CN205071455U - Multilayer circuit plate structure of low noise - Google Patents
Multilayer circuit plate structure of low noise Download PDFInfo
- Publication number
- CN205071455U CN205071455U CN201520895786.8U CN201520895786U CN205071455U CN 205071455 U CN205071455 U CN 205071455U CN 201520895786 U CN201520895786 U CN 201520895786U CN 205071455 U CN205071455 U CN 205071455U
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- CN
- China
- Prior art keywords
- abatvoix
- low noise
- base plate
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a multilayer circuit plate structure of low noise, including base plate and abatvoix, the embedding piece is installed to the upper end symmetry of base plate, install the cassette on the embedding piece, the mid -mounting of abatvoix has the amortization box, the abatvoix is connected the cassette and is connected with the amortization box, the inboard of abatvoix is equipped with half ball grooves board, be equipped with the embedded groove on the base plate, the embedded groove bonds with half ball grooves board mutually. The utility model discloses a set up base plate, abatvoix and amortization box and help increasing the holistic noise of device and eliminate the effect and realize end noise effect, through setting up the fixed function of being connected that embedding piece and cassette help realizing base plate and acoustical panel, and simple structure, convenient operation, economical and practical.
Description
Technical field
The utility model relates to circuit board design techniques field, particularly relates to a kind of Multi-layer circuit board structure of low noise.
Background technology
Circuit board makes circuit miniaturization, visualize, for permanent circuit batch production and optimize electrical appliance layout and play an important role.Circuit board can be described as FPC wiring board, and FPC wiring board is that the one made for base material with polyimides or polyester film has height reliability, excellent flexible printed circuit also known as flexible circuit board flexible PCB.It has the advantages that distribution density is high, lightweight, thickness is thin, bending property is good.The birth of FPC and PCB and development, expedited the emergence of this new product of Rigid Flex.Therefore, Rigid Flex is exactly flexible circuit board and rigid wiring board, through operations such as pressings, combines by related process requirement, the wiring board with FPC characteristic and PCB characteristic of formation.But, the Multi-layer circuit board structure of existing low noise lacks the noise eradicating efficacy the device realizing end noise result that contribute to increase device entirety, the Multi-layer circuit board structure of some low noise lacks the device being connected and fixed function contributing to realizing substrate and acoustical panel, the demand of actual conditions can not be met.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of Multi-layer circuit board structure of low noise.
The utility model is achieved through the following technical solutions:
A kind of Multi-layer circuit board structure of low noise, comprise substrate and abatvoix, the upper end of described substrate is symmetrically installed with embedded block, and described embedded block is provided with deck, the middle part of described abatvoix is provided with sound-muffling box, and described abatvoix connects deck and is connected with sound-muffling box.
As optimal technical scheme of the present utility model, the inner side of described abatvoix is provided with hemispherical groove plate, and described substrate is provided with embedded groove, and described embedded groove is mutually bonding with hemispherical groove plate.
As optimal technical scheme of the present utility model, described substrate forms by multi-layered board is bonding.
As optimal technical scheme of the present utility model, in described sound-muffling box, be provided with honeycomb layer.
During onsite application, device entirety is placed into correct position by operating personnel, then by fixing for device entirety, can carry out electric component and install steady job.
Compared with prior art, the beneficial effects of the utility model are: the utility model contributes to increasing the noise eradicating efficacy of device entirety by arranging substrate, abatvoix and sound-muffling box and realizes end noise result, function is connected and fixed by what arrange that embedded block and deck contribute to realizing substrate and acoustical panel, and structure is simple, easy to operate, economical and practical.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1, substrate; 11, embedded groove; 2, abatvoix; 21, sound-muffling box; 22, hemispherical groove plate; 3, embedded block; 31, deck.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1, Fig. 1 is structural representation of the present utility model.
The Multi-layer circuit board structure of described a kind of low noise, comprise substrate 1 and abatvoix 2, described substrate 1 forms by multi-layered board is bonding, the upper end of described substrate 1 is symmetrically installed with embedded block 3, described embedded block 3 is provided with deck 31, the middle part of described abatvoix 2 is provided with sound-muffling box 21, is provided with honeycomb layer in described sound-muffling box 21, and substrate 1, abatvoix 2 and sound-muffling box 21 contribute to the noise eradicating efficacy of increase device entirety and realize end noise result.
Described abatvoix 2 connects deck 31 and is connected with sound-muffling box 21, what embedded block 3 and deck 31 contributed to realizing substrate 1 and acoustical panel 2 is connected and fixed function, the inner side of described abatvoix 2 is provided with hemispherical groove plate 22, described substrate 1 is provided with embedded groove 11, and described embedded groove 11 is mutually bonding with hemispherical groove plate 22.
During onsite application, device entirety is placed into correct position by operating personnel, then by fixing for device entirety, can carry out electric component and install steady job.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (4)
1. the Multi-layer circuit board structure of a low noise, it is characterized in that: comprise substrate (1) and abatvoix (2), the upper end of described substrate (1) is symmetrically installed with embedded block (3), described embedded block (3) is provided with deck (31), the middle part of described abatvoix (2) is provided with sound-muffling box (21), and described abatvoix (2) connects deck (31) and is connected with sound-muffling box (21).
2. the Multi-layer circuit board structure of low noise according to claim 1, it is characterized in that: the inner side of described abatvoix (2) is provided with hemispherical groove plate (22), described substrate (1) is provided with embedded groove (11), and described embedded groove (11) is mutually bonding with hemispherical groove plate (22).
3. the Multi-layer circuit board structure of low noise according to claim 1, is characterized in that: described substrate (1) forms by multi-layered board is bonding.
4. the Multi-layer circuit board structure of low noise according to claim 1, is characterized in that: described sound-muffling box is provided with honeycomb layer in (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520895786.8U CN205071455U (en) | 2015-11-10 | 2015-11-10 | Multilayer circuit plate structure of low noise |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520895786.8U CN205071455U (en) | 2015-11-10 | 2015-11-10 | Multilayer circuit plate structure of low noise |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071455U true CN205071455U (en) | 2016-03-02 |
Family
ID=55397951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520895786.8U Expired - Fee Related CN205071455U (en) | 2015-11-10 | 2015-11-10 | Multilayer circuit plate structure of low noise |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205071455U (en) |
-
2015
- 2015-11-10 CN CN201520895786.8U patent/CN205071455U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160302 Termination date: 20211110 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |