JP4156086B2 - Electrodeposition processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electrodeposition treatment apparatus for electrodepositing and forming an electrodeposition resist on a surface of a belt-like electrodeposition material while conveying the belt-like electrodeposited material.
[0002]
[Prior art]
Conventionally, a (single layer) lead frame used as an assembly member of a resin-encapsulated semiconductor device is formed by a pressing method or an etching method, and generally has a semiconductor element mounted thereon as shown in FIG. Die pad 711, inner lead 712 for connecting to a semiconductor element provided around die pad 711, outer lead 713 for connecting to the external circuit continuously to inner lead 712, resin sealing A dam bar 714 serving as a dam at the time of carrying out, a frame (frame) portion 716 for supporting the entire lead frame 710 and the like are provided.
The lead frame (single-layer lead frame) 710 is usually made of a metal having excellent conductivity, such as Kovar, 42 alloy (42% nickel-iron alloy), or copper alloy, as shown in FIG. As described above, the semiconductor element 720 is mounted on the die pad 711, the terminal (pad) 721 of the semiconductor element 720 and the tip of the inner lead 712 are connected with a wire 730 such as gold, and then sealed with a resin 740. Thus, the semiconductor device 700 was manufactured.
Thus, in order to connect the terminal (pad) 721 of the semiconductor element 720 and the tip of the inner lead 712 with the wire 730 such as gold, silver plating having excellent conductivity and strong bonding strength with the wire is used. In general, a partial silver plating treatment is applied to the tip of the inner lead on the semiconductor element mounting side.
[0003]
Conventionally, this partial silver plating process is performed by using a plating apparatus 500 as shown in FIG. 8 while covering a region other than the plated region of the continuous lead frame 510 with several sets of lead frames with a masking jig 520. A sparger-type jig plating method for performing plating while applying the plating solution 580 ejected from the nozzle 540 to the pressed and plated area has been mainly performed.
This jig plating method requires a jig for each type of lead frame, and it takes a long time to manufacture the jig, and wear and fatigue occur as it is used. It was also a problem in terms of cost and cost. In addition, when considering the quality of plating, positioning is performed with positioning pins, and plating is performed after holding the single lead frame with the upper and lower jigs, so plating quality such as plating position accuracy and plating thickness uniformity is improved. It is easily affected by the accuracy and mounting accuracy of the manufactured jig. In addition, there is a problem that the plating easily deposits on the side surface and the back surface of the lead frame, which originally does not require plating, and requires advanced empirical techniques for adjustment. Furthermore, due to the increase in the number of input / output terminals of semiconductor elements due to advances in the semiconductor process and the narrowing of the inner lead due to the reduction in package size, the dimensional accuracy of the plated part has become even more strict. The response has become difficult.
[0004]
For this reason, as shown in FIG. 7, in recent years, instead of partial silver plating by masking with the jig described above, it is possible to cope with the increase in the number of terminals of the semiconductor element and the narrowing of the inner lead portion without requiring a jig. Using a photosensitive electrodeposition resist having resistance to the plating solution, only a predetermined area of one frame (also referred to as one series) of lead frames in which one set of several lead frames is exposed to the plating solution A lead frame silver plating method has also been adopted in which plating is performed by masking.
A partial silver plating method using this electrodeposition resist will be briefly described with reference to FIG. FIG. 7 shows a cross section of a part (characteristic part) of the lead frame in order to explain the partial silver plating method using the electrodeposition resist.
First, the entire lead frame 410 is electrolytically degreased, pickled, and chemically polished (FIG. 7A), and then the surface of the lead frame 410 is subjected to copper strike plating 430 as a base plating (FIG. 7B). Thereafter, an electrodeposition resist 420 is formed on the entire surface. (Fig. 7 (c))
Next, a predetermined portion (the tip of the die pad 411 and the inner lead 412) is exposed with ultraviolet light (exposure light) 460 using a predetermined pattern plate 450, and only the exposed portion is cured (FIG. 7D). Next, development processing is performed to remove the electrodeposition resist 420 in the unexposed portion, and the silver plating portion 440A is exposed (FIG. 7E).
