CN110536557B - Circuit line based on laser burning and carving molding, circuit and antenna manufacturing method - Google Patents
Circuit line based on laser burning and carving molding, circuit and antenna manufacturing method Download PDFInfo
- Publication number
- CN110536557B CN110536557B CN201810508780.9A CN201810508780A CN110536557B CN 110536557 B CN110536557 B CN 110536557B CN 201810508780 A CN201810508780 A CN 201810508780A CN 110536557 B CN110536557 B CN 110536557B
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- carving
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 238000000465 moulding Methods 0.000 title claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000010586 diagram Methods 0.000 claims abstract description 35
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 34
- 238000005516 engineering process Methods 0.000 claims abstract description 13
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims description 33
- 239000010410 layer Substances 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 15
- 230000008018 melting Effects 0.000 claims description 14
- 238000005538 encapsulation Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 6
- 239000005022 packaging material Substances 0.000 claims description 5
- 238000010146 3D printing Methods 0.000 claims description 3
- 238000004043 dyeing Methods 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000001802 infusion Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 9
- 239000000243 solution Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- -1 dimethyl siloxane Chemical class 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The embodiment of the invention provides a circuit line, a circuit and an antenna manufacturing method based on laser burning and carving molding, which comprises the following steps: burning and carving on the substrate by utilizing a laser burning and carving forming technology according to a preset circuit diagram to obtain a channel corresponding to the preset circuit diagram; packaging the substrate to cover the channel to form a channel; and filling low-melting-point liquid metal in the channel to form a circuit line. According to the invention, the channel is quickly obtained by burning and carving, and the low-melting-point liquid metal is filled in the channel, so that the circuit line is quickly obtained, the efficient manufacturing of the circuit line is realized, and the manufacturing efficiency of the circuit and the antenna is further improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of circuit manufacturing, in particular to a circuit line based on laser burning and carving molding, a circuit and an antenna manufacturing method.
Background
The circuit is a main component of an electric system, a control system, a communication system, computer hardware and other electric systems, plays roles in generating, transmitting, converting, controlling, processing, storing and the like of electric energy and electric signals, and has huge demand in the electronic communication industry. Therefore, how to efficiently fabricate circuits has received much attention.
The circuits are classified into single-layer circuits and multi-layer circuits according to the structural hierarchy. The fabrication of single-layer circuits mainly includes subtractive and additive processes. The subtractive method is to apply a complete piece of metal foil on a blank substrate by chemicals or machinery, and then remove unnecessary portions, which are the desired lines. The technology mainly comprises three modes of screen printing, photosensitive plate and imprinting. The addition method is that a substrate plated with a thin copper layer in advance is covered with a photoresist, exposed to ultraviolet light and developed to expose the required place, then the thickness of the circuit copper required on the circuit board is increased to the required specification by electroplating, then a layer of anti-etching resist-metal thin tin is plated, finally the photoresist is removed (membrane is removed), and finally the copper foil layer under the photoresist is etched. The multilayer circuit is generally produced by a build-up method or build-up method. The lamination method is to wrap the outer layer after the inner layer is manufactured, and then the outer layer is processed by a subtractive method or an additive method. The sequential build-up method is used to obtain a circuit with multiple printed layers by repeating the operations of the build-up method. The build-up method is to add layers of printed circuit boards one by one and process the printed circuit boards to the required shape each time one layer is added.
In the circuit line manufacturing process, the method has complex and time-consuming procedures, so that the circuit line manufacturing efficiency is not high.
Disclosure of Invention
The embodiment of the invention provides a circuit line, a circuit and an antenna manufacturing method based on laser burning and carving molding, which are used for solving the problem that the circuit line, the circuit and the antenna are low in manufacturing efficiency in the prior art.
The embodiment of the invention provides a circuit line manufacturing method based on laser burning and carving molding, which comprises the following steps: burning and carving on the substrate by utilizing a laser burning and carving forming technology according to a preset circuit diagram to obtain a channel corresponding to the preset circuit diagram; packaging the substrate to cover the channel to form a channel; and filling low-melting-point liquid metal in the channel to form a circuit line.
