CN202587659U - Molding interconnection circuit component antenna machine case with flat appearance - Google Patents
Molding interconnection circuit component antenna machine case with flat appearance Download PDFInfo
- Publication number
- CN202587659U CN202587659U CN 201220227755 CN201220227755U CN202587659U CN 202587659 U CN202587659 U CN 202587659U CN 201220227755 CN201220227755 CN 201220227755 CN 201220227755 U CN201220227755 U CN 201220227755U CN 202587659 U CN202587659 U CN 202587659U
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Abstract
The utility model provides a molding interconnection circuit component antenna machine case with a flat appearance. The molding interconnection circuit component antenna machine case with the flat appearance comprises a substrate, at least an electric-conduction metal layer and a glue-filling layer. The substrate is made of thermoplasticity plastic material. The substrate at least comprises a hole or a punching hole used for penetration of wires. The electric-conduction metal layers cover above the substrate, in an inner wall of the hole or the punching hole, and around the hole or the punching hole below the substrate, the electric-conduction metal layer arranged above the substrate is an antenna for signal radiation, the electric-conduction metal layers arranged in the inner wall of the hole or the punching hole and below the substrate are used as electric conduction lines to send signals of the antenna or be grounded. The glue-filling layer is arranged in the hole or the punching hole and fills the hole or the punching hole. The molding interconnection circuit component antenna machine case with the flat appearance is used to fill glue in through holes in the electric conduction lines so that an outer surface of the machine case is flat, and attractiveness and a sealing property of the machine case are improved.
Description
Technical field
The utility model is relevant for the field of the antenna of electronic product enclosure, especially a kind of mold interconnecting circuit element (MID) antenna casing with smooth outward appearance.
Background technology
Mold interconnecting circuit element (Molded Interconnect Device; MID) manufacturing approach of antenna; Mainly contain dijection mold (Two-shot Molding) and laser direct forming (Laser Direct Structuring, LDS) method, in addition; The mode that utilization spraying, sputter or printing also arranged, these manufacturing approaches have all applied to the antenna of electronic apparatus and have made.
Be to promote the antenna performance of electronic apparatus, or reduce the integral thickness of electronic apparatus, often use the method for plastic rubber ejaculate molding, and combine the MID technology, the antenna of electronic apparatus is made on the casing surface.In order to make the surperficial antenna of casing and the circuit communication of casing inner face; Adopt dijection mold or laser direct forming legal system to make antenna no matter be; Usually all can on the casing surface, arrange to be communicated with the through hole on casing two sides; And the chemical surface generation metal level that is plated on through-hole wall of utilization, to reach the circuit communication on casing two sides.Therefore just there is hole in appearance in casing, and not only influence is sighted, and also influences the seal of casing.
The utility model content
For solving the problem of above-mentioned explanation, the method for the utility model utilization filler is filled up the conductive through hole of antenna on the casing, makes casing can present beautiful appearance.
A kind of mold interconnecting circuit element antenna casing of the utility model with smooth outward appearance, it comprises: a substrate, this substrate are thermoplastic plastic's material, comprise a hole or a perforation on this substrate at least, are used to pass through lead and use; At least one conductive metal layer; This conductive metal layer is contained this substrate top, this hole or perforation inwall, this substrate below hole or perforation vicinity; The conductive metal layer that wherein is positioned at this substrate top is the antenna of signal radiation; The conductive metal layer that is positioned at this hole or perforation inwall and this substrate below is as the conducting wire, and the signal that is used for antenna transmits or ground connection; A filler layer, this filler layer are positioned at this hole or perforation, and fill up this hole or perforation.
Preferably, the conductive metal layer of outer surface of substrate is with laser direct forming method made.
Preferably, the conductive metal layer of outer surface of substrate is with dijection injection molding made.
Preferably, conductive metal layer is to adopt spraying, sputter, vapor deposition, printing, chemical plating or electric plating method made.