Next, after washing the exposed plating portion 440A, the entire lead frame is immersed in a silver plating solution and plated with a predetermined current density and time while stirring, and a desired film is applied to the plating portion 440A. A thick silver plating (film) 440 is obtained. (FIG. 7F) Thereafter, the electrodeposition resist 420 is stripped with a stripping solution to obtain a lead frame 410A having a silver plating (film) 440 only in a predetermined region. (Fig. 7 (g))
[0005]
To form the electrodeposition resist in the lead frame silver plating method using the electrodeposition resist shown in FIG. 7, a strip-shaped metal thin plate material is perforated, and the product portion (lead frame portion) is held at the connecting portion. Recently, a method of performing electrodeposition in a belt-like state has come to be adopted from the viewpoint of processability and workability.
In this method, as shown in FIG. 6, electrodeposition is performed in the electrodeposition tank 320 while the surface of the electrodeposited material 310 is transported in a substantially horizontal direction with the belt-like material.
However, in this method, since the surface of the electrodeposited material 310 is transported in the horizontal direction, bubbles generated on the surface of the electrodeposited material 310 during electrodeposition tend to stay on the lower surface, and this bubble causes In many cases, pits (pinholes) are generated in the electrodeposition resist formed by electrodeposition, which has been a problem.
Further, since leakage of the liquid occurs when the electrodeposition material 310 enters and discharges the electrodeposition tank 320, the leaked electrodeposition liquid 313 is collected in the electrodeposition liquid reservoir 325, and this is collected by the pump 340 and filtered. The electrodeposition liquid circulation method is used to circulate again from the discharge pipe 349 to the electrodeposition tank 320 via 345, but the amount of liquid to be circulated is large, so that the bubbles cannot be completely removed during the circulation, Occurrence of pits (pinholes) in the electrodeposition resist due to bubbles in the circulation path is also a problem.
In the case of the apparatus shown in FIG. 6, there are cases where bubbles generated when the electrodeposited material enters are directly attached to the surface of the electrodeposited material.
[0006]
In the case of the method shown in FIG. 6, a noble metal plating such as silver plating is continuously performed as shown in FIG. 9 while being held on a strip-like (hub-like) thin metal sheet material. There are also attempts.
In FIG. 9, reference numeral 611 denotes a hoop-like processed material that holds a large number of externally processed products after the electrodeposition resist is disposed, 620 is a noble metal plating tank, 613 noble metal plating solution, and 660 is for conveying and fixing. Rotating roll 670 is an electrode.
FIG. 9B is a cross-sectional view taken along D1-D2 in FIG.
[0007]
[Problems to be solved by the invention]
As described above, when noble metal plating is performed on a lead frame, a plating method using a photosensitive electrodeposition resist having resistance to a plating solution without using a jig as a plating mask has been adopted. However, pits (pinholes) were generated in the electrodeposition resist formed by electrodeposition, and quality measures were required in terms of productivity and mass productivity.
Under such circumstances, the present invention is obtained by perforating a strip-shaped metal sheet material and holding one or more product sections on the strip-shaped sheet metal material via a connecting portion. Electrodeposition used for electrodeposition forming of a photosensitive electrodeposition resist to produce a plating mask made of an electrodeposition resist for plating only a predetermined region of a processed lead frame outer shape product An object of the present invention is to provide an electrodeposition processing apparatus capable of suppressing the generation of pits (pinholes) in an electrodeposition resist formed by electrodeposition.