The embodiment of the invention provides a circuit manufacturing method based on laser burning and carving molding, which comprises the following steps: obtaining a circuit line corresponding to the circuit according to a circuit line manufacturing method based on laser burning and carving molding; electronic components on the circuit are positioned on the packaging material used in the packaging process, and the circuit can be formed after the filling is finished; or, according to a preset circuit diagram corresponding to the circuit, embedding an electronic device element on the circuit corresponding to the circuit to form the circuit.
The embodiment of the invention provides an antenna manufacturing method based on laser burning and carving molding, which comprises the following steps: and forming a circuit line corresponding to the antenna according to a circuit line manufacturing method based on laser burning and carving molding to obtain the antenna.
The embodiment of the invention discloses a method for manufacturing an antenna based on laser burning and carving molding, which comprises the following steps: forming a circuit line corresponding to the antenna according to a circuit line manufacturing method based on laser burning and carving molding; obtaining an antenna carrier based on a 3D printing technology; and arranging the circuit line corresponding to the antenna on the antenna carrier to obtain the antenna.
According to the circuit line, the circuit and the antenna manufacturing method based on laser burning-carving molding, provided by the embodiment of the invention, the substrate is burnt and carved by utilizing the laser burning-carving molding technology according to the preset circuit line diagram to obtain the channel corresponding to the preset circuit line diagram, the substrate is packaged to cover the channel to form the channel, the channel is filled with the low-melting-point liquid metal to form the circuit line, the channel is quickly obtained through burning and carving, and the low-melting-point liquid metal is filled in the channel to quickly obtain the circuit line, so that the high-efficiency manufacturing of the circuit line is realized, and the manufacturing efficiency of the circuit and the antenna is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a flow chart of a circuit line manufacturing method based on laser burning molding according to the present invention;
FIG. 2 is a schematic diagram of a circuit line etching process according to the present invention;
FIG. 3 is a longitudinal cross-sectional view of a single-layer substrate of the present invention after encapsulation;
FIG. 4(a) is a longitudinal sectional view of a multilayer substrate of the present invention after firing and before encapsulation;
FIG. 4(b) is a longitudinal sectional view of the multilayer substrate of the present invention after encapsulation;
FIG. 5 is a schematic diagram of a circuit embedded in an electronic component according to the present invention;
fig. 6 is a schematic circuit diagram of the electronic component peripheral device according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, an embodiment of the present invention provides a method for manufacturing a circuit line based on laser ablation molding, including: 101. burning and carving on the substrate by utilizing a laser burning and carving forming technology according to a preset circuit diagram to obtain a channel corresponding to the preset circuit diagram; 102. packaging the substrate to cover the channel to form a channel; 103. and filling low-melting-point liquid metal in the channel to form a circuit line.
In this embodiment, the preset circuit diagram is a reference diagram of a circuit line to be manufactured, and is used for determining a position on the substrate to be etched. FIG. 2 is a schematic diagram of circuit line etching according to the present invention. The laser 21 emits laser light to the position of the substrate 22 to be burned and engraved, so that the substrate is rapidly deformed, and the channel 23 corresponding to the preset circuit diagram is obtained. In the laser burning and carving process, residues generated by burning and carving can be removed through external force, such as brushing, needle-shaped tool removal, liquid washing or dissolution of water and the like. The laser may be various types of lasers, such as a gas laser, a solid-state laser, a semiconductor laser, and the like. The substrate is a carrier of the circuit line. The width and depth of the channel can be set according to actual needs, and are not limited herein. The channels are formed by encapsulating the substrate to form channels for subsequent convenient filling with low melting point liquid metal. The liquid metal with low melting point is amorphous, flowable and conductive, so that the filling is convenient and the conduction is realized, and the circuit can be formed by filling the corresponding channel of the circuit diagram.
