框架表面上电解析出铜，呈现脉冲正向波形；当脉冲逆向电源300施加逆向脉冲电流时，引线框架材料表面电解剥离铜，则呈现脉冲逆向波形。当脉冲逆向电源300的反复周期性变化后，引线框架材料表面不断地析出铜和剥离铜，通过设置不同的正、反向脉冲时间，可以控制引线框架材料表面析出铜和剥离铜的多少，从而改变铜膜厚度，具体地，当正向脉冲时间较长时，引线框架材料表面析出铜较多，铜膜厚度相对较厚，当反向脉冲时间较长时，引线框架材料表面剥离铜较多，铜膜厚度将会变薄。不仅可以实现Cu镀层的厚度均匀，也可以根据不同要求来实现引线框架材料表面粗糙度的不同。通过逆向脉冲电流电解剥离铜的同时，可以去除引线框架表面Cu镀层中吸收的氢原子，消除了由于铜层中含有的氢原子所导致的Cu镀层的脆性，并且改善了诸如弯曲的可加工性。That is, in the pulse reverse electrolytic copper process, the current applied to the lead frame output by the pulse reverse power supply 300 changes periodically. When the pulse reverse power supply 300 applies a forward pulse current, copper is electrolytically dissociated on the surface of the lead frame, showing a pulse forward waveform; when the pulse reverse power supply 300 applies a reverse pulse current, the surface of the lead frame material is electrolytically stripped of copper, showing a pulse reverse waveform. After the repeated periodic changes of the pulse reverse power supply 300, copper is continuously precipitated and stripped on the surface of the lead frame material. By setting different forward and reverse pulse times, the amount of copper precipitation and stripped copper on the surface of the lead frame material can be controlled. Change the thickness of the copper film. Specifically, when the forward pulse time is long, more copper is precipitated on the surface of the lead frame material, and the thickness of the copper film is relatively thick. When the reverse pulse time is long, the surface of the lead frame material peels off more copper. , the copper film thickness will be thinner. Not only can the thickness of the Cu plating layer be uniform, but also the surface roughness of the lead frame material can be varied according to different requirements. While the copper is electrolytically stripped by the reverse pulse current, the hydrogen atoms absorbed in the Cu plating layer on the surface of the lead frame can be removed, the brittleness of the Cu plating layer caused by the hydrogen atoms contained in the copper layer is eliminated, and the workability such as bending is improved. .
另外，脉冲逆向电解铜工艺中，容易形成粒径大的Cu结晶粒子。在施加逆向脉冲电流时，晶粒的粒径越小则优先被电解剥离；这是由于，晶粒的粒径越小，则表面自由能越高，越不稳定的缘故。如图3所示，当通过使用这种周期性地逆向极性的电流波形交替且重复地施加正向脉冲电流和逆向脉冲电流时，形成了具有大晶粒的粗铜表面。因此，在引线框架和封装材料之间产生很强的结合效应，因而可以获得很强的封装材料粘合性能。In addition, in the pulse reverse electrolytic copper process, Cu crystal particles with a large particle size are easily formed. When the reverse pulse current is applied, the smaller the grain size of the crystal grains, the preferentially electrolytic exfoliation; this is because the smaller the grain size of the crystal grains, the higher the surface free energy and the more unstable it is. As shown in FIG. 3, when a forward pulse current and a reverse pulse current are alternately and repeatedly applied by using such a current waveform of periodically reversed polarity, a blister copper surface having large crystal grains is formed. Therefore, a strong bonding effect is produced between the lead frame and the encapsulation material, so that a strong adhesion property of the encapsulation material can be obtained.
也就是说，当进行脉冲逆向电源300电解铜工艺时，金属铜在晶体的外延生长中比在晶核的生成中Cu的析出更快，增加了Cu镀层的晶粒尺寸和表面粗糙度。由于这种不规则形状的、粗糙的表面形态，在引线框架材料和封装材料之间产生了很强的粘合效应，因而获得的封装材料具有很强的粘合性能。周期性地逆向极性的电流波形交替且重复地施加正向脉冲电流和逆向脉冲电流时，电解析出铜层中由于氢吸收而引起的应变和杂质的混合比通常的直流电解析出铜中层的应变和杂质的混合较小。因此，电解析出层中的诸如针孔之类的缺陷很少，可以获得优异的耐腐蚀性。通过本发明的引线框架材料表面粗糙度的制造方法及制造设备代替化学药水粗化工艺，能大幅度提高引线框架表面处理的生产效率并且产品质量有极大的提高；通过引线框架材料表面粗糙度的调节及控制，扩大了引线框架在后续实际应用的范围，提高了产品质量合格率。That is to say, when the pulsed reverse power supply 300 electrolytic copper process is performed, the metal copper is precipitated faster in the epitaxial growth of the crystal than in the generation of the crystal nucleus, which increases the grain size and surface roughness of the Cu coating. Due to this irregularly shaped, rough surface morphology, a strong adhesive effect is produced between the lead frame material and the encapsulation material, and the encapsulation material obtained has strong adhesive properties. When the current waveform of the reverse polarity is applied alternately and repeatedly, the strain in the copper layer due to hydrogen absorption and the mixing ratio of impurities are electrolytically desorbed in the copper layer. There is less mixing of strain and impurities. Therefore, defects such as pinholes in the electro-desorption layer are few, and excellent corrosion resistance can be obtained. By replacing the chemical solution roughening process with the method for manufacturing the surface roughness of the lead frame material and the manufacturing equipment of the present invention, the production efficiency of the surface treatment of the lead frame can be greatly improved and the product quality can be greatly improved; The adjustment and control of the lead frame expand the scope of subsequent practical applications of the lead frame and improve the qualified rate of product quality.
由此，根据本发明实施例的引线框架表面粗糙度的制造方法，通过脉冲逆向电解技术实施电解铜工艺，不仅能够增加Cu镀层的晶粒尺寸和表面粗糙度，使在引线框架材料和封装材料之间产生了很强的粘合效应，而且电解析出层中的诸如针孔之类的缺陷很少，具有良好的耐腐蚀性能。该方法能够代替化学药水粗化工艺，能大幅度提高引线框架表面处理的生产效率并且电解铜膜均匀性得到提高，产品质量得到保障。通过对引线框架材料表面粗糙度的调节及控制，扩大了引线框架在后续实际应用的范围，提高了产品质量合格率。Therefore, according to the method for manufacturing the surface roughness of the lead frame according to the embodiment of the present invention, the electrolytic copper process is implemented by the pulse reverse electrolysis technology, which can not only increase the grain size and surface roughness of the Cu plating layer, but also make the lead frame material and packaging material. There is a strong adhesion effect between them, and there are few defects such as pinholes in the electro-desorption layer, which has good corrosion resistance. The method can replace the chemical potion roughening process, can greatly improve the production efficiency of the surface treatment of the lead frame, the uniformity of the electrolytic copper film is improved, and the product quality is guaranteed. By adjusting and controlling the surface roughness of the lead frame material, the scope of subsequent practical application of the lead frame is expanded, and the qualified rate of product quality is improved.
很据本发明的一个实施例，电解铜表面粗糙度Ra1＝产品所需引线框架材料表面粗糙度Ra2-引线框架材料表面粗糙度Ra。脉冲逆向电源300输出的脉冲正、反向电流和正、 反向脉冲时间的设定和调节与电解铜表面粗糙度的分布以及电解铜表面粗糙度的算数平均值息息相关，所以电解铜表面粗糙度的确定对脉冲逆向电解技术对引线框架表面粗糙度进行调控起到很大的作用。According to an embodiment of the present invention, the surface roughness Ra1 of the electrolytic copper = the surface roughness Ra2 of the lead frame material required for the product - the surface roughness Ra of the lead frame material. The setting and adjustment of the pulse forward and reverse current and the forward and reverse pulse time output by the pulse reverse power supply 300 are closely related to the distribution of the surface roughness of the electrolytic copper and the arithmetic mean value of the surface roughness of the electrolytic copper. It is determined that the control of the surface roughness of the lead frame by the pulse reverse electrolysis technology plays a great role.
进一步地，电解铜表面粗糙度、产品所需引线框架材料表面粗糙度、引线框架材料表面粗糙度的算数平均值范围均为0.05μm～5.0μm。Further, the arithmetic mean ranges of the surface roughness of the electrolytic copper, the surface roughness of the lead frame material required for the product, and the surface roughness of the lead frame material are all in the range of 0.05 μm to 5.0 μm.
可选地，脉冲逆向电源300输出的脉冲正向电流范围为5A～500A，脉冲逆向电源300输出的反向电流范围为20A～1000A。Optionally, the pulse forward current output by the pulse reverse power supply 300 ranges from 5A to 500A, and the reverse current output from the pulse reverse power supply 300 ranges from 20A to 1000A.
