CN109468670A - The method of lead frame copper electroplating layer - Google Patents
The method of lead frame copper electroplating layer Download PDFInfo
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- CN109468670A CN109468670A CN201811365762.6A CN201811365762A CN109468670A CN 109468670 A CN109468670 A CN 109468670A CN 201811365762 A CN201811365762 A CN 201811365762A CN 109468670 A CN109468670 A CN 109468670A
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- lead frame
- copper
- electroplating layer
- pulse current
- layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to a kind of methods of lead frame copper electroplating layer, method includes the following steps: carrying out pre-treatment to lead frame substrate；Using Bipolar pulse current, the lead frame substrate Jing Guo pre-treatment is electroplated, layers of copper is obtained；To the layers of copper post-processed to get；The technological parameter of the Bipolar pulse current includes: forward pulse current density 10ASD~15ASD, and pulsewidth is 0.5ms~50ms；Reverse pulse current density is -40ASD~-30ASD, and pulsewidth is 0.1ms~10ms.The method of the invention can effectively improve the adhesive strength of copper electroplating layer and sealing.
Description
Technical field
The present invention relates to the field of electroplating of integrated circuit, more particularly to the method for lead frame copper electroplating layer.
Background technique
Chip carrier of the lead frame as integrated circuit is a kind of real by means of bonding material (spun gold, aluminium wire, copper wire)
The electrical connection of existing chip internal circuits exit and outer lead, is the key structure part to form electric loop, it play and
The function served as bridge of outer lead connection, requires using lead frame in most semiconductor integrated blocks, is electronic information
Important basic material in industry.It is generally Nian Jie with epoxy molding plastic (EMC) after lead frame surface electroplated metal layer.Currently,
In the surface sealing of lead frame copper electroplating layer, since copper electroplating layer surface is smooth, adhesive strength is not high, cause copper surface with
Glue sticking is insecure and degumming, and if copper electroplating layer surface becomes concave-convex unordered, residual air and impurity are easy after pit,
Bubble is generated, stress is formed and concentrates, will also result in adhesive strength decline, therefore, how to increase lead frame copper electroplating layer and envelope
Adhesive strength between glue annoyings related research staff.
Summary of the invention
Based on this, the present invention provides a kind of method of lead frame copper electroplating layer, and this method can be effectively improved electro-coppering
Layer unstable problem Nian Jie with sealing, improves the adhesive strength of copper electroplating layer and sealing.
The specific technical proposal is:
A kind of method of lead frame copper electroplating layer, comprising the following steps:
Pre-treatment is carried out to lead frame substrate；
Using Bipolar pulse current, the lead frame substrate Jing Guo pre-treatment is electroplated, layers of copper is obtained；
To the layers of copper post-processed to get；
The technological parameter of the Bipolar pulse current includes:
Forward pulse current density 10ASD~15ASD, pulsewidth are 0.5ms~50ms；
Reverse pulse current density is -40ASD~-30ASD, and pulsewidth is 0.1ms~10ms.
In one of the embodiments, the forward pulse current density be 10ASD~12ASD, pulsewidth be 5ms~
50ms；
The reverse pulse current density is -35ASD~-30ASD, and pulsewidth is 1ms~10ms.
The forward pulse current density is 12ASD, pulsewidth 50ms in one of the embodiments,；
The reverse pulse current density is -30ASD, pulsewidth 10ms.
The total time of the plating is 20s~28s in one of the embodiments,.
It in one of the embodiments, in the electroplating technology, takes water as a solvent, copper plating bath includes the group of following concentration
Point:
The CuSO of 65~75g/L4·5H2O；
The H of 60~100g/L2SO4；
The FEC brightener of 2~5mL/L；
The FEC of 5~10mL/L fills and leads up agent.
The temperature of the plating is 40 DEG C~60 DEG C in one of the embodiments,.
In one of the embodiments, the layers of copper with a thickness of 0.4 μm~1.02 μm.
In one of the embodiments, the pre-treatment the following steps are included:
Oil removing is carried out to the lead frame substrate；
The lead frame substrate after oil removing is activated.
It is 2A/dm that the technological parameter of the oil removing, which includes: current density, in one of the embodiments,2~6A/dm2, temperature
Degree is 50 DEG C~70 DEG C.