According to the circuit line manufacturing method based on laser burning-etching forming, provided by the embodiment of the invention, the channel corresponding to the preset circuit line diagram is obtained by burning-etching the substrate by utilizing the laser burning-etching forming technology according to the preset circuit line diagram, the substrate is packaged, the channel is covered to form the channel, the channel is filled with the low-melting-point liquid metal to form the circuit line, the channel is quickly obtained by burning-etching, and the low-melting-point liquid metal is filled in the channel to quickly obtain the circuit line, so that the efficient manufacturing of the circuit line is realized.
As an alternative embodiment, the substrate is a single layer; correspondingly, encapsulating the substrate to cover the channel to form a channel specifically includes: and covering the surface of the substrate with the channel with an encapsulation layer to form a channel.
Fig. 3 is a longitudinal sectional view of the single-layer substrate after being packaged according to the present invention. In this embodiment, the surface of the substrate 31 on which the channel is etched is covered with an encapsulation layer 32 to form a channel 33. In addition, a low melting point liquid metal inlet 34 and a low melting point liquid metal outlet 35 are respectively arranged at two ends of the channel, wherein the low melting point liquid metal inlet 34 is used for inputting liquid metal, and the low melting point liquid metal outlet 35 is used for recovering redundant low melting point liquid metal.
As an alternative embodiment, the substrate is a multilayer; correspondingly, encapsulating the substrate to cover the channel to form a channel specifically includes: according to the preset circuit diagram, the substrates of all layers are superposed to form a communicated channel inside the substrates; and covering the surface of the outermost substrate, which is provided with the channels, with an encapsulation layer to form channels.
FIG. 4(a) is a longitudinal sectional view of the multilayer substrate of the present invention after firing and before packaging. Since the multilayer substrates 41 need to communicate with each other, it is necessary to provide a specific via hole 43 in the trench 42 to communicate with the inside of the multilayer substrate when the multilayer substrate is positioned between the intermediate substrate 411 and the uppermost substrate 412 at the time of firing. In addition, a low melting point liquid metal inlet 44 and a low melting point liquid metal outlet 45 are respectively arranged at two ends of the channel, the low melting point liquid metal inlet 44 is used for inputting liquid metal, and the low melting point liquid metal outlet 45 is used for recovering redundant low melting point liquid metal. The surface of the outermost substrate 413 on which the trench is etched is covered with the encapsulation layer 46 to form a channel. Fig. 4(b) is a longitudinal sectional view of the multilayer substrate of the present invention after packaging.
As an alternative embodiment, the substrate is a flexible material or a hard material.
In this embodiment, the substrate is made of a flexible material or a hard material. Wherein, the flexible material can be flexible high molecular polymer, paper, leather or cloth; the hard material may be plastic, wood, polymer, etc. The high molecular polymer can be dimethyl siloxane (PDMS), Polyethylene (PE), polyvinyl chloride (PVC), Polystyrene (PS), polypropylene (PP), organic glass (PMMA), etc.
As an alternative, the filling means is infusion or vacuum suction.
In this embodiment, after the substrate is packaged to form the channel, one end of the channel may be connected to an injection device or a vacuum system, and the low-melting-point liquid metal is injected or vacuum sucked into the channel until the low-melting-point liquid metal overflows from the other end of the channel, so as to form a circuit line. Excess low-melting liquid metal can be recovered through the other end of the channel.
As an optional embodiment, before the step of burning and etching the substrate by using a laser burning and etching molding technique according to the preset circuit diagram to obtain the trench corresponding to the preset circuit diagram, the method further includes: and if the substrate is made of a transparent material, dyeing the surface of the substrate needing to be burnt.
In this embodiment, the surface of the substrate of the transparent material to be etched is dyed to make the surface of the substrate to be etched opaque, so that the opaque portion can better absorb laser to be etched, and the dyeing process may be performed by printing ink, attaching a film, or the like.