Preferably, the material of this filler layer is UV glue, AB glue or thermosetting sizing material.
Preferably, described mold interconnecting circuit element antenna casing with smooth outward appearance still comprises: a coat of paint is arranged on this base material and this conductive metal layer top, and covers this base material and this conductive metal layer and make this base material form smooth surface.
Preferably, this casing is the casing of mobile phone, panel computer, notebook computer, hand-held mobile digital device.
The utility model is the through hole filler in the conducting wire, so that form smooth outward appearance at casing outer surface, promotes attractive in appearance and improves the casing seal.
Description of drawings
Figure 1A shows substrate and the laser activation district of the utility model first embodiment.
Figure 1B shows this conductive metal layer that plates of the utility model first embodiment.
Fig. 1 C shows the complete structure sketch map of the utility model first embodiment.
The first time that Fig. 2 A shows the utility model second embodiment sketch map behind the ejection formation.
The second time that Fig. 2 B shows the utility model second embodiment sketch map behind the ejection formation.
Fig. 2 C shows this conductive metal layer sketch map that plates of the utility model second embodiment.
Fig. 2 D shows the filler sketch map that lead is bored a hole of the utility model second embodiment.
Fig. 2 E shows the complete structure sketch map of the utility model second embodiment.
Wherein:
10 substrates, 11 holes
13 perforation of 12 depressed areas
20 conductive metal layers, 40 filler layers
50 coats of paint 60 can plate plastic layer
90 laser activation districts.
Embodiment
Now form with regard to the structure of the utility model, and the effect and the advantage that can produce, conjunction with figs., a preferred embodiment of lifting the utility model specifies as follows.Must understand the example that description is only applicable to the utility model, not be used to limit the scope of the utility model.
For fear of above-mentioned shortcoming; The utility model proposes a kind of mold interconnecting circuit element (MID) antenna casing with smooth outward appearance; Mold interconnecting circuit element (Molded Interconnect Device wherein; MID) manufacturing technology of antenna mainly comprises dijection mold (Two-shot Molding) and laser direct forming (Laser Direct Structuring, LDS) method.So the execution mode of the utility model is explanation with the antenna casing that these two methods are made mainly.
Be used in the laser direct forming (Laser Direct Structuring, the LDS) execution mode of the formed casing of method please refer to Figure 1A, Figure 1B, Fig. 1 C, explain as follows:
One substrate 10, but this substrate 10 is thermoplastic and is the plastic material of plating after the laser radiation activation.At least comprise the upper and lower surfaces that a hole 11 connects substrate 10 on this substrate; This hole is one to have the hole of tapering, is used to make the conducting wire, becomes the zone of antenna and conducting wire to carry out laser activation to preboarding then; Form a laser activation district 90, shown in Figure 1A;
At least one conductive metal layer 20; This conductive metal layer is contained this laser activation district 90; Wherein be positioned at the antenna of the conductive metal layer 20 of these substrate 10 tops as signal radiation, its conductive metal layer 20 that is positioned at these hole 11 inwalls and this substrate 10 belows is used for the signal transmission of antenna or the usefulness of ground connection as the conducting wire; Its mode is for to plate this conductive metal layer 20 by chemical plating method, shown in Figure 1B in laser activation district 90;
One filler layer 40, this filler layer 40 is positioned at this hole 11, with in this hole of sizing material filling 11 and fill up this hole 11, shown in Fig. 1 C.Wherein the filler layer material is UV glue, AB glue, or the thermosetting sizing material;
One coat of paint 50 above this base material 10 and this conductive metal layer 20, and covers this base material 10 and this antenna and makes the outward appearance of this base material 10 form smooth and surface that have required color and luster and texture.
The method of aforementioned formation conductive metal layer 20 except except that adopting chemical plating, still can adopt chemical plating to adopt two stage manner of electroplating afterwards more earlier.