In one of the embodiments, the technological parameter of the activation include: time for being submerged in activating solution be 10s~
20s。
The step of post-processing includes: that the layers of copper is immersed in CB-2001 solution in one of the embodiments,
In, Immersion time 10s-20s.
Compared with prior art, the invention has the following advantages:
The present invention uses Bipolar pulse current, and lead frame substrate is electroplated, and passes through control forward pulse current
With the current density and pulsewidth of reverse pulse current, big surface particles partial size, arrangement consolidation, concave-convex orderly layers of copper are obtained.On
Layers of copper surface is stated with biggish surface roughness, when both can guarantee sealing, glue is able to enter in shrinkage pool, is solidified convenient for glue
After generate countless glue hooks, increase the adhesion strength of glue and copper surface, reinforce the firmness that glue and copper surface combine；
It is avoided that, because concave-convex surface is unordered, residual air and impurity cause stress to concentrate in the shrinkage pool on layers of copper surface, adhesive strength again
The phenomenon that decline.
Detailed description of the invention
Fig. 1 is that the SEM of lead frame substrate surface schemes；
Fig. 2 is that the SEM on 1 copper electroplating layer surface of embodiment schemes；
Fig. 3 is that the SEM on 2 copper electroplating layer surface of embodiment schemes；
Fig. 4 is that the SEM on 3 copper electroplating layer surface of embodiment schemes；
Fig. 5 is that the SEM on 4 copper electroplating layer surface of embodiment schemes；
Fig. 6 is that the SEM on 5 copper electroplating layer surface of embodiment schemes；
Fig. 7 is that the SEM on 6 copper electroplating layer surface of embodiment schemes；
Fig. 8 is the configuration of surface schematic diagram of 7 copper electroplating layer of embodiment；
Fig. 9 is the configuration of surface schematic diagram of 4 copper electroplating layer of embodiment.
Specific embodiment
It is described in further detail below in conjunction with method of the specific embodiment to lead frame copper electroplating layer of the invention.
The invention can be realized in many different forms, however it is not limited to embodiments described herein.On the contrary, providing these
The purpose of embodiment be make to the disclosure of invention understand it is more thorough and comprehensive.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein "and/or" includes one or more phases
Any and all combinations of the listed item of pass.
A kind of method of lead frame copper electroplating layer, comprising the following steps:
Pre-treatment is carried out to lead frame substrate；
Using Bipolar pulse current, the lead frame substrate Jing Guo pre-treatment is electroplated, layers of copper is obtained；
To the layers of copper post-processed to get；
The technological parameter of the Bipolar pulse current includes:
Forward pulse current density 10ASD~15ASD, pulsewidth are 0.5ms~50ms；
Reverse pulse current density is -40ASD~-30ASD, and pulsewidth is 0.1ms~10ms.
Lead frame substrate is electroplated by using Bipolar pulse current, and by control forward pulse current and instead
To the current density and pulsewidth of pulse current, big surface particles partial size, arrangement consolidation, concave-convex orderly layers of copper have been obtained.It is above-mentioned
Layers of copper surface has biggish surface roughness, and when both can guarantee sealing, glue is able to enter in shrinkage pool, generates after solidifying it
Countless glue hooks increase the adhesion strength of glue and copper surface, reinforce the firmness that glue and copper surface combine；It can keep away again
Exempt from because concave-convex surface is unordered, residual air and impurity cause stress to concentrate in the shrinkage pool on layers of copper surface, adhesive strength decline
Phenomenon.
Further, it in electroplating technology, takes water as a solvent, copper plating bath includes the component of following concentration:
The CuSO of 65~75g/L4·5H2O；
The H of 60~100g/L2SO4；
The FEC brightener of 2~5mL/L；
The FEC of 5~10mL/L fills and leads up agent.
Wherein, FEC brightener is purchased from Atotech.
FEC fills and leads up agent and is purchased from Atotech.
FEC brightener plays an important role to the widening for current density of Bipolar pulse current, and then influences point of copper layers of copper
Sub- arrangement architecture.
It should be understood that carrying out pre-treatment to lead frame substrate includes carrying out oil removing and activation to lead frame substrate
Step.Increase the binding force of substrate and layers of copper.
Layers of copper is post-processed, the post-processing includes that layers of copper is immersed in protection aqueous solution CB-2001 (purchased from Feng Yuan
Chemical Co., Ltd.) the step of submerging in solution.Protection processing is carried out to layers of copper, can prevent layers of copper from changing colour.