进一步地，脉冲逆向电源300输出的脉冲正向脉冲时间可选范围为5ms～100ms；脉冲逆向电源300输出的脉冲反向脉冲时间范围为1ms～30ms。Further, the optional range of the pulse forward pulse time output by the pulse reverse power supply 300 is 5ms～100ms; the pulse reverse pulse time range output by the pulse reverse power supply 300 is 1ms～30ms.
在本发明的一些具体实施方式中，电解铜工艺槽30内设有电解铜药水，电解铜药水需要满足脉冲逆向电源300输出的脉冲正、反向电流密度使用范围。In some specific embodiments of the present invention, the electrolytic copper process tank 30 is provided with electrolytic copper syrup, and the electrolytic copper syrup needs to meet the pulse forward and reverse current density usage ranges output by the pulse reverse power supply 300 .
可选地，脉冲正向电流密度范围为2A/dm 2～70A/dm 2，脉冲反向电流密度范围为5A/dm 2～170A/dm 2。脉冲逆向电源300输出电流A＝电解铜药水电流密度A/dm 2×材料表面积dm 2；脉冲正向电流密度优选范围5A/dm 2～60A/dm 2，更优选范围10A/dm 2～50A/dm 2；脉冲反向电流密度优选范围10A/dm 2～160A/dm 2，更优选范围20A/dm 2～150A/dm 2。 Optionally, the pulse forward current density ranges from 2A/dm 2 to 70A/dm 2 , and the pulse reverse current density ranges from 5A/dm 2 to 170A/dm 2 . Pulse reverse power supply 300 output current A = electrolytic copper potion current density A/dm 2 × material surface area dm 2 ; pulse forward current density preferably ranges from 5A/dm 2 to 60A/dm 2 , and more preferably ranges from 10A/dm 2 to 50A/ dm 2 ; the pulse reverse current density preferably ranges from 10A/dm 2 to 160A/dm 2 , and more preferably ranges from 20A/dm 2 to 150A/dm 2 .
根据本发明的一个实施例，每个电解铜工艺槽30内均设有两个电极板40，两个电极板40相对设置在引线框架材料的两侧，移动路径位于两个电极板40之间。该电极板40即为阳极板，电解铜工艺槽30的数量可以为多个，电解铜工艺槽30上设有延引线框架材料运行方向贯通的通道，引线框架材料可以从电解铜工艺槽30穿出。在脉冲逆向电源300的作用下，电解铜工艺槽30内发生电解作用，引线框架材料为阴极，两个电极板40相对设置在引线框架材料的两侧，可使引线框架材料两面都发生电解作用，根据电流方向的不同，引线框架材料表面能够析出铜或者剥离铜。According to an embodiment of the present invention, each electrolytic copper process tank 30 is provided with two electrode plates 40 , the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, and the moving path is located between the two electrode plates 40 . The electrode plate 40 is the anode plate, and the number of electrolytic copper process tanks 30 can be multiple. The electrolytic copper process tank 30 is provided with a channel extending through the running direction of the lead frame material, and the lead frame material can pass through the electrolytic copper process tank 30. out. Under the action of the pulse reverse power supply 300, electrolysis occurs in the electrolytic copper process tank 30, the lead frame material is the cathode, and the two electrode plates 40 are oppositely arranged on both sides of the lead frame material, so that electrolysis can occur on both sides of the lead frame material. , depending on the direction of the current, the surface of the lead frame material can precipitate copper or strip copper.
进一步地，电极板40的表面积与浸在每个电解铜工艺槽30中的引线框架材料的表面积比为5：1，优选为3：1，更优选为2：1。在电解铜工艺槽30中，该电极板40即为阳极板，引线框架材料为阴极，也就是说要满足阳极材料面积与阴极材料面积比5：1的要求。Further, the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1, preferably 3:1, more preferably 2:1. In the electrolytic copper process tank 30, the electrode plate 40 is the anode plate, and the lead frame material is the cathode, that is to say, the requirement of the ratio of the area of the anode material to the area of the cathode material is 5:1.
可选地，电极板40的形状形成为片面、网状或者异形状。电极板40可采用可溶性金属和非可溶性金属的组合，也可采用在非可溶性电极板40，在电极板40表面电解贵金属。电极板40可以是平板弯曲成圆弧形、网状弯曲成圆弧形，只要可以满足电极板40的表面积与浸在每个电解铜工艺槽30中的引线框架材料的表面积比为5：1的要求即可。Optionally, the shape of the electrode plate 40 is formed in one-sided, meshed or irregular shape. The electrode plate 40 can be a combination of soluble metal and insoluble metal, or the insoluble electrode plate 40 can be used to electrolyze the precious metal on the surface of the electrode plate 40 . The electrode plate 40 can be a flat plate bent into an arc shape, and a mesh bent into an arc shape, as long as the ratio of the surface area of the electrode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5:1 requirements.
优选地，每个电解铜工艺槽30内的两个电极板40为相同形状或者不同形状的组合。也就是说，两个电极板40的形状可以是不同形状的组合，可以一个是片状，另一个是异形状，也可以是一个为网状，另一个为片状，可以根据实际需求来设定其大小、形状及组合，具有很高的适用性。通过阳极大小和形状的调节，可以满足阳极材料面积与阴极材料面积比5：1的要求，使引线框架材料表面电解铜膜厚均匀性得到提高，产品质量得到保障，提高了引线框架表面处理生产线的生产效率。Preferably, the two electrode plates 40 in each electrolytic copper process tank 30 are of the same shape or a combination of different shapes. That is to say, the shapes of the two electrode plates 40 can be a combination of different shapes, one can be a sheet, the other is a special shape, or one is a mesh and the other is a sheet, which can be set according to actual needs. It has high applicability to determine its size, shape and combination. Through the adjustment of the size and shape of the anode, the requirement of the ratio of the area of the anode material to the area of the cathode material of 5:1 can be met, the uniformity of the electrolytic copper film thickness on the surface of the lead frame material is improved, the product quality is guaranteed, and the lead frame surface treatment production line is improved. production efficiency.
由此，通过该引线框架表面粗糙度的制造方法进行生产能够满足以下要求：1)引线框架材料表面与感光干膜的结合要牢固；2)引线框架材料表面粗糙度要满足与封装材料的热压结合牢固，保证集成电路产品质量和生产效率；3)要解决引线框架产品质量不均匀的缺陷；4)引线框架材料表面粗糙度要满足与封装材料的热压结合牢固的同时，引线框架 材料表面的电解铜膜厚也需要达到均匀化；5)需要解决化学药水粗化工艺的引线框架表面与感光干膜热压结合强度不足及材料表面有非常容易氧化的缺陷。6)要提供具有优异耐腐蚀性能的引线框架产品。Therefore, production by the method for producing the surface roughness of the lead frame can meet the following requirements: 1) the bonding between the surface of the lead frame material and the photosensitive dry film must be firm; 2) the surface roughness of the lead frame material must meet the thermal resistance of the packaging material. The pressure bonding is firm to ensure the quality and production efficiency of integrated circuit products; 3) To solve the defect of uneven quality of lead frame products; 4) The surface roughness of the lead frame material should meet the requirements of the thermal compression bonding with the packaging material. At the same time, the lead frame material The thickness of the electrolytic copper film on the surface also needs to be uniform; 5) It is necessary to solve the problem that the surface of the lead frame and the photosensitive dry film of the chemical solution roughening process are insufficient in hot-pressing bonding strength and the surface of the material is very easy to oxidize. 6) To provide lead frame products with excellent corrosion resistance.
总而言之，通过脉冲逆向电源300为基础的脉冲逆向电解技术、选择型金属阳极、阳极大小和形状的调节和脉冲电解用铜药水三要素，是实现为集成电路产业提供高品质和高性能引线框架材料及不断挑战高端引线框架生产制造技术的重要基础。不仅能够使引线框架材料表面电解铜膜厚均匀性得到提高，具有优异的耐腐蚀性，对封装材料的优异粘合力，而且产品质量得到保障，提高了引线框架表面处理生产线的生产效率。All in all, through the three elements of pulse reverse electrolysis technology based on pulse reverse power supply 300, selective metal anode, adjustment of anode size and shape, and copper potion for pulse electrolysis, it is realized to provide high-quality and high-performance lead frame materials for the integrated circuit industry. And continue to challenge the important foundation of high-end lead frame manufacturing technology. It can not only improve the uniformity of the electrolytic copper film thickness on the surface of the lead frame material, but also have excellent corrosion resistance and excellent adhesion to the packaging material, but also ensure the product quality and improve the production efficiency of the lead frame surface treatment production line.
