CN213570802U - Lead frame blister copper surface manufacture equipment - Google Patents
Lead frame blister copper surface manufacture equipment Download PDFInfo
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- CN213570802U CN213570802U CN202022491649.1U CN202022491649U CN213570802U CN 213570802 U CN213570802 U CN 213570802U CN 202022491649 U CN202022491649 U CN 202022491649U CN 213570802 U CN213570802 U CN 213570802U
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Abstract
The utility model discloses a lead frame blister copper surface manufacture equipment, include: at least one electrolytic copper process tank, wherein electrolytic copper liquid medicine is arranged in the electrolytic copper process tank, and the lead frame material is soaked in the electrolytic copper liquid medicine; the electrolytic copper process tank is provided with a channel which runs through along the running direction of the lead frame, the lead frame material horizontally passes through the channel, and the lead frame material continuously moves forwards to form a moving path; the anode plate is arranged in the electrolytic copper process tank; the cathode guide wheel is positioned at the channel opening and is oppositely arranged on two sides of the lead frame material; and the pulse reverse power supply can output pulse forward and reverse currents and forward and reverse pulse time to ensure that the lead frame material in the electrolytic copper liquid medicine is subjected to electrolytic action, so that the surface roughness of the lead frame material is changed. The electrolytic copper process of the equipment can replace a chemical liquid medicine coarsening process, and the uniformity of the thickness of an electrolytic copper film is improved.
Description
Technical Field
The utility model belongs to the technical field of continuous lead frame surface treatment makes, concretely relates to lead frame blister copper surface manufacture equipment.
Background
A precision integrated circuit packaged by a high-precision chip and a lead frame is an important core electronic product in the modern electronic information industry. The important functions of the lead frame are supporting the chip, protecting the internal components and connecting the external circuit, and the lead frame is a key material in the integrated circuit. With the rapid development of high and new technologies of electronic information, products develop towards miniaturization, multiple functions and intellectualization. Therefore, the lead frame material is being developed to have a finer lead pitch and a higher density. This places higher demands not only on the strength and conductivity of the lead frame material, but also on the processability of the material. For example, the lead frame material does not allow for scratching, peeling, oxidation, water marks, and color non-uniformity in appearance. Certain roughness is guaranteed on the surface of the lead frame material, however, the existing equipment cannot set the roughness of the surface of the lead frame material as required, and the accuracy is difficult to guarantee.
The manufacturing method of the lead frame material of the semiconductor integrated circuit adopts a photosensitive dry film hot pressing process on the surface of the lead frame material, which has become the mainstream. In recent years, with the high integration of semiconductors, demands for the surface quality of lead frame materials have been increasing due to the miniaturization of semiconductor package substrates and printed wiring board circuits. That is, the surface roughness of the lead frame material is an important factor affecting the dry film hot pressing process, and is also a key factor for whether the packaging process can be tightly combined with the packaging material. Therefore, it is an important issue to research and develop a cleaning production apparatus for the surface of the lead frame material, and particularly, it is an urgent issue to research and develop a manufacturing method and a manufacturing apparatus for the surface roughness of the lead frame material.
Patent document 1(CN 101864586B): the method is characterized in that after a metal material is pretreated by degreasing and acid washing and dried, the upper surface and the lower surface of the metal material are processed by hot pressing by photosensitive films, ultraviolet light passes through a die with a special lead frame pattern to expose the lead frame adhered with the photosensitive films, and the lead frame material is processed by a developing solution and then is etched and electroplated to prepare the lead frame material. However, this method has a drawback that the photosensitive film is not firmly bonded to the surface of the metal material, resulting in a problem that the plating solution is dipped into the gap between the photosensitive film and the metal to be plated and a minute portion of the etched area is not etched or not etched at all.
Patent document 2(JP 6406711B 2): a method for manufacturing a chip lead frame is described, the first plating layer step including sequentially forming a Ni plating layer, a Pd plating layer and an Au plating layer at predetermined positions on the front and back surfaces of a metal plate. The second plating layer is preferably a method of forming an Ag plating layer. However, the manufacturing method is a sheet type production process, and has the defects of low production efficiency and uneven product quality; in addition, the cleaning process flow of the metal material is not described herein.
Patent document 3(JP 4431860B 2): methods for roughening copper and copper alloy material surfaces to provide lead frame materials using a surface roughening agent hydrogen peroxide and sulfuric acid system are described. However, in recent years, due to the miniaturization of the etching pattern, the requirement for the hot press bonding strength between the surface of the metal material and the photosensitive dry film has been increasing, and the bonding strength of the metal surface provided by the surface roughening agent method has been insufficient. In addition, the copper surface roughened by this method has defects that are very susceptible to oxidation.
Patent document 4(JP 1997-298265A): a technique of forming a plurality of nickel plating layers of different densities on the surface of a lead frame to improve the bonding strength with an encapsulating material is proposed. The lower layer of the multi-layered nickel plating layer is formed of a nickel plating layer forming a smooth and dense layer, and the upper layer thereof is formed of a pulse nickel plating layer that gives priority to crystal growth in the vertical direction. However, in this multi-plating technique, sufficient surface roughness of the upper nickel plating layer cannot be obtained, and the bonding force with the sealing material is weak. Therefore, this technique has a drawback that the bonding strength with the encapsulating material is insufficient.
Patent document 5(JP 2004-: a technique for forming a plurality of different metal plating layers on the surface of a lead frame to improve the bonding strength with packaging materials is provided. Sequentially plating two nickel plating layers with different thicknesses under two different nickel plating conditions to enable the total thickness of the nickel plating layers to be 1.0 mu m, then plating a palladium plating layer with the thickness of 0.03 mu m on the nickel plating layers, and further plating a gold plating layer with the thickness of 0.01 mu m on the palladium plating layer; although the lead frame with proper surface roughness is obtained by adopting the pulse reverse electrolysis technology in the forming process of the second layer of nickel, the bonding strength between the lead frame and the packaging material can meet the requirements of various product specifications. However, gold electrolytically precipitated on the surface is a noble metal with extremely high chemical stability, and does not oxidize to coarsen the surface, so that the bonding performance with the packaging material is reduced; meanwhile, the production process of the lead frame with various metal coatings has high requirements, the used noble metal is expensive, the product cost is increased, and the production is difficult to realize in actual production.
