JP3535051B2 - Surface treatment equipment - Google Patents
Surface treatment equipmentInfo
- Publication number
- JP3535051B2 JP3535051B2 JP24664799A JP24664799A JP3535051B2 JP 3535051 B2 JP3535051 B2 JP 3535051B2 JP 24664799 A JP24664799 A JP 24664799A JP 24664799 A JP24664799 A JP 24664799A JP 3535051 B2 JP3535051 B2 JP 3535051B2
- Authority
- JP
- Japan
- Prior art keywords
- processing liquid
- processing
- flow
- surface treatment
- bubbles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Chemically Coating (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、処理槽内に供給さ
れた処理液中に被処理物を浸漬し、その被処理物表面の
洗浄やめっき等の表面処理を行う表面処理装置に関する
ものである。
【０００２】
【従来の技術】従来の表面処理装置における処理槽部分
の概略図を図５に示す。図５において、３１は処理液導
入口、３２は気泡発生用ガス導入口、３３は処理槽、３
４は処理液、３５はオーバーフロー部、３６は処理槽３
３の開口部、３７は被処理物、３８は被処理物３７を処
理液３４に浸漬するための治具、３９は気泡である。
【０００３】このような従来の表面処理装置Ｑによれ
ば、処理液導入口３１を通じて処理液３４が、処理槽３
３内に連続的に供給され、処理槽３３の開口部３６に達
する。さらに、処理液導入口３１から供給される処理液
３４の増加により開口部３６から溢れ出た処理液３４
は、開口部３６の周囲に設けられたオーバーフロー部３
５に流れ落ち、オーバーフロー部３５に設けられた処理
液回収手段（図示せず）を通じて回収され、ポンプ、フ
ィルタ、温度調整装置（いずれも図示せず）等を経て、
再び処理液導入口３１から処理槽３３内に循環供給され
る。
【０００４】また、気泡発生用ガス導入口３２から導入
されたガスは、導入口３２にあけられた穴列を通じて処
理槽３３に供給され、気泡３９となって処理槽３３の開
口部３６における液面に達し、空気中へ放出されるか、
ガス回収手段（図示せず）により回収、処理される。
【０００５】一方、複数の被処理物３７は、治具３８に
よって支持固定された状態で処理槽３３内に設置され
る。この時、被処理物３７は、処理液導入口３１と気泡
発生用ガス導入口３２の上側に設置され、必要時間浸漬
することによって被処理物３７の表面処理が行われる。
【０００６】なお、治具３８は気泡３９やめっき反応で
生じた微小な気泡の被処理物３７への付着を防ぐために
振動発生手段（図示せず）により揺動されることもあ
る。
【０００７】
【発明が解決しようとする課題】しかしながら、図５に
示す従来の表面処理装置Ｑでは、処理液導入口３１から
の吹き出し方向に沿って処理液３４の流れが集中すると
いう問題がある。例えば図５のような吹き出しの場合、
被処理物３７を浸漬している領域の中央部と両端部に開
口部３６へ向かう上昇流が集中する。開口部３６に到達
した処理液３４の多くはそのままオーバーフロー部３５
に流れ落ちるが、一部は開口部３６付近から折り返して
開口部３６へ向かう流れの間を通って処理槽３３の底部
へ向かう緩やかな下降流を形成する。
【０００８】このような上昇流と下降流の入り混じる状
態では、被処理物３７の浸漬されている領域において淀
みや渦状流が発生するなど、著しく乱れた流れが形成さ
れるとともに、気泡発生用ガス導入口３２より吹き出さ
れる気泡３９の攪拌作用によってさらに処理液３４の流
れが乱される傾向にあった。
【０００９】従って、被処理物３７表面近傍の処理液３
４の流速は著しく不均一となり、被処理物３７表面近傍
の処理液３４の流速がめっき厚みや洗浄度合い等に影響
を与えるため、被処理物３７に施されるめっきの厚みや
洗浄の度合いに大きなバラツキが発生するという課題が
あった。
【００１０】また、処理液３４が無電解めっき液からな
り、気泡３９の供給が処理液３４の自己分解反応抑制の
ために処理槽３３中の酸素等の溶存量を保持する目的で
行われている場合には、前記の下降流や渦状流の存在に
より、被処理物３７の近傍には気泡３９による酸素等の
供給後長時間経過した処理液３４が滞留する可能性が高
くなるため、被処理物３７の近傍の処理液３４中で自己
分解反応抑制に必要な酸素等の溶存量が欠乏し、自己分
解反応が起こって、反応生成物が被処理物３７表面に付
着するなどしてめっき厚みのバラツキやめっき品質の著
しい悪化を引き起こすことがあった。
【００１１】従って、バラツキが少なく品質の良い表面
処理を実現するためには、表面処理装置内で均一な処理
液の流れと均一な気泡の流れを同時に与えることが求め
られる。
【００１２】このような課題に対し、特開昭６２−２９
４１８２号においては、多孔板からなる整流板を設ける
ことが提案されているが、この方法では、多孔板の穴の
