CN103917063A - Electronic equipment - Google Patents

Electronic equipment Download PDF

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Publication number
CN103917063A
CN103917063A CN201310004815.2A CN201310004815A CN103917063A CN 103917063 A CN103917063 A CN 103917063A CN 201310004815 A CN201310004815 A CN 201310004815A CN 103917063 A CN103917063 A CN 103917063A
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CN
China
Prior art keywords
electronic equipment
drain pan
top shell
hole
screw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310004815.2A
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Chinese (zh)
Inventor
龚树强
赵梦龙
张斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Device Co Ltd
Original Assignee
Huawei Device Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Device Co Ltd filed Critical Huawei Device Co Ltd
Priority to CN201310004815.2A priority Critical patent/CN103917063A/en
Publication of CN103917063A publication Critical patent/CN103917063A/en
Pending legal-status Critical Current

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Abstract

The invention discloses electronic equipment which comprises a bottom shell and a top shell. The bottom shell is made of a resin matrix composite material and comprises a bearing face used for arrangement of an electronic element, and the top shell is fixed to the bearing face. According to the electronic equipment, the top shell is adopted; the resin matrix composite material serves as the bottom shell, can be used for conduction of electric signals to achieve the function of a circuit board and also can serve as a structural composite material to bear stress of a whole machine, and accordingly the design of a traditional structure part is simplified, and meanwhile, the thickness of the whole machine is reduced.

