CN109299637A - Fingerprint mould group and fingerprint recognition panel equipped with the fingerprint mould group - Google Patents
Fingerprint mould group and fingerprint recognition panel equipped with the fingerprint mould group Download PDFInfo
- Publication number
- CN109299637A CN109299637A CN201710612967.9A CN201710612967A CN109299637A CN 109299637 A CN109299637 A CN 109299637A CN 201710612967 A CN201710612967 A CN 201710612967A CN 109299637 A CN109299637 A CN 109299637A
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- Prior art keywords
- fingerprint
- mould group
- substrate
- fingerprint mould
- chip
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Classifications
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Security & Cryptography (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention relates to a kind of fingerprint mould group and the fingerprint recognition panel equipped with the fingerprint mould group, fingerprint mould group includes: substrate, and conductive layer and coating including stacking, coating part is covered in conductive layer；Fingerprint chip, on the coating of substrate；Support structure is set to substrate far from fingerprint chip-side；Conductive layer is exposed to the region outside coating and forms conduction region, and the conductive layer not covered with coating forms conduction region, and conduction region is set around fingerprint chip and is electrically connected to support structure.Above-mentioned fingerprint mould group, since substrate is equipped with the conduction region for being electrically connected to support structure, therefore in the fingerprint mould group use process, the electrostatic beaten in fingerprint mould group can import support structure by conduction region, and then the smart machine complete machine for being equipped with the fingerprint mould group is imported by support structure, therefore it can reach antistatic effect in the case where no setting is required components such as antistatic becket, reduce the volume of fingerprint mould group.
Description
Technical field
The present invention relates to fingerprint identification device field, in particular to a kind of fingerprint mould group and the fingerprint equipped with the fingerprint mould group
Identify panel.
Background technique
A kind of input unit of the touch screen as man-machine interactive interface, is installed on various terminal equipment, is widely applied
More and more important role is played in people's life and social development in every field.In order to realize the touch function of screen
Can, therefore touch screen is made of multilayered structure, structure is complex.Also, due in the use process of terminal device, storage
Personal information is more and more, it is therefore desirable to which device encrypts terminal device.Since the fingerprint of people is common by nature-nurture
It acts on and is formed, complexity is applied not only to identify, and also has uniqueness and invariance, therefore using fingerprint recognition as one
The cipher mode that a little terminal devices use has good security performance, and it is simple and fast to facilitate identification process, facilitates behaviour
The use of author.
As the fingerprint mould group for completing fingerprint identification function, the becket being usually provided with around fingerprint chip makes fingerprint mould
Group ground connection is antistatic to achieve the effect that, the fingerprint mould group is avoided to damage under the action of electrostatic in use.And metal
The setting of ring improves the production and application cost of the fingerprint mould group, while increasing the volume of fingerprint mould group and being unfavorable for fingerprint mould
The compact in size and lightening development of group.
Summary of the invention
Based on this, it is necessary to will increase use cost and whole body while realizing anti-static function for fingerprint mould group
Long-pending problem, the fingerprint mould group for increasing use cost and volume can be avoided and be equipped with while realizing electrostatic function by providing one kind
The fingerprint recognition panel of the fingerprint mould group.
A kind of fingerprint mould group, comprising:
Substrate, conductive layer and coating including stacking, the coating part are covered in the conductive layer；
Fingerprint chip on the substrate and is electrically connected with the substrate；And
Support structure is set to the substrate far from the fingerprint chip-side；
Wherein, the conductive layer is exposed to the formation of the region outside coating conduction region, and the conduction region is set around institute
It states fingerprint chip and is electrically connected to the support structure.
Above-mentioned fingerprint mould group, since substrate is equipped with the conduction region for being electrically connected to support structure, in the fingerprint
In mould group use process, the electrostatic beaten in fingerprint mould group can be discharged into conduction region from the air gap around fingerprint chip,
Then support structure is imported by conduction region, and then imports the intelligence for being equipped with the fingerprint mould group by support structure
Equipment complete machine, therefore can reach antistatic effect in the case where no setting is required components such as antistatic becket, thus simple
The structure for having changed the fingerprint mould group, reduces the volume of fingerprint mould group, has saved the production cost of fingerprint mould group, is conducive to be equipped with
The lightening development of the smart machine of the fingerprint mould group.