空け方などを調整することで、処理液の流れを均一にす
ることは可能であるが、気泡の流れを同時に均一化する
ことができないものであった。
【００１３】また、特開平２−２９０９７６号では、被
処理物の下部からの均一な気泡の発生手段を提案してい
るが、処理液の流れについては何ら検討されておらず、
その結果、均一な気泡を発生しても、処理液の淀み等に
よって処理槽全体における気泡の分布が不均一となる場
合があった。
【００１４】さらに、これらの提案では、多孔板を用い
ることで処理液や気泡の均一な流れが実現できることを
前提としているが、多孔板前後の処理槽の状態、あるい
は処理液や気泡用ガスの搬送用流路の状態によっては必
ずしも均一な流れを発生させることはできず、多孔板の
一部に流れが集中し、結果的に処理槽内で所望の均一な
流れを実現することは難しいものであった。
【００１５】従って、本発明は上記事情に鑑みて完成さ
れたものであり、その目的は表面処理装置内に浸漬され
た被処理物の近傍で、均一な処理液の流れと均一な気泡
の流れを安定して発生させると同時に、互いの均一性を
損なわない状態を作り出すことのできる表面処理装置を
提供することにある。
【００１６】
【課題を解決するための手段】そこで、本発明の表面処
理装置は、処理槽内に供給された処理液中に被処理物を
浸漬することで、被処理物表面の洗浄やめっき等の表面
処理を施すためのものであって、前記処理槽内の前記被
処理物の設置領域よりも下部に、処理液導入手段及び気
泡発生手段をそれぞれ設置して成り、これら処理液導入
手段及び気泡発生手段を共に、Ｈ字型分岐配管を組み合
わせた配管構造を有し、各Ｈ字型分岐配管が１／２配管
長で順次分岐して成り、その末端に位置するＨ字型分岐
配管の４隅から処理液又は気泡を処理槽中へ導入するよ
うにしたことを特徴とする。
【００１７】
【発明の実施の形態】以下、本発明の実施形態について
説明する。
【００１８】図１は本発明に係る表面処理装置Ｐにおけ
る処理液の流れを説明するための概略図、図２は本発明
に係る表面処理装置Ｐにおける気泡の流れを説明するた
めの概略図である。
【００１９】図１及び図２において、１は処理液導入
管、２は気泡発生用ガス導入管、３は処理液の分岐配
管、４は気泡発生用ガスの分岐配管、５は処理液の吹出
口、６は気泡発生用ガスの吹出口、７は処理槽、８は処
理液、９はオーバーフロー部、１０は処理槽７の開口
部、１１は被処理物、１２は被処理物１１を処理液８に
浸漬するための治具、１３は処理液８が開口部１０へ向
かう流れ、１４は処理液８中に生じる渦状の流れ、１５
は気泡、１６は気泡が処理液８中を開口部１０へ向かう
流れであり、処理液の分岐配管３と処理液の吹出口５と
で処理液導入手段を形成するとともに、気泡発生用ガス
の分岐配管４と気泡の吹出口６とで気泡発生手段を構成
するようになっている。
【００２０】そして、処理液導入手段は、図１において
処理液導入管１から導入された処理液８を、少なくとも
被処理物１１の近傍で開口部１０へ向かう均一な流れ１
３として処理槽７に供給するためのものであり、気泡発
生手段は、図２において気泡発生用ガス導入管２から導
入されたガスを、少なくとも被処理物１１の近傍で開口
部１０へ向かう均一な気泡の流れ１６として処理槽７に
供給するためのものである。
【００２１】また、被処理物１１は、治具１２によって
支持固定された状態で、処理槽７中の処理液導入手段及
び気泡発生手段の上方の領域に設置されている。なお、
治具１２は気泡やめっき等の表面処理反応で生じた微小
な気泡の被処理物１１への付着を防ぐために振動発生手
段（図示せず）により揺動させても良い。
【００２２】かかる構成によれば、処理液導入手段から
処理槽７に導入された処理液８は、被処理物１１の間を
流れて処理槽７の開口部１０に達する。さらに、処理液
導入管１から供給される処理液８の増加により開口部１
０から溢れ出た処理液８は、開口部１０の周囲に設けら
れたオーバーフロー部９に流れ落ち、オーバーフロー部
９に設けられた処理液回収手段（図示せず）を通じて回
収され、ポンプ、フィルタ、温度調整装置（いずれも図
示せず）等を経て、再び処理液導入管１から処理槽７に
循環供給される。
【００２３】また、気泡発生用ガス導入管２から導入さ
れたガスは、気泡発生手段を通じて処理槽７中に供給さ
れ、気泡１５となって被処理物１１の間を流れたのち、
処理槽７の開口部１０における液面に達し、空気中へ放
出されるか、ガス回収手段（図示せず）により回収、処
理される。
【００２４】そして、本発明によれば、処理液導入手段
からの処理液の流れを均一化するとともに、気泡発生手
段からの気泡の流れを均一化するため、これら処理液導
入手段及び気泡発生手段を共に、Ｈ字型分岐配管を組み
合わせた配管構造とし、かつ各Ｈ字型分岐配管が１／２
配管長で順次分岐するようにして成り、その末端に位置
するＨ字型分岐配管の４隅から処理液又は気泡を処理槽
中へ導入するようにしたことを特徴とする。
【００２５】以下、その具体例を図３をもとに説明す
る。なお、処理液導入手段及び気泡発生手段はいずれも
同様の配管構造を有するものであるため、処理液導入手
段を例にとって説明する。
【００２６】図３は処理液導入手段を処理槽７の開口部
１０の方向から見た平面図で、２１は処理液導入管１か
ら最初の分岐まで延びた管であり、該管２１は第１のＨ
字型分岐配管３ａと連通し、このようなＨ字型分岐配管
３ｎを階層的に順次繰り返したものである。