Description

Electronic equipment
Technical field
The present invention relates to electronic applications, relate in particular to a kind of extra-thin electronic equipment.
Background technology
Current ultra-thin class of electronic devices version is to use minimum upper and lower double-layer structure part, and PCB is enclosed in to structural member inner chamber, utilizes structural member to bear various external force as top shell, and PCB is protected.But for ultra-thin equipment, because the space that two-layer shell part takies is excessive, the size restrictions of structural member the further miniaturization of equipment.
Summary of the invention
The embodiment of the present invention provides a kind of electronic equipment, large for solving the space that prior art exists double Shell to take, and is unfavorable for the problem of ultrathin.
On the one hand, provide a kind of electronic equipment, it comprises a drain pan and a top shell, and described drain pan is that polymer matrix composites are made, and described drain pan comprises the loading end for electronic component is set, and described top shell is fixed on described loading end.
In the possible implementation of the first, described electronic equipment comprises an engaging frame, and described engaging frame is fixed on described loading end, and described top shell is sticked on described engaging frame.
In conjunction with the possible implementation of the first, in the possible implementation of the second, described engaging frame is made of metal, and described engaging frame is welded in described drain pan edge.
In conjunction with the first or the possible implementation of the second, in the third possible implementation, described top shell periphery arranges at least one buckle, and described buckle is fastened on described engaging frame.
In conjunction with the third possible implementation, in the 4th kind of possible implementation, described drain pan periphery is offered at least one and described buckle groove one to one, and described buckle part is contained in described groove.
In conjunction with above-mentioned any one possible implementation, in the 5th kind of possible implementation, described top shell comprises a host cavity, described drain pan is contained in described host cavity, described drain pan comprises the bottom surface being oppositely arranged with described loading end, and the edge of described bottom surface and described host cavity is positioned at same plane.
In conjunction with above-mentioned any one possible implementation, in the 6th kind of possible implementation, described top shell is made up of plastic material.
In conjunction with above-mentioned any one possible implementation, in the 7th kind of possible implementation, described electronic equipment comprises at least one screw and screw gasket, described drain pan is offered at least one first through hole, described screw gasket is fixed on described loading end, described screw gasket comprises boss, described boss is contained in described the first through hole, the thickness of described boss is less than the degree of depth of described the first through hole, described boss is offered the second through hole, described the second through hole is concentric with described the first through hole, described screw runs through described the first through hole and the second through hole, described screw is bolted in described top shell, the head of screw of described screw is locked described boss and described top shell.
In conjunction with the 7th kind of possible implementation, in the 8th kind of possible implementation, described screw gasket is made of metal, and described screw gasket is welded on described drain pan.
In conjunction with above-mentioned any one possible implementation, in the 9th kind of possible implementation, described drain pan is made up of the stacked polymer matrix composites of sandwich construction.
The electronic equipment that embodiment of the present invention provides is ensureing under the prerequisite of complete machine intensity and reliability, utilize described polymer matrix composites not only as realizing the function of printed circuit board (PCB) but also bear machine stress as structural composite material for the conduction of the signal of telecommunication, simplify the design of conventional junction member with this, simultaneously attenuate complete machine thickness.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the schematic diagram of the electronic equipment that provides of the embodiment of the present invention;
Fig. 2 is the electronic equipment phantom of Fig. 1;
Fig. 3 is the decomposing schematic representation of the electronic equipment part assembly of Fig. 1;
Fig. 4 is the screw gasket of electronic equipment and the schematic diagram of screw lock of Fig. 1.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
In embodiments of the present invention, adopt a top shell, and adopt polymer matrix composites as drain pan, utilize described polymer matrix composites not only as realizing the function of printed circuit board (PCB) but also bear machine stress as structural composite material for the conduction of the signal of telecommunication, thereby reduce housing quantity, realize ultrathin.
See also Fig. 1 to Fig. 3, electronic equipment 100 provided by the invention comprises a drain pan 10 and a top shell 30.Described drain pan 10 is made for polymer matrix composites, and described drain pan 10 comprises the loading end 11 for electronic component is set, and described top shell 30 is fixed on described loading end 11.
Described electronic equipment 100 adopts a top shell 30, and adopt polymer matrix composites as drain pan 10, utilize described polymer matrix composites not only as realizing the function of printed circuit board (PCB) but also bear machine stress as structural composite material for the conduction of the signal of telecommunication, simplify the design of conventional junction member with this, simultaneously attenuate complete machine thickness.
In present embodiment, described electronic equipment 100 also comprises engaging frame 20, screw gasket 40 and a screw 50.Described electronic equipment 100 can be the mobile terminals such as mobile phone, music player, panel computer, and described electronic equipment 100 can be also other electronic equipments such as panel TV, integrated computer.
Described drain pan 10 is made for polymer matrix composites, can be used as the printed circuit board (PCB) of this electronic equipment 100.Described drain pan 10 adopts polymer matrix composites to have following effect:
1, can utilize ripe surface soldered technique, realize traditional structure mode be difficult to realize plastic cement, metalwork integrated.
2,, because the modulus of elasticity of polymer matrix composites is much better than traditional structure plastic material, under same thickness, intensity is high approaches 10 times (taking resin-based printed circuit board materials as example).
3, polymer matrix composites can, by printed circuit board (PCB) from single protected device, become main stressed member as after structural member.Thereby be reduced by least a traditional plastic cement structural member, further stripping apparatus size.
