CN203818668U - Combined type two-sided copper foil base plate of transparent insulating layer - Google Patents
Combined type two-sided copper foil base plate of transparent insulating layer Download PDFInfo
- Publication number
- CN203818668U CN203818668U CN201320855251.9U CN201320855251U CN203818668U CN 203818668 U CN203818668 U CN 203818668U CN 201320855251 U CN201320855251 U CN 201320855251U CN 203818668 U CN203818668 U CN 203818668U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- transparent
- insulating layer
- layer
- clad laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 97
- 239000011889 copper foil Substances 0.000 title claims abstract description 59
- 239000010410 layer Substances 0.000 claims abstract description 66
- 229920001721 polyimide Polymers 0.000 claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 229910052802 copper Inorganic materials 0.000 claims description 38
- 239000010949 copper Substances 0.000 claims description 38
- 238000009413 insulation Methods 0.000 claims description 26
- 239000013047 polymeric layer Substances 0.000 claims description 26
- 239000002131 composite material Substances 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 19
- 238000000576 coating method Methods 0.000 claims description 19
- 239000002390 adhesive tape Substances 0.000 claims description 17
- 239000003292 glue Substances 0.000 claims description 12
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 12
- 238000002834 transmittance Methods 0.000 claims description 10
- 229920006259 thermoplastic polyimide Polymers 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 5
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 229920006352 transparent thermoplastic Polymers 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 abstract description 27
- 239000000463 material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 4
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006750 UV protection Effects 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a combined type two-sided copper foil base plate of a transparent insulating layer. The combined type two-sided copper foil base plate comprises a first copper foil layer, a first transparent insulating polymer layer, a first transparent adhesive layer and a second copper foil layer which are sequentially arranged. The combined type two-sided copper foil base plate of the transparent insulating layer, which is disclosed by the utility model, adopts an insulating layer which is composed of transparent polyimide and a transparent resin material in a compounding manner and has good transparency and high heat resistance, the color of a manufacture procedure of a downstream flexible circuit board is not changed, the disadvantage that the traditional polyimide is yellow-brown and low in transparency is overcome, and the combined type two-sided copper foil base plate still keeps high transparency.
Description
Technical field
The utility model relates to a kind of Double-sided copper clad laminate, relates in particular to a kind of transparent insulating layer composite type double sided copper clad laminate.
Background technology
At present, along with the development of electronic technology industry, electronic system, in compact, high-fire resistance, multifunctionality, densification, low-cost future development, starts towards transparence future development.Transparent smart mobile phone, transparency LED, transparent plate computer etc. will be no longer conceptions of species, but the material object being seen everywhere, thus the substrate of the transparent insulating layer of high-performance and high-transmittance be selected to very important influence factor.
Summary of the invention
In order to overcome above-mentioned defect, the utility model provides a kind of transparent insulating layer composite type double sided copper clad laminate, has high-fire resistance, through high temperature process insulating barrier, does not produce variable color, can keep highly transparent.
The utility model for the technical scheme that solves its technical problem and adopt is: a kind of transparent insulating layer composite type double sided copper clad laminate, comprises the first copper foil layer, the first transparent insulation polymeric layer, transparent adhesive tape adhesion coating and the second copper foil layer that set gradually.
As further improvement of the utility model, between described the second copper foil layer and transparent adhesive tape adhesion coating, be also provided with the second transparent insulation polymeric layer.
As further improvement of the utility model, polyimides (PI) film that described the first transparent insulation polymeric layer and the second transparent insulation polymeric layer are high-transmittance, transparent thermoplastic polyimides (TPI) film and transparent liquid crystal polymer (LCP) film one of them.
As further improvement of the utility model, polyimides (PI) film that described the first transparent insulation polymeric layer and the second transparent insulation polymeric layer are high-transmittance, thickness is 5～25um.
As further improvement of the utility model, described the first copper foil layer and the second copper foil layer are selected from respectively a kind of in rolled copper foil (RA copper), electrolytic copper foil (ED copper) and high extension Copper Foil (HD copper).
As further improvement of the utility model, the thickness of described the first copper foil layer and the second copper foil layer is 3～35um.
As further improvement of the utility model, the thickness of described the first copper foil layer and the second copper foil layer is 3～9um.
As further improvement of the utility model, described the first copper foil layer is 0.8～1.2um near a side of described the first transparent insulation polymeric layer and the second copper foil layer near the surface roughness Rz of a side of described transparent adhesive tape adhesion coating.
As further improvement of the utility model, described transparent adhesive tape adhesion coating is a kind of in polyvinyl butyral resin resin (PVB) glue system, SGA system, polyester adhesive system, polyurethane adhesive system and TPI (TPI) glue system.
As further improvement of the utility model, described transparent adhesive tape adhesion coating is polyvinyl butyral resin resin (PVB) glue system, and its thickness is 5～25um.
The beneficial effects of the utility model are: this transparent insulating layer composite type double sided copper clad laminate is the insulating barrier that has adopted transparent polyimides and transparent resin material to be composited, there is good light transmittance, high-fire resistance, and through downstream FPC processing procedure nondiscolouring, overcome in the past polyimides yellow-brown, the shortcoming that light transmittance is low, still keeps highly transparent.
