CN109117695A - Fingerprint mould group and electronic equipment equipped with the fingerprint mould group - Google Patents
Fingerprint mould group and electronic equipment equipped with the fingerprint mould group Download PDFInfo
- Publication number
- CN109117695A CN109117695A CN201710496456.5A CN201710496456A CN109117695A CN 109117695 A CN109117695 A CN 109117695A CN 201710496456 A CN201710496456 A CN 201710496456A CN 109117695 A CN109117695 A CN 109117695A
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- Prior art keywords
- mould group
- fingerprint
- circuit substrate
- fingerprint mould
- recognition structure
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
Abstract
The present invention relates to a kind of fingerprint mould group and the electronic equipment equipped with the fingerprint mould group, fingerprint mould group includes: circuit substrate, and described circuit substrate one end has bent grounding parts；Fingerprint recognition structure, has one end of the grounding parts set on the circuit substrate, and the fingerprint recognition structure is electrically connected with the circuit substrate；Frame, circumferentially surrounds the fingerprint recognition structure, and the grounding parts are bent to the frame direction to be electrically connected with the frame.Above-mentioned fingerprint mould group, the bent grounding parts that circuit substrate one end has are electrically connected and realize the grounding requirement of circuit substrate with frame, and stabilization simple for structure, without other connection structures are additionally arranged so that circuit substrate is grounded, to simplify the structure of the devices such as the touch panel equipped with the fingerprint mould group, difficulty of processing and production cost are reduced.
Description
Technical field
The present invention relates to fingerprint identification technology fields, more particularly to a kind of fingerprint mould group and the electricity equipped with the fingerprint mould group
Sub- equipment.
Background technique
A kind of input unit of the touch screen as man-machine interactive interface, is installed on various terminal equipment, is widely applied
More and more important role is played in people's life and social development in every field.In order to realize the touch function of screen
Can, therefore touch screen is made of multilayered structure, structure is complex.Also, due in the use process of terminal device, storage
Personal information is more and more, it is therefore desirable to which device encrypts terminal device.Since the fingerprint of people is common by nature-nurture
It acts on and is formed, complexity is applied not only to identify, and also has uniqueness and invariance, therefore using fingerprint recognition as one
The cipher mode that a little terminal devices use has good security performance, and it is simple and fast to facilitate identification process, facilitates behaviour
The use of author.
As the fingerprint mould group for completing fingerprint identification function, need specially to be arranged conductive material and structure so that fingerprint mould group
In circuit substrate ground connection, therefore cause equipped with the fingerprint mould group device structure it is more complicated, increase manufacture difficulty.
Summary of the invention
Based on this, it is necessary to for the complex problem of the ground structure of fingerprint mould group, provide a kind of with structure letter
The fingerprint mould group of single ground structure and electronic equipment equipped with the fingerprint mould group.
A kind of fingerprint mould group, comprising:
Circuit substrate, described circuit substrate one end have bent grounding parts；
Fingerprint recognition structure, set on the circuit substrate have the grounding parts one end, the fingerprint recognition structure with
The circuit substrate electrical connection；And
Frame, circumferentially surrounds the fingerprint recognition structure, the grounding parts to the frame direction bend with it is described
Frame electrical connection.
Above-mentioned fingerprint mould group, the bent grounding parts that circuit substrate one end has are electrically connected with frame and realize circuit
The grounding requirement of substrate, and stabilization simple for structure, without other connection structures are additionally set so that circuit substrate be grounded, thus
The structure for simplifying the devices such as the touch panel equipped with the fingerprint mould group, reduces difficulty of processing and production cost.
The circuit substrate includes conductive layer and coating, the coating part covering in one of the embodiments,
For the conductive layer to form base main body, the conductive layer not covered with the coating forms the grounding parts, the grounding parts
It is directly contacted with the frame.In this way, grounding parts are convenient to directly contact with frame and reach ground connection purpose, frame be may be selected
Property carry out further grounding, to meet different needs, without making circuit base by point conducting resinl or silver paste
Ground connection is connected with frame for plate.
The grounding parts are two in one of the embodiments, and two grounding parts are located at interval at the substrate master
The edge of body.It is well contacted in this way, being remained convenient for grounding parts with frame, and there is biggish contact area, to improve
Connective stability.
The inner sidewall of the frame has circumferentially surrounded position-limited edge, the fingerprint recognition knot in one of the embodiments,
Structure includes first end and the second end for being connected to the circuit substrate, and orthographic projection of the second end in the first end is located at
In the range of the first end, step surface is formed between the first end and the second end, the step surface is held in institute
State the end face of position-limited edge.In this way, frame is cooperated by the step surface with fingerprint recognition structure with fingerprint recognition structure, refer in receiving
Line avoids the increase of the thickness of the fingerprint mould group while identifying structure, to make thickness of the fingerprint mould group as thickness and frame
Roughly the same superthin structure is spent, and is equipped with display module, USB mould group etc. in the electronic equipment of the fingerprint mould group convenient for evacuation
Structure makes the structures such as display module, USB mould group have bigger installation space
The first adhesive layer is equipped between the position-limited edge and the step surface in one of the embodiments,.In this way, can make
The fingerprint mould group integrally has good sealing state, and environmental liquids is avoided to enter fingerprint between frame and fingerprint recognition structure
Module internal.
The second end of the fingerprint recognition structure is equipped with multiple pads to be electrically connected in one of the embodiments,
The circuit substrate, multiple pads are symmetrical arranged by symmetry axis of the central axis of the fingerprint recognition structure.In this way, weldering
Disk is adapted while the normal work for meeting the fingerprint mould group needs with the size of fingerprint recognition structure.
The one side edge that the second end of the fingerprint recognition structure is equipped with the pad in one of the embodiments, covers
There is sealant to close the gap between the circuit substrate and the fingerprint recognition structure.In this way, avoiding environmental liquids from electricity
Gap between base board and fingerprint recognition structure enters between circuit substrate and fingerprint recognition structure and influences the structures such as pad
Circuit normally, improve the sealing waterproof performance of fingerprint mould group.
The fingerprint mould group further includes cover board in one of the embodiments, and the cover board is covered in the fingerprint recognition
Structure is equipped with the second adhesive layer far from the circuit substrate side between the cover board and the fingerprint recognition structure.In this way, lid
Plate is fixed in fingerprint recognition structure by the second adhesive layer to be avoided being detached from from fingerprint recognition structure, and is further functioned as
Waterproof action avoids environmental liquids from entering in fingerprint mould group by the gap between cover board and fingerprint recognition structure.
The outer ledge of the frame is equipped with chamfering in one of the embodiments, and the chamfering is equipped with sealant.Such as
This, can prevent the corner of frame to be damaged, and the setting of sealant further improves the electronics equipped with the fingerprint mould group and sets
Standby waterproof performance.
Above-mentioned fingerprint mould group realizes the ultrathin of the fingerprint mould group.It is symmetrically set in the weldering of fingerprint recognition structure second end
Disk is electrically connected fingerprint recognition structure while with superthin structure with circuit substrate and can work normally.In addition, fingerprint is known
Other structure and fingerprint mould group are whole due to being equipped with the sealing structures such as the first adhesive layer, the integral waterproofing performance of the fingerprint mould group
And the complete machine waterproof performance of the electronic equipment equipped with the fingerprint mould group has reached IPX7, so that environmental liquids be avoided to influence this
The normal work of fingerprint mould group extends the stability and service life of the fingerprint mould group.
A kind of electronic equipment, including above-mentioned fingerprint mould group, the electronic equipment offer mounting groove, and the fingerprint mould group is embedding
In the mounting groove.
Above-mentioned electronic equipment is embedded with fingerprint mould group with higher waterproof performance and ultra-thin, and it is not necessary that electricity is separately provided
The ground structure of base board, therefore waterproof performance with higher is, it can be achieved that work steady in a long-term, and can further decrease
The volume of electronic equipment realizes the lightening of electronic equipment.Further, since fingerprint mould group is embedded in mounting groove completely, therefore
Fingerprint mould group can be installed from the front or back of touch panel, therefore bring convenience for processing assembling.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the fingerprint mould group side of an embodiment；
Fig. 2 is the structural schematic diagram of the other side of fingerprint mould group shown in FIG. 1；
Fig. 3 is the sectional view along A-A of fingerprint mould group shown in FIG. 1；
Fig. 4 is the schematic diagram of the circuit substrate of fingerprint mould group shown in FIG. 1；
Fig. 5 is the B-B direction cross-sectional view of circuit substrate shown in figure；
Fig. 6 is the explosive view of fingerprint mould group shown in FIG. 1；
Fig. 7 is the explosive view of the other direction of fingerprint mould group shown in FIG. 1；
Fig. 8 is the top view of the fingerprint recognition structure of fingerprint mould group shown in FIG. 1；
Fig. 9 is the side view of the fingerprint recognition structure of fingerprint mould group shown in FIG. 1；
Figure 10 is the bottom view of the fingerprint recognition structure of fingerprint mould group shown in FIG. 1；
Figure 11 is the schematic diagram of the touch panel equipped with fingerprint mould group of an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in Figure 1, Figure 2 and Figure 3, a kind of fingerprint mould group 100 of this preferred embodiment, including circuit substrate 10, fingerprint
Identify structure 20 and frame 30.
Wherein, 10 one end of circuit substrate has grounding parts 14.Fingerprint recognition structure 20, which is set to circuit substrate 10, has ground connection
The one end in portion 14, fingerprint recognition structure 20 are electrically connected with circuit substrate 10.Frame 30 circumferentially surrounds fingerprint recognition structure 20, connects
Ground portion 14 is bent to 30 direction of frame to be electrically connected with frame 30.
Above-mentioned fingerprint mould group 100, the bent grounding parts 14 that 10 one end of circuit substrate has be electrically connected with frame 30 and
The grounding requirement of circuit substrate 10, and stabilization simple for structure are realized, without other connection structures are additionally arranged so that circuit
Substrate 10 is grounded, to simplify the structure of the devices such as the touch panel 200 equipped with the fingerprint mould group 100, reduces difficult processing
Degree and production cost.
As shown in Fig. 3, Fig. 4 and Fig. 5, specifically, frame 30 is made of conductive metal material.Circuit substrate 10 includes
Conductive layer 11 and coating 12,12 part of coating cover conductive layer 11 to form base main body 13, not covered with coating 12
Conductive layer 11 form grounding parts 14, grounding parts 14 directly contact with frame 30 and achieve the purpose that ground connection.And it is basic herein
On, frame 30 optionally carries out further grounding, to meet different needs, and it is different from the prior art,
Needing, which is connected circuit substrate 10 and frame 30 by conducting resinl or silver paste, is grounded.
In the present embodiment, conductive layer 11 has certain flexibility for naked copper, and the bending angle of grounding parts 14 can root
It is arranged according to the shape of frame 30, therefore there is biggish degree flexible for installation.Coating 12 is to be covered on naked copper one or both sides
Cover film or ink.
Please refer to Fig. 4, Fig. 6 and Fig. 7, base main body 13 includes interconnecting piece 132 and is respectively arranged on the of 132 both ends of interconnecting piece
One mounting portion 134 and the second mounting portion 136.Fingerprint recognition structure 20 is set to the first mounting portion 134, and the first mounting portion 134 exists
Orthographic projection in fingerprint recognition structure 20 is located in the range of fingerprint recognition structure 20, and grounding parts 14 are located at the first mounting portion 134
It side and is at least partially disposed in 30 range of frame in the orthographic projection on frame 30, directly and frame with the bending of 30 direction of frame
30 electrical connections.Second mounting portion 136 is equipped with other elements that connector etc. is electrically connected with circuit substrate 10.
In the present embodiment, circuit substrate 10 is flexible circuit board, with Distribution density is high, light-weight, thickness is thin, bending
Property well equal feature.In one embodiment, fingerprint mould group 100 further includes stiffening plate 80, which is set to circuit substrate 10
Far from 20 side of fingerprint recognition structure, to improve the intensity of circuit substrate 10.
Further, grounding parts 14 are connected to 132 one side edge of interconnecting piece to the second mounting portion from the first mounting portion 134
136 direction extends, to be electrically connected to frame 30 close to the edge of 136 side of the second mounting portion.In the present embodiment, it is grounded
Portion 14 is generally rectangular shaped, and grounding parts 14 are two, and two grounding parts 14 are located at interval at the long side of the first mounting portion 134 and symmetrically set
It in 132 two sides of interconnecting piece, is well contacted consequently facilitating grounding parts 14 are remained with frame 30, there is biggish connect with frame 30
Contacting surface product, improves the stability of electrical connection.It is appreciated that the shape of grounding parts 14 and position are without being limited thereto, can set as needed
It sets.
Please continue to refer to Fig. 6, Fig. 7 and Fig. 8, frame 30 is in hollow structure, and the inner sidewall of frame 30 circumferentially surrounds limited
Position side 32, fingerprint recognition structure 20 include first end 22 and the second end 24 for being connected to circuit substrate 10, and second end 24 is first
Orthographic projection on end 22 is located in the range of first end 22.Step surface, the step surface are equipped between first end 22 and second end 24
It is held in the end face of position-limited edge 32, to be limited in frame 30.
In this way, frame 30 is cooperated by the step surface with fingerprint recognition structure 20 with fingerprint recognition structure 20, refer in receiving
Line identify structure 20 while avoid the fingerprint mould group 100 thickness increase, thus make fingerprint mould group 100 become thickness with
The roughly the same superthin structure of the thickness of frame 30, and convenient for evacuation equipped with the display in the electronic equipment of the fingerprint mould group 100
The structures such as mould group, USB mould group make the structures such as display module, USB mould group have bigger installation space.
In the present embodiment, frame 30, first end 22 and second end 24 cross section be in similar kidney-shaped, and first end 22
Cross section size be greater than second end 24 cross section size, to form step surface and be held in the position-limited edge of frame 30
32 end face.
Further, the first adhesive layer 40 is equipped between position-limited edge 32 and step surface, to keep the fingerprint mould group 100 whole
With good sealing state, environmental liquids is avoided to enter in fingerprint mould group 100 between frame 30 and fingerprint recognition structure 20
Portion.In the present embodiment, the first adhesive layer 40 is formed by double-sided adhesive.
As shown in Fig. 8, Fig. 9 and Figure 10, the first end 22 of fingerprint recognition structure 20 includes fingerprint chip dies 222 and is used for
Encapsulate EMC (epoxy molding plastic, the Epoxy molding compound) encapsulation 224 of fingerprint chip dies.Fingerprint recognition structure
20 second end 24 is equipped with pad 242 far from the end face of first end 22 with electrical connection circuit substrate 10.Fingerprint chip dies 222
It is connect by connection gold thread 226 with second end 24, so that the pad 242 by second end 24 connects circuit substrate 10.In this reality
It applies in example, second end 24 is wiring board.
Further, pad 242 is multiple, and multiple pads 242 are using the central axis of fingerprint recognition structure 20 as symmetry axis
It is symmetrical arranged, is adapted while the normal work for meeting the fingerprint mould group 100 needs with the size of fingerprint recognition structure 20.
Further, it is additionally provided with dummy pad 244 on the end face of the second end 24 of fingerprint recognition structure 20, the illusory weldering
Disk 244 increases bonding area, improve fall, the reliability in the test experiments such as static pressure, falling sphere, to improve fingerprint
The mechanical performance of mould group 100.
Specifically in the present embodiment, 242 quantity of pad is 22, and 22 242 two sides of pad are opposite to be equipped with two
A rosin joint pad 244.In the square that the middle part of the second end 24 of fingerprint recognition structure 20, ten arrangements of pad 242 are arranged in two rows five
Battle array arrangement, in addition 12 pads 242 are respectively arranged on above-mentioned ten 242 two sides of pad, and respectively in the matrix row of three rows two column
Cloth, two dummy pads 244 are located at 242 both ends of pad.It is appreciated that the quantity of pad 242 and dummy pad 244 and divides
Cloth is without being limited thereto, can be set as needed.