其中需要说明的是，本发明的引线框架材料可以是金属材料，金属材料可以是由铜、镍、钴、钨、钼、铬和锌当中所选择的任意一个单体或铜、镍、钴、磷、钨、砷、钼、铬和锌当中所选择的任意两种或两种以上组成的合金；也可以是铁及其铁合金，还可以是各种不锈钢材料；所有金属材料可以是连续带材，也可以是连续引线框架材料。除此之外，凡是表面附有金属箔的材料都可以通过本发明的制造方法和制造设备进行表面粗糙度的生产加工；例如，各种塑料薄膜的单面或者双面附有金属薄膜的材料都可以制造所需求的表面粗糙度材料；It should be noted that the lead frame material of the present invention can be a metal material, and the metal material can be any single selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc or copper, nickel, cobalt, Alloys composed of any two or more selected from phosphorus, tungsten, arsenic, molybdenum, chromium and zinc; also can be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips , can also be continuous lead frame material. In addition, any material with metal foil on the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness production; for example, materials with metal film attached to one or both sides of various plastic films All materials with the required surface roughness can be manufactured;
金属材料可选宽度范围10mm～1000mm；金属材料可选厚度范围0.03mm～0.30mm；金属材料表面粗糙度的算数平均值可选范围0.06μm～2.0μmThe optional width of metal materials ranges from 10mm to 1000mm; the optional thickness of metal materials ranges from 0.03mm to 0.30mm; the optional range of arithmetic mean of surface roughness of metal materials is 0.06μm to 2.0μm
下面通过具体实施例及对比实施例使本专业技术人员更全面的理解本发明，但并不因此将本发明限制在的实施例范围之中。The following specific examples and comparative examples enable those skilled in the art to more fully understand the present invention, but the present invention is not limited to the scope of the examples.
【金属材料】【metallic material】
本发明的引线框架材料可以是金属材料，金属材料可以是由铜、镍、钴、钨、钼、铬和锌当中所选择的任意一个单体或铜、镍、钴、磷、钨、砷、钼、铬和锌当中所选择的任意两种或两种以上组成的合金；也可以是铁及其铁合金，还可以是各种不锈钢材料；所有金属材料可以是连续带材，也可以是连续引线框架材料。除此之外，凡是表面附有金属箔的材料都可以通过本发明的制造方法和制造设备进行表面粗糙度的生产加工；例如，各种塑料薄膜的单面或者双面附有金属薄膜的材料都可以制造所需求的表面粗糙度材料；The lead frame material of the present invention can be a metal material, and the metal material can be any single element selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc, or copper, nickel, cobalt, phosphorus, tungsten, arsenic, Alloys composed of any two or more selected from molybdenum, chromium and zinc; it can also be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips or continuous leads frame material. In addition, any material with metal foil on the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness production; for example, materials with metal film attached to one or both sides of various plastic films All materials with the required surface roughness can be manufactured;
金属材料可选宽度范围10mm～1000mm；金属材料可选厚度范围0.03mm～0.30mm；The optional width of metal materials ranges from 10mm to 1000mm; the optional thickness of metal materials ranges from 0.03mm to 0.30mm;
金属材料表面粗糙度的算数平均值可选范围0.1μm～10.0μm。The arithmetic mean value of the surface roughness of the metal material can be selected in the range of 0.1 μm to 10.0 μm.
【感光干膜】【Photosensitive dry film】
感光干膜表面与金属材料表面进行热压处理，得到粘合坚固、表面质量均匀的贴膜金属材料。感光干膜原材料的厚度可选范围：20～60μm；感光干膜原材料表面粗糙度可选范围：0.75～1.87μm；金属材料与感光干膜贴合后的材料厚度可选范围：0.05～0.36mm；感光干膜一侧粗糙度可选范围：0.85～2.35μm；The surface of the photosensitive dry film and the surface of the metal material are subjected to hot pressing to obtain a film-coated metal material with firm adhesion and uniform surface quality. Optional range of thickness of photosensitive dry film raw material: 20～60μm; optional range of surface roughness of photosensitive dry film raw material: 0.75～1.87μm; optional range of material thickness after lamination of metal material and photosensitive dry film: 0.05～0.36mm ; Optional range of one side roughness of photosensitive dry film: 0.85～2.35μm;
【电解铜药水】【Electrolytic Copper Potion】
所采用的电解铜药水要能满足：正向电流密度可选范围2A/dm 2～70A/dm 2；反向电流密度可选范围5A/dm 2～170A/dm 2；电解铜药水在正向电流条件下对引线框架材料表面能电解析出铜而在逆向电流条件下对引线框架材料表面能电解剥离铜的特殊要求。 The electrolytic copper potion used should be able to meet the following requirements: the forward current density can be selected from 2A/dm 2 to 70A/dm 2 ; the reverse current density can be selected from 5A/dm 2 to 170A/dm 2 ; The special requirements for the electrolytic stripping of copper on the surface of the lead frame material under the current condition and the electrolytic stripping of the copper on the surface of the lead frame material under the reverse current condition.
实施例1Example 1
(1)表面粗糙度的分析测定(1) Analysis and determination of surface roughness
如图5所示，原材料铜带C19400，宽度350mm，厚度0.12mm。用形状测量检测仪VK-X系列分析测试粗糙度Ra为0.08～0.15μm，多组数据计算出平均值为0.11μm。As shown in Figure 5, the raw material copper tape C19400 has a width of 350mm and a thickness of 0.12mm. The roughness Ra is 0.08-0.15 μm by the shape measuring and testing instrument VK-X series, and the average value calculated from multiple sets of data is 0.11 μm.
(2)根据选用的感光干膜的热压贴膜要求，金属材料表面粗糙度范围Ra为1.3～1.5μm。(2) According to the requirements of the hot-pressing film of the selected photosensitive dry film, the surface roughness Ra of the metal material is 1.3-1.5 μm.
(3)脉冲逆向电解技术制造材料的表面粗糙度Ra＝(1.2～1.5μm)-(0.08～0.15μm)，即生产加工粗糙度范围Ra为1.12～1.35μm。(3) The surface roughness Ra=(1.2～1.5μm)-(0.08～0.15μm) of the material manufactured by pulse reverse electrolysis technology, that is, the production and processing roughness range Ra is 1.12～1.35μm.
(4)根据产品生产加工要求，对金属材料进行双面粗糙度表面处理。(4) According to the production and processing requirements of the product, double-sided roughness surface treatment is performed on the metal material.
(5)引线框架材料表面粗糙度的制造(5) Manufacture of surface roughness of lead frame material
如图1所示，首先，金属原材料从放料10导出通过放料导轮11后，进入电解脱脂槽清洗除去金属材料表面的油脂等，然后进入酸活化槽清洗除去金属材料表面的锈斑及氧化物等，得到清洁的金属材料。As shown in Figure 1, first, the metal raw materials are led out from the discharge 10 through the discharge guide wheel 11, then enter the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enter the acid activation tank to clean and remove the rust and oxidation on the surface of the metal material. objects, etc., to obtain clean metal materials.
然后，在第一电解铜工艺槽30a，引线框架材料的上下两侧设有上阳极板40a和下阳极板40b与脉冲逆向电源310的阳极输出连接；进口处阴极导电13a和出口处阴极导电13b与脉冲逆向电源310的阴极输出连接。第二电解铜区域至第七镀铜区域的连接方式与第一电解铜区域的连接方式相同。如图1和图4所示。Then, in the first electrolytic copper process tank 30a, an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 . The connection manner of the second electrolytic copper area to the seventh copper plating area is the same as the connection manner of the first electrolytic copper area. As shown in Figure 1 and Figure 4.
如表1所示，由于原材料铜带宽度350mm，表面积较大，并且产品需要的引线框架材料表面粗糙度Ra 1.30～1.50μm与原材料粗糙度Ra 0.08～0.15μm相比差距较大，优选7单元的电解铜工艺进行表面粗糙度的处理；将七台脉冲逆向电源310至370的制造引线框架表面粗糙度的总额度设为21等分，每一等分的表面粗糙度为0.06～0.07μm；例如实验条件No.1的脉冲逆向电源310占15份，处理后需要达到的表面粗糙度范围Ra 0.92～1.07μm，脉冲逆向电源320至370的6台脉冲逆向电源300各占1份，用每台脉冲逆向电源300处理后，材料表面粗糙度都要满足Ra 0.06～0.07μm。As shown in Table 1, since the width of the raw material copper tape is 350mm, the surface area is large, and the surface roughness of the lead frame material required by the product is Ra 1.30~1.50μm and the raw material roughness Ra 0.08 ~ 0.15μm is relatively large, preferably 7 units The electrolytic copper process is used to process the surface roughness; the total surface roughness of the lead frame manufactured by the seven pulse reverse power supplies 310 to 370 is set to 21 equal parts, and the surface roughness of each equal part is 0.06-0.07 μm; For example, the pulse reverse power supply 310 of the experimental condition No. 1 occupies 15 parts, the surface roughness range Ra 0.92～1.07μm needs to be achieved after treatment, and the six pulse reverse power supplies 300 of the pulse reverse power supply 320 to 370 each occupy 1 part. After the pulse reverse power supply 300 is processed, the surface roughness of the material must meet Ra 0.06 ~ 0.07μm.
