JP3450179B2 - Surface treatment equipment - Google Patents
Surface treatment equipmentInfo
- Publication number
- JP3450179B2 JP3450179B2 JP08638598A JP8638598A JP3450179B2 JP 3450179 B2 JP3450179 B2 JP 3450179B2 JP 08638598 A JP08638598 A JP 08638598A JP 8638598 A JP8638598 A JP 8638598A JP 3450179 B2 JP3450179 B2 JP 3450179B2
- Authority
- JP
- Japan
- Prior art keywords
- processing
- surface treatment
- processing liquid
- flow
- tank
- Prior art date
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Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、表面処理槽内に収
容した表面処理液中に被処理物を浸漬し、その被処理物
表面の洗浄やめっき等の表面処理に用いる表面処理装置
に関するものである。
【０００２】
【従来の技術】従来の表面処理装置における表面処理槽
部分の断面図を図６に示す。図６において、３１は処理
液導入口、３２は気泡発生用ガスの導入口、３３は表面
処理槽、３４は処理液、３５はオーバーフロー部、３６
は表面処理槽３３の開口部及びそこに形成される処理液
３４の液表面、３７は被処理物、３８は被処理物３７を
処理液３４に浸漬するための治具、３９は気泡である。
【０００３】このような従来の表面処理装置によれば、
処理液導入口３１を通じて処理液３４が、表面処理槽３
３内に連続的に供給され、表面処理槽３３の開口部３６
に達する。さらに、処理液導入口３１から供給される処
理液３４の増加により開口部３６から溢れ出た処理液３
４は、開口部３６の周囲に設けられたオーバーフロー部
３５に流れ落ち、オーバーフロー部３５に設けられた処
理液回収手段（図示せず）を通じて回収、ポンプ、フィ
ルター、温度調整装置（いずれも図示せず）等を経て、
再び処理液導入口３１を通じて表面処理槽３３内に供給
される。
【０００４】また、気泡発生用ガスの導入口３２から導
入されたガスは、導入口３２にあけられた穴列を通じて
表面処理槽３３に供給され、気泡３９となって表面処理
槽３３の開口部３６に達し、空気中へ放出されるか、ガ
ス回収手段（図示せず）により回収、処理される。
【０００５】一方、治具３８によって複数の被処理物３
７が支持固定された状態で表面処理槽３３内に収納され
る。この時、被処理物３７は、処理液導入口３１と気泡
発生用ガスの導入口３２の上側に設置され必要時間浸漬
することにより表面処理が行われる。また、治具３８は
気泡３９やめっき反応等で生じた微小な気泡の被処理物
３７への付着を防ぐために振動発生手段（図示せず）に
より揺動されることもある。
【０００６】
【発明が解決しようとする課題】図６に示す従来の表面
処理装置では、処理液３４の処理液導入口３１からの吹
き出し方向に沿って流れが集中してしまうという問題が
ある。例えば図６のような吹き出しの場合、被処理物３
７を浸漬している領域の中央部と両端部に開口部３６へ
向かう上昇流が集中する。開口部３６に到達した処理液
３４の多くはそのままオーバーフロー部３５に流れ落ち
るが、一部は開口部３６付近から折り返して開口部３６
へ向かう流れの間を通って処理槽３３の底部へ向かう緩
やかな下降流を形成する。
【０００７】このような上昇流と下降流の入り交じる状
態では、被処理物３７の浸漬されている領域において淀
みや渦状流が発生するなど、著しく乱れた流れが形成さ
れてしまう。さらに、気泡発生用ガスの導入口３２より
吹き出す気泡３９による処理液３４の撹拌効果等により
このような傾向はさらに助長される。
【０００８】したがって、被処理物３７表面近傍の処理
液３４の流速は著しく不均一となり、被処理物３７表面
近傍の処理液３４の流速がめっき厚みや洗浄程度等に影
響を与えるため、被処理物３７に施されるめっきの厚み
や洗浄の程度等に大きなバラツキが発生してしまうとい
う問題があった。
【０００９】また処理液３４が無電解めっき液からなる
場合、気泡３９の供給が処理液３４の自己分解反応抑制
のために表面処理槽３３中の酸素等の溶存量を保持する
目的で行われている場合には、前記の下降流や渦状流の
存在により、被処理物３７の近傍には気泡３９による酸
素などの供給後長時間経過した処理液３４が滞留する可
能性が高くなるため、被処理物３７の近傍の処理液３４
中で自己分解反応抑制に必要な酸素などの溶存量が欠乏
し、自己分解反応が起こり、被処理物３７表面に付着す
るなどしてめっき厚みのバラツキやめっき品質の著しい
悪化を引き起こしてしまう場合があった。
【００１０】従って、バラツキが少なく品質の良い表面
処理を実現するためには、表面処理装置内で均一な処理
液の流れと均一な気泡の流れを同時に与えることが求め
られる。
【００１１】このような問題に対し、特開昭６２−２９
４１８２号においては、多孔板からなる整流板を設ける
ことが提案されているが、この方法では、整流板の穴の
空け方などを調整することで、処理液の流れを均一にす
ることは可能であるが、気泡の流れを同時に均一化する
ことができないものであった。
【００１２】また、特開平２−２９０９７６号では、被
処理物の下部からの均一な気泡の発生手段を提案してい
るが、処理液の流れについては何ら検討されておらず、
その結果、処理液の淀み等により均一な気泡を発生して
も処理槽内全体において気泡の分布が不均一となる場合
がある。
【００１３】従って、本発明は上記事情に鑑みて完成さ
れたものであり、その目的は表面処理装置内に浸漬され
た被処理物近傍で、均一な処理液の流れと均一な気泡の