Described drain pan 10 comprises the loading end 11 for electronic component 200 is set.In present embodiment, the stacked polymer matrix composites that described drain pan 10 is sandwich construction.Particularly, described drain pan 10 is for adopting resin-based printed circuit board (PCB).Sim card slot 300 and four welding hole 11a are also set on described loading end 11.Described welding hole 11a is for fixing described engaging frame 20.Described drain pan 10 comprises the bottom surface 12 being oppositely arranged with described loading end 11.Described drain pan 10 can be rectangular plate shape structure, and described drain pan 10 can comprise two relative first sides 13.Described first side 13 is the long limit of described drain pan 10.On each described first side 13, can form respectively two groove 13a.Described four groove 13a can be relatively arranged on described two first sides 13 between two, and described groove 13a is for fixing described top shell 30.Certainly, in other embodiments, on each described first side 13, also can only form a described groove 13a or more described groove 13a.Described drain pan 10 can be offered four the first through hole 10a, and described the first through hole 10a can be circular hole.Described four the first through hole 10a can be opened in 10 4 jiaos of described drain pans, for being connected with described top shell 30.Certainly, in other embodiments, described the first through hole 10a can be also the through hole of other shapes such as rectangular opening, slotted eye.The quantity of described the first through hole 10a can be also one or more.In other embodiments, decorative film, insulation film or other coating structures can also be pasted in described drain pan 10 bottom surfaces 12.
Described engaging frame 20 is fixed on described loading end 11, and described engaging frame 20 can be fixed on optional position on described loading end 11, or is arranged at as required certain and is conducive to the position that reduces space or dodge electronic component.Described engaging frame 20 is fixedly connected on described drain pan 10 edges.Because the toughness of material of described drain pan 10 is good, but elastic resilience is poor, so cannot realize complicated buckle, elastic wall structure, in order to overcome above-mentioned shortcoming, in present embodiment, by described engaging frame 20 is fixed on to described drain pan 10, then realize and the engaging of described top shell 30 by described engaging frame 20.
In present embodiment, described engaging frame 20 is made of metal, and described engaging frame 20 is welded on described drain pan 10 edges.Described engaging frame 20 can, around electronic component setting, also can be fixed on described drain pan 10 other positions according to structure setting, and in the embodiment of the present invention, the fixed position of how described engaging frame 20 does not limit.Particularly, described engaging frame 20 is rectangle frame, and described engaging frame 20 comprises two Second Edges 21 that are oppositely arranged, and described two Second Edges 21 are fixedly connected on respectively on described two first sides 13.On two Second Edges 21 of described engaging frame 20, four pad 21a are set, described each pad 21a is welded on described welding hole 11a.Because the wear-resisting withstand voltage properties of polymer matrix composites is all bad, in order to overcome above-mentioned shortcoming, in present embodiment, by being set, multiple described pad 21a can avoid exerting pressure on 10 1 of described drain pans.In order to improve the stability of connection, two described pad 21a are also set on 20 1 broadsides 22 of described engaging frame.Certainly, in other embodiments, the quantity of described pad 21a can be also two, eight or more.Certainly, in other embodiments, described electronic equipment 100 also can omit described engaging frame 20, directly by described top shell 30 peripheral snap in described drain pan 10 peripheries.
Described top shell 30 is sticked on described engaging frame 20.In present embodiment, described top shell 30 comprises a host cavity 30a, and described drain pan 10 and described engaging frame 20 are all contained in the host cavity 30a of described top shell 30.The bottom surface 12 of described drain pan 10 is positioned at same plane with the edge 30b of described host cavity 30a, to reduce the thickness of described electronic equipment 100 as far as possible.Described top shell 30 is made up of plastic material, utilizes plastic casing to realize SIM card interface and position-limit mechanism thereof, can adopt current material and conventional design, reduces research and development and manufacturing cost.Described top shell 30 peripheries arrange four buckles 31, and described buckle 31 is fastened on described engaging frame 20.Described buckle 31 is corresponding one by one with the groove 13a of described drain pan 10 peripheries.Described buckle 31 parts are contained in described groove 13a, and described groove 13a is used for dodging described buckle 31.Particularly, described top shell 30 can be rectangular configuration, and described top shell 30 comprises two article of the 3rd relative limit 32, and described buckle 31 takes shape on described the 3rd limit 32, and described two the 3rd limits 32 are sticked in respectively on described two articles of Second Edges 21 by described buckle 31.Described electronic equipment 100 retains a housing, thus can be the same with conventional design in structural design, leave various external interfaces (as external interfaces such as USB interface, SIM card interfaces).The design of described top shell 30 is just the same with ordinary construction implementation, can inherit to greatest extent prior art and experience.
See also Fig. 1 and Fig. 4, described screw gasket 40 is welded on described loading end 11 by three leg 40a at edge, described screw gasket 40 comprises boss 41, described boss 41 is contained in described the first through hole 10a, the thickness of described boss 41 is less than the degree of depth of described the first through hole 10a, forms a counter bore structure.Described boss 41 is offered the second through hole 41a, and described the second through hole 41a is concentric with described the first through hole 10a.Due to polymer matrix composites only under complete slab construction form intensity the highest, after local reduction, the strength of materials declines seriously, and easily layering, so polymer matrix composites are difficult to realize mechanical blind hole and local heavy stand structure.In order to overcome above-mentioned shortcoming, in present embodiment, on described circuit board 10, offer through hole, form counter bore structure by described screw gasket 40 and described boss 41, avoid described drain pan 10 local reductions and cause the intensity at attenuate place sharply to decline.In present embodiment, described screw gasket 40 can be rectangular sheet shape structure.Described screw gasket 40 is made of metal, and described screw gasket 40 is welded on described drain pan 10.
Described screw 50 runs through described the first through hole 10a and the second through hole 41a, described screw 50 is bolted in described top shell 30, the head of screw 51 of described screw 50 is locked described boss 41 and described top shell 30, the head of screw 51 of described screw 50 is contained in described the first through hole 10a completely, make the bottom surface 12 of described drain pan 10 completely smooth, reduce the thickness of described electronic equipment 100 simultaneously.
In embodiment of the present invention, adopt a top shell, and adopt polymer matrix composites as drain pan, utilize described polymer matrix composites not only as realizing the function of printed circuit board (PCB) but also bear machine stress as structural composite material for the conduction of the signal of telecommunication, simplify the design of conventional junction member with this, simultaneously attenuate complete machine thickness
Above disclosed is only preferred embodiment of the present invention, certainly can not limit with this interest field of the present invention, and the equivalent variations of therefore doing according to the claims in the present invention, still belongs to the scope that the present invention is contained.