Patent documents 1 to 5 provide various lead frame production methods, however, document 1 has a defect that the photosensitive dry film and the surface of the lead frame material are bonded loosely, so that the plating solution is immersed into the gap between the photosensitive film and the metal to be plated, and a minute portion of the etched area is not etched or not etched at all; the document 2 has the defects of low production efficiency and uneven product quality; in addition, the cleaning process flow of the metal material is not described; document 3 discloses that the method of roughening the surface with a chemical solution provides insufficient bonding strength on the metal surface, and the roughened surface of the lead frame material has a defect of being very easily oxidized. Document 4 discloses that sufficient surface roughness cannot be obtained in a multi-plating technique, so that the bonding force with a packaging material is weak; therefore, this technique has a drawback that the bonding strength with the encapsulating material is insufficient. In document 5, the bonding performance of the lead frame with different noble metal coatings and the packaging material is reduced, the production process requirement is high, the cost of the product is increased due to the expensive noble metal, and the method is difficult to realize in actual production and manufacturing.
The problems are important problems to be solved urgently in the manufacturing industry of the surface treatment production line of the lead frame. The bandwidth of the lead frame material is generally above 100mm, even 300-400mm, and the bandwidth of the terminal material is generally below 20mm, and the surface treatment of the lead frame material with a higher width has higher difficulty in ensuring the uniform film thickness. Firstly, the following requirements are met in the continuous production of the lead frame material surface treatment production line: 1) the surface of the lead frame material is firmly combined with the photosensitive dry film; 2) the surface roughness of the lead frame material is required to meet the requirement of firm hot-pressing combination with the packaging material, so that the quality and the production efficiency of integrated circuit products are ensured; 3) the defect of uneven quality of lead frame products is overcome; 4) the surface roughness of the lead frame material is required to meet the requirement of firm hot-pressing combination with the packaging material, and the thickness of an electrolytic copper film on the surface of the lead frame material is required to be homogenized; 5) the defects that the hot-pressing bonding strength of the lead frame surface and the photosensitive dry film in the chemical liquid medicine coarsening process is insufficient and the material surface is very easy to oxidize need to be overcome. 6) Lead frame products having excellent corrosion resistance are to be provided.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least.
Therefore, the utility model provides a lead frame blister copper surface manufacture equipment, this lead frame blister copper surface manufacture equipment have advantages such as production efficiency height, product quality height, yield height.
According to the utility model discloses lead frame blister copper surface manufacture equipment, include: at least one electrolytic copper process tank, wherein electrolytic copper liquid medicine is arranged in the electrolytic copper process tank, and the lead frame material is soaked in the electrolytic copper liquid medicine; the electrolytic copper process tank is provided with a channel which runs through along the running direction of the lead frame, the lead frame material horizontally passes through the channel, and the lead frame material continuously moves forwards to form a moving path; the anode plate is arranged in the electrolytic copper process tank; the cathode guide wheels are positioned at the channel openings and are oppositely arranged on two sides of the lead frame material;
the pulse reverse power supply can output pulse forward and reverse currents and forward and reverse pulse time to enable the lead frame materials in the electrolytic copper liquid medicine to generate electrolysis, and the surface roughness of the lead frame materials is changed.
According to the utility model discloses lead frame blister copper surface manufacture equipment implements electrolytic copper technology through the reverse electrolysis technique of pulse, and the thick homogeneity of electrolytic copper membrane of the lead frame material of this equipment production obtains improving, has strengthened the bonding strength of lead frame material surface and sensitization dry film, not only has excellent corrosion resistance, and with packaging material's excellent adhesive force, product quality obtains the guarantee moreover. The electrolytic copper process of the equipment can replace a chemical liquid medicine coarsening process, and has the advantages of high production efficiency, high product quality, high yield and the like.
According to the utility model discloses an embodiment, the quantity of anode plate is two, two the anode plate sets up relatively the both sides of lead frame material, the removal route is located two between the anode plate.
According to one embodiment of the present invention, the periphery of each of the anode plates is formed as electrolysis regions spaced apart in the longitudinal direction of the moving path.
According to one embodiment of the present invention, the surface area ratio of the anode plate to the lead frame material immersed in each electrolytic copper process tank is 5: 1.
according to one embodiment of the present invention, the anode plates are formed in a sheet, net or irregular shape, and the two anode plates in each electrolytic copper process tank have the same shape or a combination of different shapes.
According to the utility model discloses an embodiment, be equipped with pulse power supply positive output and pulse power supply negative pole output on the pulse reverse power supply, pulse power supply positive output with the anode plate is connected, pulse power supply negative pole output with the negative pole guide pulley is connected.
According to the utility model discloses an embodiment, still be equipped with pulse forward current on the pulse reverse power and set up end and pulse reverse current and set up the end, be in electrolysis copper liquid medicine lead frame material under the pulse forward current condition, lead frame material surface can the electroanalysis go out copper, be in electrolysis copper liquid medicine lead frame material under the pulse reverse current condition, lead frame material surface can the electrolysis strip copper.
According to the utility model discloses an embodiment, still be equipped with forward pulse time on the pulse reverse power and set up end and reverse pulse time and set up the end.
According to an embodiment of the utility model, be equipped with electrolytic copper liquid medicine in the electrolytic copper process groove, electrolytic copper liquid medicine needs to satisfy the pulse of pulse reverse power output just, reverse current density application range.
According to the utility model discloses an embodiment, lead frame blister copper surface manufacture equipment still includes: and the supporting wheel is arranged in the electrolytic copper process tank and can be contacted with the lower surface of the lead frame material.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a structural diagram of a lead frame blister copper surface manufacturing apparatus according to an embodiment of the present invention;
FIG. 2 is a waveform diagram of the pulse reverse power output of the lead frame blister copper surface manufacturing equipment according to the embodiment of the invention;
fig. 3 is a schematic view of a continuous apparatus of a lead frame blister copper surface manufacturing apparatus according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a continuous lead frame material implementing 1 a lead frame blister copper surface fabrication apparatus according to an embodiment of the present invention;
fig. 5 is a partial structure diagram of a lead frame blister copper surface manufacturing apparatus according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a continuous lead frame material implementing 2 an apparatus for manufacturing a blister copper surface of a lead frame according to an embodiment of the present invention;
fig. 7 is a partial structure diagram of a manufacturing apparatus for surface roughness of a chip lead frame material of a lead frame blister copper surface manufacturing apparatus according to an embodiment of the present invention;
fig. 8 is a schematic diagram of a chip lead frame material of embodiment 3 of the lead frame blister copper surface manufacturing apparatus according to an embodiment of the present invention.