The fingerprint chip is equipped with pad, the contact pads close to the substrate side in one of the embodiments,
For the substrate to be electrically connected with the substrate, the substrate further includes insulating layer, the insulating layer cover the substrate not in contact with
The region of the pad.In this way, avoiding environmental liquids from flowing to substrate surface from the gap around fingerprint chip and playing conductive work
With and influence the normal work of the fingerprint mould group.And the air when electrostatic is beaten in fingerprint mould group, around fingerprint chip
And the insulating layer can be punctured and conduct to conduction region by being discharged into the electrostatic on substrate.
The conduction region is set around fingerprint chip periphery and forms one end equipped with notch in one of the embodiments,
Semiclosed cyclic structure, the coating positioned at the conduction region inner side and outer side is connected to through the notch, the fingerprint
Chip is located on the coating on the inside of the conduction region.In this way, the electrostatic beaten around fingerprint chip can be by being set around
The conduction region of fingerprint chip imports in support structure, at the same time, since the indentation, there of conduction region is still covered with covering
Layer, therefore electrical interconnection can be set by the indentation, there, to make to be electrically connected by the substrate that fingerprint chip covers with exterior part
It connects, the setting of conduction region is avoided to influence the normal work of substrate.
The conduction region is filled between the fingerprint chip edge and the substrate edges in one of the embodiments,
Region.In this way, the conduction region has biggish area, to further promote antistatic effect.
The support structure includes reinforcement conductive sheet in one of the embodiments, and the reinforcement conductive sheet is set to
The substrate is far from the fingerprint chip-side.In this way, reinforcement conductive sheet can while providing support for substrate conducting static electricity.
The support structure further includes conduct piece in one of the embodiments, and the conduct piece is set to the benefit
Strong conductive sheet is far from the substrate side.In this way, conduct piece can continue to import electrostatic into the smart machine for being equipped with the fingerprint mould group
Complete machine.
The conductive layer is formed by conducting foam or conductive double sided adhesive tape in one of the embodiments,.In this way, conducting foam
It is covered on the surface of reinforcement conductive sheet with conductive double sided adhesive tape, and shape and the shape of reinforcement conductive sheet match, there is processing letter
Folk prescription just the characteristics of.
The substrate is flexible circuit board or Rigid Flex in one of the embodiments,.In this way, coating can be removed
To form conduction region, and have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good etc..
Edge of the fingerprint chip close to described substrate one end has along the fingerprint in one of the embodiments,
The holding tank of the circumferentially extending of chip, the holding tank is interior to be filled with sealant.In this way, sealing fingerprint chip by sealant
While gap between substrate, sealant can be contained in holding tank completely and be not take up other spaces, to reduce
The size of the fingerprint mould group, be conducive to fingerprint mould group it is compact in size with it is lightening.
A kind of fingerprint recognition panel, including above-mentioned fingerprint mould group, the fingerprint recognition panel includes fingerprint recognition panel
Main body, the fingerprint recognition panel body offer mounting groove, and the fingerprint mould group is embedded in the mounting groove, the fingerprint
The outer ledge of chip is bonded with the side wall of the mounting groove.
Above-mentioned fingerprint recognition panel, due to the fingerprint mould group that is provided with no setting is required around fingerprint chip antistatic gold
Belong to ring, and electrostatic is imported into the smart machine complete machine equipped with the fingerprint recognition panel by the way that conduction region is arranged on substrate, therefore
Be conducive to the lightening development of the fingerprint recognition panel while ensure that antistatic effect.
Detailed description of the invention
Fig. 1 is the cross-sectional view of the fingerprint mould group of an embodiment；
Fig. 2 is the top view of fingerprint mould group shown in FIG. 1；
Fig. 3 is the top view of the substrate of fingerprint mould group shown in FIG. 1；
Fig. 4 is A-A of substrate shown in Fig. 3 to cross-sectional view；
Fig. 5 is the cross-sectional view of the fingerprint recognition panel of an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give preferred embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more saturating
It is thorough comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in Figures 1 and 2, a kind of fingerprint mould group 20 in this preferred embodiment, including substrate 21, fingerprint chip 23 and
Support structure 25.
