CN206596154U - Sound-producing device module - Google Patents
Sound-producing device module Download PDFInfo
- Publication number
- CN206596154U CN206596154U CN201720195902.4U CN201720195902U CN206596154U CN 206596154 U CN206596154 U CN 206596154U CN 201720195902 U CN201720195902 U CN 201720195902U CN 206596154 U CN206596154 U CN 206596154U
- Authority
- CN
- China
- Prior art keywords
- hole
- injecting glue
- circuit board
- sound
- producing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- 239000003292 glue Substances 0.000 claims abstract description 106
- 239000000565 sealant Substances 0.000 claims abstract description 16
- 239000012530 fluid Substances 0.000 claims abstract description 15
- 238000000407 epitaxy Methods 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 15
- 239000007767 bonding agent Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Landscapes
- Slot Machines And Peripheral Devices (AREA)
Abstract
The utility model discloses a kind of sound-producing device module.The sound-producing device module includes module casing and the circuit board being arranged in the module casing, the module casing has threading mouthful, the circuit board is reached on the outside of the module casing from threading mouth, the module casing has the first hole for injecting glue and the second hole for injecting glue at the position close to the threading mouthful, first hole for injecting glue and the second hole for injecting glue penetrate into the both side surface of the circuit board on the outside of the module casing respectively, first hole for injecting glue is connected with the second hole for injecting glue at circuit board, fluid sealant is filled with first hole for injecting glue and the second hole for injecting glue, the fluid sealant is configured to the gap closed between the circuit board and threading mouthful and closes first hole for injecting glue and the second hole for injecting glue.The technical problem that the utility model is solved is how to improve the sealing state of circuit board and threading mouthful.
Description
Technical field
The utility model belongs to sound-producing device module, specifically, and the utility model is related to a kind of sound-producing device module.
Background technology
In recent years, electronic product is quickly grown, and tablet personal computer, smart mobile phone are required as people's daily life
Product.The update speed of electronic product is fast, and the performance of product is gradually lifted.Sound-producing device is a kind of important in electronic product
Part, for the conversion between voice signal and sound.Those skilled in the art are also carried out constantly to the performance of sound-producing device
Improve, to adapt to the development of electronic product.
In the prior art, sound-producing device is assemblied in electronic product complete machine, generally passes through circuit board and the device on periphery
It is electrically connected, circuit board needs to reach outside from the enclosure interior of sound-producing device.In the position of circuit board stretching, it is necessary to apply
Cover bonding agent to be sealed, prevent sound-producing device gas leakage.But, this structure existing defects.On the one hand, bonding agent has trickling
Property, bonding agent is possible to trickling to the neighboring area of circuit board, causes sound-producing device outward appearance change, and influence sound-producing device is follow-up
Assembling；On the other hand, the surrounding for the position that circuit board stretches out from sound-producing device housing is required for bonding agent to seal, but is due to electricity
Road plate itself and shell structure are blocked, and the bottom and side whether bonding agent seals up circuit board can not accurately be supervised
Control.In addition, the processing step of coating bonding agent is more complicated, the assembling speed of product have impact on.
It is improved thus, it is necessary to be stretched out to the relevant circuit board of sound-producing device with sealed structure, improves circuit board and stretch
The sealing condition of out position, improves sealing reliability, simplifies the processing step of adhering and sealing.
Utility model content
A purpose of the present utility model is to provide a kind of new solution of improved sound-producing device module.
According to first aspect of the present utility model, there is provided a kind of sound-producing device module, including module casing and setting
Circuit board in the module casing, the module casing has threading mouthful, and the circuit board reaches institute from the threading mouthful
State on the outside of module casing, the module casing has the first hole for injecting glue and the second injecting glue at the position close to the threading mouthful
Hole, first hole for injecting glue and the second hole for injecting glue penetrate into the both sides table of the circuit board on the outside of the module casing respectively
Face, first hole for injecting glue is connected with the second hole for injecting glue at circuit board, is filled in first hole for injecting glue and the second hole for injecting glue
There is fluid sealant, the fluid sealant is configured to the gap closed between the circuit board and threading mouthful and closes first hole for injecting glue
With the second hole for injecting glue.
Alternatively, the threading mouthful is opened on the side wall of the module casing, height of the threading mouthful on the wall of side
The height being fixed on the circuit board in module casing is flush.
Alternatively, first hole for injecting glue is configured to extend downward into the circuit board from the top surface of the module casing,
Second hole for injecting glue is configured to extend upwardly to the circuit board from the bottom surface of the module casing.