流れが同時に存在し、互いの均一性を損なわない状態を
作り出すことのできる表面処理装置を提供することにあ
る。
【００１４】
【課題を解決するための手段】本発明の表面処理装置
は、処理槽内に収容した処理液中に、被処理物を浸漬
し、該被処理物表面の洗浄やめっき等の表面処理を行う
ためのものであって、前記処理槽内の前記被処理物の設
置領域よりも下部に処理液導入口を設け、該導入口から
処理液を連続的に処理槽内に導入するとともに、前記処
理液導入口と前記被処理物設置領域との間に、前記処理
液導入口側から前記被処理物設置領域側に貫通するよう
に形成された複数の貫通孔と、前記被処理物設置領域側
表面に形成された複数の気泡発生孔を備えた整流板を設
けるとともに、貫通孔１４の形成される領域の最外縁か
ら表面処理槽４の壁面までの距離が、処理槽の上面から
平面的にみた場合の被処理物の設置領域の最外縁から処
理槽の壁面までの距離に対して、１／２〜２倍であるこ
とを特徴とするものである。
【００１５】本発明の表面処理装置によれば、表面処理
槽底部付近の処理液導入口と、表面処理槽内に収容した
処理液中に浸漬された被処理物との間に、板の裏表を貫
通する多数の貫通孔と、気泡発生孔を多数設けた整流板
を設けることにより、整流板上部の被処理物近傍で、整
流板の貫通穴による処理液の均一な上昇流と、整流板の
内部を通じて供給されたガスを整流板上側の気泡発生孔
を通じて処理液中に導入される気泡流の均一な流れを互
いに干渉し合うことなく同時に発生させることができ、
その結果、被処理物表面の条件を均一かつ良好とする事
で、均一かつ品質に優れためっきや洗浄などの表面処理
を実現できる。
【００１６】
【発明の実施の形態】以下、本発明の表面処理装置Ａに
ついて図を参照して説明する。図１は、本発明の表面処
理装置Ａの処理液の流れ状態を説明するための断面図、
図２は、本発明の表面処理装置Ａの気泡の流れ状態を説
明するための断面図である。
【００１７】図１及び図２において、１は処理液導入
口、２は気泡発生用ガス導入管、３は整流手段と気泡発
生手段を兼備した整流板、４は表面処理槽、５は処理
液、６はオーバーフロー部、７は表面処理槽４の開口部
及びそこに形成される処理液５の液表面、８は被処理
物、９は被処理物８を処理液５に浸漬するための治具、
１０は処理液５が開口部７へ向かう流れ、１１は処理液
５中に生じる渦状流れ、１２は気泡、１３は気泡が処理
液中を開口部７へ向かう流れである。
【００１８】図１の表面処理装置Ａによれば、表面処理
槽４には、処理液５を連続的に導入し、処理液の流れを
発生させるための処理液導入口１が処理槽４の底部に設
けられている。この処理液導入口１は、表面処理槽４の
底部において、表面処理槽４内への流れを均一化するた
めに２箇所以上に設けられていることが望ましい。
【００１９】また、被処理物８は、治具９によって支持
固定された状態で、表面処理槽４の処理液導入口１の上
方の領域に設置されている。また、治具９は気泡やめっ
き反応で生じた微小な気泡の被処理物８への付着を防ぐ
ために振動発生手段（図示せず）により揺動されること
もある。
【００２０】そして、被処理物８が設置された領域と、
処理液導入口１が設けられた底部との間には、図３、図
４に示すような、処理液が通過する貫通孔１４と、気泡
発生孔１５を具備する整流板３が設けられており、表面
処理槽４の内部は、整流板３によって、処理液導入口１
設置領域と、被処理物設置領域の２つの領域に完全に分
断されている。
【００２１】かかる構成によれば、処理液導入口１から
表面処理槽４に導入された処理液５は、整流板３にあけ
られた貫通孔１４を通過した後、被処理物８の間を流れ
て表面処理槽４の開口部７に達する。さらに、処理液導
入口１から供給される処理液５の増加により開口部７か
ら溢れ出た処理液５は、開口部７の周囲に設けられたオ
ーバーフロー部６に流れ落ち、オーバーフロー部６に設
けられた処理液回収手段（図示せず）を通じて回収、ポ
ンプ、フィルター、温度調整装置（いずれも図示せず）
等を経て、再び処理液導入口１から表面処理槽４に供給
される。
【００２２】また、気泡発生用ガスの導入口２から導入
されたガスは、整流板３内部を経て整流板３の被処理物
設置領域側の表面に形成された気泡発生穴１５を通じて
表面処理槽４に供給され、気泡１２となって被処理物８
の間を流れたのち、表面処理槽４の開口部７に達し、空
気中へ放出されるか、ガス回収手段（図示せず）により
回収、処理される。
【００２３】整流板３の具体的な構造例として、開口部
７の方向から見た平面図である図３に、また、図３のＸ
−Ｘ断面構造を示す斜視図である図４によれば、整流板
３には、処理液導入口１側から被処理物設置領域側に貫
通するように、複数の貫通孔１４が設けられている。ま
た、整流板３内部には、気泡発生用ガスを導入するため
の空洞部１６が設けられており、その空洞部１６には、
整流板３の空洞部１６に気泡発生用ガスを導入するため
のガス導入管２が取り付けられている。そして、空洞部
１６の被処理物設置領域側表面に気泡発生孔１５が形成
されている。
【００２４】この整流板３は、処理液導入口１から表面
処理槽４に導入される処理液５の流れを少なくとも被処
理物８の近傍で開口部７へ向かう均一な流れとなるよう
整える作用をなす。図１によると、整流板３に設けられ
た貫通孔１４を処理液５が通過することにより処理液５
の均一な流れ１０が形成される。整流板３によって均一
な流れが形成されるのは、整流板３の処理液導入口１側
の不均一な流れが貫通孔１４による流動抵抗によって整
流化されるのである。
【００２５】整流板３全体としての流動抵抗は、貫通孔
１４の口径、孔の個数及び整流板３の厚さ（すなわち貫
通孔１４の長さ）に依存し、貫通孔１４の口径が小さい
ほど、貫通孔１４の個数が少ないほど、また整流板３が
厚いほど、流動抵抗は高くなる。流動抵抗が高いほど貫
通孔１４から吹き出す流れは均一となるが、反面、貫通
孔１４から吹き出す処理液５の流速が過大となって被処
理物８に悪影響を及ぼしたり、処理液５を表面処理槽４
に送り込むためのポンプ（図示せず）に過大な負荷がか
