CN106911976A - Sound-producing device module - Google Patents
Sound-producing device module Download PDFInfo
- Publication number
- CN106911976A CN106911976A CN201710121972.XA CN201710121972A CN106911976A CN 106911976 A CN106911976 A CN 106911976A CN 201710121972 A CN201710121972 A CN 201710121972A CN 106911976 A CN106911976 A CN 106911976A
- Authority
- CN
- China
- Prior art keywords
- hole
- injecting glue
- circuit board
- sound
- producing device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003292 glue Substances 0.000 claims abstract description 107
- 239000000565 sealant Substances 0.000 claims abstract description 15
- 239000012530 fluid Substances 0.000 claims abstract description 14
- 238000000407 epitaxy Methods 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 17
- 239000007767 bonding agent Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000005236 sound signal Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
- Slot Machines And Peripheral Devices (AREA)
Abstract
The invention discloses a kind of sound-producing device module.The sound-producing device module includes module casing and the circuit board being arranged in the module casing, the module casing has threading mouthful, the circuit board reaches the module casing outside from threading mouth, the module casing has the first hole for injecting glue and the second hole for injecting glue at the position of the threading mouthful, first hole for injecting glue and the second hole for injecting glue penetrate into the both side surface of the circuit board from the outside of the module casing respectively, first hole for injecting glue is connected with the second hole for injecting glue at circuit board, fluid sealant is filled with first hole for injecting glue and the second hole for injecting glue, the fluid sealant is configured to the gap closed between the circuit board and threading mouthful and closes first hole for injecting glue and the second hole for injecting glue.The technical problem that the present invention is solved is the sealing state for how improving circuit board and threading mouthful.
Description
Technical field
The invention belongs to sound-producing device module, in particular it relates to a kind of sound-producing device module.
Background technology
In recent years, electronic product quickly grows, and panel computer, smart mobile phone turned into the required of people's daily life
Product.The update speed of electronic product is fast, and the performance of product is gradually lifted.Sound-producing device is a kind of important in electronic product
Part, for the conversion between voice signal and sound.Those skilled in the art are also carried out constantly to the performance of sound-producing device
Improve, to adapt to the development of electronic product.
In the prior art, sound-producing device is assemblied in the whole machine of electronic product, generally by circuit board and the device on periphery
It is electrically connected, circuit board needs to reach outside from the enclosure interior of sound-producing device.The position stretched out in circuit board is, it is necessary to apply
Cover bonding agent to be sealed, prevent sound-producing device gas leakage.But, this structure existing defects.On the one hand, bonding agent has trickling
Property, bonding agent is possible to trickling to the neighboring area of circuit board, causes sound-producing device outward appearance change, and influence sound-producing device is follow-up
Assembling；On the other hand, the surrounding of the position that circuit board stretches out from sound-producing device housing is required for bonding agent to seal, but due to electricity
Road plate itself and shell structure are blocked, and the bottom and side whether bonding agent seals up circuit board cannot accurately be supervised
Control.In addition, the processing step of coating bonding agent is more complicated, the assembling speed of product is have impact on.
Thus, it is necessary to the structure that the relevant circuit board of sound-producing device is stretched out and sealed is improved, improves circuit board and stretch
The sealing condition of out position, improves sealing reliability, simplifies the processing step of adhering and sealing.
The content of the invention
It is an object of the present invention to provide a kind of new solution of improved sound-producing device module.
According to the first aspect of the invention, there is provided a kind of sound-producing device module, including module casing and it is arranged on institute
The circuit board in module casing is stated, the module casing has threading mouthful, and the circuit board reaches the mould from the threading mouthful
Group hull outside, the module casing has the first hole for injecting glue and the second hole for injecting glue, institute at the position of the threading mouthful
State the both side surface that the first hole for injecting glue and the second hole for injecting glue penetrate into the circuit board from the outside of the module casing respectively, institute
State the first hole for injecting glue to be connected at circuit board with the second hole for injecting glue, filled with sealing in first hole for injecting glue and the second hole for injecting glue
Glue, the fluid sealant is configured to the gap closed between the circuit board and threading mouthful and closes first hole for injecting glue and second
Hole for injecting glue.
Alternatively, the threading mouthful is opened on the side wall of the module casing, height of the threading mouthful on the wall of side
The height being fixed on the circuit board in module casing is flush.
Alternatively, first hole for injecting glue is configured to extend downward the circuit board from the top surface of the module casing,
Second hole for injecting glue is configured to extend upwardly to the circuit board from the bottom surface of the module casing.
Alternatively, it is arranged at by the side wall with the threading mouthful near first hole for injecting glue and/or the second hole for injecting glue.
Alternatively, first hole for injecting glue just to second hole for injecting glue, with the hole of the second hole for injecting glue tie by the first hole for injecting glue
Structure is identical.
Alternatively, first hole for injecting glue and the second hole for injecting glue are in cube cylindrical hole.
Alternatively, length of the cross section of first hole for injecting glue and the second hole for injecting glue on the width of circuit board is big
In the width of the circuit board of corresponding position.
Alternatively, the module casing includes upper shell and lower house, has respectively on the upper shell and lower house and wears
Plate breach, the upper shell is configured to be fastened with lower house, and two threading breach combinations constitute the threading mouthful.
Alternatively, the module casing has epitaxy part, and the epitaxy part is configured for carrying to be stretched from the threading mouthful
The circuit board for going out.
One of the invention has the technical effect that, by first hole for injecting glue and the second hole for injecting glue to threading mouthful and circuit board
Between gap sealed, improve sealing condition.Improve sealing reliability.
By referring to the drawings to the detailed description of exemplary embodiment of the invention, further feature of the invention and its
Advantage will be made apparent from.
Brief description of the drawings
The accompanying drawing for being combined in the description and constituting a part for specification shows embodiments of the invention, and even
It is used to explain principle of the invention together with its explanation.
Fig. 1 is the side sectional view of the sound-producing device module that the present invention is provided；
Fig. 2 is the partial enlarged drawing of Fig. 1；
Fig. 3 is the dimensional structure diagram of the sound-producing device module that the present invention is provided；
Fig. 4 is the part explosive view of the sound-producing device module that the present invention is provided.
Specific embodiment
Describe various exemplary embodiments of the invention in detail now with reference to accompanying drawing.It should be noted that：Unless had in addition
Body illustrates that the part and the positioned opposite of step, numerical expression and numerical value for otherwise illustrating in these embodiments do not limit this
The scope of invention.
The description only actually at least one exemplary embodiment is illustrative below, never as to the present invention
And its any limitation applied or use.
May be not discussed in detail for technology, method and apparatus known to person of ordinary skill in the relevant, but suitable
In the case of, the technology, method and apparatus should be considered as a part for specification.
In all examples shown here and discussion, any occurrence should be construed as merely exemplary, without
It is as limitation.Therefore, other examples of exemplary embodiment can have different values.
It should be noted that：Similar label and letter represents similar terms in following accompanying drawing, therefore, once a certain Xiang Yi
It is defined in individual accompanying drawing, then it need not be further discussed in subsequent accompanying drawing.
The invention provides a kind of improved sound-producing device module, as shown in Figure 1, 2, the sound-producing device module includes module
Housing 1 and circuit board 2.The circuit board 2 is arranged in the module casing 1, and threading mouthful is provided with the module casing 1
11, the threading mouthful 11 connects the inside and outside of module casing 1.The subregion of the circuit board 2 is from the threading mouthfuls 11
Place extends to the outside of the module casing 1.On module casing 1 at the position of the threading mouthful 11, module casing 1 has
There are the first hole for injecting glue 12 and the second hole for injecting glue 13.Two hole for injecting glue penetrate into institute always from the outside of the module casing 1
State on two surfaces of circuit board 2, the first hole for injecting glue 12 is corresponding with a side surface of circuit board 2, the second hole for injecting glue 13 then with electricity
Another side surface correspondence of road plate 2.Further, the hole for injecting glue 13 of first hole for injecting glue 12 and second is in the position of circuit board 2
Place is interconnected.Two hole for injecting glue are located proximate to the threading mouthful 11, so the gap between circuit board 2 and threading mouthful 11 is
Connected with two hole for injecting glue.