[0008]
[Means for Solving the Problems]
The electrodeposition treatment apparatus of the present invention is It is obtained by perforating a strip-shaped metal plate material, and one or a plurality of product parts are held on the strip-shaped metal plate material via a connecting portion. An electrodeposition processing apparatus for electrodepositing and forming an electrodeposition resist on a surface of a belt-shaped electrodeposition material while conveying the belt-shaped electrodeposition material in one direction in an electrodeposition tank. The entrance part of the electrodeposition tank and the exit part from the electrodeposition tank are positioned below the surface of the electrodeposition liquid in the electrodeposition tank, respectively, and the front side of the electrodeposition material in the electrodeposition tank in the traveling direction. The electrodeposition solution is provided on the rear side and allows the electrodeposition liquid to flow out from the inlet and outlet portions. The electrodeposited material is supported before and after the electrodeposition tank in the traveling direction, and is supported within the electrodeposition tank. The electrodeposition material is transported in one direction from the inlet portion to the outlet portion in the electrodeposition tank with the electrodeposition material in contact with only the electrodeposition liquid in the electrodeposition bath. In the tank It is provided on both front and back sides of the electrodeposited material, Spray the electrodeposition liquid onto the material to be electrodeposited, The sprayed electrodeposition liquid releases bubbles attached to the electrodeposited material directly or by the electrodeposition liquid in the vicinity of the electrodeposited material that caused the flow. A plurality of electrodeposition liquid spray nozzles are provided, and in order to allow the bubbles in the electrodeposition liquid to flow out from the upper surface of the electrodeposition bath liquid, it is overflowed on the upper surface side of the electrodeposition liquid, and an inlet portion and an outlet portion The electrodeposition liquid flowing out from the electrode or the electrodeposition liquid overflowing on the upper surface side of the electrodeposition liquid is circulated and circulated through the electrodeposition liquid supply section for supplying the electrodeposition liquid from the lower side of the electrodeposition tank. Used, and Electrodeposition liquid spray nozzle The electrodeposition liquid supplied to the tank is different from the circulation and circulation route, and the electrodeposition liquid inside the electrodeposition tank is circulated and used.
[0009]
And in the above, the angle which sprays the electrodeposition liquid of an electrodeposition liquid spray nozzle is the range which is 45 degrees-90 degrees by the angle which makes with the advancing direction of a to-be-deposited material, It is characterized by the above-mentioned.
And also above either The electrodeposition liquid spray nozzle is a slit nozzle.
Also, above either 1 is characterized in that a bubble passage blocking membrane is provided between the electrode and the electrodeposited material.
Also, above either The electrodeposited material is characterized in that the lead frame is a product part.
[0010]
[Action]
The electrodeposition treatment apparatus according to the present invention has such a configuration, so that an electrodeposition resist can be electrodeposited on the surface of the electrodeposited material while transporting the band-shaped electrodeposition material while the belt-shaped electrodeposition material is conveyed. In the electrodeposition processing apparatus, it is possible to provide an electrodeposition processing apparatus that generates less pits (pinholes) in the electrodeposition resist and is efficient in terms of workability.
In particular, a lead frame in which the electrodeposition material is obtained by perforating a strip-shaped metal thin plate material, and one or more product portions are held on the strip-shaped metal thin plate material via a connecting portion. In the case of an externally processed product, the electrodeposition processing apparatus of the present invention is effective, and this apparatus enables the production of a plating mask made of an electrodeposition resist for plating only the predetermined region in quality. In terms of workability, high efficiency can be achieved and mass production can be expected.
Specifically, the entrance part of the electrodeposition material to the electrodeposition tank and the exit part from the electrodeposition tank are respectively positioned at positions below the electrodeposition liquid surface of the electrodeposition tank. The electrodeposition material is provided on the front side and the rear side of the electrodeposition material, and the electrodeposition liquid is allowed to flow out from the inlet portion and the outlet portion, and supports the electrodeposition material before and after the electrodeposition tank in the direction of travel. The electrodeposition material is not supported in the electrodeposition tank, and the electrodeposition material is brought into contact with only the electrodeposition liquid in the electrodeposition tank, and the electrodeposition material is transferred in one direction from the inlet to the outlet in the electrodeposition tank. This is achieved by providing a plurality of electrodeposition liquid spray nozzles for spraying the electrodeposition liquid onto the electrodeposited material in the electrodeposition tank.
That is, in the electrodeposition tank, the electrodeposition material is brought into contact with only the electrodeposition liquid in the electrodeposition tank, and the electrodeposition material is conveyed in one direction from the inlet to the outlet in the electrodeposition tank. Therefore, it is possible to minimize as much as possible the adhesion of dirt on the surface of the electrodeposited material, the adhesion of dirt to the electrodeposited surface during and after electrodeposition, and damage to the electrodeposited film surface due to contact. It is said.