Embodiment 1
The present embodiment provides a kind of methods of lead frame copper electroplating layer, comprising the following steps:
(1) oil removing: Fig. 1 is the scanning electron microscope (SEM) photograph of lead frame substrate surface, and wherein Fig. 1 (a) is in lead frame substrate
Center portion position surface condition schematic diagram, Fig. 2 (b) are lead frame material edge portion faces situation schematic diagram.Draw shown in FIG. 1
Wire frame substrate is placed in electricity in the PT-200 solution (PT-200 degreasing powder is purchased from Co., Ltd, Yu Gao foreign firm) that concentration is 100g/L
Solution, current density 3A/dm, temperature are 50 DEG C, electrolysis time 30s.After oil removing, residual is cleaned with tap water.
(2) it activates: at room temperature, substrate being placed in acid salt solution AS310 and impregnates 15s, the concentration of acid salt solution is 80g/
L is purchased from the Anshun Zhong Shan metal conditioner processing factory.It after oil removing, is first cleaned with tap water, then cleans residual with RO pure water.
(3) it is electroplated: using Bipolar pulse current, the lead frame substrate after oil removing is electroplated, layers of copper is obtained.
Wherein, it takes water as a solvent, copper plating bath includes following components:
The CuSO of 70g/L4·5H2O；The H of 70g/L2SO4；The FEC brightener of 3mL/L；The FEC of 7mL/L fills and leads up agent.
Bidirectional pulse condition is as shown in table 1:
Table 1
(4) it post-processes: at room temperature, in the protection aqueous solution CB-2001 solution for being 30% with concentration by the submergence of above-mentioned layers of copper,
Time be 15s to get.
The scanning electron microscope (SEM) photograph on the present embodiment layers of copper surface is as shown in Figure 2.Fig. 2 (a) is the copper of lead frame center position
Layer surface situation schematic diagram, Fig. 2 (b) are the layers of copper surface condition schematic diagram at leadframe edges position.As can be seen from Figure 2,
The present embodiment layers of copper surface particles size distribution is uniform, and surface is more smooth, and roughness is smaller, when leading to sealing, metal copper layer with
Sealing adhesive strength is relatively small.Through measuring, the present embodiment layers of copper with a thickness of 699.4nm~786.8nm.
Embodiment 2
The present embodiment provides a kind of methods of lead frame copper electroplating layer, and substantially the same manner as Example 1, difference is: double
It is as shown in table 2 to impulsive condition:
Table 2
The scanning electron microscope (SEM) photograph on the present embodiment layers of copper surface is as shown in figure 3, Fig. 3 (a) is the copper of lead frame center position
Layer surface situation schematic diagram, Fig. 3 (b) are the layers of copper surface condition schematic diagram at leadframe edges position.It can from Fig. 3
Out, center layers of copper surface particles partial size is small, and particle size distribution is uniform, and roughness is small, at marginal position layers of copper surface particles it
Between it is vacant larger, particle size distribution is uneven, and roughness is larger.When leading to sealing, the adhesive strength of center layers of copper and glue
Weaker, the adhesive strength of edge layers of copper and glue is stronger.Through measuring, the present embodiment layers of copper with a thickness of 554.4nm~612.6nm.
Embodiment 3
The present embodiment provides a kind of methods of lead frame copper electroplating layer, and substantially the same manner as Example 1, difference is: double
It is as shown in table 3 to impulsive condition:
Table 3
The scanning electron microscope (SEM) photograph on the present embodiment layers of copper surface is as shown in Figure 4.Fig. 4 (a) is the copper of lead frame center position
Layer surface situation schematic diagram, Fig. 4 (b) are the layers of copper surface condition schematic diagram at leadframe edges position.It can from Fig. 4
Out, layers of copper surface particles partial size is small, and roughness is smaller.When leading to sealing, the adhesive strength of metal copper layer and sealing is weaker.Through surveying
Amount, the present embodiment layers of copper with a thickness of 378.8nm~437.1nm.