Fluid sealant is filled with first hole for injecting glue and the second hole for injecting glue, because two structure designs of hole for injecting glue are special
Point, the fluid sealant can be flow at threading mouthful, on circuit boards, descended at the gap of two surfaces and threading mouthful and circuit board
Arris and threading mouthful gap at all form adhering and sealing.This first hole for injecting glue of the invention, the design of the second hole for injecting glue
On the one hand the sealing reliability between threading mouthful and circuit board can be effectively improved, makes all directions between circuit board and threading mouthful
The sealing of all glued dose of upper issuable gap.
Further, sealed by first, second hole for injecting glue, can be to the upper and lower surface of circuit board and edge
Sealing situation be monitored, if there is situation about not being fully sealed, it is also possible to repaired in hole.It is filled in hole for injecting glue
In fluid sealant the first hole for injecting glue and the second hole for injecting glue can also be closed, prevent gas leakage.
On the other hand, the fluid sealant being filled in hole for injecting glue is difficult to flow to other regions of circuit board, reduces sealing
Glue changes circuit board, the possibility of the outward appearance of sound-producing device module, and the assembly reliability to product provides guarantee.Seal operation
The step of and technique it is easier relative to prior art, only need to be to filling with sealant in hole for injecting glue.
As shown in Fig. 1,4, sound-producing device monomer 3, the sound-producing device list can also be included in the sound-producing device module
Body 3 is fixedly installed in the module casing 1, and sound is produced for receiving voice signal.The sound-producing device monomer 3 can be with
The circuit board 2 forms electrical connection, by transmission of sound signals to sound-producing device monomer 3.
The present invention specifically provides a kind of specific embodiment of module casing 1, as shown in Fig. 2 the threading mouthful 11 can
To be opened on the side wall of the module casing 1, it is in flat structure that the module casing 1 is overall, and the circuit board 2 is laid on module
In housing 1.11 height on the side wall of module casing 1 of the threading mouthful is fixed in module casing 1 with the circuit board 2
Highly it is substantially flush, is easy to circuit board 2 to be extended to outside module casing 1 from threading mouthful 11.
The first hole for injecting glue 12, the preferred distribution mode of the second hole for injecting glue 13, institute are also shown in implementation method shown in Fig. 2
State the first hole for injecting glue 12 to be extended downwardly into inside module casing 1 from the top surface of module casing 1, be communicated to the upper of the circuit board 2
Surface.Second hole for injecting glue 13 is extended up to inside module casing 1 from the bottom surface of the module casing 1, is communicated to described
The lower surface of circuit board 2.The hole for injecting glue 13 of first hole for injecting glue 12 and second can bypass the edge of the circuit board 2, be formed
Connection effect between two ducts.In this embodiment, two structures of hole for injecting glue are all straight holes, are easy to fluid sealant to inject
To the surface of circuit board.
Preferably, in the above-described embodiment, the hole for injecting glue 13 of first hole for injecting glue 12 and second can be near threading mouthful
The side wall of the module casing 1 where 11.As shown in Figure 1, 2, by the side wall where threading mouthful 11 is arranged near two hole for injecting glue.
Flow on the gap that the fluid sealant of hole for injecting glue can be directly filled between circuit board 2 and threading mouthful 11, form sealing effectiveness.This
Thickness of the invention not to the side wall of module casing is limited, and also degree not close with threading mouthful to hole for injecting glue is limited
System, if ensure bonding agent can by hole for injecting glue from the shell wall of module casing inner side by the gap between threading mouthful and circuit board
Sealing.
The present invention when actually implementing can according to the practical structures of sound-producing device module set first hole for injecting glue and
The structure of the second hole for injecting glue and position.Preferably, first hole for injecting glue can just to second hole for injecting glue, two hole for injecting glue
Inner hole structure can be with identical.Facilitate the processing of hole for injecting glue, it is also possible to further simplify injecting glue sealing technology.
Alternatively, as shown in figure 3, the hole for injecting glue 13 of first hole for injecting glue 12 and second can be in cube cylindrical hole, cube
The cross section of the hole for injecting glue of cylindricality is rectangle, and cube cylindrical hole is adapted to be engaged with the circuit board 2 with two parallel arris.