Moreover, by providing a plurality of electrodeposition liquid spray nozzles for spraying the electrodeposition liquid onto the electrodeposition material in the electrodeposition tank, circulation of the electrodeposition liquid and entry / exit of the electrodeposition material into the electrodeposition tank can be performed. It is possible to reduce the occurrence of pits (pinholes) generated when bubbles generated during the deposition or bubbles on the surface of the electrodeposited material generated during electrodeposition adhere to the electrodeposited material.
In particular, when the angle of spraying the electrodeposition liquid from the electrodeposition liquid spray nozzle is in the range of 45 ° to 90 ° with respect to the traveling direction of the electrodeposited material, it is effective to adhere bubbles to the electrodeposited material. Can be prevented.
In addition, by allowing the electrodeposition liquid to flow out from the inlet and outlet portions, it is possible to suppress the inflow of bubbles into the electrodeposition tank as the electrodeposition material enters and exits the electrodeposition tank. It is said.
[0011]
Furthermore, since the electrodeposition liquid supply part for supplying the electrodeposition liquid from the lower side of the electrodeposition tank is provided and the upper surface side of the electrodeposition liquid is overflowed, the flow of the electrodeposition liquid in the electrodeposition tank Is from the bottom to the top, and the bubbles in the electrodeposition liquid can be actively flowed out from the upper part of the liquid surface of the electrodeposition tank.
As a result, the accumulation of the electrodeposition liquid on the upper and lower surfaces of the electrodeposited material can be reduced, and gas (bubbles) generated near the electrodeposited material during electrodeposition can be prevented as much as possible. It is supposed to be.
[0012]
The electrodeposition liquid supplied to the nozzle is different from the one that is used by circulating from the upper surface side of the electrodeposition liquid, or the one that collects or uses the electrodeposition liquid that has flowed out from the inlet and outlet. The entire system is easily controlled by circulating and using the electrodeposition liquid inside the electrodeposition tank.
[0013]
In the electrodeposition treatment apparatus of the present invention, the material to be electrodeposited is obtained by perforating a belt-shaped metal plate material, and one or more product parts are connected to the belt-shaped metal plate material via a connecting portion. It can also be applied to externally processed products that are held in plural. This is particularly effective when an externally processed product having a lead frame as a product part is used as an electrodeposited material.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
An electrodeposition processing apparatus according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1A is a schematic cross-sectional view of a first example of an embodiment of an electrodeposition processing apparatus according to the present invention, and FIG. 1B circulates the cross-section and nozzle in A1-A2 of FIG. FIG. 2 (a) is a schematic cross-sectional view of a second example of the embodiment of the electrodeposition processing apparatus according to the present invention, and FIG. FIG. 3A and FIG. 3B are schematic diagrams showing the cross-section at B1-B2 in FIG. 3A and the path of the electrodeposition liquid circulating through the nozzles in an easy-to-understand manner. FIG. 3A and FIG. 4A is a diagram for explaining the angle θ at which the nozzle electrodeposition liquid is sprayed, FIG. 4B is a diagram of a flat nozzle, and FIG. 4C is a slit. FIG. 5 is a diagram showing a state of an electrodeposited material that has been punched and contoured with a product portion as a lead frame.
1 to 5, 100 and 105 are electrodeposition processing apparatuses, 110 is an electrodeposition liquid, 120 is an electrodeposition tank, 121 is an inlet, 121A is a flow receiver, 123 is an outlet, 123A is a flow receiver, and 125 is an overflow receiver. , 130 is an electrodeposition liquid spray nozzle, 131 is an outlet, 150 is an electrodeposition liquid supply section, 151 is an electrodeposition liquid reservoir, 152 is a pump, 153 is a filter, 154 is piping, 157 is a rectifying plate, and 160 is an electrode , 172 is a pump, 173 is a filter, 175 is piping, 177 is a control valve, and 180 is an electrodeposited material.
In addition, the arrow of the electrodeposition liquid supply part in the electrodeposition tank in FIG. 1 shows the flow direction of the electrodeposition liquid.
[0015]
First, a first example will be described.
The electrodeposition processing apparatus 100 of the first example shown in FIG. 1 has its surface in a belt-like state while transporting the belt-like electrodeposited material 180 in one direction with the surface substantially vertical. An electrodeposition processing apparatus for electrodepositing a photosensitive electrodeposition resist.