Alternatively, it is arranged near first hole for injecting glue and/or the second hole for injecting glue by the side wall with the threading mouthful.
Alternatively, first hole for injecting glue is just to second hole for injecting glue, and the hole of the first hole for injecting glue and the second hole for injecting glue is tied
Structure is identical.
Alternatively, first hole for injecting glue and the second hole for injecting glue are in cube cylindrical hole.
Alternatively, length of the cross section of first hole for injecting glue and the second hole for injecting glue on the width of circuit board is big
In the width of the circuit board of corresponding position.
Alternatively, the module casing includes respectively having on upper shell and lower house, the upper shell and lower house and worn
Plate breach, the upper shell is configured to fasten with lower house, and two threading breach combinations constitute the threading mouthful.
Alternatively, the module casing has epitaxy part, and the epitaxy part is configured for carrying and stretched from the threading mouthful
The circuit board gone out.
One of the present utility model has the technical effect that, by first hole for injecting glue and the second hole for injecting glue to threading mouthful and electricity
Gap between the plate of road is sealed, and improves sealing condition.Improve sealing reliability.
It is of the present utility model other by referring to the drawings to the detailed description of exemplary embodiment of the present utility model
Feature and its advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiment of the present utility model, and
And be used to explain principle of the present utility model together with its explanation.
Fig. 1 is the side sectional view for the sound-producing device module that the utility model is provided；
Fig. 2 is Fig. 1 partial enlarged drawing；
Fig. 3 is the dimensional structure diagram for the sound-producing device module that the utility model is provided；
Fig. 4 is the part explosive view for the sound-producing device module that the utility model is provided.
Embodiment
Various exemplary embodiments of the present utility model are described in detail now with reference to accompanying drawing.It should be noted that：Unless another
Illustrate outside, the part and the positioned opposite of step, numerical expression and numerical value otherwise illustrated in these embodiments is not limited
Make scope of the present utility model.
The description only actually at least one exemplary embodiment is illustrative below, never as to this practicality
New and its application or any limitation used.
It may be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In shown here and discussion all examples, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined, then it need not be further discussed in subsequent accompanying drawing in individual accompanying drawing.
The utility model provides a kind of improved sound-producing device module, and as shown in Figure 1, 2, the sound-producing device module includes
Module casing 1 and circuit board 2.The circuit board 2 is arranged in the module casing 1, and threading is provided with the module casing 1
Mouth 11, the threading mouthful 11 connects the inside and outside of module casing 1.The subregion of the circuit board 2 is from the threading mouthful
The outside of the module casing 1 is extended at 11.On module casing 1 at the position of the threading mouthful 11, module casing 1
With the first hole for injecting glue 12 and the second hole for injecting glue 13.Two hole for injecting glue are penetrated into always from the outside of the module casing 1
On two surfaces of the circuit board 2, the first hole for injecting glue 12 is corresponding with a side surface of circuit board 2, the second hole for injecting glue 13 then with
Another side surface correspondence of circuit board 2.Further, the hole for injecting glue 13 of the first hole for injecting glue 12 and second is in the position of circuit board 2
Place is put to be interconnected.Two hole for injecting glue are located proximate to the threading mouthful 11, so the gap between circuit board 2 and threading mouthful 11
It is to be connected with two hole for injecting glue.
Fluid sealant is filled with first hole for injecting glue and the second hole for injecting glue, because the structure design of two hole for injecting glue is special
Point, the fluid sealant can be flow at threading mouthful, on circuit boards, descended at the gap of two surfaces and threading mouthful and circuit board
Arris and threading mouthful gap at all form adhering and sealing.This first hole for injecting glue of the present utility model, the second hole for injecting glue
On the one hand design can effectively improve the sealing reliability between threading mouthful and circuit board, make between circuit board and threading mouthful each
All glued dose of issuable gap sealing on direction.
Further, sealed by first, second hole for injecting glue, upper and lower surface that can be to circuit board and edge
Sealing situation be monitored, if there is situation about not being fully sealed, can also be repaired in hole.It is filled in hole for injecting glue
In fluid sealant the first hole for injecting glue and the second hole for injecting glue can also be closed, prevent gas leakage.
On the other hand, the fluid sealant being filled in hole for injecting glue is difficult to flow to other regions of circuit board, reduces sealing
Glue changes circuit board, the possibility of the outward appearance of sound-producing device module, and the assembly reliability to product provides guarantee.Seal operation
The step of and technique it is easier relative to prior art, only need into hole for injecting glue filling with sealant.
