CN205622975U - Anti highly compressed PCB circuit board - Google Patents

Anti highly compressed PCB circuit board Download PDF

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Publication number
CN205622975U
CN205622975U CN201620243273.3U CN201620243273U CN205622975U CN 205622975 U CN205622975 U CN 205622975U CN 201620243273 U CN201620243273 U CN 201620243273U CN 205622975 U CN205622975 U CN 205622975U
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CN
China
Prior art keywords
pcb
line layer
thickness
high pressure
fool proof
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Active
Application number
CN201620243273.3U
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Chinese (zh)
Inventor
王正茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN HUANGJIANG DASHUN ELECTRONICS CO LTD
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DONGGUAN HUANGJIANG DASHUN ELECTRONICS CO LTD
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Application filed by DONGGUAN HUANGJIANG DASHUN ELECTRONICS CO LTD filed Critical DONGGUAN HUANGJIANG DASHUN ELECTRONICS CO LTD
Priority to CN201620243273.3U priority Critical patent/CN205622975U/en
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Abstract

The utility model belongs to the technical field of the circuit board, specifically speaking relates to an anti highly compressed PCB circuit board. The utility model discloses a base plate, base plate include PP basic unit, and the both sides of PP basic unit are equipped with the line layer respectively, and the outside of line layer is equipped with the insulating cover, and wherein the thickness of line layer is less than 1OZ, and the insulating thickness that covers the thickness and gate layer of membrane equals. The utility model discloses a set up the insulating cover outside the line layer, replace present printing ink layer, can improve its high pressure resistant nature, especially, 1OZ's circuit board is less than to copper foil layer thickness, the effect of optimizing structure can also be plays.

Description

A kind of PCB of anti-high pressure
Technical field
This utility model belongs to circuit board technology field, specifically, relates to the PCB of a kind of anti-high pressure.
Background technology
Along with the development of electronic product industry, primary electron industry fire cattle coiling changes and is made on traditional pcb board, so the technology of wiring board requires more and more higher, some traditional techniques are the most challenged.Producing high pressure above coil on pcb board, traditional high voltage bearing way, the technique using repeatedly ink printing, needed for it, manpower is the most, and ink thickness is also not easy management and control.In the case of particularly circuit is than comparatively dense, the thinnest the less able of its anti-high-voltage breakdown that cause of circuit corner location ink, especially when PCB is relatively thin.
Summary of the invention
The purpose of this utility model is to solve the deficiencies in the prior art, it is provided that the PCB of a kind of anti-high pressure, this PCB is easy to process, and high pressure resistant.
The technical solution adopted in the utility model is:
A kind of PCB of anti-high pressure, including substrate, substrate includes PP basic unit, PP basic unit is respectively provided on two sides with line layer, the outside of line layer is provided with insulating cover, and wherein the thickness of line layer is less than 1OZ, and the thickness of insulation coverlay is equal with the thickness of line layer.
Further, described insulating cover is PI film layer, and PI film layer AD is gluing is connected to line layer.
Further, described PCB is provided with identification hole.
Further, described PCB is provided with error-proof structure.
Further, described error-proof structure includes the one group of fool proof hole being arranged on PCB side, and this group fool proof hole linearly arranges, and fool proof hole is rounded, and the aperture in fool proof hole increases the most successively.
Further, described error-proof structure includes that three fool proof holes, three fool proof holes are separately positioned on three vertex angle parts of PCB.
Preferably, the shape in three fool proof holes is respectively circular, oval and rectangle.
What this utility model obtained has the beneficial effect that this utility model employing arranges insulating cover outside line layer, replaces existing ink layer, can improve its barotolerance;Especially for the copper foil layer thickness circuit board less than 1OZ, it is also possible to play the effect optimizing structure.
Accompanying drawing explanation
Fig. 1 is a kind of sectional structure schematic diagram of the present utility model.
Fig. 2 is a kind of structural representation of the present utility model.
Reference is:
10 PCB;5 substrates;1 PP basic unit;2 line layers;3 AD glue;4 insulating covers;100 fool proof holes.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is described further by detailed description of the invention.
Embodiment: see Fig. 1 to Fig. 2.
A kind of PCB 10 of anti-high pressure, including substrate 5, substrate 5 includes PP basic unit 1, PP basic unit 1 is respectively provided on two sides with line layer 2, the outside of line layer 2 is provided with insulating cover 4, and wherein the thickness of line layer 2 is less than 1OZ, and the thickness of insulation coverlay is equal with the thickness of line layer 2.
In the technical program, use insulating cover 4 replacement ink layer, thus be effectively improved anti-voltage resistance.Secondly, the technical program is primarily adapted for use in line layer 2 thickness PCB 10 less than 1OZ, and when thickness is bigger, PCB 10 own PP basic unit 1 has higher anti-high-voltage breakdown;In order to cost-effective, controlling the thickness of PCB 10, through test of many times, when the thickness of the coverlay that insulate is suitable with the thickness of line layer 2, barotolerance is preferable.PP basic unit 1 is PP resin bed.
Further, described insulating cover 4 is PI film layer, naturally it is also possible to for other insulant material layers, PI film layer AD glue 3 is adhered to line layer 2.
PI film anti-voltage resistance preferably, use PI film can improve the barotolerance of pcb board as insulation coverlay.
Further, described PCB 10 is provided with identification hole.
Sign hole is set, the recognition effect to PCB 10 can be played.
Further, described PCB 10 is provided with error-proof structure.
Further, described error-proof structure includes the one group of fool proof hole 100 being arranged on PCB 10 side, and this group fool proof hole 100 linearly arranges, and fool proof hole 100 is rounded, and the aperture in fool proof hole 100 increases the most successively.
When specifically arranging, this group fool proof hole 100 is at least provided with 3;Owing to the both sides of PCB 10 are disposed asymmetrically, only side is provided with fool proof hole 100, and left and right directions therefore can be avoided to invert;Secondly, the arrangement in fool proof hole 100 has directivity, is possible to prevent positive and negative to invert.
Further, described error-proof structure includes that three fool proof holes 100, three fool proof holes 100 are separately positioned on three vertex angle parts of PCB 10.
3 determine a plane, and therefore a plane can be fixed in three fool proof holes 100, and the triangle of three fool proof hole 100 compositions has direction shape simultaneously, thus avoids direction to misplace.
Preferably, the shape in three fool proof holes 100 is respectively circular, oval and rectangle.
Difform combination, can play marked effect, the model of difference PCB 10.
Below being only the preferred embodiment of the application, equivalent technical solutions on this basis still falls within application protection domain.