As shown in Fig. 2, Fig. 3 and Fig. 6, in one embodiment, the second end 24 of fingerprint recognition structure 20 is equipped with pad 242
One side edge is covered with sealant 50 using bottom filler technique, between closed circuit substrate 10 and fingerprint recognition structure 20
Gap avoids gap of the environmental liquids between circuit substrate 10 and fingerprint recognition structure 20 from entering circuit substrate 10 and fingerprint knowledge
The normally that the isostructural circuit of pad 242 is influenced between other structure 20, improves the sealing waterproofness of fingerprint mould group 100
Energy.
In one embodiment, fingerprint mould group 100 further includes cover board 60, and cover board 60 is covered in fingerprint recognition structure 20 far from electricity
10 side of base board is equipped with the second adhesive layer 70 between cover board 60 and fingerprint recognition structure 20, therefore cover board 60 is viscous by second
It closes layer 70 to be fixed in fingerprint recognition structure 20 and avoid being detached from from fingerprint recognition structure 20, and has further functioned as waterproof work
With avoiding environmental liquids from entering in fingerprint mould group 100 by the gap between cover board 60 and fingerprint recognition structure 20.In this implementation
In example, cover board 60 is ceramic material, and the second adhesive layer 70 is made of hot pressing glue.
In one embodiment, the outer ledge of frame 30 be equipped with chamfering to prevent the corner of frame to be damaged, chamfering
On can be coated with sealant.When the fingerprint mould group 100 is installed on the panel 200 of electronic equipment, on the frame 30 and panel 200
Sealant is filled in mounting groove, to further improve the waterproof performance of the electronic equipment equipped with the fingerprint mould group 100.
Above-mentioned fingerprint mould group 100, circuit substrate 10 are electrically connected ground connection with frame 30 by grounding parts 14, and by including
The frame 30 that the fingerprint recognition structure 20 and inside of first end 22 and second end 24 are equipped with edge cooperates, and realizes the fingerprint mould group
100 ultrathin.The pad 242 for being symmetrically set in 20 second end 24 of fingerprint recognition structure makes fingerprint recognition structure 20 with ultra-thin
It is electrically connected and can be worked normally with circuit substrate 10 while structure.In addition, fingerprint recognition structure 20 and fingerprint mould group 100 are whole
Due to equipped with the sealing structures such as the first adhesive layer 40, the integral waterproofing performance of the fingerprint mould group 100 and equipped with the fingerprint mould
The complete machine waterproof performance of the electronic equipment of group 100 has reached IPX7, so that environmental liquids be avoided to influence the fingerprint mould group 100
Normal work, extend the stability and service life of the fingerprint mould group 100.
As shown in figure 11, it is all kinds of to can be mobile phone, computer etc. for a kind of electronic equipment.The electronic equipment includes above-mentioned fingerprint
Mould group 100.
Electronic equipment offers mounting groove, and fingerprint mould group 100 is embedded in mounting groove.On the frame 30 of fingerprint mould group 100
Chamfering at can put marine glue to close its gap between mounting groove inner wall, to improve the complete machine waterproof of the electronic equipment
Performance.In this way, the fingerprint mould group 100 on the finger touch panel 200 of operator, can input fingerprint in the electronic equipment.
In the present embodiment, electronic equipment is equipped with panel 200, and mounting groove is opened on the panel 200.
