CN114069196A

CN114069196A - Shell assembly, preparation method thereof, antenna assembly and electronic equipment

Info

Publication number: CN114069196A
Application number: CN202010756064.XA
Authority: CN
Inventors: 廖奕翔; 李云刚
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-07-30
Filing date: 2020-07-30
Publication date: 2022-02-18
Also published as: WO2022022039A1

Abstract

The application provides a casing subassembly, be in including base plate and setting the inside conducting wire of base plate, the material of conducting wire includes metal material. The application also provides a preparation method of the shell assembly, and an antenna assembly and an electronic device comprising the shell assembly. Through will be as antenna radiation body's conducting wire setting inside the base plate, the problem that the space is not enough when the antenna module setting is inside electronic equipment has been solved, greatly increased the headroom region of antenna module, improved antenna module and electronic equipment's performance.

Description

Shell assembly, preparation method thereof, antenna assembly and electronic equipment

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to a shell assembly, a preparation method of the shell assembly, an antenna assembly and electronic equipment.

Background

The electronic equipment realizes the communication function by arranging the antenna. With the development of light and thin electronic devices, the internal space of the electronic devices is increasingly tense, the clearance area of the antenna is reduced, and the increasingly developed communication requirements are difficult to meet. Therefore, the arrangement of the antenna in the electronic device is an urgent problem to be solved.

Disclosure of Invention

In view of this, the present application provides a housing assembly, a manufacturing method thereof, an antenna assembly, and an electronic device, which solve the problem of antenna arrangement in the electronic device, increase a clearance area of an antenna, and improve performances of the antenna and the electronic device.

In a first aspect, the present application provides a housing assembly, which includes a substrate and a conductive circuit disposed inside the substrate, wherein the conductive circuit includes a metal material.

In a second aspect, the present application provides a method of making a housing assembly, comprising:

forming a substrate, wherein the material of the substrate comprises a metal compound;

and scanning the inside of the substrate by femtosecond laser to reduce the metal compound into metal to form a conductive circuit, thereby obtaining the shell component.

In a third aspect, the application provides an antenna assembly, which comprises a feed source and a shell assembly, wherein the shell assembly comprises a substrate and a conducting circuit arranged inside the substrate, the conducting circuit is made of a metal material, and the feed source is electrically connected with the conducting circuit.

In a fourth aspect, the present application provides an electronic device, including an antenna assembly, the antenna assembly includes a feed source and a housing assembly, the housing assembly includes a substrate and a conductive circuit disposed inside the substrate, the conductive circuit includes a metal material, and the feed source is electrically connected to the conductive circuit.

The application provides a casing subassembly and preparation method, antenna module and electronic equipment thereof, through will be as the conducting wire setting of antenna radiation body inside the base plate, the problem that the space is not enough when the antenna module setting is inside electronic equipment has been solved, greatly increased the headroom region of antenna module, improved antenna module and electronic equipment's performance.

Drawings

In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic structural diagram of a housing assembly according to an embodiment of the present disclosure.

Fig. 2 is a schematic structural diagram of a housing assembly according to another embodiment of the present disclosure.

Fig. 3 is a schematic flow chart of a method for manufacturing a housing assembly according to an embodiment of the present disclosure.

Fig. 4 is a microscope view of a housing assembly provided in an embodiment of the present application.

Fig. 5 is a microscope view of a housing assembly provided in another embodiment of the present application.

Fig. 6 is a microscope view of a housing assembly provided in accordance with yet another embodiment of the present application.

Fig. 7 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Description of reference numerals:

the antenna comprises a substrate-11, a conducting circuit-12, a functional layer-13, a shell component-10, a feed source-20, an antenna component-100, a circuit board-110 and electronic equipment-200.

Detailed Description

The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1, which is a schematic structural diagram of a housing assembly according to an embodiment of the present disclosure, a housing assembly 10 includes a substrate 11 and a conductive trace 12 disposed inside the substrate 11, and a material of the conductive trace 12 includes a metal material.

The antenna is a device for receiving and transmitting electromagnetic wave signals and is the most critical part of wireless communication; electromagnetic wave signal can be shielded by metal, and electrically conductive metal can produce effects such as reflection, absorption, and offset to electromagnetic wave signal, consequently when designing the antenna, should keep away from metal parts, that is to say, with the antenna setting inside electronic equipment, need leave a section clean space for the antenna, for the headroom region promptly, and then improve the radiation signal intensity of antenna, guarantee the communication effect.