The electrodeposited material 180 has a product portion of a lead frame, a large number of product portions having a perforated outer shape, and a connecting portion held by a work material made of a strip-shaped metal thin plate.
The electrodeposition material 180 has an inlet portion 121 to the electrodeposition tank 120 and an outlet portion 123 from the electrodeposition tank at positions below the electrodeposition liquid surface of the electrodeposition tank 120, respectively. The electrodeposition material 180 is provided on the front side and the rear side in the traveling direction of the electrodeposited material 180, and the electrodeposition liquid 110 is allowed to flow out from the inlet portion 121 and the outlet portion 123. The electrodeposition material 180 is supported before and after the electrodeposition tank 120 and is not supported in the electrodeposition tank 120. The electrodeposition material 180 is electrodeposited with the electrodeposition material 180 in contact with only the electrodeposition liquid 110 in the electrodeposition tank 120. It is conveyed in one direction from the inlet part 121 to the outlet part 123 in the tank 120.
Furthermore, the electrodeposition processing apparatus 100 of the first example is provided with a plurality of electrodeposition liquid spray nozzles 130 for spraying the electrodeposition liquid 110 onto the electrodeposited material 180 in the electrodeposition tank 120.
Further, in order to flow the electrodeposition liquid out of the electrodeposition tank from the inlet part 121 and the outlet part 123, or the flow of the electrodeposition liquid 110 in the electrodeposition tank 120 is from the bottom to the top, the electrodeposition liquid 110 An electrodeposition liquid supply unit 150 for supplying the electrodeposition liquid 110 from the lower side of the electrodeposition tank 120 is provided in order to flow the air bubbles from the upper surface of the electrodeposition tank 120 to the outside, and an inlet 121 and an outlet are provided. The flow receivers 121A and 123A for collecting or circulating the electrodeposition liquid 110 flowing out from the section 123, and the electrodeposition liquid overflowing on the upper surface side of the electrodeposition liquid in the electrodeposition tank 120 are collected or used for circulation. An overflow receiver 125 is provided.
[0016]
As indicated by the dotted arrows in FIG. 1A, the electrodeposition liquid from the overflow receiver 125 and the flow receivers 121A and 123A passes through a flow path (not shown) such as a pipe and is sent to the electrodeposition reservoir 151. .
Further, the electrodeposition liquid in the electrodeposition liquid reservoir 151 is sent to the lower side portion of the electrodeposition tank 120 through the filter 153 by the pump 152, and is electrified in the vertical direction from the bottom to the top through the rectifying plate 157. The liquid is supplied.
The filter 153 removes bubbles in the electrodeposition liquid.
The flow straightening plate 157 distributes the flow of the electrodeposition liquid to the entire electrodeposition tank by passing the electrodeposition liquid through the hole formed in the vertical direction, and the flow of the electrodeposition liquid is combined with the flow of the liquid due to the overflow. In the electrodeposition tank, it is directed from the bottom to the top.
Here, the liquid overflowing from the electrodeposition liquid surface of the electrodeposition tank 120 and the electrodeposition liquid flowing out from the inlet 121 and outlet 123 of the electrodeposition tank 120 are collected and circulated again. The entire configuration for feeding the electrodeposition liquid 120 to the electrodeposition tank 120 but sending the collected electrodeposition liquid from the lower side to the upper side of the electrodeposition tank 120 is referred to as an electrodeposition liquid supply unit 150.
In addition, replenishment and replacement | exchange of a new predetermined electrodeposition liquid are performed as needed.
[0017]
The overflow receiver 125 is configured such that when the liquid level of the electrodeposition tank 120 reaches a predetermined height, the electrodeposition liquid flows in. The wall of the electrodeposition tank 120 may be provided with a hole such as a slit or the like. .
This flow is to flow the bubbles in the electrodeposition liquid into the overflow receiver 125, and the minimum necessary flow is preferable.
[0018]
A flow receiver 121A is provided at the entrance 121 of the electrodeposition material 180 to the electrodeposition tank 120, and a flow receiver 123A is provided at the exit 123 from the electrodeposition tank 120 so that the electrodeposition liquid flows out from here. The electrodeposition liquid supply unit 150 supplies an electrodeposition liquid.