Reference numerals:
lead frame blister copper surface fabrication apparatus 1000;
a leadframe material 100;
a cathode guide wheel 13; cathode conduction at inlet 13 a; cathode conduction 13b at the outlet;
a support wheel 20;
an electrolytic copper process tank 30; an anode plate 40; an upper anode plate 40 a; a lower anode plate 40 b;
a pulsed reverse power supply 300;
a pulse forward current setting terminal 311; a pulsed reverse current set terminal 312;
a forward pulse time setting terminal 313; a reverse pulse time setting terminal 314;
a pulsed power supply positive output terminal 315; a pulsed power supply negative output 316.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The lead frame blister copper surface manufacturing apparatus 1000 according to an embodiment of the present invention is described in detail below with reference to the drawings.
As shown in fig. 1 to 3, the apparatus 1000 for manufacturing a blister copper surface of a lead frame according to an embodiment of the present invention includes: at least one electrolytic copper process tank 30, an anode plate 40, a cathode guide wheel 13 and at least one pulse reverse power supply 300.
Specifically, according to the device 1000 for manufacturing the blister copper surface of the lead frame in the embodiment of the present invention, the electrolytic copper solution is disposed in the electrolytic copper process tank 30, and the lead frame material is immersed in the electrolytic copper solution; the electrolytic copper process tank 30 is provided with a through channel extending along the running direction of the lead frame, the lead frame material horizontally passes through the channel, and the lead frame material continuously moves forwards to form a moving path; the anode plate 40 is positioned in the electrolytic copper process tank 30; the cathode guide wheels 13 are positioned at the passage opening and are oppositely arranged on two sides of the lead frame material; the pulse reverse power supply 300 is connected with the electrolytic copper process tank 30, and the pulse reverse power supply 300 can output pulse forward and reverse currents and pulse forward and reverse time to enable the lead frame material in the electrolytic copper liquid medicine to generate electrolysis, so that the surface roughness of the lead frame material is changed.
In other words, according to the utility model discloses lead frame blister copper surface manufacture equipment 1000 mainly comprises electrolytic copper technology groove 30, anode plate 40, negative pole guide pulley 13 and pulse reverse power supply 300, and pulse reverse power supply 300 is connected with electrolytic copper technology groove 30, and continuous lead frame material horizontal transport to electrolytic copper technology groove 30 in, continuous lead frame material can soak in the electrolytic copper liquid medicine in electrolytic copper technology groove 30 and wear out from the passageway in electrolytic copper technology groove 30, constantly moves forward and forms the moving path. When the lead frame material is in the electrolytic copper liquid medicine, the pulse reverse power supply 300 sets pulse forward and reverse currents and forward and reverse pulse time according to the requirement of surface roughness treatment of the lead frame material, and the pulse forward and reverse currents and the forward and reverse pulse time output by the pulse reverse power supply 300 enable the surface of the lead frame material in the electrolytic copper liquid medicine to generate electrolysis, so that the surface roughness of the lead frame material is changed. Specifically, the applied forward and reverse pulse currents and the forward and reverse pulse times are different, so that the electrolytic action on the surface of the lead frame material is different.
It should be noted that, the pulse reverse power source 300 is used with the electrolytic copper process tank 30, and may be multiple, for example, seven pulse reverse power sources 300 correspond to seven electrolytic copper process tanks 30, and the lead frame material is sequentially subjected to surface treatment by the seven electrolytic copper process tanks 30. Each pulse reverse power source 300 can distribute the surface roughness of the lead frame material according to requirements, and pulse forward and reverse currents and pulse forward and reverse time are set according to the surface roughness of the lead frame material corresponding to each pulse reverse power source 300. The cathode guide wheel 13 comprises, at the inlet, a cathode conductor 13a and, at the outlet, a cathode conductor 13 b.
In addition, in the pulse reverse copper electrolysis process, Cu crystal particles having a large particle size are easily formed. When the reverse pulse current is applied, the smaller the grain size of the crystal grains is, the higher the electrolytic stripping priority is; this is because the smaller the grain size of the crystal grains, the higher the surface free energy becomes, and the more unstable the surface free energy becomes. As shown in fig. 3, when a forward pulse current and a reverse pulse current are alternately and repeatedly applied by using such a current waveform periodically reversing the polarity, a blister copper surface having large grains is formed. Therefore, a strong bonding effect is generated between the lead frame and the encapsulating material, and thus a strong adhesive property of the encapsulating material can be obtained.
That is, when the copper electrolysis process using the pulse reverse power 300 is performed, the metal copper is precipitated more rapidly in the epitaxial growth of the crystal than in the generation of the crystal nuclei, increasing the grain size and surface roughness of the Cu plating layer. Due to this irregular, rough surface morphology, a strong adhesion effect is created between the leadframe material and the encapsulation material, and the encapsulation material obtained has strong adhesion properties. When a forward pulse current and a reverse pulse current are alternately and repeatedly applied to a current waveform of periodically reverse polarity, the mixing ratio of strain and impurities in the electrolytically deposited copper layer due to hydrogen absorption is small in the conventional direct current analysis. Therefore, defects such as pinholes in the electrolytic deposition layer are few, and excellent corrosion resistance can be obtained. By adopting the manufacturing method and the manufacturing equipment for the surface roughness of the lead frame material to replace a chemical liquid medicine coarsening process, the production efficiency of the surface treatment of the lead frame can be greatly improved, and the product quality is greatly improved; the range of the lead frame in subsequent practical application is enlarged and the product quality qualification rate is improved by adjusting and controlling the surface roughness of the lead frame material.
It should be noted that the lead frame material passes through the electrolytic copper process tank 30 in a horizontal conveying manner, and because the bandwidth of the lead frame material is much larger than that of the terminal material, the vertical conveying cannot ensure the stability of the lead frame material in the operation process, thereby affecting the treatment of the surface roughness. The horizontal conveying mode is more stable, and the surface roughness treatment is convenient to carry out.
From this, according to the utility model discloses lead frame blister copper surface manufacture equipment 1000 implements the electrolytic copper technology through the reverse electrolysis technique of pulse, and the thick homogeneity of electrolytic copper membrane of the lead frame material of this equipment production obtains improving, has strengthened the bonding strength of lead frame material surface and sensitization dry film, not only has excellent corrosion resistance, with packaging material's excellent adhesive force, and product quality is ensured moreover. The electrolytic copper process of the equipment can replace a chemical liquid medicine coarsening process, and has the advantages of high production efficiency, high product quality, high yield and the like.
According to an embodiment of the present invention, the number of the anode plates 40 is two, two anode plates 40 are oppositely disposed on two sides of the lead frame material, and the moving path is located between the two anode plates 40. The electrolytic copper process tank 30 can be provided in a plurality of numbers, a channel running through along the running direction of the lead frame material is arranged on the electrolytic copper process tank 30, and the lead frame material can penetrate out of the electrolytic copper process tank 30. Under the action of the pulse reverse power supply 300, electrolysis occurs in the electrolytic copper process tank 30, the two anode plates 40 are oppositely arranged on the two sides of the lead frame material, so that the two sides of the lead frame material can be electrolyzed, and copper can be separated out or stripped from the surface of the lead frame material according to different current directions.