By arranging the conductive circuit 12 serving as an antenna radiator inside the substrate 11, the clearance area of the antenna assembly 100 can be greatly increased on the premise of not increasing the internal space of the electronic device 200, and the communication quality is improved; the housing assembly 10 provided by the present application can be used not only as the housing assembly 10 of the electronic device 200, but also as an antenna radiator, and has a wide application prospect in the electronic device 200.

The conductive circuit 12 in the present application is disposed inside the substrate 11, so that interference of the substrate 11 to signals is reduced, and the signal transmission performance of the antenna assembly 100 is further improved; and conducting wire 12 is arranged in base plate 11, can not receive wearing and tearing and destroy, can not break away from base plate 11 even more, and the reliability is strong, and then has guaranteed the stability of signal.

With the arrival of 5G or more advanced communication technologies, the communication range to be covered by the antenna is wider and wider, and the number of required antennas is increasing. In the housing assembly 10 provided by the present application, the substrate 11 provides a wider selection space for the setting range and the setting number of the conductive traces 12, which greatly meets the development requirements of the communication technology and is beneficial to the application of the electronic device 200.

In the present application, the conductive line 12 may be used for receiving and transmitting electromagnetic wave signals, wherein the position, shape, number and size of the conductive line 12 inside the substrate 11 are not limited. Specifically, the selection and setting may be performed according to the communication requirements of the electronic device 200. In one embodiment of the present application, the conductive trace 12 is parallel to the surface of the substrate 11, or the conductive trace 12 forms an angle with the surface of the substrate 11. When the substrate 11 has a plurality of conductive traces 12 inside, a part of the conductive traces 12 may be parallel to the surface of the substrate 11, and a part of the conductive traces 12 may have an angle with the surface of the substrate 11. The conductive traces 12 are disposed in various ways, so as to improve the appearance of the housing assembly 10. In another embodiment of the present application, the conductive traces 12 may be linear, planar, or arrayed. In one embodiment, the linear shape includes a straight line shape, a folded line shape, a planar spiral shape, a three-dimensional spiral shape, a wavy shape, and the like, thereby enriching the appearance effect of the housing assembly 10. Specifically, the conductive traces 12 may be, but not limited to, a plurality of structural units arranged in an array, a circular ring, a polygonal ring, a solid surface, etc.

In the present embodiment, the sheet resistance of the conductive line 12 is 0.1 Ω/sq-1 Ω/sq, so as to ensure the conductive performance of the conductive line 12 and the stability of the antenna signal strength when used for an antenna radiator. When the length is L, the width is w, and the height is d (i.e., the film thickness), L is L, S is w, and R is ρ ═ L/(w ═ d) ═ (ρ/d) × (L/w). Let l ═ w then R ═ p/d, where p is the resistivity of the material, where R is the sheet resistance, which is given in units of Ω/sq and can also be expressed as Ω/□. In one embodiment, the volume of the conductive trace 12 is 0.03mm³-0.3mm³. Thereby being beneficial to ensuring the stability of signals when the antenna radiator is used. In one embodiment, the conductive traces 12 are circular rings with a ring width of 0.1mm and a thickness of 1 mm. In another embodiment, the conductive traces 12 are linear traces with a length of 3mm, a width of 1mm, and a thickness of 0.05 mm. Specifically, the design can be performed according to actual needs. In another embodiment, when the substrate 11 includes a plurality of conductive traces 12, the sheet resistance of each conductive trace 12 satisfies 0.1 Ω/sq-1 Ω/sq, so as to better implement the function of the antenna radiator.

In the present embodiment, the material of the substrate 11 includes a metal compound, and the conductive line 12 is formed by reducing the metal compound by a femtosecond laser. Through femto second laser scanning, can be at the inside direct forming conducting wire 12 of base plate 11, it is more simple and convenient, at the inside reliability promotion of conducting wire 12 of base plate 11.