引线框架材料表面粗糙度制造生产线的运行速度优选为1.5m/min。当7台脉冲逆向电源300采用表1中条件No.7时，7次电解铜层粗糙度的范围均在0.18～0.21μm，即7台脉冲逆向电源300所设定的正反向脉冲电流和正反向脉冲时间条件相同，所得到的从最下层到表层的表面粗糙度以及致密度相差很小，引线框架材料表面特性均匀一致。The operating speed of the lead frame material surface roughness manufacturing line is preferably 1.5 m/min. When the seven pulse reverse power supplies 300 use the condition No. 7 in Table 1, the roughness of the electrolytic copper layer for the seven times is in the range of 0.18-0.21 μm, that is, the forward and reverse pulse currents set by the seven pulse reverse power supplies 300 and The forward and reverse pulse time conditions are the same, the obtained surface roughness and density from the bottom layer to the surface layer have little difference, and the surface characteristics of the lead frame material are uniform.
当采用条件No.1时，脉冲逆向电源310需要设定较大正向脉冲电流和较长的正向脉冲时间，而反向脉冲电流的设定值要小，反向脉冲时间的设定需较短；得到的电解铜粗糙度较大而且致密度较差；随后六台脉冲逆向电源320至370的设定条件与条件No.7比较是较小的正向脉冲电流和较长的正向脉冲时间，而反向脉冲电流的设定值与条件No.7相比稍大，反向脉冲时间要比No.7短很多；因此所得到的表面粗糙度在达到产品规格的同时，与条件No.7相比表面致密度较好。When the condition No. 1 is adopted, the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current. Short; the obtained electrolytic copper has a large roughness and a poor density; the set conditions of the subsequent six pulse reverse power supplies 320 to 370 are compared with the condition No. 7, which is a smaller forward pulse current and a longer forward pulse time, and the set value of the reverse pulse current is slightly larger than that of the condition No.7, and the reverse pulse time is much shorter than that of No.7; therefore, the obtained surface roughness meets the product specification and is similar to the condition No. 7. .7 is better than the surface density.
当采用条件No.2至No.6时，引线框架材料表面粗糙度在达到要求的同时，致密度范围在条件No.1和No.7之间。When the conditions No. 2 to No. 6 are used, the surface roughness of the lead frame material meets the requirements, and the density range is between the conditions No. 1 and No. 7.
当采用条件No.13时，六台脉冲逆向电源310至360需要设定较小的正向脉冲电流和较长的正向脉冲时间，而设定大的反向脉冲电流和很短的反向脉冲时间；得到的镀铜层粗糙度较小并且致密度较好。最后一台脉冲逆向电源370的设定条件是较大的正向脉冲电流和较长的正向脉冲时间，而设定较大的反向脉冲电流和较短的反向脉冲时间，因此所得到的表面粗糙度在达到产品规格的同时，与条件No.7相比表面致密度较差。When the condition No. 13 is adopted, the six pulse reverse power supplies 310 to 360 need to be set with a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse current. Pulse time; the resulting copper layer has less roughness and better density. The setting conditions of the last pulse reverse power supply 370 are larger forward pulse current and longer forward pulse time, and set larger reverse pulse current and shorter reverse pulse time, so the obtained While reaching the product specification, the surface roughness is inferior to that of Condition No. 7.
当采用条件No.8至No.12时，引线框架材料表面粗糙度在达到要求的同时，致密度处在条件No.7和No.13之间。When the conditions No. 8 to No. 12 are used, the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 7 and No. 13.
引线框架表面粗糙度用形状测量检测仪VK-X系列分析测试。引线框架粗铜材料用作后续镀银的原料，必须能够与镀银层形成致密坚固的结合层是判断引线框架表面规格的标准。The surface roughness of the lead frame is analyzed and tested with the shape measuring instrument VK-X series. The lead frame blister copper material is used as the raw material for subsequent silver plating, and it must be able to form a dense and strong bonding layer with the silver plating layer, which is the standard for judging the surface specifications of the lead frame.
用感光干膜验证引线框架材料表面粗糙度和致密度的效果。The effect of surface roughness and density of lead frame material was verified with photosensitive dry film.
当选定感光干膜的品牌和型号后，用形状测量检测仪VK-X系列分析测试粗糙度Ra为1.3～1.85μm，多组数据平均值Ra为1.58μm；与上述制造的金属材料通过压膜机进行热压后的表面粗糙度规格范围1.57～1.93μm。以此规格范围作为检查标准，将上述各种条件生产制造的金属材料与感光干膜压热的产品经过形状测量检测仪VK-X检测，既能确定最佳的金属材料表面粗糙度的制造方法和最佳的脉冲逆向电源300的设定条件。After selecting the brand and model of the photosensitive dry film, use the shape measuring instrument VK-X series to analyze and test the roughness Ra of 1.3 ~ 1.85μm, and the average value of multiple sets of data Ra is 1.58μm; The surface roughness specification range of the film machine after hot pressing is 1.57-1.93 μm. With this specification range as the inspection standard, the metal materials produced under the above conditions and the photosensitive dry film autoclaved products are tested by the shape measuring detector VK-X, which can determine the best manufacturing method for the surface roughness of metal materials and the optimal pulse reverse power supply 300 setting conditions.
由此，本实施列的最佳条件是No.2。Therefore, the optimum condition of this embodiment is No.2.
实施例2Example 2
(1)表面粗糙度的分析测定(1) Analysis and determination of surface roughness
如图7所示，卷式引线框架，宽度115mm，厚度0.15mm，金属原材料为C14410。用形状测量检测仪VK-X系列分析测试粗糙度Ra为0.12～0.21μm，多组数据计算平均值为0.17μm。As shown in Figure 7, the roll lead frame has a width of 115mm and a thickness of 0.15mm, and the metal raw material is C14410. The roughness Ra is 0.12-0.21 μm, and the average value calculated from multiple sets of data is 0.17 μm.
(2)根据后续镀银工艺的要求，引线框架表面粗糙度需求范围为2.5～3.7μm；(2) According to the requirements of the subsequent silver plating process, the surface roughness of the lead frame needs to be in the range of 2.5 to 3.7 μm;
(3)脉冲逆向电解技术制造的表面粗糙度Ra＝(2.5～3.7μm)-(0.12～0.21μm)，即生产加工粗糙度范围Ra为2.38～3.49μm。(3) The surface roughness Ra=(2.5～3.7μm)-(0.12～0.21μm) manufactured by pulse reverse electrolysis technology, that is, the production processing roughness range Ra is 2.38～3.49μm.
(4)根据生产加工要求，对引线框架材料的单面进行粗糙度表面处理。(4) According to the production and processing requirements, roughness surface treatment is performed on one side of the lead frame material.
(5)引线框架表面处理(5) Surface treatment of lead frame
如图1所示，首先，金属原材料从放料10导出通过放料导轮11后，进入电解脱脂槽清洗除去金属材料表面的油脂等，然后进入酸活化槽清洗除去金属材料表面的锈斑及氧化物等，得到清洁的金属材料。As shown in Figure 1, first, the metal raw materials are led out from the discharge 10 through the discharge guide wheel 11, then enter the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enter the acid activation tank to clean and remove the rust and oxidation on the surface of the metal material. objects, etc., to obtain clean metal materials.
然后，在第一电解铜工艺槽30a，引线框架材料的上下两侧设有上阳极板40a和下阳极板40b与脉冲逆向电源310的阳极输出连接；进口处阴极导电13a和出口处阴极导电13b与脉冲逆向电源310的阴极输出连接。第二电解铜区域至第六电解铜区域的连接方式与第一电解铜区域的连接方式相同，如图6所示。Then, in the first electrolytic copper process tank 30a, an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 . The connection manner of the second electrolytic copper region to the sixth electrolytic copper region is the same as that of the first electrolytic copper region, as shown in FIG. 6 .
如表2所示，卷式引线框架材料宽度115mm，表面积与实施例1相比不足三分之一，选用6单元的电解铜工艺进行表面粗糙度的处理；产品需求的材料表面粗糙度为Ra2.38～3.49μm；将六台脉冲逆向电源310至360的制造金属表面粗糙度的总额度设为18等份，每一等分的表面粗糙度为0.132～0.193μm；例如实验条件No.1的脉冲逆向电源310占11份，处理后需要达到的表面粗糙度范围Ra 1.454～2.132μm，脉冲逆向电源320占3份，处理后需要达到的表面粗糙度范围Ra 0.396～0.581μm，脉冲逆向电源320至360的4台脉冲逆向电源300各占1份，用每台脉冲逆向电源300处理后，材料表面粗糙度都要满足Ra 0.132～0.193μm。As shown in Table 2, the width of the rolled lead frame material is 115mm, and the surface area is less than one-third of that of Example 1. The 6-unit electrolytic copper process is used for surface roughness treatment; the surface roughness of the material required by the product is Ra2 .38～3.49μm; the total surface roughness of the manufactured metal of the six pulse reverse power sources 310 to 360 is set to 18 equal parts, and the surface roughness of each equal part is 0.132～0.193μm; for example, the experimental condition No.1 The pulse reverse power supply 310 accounts for 11 parts, the surface roughness range that needs to be reached after treatment is Ra 1.454～2.132μm, the pulse reverse power supply 320 occupies 3 parts, and the surface roughness range that needs to be achieved after processing Ra 0.396～0.581μm, the pulse reverse power supply 4 sets of pulse reverse power supply 300 from 320 to 360 each account for one part. After processing with each pulse reverse power supply 300, the surface roughness of the material must meet Ra 0.132 ~ 0.193μm.