It is further preferred that for the ease of making the first hole for injecting glue 12 be connected with the second hole for injecting glue 13, enabling fluid sealant to be filled into circuit
At gap between the arris and threading of plate mouthfuls 11, the length of the cross section of hole for injecting glue on the width of circuit board is preferably big
In the width of the circuit board of corresponding position.First hole for injecting glue and the second hole for injecting glue can also be in cylinder, diamond holes, this
Invention is limited not to this.The internal structure of hole for injecting glue can also according to injection process when the shape of dispensing needle head that is used
It is designed.
Alternatively, as shown in figure 4, the module casing 1 can include upper shell 14 and lower house 15, the upper shell 14
Fastened with lower house 15 and constitute the complete structure of module casing 1, the circuit board 2 and sound-producing device monomer 3 are arranged on upper shell
14 and lower house 15 inside.Especially, there is threading breach respectively on the upper shell 14 and lower house 15, when the upper shell
14 with lower house 15 when fastening, and two threading breach combinations constitute the threadings mouthful 11.
Alternatively, as shown in Fig. 1,2,4, there is epitaxy part 16 on the module casing 1, the epitaxy part 16 is used to carry
From the circuit board 2 that the threading mouthful 11 stretches out.Circuit board 2 positioned at the outside of module casing 1 can be adhesively fixed on the extension
In portion 16, it is electrically connected with the whole machine of electronic product in order to the sound-producing device module.The epitaxy part 16 can be plugged on
On the circuit of the whole machine of electronic product, to realize the electrical connection of circuit board and the whole machine of product.In the present embodiment, can without from
The outside of the module casing is closed to the gap between circuit board and threading mouthful, and fluid sealant is from the inner side of module casing
Realize sealing.Or, for improve sealing reliability consideration, it is also possible on the outside of the module casing and circuit board with
Fluid sealant is set again between epitaxy part, and the present invention is limited not to this.
Although being described in detail to some specific embodiments of the invention by example, the skill of this area
Art personnel it should be understood that example above is merely to illustrate, rather than in order to limit the scope of the present invention.The skill of this area
Art personnel to above example it should be understood that can modify without departing from the scope and spirit of the present invention.This hair
Bright scope is defined by the following claims.
Claims (9)
1. a kind of sound-producing device module, it is characterised in that including module casing (1) and be arranged in the module casing (1)
Circuit board (2), the module casing (1) reaches institute with threading mouthful (11), the circuit board (2) from the threading mouthful (11)
Module casing (1) outside is stated, the module casing (1) has the first hole for injecting glue at the position of the threading mouthful (11)
(12) and the second hole for injecting glue (13), first hole for injecting glue (12) and the second hole for injecting glue (13) are respectively from the module casing (1)
Outside penetrate into the both side surface of the circuit board (2), first hole for injecting glue (12) is with the second hole for injecting glue (13) in circuit
Plate (2) place is connected, and fluid sealant is filled with first hole for injecting glue (12) and the second hole for injecting glue (13), and the fluid sealant is configured to
Close the gap between the circuit board (2) and threading mouthful (11) and close first hole for injecting glue (12) and the second hole for injecting glue
(13)。
2. sound-producing device module according to claim 1, it is characterised in that the threading mouthful (11) is opened in the module
On the side wall of housing (1), height of the threading mouthful (11) on the wall of side is fixed on module casing (1) with the circuit board (2)
Interior height is flush.
3. sound-producing device module according to claim 2, it is characterised in that first hole for injecting glue (12) is configured to from institute
The top surface for stating module casing (1) extends downward the circuit board (2), and second hole for injecting glue (13) is configured to from the module
The bottom surface of housing (1) extends upwardly to the circuit board (2).
4. sound-producing device module according to claim 3, it is characterised in that first hole for injecting glue (12) and/or second
Hole for injecting glue (13) is neighbour to be arranged at by the side wall with the threading mouthful (11).
5. sound-producing device module according to claim 3, it is characterised in that first hole for injecting glue (12) is just to described
Two hole for injecting glue (13), the first hole for injecting glue (12) is identical with the pore structure of the second hole for injecting glue (13).
6. sound-producing device module according to claim 1, it is characterised in that first hole for injecting glue (12) and the second injecting glue
Hole (13) is in a cube cylindrical hole.