Further, the periphery of each anode plate 40 is formed as an electrolytic region disposed at intervals in the length direction of the moving path. In the electrolytic process tank, under the action of electrolytic copper liquid medicine and pulse positive and reverse currents, the surface of the lead frame material generates electrolytic action, copper can be precipitated or stripped from the surface of the lead frame material, and an electrolytic area is formed around each anode plate 40.
Preferably, the surface area of the anode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5: 1, preferably 3: 1, more preferably 2: 1. in the electrolytic copper process tank 30, the anode plate 40 is an anode, the lead frame material is a cathode, that is, the area ratio of the anode material to the cathode material is 5: 1, in the presence of a catalyst.
The anode plate 40 is also an electrode plate, and the anode plate 40 includes an upper anode plate 40a and a lower anode plate 40 b.
Alternatively, the anode plates 40 are shaped as a sheet, a net, or a profile, and the two anode plates 40 in each electrolytic copper process tank 30 are the same shape or a combination of different shapes. The anode plate 40 can adopt a combination of soluble metal and non-soluble metal, and can also adopt a method of electrolyzing noble metal on the surface of the anode plate 40 on the non-soluble anode plate 40. The anode plate 40 may be a flat plate bent into a circular arc shape, or a mesh bent into a circular arc shape, as long as the ratio of the surface area of the anode plate 40 to the surface area of the lead frame material immersed in each electrolytic copper process tank 30 is 5: 1, the required result. That is, the shapes of the two electrode plates 40 may be combinations of different shapes, one may be a sheet, the other is a special shape, or one may be a net, the other is a sheet, the size, shape and combination thereof can be set according to actual requirements, and the applicability is high. Through the regulation of the size and the shape of the anode, the area ratio of the anode material to the cathode material can be satisfied as 5: 1, the uniformity of the thickness of the electrolytic copper film on the surface of the lead frame material is improved, the product quality is guaranteed, and the production efficiency of the lead frame surface treatment production line is improved.
According to the utility model discloses an embodiment is equipped with pulse source positive output 315 and pulse source negative output 316 on the pulse reverse power supply 300, and pulse source positive output 315 is connected with anode plate 40, and pulse source negative output 316 is connected with cathode guide wheel 13.
Further, the pulse reverse power supply 300 is further provided with a pulse forward current setting terminal 311 and a pulse reverse current setting terminal 312, copper can be electrically desorbed from the surface of the lead frame material in the electrolytic copper chemical solution under the pulse forward current condition, and copper can be electrolytically stripped from the surface of the lead frame material in the electrolytic copper chemical solution under the pulse reverse current condition. That is, in the pulse reverse electrolytic copper process, the current applied to the lead frame outputted from the pulse reverse power source 300 is periodically changed. When a pulse reverse power source 300 applies a forward pulse current, copper is electrically analyzed on the surface of the lead frame, and a pulse forward waveform is presented; when a pulse reverse power source 300 applies a reverse pulse current, copper is electrolytically stripped on the surface of the lead frame material, and a pulse reverse waveform is presented. After the pulse reverse power supply 300 is repeatedly and periodically changed, copper is continuously precipitated and stripped from the surface of the lead frame material, and the amount of the precipitated copper and the stripped copper on the surface of the lead frame material can be controlled by setting different forward and reverse pulse time, so that the thickness of a copper film is changed.
Specifically, when the forward pulse time is longer, the surface of the lead frame material is separated with more copper, and the thickness of the copper film is relatively thicker, and when the reverse pulse time is longer, the surface of the lead frame material is stripped with more copper, and the thickness of the copper film becomes thinner. The thickness uniformity of the Cu plating layer can be realized, and the difference of the surface roughness of the lead frame material can be realized according to different requirements. While electrolytically peeling copper by a reverse pulse current, hydrogen atoms absorbed in the Cu plating layer on the surface of the lead frame can be removed, brittleness of the Cu plating layer due to hydrogen atoms contained in the copper layer is eliminated, and workability such as bending is improved. In some embodiments of the present invention, the pulse reverse power source 300 further comprises a forward pulse time setting terminal 313 and a reverse pulse time setting terminal 314.
According to an embodiment of the present invention, the electrolytic copper solution is disposed in the electrolytic copper process tank 30, and the electrolytic copper solution is required to satisfy the range of application of the pulse forward and reverse current densities outputted by the pulse reverse power supply 300. Optionally, the pulse forward current density is in the range of 2A/dm2～70A/dm2The range of pulse reverse current density is 5A/dm2～170A/dm2. The output current A of the pulse reverse power supply 300 is equal to the current density A/dm of the electrolytic copper liquid medicine2X material surface area dm2(ii) a The preferred range of the pulse forward current density is 5A/dm2～60A/dm2More preferably in the range of 10A/dm2～50A/dm2(ii) a The preferred range of pulse reverse current density is 10A/dm2～160A/dm2More preferably in the range of 20A/dm2～150A/dm2。
As shown in fig. 7, the lead frame blister copper surface manufacturing apparatus 1000 may further include a support wheel 20, wherein the support wheel 20 is disposed in the electrolytic copper processing tank 30 and can contact with the lower surface of the lead frame material. That is, the support wheels 20 are disposed intermediate the lower anode plate 40b and the leadframe material. Because the general bandwidth of the lead frame material is more than 100mm, the supporting wheel 20 can effectively support the lead frame material with wider bandwidth, and the lead frame material can stably run when being conveyed, so that the effect of surface roughness treatment on the lead frame material is ensured.
To sum up, according to the utility model discloses lead frame blister copper surface manufacture equipment 1000 can guarantee the smooth operation of lead frame material of bandwidth broad, and roughness treatment is carried out to lead frame material surface to the periodic change of rethread pulse reverse power supply 300, carries out roughness's change under the even prerequisite of assurance copper film thickness. The thickness uniformity of the electrolytic copper film of the lead frame material produced by the equipment is improved, the bonding strength between the surface of the lead frame material and the photosensitive dry film is enhanced, the lead frame material has excellent corrosion resistance and excellent adhesive force with a packaging material, and the product quality is guaranteed. The manufacturing equipment for the surface roughness of the lead frame has the advantages of high production efficiency, high product quality, high yield and the like.
The present invention will be more fully understood by those skilled in the art from the following examples and comparative examples, but the scope of the present invention is not limited thereto.