The embodiment of the invention provides a circuit manufacturing method based on laser burning and carving molding, which comprises the following steps: obtaining a circuit line corresponding to the circuit according to a circuit line manufacturing method based on laser burning and carving molding; electronic components on the circuit are positioned on the packaging material used in the packaging process, and the circuit can be formed after the filling is finished; or, according to a preset circuit diagram corresponding to the circuit, embedding an electronic device element on the circuit corresponding to the circuit to form the circuit.
Fig. 5 is a schematic diagram of a circuit embedded in an electronic component according to the present invention. Wherein, the electronic components that the circuit contains are embedded in the packaging material. In the process of packaging the substrate, the electronic component embedded in the packaging material is ensured to be connected with the circuit line, and then the circuit can be obtained. Fig. 6 is a schematic circuit diagram of the electronic component peripheral device according to the present invention. The electronic component is embedded in the circuit line corresponding to the circuit after the circuit line corresponding to the circuit is obtained.
According to the circuit manufacturing method based on laser burning-engraving molding provided by the embodiment of the invention, the channel corresponding to the preset circuit diagram is obtained by burning-engraving on the substrate by utilizing the laser burning-engraving molding technology according to the preset circuit diagram, the substrate is packaged, the channel is covered to form the channel, the channel is filled with the low-melting-point liquid metal to form the circuit, the channel is quickly obtained by burning-engraving, and the low-melting-point liquid metal is filled in the channel to quickly obtain the circuit, so that the high-efficiency manufacturing of the circuit is realized.
The embodiment of the invention provides an antenna manufacturing method based on laser burning and carving molding, which comprises the following steps: and forming a circuit line corresponding to the antenna according to a circuit line manufacturing method based on laser burning and carving molding to obtain the antenna.
According to the manufacturing method of the antenna based on laser burning-carving molding, provided by the embodiment of the invention, the channel corresponding to the preset circuit diagram is obtained by burning-carving on the substrate by utilizing the laser burning-carving molding technology according to the preset circuit diagram, the substrate is packaged, the channel is covered to form the channel, the channel is filled with the low-melting-point liquid metal to form the circuit, the channel is quickly obtained by burning-carving, and the low-melting-point liquid metal is filled in the channel to quickly obtain the circuit, so that the efficient manufacturing of the antenna is realized.
The embodiment of the invention discloses a method for manufacturing an antenna based on laser burning and carving molding, which comprises the following steps: forming a circuit line corresponding to the antenna according to a circuit line manufacturing method based on laser burning and carving molding; obtaining an antenna carrier based on a 3D printing technology; and arranging the circuit line corresponding to the antenna on the antenna carrier to obtain the antenna.
According to the manufacturing method of the antenna based on laser burning-carving molding, provided by the embodiment of the invention, the channel corresponding to the preset circuit diagram is obtained by burning-carving on the substrate by utilizing the laser burning-carving molding technology according to the preset circuit diagram, the substrate is packaged, the channel is covered to form the channel, the channel is filled with the low-melting-point liquid metal to form the circuit, the channel is quickly obtained by burning-carving, and the low-melting-point liquid metal is filled in the channel to quickly obtain the circuit, so that the efficient manufacturing of the antenna is realized.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A circuit line manufacturing method based on laser burning forming is characterized by comprising the following steps:
burning and carving on the substrate by utilizing a laser burning and carving forming technology according to a preset circuit diagram to obtain a channel corresponding to the preset circuit diagram;
packaging the substrate to cover the channel to form a channel;
an inlet and an outlet are respectively arranged at two ends of the channel;
filling low-melting-point liquid metal in the channel to form a circuit line;
wherein the inlet is used for inputting the low melting point liquid metal, and the outlet is used for recovering the redundant low melting point liquid metal.
2. The method of claim 1, wherein the substrate is a single layer;
correspondingly, encapsulating the substrate to cover the channel to form a channel specifically includes:
and covering the surface of the substrate with the channel with an encapsulation layer to form a channel.
3. The method of claim 1, wherein the substrate is a multilayer;
correspondingly, encapsulating the substrate to cover the channel to form a channel specifically includes:
according to the preset circuit diagram, the substrates of all layers are superposed to form a communicated channel inside the substrates;
and covering the surface of the outermost substrate, which is provided with the channels, with an encapsulation layer to form channels.