【００２７】即ち、第１次の分岐は、管２１の先端よ
り、図の水平方向へ長さＬ11で分岐し、さらにその両先
端から図の垂直方向へ長さＬ12で分岐する。第２次の分
岐は、第１次分岐の全先端より、図の水平方向へ長さＬ
21で分岐し、さらにそれらの全先端から図の垂直方向へ
長さＬ22で分岐する。全く同様に、第３次、第４次と任
意の次数の分岐を繰り返す。この時、第ｎ次分岐の各分
岐配管の長さＬn1及びＬn2は、第ｎ−１次分岐の各分岐
配管の長さＬ(n-1)1及びＬ(n-1)2から次の関係式で決定
される。
【００２８】Ｌn1／Ｌ(n-1)1＝Ｌn2／Ｌ(n-1)2＝１／２
この様な分岐を無数に繰り返した場合を考慮すると、第
１次分岐の各分岐配管の長さＬ11、Ｌ12は、処理液８を
供給したい領域の各辺の長さＬ1 及びＬ2 に対して、
Ｌ11／Ｌ1 ＝Ｌ12／Ｌ2 ＝１／２
でなければならないことが判る。
【００２９】このような自己相似的な分岐の繰り返しで
作られる幾何形状は、フラクタル形状と呼ばれ、特に本
発明におけるＨ字型の分岐構造によるものはＨ−フラク
タル形状と呼ばれ、このような分岐構造をもって形成す
ることにより、管２１から末端に位置する全てのＨ字型
分岐配管までの距離及び配管の屈曲数を同じにすること
ができる。そして、その末端に位置するＨ字型分岐配管
３ｅの４隅を処理液８の吹出口５としてあるため、全て
の吹出口５までの流動抵抗を等しくできるため、吹出口
５から処理槽７中に供給される処理液８の量を均等にで
き、処理液８の流れを均一化することがきる。なお、吹
出口５は、処理槽７の開口部１０に向けて設置すること
が望ましい。
【００３０】なお、分岐の階層数は、任意の次数でよ
く、求められる処理液８の供給の均一さの程度や製作可
能な配管の太さを考慮して決定すれば良い。また、配管
の太さ及び断面形状は同一次の分岐配管で等しければ良
く、その他の制限は製作可能な範囲において何ら設ける
必要はない。
【００３１】そして、気泡発生手段においても図３と同
様の分岐構造でもって形成することにより、処理槽７内
の処理液８中に均一な流れの気泡１５を発生させること
ができ、処理槽７内における処理液８の流れ及び気泡１
５の流れの両方を均一化することができるため、被処理
物１１の近傍に均一かつ良好な表面処理条件を与えるこ
とができ、結果としてめっき厚みのばらつきや洗浄度合
いのばらつきを極めて小さくすることができる。
【００３２】ただし、処理液８は、被処理物１１の設置
領域を避けて、処理槽７と被処理物１１の設置領域の間
の被処理物１１が設置されていない領域（以下、隙間領
域）へ流れていく傾向がある。そこで、処理液導入手段
の占有領域（分岐配管全体が占める領域を指す）をどの
範囲とするか考慮されるべきである。
【００３３】処理液導入手段の占有領域は、処理槽７の
開口部１０から平面的に見た場合、被処理物１１の設置
領域の最外縁から処理槽７の壁面までの距離に対して、
処理液導入手段の占有領域の最外縁から処理槽７の壁面
までの距離が、１／２〜２倍であることが望ましい。
【００３４】このことを図４で示すと、処理液導入手段
の占有領域Ｂが最も狭い場合を（ａ）で示す。図４
（ａ）においては、被処理物１１の設置領域Ａの最外縁
Ａ1 から処理槽７の壁面７ａまでの距離ｘに対して、処
理液導入手段の占有領域Ｂの最外縁Ｂ1 から処理槽７の
壁面７ａまでの距離ｙが２倍である場合である。
【００３５】図４（ｂ）は、処理液導入手段の占有領域
Ｂが最も広い場合を示すもので、被処理物１１の設置領
域Ａの最外縁Ａ1 から処理槽７の壁面７ａまでの距離ｘ
に対して、処理液導入手段の占有領域Ｂの最外縁Ｂ1 か
ら処理槽７の壁面７ａまでの距離ｙが１／２倍となって
いる。
【００３６】この理由としては、処理液導入手段の占有
領域Ｂが図４（ａ）より狭いときには、被処理物１１の
設置領域Ａから隙間領域へ漏れる処理液８が、被処理物
１１の設置領域Ａの両端部で渦を形成し、均一な流れの
形成を妨げてしまうからであり、処理液導入手段の占有
領域Ｂが図４（ｂ）より広いときには、隙間領域に処理
液８の流れが集中し、隙間領域から被処理物１１の設置
領域Ａへ流れ込む処理液８が、被処理物１１の設置領域
Ａの両端部で渦を形成し、均一な流れの形成を妨げるか
らである。
【００３７】また、処理液導入手段により供給される処
理液８の均一な流れ１３と、気泡発生手段により生成さ
れる気泡１５の均一な流れ１６が互いに干渉しないよ
う、互いの占有領域をほぼ同一範囲とすることが望まし
い。かかる点において、気泡発生手段の占有領域を、図
４で説明したように処理液導入手段の占有領域と同様な
領域に設置することが望ましい。
【００３８】さらに、処理液の吹出口５と気泡の吹出口
６が処理槽７の開口部１０側より見て重ならないよう、
水平方向に適当量ずらして設置することが望ましい。
【００３９】なお、処理液導入手段及び気泡発生手段
は、図３のような分岐構造を実現できるのであればいか
なる材質、製作方法を用いても良く、例えば、分岐構造
のパイプを用いても、平板にＨ字型分岐配管の構造を溝
状に彫った上に別の平板で封止するようにしても良い。
【００４０】以上のように、本発明によれば、図１に示
した均一な処理液８の流れ１３と、図２に示した均一な
気泡１５の流れ１６が、互いの流れ１３，１６の障害と
ならず、互いの流れ１３，１６の均一性を損なうことが
ないため、被処理物１１の近傍に均一かつ良好な表面処
