CN106911976B - Sound production device module - Google Patents
Sound production device module Download PDFInfo
- Publication number
- CN106911976B CN106911976B CN201710121972.XA CN201710121972A CN106911976B CN 106911976 B CN106911976 B CN 106911976B CN 201710121972 A CN201710121972 A CN 201710121972A CN 106911976 B CN106911976 B CN 106911976B
- Authority
- CN
- China
- Prior art keywords
- injection hole
- glue injection
- circuit board
- hole
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004519 manufacturing process Methods 0.000 title description 2
- 239000003292 glue Substances 0.000 claims abstract description 107
- 238000002347 injection Methods 0.000 claims abstract description 95
- 239000007924 injection Substances 0.000 claims abstract description 95
- 238000007789 sealing Methods 0.000 claims abstract description 23
- 230000000149 penetrating effect Effects 0.000 claims description 10
- 239000000565 sealant Substances 0.000 description 15
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
- Slot Machines And Peripheral Devices (AREA)
Abstract
The invention discloses a sound generating device module. The sound generating device module comprises a module shell and a circuit board arranged in the module shell, wherein the module shell is provided with a through hole, the circuit board extends to the outer side of the module shell from the through hole, the module shell is provided with a first glue injection hole and a second glue injection hole at positions close to the through hole, the first glue injection hole and the second glue injection hole respectively penetrate through the two side surfaces of the circuit board from the outer side of the module shell, the first glue injection hole and the second glue injection hole are communicated at the circuit board, and sealing glue is filled in the first glue injection hole and the second glue injection hole and is configured to seal gaps between the circuit board and the through hole and seal the first glue injection hole and the second glue injection hole. The invention solves the technical problem of how to improve the sealing state of a circuit board and a through board opening.
Description
Technical Field
The invention belongs to a sound generating device module, and particularly relates to a sound generating device module.
Background
In recent years, development of electronic products is rapid, and tablet computers and smart phones have become necessities of daily life of people. The updating speed of the electronic product is high, and the performance of the product is gradually improved. Sound emitting devices are an important component in electronic products for converting between sound signals and sound. Those skilled in the art have also continuously improved the performance of sound emitting devices to accommodate the development of electronic products.
In the prior art, the sound generating device is assembled in the whole electronic product, and is usually electrically connected with peripheral devices through a circuit board, and the circuit board needs to extend out from the inside of the shell of the sound generating device to the outside. And the position where the circuit board extends out is required to be coated with an adhesive for sealing, so that the sounding device is prevented from leaking air. However, this structure has drawbacks. On the one hand, the adhesive has flowing property, and the adhesive possibly flows to the peripheral area of the circuit board, so that the appearance of the sounding device is changed, and the subsequent assembly of the sounding device is influenced; on the other hand, the periphery of the position where the circuit board extends out from the sound generating device shell needs to be sealed by the adhesive, but due to the shielding of the circuit board and the shell structure, whether the bottom and the side surface of the circuit board are sealed by the adhesive or not cannot be accurately monitored. In addition, the process steps of coating the adhesive are complex, and the assembly speed of the product is affected.
Therefore, it is necessary to improve the structure of the sound generating device related to the extending and sealing of the circuit board, improve the sealing condition of the extending position of the circuit board, improve the sealing reliability and simplify the process steps of bonding and sealing.
Disclosure of Invention
It is an object of the present invention to provide a new solution for an improved sound generating device module.
According to a first aspect of the present invention, there is provided a sound emitting device module, comprising a module housing and a circuit board disposed in the module housing, the module housing having a board through hole from which the circuit board extends to an outside of the module housing, the module housing having a first glue injection hole and a second glue injection hole at positions near the board through hole, the first glue injection hole and the second glue injection hole penetrating from the outside of the module housing to both side surfaces of the circuit board, respectively, the first glue injection hole and the second glue injection hole communicating at the circuit board, the first glue injection hole and the second glue injection hole being filled with a sealant configured to close a gap between the circuit board and the board through hole and to close the first glue injection hole and the second glue injection hole.
Optionally, the board through opening is formed on a side wall of the module housing, and the height of the board through opening on the side wall is flush with the height of the circuit board fixed in the module housing.
Optionally, the first glue injection hole is configured to extend downward from a top surface of the module housing to the circuit board, and the second glue injection hole is configured to extend upward from a bottom surface of the module housing to the circuit board.
Optionally, the first glue injection hole and/or the second glue injection hole are/is adjacently arranged beside the side wall with the plate penetrating opening.
