CN203968374U - Electret capacitor microphone - Google Patents
Electret capacitor microphone Download PDFInfo
- Publication number
- CN203968374U CN203968374U CN201420430122.XU CN201420430122U CN203968374U CN 203968374 U CN203968374 U CN 203968374U CN 201420430122 U CN201420430122 U CN 201420430122U CN 203968374 U CN203968374 U CN 203968374U
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- CN
- China
- Prior art keywords
- pcb board
- electret capacitor
- capacitor microphone
- microphone
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003990 capacitor Substances 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 11
- 230000007704 transition Effects 0.000 claims abstract description 4
- 230000004888 barrier function Effects 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 3
- 239000012774 insulation material Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 7
- 238000005538 encapsulation Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model relates to a kind of electret capacitor microphone, comprises the encapsulating structure being comprised of the first pcb board and the second pcb board, and the pole plate and the vibrating diaphragm that are installed on the sound-electric transition components of composition in encapsulating structure; Described the second pcb board is integrally-built concave shape pcb board, and described the first pcb board is fixedly connected with the openend of the second pcb board by PP prepreg.Electret capacitor microphone of the present utility model, required material is few, and bonding strength is high, and good airproof performance is simple and easy in technique implement, and properties of product are reliable and stable, and are not limited to the shape of microphone, applied widely.
Description
Technical field
The utility model relates to microphone, is specifically related to a kind of electret capacitor microphone.
Background technology
Along with improving constantly of constantly the reducing of electronic product volume, performance, the volume of microphone and the requirement of performance that people use electronic product are also more and more higher.At present the electret capacitor microphone of volume production mostly is the three sandwich circuit board structures that connect by fixing glue or adds the encapsulating structure of metal shell for wiring board.The former required material is many, and it is high that technique realizes difficulty, and because a plurality of positions are bonding, easily causes product firmness to reduce, and affects product reliability.The latter can realize by welding or put the mode of conducting resinl the encapsulation of microphone in theory, but because the element internal of electret capacitor microphone needs certain pressure to guarantee the fastness connecting, therefore these two kinds of modes are all difficult to practical application---the not high and easy leakage sound of microphone firmness that the mode of welding or some conducting resinl realizes, must consider to guarantee its seal by the mode of some glue, it is very large again that technique realizes difficulty; So be to adopt metal shell the mode of wiring board edge sealing to be completed to the encapsulation of microphone in actual production, but it is not suitable for non-circular microphone, can only realize simple shielding yet and be connected with circuit.
Utility model content
In view of the above problems, the purpose of this utility model is to provide a kind of easily enforcement of material, technique, good airproof performance and electret capacitor microphone firm, stable performance of simplifying.
The utility model adopts following technical scheme: the first pcb board; The second pcb board, described the second pcb board is that integrally-built concave shape pcb board and bottom are provided with sound hole, on the madial wall of described the second pcb board and interior diapire, is covered with conductive layer, on the conductive layer of described madial wall, is covered with insulating barrier; Wherein, described the first pcb board is fixedly connected with and seals described openend by the openend of PP prepreg and the second pcb board, thereby forms the encapsulating structure with cavity; And, be installed on pole plate and the vibrating diaphragm of the sound-electric transition components of composition in the cavity of described encapsulating structure.
A preferred technical scheme, described insulating barrier is polyester plastics.
A preferred technical scheme, described the second pcb board is FR-4 backing material plate.
A preferred technical scheme, described the second pcb board is multi-layer sheet, the conductive material layer replacing and insulation material layer, consists of.
A preferred technical scheme, described the first pcb board consists of resin material.
A preferred technical scheme, the interior diapire of described the second pcb board is provided with balancing slit.
Electret capacitor microphone of the present utility model, required material is few, and bonding strength is high, and good airproof performance is simple and easy in technique implement, and properties of product are reliable and stable, and are not limited to the shape of microphone, applied widely.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model electret capacitor microphone embodiment.
Fig. 2 is the vertical view of the utility model the second pcb board embodiment.
Fig. 3 is the vertical view of the utility model second another embodiment of pcb board.
Embodiment
Below in conjunction with accompanying drawing, specific embodiment of the utility model is described in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the utility model, and can not be interpreted as restriction of the present utility model.
Shown in figure 1, the encapsulating structure of electret capacitor microphone is comprised of the first pcb board 1 and the second pcb board 4, in described encapsulating structure inside, acoustics and electronic unit are installed, comprise amplifier 2, shell fragment 3, pole plate 5, pad 6 and vibrating diaphragm 7, described pole plate 5 and vibrating diaphragm 7 form sound-electric transition components, described shell fragment 3 conducting amplifiers 2 and pole plate 5, described amplifier 2 is fixed on the first pcb board 1 by fixing glue 9, and wherein said the first pcb board 1 consists of resin material.