理条件を与えることができる。
【００４１】
【実施例】以下、本発明の効果を確認するために以下の
実験を行った。実験では、図１に示す様な表面処理装置
Ｐにおいて、被処理物１１としてプリント基板を浸漬
し、それらの配線部分の無電解銅めっきを実施した。
【００４２】処理液導入手段及び気泡発生手段は、図３
及び図４に示すような４次までのＨ字型分岐配管を有す
る配管構造を用いた。また、処理液導入手段及び気泡発
生手段の占有領域の寸法は幅３００ｍｍ、奥行き２８０
ｍｍとした。そして、処理液８の流量は毎分２５リット
ル、気泡発生用ガスの流量は毎分１０リットルとし、め
っき処理を施した。
【００４３】また、従来の表面処理装置として、図５の
ような装置Ｑで、同様のめっき処理を行い、めっき不良
発生率の比較を行った。
【００４４】この結果、従来の表面処理装置Ｑでは不良
発生率が１０％であったのに対し、本発明の表面処理装
置Ｐでは０．１２％となり、極めて良好かつ均一なめっ
き処理条件が得られることが判った。
【００４５】
【発明の効果】以上のように、本発明の表面処理装置に
よれば、処理槽内に供給された処理液中に被処理物を浸
漬することで、被処理物表面の洗浄やめっき等の表面処
理を施すためのものであって、前記処理槽内の前記被処
理物の設置領域よりも下部に、処理液導入手段及び気泡
発生手段をそれぞれ設置して成り、これら処理液導入手
段及び気泡発生手段を共に、Ｈ字型分岐配管を組み合わ
せた配管構造を有し、各Ｈ字型分岐配管が１／２配管長
で順次分岐して成り、その末端に位置するＨ字型分岐配
管の４隅から処理液又は気泡を処理槽中へ導入するよう
にしたことから、処理液及び気泡発生用ガスの供給源か
ら全ての吹出口までの距離及び配管の屈曲数を全て等し
くできるため、各吹出口から均等な処理液及び気泡を供
給することができ、被処理物の近傍で、均一な処理液の
流れと均一な気泡の流れを安定に発生させると同時に、
互いの均一性を損なわない状態を作り出すことができ
る。その結果、被処理物の表面処理の均質化を図ること
ができ、均一かつ品質に優れためっきや洗浄などの表面
処理を実現できる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a process for immersing a processing object in a processing solution supplied into a processing tank and cleaning or plating the surface of the processing object. The present invention relates to a surface treatment device for performing a surface treatment. 2. Description of the Related Art FIG. 5 is a schematic view of a processing tank in a conventional surface treatment apparatus. In FIG. 5, reference numeral 31 denotes a processing liquid inlet, 32 denotes a gas inlet for generating bubbles, 33 denotes a processing tank,
4 is a processing solution, 35 is an overflow section, 36 is a processing tank 3
An opening 3, a workpiece 37, a jig 38 for immersing the workpiece 37 in the processing liquid 34, and a bubble 39. According to such a conventional surface treatment apparatus Q, the treatment liquid 34 is supplied to the treatment tank 3 through the treatment liquid inlet 31.
3 and continuously reaches the opening 36 of the processing tank 33. Further, the processing liquid 34 overflowing from the opening 36 due to an increase in the processing liquid 34 supplied from the processing liquid inlet 31.
Is an overflow part 3 provided around the opening 36.
5, and is collected through a processing liquid collecting means (not shown) provided in the overflow section 35, and is passed through a pump, a filter, a temperature adjusting device (none of which is shown), and the like.