Specifically, substrate 21 includes the conductive layer 212 and coating 214 of stacking, and 214 part of coating is covered in conductive layer
212.Fingerprint chip 23 is set on substrate 21 and is electrically connected with substrate 21, and support structure 25 is set to substrate 21 far from fingerprint core
23 side of piece.Wherein, conductive layer 212 is exposed to the formation of the region outside coating 214 conduction region 216, and conduction region 216 is set around finger
Line chip 23 is simultaneously electrically connected to support structure 25.
Above-mentioned fingerprint mould group 20 is electrically connected to the conduction region 216 of support structure 25 since substrate 21 is equipped with,
In 20 use process of fingerprint mould group, the electrostatic beaten in fingerprint mould group 20 can be from the air gap around fingerprint chip 23
It is discharged into conduction region 216, support structure 25 is then imported by conduction region 216, and then lead by support structure 25
Enter to be equipped with the smart machine complete machine of the fingerprint mould group 20, therefore in the case where no setting is required components such as antistatic becket i.e.
It can reach antistatic effect, to simplify the structure of the fingerprint mould group 20, reduce the volume of fingerprint mould group 20, save
The production cost of fingerprint mould group 20 is conducive to the lightening development of the smart machine equipped with the fingerprint mould group 20.
In the present embodiment, substrate 21 is flexible circuit board, so as to remove coating 214 to form conduction region 216,
And have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good etc..It is appreciated that in other embodiments, base
Plate 21 can also be Rigid Flex.
Please refer to FIG. 1 to FIG. 4, fingerprint chip 23 is equipped with pad close to 21 side of substrate, contact pads substrate 21 with base
Plate 21 is electrically connected.Substrate 21 further includes insulating layer 219, and insulating layer 219 covers substrate 21 and plays not in contact with the region of pad absolutely
Edge effect, avoids environmental liquids from flowing to 21 surface of substrate from the gap around fingerprint chip 23 and play electric action and influence this
The normal work of fingerprint mould group 20.And when electrostatic is beaten in fingerprint mould group 21, air around fingerprint chip 23 and release
The electrostatic being put on substrate 21 can puncture the insulating layer 219 and conduct to conduction region 216.Specifically in the present embodiment, insulating layer
219 ink by being coated in 21 surface of substrate is formed.
Conduction region 216 is set around 23 periphery of fingerprint chip and forms the semiclosed cyclic structure that one end is equipped with notch 218, position
Coating 214 in 216 inner side and outer side of conduction region is connected to through notch 218, and fingerprint chip 23 is located at covering for 216 inside of conduction region
On cap rock 214.In this way, the electrostatic beaten around fingerprint chip 23 can be imported by being set around the conduction region 216 of fingerprint chip 23
In support structure 25, at the same time, since notch 2162 is connected to inside and outside conduction region 216, it can be lacked by this
Setting electrical interconnection avoids conduction to make to be electrically connected by the substrate 21 that fingerprint chip 23 covers with exterior part at mouth 218
The setting in area 216 influences the normal work of substrate 21.
Further, conduction region 216 is filled in the region between 21 edge of 23 edge of fingerprint chip and substrate certainly.In this way,
The conduction region 216 has biggish area, to further promote antistatic effect.
Specifically in the present embodiment, the cross section of fingerprint chip 23 is in kidney-shaped, and substrate 21 includes base main body and from base
The interconnecting piece that plate main body extends.Fingerprint chip 23 is set in base main body, and base main body is also substantially in kidney-shaped and fingerprint chip 23
In the range of the orthographic projection in base main body is located at base main body, so that reserving certain area forms conduction region 216.Substrate master
The notch of conduction region 216 on body is located at the junction of interconnecting piece and base main body, consequently facilitating base main body is walked with interconnecting piece
Line.
Please continue to refer to Fig. 1, in one embodiment, support structure 25 includes reinforcement conductive sheet 252 and conduct piece
254, reinforcement conductive sheet 252 is set to substrate 21 far from 23 side of fingerprint chip, and it is separate that conduct piece 254 is set to reinforcement conductive sheet 252
21 side of substrate.In this way, reinforcement conductive sheet 252 can while providing support for substrate 21 conducting static electricity, electrostatic is led
Electric part 254, conduct piece 254 then continue to import electrostatic into the smart machine complete machine for being equipped with the fingerprint mould group 20.Specifically in this implementation
In example, reinforcement conductive sheet 252 is reinforcement steel disc, and conduct piece 254 is formed by conducting foam or conductive double sided adhesive tape.Conducting foam with lead
Electric double-sided adhesive is covered on the surface of reinforcement conductive sheet 252, and shape and the shape of reinforcement conductive sheet 252 match, and has processing
Simple and convenient feature.