Accompanying drawing explanation
Fig. 1 is the utility model embodiment 1 structural representation;
Fig. 2 is the utility model embodiment 2 structural representations.
By reference to the accompanying drawings, make the following instructions:
101a---the first copper foil layer
101b---the second copper foil layer
102a---the first transparent insulation polymeric layer
102b---the second transparent insulation polymeric layer
103---transparent adhesive tape adhesion coating
The specific embodiment
By reference to the accompanying drawings; the utility model is elaborated; but protection domain of the present utility model is not limited to following embodiment, the simple equivalence of in every case being done with the utility model claim and description changes and modifies, within all still belonging to the utility model patent covering scope.
Embodiment 1:
The thick Copper Foil of one 9um is provided, and be coated with silica-based replacement clear polyimides colloid with this Copper Foil matsurface, and obtain an one side copper clad laminate after being dried clear polyimides (PI) layer that formation 7.5um is thick, again at the PI of this one side copper clad laminate face painting polyethylene butyral glue, through short time prebake conditions, the PI face of the same one side copper clad laminate of pressing (or Copper Foil M/S face) again, the pressure giving by the gap between roller and roller, make two one side copper clad laminates by middle adhesion coating close adhesion, to form Double-sided copper clad laminate.Finally, toast this Double-sided copper clad laminate, resin bed is solidified, finally form a kind of transparent insulating layer composite type double sided copper clad laminate.Its structure as shown in Figure 1, comprise successively from top to bottom the first copper foil layer 101a, the first transparent insulation polymeric layer 102a, transparent adhesive tape adhesion coating 103, the second transparent insulation polymeric layer 102b and the second copper foil layer 101b, the first copper foil layer 101a and the second copper foil layer 101b thickness are 9um, the thickness of the first transparent insulation polymeric layer 102a and the second transparent insulation polymeric layer 102b is 7.5um, and transparent adhesive tape adhesion coating 103 thickness are 7.5um.
Embodiment 2:
The thick Copper Foil of one 9um is provided, and be coated with silica-based replacement clear polyimides colloid with this Copper Foil matsurface, and obtain an one side copper clad laminate after being dried clear polyimides (PI) layer that formation 7.5um is thick, again at the PI of this one side copper clad laminate face painting polyethylene butyral glue, through short time prebake conditions, the Copper Foil of the uncoated silica-based replacement clear polyimides colloid of pressing one again, the pressure giving by the gap between roller and roller, make one side copper clad laminate and Copper Foil by middle adhesion coating close adhesion, to form Double-sided copper clad laminate.Finally, toast this Double-sided copper clad laminate, resin bed is solidified, finally form a kind of transparent insulating layer composite type double sided copper clad laminate.Its structure as shown in Figure 2, comprise successively from top to bottom the first copper foil layer 101a, the first transparent insulation polymeric layer 102a, transparent adhesive tape adhesion coating 103 and the second copper foil layer 101b, the first copper foil layer 101a and the second copper foil layer 101b thickness are 9um, the thickness of the first transparent insulation polymeric layer 102a is 7.5um, and transparent adhesive tape adhesion coating 103 thickness are 7.5um.
The transparent insulating layer composite type double sided copper clad laminate of above-mentioned two embodiment and existing opaque composite type double sided copper clad laminate are carried out to peel strength and light transmittance test, and its test result is as shown in table 1.
Table 1: substrate properties comparison
Wherein, in above-described embodiment, the first copper foil layer and the second copper foil layer can be selected from respectively a kind of in rolled copper foil (RA copper), electrolytic copper foil (ED copper) and high extension Copper Foil (HD copper), and the first copper foil layer is between 0.8～1.2um near a side of the first transparent insulation polymeric layer and the second copper foil layer near the surface roughness Rz of a side of transparent adhesive tape adhesion coating.
The first transparent insulation polymeric layer and the second transparent insulation polymeric layer can be selected from polyimides (PI) film, transparent thermoplastic polyimides (TPI) film or transparent liquid crystal polymer (LCP) film of high-transmittance, are preferably polyimides (PI) film of high-transmittance.
Transparent adhesive tape adhesion coating is selected from a kind of in polyvinyl butyral resin resin (PVB) glue system, SGA system, polyester adhesive system, polyurethane adhesive system and TPI (TPI) glue system, is preferably polyvinyl butyral resin resin (PVB) glue system.Polyvinyl butyral resin resin (PVB) glue system, the transparency that tool is higher, cold resistance, resistance to impact, ultra-violet resistance are good.
In order to realize the high grade of transparency, total thickness of insulating layer of transparent insulating layer composite type double sided copper clad laminate of the present invention can not be too thick, and total thickness of insulating layer is best at 15～25um.
In addition, in the present invention, the formation principle of clear polyimides is: in polyimide structures, introduce containing fluoro substituents or side group, utilize the electronegativity that fluorine atom is larger, cut off the conjugation of electron cloud, suppress the formation of CTC; Reduce the content of fragrant result in PI molecule, as adopted dianhydride or the diamine monomer with alicyclic structure, reduce the probability that CTC forms; Introduce nonplanar structure, sulfuryl structure, silicon substrate structure, a position replacement structure etc. and reduce conjugation.