かる等の問題が発生する。
【００２６】したがって、整流板３全体としての流動抵
抗は適当な範囲内にあることが望ましく、その範囲は整
流板３の面積や処理液導入口１の数や位置、処理液５の
流量等にもよるが、流量が１ｃｍ2 当たり、０．０１〜
０．０５リットル／分である場合、貫通孔１４の口径は
１ｍｍ〜１０ｍｍで２００〜８００個の範囲にあること
が望ましい。
【００２７】また、処理液５は、被処理物８の設置領域
を避けて、表面処理槽４と被処理物８の設置領域の間の
被処理物８が設置されていない領域（以下、隙間領域）
へ流れていく傾向がある。そこで、貫通孔１４を整流板
３のどの位置に形成するか配慮されるべきである。
【００２８】本発明によれば、整流板３において、貫通
孔１４を形成する領域は、表面処理槽４の上面から平面
的にみた場合、被処理物８の設置領域の最外縁から表面
処理槽４の壁面までの距離に対して、貫通孔１４の形成
される領域の最外縁から表面処理槽４の壁面までの距離
が１／２〜２倍であることが必要である。
【００２９】このことを図５で示すと、貫通孔１４を形
成する領域が最も狭い場合を（ａ）で示す。図５（ａ）
においては、被処理物８の設置領域Ａの最外縁Ａ1 （図
面では点線で示した）から表面処理槽４の壁面４ａまで
の距離ｘに対して、貫通孔１４の形成される領域Ｂ（斜
線部）の最外縁Ｂ1 から表面処理槽４の壁面までの距離
ｙが２倍である場合である。
【００３０】図５（ｂ）は、貫通孔１４を形成する領域
が最も広い場合をで示すもので、被処理物８の設置領域
Ａの最外縁（図面では点線で示した）から表面処理槽４
の壁面４ａまでの距離ｘに対して、貫通孔１４の形成さ
れる領域Ｂ（斜線部）の最外縁Ｂ1 から表面処理槽４の
壁面までの距離ｙがｘ／２となっている。
【００３１】貫通孔１４を形成する領域Ｂが図５（ａ）
より狭いときには、被処理物８の設置領域から隙間領域
へ漏れる処理液５が、被処理物８の設置領域の両端部で
渦を形成し、均一な流れの形成を妨げてしまう。
【００３２】また、貫通孔１４を形成する領域Ｂが図５
（ｂ）より広いときには、隙間領域に処理液８の流れが
集中し、隙間領域から被処理物８の設置領域へ流れ込む
処理液５が、被処理物８の設置領域の両端部で渦を形成
し、均一な流れの形成を妨げる。
【００３３】一方、図２によると、整流板３は、気泡発
生用ガスの導入管２から導入されたガスを、少なくとも
被処理物８の近傍で開口部７へ向かう均一な気泡の流れ
１３として表面処理槽４に供給する作用をなす。整流板
３の上側の気泡発生孔１５は、吹き出されるガスの量が
整流板３の上面で均一になるような大きさ、数である必
要がある。
【００３４】気泡発生孔１５の大きさ、個数は、整流板
３の面積や上側面の厚さ、気泡発生用ガスの流量等にも
よるが、例えばガス流量が１ｃｍ2 当たり０．０１〜
０．０５リットル／分とする場合、整流板３上側の気泡
発生孔１５の口径は０．５ｍｍ〜３ｍｍで２００〜８０
０個の範囲にあることが望ましい。
【００３５】この範囲よりも気泡発生孔１５の口径が小
さいか個数が少ないと整流板３にガスを送り込むコンプ
レッサなどの装置に過大な負荷がかかり、気泡発生孔１
５の口径が大きいか個数が多いとガスの導入口２近くに
集中して気泡が発生したり、１個の気泡の大きさが大き
すぎるなどの問題が発生する。
【００３６】また、貫通孔１４により生成される処理液
５の均一な流れ１０と整流板３上側の気泡発生孔１５に
より生成される気泡の流れ１３が互いに干渉しないよ
う、流れの発生領域をほぼ同程度にすることが望まし
い。かかる点において、気泡発生孔１５の設置領域を図
５で説明したように、貫通孔１４の設置領域と同様な領
域に形成することが望ましい。
【００３７】なお、整流板３は、図３及び図４のような
構造に限定されず、ガス導入管２から導入されたガスを
整流板３の内部を通って整流板３全体に搬送でき、ガス
を整流板３の上側から均一に吹き出すことができるもの
であれば、材質、構造を特に限定するものではなく、例
えば整流板３の上面に撥水性の多孔性膜を形成してもよ
い。
【００３８】本発明の上記構成によれば、図１、図２に
示したように、均一な処理液５の流れ１０と、均一な気
泡の流れ１３は、互いの流れの障害とならず、発生した
流れ同志も互いの均一性を損なうことがないため、被処
理物８の近傍に均一かつ良好な表面処理条件を与えるこ
とができる。
【００３９】
【実施例】以下、本発明を効果を確認するために以下の
実験を行った。実験では、図１に示す様な表面処理装置
において、被処理物８としてプリント基板を浸漬し、そ
れらの配線部分の無電解銅めっきを実施した。
【００４０】図３、及び図４に示すように、整流板３は
寸法が幅３００ｍｍ、奥行き２８０ｍｍ、厚さ２０ｍｍ
で、上側板の厚さが５ｍｍの中空構造のものとし、貫通
孔１４の口径は５ｍｍで孔の総数は５００個、整流板３
上側の気泡発生孔１５の口径は１ｍｍで孔の総数は５０
０個とした。また、処理液５の流量は毎分２５リット
ル、気泡発生用ガスの流量は毎分１０リットルとした。
【００４１】また従来の方法として、図５のような装置
で、同様のめっき処理を行い、めっき不良発生率の比較
を行った。その結果、図５の従来の装置では不良発生率
が１０％であったのに対し、本発明の装置では０．２％
となり、極めて良好かつ均一なめっき処理条件が提供で
きることが判った。
【００４２】
【発明の効果】以上詳述したように、本発明の表面処理
装置は、処理液導入口と被処理物設置領域との間に、処
理液導入口側から被処理物設置領域側に貫通するように
形成された複数の貫通孔と、前記被処理物設置領域側表
面に形成された複数の気泡発生孔を備えた整流板を設け
ることにより、処理液の流れと、気泡の流れとが相互の
機能の妨げとなることなく、均一な流れとして被処理物
近傍に供給される結果、被処理物の表面処理の均質化を