[ METAL MATERIAL ]
The lead frame material of the utility model can be a metal material, and the metal material can be an alloy consisting of any one selected monomer from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc or any two or more selected monomers from copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium and zinc; or iron and iron alloy thereof, and various stainless steel materials; all metallic materials may be continuous strip or continuous lead frame materials. In addition, all the materials with the metal foil attached on the surface can be subjected to surface roughness production and processing by the manufacturing method and the manufacturing equipment of the utility model; for example, various materials with a metal film attached to one or both surfaces of a plastic film can be used to produce the desired surface roughness material;
the optional width range of the metal material is 10 mm-1000 mm; the selectable thickness range of the metal material is 0.03 mm-0.30 mm;
the arithmetic mean value of the surface roughness of the metal material can be selected from 0.1-10.0 μm.
[ PHOTOSENSITIVE DRY FILM ]
And carrying out hot pressing treatment on the surface of the photosensitive dry film and the surface of the metal material to obtain the film-coated metal material with firm adhesion and uniform surface quality. The thickness of the photosensitive dry film raw material can be selected in a range: 20-60 μm; optional range of surface roughness of photosensitive dry film raw materials: 0.75 to 1.87 μm; the optional range of the thickness of the material after the metal material is attached to the photosensitive dry film is as follows: 0.05-0.36 mm; optional range of roughness of one side of the photosensitive dry film: 0.85-2.35 μm;
[ electrolytic copper chemical liquid ]
The electrolytic copper liquid medicine used can meet the following requirements: optional range of forward current density 2A/dm2～70A/dm2(ii) a Reverse current density selectable range 5A/dm2～170A/dm2(ii) a The electrolytic copper liquid can electrically resolve copper on the surface of the lead frame material under the condition of forward current and can electrolytically strip the copper on the surface of the lead frame material under the condition of reverse current.
Example 1
(1) Analytical determination of surface roughness
As shown in FIG. 4, the raw material copper strip C19400 has a width of 350mm and a thickness of 0.12 mm. The roughness Ra is 0.08-0.15 mu m by using a shape measuring detector VK-X series analysis test, and the average value of multiple groups of data is calculated to be 0.11 mu m.
(2) According to the hot-pressing film-sticking requirement of the selected photosensitive dry film, the surface roughness Ra of the metal material is 1.3-1.5 mu m.
(3) The surface roughness Ra of the material manufactured by the pulse reverse electrolysis technology is (1.2-1.5 mu m) - (0.08-0.15 mu m), namely the range Ra of the production processing roughness is 1.12-1.35 mu m.
(4) According to the production and processing requirements of products, the metal material is subjected to double-sided roughness surface treatment.
(5) Manufacture of surface roughness of lead frame material
As shown in fig. 1 and 3, the metal raw material is first led out from the feeding machine and passed through the feeding guide wheel, and then enters the electrolytic degreasing tank to be cleaned and remove grease and the like on the surface of the metal material, and then enters the acid activation tank to be cleaned and removed of rust spots, oxides and the like on the surface of the metal material, so that a clean metal material is obtained.
Then, an upper anode plate 40a and a lower anode plate 40b are arranged on the upper and lower sides of the lead frame material in the first electrolytic copper process tank 30 a; connected to the anode output of the pulsed reverse power supply 310; the cathode conductor 13a at the inlet and the cathode conductor 13b at the outlet are connected to the cathode output of the pulsed reverse power supply 310. The second electrolytic copper area to the seventh copper plated area are connected in the same manner as the first electrolytic copper area. As shown in fig. 1 and 3.
As shown in Table 1, the width of the raw material copper strip is 350mm, the surface area is large, the difference between the surface roughness Ra 1.30-1.50 μm of the lead frame material required by the product and the raw material roughness Ra 0.08-0.15 μm is large, and the surface roughness is preferably treated by 7-unit electrolytic copper process; setting the total amount of the surface roughness of the lead frames manufactured by the seven pulse reverse power supplies 310 to 370 to be 21 equal parts, wherein the surface roughness of each equal part is 0.06-0.07 mu m; for example, under the experimental conditions No.1, 15 parts of the pulse reverse power source 310, 1 part of each of 6 pulse reverse power sources 300 of the pulse reverse power sources 320 to 370, and the surface roughness of the material after being processed by each pulse reverse power source 300 is within the range of Ra 0.92 to 1.07 μm.
The running speed of the lead frame material surface roughness manufacturing line is preferably 1.5 m/min. When the condition No.7 in Table 1 is adopted by the 7 pulse reverse power supplies 300, the roughness ranges of the 7 electrolytic copper layers are all 0.18-0.21 mu m, namely the forward and reverse pulse current and the forward and reverse pulse time conditions set by the 7 pulse reverse power supplies 300 are the same, the obtained surface roughness and density difference from the lowest layer to the surface layer is small, and the surface characteristics of the lead frame material are uniform and consistent.
When the condition No.1 is adopted, the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current needs to be smaller and the set value of the reverse pulse time needs to be shorter; the obtained electrolytic copper has larger roughness and poorer density; then the set conditions of the six pulse reverse power supplies 320 to 370 are smaller forward pulse current and longer forward pulse time compared with condition No.7, and the set value of the reverse pulse current is slightly larger compared with condition No.7 and the reverse pulse time is much shorter than condition No. 7; therefore, the obtained surface roughness reaches the product specification, and the surface compactness is better compared with the condition No. 7.
When the conditions No.2 to No.6 are adopted, the surface roughness of the lead frame material meets the requirement, and the compactness range is between the conditions No.1 and No. 7.
When the condition No.13 is adopted, the six pulse reverse power supplies 310 to 360 need to set a smaller forward pulse current and a longer forward pulse time, and set a larger reverse pulse current and a shorter reverse pulse time; the obtained copper plating layer has small roughness and good compactness. The last pulsed reverse power source 370 was set for a larger forward pulse current and a longer forward pulse time, and for a larger reverse pulse current and a shorter reverse pulse time, so the resulting surface roughness achieved the product specification and was less dense than condition No. 7.
When the conditions No.8 to No.12 are adopted, the surface roughness of the lead frame material is between the conditions No.7 and No.13 while the requirement is met.
The surface roughness of the lead frame is analyzed and tested by a shape measuring detector VK-X series. The raw copper material of the lead frame is used as a raw material for subsequent silver plating, and a dense and firm bonding layer which is required to be formed with the silver plating layer is the standard for judging the surface specification of the lead frame.
And verifying the surface roughness and the density effect of the lead frame material by using a photosensitive dry film.