Optionally, the first glue injection hole is opposite to the second glue injection hole, and the hole structures of the first glue injection hole and the second glue injection hole are the same.
Optionally, the first glue injection hole and the second glue injection hole are cubic cylindrical holes.
Optionally, the length of the cross sections of the first glue injection hole and the second glue injection hole in the width direction of the circuit board is larger than the width of the circuit board at the corresponding position.
Optionally, the module casing includes upper casing and lower casing, have respectively on upper casing and the lower casing and cross the board breach, upper casing disposes to can with lower casing lock, two cross the board breach combination constitutes cross the board mouth.
Optionally, the module housing has an extension configured to carry a circuit board protruding from the through-board opening.
The invention has the technical effects that the gap between the board penetrating opening and the circuit board is sealed through the first glue injection hole and the second glue injection hole, so that the sealing condition is improved. And the sealing reliability is improved.
Other features of the present invention and its advantages will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a side cross-sectional view of a sound emitting device module provided by the present invention;
FIG. 2 is an enlarged view of a portion of FIG. 1;
FIG. 3 is a schematic perspective view of a sound generating device module according to the present invention;
fig. 4 is an exploded view of components of the sound generator module provided by the present invention.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise.
The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
The invention provides an improved sound generating device module, which is shown in fig. 1 and 2, and comprises a module shell 1 and a circuit board 2. The circuit board 2 is arranged in the module housing 1, a board through opening 11 is arranged on the module housing 1, and the board through opening 11 is communicated with the inside and the outside of the module housing 1. The partial region of the circuit board 2 extends from the through-opening 11 to the outside of the module housing 1. At a position on the module housing 1 close to the through-board 11, the module housing 1 has a first glue injection hole 12 and a second glue injection hole 13. The two glue injection holes extend from the outside of the module housing 1 to the two surfaces of the circuit board 2, the first glue injection hole 12 corresponds to one surface of the circuit board 2, and the second glue injection hole 13 corresponds to the other surface of the circuit board 2. Further, the first glue injection hole 12 and the second glue injection hole 13 communicate with each other at the position of the circuit board 2. The two glue injection holes are positioned close to the through hole 11, so that a gap between the circuit board 2 and the through hole 11 is communicated with the two glue injection holes.
And the first glue injection hole and the second glue injection hole are filled with sealant, and due to the structural design characteristics of the two glue injection holes, the sealant can flow to the through plate opening, and adhesive sealing is formed at the gaps of the upper surface and the lower surface of the circuit board and the through plate opening and the gaps of the edge of the circuit board and the through plate opening. The design of the first glue injection hole and the second glue injection hole can effectively improve the sealing reliability between the board through hole and the circuit board on one hand, and enable gaps possibly generated in all directions between the circuit board and the board through hole to be sealed by the adhesive.
Furthermore, the sealing conditions of the upper surface, the lower surface and the edge of the circuit board can be monitored by sealing the first glue injection hole and the second glue injection hole, and if the sealing conditions are not completely sealed, the repairing can be carried out in the holes. The sealant filled in the sealant injecting holes can also seal the first sealant injecting holes and the second sealant injecting holes, so that air leakage is prevented.
On the other hand, the sealant filled in the glue injection hole is not easy to flow to other areas of the circuit board, so that the possibility that the sealant changes the appearance of the circuit board and the sounding device module is reduced, and the assembly reliability of the product is guaranteed. Compared with the prior art, the sealing operation steps and the sealing process are simpler and more convenient, and the sealant is only required to be filled into the sealant injection hole.
As shown in fig. 1 and 4, the sound generating device module may further include a sound generating device unit 3, where the sound generating device unit 3 is fixedly disposed in the module housing 1 and is configured to receive a sound signal to generate sound. The sound generator unit 3 may be electrically connected to the circuit board 2 to transmit sound signals to the sound generator unit 3.
The invention particularly provides an embodiment of the module housing 1, as shown in fig. 2, the through board opening 11 may be formed on a side wall of the module housing 1, the module housing 1 is in a flat structure, and the circuit board 2 is laid in the module housing 1. The height of the through-board 11 on the side wall of the module housing 1 is substantially flush with the height of the circuit board 2 fixed in the module housing 1, so that the circuit board 2 extends from the through-board 11 to the outside of the module housing 1.