In this application, the material of the conductive circuit 12 includes a metal material, and the metal material may be a simple metal substance or an alloy. In an embodiment of the present application, the metal material includes at least one of copper, silver, and gold. In another embodiment of the present application, the conductive line 12 is composed of a plurality of metal nanoparticles. Optionally, the metal nanoparticles have a particle size of 10nm to 150 nm. In one embodiment, the metal nanoparticles are welded to form the conductive circuit 12, and the metal nanoparticles are continuously arranged to form the conductive circuit 12. Optionally, the metal nanoparticles include at least one of copper nanoparticles, silver nanoparticles, and gold nanoparticles.

In the present application, one or more conductive traces 12 may be disposed within the substrate 11. In the present embodiment, the conductive line 12 includes at least one conductive wiring. In an embodiment, the line width of the conductive wires is smaller than 3 μm, so that transparent conductive wires can be manufactured, the visual effect of the housing assembly 10 is improved, and the technological sense of the housing assembly 10 is enhanced. For example, the conductive traces 12 have an optical transmittance greater than 50%, 75%, 80%, or 90%. In one embodiment, the conductive traces 12 are transparent grid-like conductive traces.

In the present embodiment, the dimensional accuracy of the conductive line 12 is ± 0.1 mm. The size precision of the conductive circuit 12 is excellent and is not greatly different from the preset size, so that the preparation yield of the shell assembly 10 is improved, and the application of the shell assembly is facilitated.

In the present application, the shape and size of the substrate 11 can be selected and designed according to actual needs. In one embodiment, the substrate 11 may have a 2D shape, a 2.5D shape, or a 3D shape. In another embodiment, the thickness of the substrate 11 is 0.05mm to 1mm, and may be, but not limited to, 0.05mm, 0.1mm, 0.25mm, 0.4mm, 0.5mm, 0.6mm, 0.8mm, 0.9mm, 1mm, etc., which not only ensures the mechanical property requirement of the housing assembly 10, but also does not become too thick, thereby meeting the requirement of being light and thin.

In the present embodiment, the substrate 11 is an integrally molded structure. In one embodiment of the present application, the material of the substrate 11 includes a metal compound, and the metal compound is a compound of a metal material. That is, the metal compound is a compound corresponding to the metal material. In one embodiment, the mass content of the metal compound in the substrate 11 is less than 10%. Further, the mass content of the metal compound in the substrate 11 is less than 9%, 8%, 7%, 6.5%, 4%, or 2%. In one embodiment, the metal compound includes at least one of a copper compound, a silver compound, and a gold compound. Further, the metal compound includes at least one of copper oxide, silver oxide, and gold oxide. The substrate 11 may be colorless and transparent, may be colored and transparent, or may be solid depending on the nature of each component added.

In one embodiment of the present application, the substrate 11 may be a glass substrate. It is understood that the substrate 11 may also be any other substrate that can be reduced to form conductive traces by a process. In one embodiment, the substrate 11 may be a tempered glass. The tempered glass has excellent mechanical properties, and improves the impact resistance of the housing assembly 10. In one embodiment, the substrate 11 has a surface compressive stress greater than 700MPa and a Young's modulus greater than 60 GPa. Further, the surface compressive stress of the substrate 11 is more than 800MPa, and the Young's modulus is more than 65 GPa. In another embodiment, substrate 11 is a strengthened glass and the surface of substrate 11 includes a strengthened layer. Optionally, the thickness of the strengthening layer is 10 μm to 150 μm. In the present application, the distance between the conductive line 12 and the surface of the substrate 11 is not limited, and may be selected as needed. For example, the conductive traces 12 may be infinitely close to one surface of the substrate 11, may be located in the middle of the substrate 11, and the like. In the present application, when the housing assembly 10 is applied to an electronic device, the substrate 11 has an inner surface facing the inside of the electronic apparatus 200, and an outer surface corresponding to the inner surface. In one embodiment, the conductive trace 12 may be infinitely close to the outer surface of the substrate 11, so as to avoid the interference of the substrate 11 with the signal as much as possible. In another embodiment, when the surface of the substrate 11 includes a strengthening layer, in order not to affect the strengthening layer of the substrate 11, the conductive line 12 is disposed inside the substrate 11 in a region without the strengthening layer, i.e., the distance from the conductive line 12 to the surface of the substrate 11 is greater than the thickness of the strengthening layer. Optionally, the distance from the conductive line 12 to the surface of the substrate 11 is greater than 150 μm.