After the brand and the model of the photosensitive dry film are selected, the roughness Ra is 1.3-1.85 mu m through a shape measuring detector VK-X series analysis test, and the average Ra of a plurality of groups of data is 1.58 mu m; the surface roughness specification range of the metal material manufactured by the method and the metal material manufactured by the method are 1.57-1.93 mu m after hot pressing by a film pressing machine. By using the specification range as an inspection standard, the metal material produced and manufactured under various conditions and the product subjected to the photosensitive dry film pressing and heating are detected by a shape measurement detector VK-X, so that the optimal manufacturing method of the surface roughness of the metal material and the optimal setting conditions of the pulse reverse power supply 300 can be determined.
Thus, the most preferable condition in this embodiment is No. 2.
Example 2
(1) Analytical determination of surface roughness
As shown in fig. 6, the rolled lead frame has a width of 115mm, a thickness of 0.15mm, and a metal raw material of C14410). The roughness Ra is 0.12-0.21 mu m by using a shape measuring detector VK-X series analysis test, and the average value of multiple groups of data is 0.17 mu m.
(2) According to the requirements of the subsequent silver plating process, the required range of the surface roughness of the lead frame is 2.5-3.7 mu m;
(3) the surface roughness Ra of the product is (2.5-3.7 μm) - (0.12-0.21 μm), namely the production processing roughness Ra is 2.38-3.49 μm.
(4) And (3) carrying out roughness surface treatment on one side of the lead frame material according to production and processing requirements.
(5) Lead frame surface treatment
As shown in fig. 1, the metal raw material is first led out from the feeding machine and passed through the feeding guide wheel, and then enters the electrolytic degreasing tank to be cleaned and remove grease and the like on the surface of the metal material, and then enters the acid activation tank to be cleaned and removed of rust, oxide and the like on the surface of the metal material, so that a clean metal material is obtained.
Then, in the first electrolytic copper process tank 30a, the upper and lower sides of the lead frame material are provided with an upper anode plate 40a and a lower anode plate 40b which are connected with the anode output of the pulse reverse power supply 310; the cathode conductor 13a at the inlet and the cathode conductor 13b at the outlet are connected to the cathode output of the pulsed reverse power supply 310. The second to sixth electrolytic copper areas are connected in the same manner as the first electrolytic copper areas, as shown in fig. 5.
As shown in Table 2, the width of the rolled lead frame material is 115mm, the surface area is less than one third compared with the embodiment 1, and 6 units of electrolytic copper process is selected for surface roughness treatment; the surface roughness of the material required by the product is Ra2.38-3.49 mu m; setting the total amount of the surface roughness of the manufactured metal of six pulse reverse power supplies 310 to 360 to be 18 equal parts, wherein the surface roughness of each equal part is 0.132 to 0.193 mu m; for example, under the experimental conditions No.1, 11 parts of the pulse reverse power source 310, 3 parts of the pulse reverse power source 320, 0.396-0.581 μm of the surface roughness range Ra 1.454-2.132 μm after treatment, 1 part of each of 4 pulse reverse power sources 300 of the pulse reverse power sources 320-360, and the surface roughness of the material satisfies Ra 0.132-0.193 μm after treatment by each pulse reverse power source 300.
The running speed of the lead frame material surface roughness manufacturing production line is preferably 2.0 m/min; when the condition No.9 in Table 2 is adopted by the 6 pulse reverse power supplies 300, the roughness ranges of the 6 electrolytic copper layers are all 0.396-0.581 mu m, namely the forward and reverse pulse current and the forward and reverse pulse time conditions set by the 6 pulse reverse power supplies 300 are the same, the obtained surface roughness and density difference from the lowest layer to the surface layer is small, and the surface characteristics of the lead frame material are uniform and consistent.
When the condition No.1 is adopted, the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current needs to be smaller and the set value of the reverse pulse time needs to be shorter; the obtained electrolytic copper has larger roughness and poorer density; the conditions required to be set by the pulse reverse power supply 320 are the same as those adopted by the 6 pulse reverse power supplies 300 in the case of No.9, and then the setting conditions of the four pulse reverse power supplies 330 to 360 are smaller forward pulse current and longer forward pulse time compared with the condition of No.9, while the setting value of the reverse pulse current is slightly larger compared with the condition of No.9, and the reverse pulse time is much shorter than that of No. 9; therefore, the obtained electrolytic copper has better surface compactness compared with the condition No.9 while the surface roughness meets the specification requirement of the product.
When the conditions of No.2, No.3, No.4, No.5, No.6, No.7 and No.8 are adopted, the surface roughness of the lead frame material is achieved, and the compactness is between No.1 and No. 9.
When the condition No.17 is adopted, the four pulse reverse power supplies 310 to 340 need to set a smaller forward pulse current and a longer forward pulse time, and set a larger reverse pulse current and a shorter reverse pulse time; the obtained copper plating layer has small roughness and good compactness. The conditions required to be set by the pulse reverse power supply 350 are the same as those adopted by the 6 pulse reverse power supplies 300 in the condition of No.9, and the setting conditions of the last pulse reverse power supply 360 are larger forward pulse current and longer forward pulse time, and larger reverse pulse current and shorter reverse pulse time are set, so that the obtained surface roughness reaches the product specification and is poorer in surface compactness compared with the condition of No. 9.
When the conditions No.8 to No.16 are adopted, the surface roughness of the lead frame material is between the conditions No.9 and No.17 while the requirement is met.
Thus, the most preferable condition in this embodiment is No. 3.
Example 3
(1) Analytical determination of surface roughness
As shown in FIG. 8, the sheet type lead frame has a width of 105mm and a thickness of 0.20mm, and the metal raw material is C14410. The roughness Ra is 0.15-0.23 μm by using a shape measuring detector VK-X series analysis test, and the average value Ra of a plurality of groups of data is 0.19 μm.
(2) According to the requirement of the subsequent silver plating process, the required range of the surface roughness of the lead frame is Ra of 3.5-4.9 μm.
(3) The surface roughness Ra manufactured by the pulse reverse electrolysis technology is (3.5-4.9 mu m) - (0.15-0.23 mu m), namely the production processing roughness Ra is 3.35-4.67 mu m;
(4) according to the production and processing requirements, carrying out roughness surface treatment on one side of the sheet lead frame;
(5) surface treatment of sheet type lead frame
As shown in fig. 1, firstly, the lead frame material is led out from the feeding machine and passes through the feeding guide wheel, and then enters the electrolytic degreasing tank to be cleaned and remove grease and the like on the surface of the metal material, and then enters the acid activation tank to be cleaned and removed of rust spots, oxides and the like on the surface of the metal material, so as to obtain the clean metal material.