引线框架材料表面粗糙度制造生产线的运行速度优选为2.0m/min；当6台脉冲逆向电源300采用表2中条件No.9时，6次电解铜层粗糙度的范围均在0.396～0.581μm，即6台脉冲逆向电源300所设定的正反向脉冲电流和正反向脉冲时间条件相同，所得到的从最下层到表层的表面粗糙度以及致密度相差很小，引线框架材料表面特性均匀一致。The running speed of the production line for the surface roughness of the lead frame material is preferably 2.0m/min; when the condition No. 9 in Table 2 is used for 6 sets of pulse reverse power supplies 300, the roughness of the 6 times electrolytic copper layer is in the range of 0.396～0.581μm , that is, the forward and reverse pulse currents and the forward and reverse pulse time conditions set by the 6 pulse reverse power supplies 300 are the same, and the obtained surface roughness and density from the bottom layer to the surface layer are very small, and the surface characteristics of the lead frame material are very small. uniform.
当采用条件No.1时，脉冲逆向电源310需要设定较大正向脉冲电流和较长的正向脉冲时间，而反向脉冲电流的设定值要小，反向脉冲时间的设定需较短；得到的电解铜粗糙度较大而且致密度较差；脉冲逆向电源320所需设定的条件与No.9时6台脉冲逆向电源300所采用的条件相同，随后四台脉冲逆向电源330至360的设定条件与条件No.9比较是较小的正向脉冲电流和较长的正向脉冲时间，而反向脉冲电流的设定值与条件No.9相比稍大，反向脉冲时间要比No.9短很多；因此所得到的电解铜表面粗糙度在达到产品规格要求的同时，与条件No.9相比表面致密度较好。When the condition No. 1 is adopted, the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current. Short; the obtained electrolytic copper has large roughness and poor density; the conditions required for the pulse reverse power supply 320 to be set are the same as those used for the 6 pulse reverse power supply 300 in No. 9, and then the four pulse reverse power supplies 330 The setting conditions to 360 are smaller forward pulse current and longer forward pulse time compared with condition No.9, while the setting value of reverse pulse current is slightly larger than that of condition No.9, reverse The pulse time is much shorter than that of No. 9; therefore, the surface roughness of the obtained electrolytic copper meets the requirements of product specifications, and the surface density is better than that of Condition No. 9.
当采用条件No.2、No.3、No.4、No.5、No.6、No.7和No.8时，引线框架材料表面粗糙度在达到要求的同时，致密度处在No.1和No.9之间。When using the conditions No.2, No.3, No.4, No.5, No.6, No.7 and No.8, the surface roughness of the lead frame material meets the requirements and the density is at No. Between 1 and No.9.
当采用条件No.17时，四台脉冲逆向电源310至340需要设定较小的正向脉冲电流和较长的正向脉冲时间，而设定大的反向脉冲电流和很短的反向脉冲时间；得到的镀铜层粗糙度较小并且致密度较好。脉冲逆向电源350所需设定的条件与No.9时6台脉冲逆向电源300所采用的条件相同，最后一台脉冲逆向电源360的设定条件是较大的正向脉冲电流和较长的正向脉冲时间，而设定较大的反向脉冲电流和较短的反向脉冲时间，因此所得到的表面粗糙度在达到产品规格的同时，与条件No.9相比表面致密度较差。When the condition No. 17 is adopted, the four pulse reverse power supplies 310 to 340 need to set a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse Pulse time; the resulting copper layer has less roughness and better density. The conditions for the pulse reverse power supply 350 to be set are the same as those used for the 6 pulse reverse power supply 300 in No. 9. The setting conditions for the last pulse reverse power supply 360 are a larger forward pulse current and a longer pulse reverse current. The forward pulse time is set, and the reverse pulse current is larger and the reverse pulse time is shorter. Therefore, the obtained surface roughness meets the product specification and the surface density is lower than that of Condition No. 9. .
当采用条件No.8至No.16时，引线框架材料表面粗糙度在达到要求的同时，致密度处在条件No.9和No.17之间。When the conditions No. 8 to No. 16 are used, the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 9 and No. 17.
由此，本实施列的最佳条件是No.3。Therefore, the optimum condition of this embodiment is No.3.
实施例3Example 3
(1)表面粗糙度的分析测定(1) Analysis and determination of surface roughness
如图9所示，片式引线框架，宽度105mm，厚度0.20mm，金属原材料为C14410。用形状测量检测仪VK-X系列分析测试粗糙度Ra为0.15～0.23μm，多组数据平均值Ra为0.19μm。As shown in Figure 9, the chip lead frame has a width of 105mm and a thickness of 0.20mm, and the metal raw material is C14410. The roughness Ra is 0.15-0.23 μm, and the average value Ra of multiple sets of data is 0.19 μm.
(2)根据后续镀银工艺的要求，引线框架表面粗糙度需求范围为Ra为3.5～4.9μm。(2) According to the requirements of the subsequent silver plating process, the surface roughness requirements of the lead frame are in the range of Ra of 3.5 to 4.9 μm.
(3)脉冲逆向电解技术制造的表面粗糙度Ra＝(3.5～4.9μm)-(0.15～0.23μm)，既生产加工粗糙度范围Ra为3.35～4.67μm；(3) The surface roughness Ra=(3.5～4.9μm)-(0.15～0.23μm) manufactured by pulse reverse electrolysis technology, that is, the production and processing roughness range Ra is 3.35～4.67μm;
(4)根据生产加工要求，对片式引线框架单面进行粗糙度表面处理；(4) According to the production and processing requirements, roughness surface treatment is performed on one side of the chip lead frame;
(5)片式引线框架表面处理(5) Surface treatment of chip lead frame
如图1所示，首先，引线框架材料从放料10导出通过放料导轮11后，进入电解脱脂槽清洗除去金属材料表面的油脂等，然后进入酸活化槽清洗除去金属材料表面的锈斑及氧化物等，得到清洁的金属材料。As shown in Figure 1, first, the lead frame material is led out from the discharge 10 through the discharge guide wheel 11, then enters the electrolytic degreasing tank to clean and remove the grease on the surface of the metal material, and then enters the acid activation tank to clean and remove the rust and stains on the surface of the metal material. oxides, etc., to obtain clean metal materials.
然后，在第一电解铜工艺槽30a，引线框架材料的上下两侧设有上阳极板40a和下阳极板40b与脉冲逆向电源310的阳极输出连接；进口处阴极导电13a和出口处阴极导电13b与脉冲逆向电源310的阴极输出连接。第二电解铜区域至第六电解铜区域的连接方式与第一电解铜区域的连接方式相同，如图3和图8所示。Then, in the first electrolytic copper process tank 30a, an upper anode plate 40a and a lower anode plate 40b are provided on the upper and lower sides of the lead frame material to connect with the anode output of the pulse reverse power supply 310; the cathode conduction 13a at the inlet and the cathode conduction 13b at the outlet Connect to the cathode output of the pulse reverse power supply 310 . The connection manner of the second electrolytic copper region to the sixth electrolytic copper region is the same as that of the first electrolytic copper region, as shown in FIG. 3 and FIG. 8 .