The liquid is again circulated from the processing liquid inlet 31 into the processing tank 33. The gas introduced from the gas introduction port 32 for generating bubbles is supplied to the processing tank 33 through a row of holes formed in the introduction port 32, and is converted into bubbles 39 in the liquid at the opening 36 of the processing tank 33. Surface and released into the air,
The gas is recovered and processed by a gas recovery means (not shown). On the other hand, a plurality of objects to be processed 37 are installed in a processing tank 33 while being supported and fixed by a jig 38. At this time, the object 37 is placed above the treatment liquid inlet 31 and the gas inlet 32 for generating bubbles, and is immersed for a necessary time to perform the surface treatment of the object 37. The jig 38 may be swung by vibration generating means (not shown) in order to prevent the bubbles 39 and minute bubbles generated by the plating reaction from adhering to the workpiece 37. [0007] However, the conventional surface treatment apparatus Q shown in FIG. 5 has a problem that the flow of the processing liquid 34 is concentrated along the blowing direction from the processing liquid inlet 31. . For example, in the case of a balloon as shown in FIG. 5,
The upward flow toward the opening 36 is concentrated at the center and both ends of the region where the object 37 is immersed. Most of the processing liquid 34 that has reached the opening portion 36 is
However, a part thereof turns back from the vicinity of the opening 36 and forms a gentle downward flow toward the bottom of the processing tank 33 through the flow toward the opening 36. In such a state where the upward flow and the downward flow are mixed, a remarkably turbulent flow such as stagnation or a vortex flow is generated in the area where the object 37 is immersed, and air bubbles are generated. The flow of the processing liquid 34 tended to be further disturbed by the stirring action of the bubbles 39 blown out from the gas inlet 32. Therefore, the processing liquid 3 near the surface of the processing object 37
4 becomes extremely non-uniform, and the flow rate of the processing solution 34 near the surface of the object 37 affects the plating thickness and the degree of cleaning. There was a problem that large variations occurred. The processing solution 34 is made of an electroless plating solution, and the supply of bubbles 39 is performed for the purpose of maintaining the dissolved amount of oxygen and the like in the processing tank 33 in order to suppress the self-decomposition reaction of the processing solution 34. In the case where the processing liquid 34 has been supplied for a long time after the supply of oxygen or the like by the bubbles 39, the possibility that the processing liquid 34 stays in the vicinity of the processing object 37 increases due to the existence of the downward flow or the vortex flow. In the processing solution 34 near the processing object 37, the dissolved amount of oxygen and the like necessary for suppressing the self-decomposition reaction is deficient, the self-decomposition reaction occurs, and the reaction product adheres to the surface of the processing object 37, and the plating is performed. In some cases, thickness variations and remarkable deterioration of plating quality were caused. Therefore, in order to realize a high quality surface treatment with less variation, it is required to simultaneously provide a uniform flow of the processing liquid and a uniform flow of the bubbles in the surface processing apparatus. To solve such a problem, Japanese Patent Application Laid-Open No. Sho 62-29
No. 4,182, it is proposed to provide a rectifying plate made of a perforated plate. However, in this method, it is possible to make the flow of the processing liquid uniform by adjusting the way of making holes in the perforated plate. However, the flow of bubbles could not be made uniform at the same time. Japanese Patent Application Laid-Open No. 2-290976 proposes a means for generating uniform air bubbles from the lower part of the object to be processed, but the flow of the processing liquid has not been studied at all.
As a result, even when uniform bubbles are generated, the distribution of bubbles in the entire processing tank may be uneven due to stagnation of the processing liquid. Further, in these proposals, it is assumed that a uniform flow of the processing liquid or bubbles can be realized by using a perforated plate. Depending on the condition of the transfer channel, a uniform flow cannot always be generated, and the flow concentrates on a part of the perforated plate, and as a result, it is difficult to achieve a desired uniform flow in the processing tank. Met. Accordingly, the present invention has been completed in view of the above circumstances, and an object thereof is to provide a uniform flow of a processing solution and a uniform flow of bubbles near an object to be processed immersed in a surface processing apparatus. The present invention is to provide a surface treatment apparatus capable of stably generating and simultaneously creating a state in which uniformity is not impaired. Therefore, the surface treatment apparatus of the present invention immerses the object in the processing solution supplied into the processing tank to clean or plate the surface of the object. Etc., which are provided with a processing liquid introduction unit and a bubble generation unit below the installation area of the object in the processing tank. And the bubble generating means both have a piping structure combining H-shaped branch pipes, each H-shaped branch pipe is sequentially branched by a 1/2 pipe length, and an H-shaped branch pipe located at the end thereof The processing liquid or air bubbles are introduced into the processing tank from the four corners. Embodiments of the present invention will be described below. FIG. 1 is a schematic diagram for explaining the flow of a processing liquid in the surface treatment apparatus P according to the present invention, and FIG. 2 is a schematic diagram for explaining the flow of bubbles in the surface treatment apparatus P according to the present invention. is there. 1 and 2, reference numeral 1 denotes a processing liquid introduction pipe, 2 denotes a bubble generation gas introduction pipe, 3 denotes a processing liquid branch pipe, 4 denotes a bubble generation gas branch pipe, and 5 denotes a processing liquid blowing pipe. An outlet, 6 is an outlet of gas for generating bubbles, 7 is a processing tank, 8 is a processing liquid, 9 is an overflow section, 10 is an opening of the processing tank 7, 11 is an object to be processed, and 12 is an object to be processed 11. A jig for dipping in the liquid 8, 13 a flow of the processing liquid 8 toward the opening 10, 14 a vortex flow generated in the processing liquid 8, 15
Is a flow of air bubbles, and 16 is a flow of air bubbles toward the opening 10 in the processing liquid 8. The processing liquid branch pipe 3 and the processing liquid outlet 5 form a processing liquid introduction means. The branch pipe 4 and the bubble outlet 6 constitute a bubble generating means. The processing liquid introducing means converts the processing liquid 8 introduced from the processing liquid introducing pipe 1 in FIG. 1 into a uniform flow 1 toward the opening 10 at least in the vicinity of the processing object 11.