Claims (10)

1. an electronic equipment, it comprises a drain pan and a top shell, and described drain pan is that polymer matrix composites are made, and described drain pan comprises the loading end for electronic component is set, and described top shell is fixed on described loading end.
2. electronic equipment as claimed in claim 1, is characterized in that, described electronic equipment comprises an engaging frame, and described engaging frame is fixed on described loading end, and described top shell is sticked on described engaging frame.
3. electronic equipment as claimed in claim 2, is characterized in that, described engaging frame is made of metal, and described engaging frame is welded in described drain pan edge.
4. electronic equipment as claimed in claim 2 or claim 3, is characterized in that, described top shell periphery arranges at least one buckle, and described buckle is fastened on described engaging frame.
5. electronic equipment as claimed in claim 4, is characterized in that, described drain pan periphery is offered at least one and described buckle groove one to one, and described buckle part is contained in described groove.
6. the electronic equipment as described in claim 1-5 any one, it is characterized in that, described top shell comprises a host cavity, and described drain pan is contained in described top shell host cavity, described drain pan comprises the bottom surface being oppositely arranged with described loading end, and the edge of described bottom surface and described host cavity is positioned at same plane.
7. the electronic equipment as described in claim 1-6 any one, is characterized in that, described top shell is made up of plastic material.
8. the electronic equipment as described in claim 1-7 any one, it is characterized in that, described electronic equipment comprises at least one screw and screw gasket, described drain pan is offered at least one first through hole, described screw gasket is fixed on described loading end, described screw gasket comprises boss, described boss is contained in described the first through hole, the thickness of described boss is less than the degree of depth of described the first through hole, described boss is offered the second through hole, described the second through hole is concentric with described the first through hole, described screw runs through described the first through hole and the second through hole, described screw is bolted in described top shell, the head of screw of described screw is locked described boss and described top shell.
9. electronic equipment as claimed in claim 8, is characterized in that, described screw gasket is made of metal, and described screw gasket is welded on described drain pan.
10. the electronic equipment as described in claim 1-9 any one, is characterized in that, described drain pan is made up of the stacked polymer matrix composites of sandwich construction.
CN201310004815.2A 2013-01-07 2013-01-07 Electronic equipment Pending CN103917063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310004815.2A CN103917063A (en) 2013-01-07 2013-01-07 Electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310004815.2A CN103917063A (en) 2013-01-07 2013-01-07 Electronic equipment

Publications (1)