As shown in Fig. 1,4, sound-producing device monomer 3, the sound-producing device list can also be included in the sound-producing device module
Body 3 is fixedly installed in the module casing 1, and sound is produced for receiving voice signal.The sound-producing device monomer 3 can be with
The formation of circuit board 2 electrical connection, by transmission of sound signals to sound-producing device monomer 3.
The utility model specifically provides a kind of embodiment of module casing 1, as shown in Fig. 2 the threading mouthful
11 can be opened on the side wall of the module casing 1, and the overall module casing 1 is in flat structure, and the circuit board 2 is laid on
In module casing 1.11 height on the side wall of module casing 1 of the threading mouthful is fixed on module casing 1 with the circuit board 2
Interior height is substantially flush, and is easy to circuit board 2 to be extended to from threading mouthful 11 outside module casing 1.
The first hole for injecting glue 12, the preferred distribution mode of the second hole for injecting glue 13, institute are also shown in embodiment shown in Fig. 2
State the first hole for injecting glue 12 to extend downwardly into inside module casing 1 from the top surface of module casing 1, be communicated to the upper of the circuit board 2
Surface.Second hole for injecting glue 13 is extended up to inside module casing 1 from the bottom surface of the module casing 1, is communicated to described
The lower surface of circuit board 2.The hole for injecting glue 13 of first hole for injecting glue 12 and second can bypass the edge of the circuit board 2, be formed
Connection effect between two ducts.In this embodiment, the structure of two hole for injecting glue is all straight hole, is easy to fluid sealant to inject
To the surface of circuit board.
Preferably, in the above-described embodiment, the hole for injecting glue 13 of the first hole for injecting glue 12 and second can be close to threading mouthful
The side wall of module casing 1 where 11.As shown in Figure 1, 2, by the side wall that the place of threading mouthful 11 is arranged near two hole for injecting glue.
Flow on the gap that the fluid sealant of hole for injecting glue can be directly filled between circuit board 2 and threading mouthful 11, form sealing effectiveness.This
Utility model is not limited the thickness of the side wall of module casing, also hole for injecting glue and the close degree of threading mouthful is not carried out
Limitation, if ensure bonding agent can by hole for injecting glue on the inside of the shell wall of module casing by the seam between threading mouthful and circuit board
Gap is sealed.
The utility model can set first injecting glue when actually implementing according to the practical structures of sound-producing device module
The structure and position of hole and the second hole for injecting glue.Preferably, first hole for injecting glue can be just to second hole for injecting glue, two notes
The inner hole structure in glue hole can be with identical.Facilitate the processing of hole for injecting glue, also can further simplify injecting glue sealing technology.
Alternatively, as shown in figure 3, the hole for injecting glue 13 of first hole for injecting glue 12 and second can be in cube cylindrical hole, cube
The cross section of the hole for injecting glue of cylindricality is rectangle, and cube cylindrical hole is adapted to be engaged with the circuit board 2 with two parallel arris.
It is further preferred that for the ease of making the first hole for injecting glue 12 be connected with the second hole for injecting glue 13, enabling fluid sealant to be filled into circuit
At gap between the arris and threading of plate mouthfuls 11, the length of the cross section of hole for injecting glue on the width of circuit board is preferably big
In the width of the circuit board of corresponding position.First hole for injecting glue and the second hole for injecting glue can also be in cylinder, diamond holes, this
Utility model is not limited this.The dispensing needle head that the internal structure of hole for injecting glue is used when can also be according to injection process
Shape is designed.
Alternatively, as shown in figure 4, the module casing 1 can include upper shell 14 and lower house 15, the upper shell 14
Fastened with lower house 15 and constitute the complete structure of module casing 1, the circuit board 2 and sound-producing device monomer 3 are arranged on upper shell
14 and lower house 15 inside.Especially, there is threading breach respectively, when the upper shell on the upper shell 14 and lower house 15
14 with lower house 15 when fastening, and two threading breach combinations constitute the threadings mouthful 11.
Alternatively, as shown in Fig. 1,2,4, there is epitaxy part 16 on the module casing 1, the epitaxy part 16 is used to carry
The circuit board 2 stretched out from the threading mouthful 11.Circuit board 2 positioned at the outside of module casing 1 can be adhesively fixed on the extension
In portion 16, in order to which the sound-producing device module and electronic product complete machine are electrically connected.The epitaxy part 16 can be plugged on
On the circuit of electronic product complete machine, to realize the electrical connection of circuit board and product complete machine.In the present embodiment, can without from
The outside of the module casing is closed to the gap between circuit board and threading mouthful, and fluid sealant is from the inner side of module casing
Realize sealing.Or, for improve sealing reliability consideration, can also on the outside of the module casing and circuit board with
Fluid sealant is set again between epitaxy part, and the utility model is not limited this.