如表3所示，片式引线框架，宽度105mm，表面积与实施例1相比不足三分之一，优选5单元的电解铜工艺进行表面粗糙度的处理；产品需求的材料表面粗糙度为Ra3.35～4.67μm；将五台脉冲逆向电源310至350的制造金属表面粗糙度的总额度设为20等份，每一等分的表面粗糙度为0.167～0.233μm；例如实验条件No.1的脉冲逆向电源310占15份，处理后需要达到的表面粗糙度范围Ra 2.512～3.503μm，脉冲逆向电源320占2份，处理后需要达到的表 面粗糙度范围Ra 0.335～0.467μm，脉冲逆向电源320至350的3台脉冲逆向电源300各占1份，用每台脉冲逆向电源300处理后，材料表面粗糙度都要满足Ra 0.167～0.233μm。As shown in Table 3, the chip lead frame has a width of 105mm, and its surface area is less than one-third of that of Example 1. It is preferable to use a 5-unit electrolytic copper process for surface roughness treatment; the surface roughness of the material required by the product is Ra3 .35～4.67μm; the total surface roughness of the metal produced by the five pulse reverse power sources 310 to 350 is set to 20 equal parts, and the surface roughness of each equal part is 0.167～0.233μm; for example, the experimental condition No.1 The pulse reverse power supply 310 accounts for 15 parts, the surface roughness range to be achieved after treatment is Ra 2.512 ~ 3.503μm, the pulse reverse power supply 320 occupies 2 parts, the surface roughness range to be achieved after treatment is Ra 0.335 ~ 0.467μm, the pulse reverse power supply 3 sets of pulse reverse power supply 300 from 320 to 350 each account for 1 part. After processing with each pulse reverse power supply 300, the surface roughness of the material must meet Ra 0.167 ~ 0.233μm.
片式引线框架材料表面粗糙度制造生产线的运行速度优选为1.5m/min；当5台脉冲逆向电源300采用表3中条件No.9时，5次电解铜层粗糙度的范围均在0.670～0.934μm，即6台脉冲逆向电源300所设定的正反向脉冲电流和正反向脉冲时间条件相同，所得到的从最下层到表层的表面粗糙度以及致密度相差很小，引线框架材料表面特性均匀一致。The running speed of the production line for the surface roughness of the chip lead frame material is preferably 1.5m/min; when the five pulse reverse power supplies 300 use the condition No. 9 in Table 3, the roughness of the five electrolytic copper layers is in the range of 0.670～ 0.934μm, that is, the forward and reverse pulse current and the forward and reverse pulse time conditions set by the 6 sets of pulse reverse power supply 300 are the same, and the obtained surface roughness and density from the bottom layer to the surface layer are very small, and the lead frame material The surface properties are uniform.
当采用条件No.1时，脉冲逆向电源310需要设定较大正向脉冲电流和较长的正向脉冲时间，而反向脉冲电流的设定值要小，反向脉冲时间的设定需较短；得到的电解铜粗糙度较大而且致密度较差；脉冲逆向电源320所需设定的条件与No.9的5台脉冲逆向电源300所采用的条件不同，采用的是较小的正向脉冲电流和较长的正向脉冲时间，而反向脉冲电流的设定值与条件No.9相比稍大，反向脉冲时间要比No.9短很多；随后三台脉冲逆向电源330至350的设定条件与条件No.9比较是较小的正向脉冲电流和较长的正向脉冲时间，而反向脉冲电流的设定值与条件No.9相比稍大，反向脉冲时间要比No.9短很多。因此所得到的电解铜表面粗糙度在达到产品规格要求的同时，与条件No.9相比表面致密度较好。When the condition No. 1 is adopted, the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current should be small, and the setting of the reverse pulse time should be longer than that of the reverse pulse current. Short; the obtained electrolytic copper has large roughness and poor density; the conditions required for the pulse reverse power supply 320 to be set are different from those used by the five pulse reverse power supplies 300 of No. 9, and the smaller positive The forward pulse current and longer forward pulse time, while the set value of the reverse pulse current is slightly larger than that of No.9, and the reverse pulse time is much shorter than that of No.9; then three pulse reverse power supplies 330 The setting conditions to 350 are smaller forward pulse current and longer forward pulse time compared with condition No.9, while the setting value of reverse pulse current is slightly larger than that of condition No.9, reverse direction The pulse time is much shorter than No.9. Therefore, the surface roughness of the obtained electrolytic copper meets the requirements of product specifications, and the surface density is better than that of Condition No. 9.
当采用条件No.2、No.3、No.4、No.5、No.6、No.7和No.8时，引线框架材料表面粗糙度在达到要求的同时，致密度处在No.1和No.9之间。When using the conditions No.2, No.3, No.4, No.5, No.6, No.7 and No.8, the surface roughness of the lead frame material meets the requirements and the density is at No. Between 1 and No.9.
当采用条件No.17时，三台脉冲逆向电源310至330需要设定较小的正向脉冲电流和较长的正向脉冲时间，而设定大的反向脉冲电流和很短的反向脉冲时间；得到的镀铜层When the condition No. 17 is adopted, the three pulse reverse power supplies 310 to 330 need to be set with a small forward pulse current and a long forward pulse time, and set a large reverse pulse current and a very short reverse pulse current. Pulse time; the resulting copper coating
粗糙度较小并且致密度较好。脉冲逆向电源340所需设定的条件与No.9时5台脉冲逆向电源300所采用的条件不同，采用的是较小的正向脉冲电流和较长的正向脉冲时间，而反向脉冲电流的设定值与条件No.9相比稍大，反向脉冲时间要比No.9短很多；最后面一台脉冲逆向电源350的设定条件是较大的正向脉冲电流和较长的正向脉冲时间，而设定较大的反向脉冲电流和较短的反向脉冲时间，因此所得到的表面粗糙度在达到产品规格的同时，与条件No.9比较表面致密度更差。The roughness is less and the density is better. The conditions required for the pulse reverse power supply 340 to be set are different from the conditions used by the 5 pulse reverse power supply 300 in No. 9. It adopts a smaller forward pulse current and a longer forward pulse time, while the reverse pulse The setting value of current is slightly larger than that of condition No.9, and the reverse pulse time is much shorter than that of No.9; the setting conditions of the last pulse reverse power supply 350 are larger forward pulse current and longer pulse duration. The forward pulse time is longer, and a larger reverse pulse current and a shorter reverse pulse time are set. Therefore, the obtained surface roughness meets the product specification and the surface density is worse than that of Condition No. 9. .
当采用条件No.8至No.16时，引线框架材料表面粗糙度在达到要求的同时，致密度处在条件No.9和No.17之间。When the conditions No. 8 to No. 16 are used, the surface roughness of the lead frame material meets the requirements while the density is between the conditions No. 9 and No. 17.
由此，本实施列的最佳条件是No.4。Therefore, the optimum condition of this embodiment is No.4.
表1、表2、表3分别为7台脉冲逆向电源300对应的引线框架表面粗糙度的分配额度、6台脉冲逆向电源300对应的引线框架表面粗糙度的分配额度、5台脉冲逆向电源300对应的引线框架表面粗糙度的分配额度。其中包括每一台脉冲逆向电源300的分配份数和具体表面粗糙度范围。Table 1, Table 2, and Table 3 are respectively the allocation quota of lead frame surface roughness corresponding to 7 sets of pulse reverse power supply 300, the allocation quota of lead frame surface roughness corresponding to 6 sets of pulse reverse power supply 300, and the allocation quota of lead frame surface roughness corresponding to 5 sets of pulse reverse power supply 300, respectively. The assigned amount of the corresponding lead frame surface roughness. It includes the assigned number of each pulse reverse power supply 300 and the specific surface roughness range.
表1：7台脉冲逆向电源对应的引线框架表面粗糙度的分配额度单位：μmTable 1: Allocation quota of lead frame surface roughness corresponding to 7 sets of pulse reverse power supply unit: μm
Figure PCTCN2021124340-appb-000001
Figure PCTCN2021124340-appb-000001
Figure PCTCN2021124340-appb-000002
Figure PCTCN2021124340-appb-000002
表2：6台脉冲逆向电源对应的引线框架表面粗糙度的分配额度单位：μmTable 2: Allocation quota of lead frame surface roughness corresponding to 6 pulse reverse power supplies Unit: μm
Figure PCTCN2021124340-appb-000003
Figure PCTCN2021124340-appb-000003
Figure PCTCN2021124340-appb-000004
Figure PCTCN2021124340-appb-000004
表3：5台脉冲逆向电源对应的引线框架表面粗糙度的分配额度单位：μmTable 3: Allocation quota of lead frame surface roughness corresponding to 5 pulse reverse power supplies Unit: μm
Figure PCTCN2021124340-appb-000005
Figure PCTCN2021124340-appb-000005
Figure PCTCN2021124340-appb-000006
Figure PCTCN2021124340-appb-000006
由此，调节控制各单元可选脉冲逆向电源300输出电流各不相同，同时调节控制各单元可选脉冲逆向电源300输出脉冲时间也各不相同，通过所选不同设定条件单元的各种排列组合，设计表面粗糙度需求范围的试验方案并对实验结果优化处理，优选出最佳的材料表面粗糙度的实验方法，得到引线框架生产要求的所需引线框架材料表面粗糙度Therefore, the output current of the optional pulse reverse power supply 300 of each unit of adjustment and control is different, and at the same time, the output pulse time of the optional pulse reverse power supply 300 of each unit of adjustment and control is also different. Combine, design the test plan for the surface roughness requirement range and optimize the experimental results, optimize the experimental method of the best material surface roughness, and obtain the required surface roughness of the lead frame material required by the lead frame production
调节控制引线框架材料表面粗糙度的电解铜工艺可选范围3单元～12单元，优选范围4单元～11单元，更优选范围5单元～10单元。The electrolytic copper process for adjusting and controlling the surface roughness of the lead frame material can be selected in the range of 3 units to 12 units, preferably in the range of 4 units to 11 units, and more preferably in the range of 5 units to 10 units.