4. The method of claim 1, wherein the substrate is a flexible material or a rigid material.
5. The method of claim 1, wherein the filling means is infusion or vacuum suction.
6. The method of claim 1, wherein before the step of burning the substrate according to the predetermined circuit pattern by using a laser burning molding technique to obtain the trench corresponding to the predetermined circuit pattern, the method further comprises:
and if the substrate is made of a transparent material, dyeing the surface of the substrate needing to be burnt.
7. A circuit manufacturing method based on laser burning and carving molding is characterized by comprising the following steps:
the method according to any one of claims 1-6, obtaining circuit lines corresponding to the circuit;
electronic components on the circuit are positioned on the packaging material used in the packaging process, and the circuit can be formed after the filling is finished; or, according to a preset circuit diagram corresponding to the circuit, embedding an electronic device element on the circuit corresponding to the circuit to form the circuit.
8. A manufacturing method of an antenna based on laser burning and carving molding is characterized by comprising the following steps:
the method according to any one of claims 1 to 6, wherein the antenna is obtained by forming a circuit line corresponding to the antenna.
9. A manufacturing method of an antenna based on laser burning and carving molding is characterized by comprising the following steps:
the method according to any one of claims 1-6, forming a circuit line corresponding to the antenna;
obtaining an antenna carrier based on a 3D printing technology;
and arranging the circuit line corresponding to the antenna on the antenna carrier to obtain the antenna.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810508780.9A CN110536557B (en) | 2018-05-24 | 2018-05-24 | Circuit line based on laser burning and carving molding, circuit and antenna manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810508780.9A CN110536557B (en) | 2018-05-24 | 2018-05-24 | Circuit line based on laser burning and carving molding, circuit and antenna manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110536557A CN110536557A (en) | 2019-12-03 |
| CN110536557B true CN110536557B (en) | 2020-12-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810508780.9A Active CN110536557B (en) | 2018-05-24 | 2018-05-24 | Circuit line based on laser burning and carving molding, circuit and antenna manufacturing method |
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| CN114069196A (en) * | 2020-07-30 | 2022-02-18 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof, antenna assembly and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446961A (en) * | 1993-10-15 | 1995-09-05 | International Business Machines Corporation | Method for repairing semiconductor substrates |
| US20120273261A1 (en) * | 2010-10-20 | 2012-11-01 | Taiwan Green Point Enterprises Co., Ltd. | Circuit substrate having a circuit pattern and method for making the same |
| CN103857205A (en) * | 2012-12-04 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | Circuit board laser pore-forming method |
| CN103931277A (en) * | 2011-11-16 | 2014-07-16 | 陶瓷技术有限责任公司 | Embedded metal structures in ceramic substrates |
| CN105744748A (en) * | 2016-04-26 | 2016-07-06 | 北京梦之墨科技有限公司 | Manufacturing method and apparatus for carving type liquid metal circuit |
-
2018
- 2018-05-24 CN CN201810508780.9A patent/CN110536557B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5446961A (en) * | 1993-10-15 | 1995-09-05 | International Business Machines Corporation | Method for repairing semiconductor substrates |
| US20120273261A1 (en) * | 2010-10-20 | 2012-11-01 | Taiwan Green Point Enterprises Co., Ltd. | Circuit substrate having a circuit pattern and method for making the same |
| CN103931277A (en) * | 2011-11-16 | 2014-07-16 | 陶瓷技术有限责任公司 | Embedded metal structures in ceramic substrates |
| CN103857205A (en) * | 2012-12-04 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | Circuit board laser pore-forming method |
| CN105744748A (en) * | 2016-04-26 | 2016-07-06 | 北京梦之墨科技有限公司 | Manufacturing method and apparatus for carving type liquid metal circuit |
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| Publication number | Publication date |
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| CN110536557A (en) | 2019-12-03 |
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