Then, in the first electrolytic copper process tank 30a, the upper and lower sides of the lead frame material are provided with an upper anode plate 40a and a lower anode plate 40b which are connected with the anode output of the pulse reverse power supply 310; the cathode conductor 13a at the inlet and the cathode conductor 13b at the outlet are connected to the cathode output of the pulsed reverse power supply 310. The second to sixth electrolytic copper areas are connected in the same manner as the first electrolytic copper areas, as shown in fig. 2 and 7.
As shown in table 3, the sheet type lead frame, width 105mm, surface area less than one third compared to example 1, preferably 5 units electrolytic copper process was treated for surface roughness; the surface roughness of the material required by the product is Ra3.35-4.67 mu m; setting the total amount of the roughness of the surface of the manufactured metal of the five pulse reverse power supplies 310 to 350 to be 20 equal parts, wherein the surface roughness of each part is 0.167 to 0.233 mu m; for example, in the experimental condition No.1, 15 parts of the pulse reverse power source 310, 2 parts of the pulse reverse power source 320, 0.335 to 0.467 μm of the surface roughness range Ra 2.512 to 3.503 μm after treatment, 1 part of each of 3 pulse reverse power sources 300 of the pulse reverse power source 320 to 350, and the surface roughness of the material after treatment by each pulse reverse power source 300 is 0.167 to 0.233 μm.
The running speed of the manufacturing production line of the surface roughness of the sheet lead frame material is preferably 1.5 m/min; when 5 pulse reverse power supplies 300 adopt the condition No.9 in Table 3, the roughness ranges of 5 electrolytic copper layers are all 0.670-0.934 μm, namely the conditions of the forward pulse current and the reverse pulse time set by 6 pulse reverse power supplies 300 are the same, the obtained surface roughness and density difference from the lowest layer to the surface layer is small, and the surface characteristics of the lead frame material are uniform and consistent.
When the condition No.1 is adopted, the pulse reverse power supply 310 needs to set a larger forward pulse current and a longer forward pulse time, while the set value of the reverse pulse current needs to be smaller and the set value of the reverse pulse time needs to be shorter; the obtained electrolytic copper has larger roughness and poorer density; the conditions required to be set by the pulse reverse power supply 320 are different from those adopted by the 5 pulse reverse power supplies 300 of No.9, a smaller forward pulse current and a longer forward pulse time are adopted, while the set value of the reverse pulse current is slightly larger than that of the condition No.9, and the reverse pulse time is much shorter than that of the condition No. 9; the setting conditions of the subsequent three pulse reverse power supplies 330 to 350 are a smaller forward pulse current and a longer forward pulse time compared with the condition No.9, and the setting value of the reverse pulse current is slightly larger compared with the condition No.9 and the reverse pulse time is much shorter than the condition No. 9. Therefore, the obtained electrolytic copper has better surface compactness compared with the condition No.9 while the surface roughness meets the specification requirement of the product.
When the conditions of No.2, No.3, No.4, No.5, No.6, No.7 and No.8 are adopted, the surface roughness of the lead frame material is achieved, and the compactness is between No.1 and No. 9.
When the condition No.17 is adopted, the three pulse reverse power supplies 310 to 330 need to set a smaller forward pulse current and a longer forward pulse time, and set a larger reverse pulse current and a shorter reverse pulse time; the obtained copper plating layer has small roughness and good compactness. The conditions required to be set by the pulse reverse power supply 340 are different from the conditions adopted by the 5 pulse reverse power supplies 300 in the condition No.9, a small forward pulse current and a long forward pulse time are adopted, the set value of the reverse pulse current is slightly larger than that of the condition No.9, and the reverse pulse time is much shorter than that of the condition No. 9; the last pulse reverse power supply 350 is set with a larger forward pulse current and a longer forward pulse time, and with a larger reverse pulse current and a shorter reverse pulse time, so that the obtained surface roughness reaches the product specification and is poorer in surface compactness compared with the condition No. 9.
When the conditions No.8 to No.16 are adopted, the surface roughness of the lead frame material is between the conditions No.9 and No.17 while the requirement is met.
Thus, the most preferable condition in this embodiment is No. 4.
Tables 1, 2, and 3 respectively show the distribution limit of the surface roughness of the lead frame corresponding to 7 pulse reverse power supplies 300, the distribution limit of the surface roughness of the lead frame corresponding to 6 pulse reverse power supplies 300, and the distribution limit of the surface roughness of the lead frame corresponding to 5 pulse reverse power supplies 300. Including the number of fractions dispensed and the specific surface roughness range for each pulsed reverse power supply 300.
Table 1: 7 lead frame surface roughness's that pulse reverse power corresponds distribution quota unit: mum of
Table 2: 6 distribution limit units of the surface roughness of the lead frame corresponding to the pulse reverse power supply: mum of
Table 3: 5 distribution limit units of the surface roughness of the lead frame corresponding to the pulse reverse power supply: mum of
Therefore, the output currents of the optional pulse reverse power supplies 300 of each unit are regulated and controlled to be different, the output pulse time of the optional pulse reverse power supplies 300 of each unit is regulated and controlled to be different, through various arrangement combinations of the units with different set conditions, a test scheme with a surface roughness requirement range is designed, the test result is optimized, an optimal experimental method for the surface roughness of the material of the lead frame is optimized, and the required surface roughness of the material of the lead frame required by the production of the lead frame is obtained
The electrolytic copper process for regulating and controlling the surface roughness of the lead frame material can select a range from 3 units to 12 units, preferably a range from 4 units to 11 units, and more preferably a range from 5 units to 10 units.
As shown in fig. 4 to 8, according to the method for manufacturing surface roughness of lead frame material of the embodiment of the present invention, the lead frame material can be electrolytically processed to have surface roughness required for a product. The continuous lead frame material 200, 500 and 700 is surface treated by a pulse reverse electrolysis technique and preferably electrolytic copper bath. The production and processing conditions of the surface roughness of the lead frame material can be determined by designing a test scheme of a required range of the surface roughness, the experimental result is optimized, and the optimal manufacturing method of the surface roughness of the material is optimized.
The lead frame material of the utility model can be a metal material, and the metal material can be an alloy consisting of any one selected monomer from copper, nickel, cobalt, tungsten, molybdenum, chromium and zinc or any two or more selected monomers from copper, nickel, cobalt, phosphorus, tungsten, arsenic, molybdenum, chromium and zinc; or iron and iron alloy thereof, and various stainless steel materials; all metallic materials may be continuous strip or continuous lead frame materials. In addition, all the materials with metal foil attached on the surface can be processed by the manufacturing method and the manufacturing equipment of the utility model with the surface roughness. For example, various materials having a metal film attached to one or both surfaces of a plastic film can be used to produce the desired surface roughness material.