Referring to fig. 2, a schematic structural diagram of a housing assembly according to another embodiment of the present disclosure is substantially the same as that of fig. 1, except that the housing assembly 10 further includes a functional layer 13, and the functional layer 13 is disposed on a surface of the substrate 11. By providing the functional layer 13, the appearance effect and usability of the housing assembly 10 are improved. In one embodiment, the functional layer 13 may include, but is not limited to, at least one of a color layer, an optical film layer, a texture layer, an anti-fingerprint layer and a hardening layer, so as to improve the visual effect of the housing assembly 10, and protect the housing assembly 10 to ensure its usability. In another embodiment, the thickness of the functional layer 13 may be 0.01mm to 0.6mm, and particularly, but not limited to, 0.01mm, 0.03mm, 0.05mm, 0.1mm, 0.25mm, 0.35mm, 0.5mm, 0.55mm, etc., which can enhance the appearance effect of the housing assembly 10 without excessively increasing the thickness of the housing assembly 10.

In the present application, the functional layer 13 may be disposed on the outer surface of the substrate 11, may also be disposed on the inner surface of the substrate 11, and may also be partially disposed on the outer surface of the substrate 11 and partially disposed on the inner surface of the substrate 11, which may be specifically selected according to actual needs. When the functional layer 13 is disposed on the inner surface of the substrate 11, in order to present the appearance effect of the functional layer 13, the substrate 11 should have certain light transmittance, for example, the optical transmittance of the substrate 11 may be, but is not limited to, greater than 75%, 80%, 85%, 90%, 92%, or the like. When the functional layer 13 is disposed on the outer surface of the substrate 11, the color and shape of the conductive circuit 12 can be shielded, so as to better hide the conductive circuit 12, and improve the ornamental value of the housing assembly 10.

This application both can regard as casing subassembly 10 to use through setting up conducting wire 12 inside base plate 11, and conducting wire 12 can regard as the antenna radiator body simultaneously, has solved the not enough problem of space when the antenna setting is inside at electronic equipment 200, greatly increased the headroom region of antenna, improve antenna and electronic equipment 200's performance.

Referring to fig. 3, a schematic flow chart of a method for manufacturing a housing assembly according to an embodiment of the present application is shown, where the method for manufacturing the housing assembly 10 according to any of the embodiments includes:

operation 101: and forming a substrate, wherein the material of the substrate comprises a metal compound.

Operation 102: and scanning the inside of the substrate by femtosecond laser to reduce the metal compound into metal to form a conductive circuit, thereby obtaining the shell component.

In operation 101, a shaped substrate comprises: and melting and molding the mixture comprising the metal compound to obtain the substrate. In one embodiment, the mixture further comprises a base stock. Further, the base raw material may be a glass raw material. Therefore, the glass substrate with the metal compound can be prepared, and after the femtosecond laser scanning, the glass substrate is changed into a glass substrate, and meanwhile, the glass substrate is internally provided with a conducting circuit. It can be understood that the base material may be other substrate materials as long as the metal compound therein can be reduced by the femtosecond laser to form the conductive circuit. In one embodiment, the glass substrate is made by melting and shaping a mixture of glass raw materials and metal compounds. In the embodiments of the present application, the glass raw material includes a substance commonly used as a glass component. In one embodiment, the glass raw materials include a silicon source, an aluminum source, a sodium source, a potassium source, a magnesium source, and a zirconium source. Optionally, the glass raw materials comprise silicon dioxide, aluminum oxide, sodium oxide, potassium oxide, magnesium oxide and zirconium dioxide, so that the aluminum-silicon material glass can be prepared. Further, the glass raw materials comprise, by mass, 55% -65% of silicon dioxide, 12% -20% of aluminum oxide, 10% -15% of sodium oxide, 0.5% -2% of potassium oxide, 3% -8% of magnesium oxide and 0.5% -5% of zirconium dioxide. Silica is the main component for forming glass, and is beneficial to the mechanical property and chemical stability of the glass; the aluminum oxide is beneficial to improving the bending strength of the glass; the sodium oxide and the potassium oxide promote the melting process and also facilitate the strengthening process; the magnesium oxide reduces the melting temperature and inhibits the generation of crystals; the zirconium dioxide is beneficial to promoting the strengthening process and improving the surface compressive stress and Young modulus of the product; therefore, by controlling the components within the above ranges, a glass substrate having excellent mechanical properties and good stability can be advantageously produced. In another embodiment, the glass raw materials include a silicon source, an aluminum source, a sodium source, a potassium source, a magnesium source, a zirconium source, and a lithium source. Optionally, the glass raw materials comprise silicon dioxide, aluminum oxide, sodium oxide, potassium oxide, magnesium oxide, zirconium dioxide and lithium oxide, and further the lithium-aluminum-silicon material glass can be prepared. Lithium oxide can lower the glass melting temperature while also facilitating the strengthening process. Further, the glass raw materials comprise, by mass, 55% -65% of silicon dioxide, 12% -20% of aluminum oxide, 10% -15% of sodium oxide, 0.5% -2% of potassium oxide, 3% -8% of magnesium oxide, 0.5% -5% of zirconium dioxide and 3% -8% of lithium oxide.