如图1至图9所示，根据本发明实施例的引线框架材料表面粗糙度的制造方法，能够将引线框架材料电解加工成产品所需的表面粗糙度。通过脉冲逆向电解技术和优选电解铜药水对连续引线框架材料200、500和700进行表面处理。引线框架材料表面粗糙度的生产加工条件可以通过设计表面粗糙度需求范围的试验方案进行确定，并对实验结果优化处理，优选出最佳的材料表面粗糙度的制造方法，其具有连续生产加工效率高，增加引线框架材料表面与感光干膜的结合强度以及与封装材料的结合强度，提高引线框架产品质量。As shown in FIG. 1 to FIG. 9 , according to the method for manufacturing the surface roughness of the lead frame material according to the embodiment of the present invention, the lead frame material can be electrolytically processed into the surface roughness required for the product. The continuous lead frame materials 200, 500 and 700 are surface treated by pulsed reverse electrolysis techniques and preferably electrolytic copper potions. The production and processing conditions of the surface roughness of the lead frame material can be determined by designing a test plan for the required range of surface roughness, and optimizing the experimental results to optimize the manufacturing method of the best material surface roughness, which has continuous production and processing efficiency. High, increase the bonding strength between the surface of the lead frame material and the photosensitive dry film and the bonding strength with the packaging material, and improve the quality of the lead frame product.
本发明的引线框架材料可以是金属材料，金属材料可以是由铜、镍、钴、钨、钼、铬和锌当中所选择的任意一个单体或铜、镍、钴、磷、钨、砷、钼、铬和锌当中所选择的任意两种或两种以上组成的合金；也可以是铁及其铁合金，还可以是各种不锈钢材料；所有金属材料可以是连续带材，也可以是连续引线框架材料。除此之外，凡是表面附有金属箔的材料都可以通过本发明的制造方法和制造设备进行表面粗糙度的生产加工。例如，各种塑料薄膜的单面或者双面附有金属薄膜的材料都可以制造所需求的表面粗糙度材料。The lead frame material of the present invention can be a metal material, and the metal material can be any single element selected from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc, or copper, nickel, cobalt, phosphorus, tungsten, arsenic, Alloys composed of any two or more selected from molybdenum, chromium and zinc; it can also be iron and its iron alloys, or various stainless steel materials; all metal materials can be continuous strips or continuous leads frame material. In addition, any material with metal foil attached to the surface can be processed by the manufacturing method and manufacturing equipment of the present invention for surface roughness. For example, materials with metal films attached to one or both sides of various plastic films can produce the required surface roughness materials.
引线框架材料的板厚可选范围是0.03mm～0.80mm，优选范围是0.05mm～0.55mm，更优选范围是0.07mm～0.35mm；金属材料宽度可选范围50mm～1000mm，优选范围80mm～700mm，更优选范围是100mm～500mm。The thickness of the lead frame material can be selected in the range of 0.03mm to 0.80mm, preferably in the range of 0.05mm to 0.55mm, and more preferably in the range of 0.07mm to 0.35mm; the width of the metal material can be selected in the range of 50mm to 1000mm, preferably in the range of 80mm to 700mm , the more preferred range is 100mm to 500mm.
感光干膜表面与引线框架材料表面要进行热压处理，得到结合坚固、表面厚度均匀的贴膜引线框架材料。感光干膜原材料的厚度可选范围是20～100μm，优选范围是20～80μm，更优选范围是20～80μm。另外，感光干膜原材料表面粗糙度可选范围是0.65～2.17μm，优选范围是0.55～2.07μm，更优选范围是0.50～1.97μm。感光干膜与引线框架材料热压结合后的感光干膜一侧粗糙度可选范围是1.05～2.65μm，优选范围是0.95～2.50μm，更优选范围是0.85～2.30μm。The surface of the photosensitive dry film and the surface of the lead frame material should be subjected to hot pressing treatment to obtain a film lead frame material with strong bonding and uniform surface thickness. The thickness of the photosensitive dry film raw material can be selected in the range of 20-100 μm, preferably in the range of 20-80 μm, and more preferably in the range of 20-80 μm. In addition, the surface roughness of the photosensitive dry film raw material can be selected in the range of 0.65-2.17 μm, preferably in the range of 0.55-2.07 μm, and more preferably in the range of 0.50-1.97 μm. The optional range of one side roughness of the photosensitive dry film after the photosensitive dry film and the lead frame material are thermocompressed is 1.05-2.65 μm, preferably 0.95-2.50 μm, and more preferably 0.85-2.30 μm.
脉冲逆向电解技术是由脉冲逆向电源300输出的正向脉冲波形和反向脉冲波形的电流通过阳极板和电解铜药水传输到引线框架材料表面以及正向脉冲时间和反向脉冲时间组成。优选地，脉冲逆向电源300输出的双脉冲正向电流可选范围5A～500A，优选范围10A～450A，更优选范围20A～430A；双脉冲整流器输出的反向电流可选范围20A～1000A，优选范围30A～900A，更优选范围50A～850A；脉冲逆向电源300输出的双脉冲正向脉冲时间可选范围5ms～100ms，优选范围7ms～70ms，更优选范围10ms～50ms；脉冲逆向电源300输出的反向脉冲时间可选范围1ms～30ms，优选范围3ms～20ms，更优选范围5ms～10ms。The pulse reverse electrolysis technology is composed of the forward pulse waveform and reverse pulse waveform outputted by the pulse reverse power supply 300, which are transmitted to the surface of the lead frame material through the anode plate and the electrolytic copper solution, and the forward pulse time and the reverse pulse time. Preferably, the double-pulse forward current output by the pulse reverse power supply 300 can be selected in the range of 5A-500A, preferably in the range of 10A-450A, and more preferably in the range of 20A-430A; the reverse current output by the double-pulse rectifier can be selected in the range of 20A-1000A, preferably The range is 30A～900A, and the more preferred range is 50A～850A; the double-pulse forward pulse time output by the pulse reverse power supply 300 can be selected in the range of 5ms～100ms, preferably in the range of 7ms～70ms, more preferably in the range of 10ms～50ms; The reverse pulse time can be selected in the range of 1ms-30ms, preferably in the range of 3ms-20ms, and more preferably in the range of 5ms-10ms.
其中，电解铜药水的正向电流密度可选范围2A/dm 2～70A/dm 2，优选范围5A/dm 2～60A/dm 2，更优选范围10A/dm 2～50A/dm 2；电解铜药水的反向电流密度可选范围5A/dm 2～170A/dm 2，优选范围10A/dm 2～160A/dm 2，更优选范围20A/dm 2～150A/dm 2。 Among them, the forward current density of the electrolytic copper potion can be selected in the range of 2A/dm 2 -70A/dm 2 , preferably in the range of 5A/dm 2 -60A/dm 2 , and more preferably in the range of 10A/dm 2 -50A/dm 2 ; The reverse current density of the liquid medicine can be selected in the range of 5A/dm 2 -170A/dm 2 , preferably in the range of 10A/dm 2 -160A/dm 2 , and more preferably in the range of 20A/dm 2 -150A/dm 2 .
进一步地，阳极板表面积与浸在每个电解铜药水槽中的引线框架材料的表面积比可选为5：1，优选为3：1，更优选为2：1；而阳极板可采用可溶性金属和非可溶性金属，也可采用在非可溶性阳极板表面电解贵金属的方法；阳极的形状可以片形和网状，也可以是异形，例如平板弯曲成圆弧形，或是网状弯曲成圆弧形，又例如在平面板上依据位置不同打孔的大小和分布也不相同的各种组合，为了满足阳极面积与阴极面积比5：1的要求，也可以将两种不同形状的阳极或两种以上进行组合而成。引线框架表面粗糙度算数平均值的可选范围0.05μm～5.0μm，优选为0.07μm～4.5μm，更优选为0.09μm～3.9μm。Further, the ratio of the surface area of the anode plate to the surface area of the lead frame material immersed in each electrolytic copper bath can be selected as 5:1, preferably 3:1, more preferably 2:1; and the anode plate can be made of soluble metal and insoluble metals, the method of electrolyzing precious metals on the surface of insoluble anode plates can also be used; the shape of the anode can be sheet-shaped, mesh-shaped, or special-shaped, for example, the flat plate is bent into an arc shape, or the mesh is bent into an arc Another example is various combinations of different sizes and distributions of holes on the flat plate according to different positions. A combination of more than one species. The optional range of the arithmetic mean value of the surface roughness of the lead frame is 0.05 μm to 5.0 μm, preferably 0.07 μm to 4.5 μm, and more preferably 0.09 μm to 3.9 μm.