Embodiment 4
The present embodiment provides a kind of methods of lead frame copper electroplating layer, and substantially the same manner as Example 1, difference is: double
It is as shown in table 4 to impulsive condition:
Table 4
The scanning electron microscope (SEM) photograph on the present embodiment layers of copper surface is as shown in Figure 5.Fig. 5 (a) is the copper of lead frame center position
Layer surface situation schematic diagram, Fig. 5 (b) are the layers of copper surface condition schematic diagram at leadframe edges position.It can from Fig. 5
Out, layers of copper surface particles partial size is larger, and concave-convex orderly, roughness is larger.When leading to sealing, the adhesive strength of metal copper layer and glue
It is higher.Through measuring, the present embodiment layers of copper with a thickness of 553.7nm~612.0nm.
Embodiment 5
The present embodiment provides a kind of methods of lead frame copper electroplating layer, and substantially the same manner as Example 1, difference is: double
It is as shown in table 5 to impulsive condition:
Table 5
The scanning electron microscope (SEM) photograph on the present embodiment layers of copper surface is as shown in Figure 6.Fig. 6 (a) is the copper of lead frame center position
Layer surface situation schematic diagram, Fig. 6 (b) are the layers of copper surface condition schematic diagram at leadframe edges position.It can from Fig. 6
Out, center layers of copper surface particles dense arrangement, roughness with higher.When leading to sealing, metal copper layer is bonding with glue strong
It spends higher.Through measuring, the present embodiment layers of copper with a thickness of 466.2nm~495.4nm.
Embodiment 6
The present embodiment provides a kind of methods of lead frame copper electroplating layer, and substantially the same manner as Example 1, difference is: double
It is as shown in table 6 to impulsive condition:
Table 6
The scanning electron microscope (SEM) photograph on the present embodiment layers of copper surface is as shown in Figure 7.Fig. 7 (a) is the copper of lead frame center position
Layer surface situation schematic diagram, Fig. 7 (b) are the layers of copper surface condition schematic diagram at leadframe edges position.It can from Fig. 7
Out, layers of copper surface roughness is smaller.When leading to sealing, the adhesive strength of metal copper layer and glue is weaker.Through measuring, the present embodiment copper
Layer with a thickness of 991.2nm~1.02 μm.
Embodiment 7
The present embodiment provides a kind of methods of lead frame copper electroplating layer, and substantially the same manner as Example 1, difference is: electricity
It in depositing process, takes water as a solvent, copper plating bath includes the component of following concentration:
The CuSO of 70g/L4·5H2O；The H of 70g/L2SO4；The brightening agent for acid copper electroplating (being purchased from Atotech) of 3mL/L；7mL/L's
Sour copper fills and leads up agent (purchased from Atotech).
Fig. 8 is the present embodiment layers of copper configuration of surface schematic diagram, and Fig. 9 is the configuration of surface schematic diagram of 4 copper electroplating layer of embodiment,
With Fig. 9 comparison it is found that the present embodiment layers of copper surface-brightening, roughness is smaller, cause its adhesive strength also weaker.
By the comparison of embodiment 1-8 it is found that the layers of copper surface roughness highest of embodiment 4, layers of copper are bonding with sealing
Intensity highest.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of method of lead frame copper electroplating layer, which comprises the following steps:
Pre-treatment is carried out to lead frame substrate；
Using Bipolar pulse current, the lead frame substrate Jing Guo pre-treatment is electroplated, layers of copper is obtained；
To the layers of copper post-processed to get；
The technological parameter of the Bipolar pulse current includes:
Forward pulse current density 10ASD~15ASD, pulsewidth are 0.5ms~50ms；
Reverse pulse current density is -40ASD~-30ASD, and pulsewidth is 0.1ms~10ms.
2. the method for lead frame copper electroplating layer according to claim 1, which is characterized in that
The forward pulse current density is 10ASD~12ASD, and pulsewidth is 5ms~50ms；
The reverse pulse current density is -35ASD~-30ASD, and pulsewidth is 1ms~10ms.
3. the method for lead frame copper electroplating layer according to claim 2, which is characterized in that
The forward pulse current density is 12ASD, pulsewidth 50ms；
The reverse pulse current density is -30ASD, pulsewidth 10ms.
4. the method for lead frame copper electroplating layer according to claim 1, which is characterized in that the total time of the plating is
20s~28s.
5. the method for lead frame copper electroplating layer according to claim 1, which is characterized in that in the electroplating technology, with
Water is solvent, and copper plating bath includes the component of following concentration:
The CuSO of 65~75g/L4·5H2O；
The H of 60~100g/L2SO4；
The FEC brightener of 2~5mL/L；
The FEC of 5~10mL/L fills and leads up agent.