図ることができる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for immersing an object to be treated in a surface treatment solution contained in a surface treatment tank, and cleaning and plating the surface of the object. And a surface treatment apparatus used for the surface treatment. 2. Description of the Related Art FIG. 6 is a sectional view of a surface treatment tank in a conventional surface treatment apparatus. 6, reference numeral 31 denotes a processing liquid inlet, 32 denotes an inlet for gas for generating bubbles, 33 denotes a surface processing tank, 34 denotes a processing liquid, 35 denotes an overflow section, and 36 denotes a processing liquid.
Is an opening of the surface treatment tank 33 and a liquid surface of the treatment liquid 34 formed therein, 37 is an object to be treated, 38 is a jig for immersing the object 37 in the treatment liquid 34, and 39 is a bubble. . According to such a conventional surface treatment apparatus,
The processing liquid 34 is supplied to the surface processing tank 3 through the processing liquid inlet 31.
3 and continuously supplied into the opening 3 of the surface treatment tank 33.
Reach Further, the processing liquid 3 overflowing from the opening 36 due to an increase in the processing liquid 34 supplied from the processing liquid inlet 31.
4 flows down into an overflow section 35 provided around the opening 36, and is collected through a processing liquid collecting means (not shown) provided in the overflow section 35, a pump, a filter, and a temperature adjusting device (none is shown). ) Etc.,
It is again supplied into the surface treatment tank 33 through the treatment liquid inlet 31. The gas introduced from the gas inlet for gas generation 32 is supplied to the surface treatment tank 33 through a row of holes formed in the gas inlet 32, and becomes bubbles 39 to form an opening in the surface treatment tank 33. 36, and is discharged into the air or collected and processed by gas collecting means (not shown). On the other hand, a plurality of workpieces 3
7 is accommodated in the surface treatment tank 33 while being supported and fixed. At this time, the object 37 is placed above the treatment liquid inlet 31 and the gas inlet 32 for bubble generation gas, and is immersed for a required time to perform a surface treatment. Further, the jig 38 may be swung by vibration generating means (not shown) in order to prevent the bubbles 39 and minute bubbles generated by a plating reaction or the like from adhering to the workpiece 37. In the conventional surface treatment apparatus shown in FIG. 6, there is a problem that the flow of the treatment liquid 34 concentrates in the direction of blowing out from the treatment liquid inlet 31. For example, in the case of a balloon as shown in FIG.