The gas generating means 3 is for supplying the gas introduced from the gas generating pipe 2 for generating gas to the processing tank 7 as shown in FIG. This is for supplying to the processing tank 7 as a flow 16 of simple bubbles. The object 11 is supported and fixed by a jig 12 in a region above the processing liquid introducing means and the bubble generating means in the processing tank 7. In addition,
The jig 12 may be oscillated by vibration generating means (not shown) in order to prevent bubbles or minute bubbles generated by a surface treatment reaction such as plating from adhering to the workpiece 11. According to this configuration, the processing liquid 8 introduced into the processing tank 7 from the processing liquid introducing means flows between the processing objects 11 and reaches the opening 10 of the processing tank 7. Further, the opening 1 is increased due to an increase in the processing liquid 8 supplied from the processing liquid introduction pipe 1.
The processing liquid 8 overflowing from 0 flows down into an overflow section 9 provided around the opening 10 and is recovered through a processing liquid recovery means (not shown) provided in the overflow section 9, where a pump, a filter, a temperature The liquid is circulated again from the processing liquid introduction pipe 1 to the processing tank 7 via an adjusting device (neither is shown) or the like. The gas introduced from the bubble generating gas introducing pipe 2 is supplied into the processing tank 7 through the bubble generating means, and flows as bubbles 15 between the objects 11 to be processed.
The liquid reaches the liquid level in the opening 10 of the processing tank 7 and is discharged into the air or collected and processed by gas collecting means (not shown). According to the present invention, in order to make the flow of the processing liquid from the processing liquid introducing means uniform and to make the flow of the bubbles from the bubble generating means uniform, the processing liquid introducing means and the bubble generating means are provided. Have a piping structure combining H-shaped branch pipes, and each H-shaped branch pipe is １ ／
It is characterized in that the processing liquid or air bubbles are introduced into the processing tank from four corners of the H-shaped branching pipe located at the end of the pipe. A specific example will be described below with reference to FIG. Since both the processing liquid introducing means and the bubble generating means have the same piping structure, the processing liquid introducing means will be described as an example. FIG. 3 is a plan view of the processing liquid introducing means as viewed from the direction of the opening 10 of the processing tank 7. Numeral 21 denotes a pipe extending from the processing liquid introducing pipe 1 to the first branch. 1 H
The H-shaped branch pipe 3n communicates with the H-shaped branch pipe 3a, and the H-shaped branch pipe 3n is sequentially and hierarchically repeated. [0027] That is, the primary branch, from the distal end of the tube 21, branch length L 11 in the horizontal direction in the figure, further branches with a length L 12 from both tip to vertical direction in FIG. The secondary branch has a length L in the horizontal direction in the figure from all the ends of the primary branch.
Branches at 21, further split by a length L 22 from all the tip thereof in the vertical direction in FIG. In exactly the same way, the third order, fourth order, and branch of an arbitrary order are repeated. At this time, the lengths L n1 and L n2 of the branch pipes of the n-th branch are calculated from the lengths L (n-1) 1 and L (n-1) 2 of the branch pipes of the (n-1) -th branch. It is determined by the following relational expression. Ln1 / L (n-1) 1 = Ln2 / L (n-1) 2 = 1/2 Considering the case where such branches are repeated countlessly, each branch pipe of the primary branch is taken into account. length L 11, L 12 is the length L 1 and L 2 of each side of the area to be supplied to the treatment liquid 8, unless L 11 / L 1 = L 12 / L 2 = 1/2 It turns out that it does not become. A geometrical shape formed by repeating such self-similar branching is called a fractal shape. In particular, an H-shaped branching structure according to the present invention is called an H-fractal shape. By forming with the branch structure, the distance from the pipe 21 to all the H-shaped branch pipes located at the end and the number of bent pipes can be made the same. Since the four corners of the H-shaped branch pipe 3e located at the ends thereof are used as the outlets 5 of the processing liquid 8, the flow resistances to all the outlets 5 can be equalized. The amount of the processing liquid 8 supplied to the substrate can be made uniform, and the flow of the processing liquid 8 can be made uniform. The outlet 5 is desirably installed toward the opening 10 of the processing tank 7. The number of layers in the branch may be of any order, and may be determined in consideration of the required degree of uniformity of supply of the processing liquid 8 and the thickness of the pipe that can be manufactured. In addition, the thickness and cross-sectional shape of the pipe may be the same as those of the same branch pipe, and other restrictions need not be provided as far as they can be manufactured. Also, by forming the bubble generating means with the same branch structure as in FIG. 3, it is possible to generate air bubbles 15 having a uniform flow in the processing liquid 8 in the processing tank 7. Of treatment liquid 8 and bubbles 1
5 can be made uniform, so that uniform and good surface treatment conditions can be provided in the vicinity of the object 11 to be processed. As a result, variations in plating thickness and variations in cleaning degree can be extremely reduced. Can be. However, the processing liquid 8 is placed in an area where the processing object 11 is not installed (hereinafter referred to as a gap area) between the processing tank 7 and the installation area of the processing object 11 avoiding the installation area of the processing object 11. ). Therefore, the range occupied by the processing liquid introducing means (which indicates the area occupied by the entire branch pipe) should be considered. The area occupied by the processing liquid introducing means is, when viewed from the opening 10 of the processing tank 7 in a plan view, the distance from the outermost edge of the installation area of the processing object 11 to the wall surface of the processing tank 7.