This prevents bubbles from flowing into the electrodeposition tank 120 as the electrodeposited material 180 enters and exits the electrodeposition tank 120.
[0019]
In this example, at the time of electrodeposition, bubbles are generated on the surface portion of the electrodeposited material 180 and the surface portion of the electrode 160, but the electrode 160 is prevented from adhering to the electrodeposited material 180. 1 is provided between the electrode 160 and the electrodeposited material 180 to prevent the passage of bubbles, but is not shown in FIG.
It is preferable to provide a distance adjusting unit (not shown) that can change the distance between the electrodeposited material 180 and the electrode 160 or between the electrodeposited material 180 and the diaphragm (not shown).
The structure includes a motor, a belt, a drive support portion, and the like, and the electrode 160 and the partition wall can be independently changed by driving the drive support portion by rotating the motor. However, it need not be limited to this. Thereby, it can respond to various electrodeposition conditions.
[0020]
As shown in FIG. 1A, in the electrodeposition processing apparatus 100, the electrodeposition liquid spray nozzles 130 are provided on both the front and back surfaces of the electrodeposited material 180.
The electrodeposition liquid sprayed from the electrodeposition liquid spray nozzle 130 directly or the electrodeposition liquid in the vicinity of the electrodeposited material 180 generated by the flow emits bubbles adhering to the electrodeposited material 180, and the electrodeposition is performed. Prevents pinholes caused by membrane bubbles.
This prevents bubbles from adhering to the electrodeposition material 180 in combination with the flow from the bottom to the top of the electrodeposition liquid 110 in the electrodeposition tank 120.
As shown in FIGS. 4A and 4A, the angle θ formed by the direction of travel of the electrodeposited material 180 (thick dotted line arrow) and the direction of the electrodeposited liquid (thick solid line arrow) is expressed here. The angle at which the electrodeposition liquid spray nozzle 130 sprays the electrodeposition liquid. For example, in the case of FIGS. 4A and 4B, θ is 90 °.
The angle θ is preferably in the range of 45 ° to 90 °.
As the nozzle, a flat nozzle as shown in FIG. 4B or a slit nozzle as shown in FIG. 4C is used.
4B and FIG. 4B are views seen from the electrodeposition liquid outlet side, and FIG. 4B and FIG. 4B are views seen from the electrodeposition liquid outlet side. It is FIG.4 (c) (b).
As shown in FIG. 1 (b), the nozzle 130 shown in FIG. 1 (a) is free from an overflow from the upper surface of the electrodeposition liquid in the electrodeposition tank 120 and an outflow when the electrodeposited material 180 enters and exits. Is separated from the electrodeposition liquid supply unit 150 (shown in FIG. 1 (a)), and circulates as shown in FIG. 1 (b). The electrodeposition liquid is blown out from the opening by applying pressure.
In this example, the electrodeposition liquid spray nozzles 130 are arranged before and after the electrode 160 in the traveling direction of the electrodeposited material 180, respectively. In order to remove bubbles adhering to the surface of the electrodeposition material 180 before electrodeposition, the electrodeposition liquid spray nozzle 130 on the outlet 123 side has a pinhole due to the bubbles when forming the electrodeposition film. It is for removing bubbles.
[0021]
The electrodeposition liquid 110 is, for example, an acrylic unsaturated compound having a carboxyl group, which is dissolved in an acrylic monomer or styrene and neutralized with an organic amine, and a small amount of a photosensitizer is added. Is mentioned. However, it is not limited to the acrylic type, and may be, for example, a polyolefin type or polybutadiene type electrodeposition liquid.
Examples of the photosensitizer include benzoin ether.
The electrodeposition resist film may be either an anion precipitation type or a cation precipitation type.
The photosensitive electrodeposition resist is not particularly limited to a positive type or a negative type.
The electrodeposition resist is deposited on the cathode in the case of the cation type, and is deposited on the anode in the case of the anion type. Therefore, the polarity on the electrodeposit (lead frame outer shape processed product) side is determined according to the type.