The preferred distribution of the first and second glue injection holes 12, 13 is also shown in the embodiment shown in fig. 2, said first glue injection hole 12 extending from the top surface of the module housing 1 down to the interior of the module housing 1, communicating to the upper surface of said circuit board 2. The second glue injection hole 13 extends upward from the bottom surface of the module housing 1 to the inside of the module housing 1, and communicates with the lower surface of the circuit board 2. The first glue injection hole 12 and the second glue injection hole 13 may bypass the edge of the circuit board 2, so as to form a communication effect between the two channels. In this embodiment, both glue injection holes are straight holes in configuration to facilitate the injection of the sealant to the surface of the circuit board.
Preferably, in the above embodiment, the first glue injection hole 12 and the second glue injection hole 13 may be close to the side wall of the module housing 1 where the board through hole 11 is located. As shown in fig. 1 and 2, two glue injection holes are adjacently arranged beside the side wall where the plate through hole 11 is positioned. The sealant flowing into the glue injection hole can be directly filled in the gap between the circuit board 2 and the through hole 11 to form a sealing effect. The invention does not limit the thickness of the side wall of the module shell and the approaching degree of the glue injection hole and the board penetrating opening, so long as the adhesive can seal the gap between the board penetrating opening and the circuit board from the inner side of the shell wall of the module shell through the glue injection hole.
The structure and the position of the first glue injection hole and the second glue injection hole can be set according to the actual structure of the sound generating device module in actual implementation. Preferably, the first glue injection hole may be opposite to the second glue injection hole, and the inner hole structures of the two glue injection holes may be identical. The processing of the glue injection hole is convenient, and the glue injection sealing process can be further simplified.
Alternatively, as shown in fig. 3, the first glue injection hole 12 and the second glue injection hole 13 may be cubic cylindrical holes, and the cross section of each cubic cylindrical glue injection hole is rectangular, and each cubic cylindrical hole is suitable for being matched with the circuit board 2 with two parallel edges. Further preferably, in order to facilitate communication between the first glue injection hole 12 and the second glue injection hole 13, the sealant is allowed to fill the gap between the edge of the circuit board and the board penetration hole 11, and the length of the cross section of the glue injection hole in the width direction of the circuit board is preferably larger than the width of the circuit board at the corresponding position. The first glue injection hole and the second glue injection hole can also be cylindrical and diamond holes, and the invention is not limited to the cylindrical holes and the diamond holes. The internal structure of the glue injection hole can be designed according to the shape of the glue injection needle head adopted in the glue injection process.
Alternatively, as shown in fig. 4, the module housing 1 may include an upper housing 14 and a lower housing 15, where the upper housing 14 and the lower housing 15 are fastened to form a complete module housing 1 structure, and the circuit board 2 and the sound generator unit 3 are disposed inside the upper housing 14 and the lower housing 15. Specifically, the upper housing 14 and the lower housing 15 are respectively provided with a threading notch, and when the upper housing 14 is buckled with the lower housing 15, the threading notches are combined to form the threading opening 11.
Optionally, as shown in fig. 1, 2 and 4, the module housing 1 has an extension 16 thereon, and the extension 16 is used for carrying the circuit board 2 protruding from the board through hole 11. The circuit board 2 located outside the module housing 1 may be adhered and fixed on the extension portion 16, so that the sound generating device module is electrically connected with the whole electronic product. The extension 16 may be inserted into a circuit of the whole electronic product to electrically connect the circuit board with the whole electronic product. In this embodiment, the sealing glue can seal the gap between the circuit board and the through hole from the inner side of the module case without sealing the gap from the outer side of the module case. Alternatively, in order to improve the sealing reliability, a sealant may be further provided outside the module case and between the circuit board and the external extension portion, which is not limited by the present invention.
While certain specific embodiments of the invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (7)
1. The utility model provides a sound generating device module, its characterized in that includes module casing (1) and sets up circuit board (2) in module casing (1), module casing (1) have through board mouth (11), circuit board (2) stretch to the module casing (1) outside from through board mouth (11), module casing (1) are close to the position department of through board mouth (11) has first injecting glue hole (12) and second injecting glue hole (13), first injecting glue hole (12) and second injecting glue hole (13) are respectively from the outside of module casing (1) run through to the both sides surface of circuit board (2), first injecting glue hole (12) and second injecting glue hole (13) are in circuit board (2) department intercommunication, first injecting glue hole (12) and second injecting glue hole (13) are filled with the sealing glue, sealing glue is configured to seal circuit board (2) and through board mouth (11) and first injecting glue hole (12) and second injecting glue hole (13);
the first glue injection hole (12) and the second glue injection hole (13) are cubic cylindrical holes, and the length of the cross sections of the first glue injection hole (12) and the second glue injection hole (13) in the width direction of the circuit board (2) is larger than the width of the circuit board (2) at the corresponding position.