The antenna of the utility model second embodiment and conducting wire manufacturing approach are the dijection injection molding; Promptly through twice plastic jetting forming and chemical plating; Shown in Fig. 2 A, Fig. 2 B, Fig. 2 C, Fig. 2 D and Fig. 2 E; Wherein identical with first embodiment object representes that with identical label the character and the function of its element repeat no more.Explain as follows:
One substrate 10, this substrate is penetrating for the first time formation two depressed areas 12 and at least one perforation 13 on this substrate simultaneously in the operation, shown in Fig. 2 A;
After penetrating for the second time, can plate plastic layer 60 in the surperficial formation in top of the wall surface of the hole of two depressed areas 12 and this perforation 13, shown in Fig. 2 B;
The mode of applied chemistry plating plates one deck conductive metal layer 20 on this plated plastic layer 60 surfaces that this secondary penetrates then, and this conductive metal layer 20 is preferable can be an antenna.This conductive metal layer 20 is contained this can plate plastic layer 60; Wherein be positioned at the antenna of the conductive metal layer 20 of these substrate 10 tops as signal radiation; Its conductive metal layer 20 that is positioned at these bore a hole 13 inwalls and this substrate 10 belows is as the conducting wire; Be used for the signal transmission of antenna or the usefulness of ground connection, shown in Fig. 2 C;
One filler layer 40, this filler layer 40 is positioned at this perforation 13, with filling up this perforation 13 in this perforation 13 of sizing material filling, shown in Fig. 2 D; Wherein the filler layer material is UV glue, AB glue, or the thermosetting sizing material;
One coat of paint 50 for above this base material 10 and this conductive metal layer 20, and covers this substrate 10 and this conductive metal layer 20 and makes substrate form smooth and surface that have required color and luster and texture.
The utility model forms this filler layer 40 and should bore a hole and 13 seal in this perforation 13, so integral body can form a quite smooth outward appearance when painting, can not stay the vestige of depression because of this perforation, so can present beautiful appearance.
In sum, the design of consideration of the utility model hommization quite meets actual demand.Its concrete improvement has disappearance now, obviously has breakthrough progressive advantage compared to prior art, the enhancement that has effect really, and non-being easy to reached.The utility model disclosed or was exposed on domestic and the external document and market, had met patent statute.Above-listed detailed description specifies to a possible embodiments of this practical utility model; But this embodiment is not in order to limit the claim of this practical utility model; Allly do not break away from the equivalence that this practical utility model skill spirit does and implement or change, all should be contained in the claim of the utility model.
Claims (7)
1. mold interconnecting circuit element antenna casing with smooth outward appearance is characterized in that it comprises:
A substrate, this substrate are thermoplastic plastic's material, comprise a hole or a perforation on this substrate at least, are used to pass through lead and use;
At least one conductive metal layer; This conductive metal layer is contained this substrate top, this hole or perforation inwall, this substrate below hole or perforation vicinity; The conductive metal layer that wherein is positioned at this substrate top is the antenna of signal radiation; The conductive metal layer that is positioned at this hole or perforation inwall and this substrate below is as the conducting wire, and the signal that is used for antenna transmits or ground connection;
A filler layer, this filler layer are positioned at this hole or perforation, and fill up this hole or perforation.
2. the mold interconnecting circuit element antenna casing with smooth outward appearance as claimed in claim 1 is characterized in that the conductive metal layer of outer surface of substrate is with laser direct forming method made.
3. the mold interconnecting circuit element antenna casing with smooth outward appearance as claimed in claim 1 is characterized in that the conductive metal layer of outer surface of substrate is with dijection injection molding made.
4. the mold interconnecting circuit element antenna casing with smooth outward appearance as claimed in claim 1 is characterized in that, conductive metal layer is to adopt spraying, sputter, vapor deposition, printing, chemical plating or electric plating method made.