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CN103917063A true CN103917063A (en) 2014-07-09

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105658007A (en) * 2016-04-11 2016-06-08 联想(北京)有限公司 Electronic equipment and shell thereof
CN107390778A (en) * 2016-04-26 2017-11-24 联想(新加坡)私人有限公司 Housing part and electronic equipment
CN110278671A (en) * 2018-03-13 2019-09-24 埃波罗-布克斯有限公司 The data logger of compact structure

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS645894A (en) * 1987-06-29 1989-01-10 Toshiba Corp Thin-type mounting type semiconductor device
JPS6445894A (en) * 1987-08-11 1989-02-20 Oji Paper Co Production of cast coat paper
US5097592A (en) * 1989-08-17 1992-03-24 Amp Incorporated Method of making molded electrical interconnection system
CN1132995A (en) * 1994-10-19 1996-10-09 株式会社Aue研究所 Electronic circuit and its assembling method
CN1700847A (en) * 2004-02-10 2005-11-23 施耐德电器工业公司 Metal box particularly for electrical units
CN101036384A (en) * 2004-10-11 2007-09-12 汤姆森特许公司 Display device with cathode ray tube and corresponding fixing system
CN200997726Y (en) * 2006-12-31 2007-12-26 邓辉伦 Electronic card casing structure
CN101404861A (en) * 2007-10-01 2009-04-08 株式会社电装 Electronic circuit device and method of making the same
CN101404863A (en) * 2007-10-01 2009-04-08 株式会社电装 Electronic circuit device and method of making the same
CN101502193A (en) * 2006-07-25 2009-08-05 松下电器产业株式会社 Circuit board and portable electronic apparatus
JP2010193218A (en) * 2009-02-18 2010-09-02 Kyocera Corp Portable electronic equipment
CN101965103A (en) * 2010-04-20 2011-02-02 力帆实业(集团)股份有限公司 Printed circuit board encapsulating method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS645894A (en) * 1987-06-29 1989-01-10 Toshiba Corp Thin-type mounting type semiconductor device
JPS6445894A (en) * 1987-08-11 1989-02-20 Oji Paper Co Production of cast coat paper
US5097592A (en) * 1989-08-17 1992-03-24 Amp Incorporated Method of making molded electrical interconnection system
CN1132995A (en) * 1994-10-19 1996-10-09 株式会社Aue研究所 Electronic circuit and its assembling method
CN1700847A (en) * 2004-02-10 2005-11-23 施耐德电器工业公司 Metal box particularly for electrical units
CN101036384A (en) * 2004-10-11 2007-09-12 汤姆森特许公司 Display device with cathode ray tube and corresponding fixing system
CN101502193A (en) * 2006-07-25 2009-08-05 松下电器产业株式会社 Circuit board and portable electronic apparatus
CN200997726Y (en) * 2006-12-31 2007-12-26 邓辉伦 Electronic card casing structure
CN101404861A (en) * 2007-10-01 2009-04-08 株式会社电装 Electronic circuit device and method of making the same
CN101404863A (en) * 2007-10-01 2009-04-08 株式会社电装 Electronic circuit device and method of making the same
JP2010193218A (en) * 2009-02-18 2010-09-02 Kyocera Corp Portable electronic equipment
CN101965103A (en) * 2010-04-20 2011-02-02 力帆实业(集团)股份有限公司 Printed circuit board encapsulating method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105658007A (en) * 2016-04-11 2016-06-08 联想(北京)有限公司 Electronic equipment and shell thereof
CN107390778A (en) * 2016-04-26 2017-11-24 联想(新加坡)私人有限公司 Housing part and electronic equipment
CN107390778B (en) * 2016-04-26 2020-06-05 联想(新加坡)私人有限公司 Case member and electronic device
CN110278671A (en) * 2018-03-13 2019-09-24 埃波罗-布克斯有限公司 The data logger of compact structure
CN110278671B (en) * 2018-03-13 2023-03-17 埃波罗-布克斯有限公司 Data recorder with compact structure

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Application publication date: 20140709

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