6. the method for lead frame copper electroplating layer according to claim 5, which is characterized in that the temperature of the plating is 40
DEG C~60 DEG C.
7. the method for lead frame copper electroplating layer according to claim 1-6, which is characterized in that the layers of copper
With a thickness of 0.4 μm~1.02 μm.
8. the method for lead frame copper electroplating layer according to claim 1-6, which is characterized in that the pre-treatment
The following steps are included:
Oil removing is carried out to the lead frame substrate；
The lead frame substrate after oil removing is activated.
9. the method for lead frame copper electroplating layer according to claim 8, which is characterized in that the technological parameter of the oil removing
Include: current density be 2A/dm2~6A/dm2, temperature is 50 DEG C~70 DEG C.
10. the method for lead frame copper electroplating layer according to claim 8, which is characterized in that the technique of the activation is joined
It is 10s~20s that number, which includes: the time submerged in activating solution,.
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| CN201811365762.6A CN109468670B (en) | 2018-11-16 | 2018-11-16 | Method for electroplating copper layer on lead frame |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111394759A (en) * | 2020-04-01 | 2020-07-10 | 集美大学 | Preparation method for increasing hardness of electroplated copper by utilizing ultrasonic and bidirectional pulse current |
| CN112331566A (en) * | 2020-11-02 | 2021-02-05 | 昆山一鼎工业科技有限公司 | Manufacturing equipment and manufacturing method for surface roughness of lead frame |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1880514A (en) * | 2005-06-02 | 2006-12-20 | 新光电气工业株式会社 | Copper strike plating method |
| JP2008223063A (en) * | 2007-03-09 | 2008-09-25 | Furukawa Electric Co Ltd:The | Roughened rolled copper sheet and its manufacturing method |
| CN104152959A (en) * | 2013-05-14 | 2014-11-19 | 新光电气工业株式会社 | Plating film manufacturing method |
| CN106119915A (en) * | 2016-06-27 | 2016-11-16 | 中山品高电子材料有限公司 | The electro-plating method of lead frame |
| CN108352376A (en) * | 2015-11-18 | 2018-07-31 | 株式会社三井高科技 | Lead frame, lead-frame packages and their manufacturing method |
-
2018
- 2018-11-16 CN CN201811365762.6A patent/CN109468670B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1880514A (en) * | 2005-06-02 | 2006-12-20 | 新光电气工业株式会社 | Copper strike plating method |
| JP2008223063A (en) * | 2007-03-09 | 2008-09-25 | Furukawa Electric Co Ltd:The | Roughened rolled copper sheet and its manufacturing method |
| CN104152959A (en) * | 2013-05-14 | 2014-11-19 | 新光电气工业株式会社 | Plating film manufacturing method |
| CN108352376A (en) * | 2015-11-18 | 2018-07-31 | 株式会社三井高科技 | Lead frame, lead-frame packages and their manufacturing method |
| CN106119915A (en) * | 2016-06-27 | 2016-11-16 | 中山品高电子材料有限公司 | The electro-plating method of lead frame |
Non-Patent Citations (1)
| Title |
|---|
| 宋辉: "铜粗化QFN引线框架的量产制备方法", 《化学工程与装备》 * |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111394759A (en) * | 2020-04-01 | 2020-07-10 | 集美大学 | Preparation method for increasing hardness of electroplated copper by utilizing ultrasonic and bidirectional pulse current |
| CN111394759B (en) * | 2020-04-01 | 2021-04-06 | 集美大学 | Preparation method for increasing hardness of electroplated copper by utilizing ultrasonic and bidirectional pulse current |
| CN112331566A (en) * | 2020-11-02 | 2021-02-05 | 昆山一鼎工业科技有限公司 | Manufacturing equipment and manufacturing method for surface roughness of lead frame |
| WO2022089232A1 (en) * | 2020-11-02 | 2022-05-05 | 昆山一鼎工业科技有限公司 | Manufacturing equipment and manufacturing method for lead frame surface roughness |
| JP2022547336A (en) * | 2020-11-02 | 2022-11-11 | 昆山一鼎工業科技有限公司 | Manufacturing equipment and manufacturing method for lead frame surface roughness |
| CN112331566B (en) * | 2020-11-02 | 2024-09-27 | 昆山一鼎工业科技有限公司 | Manufacturing equipment and manufacturing method for surface roughness of lead frame |
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