It is desirable that the distance from the outermost edge of the area occupied by the processing liquid introducing means to the wall surface of the processing tank 7 is 1/2 to 2 times. This is shown in FIG. 4, where (a) shows a case where the occupied area B of the processing liquid introducing means is the smallest. FIG.
(A), the coefficients of the relative distance x from the outermost edge A 1 of the installation area A of the workpiece 11 to the wall surface 7a of the processing tank 7, the processing tank from the outermost edge B 1 of the occupied region B of the treatment liquid introduction means 7 is twice as long as the distance y to the wall surface 7a. FIG. 4B shows a case where the area B occupied by the processing liquid introducing means is the widest. The distance from the outermost edge A 1 of the installation area A of the processing object 11 to the wall surface 7 a of the processing tank 7 is shown. x
Respect, the distance y from the outermost edge B 1 of the occupied region B of the processing liquid introduction means to the wall surface 7a of the processing tank 7 becomes 1/2 times. The reason for this is that when the area B occupied by the processing liquid introducing means is narrower than that shown in FIG. 4A, the processing liquid 8 leaking from the installation area A of the processing object 11 to the gap area will This is because a vortex is formed at both ends of the region A, and the formation of a uniform flow is hindered. When the occupied region B of the processing liquid introduction means is wider than that shown in FIG. Is concentrated, and the processing liquid 8 flowing from the gap region into the installation region A of the processing object 11 forms vortices at both ends of the installation region A of the processing object 11 and hinders formation of a uniform flow. The occupied areas of the processing liquid 8 supplied by the processing liquid introducing means are substantially the same as each other so that the uniform flow 13 of the processing liquid 8 and the uniform flow 16 of the bubbles 15 generated by the bubble generating means do not interfere with each other. It is desirable to set the range. In this respect, it is desirable that the occupied area of the bubble generating means is set in the same area as the occupied area of the processing liquid introducing means as described with reference to FIG. Furthermore, the processing solution outlet 5 and the bubble outlet 6 do not overlap when viewed from the opening 10 side of the processing tank 7.
It is desirable to displace it by an appropriate amount in the horizontal direction. The processing liquid introducing means and the bubble generating means may be made of any material and manufacturing method as long as the branching structure as shown in FIG. 3 can be realized. The structure of the H-shaped branch pipe may be engraved in a groove shape on a flat plate and then sealed with another flat plate. As described above, according to the present invention, the uniform flow 13 of the processing liquid 8 shown in FIG. 1 and the uniform flow 16 of the bubbles 15 shown in FIG. Since it does not become an obstacle and does not impair the uniformity of the flows 13 and 16, uniform and favorable surface treatment conditions can be provided in the vicinity of the object 11. EXAMPLES The following experiments were conducted to confirm the effects of the present invention. In the experiment, in a surface treatment apparatus P as shown in FIG. 1, a printed circuit board was immersed as the object to be treated 11, and electroless copper plating of those wiring portions was performed. The processing liquid introducing means and the bubble generating means are shown in FIG.
Further, a piping structure having H-shaped branch piping up to the fourth order as shown in FIG. 4 was used. The dimensions of the area occupied by the processing liquid introducing means and the bubble generating means are 300 mm in width and 280 in depth.