In one embodiment of the present application, melting comprises holding at 1500 ℃ to 1800 ℃ for 2h to 10h to form a uniformly mixed molten liquid. Further, the melting comprises heat preservation for 4-9 h at 1550-1700 ℃. In another embodiment of the present application, the forming includes overflow downdraw forming or float forming, which facilitates the production of glass substrates of thinner thickness. In another embodiment of the present application, the forming further comprises annealing, wherein the annealing comprises treating at 500 ℃ to 750 ℃ for 0.5h to 5 h. In yet another embodiment of the present application, the molding further includes strengthening. Optionally, the chemical strengthening is performed by means of ion exchange. Further, the strengthening comprises soaking in molten potassium salt for 4-7 h. Further, the potassium salt may be potassium nitrate, potassium chloride, or the like. In one embodiment, the surface compressive stress of the strengthened glass substrate is greater than 700MPa, the Young modulus is greater than 60GPa, the mechanical property is improved, and the application of the strengthened glass substrate is facilitated. A strengthening layer is formed on the surface of the strengthened glass substrate, and the thickness of the strengthening layer is 10-150 μm. It will be appreciated that the substrate may be integrally formed by the above process. In the present application, before the glass substrate is strengthened, the glass substrate may be subjected to cutting, hot bending, polishing, and other processes to obtain the glass substrate with the desired appearance effect.

In one embodiment of the present application, the metal compound is present in the mixture in an amount of 0.5% to 10% by mass. In the present application, the metal compound in the substrate needs to be reduced, and when the mass content of the metal compound in the mixture is not less than 0.5%, it is beneficial to form a complete and more conductive traces 12 to meet the requirements of antenna design, for example, it is beneficial to form a continuous linear or planar conductive trace 12; meanwhile, the mass content of the metal compound in the mixture is not more than 10% so as to avoid that the metal compound excessively affects the mechanical strength of the finally formed substrate. Therefore, when the mass content of the metal compound in the mixture is 0.5% to 10%, the preparation and the application of the subsequent conductive circuit 12 are facilitated, and the mechanical strength of the substrate is also facilitated, so that the application of the housing assembly 10 in the electronic device 200 is facilitated. Further, the mass content of the metal compound in the mixture is 1% -9%, 2% -8.5%, 3.5% -7% or 4% -6.5%. In one embodiment, the metal compound includes at least one of a copper compound, a silver compound, and a gold compound. Further, the metal compound includes at least one of copper oxide, silver oxide, and gold oxide. In a specific embodiment, when the mixture comprises copper oxide, silver oxide or gold oxide, the mass content of the copper oxide, the silver oxide or the gold oxide in the mixture is 0.5-10%; when at least two of copper oxide, silver oxide and gold oxide are included in the mixture, the total mass of at least two of copper oxide, silver oxide and gold oxide accounts for 0.5-10% of the mass of the mixture.

In operation 102, a femtosecond laser is used to scan the inside of the substrate to reduce the metal compound into metal to form the conductive traces 12, thereby obtaining the housing assembly 10. It can be understood that the substrate after the femtosecond laser scanning is the base plate 11, and the difference between the substrate and the base plate 11 is whether the femtosecond laser scanning is performed or not. The housing assembly 10 includes a substrate 11 and a conductive circuit 12 disposed inside the substrate 11, and a material of the conductive circuit 12 includes a metal material.