The upward flow toward the opening 36 is concentrated at the center portion and both end portions of the region in which 7 is immersed. Most of the processing liquid 34 that has reached the opening 36 flows down to the overflow section 35 as it is, but a part of the processing liquid 34 turns back from the vicinity of the opening 36 and
A gentle downward flow toward the bottom of the processing tank 33 is formed through the flow toward the bottom. In such a state where the upward flow and the downward flow intersect, a remarkably turbulent flow is formed, for example, a stagnation or a vortex flow is generated in a region where the object 37 is immersed. Further, such a tendency is further promoted by the stirring effect of the processing liquid 34 by the bubbles 39 blown out from the gas inlet 32 for the bubble generation gas. Accordingly, the flow rate of the processing liquid 34 near the surface of the processing object 37 becomes extremely uneven, and the flow rate of the processing liquid 34 near the surface of the processing object 37 affects the plating thickness, the degree of cleaning, and the like. There is a problem that a large variation occurs in the thickness of the plating applied to the object 37, the degree of cleaning, and the like. When the processing solution 34 is made of an electroless plating solution, the supply of bubbles 39 is performed for the purpose of maintaining the dissolved amount of oxygen and the like in the surface processing tank 33 in order to suppress the self-decomposition reaction of the processing solution 34. In this case, the possibility of the processing liquid 34 that has passed for a long time after the supply of oxygen or the like by the bubbles 39 increases in the vicinity of the processing object 37 due to the existence of the descending flow or the vortex flow, Processing liquid 34 near the object 37
In the case where the dissolved amount of oxygen and the like necessary for suppressing the self-decomposition reaction is insufficient, the self-decomposition reaction occurs, causing the plating thickness to vary and the plating quality to be significantly deteriorated due to adhesion to the surface of the workpiece 37. was there. Therefore, in order to realize high quality surface treatment with little variation, it is necessary to simultaneously provide a uniform flow of the processing solution and a uniform flow of bubbles in the surface processing apparatus. To solve such a problem, Japanese Patent Application Laid-Open No. Sho 62-29
In No. 4182, it is proposed to provide a flow straightening plate made of a perforated plate. However, in this method, it is possible to make the flow of the processing liquid uniform by adjusting the way of forming holes in the current straightening plate. However, the flow of bubbles could not be made uniform at the same time. Japanese Patent Application Laid-Open No. 2-290976 proposes means for generating uniform air bubbles from the lower part of the object to be processed. However, the flow of the processing liquid has not been studied at all.
As a result, even if uniform bubbles are generated due to the stagnation of the processing liquid or the like, the distribution of the bubbles may be uneven throughout the processing tank. Accordingly, the present invention has been completed in view of the above circumstances, and an object of the present invention is to provide a uniform flow of a processing solution and a uniform flow of bubbles near an object to be immersed in a surface treatment apparatus. It is an object of the present invention to provide a surface treatment apparatus which can exist at the same time and can create a state in which uniformity is not impaired. [0014] The surface treatment apparatus of the present invention immerses an object to be treated in a treatment solution contained in a treatment tank, and cleans the surface of the object to be treated and performs surface treatment such as plating. It is for performing a process, a processing liquid inlet is provided below the installation area of the object to be processed in the processing tank, and the processing liquid is continuously introduced into the processing tank from the inlet. A plurality of through-holes formed between the processing liquid introduction port and the processing object installation area to penetrate from the processing liquid introduction port side to the processing object installation area side; formed in the installation region side surface a plurality of bubble generation hole with a rectifying plate set <br/> only Rutotomoni, or outermost edge of the area formed of the through-holes 14
From the top surface of the processing tank
From the outermost edge of the installation area of the workpiece
1/2 to 2 times the distance to the wall
It is characterized by the following. According to the surface treatment apparatus of the present invention, the front and back of the plate are placed between the treatment liquid inlet near the bottom of the surface treatment tank and the object immersed in the treatment liquid contained in the surface treatment tank. By providing a large number of through-holes and a straightening plate provided with a large number of bubble generating holes, a uniform ascending flow of the processing liquid through the through-holes of the straightening plate and the straightening plate near the object to be processed above the straightening plate, The gas supplied through the inside can be simultaneously generated without interfering with the uniform flow of the bubble flow introduced into the processing liquid through the bubble generation holes on the upper side of the rectifier plate,
As a result, uniform and good surface treatment such as plating and cleaning can be realized by making the conditions of the surface of the object to be treated uniform and good. Hereinafter, a surface treatment apparatus A of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view for explaining a flow state of a processing liquid in a surface treatment apparatus A of the present invention,
FIG. 2 is a cross-sectional view for explaining the flow state of bubbles in the surface treatment apparatus A of the present invention. 1 and 2, reference numeral 1 denotes a processing liquid inlet, 2 denotes a gas introduction pipe for generating bubbles, 3 denotes a rectifying plate having both rectifying means and bubble generating means, 4 denotes a surface treatment tank, and 5 denotes a processing liquid. , 6 are an overflow portion, 7 is an opening of the surface treatment tank 4 and a liquid surface of the treatment liquid 5 formed therein, 8 is an object to be treated, and 9 is a treatment for immersing the object 8 in the treatment liquid 5. Utensils,
Reference numeral 10 denotes a flow of the processing liquid 5 toward the opening 7, reference numeral 11 denotes a vortex flow generated in the processing liquid 5, reference numeral 12 denotes a bubble, and reference numeral 13 denotes a flow of the bubble toward the opening 7 in the processing liquid. According to the surface treatment apparatus A of FIG. 1, the treatment liquid 5 is continuously introduced into the surface treatment tank 4, and the treatment liquid inlet 1 for generating a flow of the treatment liquid is provided in the treatment tank 4. It is provided at the bottom. It is desirable that the treatment liquid inlets 1 are provided at two or more locations at the bottom of the surface treatment tank 4 in order to make the flow into the surface treatment tank 4 uniform. The object 8 is placed in a region above the treatment liquid inlet 1 of the surface treatment tank 4 while being supported and fixed by a jig 9. Further, the jig 9 may be swung by vibration generating means (not shown) in order to prevent bubbles or minute bubbles generated by a plating reaction from adhering to the workpiece 8. Then, an area where the object 8 is placed,
As shown in FIGS. 3 and 4, a flow straightening plate 3 having a through hole 14 through which the processing liquid passes and a baffle generating hole 15 is provided between the bottom and the bottom where the processing liquid inlet 1 is provided. The inside of the surface treatment tank 4 is treated by the current plate 3 with the treatment liquid inlet 1.