Claims (7)

1. a PCB for anti-high pressure, including substrate, substrate includes PP basic unit, PP basic unit is respectively provided on two sides with line layer, it is characterized in that: the outside of line layer is provided with insulating cover, wherein the thickness of line layer is less than 1OZ, and the thickness of insulation coverlay is equal with the thickness of line layer.
The PCB of a kind of anti-high pressure the most according to claim 1, it is characterised in that: described insulating cover is PI film layer, and PI film layer AD is gluing is connected to line layer.
The PCB of a kind of anti-high pressure the most according to claim 2, it is characterised in that: described PCB is provided with identification hole.
The PCB of a kind of anti-high pressure the most according to claim 3, it is characterised in that: described PCB is provided with error-proof structure.
The PCB of a kind of anti-high pressure the most according to claim 4, it is characterized in that: described error-proof structure includes being arranged on one group of fool proof hole of PCB side, this group fool proof hole linearly arranges, and fool proof hole is rounded, and the aperture in fool proof hole increases the most successively.
The PCB of a kind of anti-high pressure the most according to claim 4, it is characterised in that: described error-proof structure includes that three fool proof holes, three fool proof holes are separately positioned on three vertex angle parts of PCB.
The PCB of a kind of anti-high pressure the most according to claim 6, it is characterised in that: the shape in three fool proof holes is respectively circular, oval and rectangle.
CN201620243273.3U 2016-03-28 2016-03-28 Anti highly compressed PCB circuit board Active CN205622975U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620243273.3U CN205622975U (en) 2016-03-28 2016-03-28 Anti highly compressed PCB circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620243273.3U CN205622975U (en) 2016-03-28 2016-03-28 Anti highly compressed PCB circuit board

Publications (1)

Publication Number Publication Date
CN205622975U true CN205622975U (en) 2016-10-05

Family

ID=57031515

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620243273.3U Active CN205622975U (en) 2016-03-28 2016-03-28 Anti highly compressed PCB circuit board

Country Status (1)

Country Link
CN (1) CN205622975U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107085738A (en) * 2017-02-09 2017-08-22 韦旭辉 A kind of label suitable for PCB, FPC
CN111542169A (en) * 2020-04-15 2020-08-14 东莞万钧电子科技有限公司 Manufacturing process of high-voltage-resistant PCB

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107085738A (en) * 2017-02-09 2017-08-22 韦旭辉 A kind of label suitable for PCB, FPC
CN111542169A (en) * 2020-04-15 2020-08-14 东莞万钧电子科技有限公司 Manufacturing process of high-voltage-resistant PCB

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