In the present application, the depth of the focal point is controlled by the spectroscopic lens of the femtosecond laser, so that the focal point is located inside the substrate, and then the metal compound inside the substrate is reduced to form the conductive line 12. The femtosecond laser lasts for a very short time, and is femtosecond level, in the femtosecond laser scanning process, the process time of metal compound reduction to form metal is very short, the region inside the substrate which is not scanned by the femtosecond laser still cannot be subjected to heat radiation, no hot melting region is generated, and further the interior of the substrate cannot be damaged, and meanwhile, because the focus is directly positioned inside the substrate, the surface of the substrate cannot be damaged, and further the performance of the formed substrate 11 cannot be influenced.

In one embodiment of the present application, the femtosecond laser has a power of less than 1W, a frequency of 0.8kHz to 1.2kHz, and a wavelength of 600nm to 900 nm. In the application, the power of the femtosecond laser is controlled, so that the metal compound can be reduced; the scanning speed of the femtosecond laser can be controlled, so that the size of the conductive circuit 12 can be controlled; the scanning interval of the femtosecond laser can be controlled, and thus the shape of the conductive line 12 can be controlled. In one embodiment, the power of the femtosecond laser is greater than or equal to 35mW, thereby facilitating the reduction of all the metal compounds in the position scanned by the femtosecond laser. In another embodiment, the femtosecond laser has a scanning speed of 5 μm/s to 50 μm/s and a scanning interval of 3 μm to 8 μm. Furthermore, the scanning speed of the femtosecond laser is 5-15 μm/s, and the scanning interval is 3-6 μm. In a specific embodiment, when the metal compound comprises copper oxide, the power of the femtosecond laser is greater than or equal to 30 mW; when the metal compound comprises silver oxide, the power of the femtosecond laser is greater than or equal to 35 mW; when the metal compound includes gold oxide, the power of the femtosecond laser is greater than or equal to 25mW to reduce the metal compound in the position scanned by the femtosecond laser entirely. In another embodiment, the femtosecond laser has a scanning speed of more than 30 μm/s, which is beneficial to manufacturing conductive wiring and transparent conductive lines 12 with a line width of less than 3 μm.

In this application, because the precision of femto second laser technique is high, and then the conducting wire 12 that makes is minimum with predetermineeing the position difference at the inside position of base plate 11, and the distribution of conducting wire 12 accords with and predetermines the requirement, and the size of conducting wire 12 is minimum with predetermineeing the size difference, promotes shell assembly 10's preparation yield by a wide margin. In an embodiment of the present application, the size precision of the conductive circuit 12 is ± 0.1mm, the position precision is ± 0.2mm, the conductive circuit 12 can be prepared inside the planar and curved substrate 11, the preparation yield of the housing assembly 10 is improved, and the application thereof is facilitated.

In one embodiment of the present application, a glass substrate is prepared by mixing, by mass, 58% of silicon dioxide, 18% of aluminum oxide, 12% of sodium oxide, 1% of potassium oxide, 4% of lithium oxide, 4% of magnesium oxide, 2% of zirconium dioxide, and 1% of silver oxide, melting at 1600 ℃, and then molding, annealing, and chemically strengthening the mixture. The glass substrate was fixed on an operation table, and scanned with a femtosecond laser at a scanning speed of 10 μm/s at a power of 35mW in a region of 200 μm from one surface of the glass substrate, and the precipitated metal and the formed conductive line were observed by an optical microscope. Fig. 4 is a microscope image of a housing assembly according to an embodiment of the present application. It can be seen that approximately annular, point-shaped and linear conductive circuits can be formed by controlling the femtosecond laser scanning condition so as to meet different application requirements.

In another embodiment of the present application, a glass substrate is prepared by mixing, by mass, 58% of silicon dioxide, 18% of aluminum oxide, 12% of sodium oxide, 1% of potassium oxide, 4% of lithium oxide, 4% of magnesium oxide, 2% of zirconium dioxide and 1% of copper oxide, melting at 1600 ℃, and then molding, annealing and chemically strengthening the mixture. The precipitated metal and the formed conductive line were observed by an optical microscope by scanning a femtosecond laser at a scanning speed of 10 μm/s at a power of 30mW in an area of 200 μm from one surface of the glass substrate. Fig. 5 is a microscope view of a housing assembly according to another embodiment of the present application. It can be seen that the conductive lines with continuous linear or discontinuous patterns can be formed by controlling the femtosecond laser scanning conditions to meet different application requirements. In another embodiment of the present invention, the glass substrate may be prepared by mixing silica, alumina, sodium oxide, potassium oxide, magnesium oxide, zirconium dioxide, silver oxide, and then performing melt molding. And forming a conductive circuit inside the glass substrate by femtosecond laser.