It is completely divided into two areas, an installation area and a workpiece installation area. According to this configuration, the processing liquid 5 introduced from the processing liquid inlet 1 into the surface processing tank 4 passes through the through holes 14 formed in the current plate 3 and then flows between the processing objects 8. It flows and reaches the opening 7 of the surface treatment tank 4. Further, the processing liquid 5 that has overflowed from the opening 7 due to an increase in the processing liquid 5 supplied from the processing liquid inlet 1 flows down into an overflow section 6 provided around the opening 7 and is provided in the overflow section 6. Recovery through a processing liquid recovery means (not shown), a pump, a filter, and a temperature controller (none is shown)
After that, it is supplied again to the surface treatment tank 4 from the treatment liquid inlet 1. Further, the gas introduced from the gas inlet 2 for the bubble generation gas passes through the inside of the flow straightening plate 3 and passes through the air bubble generating hole 15 formed on the surface of the straightening plate 3 on the side of the workpiece to be processed. 4 to be processed into bubbles 12
After that, it reaches the opening 7 of the surface treatment tank 4 and is discharged into the air or collected and processed by gas collecting means (not shown). As a specific structure example of the current plate 3, FIG. 3 which is a plan view viewed from the direction of the opening 7 and FIG.
According to FIG. 4, which is a perspective view showing a −X cross-sectional structure, a plurality of through holes 14 are provided in the current plate 3 so as to penetrate from the processing liquid introduction port 1 side to the processing object installation area side. I have. Further, a cavity 16 for introducing a gas for generating bubbles is provided inside the current plate 3, and the cavity 16 has
A gas introduction pipe 2 for introducing gas for generating bubbles is attached to the cavity 16 of the current plate 3. The bubble generating holes 15 are formed on the surface of the hollow portion 16 on the side of the object to be treated. The flow regulating plate 3 acts to adjust the flow of the processing liquid 5 introduced from the processing liquid inlet 1 into the surface processing tank 4 so as to be a uniform flow toward the opening 7 at least near the workpiece 8. Make According to FIG. 1, the processing liquid 5 passes through the through-hole 14 provided in the current plate 3 so that the processing liquid 5
Is formed. The reason why a uniform flow is formed by the rectifying plate 3 is that the non-uniform flow of the rectifying plate 3 on the side of the processing liquid inlet 1 is rectified by the flow resistance of the through hole 14. The flow resistance of the current plate 3 as a whole depends on the diameter of the through holes 14, the number of holes, and the thickness of the current plate 3 (ie, the length of the through holes 14). The flow resistance increases as the number of through holes 14 decreases and as the flow straightening plate 3 becomes thicker. The higher the flow resistance, the more uniform the flow blown out from the through-holes 14, but, on the other hand, the flow velocity of the processing liquid 5 blown out from the through-holes 14 becomes excessively large, adversely affecting the workpiece 8, or causing the processing liquid 5 to undergo surface treatment. Tank 4
Problems such as an excessive load being applied to a pump (not shown) for feeding the oil into the pump. Therefore, the flow resistance of the flow straightening plate 3 as a whole is desirably within an appropriate range. The range depends on the area of the flow straightening plate 3, the number and position of the processing liquid inlets 1, the flow rate of the processing liquid 5, and the like. but it depends, the flow rate is 1cm 2 per, 0.01
In the case of 0.05 liter / min, the diameter of the through holes 14 is desirably 1 mm to 10 mm and in the range of 200 to 800 holes. Further, the processing liquid 5 avoids the area where the object 8 is to be installed and avoids the area where the object 8 is to be installed between the surface treatment tank 4 and the area where the object 8 is to be installed (hereinafter referred to as a gap). region)
There is a tendency to flow to. Therefore, consideration should be given to where the through hole 14 is formed in the current plate 3. According to the present invention, in the current plate 3, the area in which the through-hole 14 is formed is viewed from the upper surface of the surface treatment tank 4 in plan view from the outermost edge of the installation area of the workpiece 8. The distance from the outermost edge of the region where the through hole 14 is formed to the wall surface of the surface treatment tank 4 needs to be 1/2 to 2 times the distance to the wall surface of the surface treatment tank 4. FIG. 5 shows this case, where (a) shows a case where the area where the through hole 14 is formed is the narrowest. FIG. 5 (a)
In the case of the distance B from the outermost edge A 1 of the installation area A of the workpiece 8 (indicated by a dotted line in the drawing) to the wall surface 4a of the surface treatment tank 4, the area B where the through hole 14 is formed ( distance y from the outermost edge B 1 to the wall surface of the surface treatment tank 4 the hatched portion) is the case is twice. FIG. 5B shows a case where the area in which the through hole 14 is formed is the widest, and the surface treatment tank starts from the outermost edge (indicated by a dotted line in the drawing) of the installation area A of the workpiece 8. 4
With respect to the distance x from the wall 4a of the distance y from the outermost edge B 1 to the wall surface of the surface treatment tank 4 is in the x / 2 in the region B formed of the through-hole 14 (the hatched portion). FIG. 5A shows a region B where the through hole 14 is formed.