In addition, as the lead frame material, 42 alloy (42% nickel-iron alloy), Kovar, and various copper alloys can be applied, and expensive precious metal plating such as silver plating treatment, palladium plating treatment, palladium alloy plating treatment, etc. can be used without waste. It can be applied only to the desired part.
[0022]
When the electrodeposition material 180 uses a lead frame as a product portion, for example, as shown in FIG.
A single lead frame 210 as shown in FIG. 10 (a) is held by a plurality of frames or connecting portions and connected, and one lead frame shown in FIG. 2 (b) (also referred to as a single frame). A plurality of holes are drilled in a state where 210A is held by the connecting portion 220 on the belt-like processed material 205.
[0023]
As a modified example of the electrodeposition treatment apparatus of the first example shown in FIG. 1, as shown in FIG. In the first example shown in FIG. 1, the electrode 160 is provided, and the electrodeposition liquid spray nozzles 130 are respectively provided before and after the electrodeposition material 180 of each electrode in the traveling direction. In the above, there is a configuration in which the nozzle on the upper side of the electrodeposited material 180 is removed.
[0024]
Next, a second example will be described.
The electrodeposition processing apparatus 105 of the second example shown in FIG. 2 differs from the first example shown in FIG. 1 in that the electrodeposited material 180 is transported with its surface substantially horizontal, In this state, a photosensitive electrodeposition resist is electrodeposited on the surface.
The supply of the electrodeposition liquid and the flow are basically the same as in the first example, but by performing electrodeposition while transporting the electrodeposited material 180 with its surface substantially horizontal, Compared to both surfaces of the electrodeposited material 180 of the first example, bubbles are difficult to remove on the lower surface of the electrodeposited material 180 of this example.
[0025]
【The invention's effect】
As described above, the present invention is an electrodeposition processing apparatus for electrodeposition forming an electrodeposition resist on a surface of a belt-shaped electrodeposition material while conveying the belt-shaped electrodeposition material. It is possible to provide an electrodeposition processing apparatus with less pits (pinholes) and good workability.
In particular, a lead frame in which the electrodeposition material is obtained by perforating a strip-shaped metal thin plate material, and one or more product portions are held on the strip-shaped metal thin plate material via a connecting portion. In the case of an externally processed product, the electrodeposition processing apparatus of the present invention is effective, and this apparatus enables the production of a plating mask made of an electrodeposition resist for plating only a predetermined area in quality. In terms of workability, high efficiency can be achieved and mass production can be expected.
In lead frame plating using electrodeposition resist, there is no fear of plating leakage like the jig plating method, and it is possible to plate expensive noble metals such as silver only in necessary areas. Since the lead frame can be made finer, that is, the inner leads can be made narrower in pitch, the electrodeposition processing apparatus of the present invention can cope with mass production and miniaturization of the lead frame.
[Brief description of the drawings]
FIG. 1 is a schematic view showing a first example of an embodiment of an electrodeposition treatment apparatus of the present invention.
FIG. 2 is a schematic view showing a second example of the embodiment of the electrodeposition processing apparatus of the present invention;
FIG. 3 is a simplified diagram showing a modification of the first example of the embodiment of the electrodeposition processing apparatus of the present invention.
FIG. 4 is a diagram for explaining the electrodeposition liquid spraying angle θ of the electrodeposition liquid spray nozzle and the electrodeposition liquid spray nozzle.
FIG. 5 is a diagram showing a state of an electrodeposited material that has been punched and processed with the product portion as a lead frame
FIG. 6 is a diagram of an electrodeposition processing apparatus for coating a conventional electrodeposition resist.
FIG. 7 is a process diagram for explaining a plating process using a conventional electrodeposition resist film.
FIG. 8 is a schematic view of a partial plating apparatus using a masking method with a jig.
FIG. 9 is a schematic diagram for explaining a noble metal plating method for a strip-shaped plate having an outer shape processed using an electrodeposition resist film as a mask.