In another embodiment of the present application, a glass substrate is prepared by mixing, by mass, 58% of silicon dioxide, 18% of aluminum oxide, 12% of sodium oxide, 1% of potassium oxide, 4% of lithium oxide, 4% of magnesium oxide, 2% of zirconium dioxide, and 1% of copper oxide, melting at 1600 ℃, and then molding, annealing, and chemically strengthening. The precipitated metal and the formed conductive wiring were observed by an optical microscope by scanning a region 200 μm from one surface of the glass substrate with a femtosecond laser at a scanning speed of 10 μm/s with a wavelength of 780nm, a frequency of 1kHz, and a power of 30mW at a scanning interval of 5 μm. Fig. 6 is a microscope view of a housing assembly according to another embodiment of the present application. It can be seen that the conductive circuit has good continuity and good pattern effect, and the space between a plurality of two points is marked in fig. 6, so that the conductive circuit with micron-sized size can be manufactured by femtosecond laser, which is more beneficial to the application of the conductive circuit.

In the present embodiment, the functional layer 13 may be formed on the surface of the substrate after being scanned by the femtosecond laser. It can be understood that the substrate after the femtosecond laser scanning is the base plate 11. Specifically, the functional layer 13 may include, but is not limited to, at least one of a color layer, an optical film layer, a texture layer, an anti-fingerprint layer, and a hardening layer. Optionally, the thickness of the functional layer 13 may be 0.01mm to 0.6mm, and specifically, but not limited to, 0.01mm, 0.03mm, 0.05mm, 0.1mm, 0.25mm, 0.35mm, 0.5mm, 0.55mm, and the like, which not only can enrich the appearance effect of the housing assembly 10, but also does not increase the thickness of the housing assembly 10 too much.

The application provides a preparation method of casing subassembly, has both guaranteed the original performance of base plate 11, and base plate 11 plays the guard action to its inside conducting wire 12, more is favorable to the application in electronic equipment 200.

The preparation method of the shell assembly 10 provided by the application is simple to operate and easy for large-scale production; conducting wire 12 directly forms through femto second laser scanning back, compares in conducting wire 12 that modes such as printing, paste set up, and conducting wire 12 that this application provided is difficult for droing, can not receive external environment's influence, also can not suffer damage, and the stability of signal has been guaranteed to the good reliability.

The application further provides an antenna assembly 100, the antenna assembly 100 includes a feed source 20 and the housing assembly 10 according to any of the above embodiments, the housing assembly 10 includes a substrate 11 and a conductive circuit 12 disposed inside the substrate 11, the conductive circuit 12 is made of a metal material, and the feed source 20 is electrically connected to the conductive circuit 12.

In this application, the conducting circuit 12 in the housing assembly 10 and the feed-in mode of the feed source 20 can be coupled feed-in, and then direct electrical connection is not needed, so that the arrangement of additional parts is avoided, and meanwhile, signals can be amplified and radiated to ensure the communication quality. In the present application, the antenna assembly 100 may be different types of antennas, such as an NFC antenna, a WiFi antenna, a GPS antenna, a bluetooth antenna, and the like.

In an embodiment of the present application, the antenna assembly 100 further comprises conductive components for feeding signals generated by the feed 20 into the conductive line 12. Optionally, the conductive features are coupled to the conductive traces 12. The conductive member may be, but is not limited to, a spring, a wire, etc.

The application further provides an electronic device 200, which includes an antenna assembly 100, the antenna assembly 100 includes a feed source 20 and the housing assembly 10 according to any of the above embodiments, the housing assembly 10 includes a substrate 11 and a conductive circuit 12 disposed inside the substrate 11, the conductive circuit 12 is made of a metal material, and the feed source 20 is electrically connected to the conductive circuit 12. It is understood that the electronic device 200 may be, but is not limited to, a cell phone, a tablet computer, a notebook computer, a watch, an MP3, an MP4, a GPS navigator, a digital camera, etc.