7. sound-producing device module according to claim 6, it is characterised in that first hole for injecting glue (12) and the second injecting glue
Width of length of the cross section in hole (13) on the width of circuit board (2) more than the circuit board (2) of corresponding position.
8. sound-producing device module according to claim 1, it is characterised in that the module casing (1) is including upper shell
(14) and lower house (15), there is threading breach, the upper shell (14) respectively on the upper shell (14) and lower house (15)
It is configured to be fastened with lower house (15), two threading breach combinations constitute the threading mouthful (11).
9. sound-producing device module according to claim 1, it is characterised in that the module casing (1) is with epitaxy part
(16), the epitaxy part (16) is configured for carrying the circuit board (2) stretched out from the threading mouthful (11).
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121972.XA CN106911976B (en) | 2017-03-01 | 2017-03-01 | Sound production device module |
| PCT/CN2017/090637 WO2018157528A1 (en) | 2017-03-01 | 2017-06-28 | Sounder module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710121972.XA CN106911976B (en) | 2017-03-01 | 2017-03-01 | Sound production device module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106911976A true CN106911976A (en) | 2017-06-30 |
| CN106911976B CN106911976B (en) | 2023-12-22 |
Family
ID=59186127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710121972.XA Active CN106911976B (en) | 2017-03-01 | 2017-03-01 | Sound production device module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106911976B (en) |
| WO (1) | WO2018157528A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108650819A (en) * | 2018-04-26 | 2018-10-12 | 歌尔股份有限公司 | Sound-producing device module |
| CN110572743A (en) * | 2019-06-28 | 2019-12-13 | 瑞声光电科技(常州)有限公司 | Loudspeaker box |
| WO2020258215A1 (en) * | 2019-06-28 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Sound producing device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW456748U (en) * | 1999-08-20 | 2001-09-21 | Shen Ya Guang | Airtight waterproof structure of outdoor lamp control box |
| CN201114656Y (en) * | 2007-10-09 | 2008-09-10 | 鹤山丽得电子实业有限公司 | Waterproof structure for music box |
| CN203618121U (en) * | 2013-12-11 | 2014-05-28 | 歌尔声学股份有限公司 | Loudspeaker module |
| CN204967635U (en) * | 2015-10-13 | 2016-01-13 | 北京微科能创科技有限公司 | Power supply module |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008271426A (en) * | 2007-04-24 | 2008-11-06 | Matsushita Electric Works Ltd | Acoustic sensor |
| CN201290163Y (en) * | 2008-09-19 | 2009-08-12 | 瑞声声学科技(常州)有限公司 | Integration system of minitype sound generator |
| CN204518070U (en) * | 2015-04-17 | 2015-07-29 | 歌尔声学股份有限公司 | Speaker vibration system |
| CN206596154U (en) * | 2017-03-01 | 2017-10-27 | 歌尔股份有限公司 | Sound-producing device module |
-
2017
- 2017-03-01 CN CN201710121972.XA patent/CN106911976B/en active Active
- 2017-06-28 WO PCT/CN2017/090637 patent/WO2018157528A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW456748U (en) * | 1999-08-20 | 2001-09-21 | Shen Ya Guang | Airtight waterproof structure of outdoor lamp control box |
| CN201114656Y (en) * | 2007-10-09 | 2008-09-10 | 鹤山丽得电子实业有限公司 | Waterproof structure for music box |
| CN203618121U (en) * | 2013-12-11 | 2014-05-28 | 歌尔声学股份有限公司 | Loudspeaker module |
| CN204967635U (en) * | 2015-10-13 | 2016-01-13 | 北京微科能创科技有限公司 | Power supply module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108650819A (en) * | 2018-04-26 | 2018-10-12 | 歌尔股份有限公司 | Sound-producing device module |
| CN110572743A (en) * | 2019-06-28 | 2019-12-13 | 瑞声光电科技(常州)有限公司 | Loudspeaker box |
| CN110572743B (en) * | 2019-06-28 | 2020-10-27 | 瑞声光电科技(常州)有限公司 | Loudspeaker box |
| WO2020258215A1 (en) * | 2019-06-28 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Sound producing device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018157528A1 (en) | 2018-09-07 |
| CN106911976B (en) | 2023-12-22 |
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