The adjustment that the present invention fills a prescription by colloid, reached transparent insulation polymeric layer and the approaching thermal coefficient of expansion of substratum transparent, thereby form a kind of globality, the FPC material of high dimensional stability, and depth of camber is less, and the stability of size harmomegathus is better.
Claims (10)
1. a transparent insulating layer composite type double sided copper clad laminate, is characterized in that: comprise the first copper foil layer (101a), the first transparent insulation polymeric layer (102a), transparent adhesive tape adhesion coating (103) and the second copper foil layer (101b) that set gradually.
2. transparent insulating layer composite type double sided copper clad laminate according to claim 1, is characterized in that: between described the second copper foil layer (101b) and transparent adhesive tape adhesion coating (103), be also provided with the second transparent insulation polymeric layer (102b).
3. transparent insulating layer composite type double sided copper clad laminate according to claim 2, is characterized in that: polyimide film, transparent thermoplastic polyimide film and transparent liquid crystal polymer film that described the first transparent insulation polymeric layer and the second transparent insulation polymeric layer are high-transmittance one of them.
4. transparent insulating layer composite type double sided copper clad laminate according to claim 3, is characterized in that: the polyimide film that described the first transparent insulation polymeric layer and the second transparent insulation polymeric layer are high-transmittance, thickness is 5～25um.
5. according to the transparent insulating layer composite type double sided copper clad laminate described in any one in claim 1 to 4, it is characterized in that: described the first copper foil layer and the second copper foil layer are selected from respectively a kind of in rolled copper foil, electrolytic copper foil and high extension Copper Foil.
6. transparent insulating layer composite type double sided copper clad laminate according to claim 5, is characterized in that: the thickness of described the first copper foil layer and the second copper foil layer is 3～35um.
7. transparent insulating layer composite type double sided copper clad laminate according to claim 5, is characterized in that: the thickness of described the first copper foil layer and the second copper foil layer is 3～9um.
8. transparent insulating layer composite type double sided copper clad laminate according to claim 5, is characterized in that: described the first copper foil layer is 0.8～1.2um near a side of described the first transparent insulation polymeric layer and the second copper foil layer near the surface roughness Rz of a side of described transparent adhesive tape adhesion coating.
9. according to the transparent insulating layer composite type double sided copper clad laminate described in any one in claim 1 to 4, it is characterized in that: described transparent adhesive tape adhesion coating is a kind of in polyvinyl butyral resin resin glue system, SGA system, polyester adhesive system, polyurethane adhesive system and TPI glue system.
10. transparent insulating layer composite type double sided copper clad laminate according to claim 9, is characterized in that: described transparent adhesive tape adhesion coating is polyvinyl butyral resin resin glue system, and its thickness is 5～25um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320855251.9U CN203818668U (en) | 2013-12-23 | 2013-12-23 | Combined type two-sided copper foil base plate of transparent insulating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320855251.9U CN203818668U (en) | 2013-12-23 | 2013-12-23 | Combined type two-sided copper foil base plate of transparent insulating layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203818668U true CN203818668U (en) | 2014-09-10 |
Family
ID=51474208
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320855251.9U Expired - Lifetime CN203818668U (en) | 2013-12-23 | 2013-12-23 | Combined type two-sided copper foil base plate of transparent insulating layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203818668U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103692724A (en) * | 2013-12-23 | 2014-04-02 | 松扬电子材料(昆山)有限公司 | Double-face copper clad baseplate with composite type transparent insulation layer |
| CN104859223A (en) * | 2015-05-21 | 2015-08-26 | 成都多吉昌新材料有限公司 | Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers |
| CN110337177A (en) * | 2019-06-21 | 2019-10-15 | 广州金鹏源康精密电路股份有限公司 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
| CN112277405A (en) * | 2019-07-26 | 2021-01-29 | 昆山雅森电子材料科技有限公司 | Transparent composite PI film, transparent composite PI substrate containing PI film and preparation method of transparent composite PI substrate |
-
2013
- 2013-12-23 CN CN201320855251.9U patent/CN203818668U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103692724A (en) * | 2013-12-23 | 2014-04-02 | 松扬电子材料(昆山)有限公司 | Double-face copper clad baseplate with composite type transparent insulation layer |
| CN104859223A (en) * | 2015-05-21 | 2015-08-26 | 成都多吉昌新材料有限公司 | Adhesive-free FCCL (flexible copper-clad laminate) with two medium layers |
| CN110337177A (en) * | 2019-06-21 | 2019-10-15 | 广州金鹏源康精密电路股份有限公司 | It is a kind of with the circuit board of pad and preparation method thereof that can bear high thrust |
| CN112277405A (en) * | 2019-07-26 | 2021-01-29 | 昆山雅森电子材料科技有限公司 | Transparent composite PI film, transparent composite PI substrate containing PI film and preparation method of transparent composite PI substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140910 |