Although some specific embodiments of the present utility model are described in detail by example, this area
It is to be understood by the skilled artisans that example above is merely to illustrate, rather than in order to limit scope of the present utility model.This
Field it is to be understood by the skilled artisans that can be in the case where not departing from scope and spirit of the present utility model, to above example
Modify.Scope of the present utility model is defined by the following claims.
Claims (9)
1. a kind of sound-producing device module, it is characterised in that including module casing (1) and be arranged in the module casing (1)
Circuit board (2), the module casing (1) has threading mouthful (11), and the circuit board (2) reaches institute from the threading mouthful (11)
State on the outside of module casing (1), the module casing (1) has the first hole for injecting glue at the position close to the threading mouthful (11)
(12) and the second hole for injecting glue (13), first hole for injecting glue (12) and the second hole for injecting glue (13) are respectively from the module casing (1)
Outside penetrate into the both side surfaces of the circuit board (2), first hole for injecting glue (12) is with the second hole for injecting glue (13) in circuit
Plate (2) place is connected, and fluid sealant is filled with first hole for injecting glue (12) and the second hole for injecting glue (13), and the fluid sealant is configured to
Close the gap between the circuit board (2) and threading mouthful (11) and close first hole for injecting glue (12) and the second hole for injecting glue
(13)。
2. sound-producing device module according to claim 1, it is characterised in that the threading mouthful (11) is opened in the module
On the side wall of housing (1), height of the threading mouthful (11) on the wall of side is fixed on module casing (1) with the circuit board (2)
Interior height is flush.
3. sound-producing device module according to claim 2, it is characterised in that first hole for injecting glue (12) is configured to from institute
The top surface for stating module casing (1) extends downward into the circuit board (2), and second hole for injecting glue (13) is configured to from the module
The bottom surface of housing (1) extends upwardly to the circuit board (2).
4. sound-producing device module according to claim 3, it is characterised in that first hole for injecting glue (12) and/or second
Hole for injecting glue (13) is neighbour to be arranged at by the side wall with the threading mouthful (11).
5. sound-producing device module according to claim 3, it is characterised in that first hole for injecting glue (12) is just to described
Two hole for injecting glue (13), the first hole for injecting glue (12) is identical with the pore structure of the second hole for injecting glue (13).
6. sound-producing device module according to claim 1, it is characterised in that first hole for injecting glue (12) and the second injecting glue
Hole (13) is in cube cylindrical hole.
7. sound-producing device module according to claim 6, it is characterised in that first hole for injecting glue (12) and the second injecting glue
Length of the cross section in hole (13) on the width of circuit board (2) is more than the width of the circuit board (2) of corresponding position.
8. sound-producing device module according to claim 1, it is characterised in that the module casing (1) includes upper shell
(14) and lower house (15), there is threading breach, the upper shell (14) respectively on the upper shell (14) and lower house (15)
It is configured to fasten with lower house (15), two threading breach combinations constitute the threading mouthful (11).
9. sound-producing device module according to claim 1, it is characterised in that the module casing (1) has epitaxy part
(16), the epitaxy part (16) is configured for the circuit board (2) that carrying is stretched out from the threading mouthful (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720195902.4U CN206596154U (en) | 2017-03-01 | 2017-03-01 | Sound-producing device module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720195902.4U CN206596154U (en) | 2017-03-01 | 2017-03-01 | Sound-producing device module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206596154U true CN206596154U (en) | 2017-10-27 |
Family
ID=60126239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720195902.4U Withdrawn - After Issue CN206596154U (en) | 2017-03-01 | 2017-03-01 | Sound-producing device module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206596154U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018157528A1 (en) * | 2017-03-01 | 2018-09-07 | 歌尔股份有限公司 | Sounder module |
| WO2024148479A1 (en) * | 2023-01-09 | 2024-07-18 | 宜宾市天珑通讯有限公司 | Terminal sound production apparatus and terminal device |
-
2017
- 2017-03-01 CN CN201720195902.4U patent/CN206596154U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018157528A1 (en) * | 2017-03-01 | 2018-09-07 | 歌尔股份有限公司 | Sounder module |
| WO2024148479A1 (en) * | 2023-01-09 | 2024-07-18 | 宜宾市天珑通讯有限公司 | Terminal sound production apparatus and terminal device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20171027 Effective date of abandoning: 20231222 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20171027 Effective date of abandoning: 20231222 |