Edge of the fingerprint chip 23 close to 21 one end of substrate has the holding tank of the circumferentially extending along fingerprint chip 23
232, sealant 27 is filled in holding tank 232.In this way, being sealed between fingerprint chip 23 and substrate 21 by sealant 27
While gap, sealant 27 can be contained in holding tank 232 completely and be not take up other spaces, to reduce the fingerprint mould
Group 20 size, be conducive to fingerprint mould group 20 it is compact in size with it is lightening.
In one embodiment, fingerprint chip 23 is also covered with cover board 29 far from 21 side of substrate, which has insulation
Effect can play a protective role to fingerprint chip 23, avoid the directly contact external environment of fingerprint chip 23 and damage, and make to refer to
Line chip 23 has certain insulation performance, to make the electrostatic beaten in fingerprint mould group 20 preferentially from the sky around fingerprint chip 23
Conduction region 216 is discharged into air cleft gap.
Above-mentioned fingerprint mould group 20, no setting is required surround the antistatic becket of fingerprint chip 23, and passes through on the base plate (21
Conduction region 216 is set, electrostatic is imported to the smart machine complete machine for being equipped with the fingerprint mould group 20, with preferable antistatic effect
The structure for simplifying the fingerprint mould group 20 simultaneously, has saved production cost, and reduce the volume of the fingerprint mould group 20, has been conducive to
Fingerprint mould group 20 it is compact in size and lightening.In addition, the holding tank 232 of 23 edge of fingerprint chip can accommodate completely it is close
Sealing 27, to further reduce the volume of the fingerprint mould group 20 while reaching good sealed waterproof effect.
As shown in figure 5, a kind of fingerprint recognition panel 100 of this better embodiment, including above-mentioned fingerprint mould group 20.
Specifically, fingerprint recognition panel 100 further includes fingerprint recognition panel body 60, and fingerprint recognition panel body 60 opens up
There is mounting groove, the shape of mounting groove has the matching of fingerprint mould group 20, and fingerprint mould group 20 is at least partly embedded in mounting groove, fingerprint mould
The outer ledge of group 20 is bonded with the side wall of mounting groove.In this way, no setting is required the parts such as becket of fingerprint mould group 20 and directly set
In on fingerprint recognition panel 100, to reduce the lightening development for being conducive to the fingerprint recognition panel 100.
Further, the edge of the substrate 21 of fingerprint mould group 20 is also arranged with water proof ring 40, fingerprint recognition panel body 60
It is covered on the water proof ring 40, to improve the sealing waterproof performance of the fingerprint recognition panel 100.In the present embodiment, waterproof
Circle 40 is made of waterproof foam rubber.It is appreciated that the material of water proof ring 40 is without being limited thereto, can be set as needed.
Further, which, which adopts, is made from an insulative material, therefore beats the electrostatic in fingerprint mould group 20
Understand in the preferentially air gap between mounting groove inner sidewall and fingerprint chip 23 and be discharged on conduction region 216, so that realizing should
The good antistatic effect of fingerprint recognition panel 100.
Above-mentioned fingerprint recognition panel 100, since no setting is required around fingerprint chip 23 for the fingerprint mould group 20 that is provided with
Antistatic becket, and electrostatic is imported to the intelligence for being equipped with the fingerprint recognition panel 100 by setting conduction region 216 on the base plate (21
Can equipment complete machine, therefore be conducive to while ensure that antistatic effect the lightening development of the fingerprint recognition panel 100.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of fingerprint mould group characterized by comprising
Substrate, conductive layer and coating including stacking, the coating part are covered in the conductive layer；
Fingerprint chip on the substrate and is electrically connected with the substrate；And
Support structure is set to the substrate far from the fingerprint chip-side；
Wherein, the conductive layer is exposed to the formation of the region outside coating conduction region, and the conduction region is set around the finger
Line chip is simultaneously electrically connected to the support structure.
2. fingerprint mould group according to claim 1, which is characterized in that the fingerprint chip is equipped with close to the substrate side
Pad, substrate described in the contact pads is to be electrically connected with the substrate, and the substrate further includes insulating layer, and the insulating layer covers
The substrate is covered not in contact with the region of the pad.