When it is narrower, the processing liquid 5 leaking from the installation area of the processing object 8 to the gap area forms a vortex at both ends of the installation area of the processing object 8 and prevents formation of a uniform flow. The region B in which the through hole 14 is formed is shown in FIG.
(B) When it is wider, the flow of the processing liquid 8 concentrates in the gap area, and the processing liquid 5 flowing from the gap area to the installation area of the processing object 8 forms a vortex at both ends of the installation area of the processing object 8. And prevent the formation of a uniform flow. On the other hand, according to FIG. 2, the rectifying plate 3 converts the gas introduced from the bubble generation gas introduction pipe 2 into a uniform bubble flow 13 toward the opening 7 at least in the vicinity of the workpiece 8. It has the function of supplying to the surface treatment tank 4. The bubble generation holes 15 on the upper side of the current plate 3 need to have a size and a number such that the amount of gas to be blown out is uniform on the upper surface of the current plate 3. The size of the bubble generating holes 15, the number is the current plate 3 of the area and the upper side thick, depending on the flow rate, etc. of the bubble generating gas, such as gas flow rate is 1 cm 2 per 0.01
In the case of 0.05 liter / minute, the diameter of the bubble generation hole 15 on the upper side of the current plate 3 is 0.5 mm to 3 mm and 200 to 80 mm.
It is desirable to be in the range of zero. If the diameter of the bubble generating holes 15 is smaller or smaller than this range, an excessive load is applied to a device such as a compressor for feeding gas to the flow straightening plate 3, and the bubble generating holes 1
If the diameter of the nozzle 5 is large or the number of nozzles 5 is large, there arises a problem that bubbles are generated near the gas inlet 2 and that the size of one bubble is too large. In addition, the flow generation region is set substantially so that the uniform flow 10 of the processing liquid 5 generated by the through holes 14 and the flow 13 of the bubbles generated by the bubble generation holes 15 on the rectifying plate 3 do not interfere with each other. It is desirable to make the same. In this respect, it is desirable that the installation region of the bubble generation hole 15 be formed in the same region as the installation region of the through hole 14, as described with reference to FIG. The structure of the current plate 3 is not limited to the structure shown in FIGS. 3 and 4, and the gas introduced from the gas introduction pipe 2 can be conveyed to the entire current plate 3 through the inside of the current plate 3. The material and structure are not particularly limited as long as the gas can be blown out uniformly from the upper side of the current plate 3. For example, a water-repellent porous film may be formed on the upper surface of the current plate 3. According to the above configuration of the present invention, as shown in FIGS. 1 and 2, the uniform flow 10 of the processing liquid 5 and the uniform flow 13 of the bubble do not hinder each other's flow. Since the generated flows do not impair each other's uniformity, uniform and favorable surface treatment conditions can be provided in the vicinity of the processing object 8. EXAMPLES The following experiments were conducted to confirm the effects of the present invention. In the experiment, a printed circuit board was immersed in the surface treatment apparatus as shown in FIG. 1 as the object 8 to be treated, and electroless copper plating of those wiring portions was performed. As shown in FIGS. 3 and 4, the current plate 3 has a width of 300 mm, a depth of 280 mm, and a thickness of 20 mm.
The upper plate has a hollow structure with a thickness of 5 mm, the diameter of the through hole 14 is 5 mm, the total number of holes is 500,
The diameter of the upper bubble generation hole 15 is 1 mm and the total number of holes is 50.
The number was set to 0. The flow rate of the processing liquid 5 was 25 liters per minute, and the flow rate of the bubble generation gas was 10 liters per minute. Further, as a conventional method, the same plating treatment was performed using an apparatus as shown in FIG. 5, and the incidence of plating defects was compared. As a result, the defect occurrence rate was 10% in the conventional apparatus of FIG.
