CN203618239U - Pressing structure of rigid-flex printed circuit board - Google Patents
Pressing structure of rigid-flex printed circuit board Download PDFInfo
- Publication number
- CN203618239U CN203618239U CN201320733259.8U CN201320733259U CN203618239U CN 203618239 U CN203618239 U CN 203618239U CN 201320733259 U CN201320733259 U CN 201320733259U CN 203618239 U CN203618239 U CN 203618239U
- Authority
- CN
- China
- Prior art keywords
- silicon rubber
- rigid
- flexible
- pressing structure
- daughter board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a pressing structure of a rigid-flex printed circuit board. The pressing structure comprises a silicon rubber coated material, a rigid sub plate, a dielectric layer, a flexible sub plate, a dielectric layer, a rigid sub plate and a silicon rubber coating material which are sequentially stacked. The plate face of the flexible sub plate is provided with a flexible region. The rigid sub plate is provided with a through window region corresponding to the flexible region. The through window region is provided with a silicon rubber gasket. According to the pressing structure, the silicon rubber gasket is arranged at the through window region, the glue overflow of the dielectric layer (prepreg) can be effectively prevented, the glue overflow is less than 0.6mm, the silicon rubber gasket can be easily separated from a circuit board body, and any other defects are not produced.
Description
Technical field
The utility model relates to printed wiring board technical field, particularly relates to a kind of pressing structure of rigid-flexible combined circuit board.
Background technology
Along with electronic product is to miniaturization, portable future development, the market demand of rigid-flex combined board is growing.Rigid-flex combined board is that one combines rigid plate and flex plate advantage, can the three-dimensional special wiring board of assembling in implementation space.In order to reduce excessive glue with the reduction impact on bending property of rigid-flex combined board at rigid-flexible jointing edge, it conventionally adopts the prepreg that do not flow to bond between flexible layer and rigid layer.The mobility of prepreg resin in pressing process of not flowing is poor, easily causes that gummosis is not enough and occurs the defect such as pressing hickie, filler cavity.In the time running into thick copper, high level, the intensive isostructural plate pressing of circuit, required filler amount is larger, and between this type of flaggy, the general prepreg that adopts more number carries out pressing.So, brought the problem of the corresponding excessive glue control of place's flexure region of windowing.
Utility model content
Based on this, the purpose of this utility model is to provide a kind of pressing structure of rigid-flexible combined circuit board.
Concrete technical scheme is as follows:
A kind of pressing structure of rigid-flexible combined circuit board, this pressing structure comprises that the silicon rubber stacking gradually covers shape material, rigidity daughter board, dielectric layer, flexible daughter board, dielectric layer, rigidity daughter board and silicon rubber and covers shape material, the plate face of described flexible daughter board is provided with flexure region, described rigidity daughter board is provided with the logical window region corresponding with flexure region, and described logical window region is provided with silicon rubber pad.
Can effectively prevent the pressing process medium layer glue that overflows at logical window region division silicon rubber pad, and silicon rubber pad easily and wiring board body portion from, can not produce any other defect.
In an embodiment, the size of the each length of side of described silicon rubber pad is than the little 0.1-1.2mm of size of the each length of side in described logical window region therein.
The size of silicon rubber pad is less than the size in logical window region, makes silicon rubber pad can be easy to be nested into logical window region, convenient operation, and avoided silicon rubber pad to stretch into rigid-flexible junction causing the layering of rigidity daughter board and flexible daughter board.
Therein in an embodiment, the little 0.05-0.2mm of gross thickness of the Thickness Ratio rigidity daughter board of described silicon rubber pad and dielectric layer.
Arrange the Thickness Ratio rigidity daughter board of silicon rubber pad and the gross thickness of dielectric layer little can further prevent overflow glue.
In an embodiment, the thickness that described silicon rubber covers shape material is 0.2-1.5mm therein.
In an embodiment, described rigidity daughter board is individual layer rigid plate or multilayer rigid plate therein; Described flexible daughter board is single-layer flexible plate or multi-layer flexible sheet.
The beneficial effects of the utility model:
1, can effectively prevent the pressing process medium layer glue that overflows at logical window region division silicon rubber pad, and silicon rubber pad easily and wiring board body portion from, can not produce any other defect.
2, the size of silicon rubber pad is less than the size in logical window region, makes silica gel pad can be easy to be nested into logical window region, convenient operation, and avoided silicon rubber pad to stretch into rigid-flexible junction causing the layering of rigidity daughter board and flexible daughter board.
3, arrange the Thickness Ratio rigidity daughter board of silicon rubber pad and the gross thickness of dielectric layer little can further prevent overflow glue.