mm. The plating process was performed at a flow rate of the processing liquid 8 of 25 liters per minute and a flow rate of the bubble generation gas of 10 liters per minute. Further, the same plating treatment was carried out using a conventional surface treatment apparatus such as an apparatus Q as shown in FIG. 5, and the occurrence rate of plating defects was compared. As a result, the rate of occurrence of defects was 10% in the conventional surface treatment apparatus Q, whereas it was 0.12% in the surface treatment apparatus P of the present invention, and extremely good and uniform plating treatment conditions were obtained. It turned out to be. As described above, according to the surface treatment apparatus of the present invention, the object to be treated is immersed in the treatment solution supplied into the treatment tank, thereby cleaning the surface of the object to be treated. It is for performing a surface treatment such as plating, and is provided with a processing liquid introduction unit and a bubble generation unit below the installation area of the object to be processed in the processing tank. Both the means and the bubble generating means have a piping structure in which H-shaped branch pipes are combined, and each H-shaped branch pipe is sequentially branched by a 1/2 pipe length, and an H-shaped branch located at the end thereof Since the processing liquid or bubbles are introduced into the processing tank from the four corners of the pipe, the distance from the supply source of the processing liquid and the gas for generating bubbles to all the outlets and the number of bending of the pipe can be all equal. And supply an equal amount of processing liquid and air bubbles from each outlet. In the vicinity of the object to be processed, a uniform flow of the processing solution and a uniform flow of bubbles are generated stably,
A state that does not impair the uniformity of each other can be created. As a result, the surface treatment of the object to be treated can be homogenized, and a uniform and excellent surface treatment such as plating and cleaning can be realized.
【図面の簡単な説明】
【図１】本発明の表面処理装置における処理液の流れを
説明するための概略図である。
【図２】本発明の表面処理装置における気泡の流れを説
明するための概略図である。
【図３】本発明の表面処理装置における処理液導入手段
を示す平面図である。
【図４】本発明における処理液導入手段の占有領域を説
明するためのもので、（ａ）は占有領域が最も狭い場
合、（ｂ）は占有領域が最も広い場合である。
【図５】従来の表面処理装置を示す概略図である。
【符号の説明】
１：処理液導入管 ２：気泡発生用ガス導入管 ３：処
理液の分岐配管
４：気泡発生用ガスの分岐配管 ５：処理液の吹出口
６：気泡の吹出口
７：処理槽 ８：処理液、９：オーバーフロー部 １
０：処理槽の開口部
１１：被処理物 １２：治具 １３：処理液が開口部へ
向かう流れ
１４：処理液中に生じる渦状の流れ １５：気泡
１６：気泡が処理液中を開口部へ向かう流れ ２１：管BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram for explaining a flow of a processing liquid in a surface treatment apparatus of the present invention. FIG. 2 is a schematic diagram for explaining the flow of bubbles in the surface treatment apparatus of the present invention. FIG. 3 is a plan view showing a treatment liquid introducing means in the surface treatment apparatus of the present invention. FIGS. 4A and 4B are diagrams for explaining an occupied area of the processing liquid introducing means in the present invention, wherein FIG. 4A shows a case where the occupied area is the narrowest, and FIG. FIG. 5 is a schematic view showing a conventional surface treatment apparatus. [Description of Signs] 1: Processing liquid introduction pipe 2: Gas generation pipe for bubble generation 3: Branch pipe for processing liquid 4: Branch pipe for gas for bubble generation 5: Processing liquid outlet
6: Bubble outlet 7: Processing tank 8: Processing liquid, 9: Overflow section 1
0: Opening of processing tank 11: Object to be processed 12: Jig 13: Flow of processing liquid toward opening 14: Vortex flow generated in processing liquid 15: Bubbles 16: Bubbles flowing into processing liquid into opening Heading flow 21: Tube
───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.7，ＤＢ名) C23C 18/16 C23G 3/00 C25D 17/00 ──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. 7 , DB name) C23C 18/16 C23G 3/00 C25D 17/00
Claims (1)
物を浸漬し、該被処理物表面の洗浄やめっき等の表面処
理を行う表面処理装置において、前記処理槽内の前記被
処理物の設置領域よりも下部に、処理液導入手段及び気
泡発生手段を設置して成り、これら処理液導入手段及び
気泡発生手段は共にＨ字型分岐配管を組み合わせた配管
構造を有するとともに、各Ｈ字型分岐配管は１／２配管
長で順次分岐して成り、その末端に位置するＨ字型分岐
配管の４隅より処理液又は気泡を導入するようにしたこ
とを特徴とする表面処理装置。(57) [Claims] 1. A surface treatment for immersing an object to be processed in a processing solution supplied into a processing tank and performing a surface treatment such as cleaning or plating of the surface of the object to be processed. In the apparatus, a processing liquid introduction unit and a bubble generation unit are provided below the installation area of the object to be processed in the processing tank, and both the processing liquid introduction unit and the bubble generation unit are H-shaped branch pipes. And each H-shaped branch pipe is sequentially branched with a 1/2 pipe length, and the processing liquid or air bubbles are introduced from the four corners of the H-shaped branch pipe located at the end. A surface treatment apparatus characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24664799A JP3535051B2 (en) | 1999-08-31 | 1999-08-31 | Surface treatment equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24664799A JP3535051B2 (en) | 1999-08-31 | 1999-08-31 | Surface treatment equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001073152A JP2001073152A (en) | 2001-03-21 |
| JP3535051B2 true JP3535051B2 (en) | 2004-06-07 |
Family
ID=17151534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24664799A Expired - Fee Related JP3535051B2 (en) | 1999-08-31 | 1999-08-31 | Surface treatment equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3535051B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI419351B (en) * | 2011-02-14 | 2013-12-11 | Sunshine Pv Corp | Chemical bath deposition machine and distribution branch structure |
-
1999
- 1999-08-31 JP JP24664799A patent/JP3535051B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001073152A (en) | 2001-03-21 |
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