5. the mold interconnecting circuit element antenna casing with smooth outward appearance as claimed in claim 1 is characterized in that the material of this filler layer is UV glue, AB glue or thermosetting sizing material.
6. the mold interconnecting circuit element antenna casing with smooth outward appearance as claimed in claim 1 is characterized in that, still comprises:
A coat of paint is arranged on this base material and this conductive metal layer top, and covers this base material and this conductive metal layer and make this base material form smooth surface.
7. the mold interconnecting circuit element antenna casing with smooth outward appearance as claimed in claim 1 is characterized in that, this casing is the casing of mobile phone, panel computer, notebook computer, hand-held mobile digital device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220227755 CN202587659U (en) | 2012-05-21 | 2012-05-21 | Molding interconnection circuit component antenna machine case with flat appearance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220227755 CN202587659U (en) | 2012-05-21 | 2012-05-21 | Molding interconnection circuit component antenna machine case with flat appearance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202587659U true CN202587659U (en) | 2012-12-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220227755 Expired - Fee Related CN202587659U (en) | 2012-05-21 | 2012-05-21 | Molding interconnection circuit component antenna machine case with flat appearance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202587659U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104241810A (en) * | 2013-06-17 | 2014-12-24 | 深圳富泰宏精密工业有限公司 | Shell, manufacturing method of shell and electronic device with shell |
| WO2015035890A1 (en) * | 2013-09-13 | 2015-03-19 | Byd Company Limited | Method for manufacturing antenna, antenna and mobile terminal |
| CN104780725A (en) * | 2014-01-14 | 2015-07-15 | 宏达国际电子股份有限公司 | Shell, hand-held apparatus and manufacturing method for shell |
| US9774072B2 (en) | 2009-10-09 | 2017-09-26 | Htc Corporation | Housing, handheld device, and manufacturing method of housing |
| WO2022022039A1 (en) * | 2020-07-30 | 2022-02-03 | Oppo广东移动通信有限公司 | Housing assembly and preparation method therefor, antenna assembly, and electronic device |
-
2012
- 2012-05-21 CN CN 201220227755 patent/CN202587659U/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9774072B2 (en) | 2009-10-09 | 2017-09-26 | Htc Corporation | Housing, handheld device, and manufacturing method of housing |
| CN104241810A (en) * | 2013-06-17 | 2014-12-24 | 深圳富泰宏精密工业有限公司 | Shell, manufacturing method of shell and electronic device with shell |
| CN104241810B (en) * | 2013-06-17 | 2018-09-25 | 深圳富泰宏精密工业有限公司 | Shell, the electronic device of the production method and application of the shell shell |
| WO2015035890A1 (en) * | 2013-09-13 | 2015-03-19 | Byd Company Limited | Method for manufacturing antenna, antenna and mobile terminal |
| CN104780725A (en) * | 2014-01-14 | 2015-07-15 | 宏达国际电子股份有限公司 | Shell, hand-held apparatus and manufacturing method for shell |
| CN104780725B (en) * | 2014-01-14 | 2018-06-01 | 宏达国际电子股份有限公司 | The manufacturing method of housing, hand-held device and housing |
| CN108601255A (en) * | 2014-01-14 | 2018-09-28 | 宏达国际电子股份有限公司 | Hand-held device |
| WO2022022039A1 (en) * | 2020-07-30 | 2022-02-03 | Oppo广东移动通信有限公司 | Housing assembly and preparation method therefor, antenna assembly, and electronic device |
| CN114069196A (en) * | 2020-07-30 | 2022-02-18 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof, antenna assembly and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Qingdao Longbow Plastic Mold Co.,Ltd. Assignor: Qingdao Changgong Electronic Co., Ltd. Contract record no.: 2013370000159 Denomination of utility model: Molding interconnection circuit component antenna machine case with flat appearance Granted publication date: 20121205 License type: Exclusive License Record date: 20130711 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121205 Termination date: 20160521 |