根据本发明实施例的引线框架表面粗糙度的制造设备的其他结构和操作对于本 领域技术人员而言都是可以理解并且容易实现的，因此不再详细描述。Other structures and operations of the apparatus for manufacturing the surface roughness of the lead frame according to the embodiments of the present invention can be understood and easily realized by those skilled in the art, and thus will not be described in detail.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
尽管已经示出和描述了本发明的实施例，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。Although embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, The scope of the invention is defined by the claims and their equivalents.

Claims (11)

  1. 一种引线框架表面粗糙度的制造设备，其特征在于，按生产工艺顺序从前至后依次设置有：放料装置、清洗装置、电解铜装置和收料装置，所述放料装置能够对料盘上的引线框架材料进行放料；所述清洗装置能够对引线框架材料进行清洗，去除表面杂质；所述收料装置能够将处理好的引线框架材料进行收卷；所述电解铜装置能够通过脉冲逆向电解技术对引线框架材料的表面粗糙度进行调控，所述电解铜装置包括：A manufacturing equipment for the surface roughness of a lead frame, which is characterized in that, according to the production process sequence from front to back, a discharging device, a cleaning device, an electrolytic copper device and a receiving device are arranged in sequence, and the discharging device can The lead frame material is discharged; the cleaning device can clean the lead frame material to remove surface impurities; the receiving device can rewind the processed lead frame material; the electrolytic copper device can pass the pulse The surface roughness of the lead frame material is regulated by the reverse electrolysis technology, and the electrolytic copper device includes:
    脉冲逆向电源，所述脉冲逆向电源能够输出脉冲正、反向电流和正、反向脉冲时间；Pulse reverse power supply, the pulse reverse power supply can output pulse forward and reverse current and forward and reverse pulse time;
    电解铜工艺槽，所述电解铜工艺槽的数量为多个，所述引线框架材料可以从多个所述电解铜工艺槽穿过，所述引线框架材料不断向前移动形成移动路径；an electrolytic copper process tank, the number of the electrolytic copper process tanks is multiple, the lead frame material can pass through the plurality of the electrolytic copper process tanks, and the lead frame material continuously moves forward to form a moving path;
    电解铜药水，所述电解铜药水设在所述电解铜工艺槽内，所述引线框架材料能够浸在所述电解铜药水中。The electrolytic copper syrup is provided in the electrolytic copper process tank, and the lead frame material can be immersed in the electrolytic copper syrup.
  2. 根据权利要求1所述的引线框架表面粗糙度的制造设备，其特征在于，每个所述电解铜工艺槽内均设有两个电极板，两个所述电极板相对设置在所述引线框架材料的两侧，所述移动路径位于两个所述电极板之间。The manufacturing equipment for the surface roughness of the lead frame according to claim 1, wherein each of the electrolytic copper process tanks is provided with two electrode plates, and the two electrode plates are oppositely arranged on the lead frame. On both sides of the material, the moving path is located between the two electrode plates.
  3. 根据权利要求2所述的引线框架表面粗糙度的制造设备，其特征在于，电极板的表面积与浸在每个电解铜工艺槽中的所述引线框架材料的表面积比为5：1。The manufacturing equipment for the surface roughness of the lead frame according to claim 2, wherein the ratio of the surface area of the electrode plate to the surface area of the lead frame material immersed in each electrolytic copper process tank is 5:1.
  4. 根据权利要求3所述的引线框架表面粗糙度的制造设备，其特征在于，所述电极板的形状形成为片面、网状或者异形状，每个所述电解铜工艺槽内的两个电极板为相同形状或者不同形状的组合。The manufacturing equipment for the surface roughness of the lead frame according to claim 3, wherein the shape of the electrode plate is formed as one-sided, mesh or special shape, and the two electrode plates in each of the electrolytic copper process tanks The same shape or a combination of different shapes.
  5. 一种引线框架表面粗糙度的制造方法，采用权利要求1-4任一项所述的引线框架表面粗糙度的制造设备，通过脉冲逆向电解技术对引线框架表面粗糙度进行调控，其特征在于，包括以下步骤：A method for manufacturing the surface roughness of a lead frame, using the manufacturing equipment for the surface roughness of the lead frame according to any one of claims 1-4, and regulating the surface roughness of the lead frame by a pulse reverse electrolysis technique, characterized in that: Include the following steps:
    S1、分析测试引线框架表面粗糙度，计算得出引线框架表面粗糙度算数平均值；S1. Analyze and test the surface roughness of the lead frame, and calculate the arithmetic mean value of the surface roughness of the lead frame;
    S2、将引线框架材料从放料机导出，进入电解脱脂槽清洗，然后再进入酸活化槽清洗，得到清洁的引线框架材料；S2, export the lead frame material from the unwinder, enter the electrolytic degreasing tank for cleaning, and then enter the acid activation tank for cleaning to obtain clean lead frame material;
    S3、电解镀铜工段：根据电解铜表面粗糙度，确定脉冲逆向电源输出的脉冲正、反向电流和正、反向脉冲时间；S3. Electrolytic copper plating section: According to the surface roughness of electrolytic copper, determine the pulse forward and reverse current and forward and reverse pulse time output by the pulse reverse power supply;
    S4、将所述脉冲正、反向电流通过电极板施加在所述引线框架材料表面，并使施加在所述引线框架材料上的电流方向朝向电极板面；S4, applying the pulsed forward and reverse currents on the surface of the lead frame material through the electrode plate, and making the direction of the current applied on the lead frame material toward the electrode plate surface;
    S5、开启脉冲逆向电源，预热后，控制施加正反向脉冲电流和所述正、反向脉冲时间按引线框架材料的移动路径依次经过多个电解铜工艺槽的处理后得到产品所需引线框架表面粗糙度。S5. Turn on the pulse reverse power supply, and after preheating, control the application of forward and reverse pulse currents and the forward and reverse pulse times according to the movement path of the lead frame material, and then obtain the lead wires required for the product after being processed by a plurality of electrolytic copper process tanks in turn. Frame surface roughness.
  6. 根据权利要求5所述的引线框架表面粗糙度的制造方法，其特征在于，电解铜表面粗糙度＝产品所需引线框架材料表面粗糙度-引线框架材料表面粗糙度。The method for manufacturing the surface roughness of a lead frame according to claim 5, wherein the surface roughness of the electrolytic copper=the surface roughness of the lead frame material required for the product-the surface roughness of the lead frame material.
  7. 根据权利要求6所述的引线框架表面粗糙度的制造方法，其特征在于，所述电解铜表面粗糙度的算数平均值范围均为0.05μm～5.0μm。The method for manufacturing the surface roughness of the lead frame according to claim 6, wherein the arithmetic mean value of the surface roughness of the electrolytic copper is in the range of 0.05 μm to 5.0 μm.
  8. 根据权利要求5所述的引线框架表面粗糙度的制造方法，其特征在于，所述脉冲逆向电源输出的脉冲正向电流范围为5A～500A，所述脉冲逆向电源输出的反向电流范围为20A～1000A。The method for manufacturing the surface roughness of a lead frame according to claim 5, wherein the pulse forward current range output by the pulse reverse power supply is 5A-500A, and the reverse current range output by the pulse reverse power supply is 20A ~1000A.
  9. 根据权利要求5所述的引线框架表面粗糙度的制造方法，其特征在于，所述脉冲逆向 电源输出的脉冲正向脉冲时间可选范围为5ms～100ms；所述脉冲逆向电源输出的脉冲反向脉冲时间范围为1ms～30ms。The method for manufacturing the surface roughness of a lead frame according to claim 5, wherein the pulse forward pulse time output by the pulse reverse power supply can be selected in the range of 5ms to 100ms; the pulse reverse pulse output by the pulse reverse power supply The pulse time range is 1ms to 30ms.
  10. 根据权利要求5所述的引线框架表面粗糙度的制造方法，其特征在于，所述电解铜工艺槽内设有电解铜药水，所述电解铜药水需要满足所述脉冲逆向电源输出的脉冲正、反向电流密度使用范围。The method for manufacturing the surface roughness of a lead frame according to claim 5, wherein the electrolytic copper process tank is provided with an electrolytic copper potion, and the electrolytic copper potion needs to satisfy the pulse positive and negative pulse output from the pulse reverse power supply. Reverse current density usage range.
  11. 根据权利要求10所述的引线框架表面粗糙度的制造方法，其特征在于，脉冲正向电流密度范围为2A/dm 2～70A/dm 2，脉冲反向电流密度范围为5A/dm 2～170A/dm 2。 The method for manufacturing the surface roughness of a lead frame according to claim 10, wherein the pulse forward current density ranges from 2A/dm 2 to 70A/dm 2 , and the pulse reverse current density ranges from 5A/dm 2 to 170A. /dm 2 .
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