3. fingerprint mould group according to claim 1, which is characterized in that the conduction region is set around fingerprint chip periphery
And form one end and set semiclosed cyclic structure jaggy, described in the coating warp positioned at the conduction region inner side and outer side
Notch connection, the fingerprint chip are located on the coating on the inside of the conduction region.
4. fingerprint mould group according to claim 3, which is characterized in that the conduction region is filled in the fingerprint chip edge
With the region between the substrate edges.
5. fingerprint mould group according to claim 1, which is characterized in that the support structure includes reinforcement conductive sheet,
The reinforcement conductive sheet is set to the substrate far from the fingerprint chip-side.
6. fingerprint mould group according to claim 5, which is characterized in that the support structure further includes conduct piece, institute
Conduct piece is stated set on the reinforcement conductive sheet far from the substrate side.
7. fingerprint mould group according to claim 6, which is characterized in that the conductive layer is by conducting foam or conductive double sided adhesive tape
It is formed.
8. fingerprint mould group according to claim 1, which is characterized in that the substrate is flexible circuit board or soft or hard combination
Plate.
9. fingerprint mould group described in any one according to claim 1~8, which is characterized in that the fingerprint chip is close to described
The edge of substrate one end has the holding tank of the circumferentially extending along the fingerprint chip, is filled with sealing in the holding tank
Glue.
10. a kind of fingerprint recognition panel, which is characterized in that including fingerprint mould group as claimed in any one of claims 1 to 9 wherein,
The fingerprint recognition panel includes fingerprint recognition panel body, and the fingerprint recognition panel body offers mounting groove, the finger
Line mould group is at least partly embedded in the mounting groove, and the outer ledge of the fingerprint chip and the side wall of the mounting groove paste
It closes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710612967.9A CN109299637A (en) | 2017-07-25 | 2017-07-25 | Fingerprint mould group and fingerprint recognition panel equipped with the fingerprint mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710612967.9A CN109299637A (en) | 2017-07-25 | 2017-07-25 | Fingerprint mould group and fingerprint recognition panel equipped with the fingerprint mould group |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109299637A true CN109299637A (en) | 2019-02-01 |
Family
ID=65167296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710612967.9A Withdrawn CN109299637A (en) | 2017-07-25 | 2017-07-25 | Fingerprint mould group and fingerprint recognition panel equipped with the fingerprint mould group |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109299637A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110320972A (en) * | 2019-05-20 | 2019-10-11 | 华为技术有限公司 | A kind of fingerprint recognition mould group and a kind of electronic equipment |
| CN111144339A (en) * | 2019-12-30 | 2020-05-12 | 业成科技（成都）有限公司 | Fingerprint recognition module and electronic device |
| CN113065389A (en) * | 2021-02-03 | 2021-07-02 | 深圳阜时科技有限公司 | Fingerprint chip, fingerprint chip module and electronic equipment |
| CN113556639A (en) * | 2021-06-29 | 2021-10-26 | 荣成歌尔微电子有限公司 | SIP module and TWS earphone |
-
2017
- 2017-07-25 CN CN201710612967.9A patent/CN109299637A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110320972A (en) * | 2019-05-20 | 2019-10-11 | 华为技术有限公司 | A kind of fingerprint recognition mould group and a kind of electronic equipment |
| WO2020233562A1 (en) * | 2019-05-20 | 2020-11-26 | 华为技术有限公司 | Fingerprint recognition module and electronic device |
| CN110320972B (en) * | 2019-05-20 | 2022-05-06 | 荣耀终端有限公司 | A fingerprint identification module and an electronic device |
| CN111144339A (en) * | 2019-12-30 | 2020-05-12 | 业成科技（成都）有限公司 | Fingerprint recognition module and electronic device |
| CN111144339B (en) * | 2019-12-30 | 2023-03-24 | 业泓科技(成都)有限公司 | Fingerprint identification module and electronic device |
| CN113065389A (en) * | 2021-02-03 | 2021-07-02 | 深圳阜时科技有限公司 | Fingerprint chip, fingerprint chip module and electronic equipment |
| CN113556639A (en) * | 2021-06-29 | 2021-10-26 | 荣成歌尔微电子有限公司 | SIP module and TWS earphone |
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Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
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Application publication date: 20190201 |