Above-mentioned electronic equipment is embedded with fingerprint mould group 100 with higher waterproof performance and ultra-thin, and without being separately provided
The ground structure of circuit substrate 10, therefore waterproof performance with higher is, it can be achieved that work steady in a long-term, and can be further
The volume for reducing electronic equipment, realizes the lightening of electronic equipment.Further, since fingerprint mould group 100 is embedded at mounting groove completely
It is interior, therefore fingerprint mould group 100 can be installed from the front or back of touch panel 200, therefore be brought just for processing assembling
Benefit.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of fingerprint mould group characterized by comprising
Circuit substrate, described circuit substrate one end have bent grounding parts；
Fingerprint recognition structure, set on the circuit substrate have the grounding parts one end, the fingerprint recognition structure with it is described
Circuit substrate electrical connection；And
Frame, circumferentially surrounds the fingerprint recognition structure, the grounding parts to the frame direction bend with the frame
Electrical connection.
2. fingerprint mould group according to claim 1, which is characterized in that the circuit substrate includes conductive layer and coating,
The coating part covers the conductive layer to form base main body, and the conductive layer not covered with the coating forms described
Grounding parts, the grounding parts are directly contacted with the frame.
3. fingerprint mould group according to claim 2, which is characterized in that the grounding parts are two, two grounding parts
It is located at interval at the edge of the base main body.
4. fingerprint mould group according to claim 1, which is characterized in that the inner sidewall of the frame has circumferentially surrounded limit
Side, the fingerprint recognition structure include first end and the second end for being connected to the circuit substrate, and the second end is described
Orthographic projection on one end is located in the range of the first end, is formed with step surface between the first end and the second end,
The step surface is held in the end face of the position-limited edge.
5. fingerprint mould group according to claim 4, which is characterized in that be equipped with the between the position-limited edge and the step surface
One adhesive layer.
6. fingerprint mould group according to claim 4, which is characterized in that the second end of the fingerprint recognition structure is equipped with
For multiple pads to be electrically connected to the circuit substrate, multiple pads are symmetrical with the central axis of the fingerprint recognition structure
Axial symmetry setting.
7. fingerprint mould group according to claim 6, which is characterized in that the second end of the fingerprint recognition structure is equipped with described
The one side edge of pad is covered with sealant to close the gap between the circuit substrate and the fingerprint recognition structure.
8. fingerprint mould group according to claim 1, which is characterized in that the fingerprint mould group further includes cover board, the cover board
The fingerprint recognition structure is covered in far from the circuit substrate side, is equipped between the cover board and the fingerprint recognition structure
Second adhesive layer.
9. fingerprint mould group according to claim 1, which is characterized in that the outer ledge of the frame is equipped with chamfering, described
Chamfering is equipped with sealant.
10. a kind of electronic equipment, which is characterized in that described including fingerprint mould group as claimed in any one of claims 1 to 9 wherein
Electronic equipment offers mounting groove, and the fingerprint mould group is embedded in the mounting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710496456.5A CN109117695A (en) | 2017-06-26 | 2017-06-26 | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710496456.5A CN109117695A (en) | 2017-06-26 | 2017-06-26 | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109117695A true CN109117695A (en) | 2019-01-01 |
Family
ID=64821736
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710496456.5A Withdrawn CN109117695A (en) | 2017-06-26 | 2017-06-26 | Fingerprint mould group and electronic equipment equipped with the fingerprint mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109117695A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112560628A (en) * | 2020-12-07 | 2021-03-26 | 东莞华贝电子科技有限公司 | Side fingerprint identification mechanism and mobile terminal |
| CN114002935A (en) * | 2020-07-13 | 2022-02-01 | Oppo广东移动通信有限公司 | Wearable device |
-
2017
- 2017-06-26 CN CN201710496456.5A patent/CN109117695A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114002935A (en) * | 2020-07-13 | 2022-02-01 | Oppo广东移动通信有限公司 | Wearable device |
| CN112560628A (en) * | 2020-12-07 | 2021-03-26 | 东莞华贝电子科技有限公司 | Side fingerprint identification mechanism and mobile terminal |
| CN112560628B (en) * | 2020-12-07 | 2024-04-12 | 东莞华贝电子科技有限公司 | Side fingerprint identification mechanism and mobile terminal |
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| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 Nanchang Avenue, Nanchang high tech Zone, Nanchang, Jiangxi 1189 Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190101 |