4, pressing structure of the present utility model, the excessive glue that can realize rigid-flexible combined circuit board flexure region is less than 0.6mm.
Accompanying drawing explanation
Fig. 1 is the pressing structure schematic diagram of the rigid-flexible combined circuit board of the utility model.
Description of reference numerals:
101, silicon rubber covers shape material; 102, silicon rubber pad; 103, rigidity daughter board; 104, dielectric layer; 105, flexure region; 106, flexible daughter board; 107, rigid region.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further elaborated.
With reference to figure 1, a kind of pressing structure of rigid-flexible combined circuit board, this pressing structure comprises that the silicon rubber stacking gradually covers shape material 101, rigidity daughter board 103, dielectric layer 104, flexible daughter board 106, dielectric layer 104(prepreg), rigidity daughter board 103 and silicon rubber covers shape material 101, the plate face of described flexible daughter board is provided with flexure region 105 and rigid region 107, described rigidity daughter board is provided with the logical window region corresponding with flexure region, and described logical window region is provided with silicon rubber pad 102.
Can effectively prevent the pressing process medium layer glue that overflows at logical window region division silicon rubber pad, and silicon rubber pad easily and wiring board body portion from, can not produce any other defect.
The size of the each length of side of described silicon rubber pad is than the little 0.1-1.2mm of size of the each length of side in described logical window region.
The size of silicon rubber pad is less than the size in logical window region, makes silica gel pad can be easy to be nested into logical window region, convenient operation, and avoided silicon rubber pad to stretch into rigid-flexible junction causing the layering of rigidity daughter board and flexible daughter board.
The little 0.05-0.2mm of gross thickness of the Thickness Ratio rigidity daughter board of described silicon rubber pad and dielectric layer.
Arrange the Thickness Ratio rigidity daughter board of silicon rubber pad and the gross thickness of dielectric layer little can further prevent overflow glue.
The thickness that described silicon rubber covers shape material is 0.2-1.5mm.
Described rigidity daughter board is individual layer rigid plate or multilayer rigid plate; Described flexible daughter board is single-layer flexible plate or multi-layer flexible sheet.
The beneficial effect of this rigid-flexible combined circuit board pressing structure:
1, can effectively prevent the pressing process medium layer glue that overflows at logical window region division silicon rubber pad, and silicon rubber pad easily and wiring board body portion from, can not produce any other defect.
2, the size of silicon rubber pad is less than the size in logical window region, makes silica gel pad can be easy to be nested into logical window region, convenient operation, and avoided silicon rubber pad to stretch into rigid-flexible junction causing the layering of rigidity daughter board and flexible daughter board.
3, arrange the Thickness Ratio rigidity daughter board of silicon rubber pad and the gross thickness of dielectric layer little can further prevent overflow glue.
4, pressing structure of the present utility model, the excessive glue that can realize rigid-flexible combined circuit board flexure region is less than 0.6mm.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (5)
1. the pressing structure of a rigid-flexible combined circuit board, it is characterized in that, this pressing structure comprises that the silicon rubber stacking gradually covers shape material, rigidity daughter board, dielectric layer, flexible daughter board, dielectric layer, rigidity daughter board and silicon rubber and covers shape material, the plate face of described flexible daughter board is provided with flexure region, described rigidity daughter board is provided with the logical window region corresponding with flexure region, and described logical window region is provided with silicon rubber pad.
2. the pressing structure of rigid-flexible combined circuit board according to claim 1, is characterized in that, the size of the each length of side of described silicon rubber pad is than the little 0.1-1.2mm of size of the each length of side in described logical window region.
3. the pressing structure of rigid-flexible combined circuit board according to claim 1, is characterized in that, the little 0.05-0.2mm of gross thickness of the Thickness Ratio rigidity daughter board of described silicon rubber pad and dielectric layer.
4. according to the pressing structure of the rigid-flexible combined circuit board described in claim 1-3 any one, it is characterized in that, the thickness that described silicon rubber covers shape material is 0.2-1.5mm.