FIG. 10 is a diagram for explaining a lead frame and a semiconductor device;
[Explanation of symbols]
100, 105 Electrodeposition processing equipment
110 Electrodeposition solution
120 electrodeposition bath
121 Entrance
121A Flow receiver
123 Exit
123A Flow receiver
125 Overflow receiver
130 Electrodeposition spray nozzle
131 Outlet
150 Electrodeposition liquid supply unit
151 Electrodeposition liquid reservoir
152 pump
153 filters
154 Piping
157 Current plate
160 electrodes
172 pump
173 filters
175 piping
177 Control valve
180 Electrodeposited material
200 Electrodeposited material
205 Processed material
210 1 lead frame
210A 1 frame of lead frame (1 station)
220 connecting part
310 Electrodeposited material
313 Electrodeposition solution
313A Supplementary charging liquid
320 Electrodeposition tank
323 Overflow receiver
325 Electrodeposition liquid reservoir
340 pump
345 filter
347 piping
349 Discharge piping
350 Electrodeposition liquid circulation part
410 Lead frame
410A Silver plated lead frame
411 die pad
412 Inner lead
412A side (edge)
420 Electrodeposition resist film
430 Copper strike plating
440 Silver plating (film)
440A Plating part
450 pattern version
460 UV light (exposure light)
500 Plating equipment
510 lead frame
520 Masking jig
530 Press jig
530A Press material
530B elastic material
540 nozzles
550 constant current source
560 Anode electrode
570 Cathode electrode
611 Electrodeposited material
613 Precious metal plating solution
620 Precious metal plating tank
660 Transport fixing roll
670 electrode
700 Semiconductor device
710 Lead frame
711 die pad
712 Inner lead
713 Outer lead
714 Dam Bar
715 Hanging lead
716 Frame part
720 Semiconductor element
721 terminal (pad)
730 wire
740 resin

Claims (5)

A belt-shaped electrodeposition material obtained by punching a strip-shaped metal plate material and having one or more product parts held on the strip-shaped metal plate material via a connecting portion , An electrodeposition processing apparatus for electrodepositing and forming an electrodeposition resist on the surface of the electrodeposition resist while it is transported in one direction in the electrodeposition tank, to the electrodeposition tank of the electrodeposition material An inlet part of the electrodeposition tank, and an outlet part from the electrodeposition tank at positions lower than the electrodeposition liquid surface of the electrodeposition tank, respectively, on the front side and the rear side of the electrodeposition material in the electrodeposition tank, and The electrodeposition liquid is allowed to flow out from the inlet and outlet portions. The electrodeposited material is supported before and after the electrodeposition tank in the traveling direction, and is not supported in the electrodeposition tank. The electrodeposition tank is conveyed in one direction from the inlet to the outlet in the electrodeposition tank with only the electrodeposition liquid in the electrodeposition tank being touched. There are provided on both sides of the electrodeposition material, spraying the electrodeposition liquid onto electrodeposition material, injected electrodeposition solution directly, or, thereby collecting near the electrodeposition material flow occurs Chakueki A plurality of electrodeposition liquid spray nozzles that release bubbles adhering to the electrodeposited material are provided, and in order to allow the bubbles in the electrodeposition liquid to flow outward from the upper surface of the electrodeposition bath, The electrodeposition liquid overflowed from the top surface of the liquid and circulated from the inlet and outlet, or the electrodeposition liquid overflowed from the top surface of the electrodeposition liquid, is circulated to form the electrodeposition liquid from the lower side of the electrodeposition tank. The electrodeposition liquid to be circulated through the electrodeposition liquid supply portion for supplying the electrodeposition liquid and the electrodeposition liquid sprayed to the electrodeposition liquid spray nozzle is in a separate system from the overflow and circulation path. An electrodeposition treatment apparatus characterized in that the electrodeposition liquid inside the deposition tank is circulated.   2. The electrodeposition processing apparatus according to claim 1, wherein an angle of spraying the electrodeposition liquid from the electrodeposition liquid spray nozzle is in a range of 45 ° to 90 ° with respect to an advancing direction of the electrodeposited material. 3. The electrodeposition processing apparatus according to claim 1, wherein the electrodeposition liquid spray nozzle is a slit nozzle. In any one of claims 1 to 3, the electrode and the electrodeposition processing device characterized in that a diaphragm for gas bubbles pass blocking between the electric Chakuzai. The electrodeposition processing apparatus according to any one of claims 1 to 4, wherein the electrodeposited material has a lead frame as a product portion.

Images