It was found that extremely good and uniform plating conditions could be provided. As described above in detail, the surface treatment apparatus of the present invention is provided between the processing liquid inlet and the processing object installation area from the processing liquid introduction port to the processing object installation area. By providing a flow straightening plate having a plurality of through holes formed so as to penetrate through and a plurality of bubble generating holes formed on the surface of the processing object installation area, a flow of a processing liquid and a flow of bubbles are provided. Are supplied to the vicinity of the object to be processed as a uniform flow without obstructing mutual functions, so that the surface treatment of the object to be processed can be homogenized.
【図面の簡単な説明】
【図１】本発明の表面処理装置Ａにおける処理液の流れ
状態を説明するための断面図である。
【図２】本発明の表面処理装置Ａにおける気泡の流れ状
態を説明するための断面図である。
【図３】本発明における整流板の具体例の平面図であ
る。
【図４】図３の整流板におけるＸ−Ｘ断面構造を示す斜
視図である。
【図５】本発明における整流板での貫通孔形成領域を説
明するためのもので、（ａ）は形成領域が最も狭い場
合、（ｂ）は最も広い場合である。
【図６】従来の表面処理装置の概略断面図である。
【符号の説明】
１：処理液導入口，２：気泡発生用ガス導入管、３：整
流板，４：表面処理槽，５：処理液、６：オーバーフロ
ー部、７：開口部又は液表面、８：被処理物、９：治
具、１２：気泡、１４：貫通孔、１５：気泡発生孔、１
６：空洞部BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view for explaining a flow state of a processing liquid in a surface treatment apparatus A of the present invention. FIG. 2 is a cross-sectional view for explaining a flow state of bubbles in the surface treatment apparatus A of the present invention. FIG. 3 is a plan view of a specific example of a current plate in the present invention. FIG. 4 is a perspective view showing a cross-sectional structure taken along line XX of the current plate of FIG. 5A and 5B are diagrams for explaining a through-hole forming region in the current plate in the present invention, wherein FIG. 5A shows a case where the forming region is the narrowest, and FIG. 5B shows a case where the forming region is the widest. FIG. 6 is a schematic sectional view of a conventional surface treatment apparatus. [Description of Signs] 1: Treatment liquid inlet, 2: Gas introduction pipe for bubble generation, 3: Rectifier plate, 4: Surface treatment tank, 5: Treatment liquid, 6: Overflow part, 7: Opening or liquid surface, 8: Workpiece, 9: Jig, 12: Bubble, 14: Through hole, 15: Bubble generation hole, 1
6: cavity
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C23C 18/31 C25D 5/08 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) C23C 18/31 C25D 5/08
Claims (1)
を浸漬し、該被処理物表面の洗浄やめっき等の表面処理
を行うための表面処理装置において、前記処理槽内の前
記被処理物の設置領域よりも下部に処理液導入口を設
け、該導入口から処理液を連続的に処理槽内に導入する
とともに、前記処理液導入口と前記被処理物設置領域と
の間に、前記処理液導入口側から前記被処理物設置領域
側に貫通するように形成された複数の貫通孔と、前記被
処理物設置領域側表面に形成された複数の気泡発生孔を
備えた整流板を設けるとともに、貫通孔１４の形成され
る領域の最外縁から表面処理槽４の壁面までの距離が、
処理槽の上面から平面的にみた場合の被処理物の設置領
域の最外縁から処理槽の壁面までの距離に対して、１／
２〜２倍であることを特徴とする表面処理装置。(57) [Claims 1] A surface for immersing an object to be processed in a processing solution contained in a processing tank and performing a surface treatment such as cleaning or plating of the surface of the object to be processed. In the processing apparatus, a processing liquid introduction port is provided below the installation area of the object to be processed in the processing tank, and the processing liquid is continuously introduced into the processing tank from the introduction port, and the processing liquid introduction port is provided. A plurality of through-holes formed so as to penetrate from the processing liquid inlet side to the processing object installation area side between the processing object installation area side and the processing object installation area side; and a plurality of Rutotomoni provided a rectifying plate having a bubble generation hole, is formed in the through hole 14
The distance from the outermost edge of the region to the surface of the surface treatment tank 4 is
Installation area of the object to be processed when viewed from the top of the processing tank
The distance from the outermost edge of the area to the wall of the treatment tank is 1 /
A surface treatment apparatus characterized in that the number is 2 to 2 times .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08638598A JP3450179B2 (en) | 1998-03-31 | 1998-03-31 | Surface treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08638598A JP3450179B2 (en) | 1998-03-31 | 1998-03-31 | Surface treatment equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11279767A JPH11279767A (en) | 1999-10-12 |
| JP3450179B2 true JP3450179B2 (en) | 2003-09-22 |
Family
ID=13885419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08638598A Expired - Fee Related JP3450179B2 (en) | 1998-03-31 | 1998-03-31 | Surface treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3450179B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI343840B (en) * | 2005-07-06 | 2011-06-21 | Applied Materials Inc | Apparatus for electroless deposition of metals onto semiconductor substrates |
| JP6026356B2 (en) * | 2013-06-03 | 2016-11-16 | 富士フイルム株式会社 | Deposition equipment |
-
1998
- 1998-03-31 JP JP08638598A patent/JP3450179B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11279767A (en) | 1999-10-12 |
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