Described the second pcb board 4 is for integrally-built concave shape pcb board and bottom are provided with sound hole, and described " overall structure " refers to that the second pcb board is a monoblock wiring board, and is not by the assembled structure of mode such as bonding by a plurality of wiring boards.The concave shape structure of described the second pcb board can be processed to mill out for holding the groove of microphone parts and forms by pcb board being carried out to milling; the second pcb board in the present embodiment is right angle rectangular shape; but the second pcb board of the present utility model is not limited to right angle rectangular shape; every overall structure and offer the embodiment that the pcb board of a groove all should be considered as being equal to, within protection range of the present utility model.
With reference to the vertical view that Figure 2 shows that described the second pcb board, as can be seen from the figure, the groove inwall of described the second pcb board is covered with conductive layer, wherein madial wall is covered with conductive layer 41, interior diapire is covered with conductive layer 42, described conductive layer 41 for guaranteeing that the circuit of microphone is connected and shielding, can be copper layer with 42, by carry out the formation of PTH electroless copper plating at groove inwall.On the conductive layer 41 of described madial wall, being coated with insulating barrier 43, can be polyester plastics, for the microphone assembly that insulate.Wherein, described the second pcb board can be FR-4 backing material plate; The second pcb board can also form Multilayer Structure, by the conductive material layer replacing and insulation material layer, formed, and be for example three ply board, middle conductive layer facilitates circuit trace, can make product wires design freer more flexible, outer field conductive layer can be used for electromagnetic shielding, improving product performance.
Described the first pcb board 1 and the second pcb board 4 form the encapsulating structure with cavity, specifically, described the first pcb board 1 is to adopt the technique of high-temperature laminating and the openend of the second pcb board 4 to be fixed together by PP prepreg 8, thereby seal described openend, completes encapsulation.This encapsulating structure all being formed by pcb board of the utility model circuit trace of being more convenient for, can realize complicated circuit design, simultaneously because the link position of microphone integral body is few, and the intensity by PP prepreg high-temperature laminating connected mode is together also higher, and firmness and the reliability of corresponding microphone products improve thereupon.In addition, thisly via two pcb boards, adopt the microphone of PP prepregs encapsulation more to save material, potting is leakiness sound not well, and the shape that is not limited to microphone is applied widely, than the packaged type of metal shell, in technique, also more easily realizes.
With reference to the vertical view that Figure 3 shows that second another embodiment of pcb board, as can be seen from the figure, the interior diapire of described the second pcb board offers balancing slit 44 and elliptical slot 45, to improve frequency acoustic performance and the oscillation space of microphone products.
Embodiment shown in above foundation is graphic describes structure of the present utility model, feature and action effect in detail; one of ordinary skill in the art are understood that; above-described embodiment is only unrestricted for explaining the utility model; every change of doing according to conception of the present utility model; or be revised as the equivalent embodiment of equivalent variations, all should belong in protection range of the present utility model.
Claims (6)
1. an electret capacitor microphone, is characterized in that, comprising:
The first pcb board;
The second pcb board, described the second pcb board is that integrally-built concave shape pcb board and bottom are provided with sound hole, on the madial wall of described the second pcb board and interior diapire, is covered with conductive layer, on the conductive layer of described madial wall, is covered with insulating barrier;
Wherein, described the first pcb board is fixedly connected with and seals described openend by the openend of PP prepreg and the second pcb board, thereby forms the encapsulating structure with cavity; And,
Be installed on pole plate and the vibrating diaphragm of the sound-electric transition components of composition in the cavity of described encapsulating structure.
2. electret capacitor microphone as claimed in claim 1, is characterized in that: described insulating barrier is polyester plastics.
3. electret capacitor microphone as claimed in claim 1, is characterized in that: described the second pcb board is FR-4 backing material plate.
4. electret capacitor microphone as claimed in claim 1, is characterized in that: described the second pcb board is multi-layer sheet, the conductive material layer replacing and insulation material layer, consists of.
5. electret capacitor microphone as claimed in claim 1, is characterized in that: described the first pcb board consists of resin material.
6. electret capacitor microphone as claimed in claim 1, is characterized in that: the interior diapire of described the second pcb board is provided with balancing slit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420430122.XU CN203968374U (en) | 2014-07-31 | 2014-07-31 | Electret capacitor microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420430122.XU CN203968374U (en) | 2014-07-31 | 2014-07-31 | Electret capacitor microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203968374U true CN203968374U (en) | 2014-11-26 |
Family
ID=51928911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420430122.XU Active CN203968374U (en) | 2014-07-31 | 2014-07-31 | Electret capacitor microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203968374U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106162394A (en) * | 2015-04-28 | 2016-11-23 | 钰太芯微电子科技（上海）有限公司 | A kind of waterproof microphone monomer |
-
2014
- 2014-07-31 CN CN201420430122.XU patent/CN203968374U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106162394A (en) * | 2015-04-28 | 2016-11-23 | 钰太芯微电子科技（上海）有限公司 | A kind of waterproof microphone monomer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
|
| TR01 | Transfer of patent right |