2. The sound generating device module according to claim 1, wherein the board penetrating opening (11) is formed in a side wall of the module housing (1), and the height of the board penetrating opening (11) on the side wall is flush with the height of the circuit board (2) fixed in the module housing (1).
3. The sound emitting device module according to claim 2, wherein the first glue injection hole (12) is configured to extend downwards from the top surface of the module housing (1) to the circuit board (2), and the second glue injection hole (13) is configured to extend upwards from the bottom surface of the module housing (1) to the circuit board (2).
4. A sound emitting device module according to claim 3, characterized in that the first glue injection hole (12) and/or the second glue injection hole (13) are arranged next to the side wall with the board through opening (11).
5. A sound generating device module according to claim 3, characterized in that the first glue injection hole (12) is opposite to the second glue injection hole (13), and the hole structures of the first glue injection hole (12) and the second glue injection hole (13) are the same.
6. The sound generating device module according to claim 1, wherein the module housing (1) comprises an upper housing (14) and a lower housing (15), wherein the upper housing (14) and the lower housing (15) are respectively provided with a board penetrating notch, the upper housing (14) is configured to be buckled with the lower housing (15), and the two board penetrating notches are combined to form the board penetrating opening (11).
7. The sound emitting device module according to claim 1, characterized in that the module housing (1) has an extension (16), the extension (16) being configured for carrying a circuit board (2) protruding from the through opening (11).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121972.XA CN106911976B (en) | 2017-03-01 | 2017-03-01 | Sound production device module |
| PCT/CN2017/090637 WO2018157528A1 (en) | 2017-03-01 | 2017-06-28 | Sounder module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121972.XA CN106911976B (en) | 2017-03-01 | 2017-03-01 | Sound production device module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106911976A CN106911976A (en) | 2017-06-30 |
| CN106911976B true CN106911976B (en) | 2023-12-22 |
Family
ID=59186127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710121972.XA Active CN106911976B (en) | 2017-03-01 | 2017-03-01 | Sound production device module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106911976B (en) |
| WO (1) | WO2018157528A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108650819B (en) * | 2018-04-26 | 2020-09-22 | 歌尔股份有限公司 | Sound production device module |
| WO2020258215A1 (en) * | 2019-06-28 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Sound producing device |
| WO2020258212A1 (en) * | 2019-06-28 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Speaker case |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW456748U (en) * | 1999-08-20 | 2001-09-21 | Shen Ya Guang | Airtight waterproof structure of outdoor lamp control box |
| CN201114656Y (en) * | 2007-10-09 | 2008-09-10 | 鹤山丽得电子实业有限公司 | Waterproof structure for music box |
| CN203618121U (en) * | 2013-12-11 | 2014-05-28 | 歌尔声学股份有限公司 | Loudspeaker module |
| CN204967635U (en) * | 2015-10-13 | 2016-01-13 | 北京微科能创科技有限公司 | Power supply module |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008271426A (en) * | 2007-04-24 | 2008-11-06 | Matsushita Electric Works Ltd | Acoustic sensor |
| CN201290163Y (en) * | 2008-09-19 | 2009-08-12 | 瑞声声学科技(常州)有限公司 | Integration system of minitype sound generator |
| CN204518070U (en) * | 2015-04-17 | 2015-07-29 | 歌尔声学股份有限公司 | Speaker vibration system |
| CN206596154U (en) * | 2017-03-01 | 2017-10-27 | 歌尔股份有限公司 | Sound-producing device module |
-
2017
- 2017-03-01 CN CN201710121972.XA patent/CN106911976B/en active Active
- 2017-06-28 WO PCT/CN2017/090637 patent/WO2018157528A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW456748U (en) * | 1999-08-20 | 2001-09-21 | Shen Ya Guang | Airtight waterproof structure of outdoor lamp control box |
| CN201114656Y (en) * | 2007-10-09 | 2008-09-10 | 鹤山丽得电子实业有限公司 | Waterproof structure for music box |
| CN203618121U (en) * | 2013-12-11 | 2014-05-28 | 歌尔声学股份有限公司 | Loudspeaker module |
| CN204967635U (en) * | 2015-10-13 | 2016-01-13 | 北京微科能创科技有限公司 | Power supply module |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018157528A1 (en) | 2018-09-07 |
| CN106911976A (en) | 2017-06-30 |
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