The thickness of the lead frame material can be selected from the range of 0.03mm to 0.80mm, preferably from the range of 0.05mm to 0.55mm, and more preferably from the range of 0.07mm to 0.35 mm; the width of the metal material can be selected from the range of 50mm to 1000mm, preferably from 80mm to 700mm, and more preferably from 100mm to 500 mm.
And carrying out hot pressing treatment on the surface of the photosensitive dry film and the surface of the lead frame material to obtain the film-coated lead frame material which is firmly combined and uniform in surface thickness. The thickness of the photosensitive dry film raw material can be selected within the range of 20-100 μm, preferably within the range of 20-80 μm, and more preferably within the range of 20-80 μm. In addition, the surface roughness of the photosensitive dry film raw material can be selected from the range of 0.65 to 2.17 μm, preferably from the range of 0.55 to 2.07 μm, and more preferably from the range of 0.50 to 1.97 μm. The optional range of the roughness of one side of the photosensitive dry film after the photosensitive dry film is combined with the lead frame material by hot pressing is 1.05-2.65 mu m, the preferred range is 0.95-2.50 mu m, and the more preferred range is 0.85-2.30 mu m.
The pulse reverse electrolysis technology is composed of forward pulse waveform and reverse pulse waveform current output by a pulse reverse power supply 300, positive plate and electrolytic copper liquid medicine are transmitted to the surface of a lead frame material, and forward pulse time and reverse pulse time are transmitted. Preferably, the double-pulse forward current output by the pulse reverse power supply 300 can be selected from the range of 5A to 500A, preferably from the range of 10A to 450A, and more preferably from the range of 20A to 430A; the reverse current output by the double-pulse rectifier can be selected within the range of 20A-1000A, preferably within the range of 30A-900A, and more preferably within the range of 50A-850A; the double-pulse forward pulse time output by the pulse reverse power supply 300 can be selected within a range of 5 ms-100 ms, preferably within a range of 7 ms-70 ms, and more preferably within a range of 10 ms-50 ms; the reverse pulse time output by the pulse reverse power supply 300 can be selected from the range of 1ms to 30ms, preferably from the range of 3ms to 20ms, and more preferably from the range of 5ms to 10 ms.
Wherein the selectable range of the forward current density of the electrolytic copper liquid medicine is 2A/dm2～70A/dm2Preferably in the range of 5A/dm2～60A/dm2More preferably in the range of 10A/dm2～50A/dm2(ii) a The reverse current density of the electrolytic copper liquid medicine can be selected within the range of 5A/dm2～170A/dm2Preferably in the range of 10A/dm2～160A/dm2More preferably in the range of 20A/dm2～150A/dm2。
Further, the ratio of the surface area of the anode plate to the surface area of the lead frame material immersed in each electrolytic copper bath was selected to be 5: 1, preferably 3: 1, more preferably 2: 1; the anode plate can adopt soluble metal and non-soluble metal, and can also adopt a method for electrolyzing noble metal on the surface of the non-soluble anode plate; the shape of the anode can be sheet-shaped and net-shaped, or can be irregular, such as a flat plate bent into an arc shape, or a net-shaped bent into an arc shape, or various combinations of different sizes and distributions of holes on a flat plate according to positions, in order to satisfy the ratio of the anode area to the cathode area of 5: 1, two or more than two anodes with different shapes can be combined. The optional range of the surface roughness arithmetic mean value of the lead frame is 0.05 to 5.0 μm, preferably 0.07 to 4.5 μm, and more preferably 0.09 to 3.9 μm.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. A lead frame blister copper surface manufacturing equipment is characterized by comprising:
at least one electrolytic copper process tank, wherein electrolytic copper liquid medicine is arranged in the electrolytic copper process tank, and the lead frame material is soaked in the electrolytic copper liquid medicine; the electrolytic copper process tank is provided with a channel which runs through along the running direction of the lead frame, the lead frame material horizontally passes through the channel, and the lead frame material continuously moves forwards to form a moving path;
the anode plate is arranged in the electrolytic copper process tank;
the cathode guide wheels are positioned at the channel openings and are oppositely arranged on two sides of the lead frame material;
the pulse reverse power supply can output pulse forward and reverse currents and forward and reverse pulse time to enable the lead frame materials in the electrolytic copper liquid medicine to generate electrolysis, and the surface roughness of the lead frame materials is changed.
2. The lead frame blister copper surface manufacturing apparatus according to claim 1, wherein the number of the anode plates is two, two of the anode plates are oppositely disposed on both sides of the lead frame material, and the moving path is located between the two anode plates.
3. The lead frame blister copper surface manufacturing apparatus according to claim 2, wherein the periphery of each anode plate is formed with electrolysis regions spaced apart along the length of the moving path.
4. The lead frame blister copper surface manufacturing apparatus according to claim 2, wherein the ratio of the surface area of the anode plate to the surface area of the lead frame material immersed in each electrolytic copper process tank is 5: 1.
5. the lead frame blister copper surface manufacturing equipment according to claim 4, wherein the anode plates are shaped like a sheet, a net or a profile, and the two anode plates in each electrolytic copper process tank are the same shape or a combination of different shapes.
6. The lead frame blister copper surface manufacturing equipment according to claim 1, wherein a pulse power supply positive output end and a pulse power supply negative output end are arranged on the pulse reverse power supply, the pulse power supply positive output end is connected with the anode plate, and the pulse power supply negative output end is connected with the cathode guide wheel.
7. The lead frame blister copper surface manufacturing equipment according to claim 6, wherein the pulse reverse power supply is further provided with a pulse forward current setting terminal and a pulse reverse current setting terminal, the surface of the lead frame material in the electrolytic copper solution can be used for electrically resolving copper under the condition of pulse forward current, and the surface of the lead frame material in the electrolytic copper solution can be used for electrolytically resolving copper under the condition of pulse reverse current.
8. The lead frame blister copper surface manufacturing equipment according to claim 7, wherein the pulse reverse power supply is further provided with a forward pulse time setting end and a reverse pulse time setting end.
9. The lead frame blister copper surface manufacturing equipment according to claim 1, wherein an electrolytic copper liquid medicine is arranged in the electrolytic copper process tank, and the electrolytic copper liquid medicine is required to meet the use range of pulse forward current density and pulse reverse current density output by a pulse reverse power supply.
10. The lead frame blister copper surface manufacturing apparatus according to claim 1, further comprising: and the supporting wheel is arranged in the electrolytic copper process tank and can be contacted with the lower surface of the lead frame material.
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