5. according to the pressing structure of the rigid-flexible combined circuit board described in claim 1-3 any one, it is characterized in that, described rigidity daughter board is individual layer rigid plate or multilayer rigid plate; Described flexible daughter board is single-layer flexible plate or multi-layer flexible sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320733259.8U CN203618239U (en) | 2013-11-18 | 2013-11-18 | Pressing structure of rigid-flex printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320733259.8U CN203618239U (en) | 2013-11-18 | 2013-11-18 | Pressing structure of rigid-flex printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203618239U true CN203618239U (en) | 2014-05-28 |
Family
ID=50770853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320733259.8U Expired - Fee Related CN203618239U (en) | 2013-11-18 | 2013-11-18 | Pressing structure of rigid-flex printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203618239U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105349A (en) * | 2014-07-02 | 2014-10-15 | 中国航天科技集团公司第九研究院第七七一研究所 | Method for processing rigid-flex printed board by cover laminating and lining filling method |
| CN104470199A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Rigid-flexible combined board laminar structure |
| CN106604573A (en) * | 2016-12-12 | 2017-04-26 | 上海展华电子有限公司 | Rigid-flex board processing method avoiding serration at rigid-flex joint |
| CN108260275A (en) * | 2017-12-21 | 2018-07-06 | 深南电路股份有限公司 | Using the rigid-flexible combination PCB and its processing method of extraction-type gasket construction |
| CN112157982A (en) * | 2020-09-25 | 2021-01-01 | 江苏铁锚玻璃股份有限公司 | Method for manufacturing ultrathin laminated glass |
| CN114916157A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Method for protecting fingers or PAD (PAD application program) in soft area of rigid-flex board |
-
2013
- 2013-11-18 CN CN201320733259.8U patent/CN203618239U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105349A (en) * | 2014-07-02 | 2014-10-15 | 中国航天科技集团公司第九研究院第七七一研究所 | Method for processing rigid-flex printed board by cover laminating and lining filling method |
| CN104470199A (en) * | 2014-11-25 | 2015-03-25 | 镇江华印电路板有限公司 | Rigid-flexible combined board laminar structure |
| CN104470199B (en) * | 2014-11-25 | 2017-05-17 | 镇江华印电路板有限公司 | Rigid-flexible combined board laminar structure |
| CN106604573A (en) * | 2016-12-12 | 2017-04-26 | 上海展华电子有限公司 | Rigid-flex board processing method avoiding serration at rigid-flex joint |
| CN108260275A (en) * | 2017-12-21 | 2018-07-06 | 深南电路股份有限公司 | Using the rigid-flexible combination PCB and its processing method of extraction-type gasket construction |
| CN112157982A (en) * | 2020-09-25 | 2021-01-01 | 江苏铁锚玻璃股份有限公司 | Method for manufacturing ultrathin laminated glass |
| CN114916157A (en) * | 2022-06-01 | 2022-08-16 | 东莞森玛仕格里菲电路有限公司 | Method for protecting fingers or PAD (PAD application program) in soft area of rigid-flex board |
| CN114916157B (en) * | 2022-06-01 | 2024-04-12 | 东莞森玛仕格里菲电路有限公司 | Soft region finger or PAD protection method for soft and hard combined plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203618239U (en) | Pressing structure of rigid-flex printed circuit board | |
| CN103687346A (en) | Rigid-flexible combined printed circuit board preparation method | |
| CN106793567A (en) | A kind of preparation method of rigid and flexibility plate | |
| CN202958045U (en) | High-reliability hard and soft combined board | |
| CN203661421U (en) | Circuit board bonding structure with small size thin blind slot | |
| CN102523683A (en) | Flex-rigid combined board and manufacturing method of flex-rigid combined board | |
| CN203661404U (en) | Bonding structure of high-smoothness step blind slot circuit board | |
| CN201750634U (en) | Improved pressing in carrier structure provided with rigid-flexible circuit board | |
| CN204031568U (en) | Flexible printed circuit board | |
| CN101351079A (en) | Method for processing step ladder PCB plate | |
| CN203618215U (en) | Plate structure for preventing warpage of ladder type printed circuit board | |
| CN203722925U (en) | Flexible and hard combined circuit board with function of convenient three-dimensional assembling | |
| CN203057686U (en) | Printed circuit board with flexible area | |
| CN102490435B (en) | Method for manufacturing asymmetric factor multi-layer hardboard in soft and hard combination board by adopting separation lamination method | |
| CN104159397A (en) | Pressing structure and method of cavity PCB | |
| CN202310299U (en) | Rigid-flex board | |
| CN204180376U (en) | The pressing structure of cavity PCB plate | |
| CN202364470U (en) | Double-face conductive back-bare type FPC compacting substrate | |
| CN205491428U (en) | Hot pressing laminating flexible circuit board | |
| CN204335159U (en) | A kind of soft or hard is in conjunction with FPC | |
| CN201750624U (en) | Improved laminar structure of PCB (printed circuit board) | |
| CN206164979U (en) | Composite circuit board | |
| CN205017684U (en) | Adopt one -course three -layer flexible circuit board of fine copper preparation inlayer | |
| CN205071455U (en) | Multilayer circuit plate structure of low noise | |
| CN204069481U (en) | A kind of battery protection wiring board with overcoat and solder mask structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20211118 |