In the present application, the housing assembly 10 may be used as a rear case of the electronic device 200, as a front cover of the electronic device 200, or as a bezel connecting the rear case and the front cover in the electronic device 200. In an embodiment, when the housing assembly 10 serves as a front cover of the electronic device 200, the electronic device 200 further includes a display screen, and in this case, the housing assembly 10 includes a display area and a non-display area, the display area is an area corresponding to the display screen, and the non-display area is an area not corresponding to the display screen; in order not to affect the normal operation of the electronic device 200, when the conductive traces 12 are disposed in the display area, the conductive traces 12 are transparent conductive traces.

In an embodiment of the present application, the electronic device 200 further includes a circuit board 110, and the feed 20 is disposed on the circuit board 110. Referring to fig. 7, a schematic structural diagram of an electronic device 200 according to an embodiment of the present disclosure is provided, which includes a circuit board 110, an antenna assembly 100, a feed 20 of the antenna assembly 100, and a housing assembly 10, where the feed 20 is disposed on the circuit board 110. The conductive circuit 12 in the housing assembly 10 can receive electromagnetic wave signals sent by other devices and can also send electromagnetic wave signals to other devices, and the feed source 20 can feed the electromagnetic wave signals received by the conductive circuit 12 to the circuit board 110 and can also feed signals generated by the circuit board 110 to the conductive circuit 12. Feed 20 may be, but is not limited to, a radio frequency chip. The conductive circuit 12 in the housing assembly 10 serves as an antenna radiator, which greatly increases the clearance area of the antenna, avoids the communication problem caused by insufficient internal space of the electronic device 200, improves the performance of the antenna assembly 100 and the electronic device 200, and is beneficial to wide application.

The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. The shell assembly is characterized by comprising a substrate and a conducting circuit arranged inside the substrate, wherein the conducting circuit is made of a metal material.

2. The housing assembly of claim 1, wherein the substrate comprises a metal compound, and the metal compound is a compound of the metal material.

3. The housing assembly of claim 2, wherein the conductive line is formed from the metal compound via femtosecond laser reduction.

4. The housing assembly of claim 2, wherein the metal compound is present in the substrate at less than 10% by mass.

5. The housing assembly of claim 1 wherein the conductive traces have a sheet resistance of 0.1 Ω/sq to 1 Ω/sq.

6. The housing assembly of claim 1, wherein the metallic material comprises at least one of copper, silver, and gold.

7. The housing assembly of claim 1 wherein the conductive trace has a dimensional accuracy of ± 0.1 mm.

8. The housing assembly of claim 1, wherein the conductive trace includes at least one conductive wire having a line width of less than 3 μ ι η.

9. The housing assembly of claim 1, wherein the conductive trace is parallel to a surface of the substrate or the conductive trace is angled with respect to the surface of the substrate.

10. The housing assembly of claim 1, further comprising a functional layer disposed on a surface of the substrate.

11. A method of making a housing assembly, comprising:

12. The method of claim 11, wherein the femtosecond laser has a power of less than 1W, a frequency of 0.8kHz to 1.2kHz, and a wavelength of 600nm to 900 nm.

13. The method of claim 12, wherein the femtosecond laser has a power of 35mW or more, a scanning speed of 5 μm/s to 50 μm/s, and a scanning interval of 3 μm to 8 μm.

14. The method of manufacturing of claim 11, wherein the molding substrate comprises:

and melting and molding the mixture comprising the metal compound to obtain the substrate.

15. The method according to claim 14, wherein the metal compound is contained in the mixture in an amount of 0.5 to 10% by mass.

16. The method of claim 14, wherein the mixture further comprises a base material comprising, by mass, 55% to 65% silica, 12% to 20% alumina, 10% to 15% sodium oxide, 0.5% to 2% potassium oxide, 3% to 8% magnesium oxide, and 0.5% to 5% zirconia.

17. The antenna assembly is characterized by comprising a feed source and a shell assembly, wherein the shell assembly comprises a substrate and a conducting circuit arranged inside the substrate, the conducting circuit is made of metal materials, and the feed source is electrically connected with the conducting circuit.

18. An electronic device is characterized by comprising an antenna assembly, wherein the antenna assembly comprises a feed source and a shell assembly, the shell assembly comprises a substrate and a conducting circuit arranged inside the substrate, the conducting circuit is made of a metal material, and the feed source is electrically connected with the conducting circuit.