CN208421844U - Fingerprint mould group and electronic device - Google Patents
Fingerprint mould group and electronic device Download PDFInfo
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- CN208421844U CN208421844U CN201821118811.1U CN201821118811U CN208421844U CN 208421844 U CN208421844 U CN 208421844U CN 201821118811 U CN201821118811 U CN 201821118811U CN 208421844 U CN208421844 U CN 208421844U
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- diversion trench
- mould group
- support plate
- protective case
- fingerprint
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Abstract
The application provides a kind of fingerprint mould group and electronic device.The fingerprint mould group is applied to electronic device, comprising: protective case, the protective case form accommodating chamber；Fingerprint recognition chip, the fingerprint recognition chip are at least partially housed in the accommodating chamber；Support plate; the support plate is used to support the fingerprint recognition chip; the support plate is at least partially housed in the accommodating chamber; the support plate includes the first surface away from the fingerprint recognition chip; the first surface is bonded the protective case; the at least partly described first surface offers diversion trench, and colloid is provided in the diversion trench, and the support plate is fixedly connected by the colloid with the protective case.The technical solution of the application helps to realize the water proof and dust proof of fingerprint mould group.
Description
Technical field
This application involves electronic technology field more particularly to a kind of fingerprint mould group and electronic devices.
Background technique
Along with the development of development of Mobile Internet technology, mobile Internet terminal user identification information safety problem is increasingly
It is prominent, end of appearing in the newspapers repeatly the case where identity identification information is stolen and personation due to causes user's economic loss.Conventional password formula identity
Identifying schemes, there is low efficiency, time-consuming, safety is low and it is cumbersome the problems such as, gradually become current mobile interchange
The universal short slab problem of network technology development.Fingerprint identification technology can efficiently solve the above problem.In traditional technology, fingerprint mould group
In for protect fingerprint recognition chip steel plate and between the Silicone Case of water proof and dust proof use two-sided glue connection, but
Be double-sided adhesive reliability it is not high, be easy to be unfavorable for waterproof and dustproof so that Silicone Case is detached from from steel plate, once water inlet,
It may cause fingerprint mould group failure.
Utility model content
The application provides a kind of fingerprint mould group, is applied to electronic device, and the fingerprint mould group includes:
Protective case, the protective case form accommodating chamber；
Fingerprint recognition chip, the fingerprint recognition chip are at least partially housed in the accommodating chamber；
Support plate, the support plate are used to support the fingerprint recognition chip, and the support plate is at least partially housed in institute
Accommodating chamber is stated, the support plate includes the first surface away from the fingerprint recognition chip, and the first surface is bonded the guarantor
Sheath, at least partly described first surface offer diversion trench, are provided with colloid in the diversion trench, and the colloid is by the branch
Fagging is fixedly connected with the protective case.
Fingerprint mould group provided by the present application includes the fingerprint recognition chip being stacked and support plate, and fingerprint mould group further includes
Protective case, the protective case form accommodating chamber, and the fingerprint recognition chip is partially housed in the accommodating chamber, and the support plate
It is partially housed in the accommodating chamber, the support plate offers diversion trench far from the surface of the fingerprint recognition chip, described to lead
Colloid is provided in chute, the support plate is fixedly connected by the colloid with the protective case.Compared to being adopted in traditional technology
With the mode of two-sided gluing knot, the technical solution of the application can make the connection between the support plate and the protective case more
Add securely, to help to realize the water proof and dust proof of fingerprint mould group.
The application also provides a kind of electronic device, and the electronic device includes fingerprint mould group as described above.
Detailed description of the invention
It, below will be to use required in embodiment in order to illustrate more clearly of the technical solution of the application embodiment
Attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is some embodiments of the application, for this field
For those of ordinary skill, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 (a) is the structural schematic diagram for the fingerprint mould group that the embodiment of the present application one provides.
Fig. 1 (b) is the structural schematic diagram of support plate in the embodiment of the present application one.
Fig. 2 is the structural schematic diagram of support plate in the fingerprint mould group of the offer of the embodiment of the present application two.
Fig. 3 is the structural schematic diagram of support plate in the fingerprint mould group of the offer of the embodiment of the present application three.
Fig. 4 (a) is the structural schematic diagram of support plate in the fingerprint mould group of the offer of the embodiment of the present application four.
Fig. 4 (b) is that the section of diversion trench in Fig. 4 (a) forms the schematic diagram of groove.
Fig. 5 is the structural schematic diagram for the fingerprint mould group that the embodiment of the present application five provides.
Fig. 6 is the structural schematic diagram for the fingerprint mould group that the embodiment of the present application six provides.
Fig. 7 is the structural schematic diagram for the electronic device that one preferred embodiment of the application provides.
Specific embodiment
Below in conjunction with the attached drawing in the application embodiment, the technical solution in the application embodiment is carried out clear
Chu is fully described by, it is clear that described embodiment is only a part of embodiment of the application, rather than whole realities
Apply mode.Based on the embodiment in the application, those of ordinary skill in the art institute under that premise of not paying creative labor
The every other embodiment obtained, shall fall in the protection scope of this application.
Show also referring to the structure that Fig. 1 (a) and Fig. 1 (b), Fig. 1 (a) are the fingerprint mould groups that the embodiment of the present application one provides
It is intended to.Fig. 1 (b) is the structural schematic diagram of support plate in the embodiment of the present application one.In the present embodiment, the fingerprint mould group 10 is answered
For electronic device 1 (please referring to Fig. 7), the fingerprint mould group 10 includes protective case 100, fingerprint recognition chip 200 and support plate
300.The protective case 100 forms accommodating chamber 100A；The fingerprint recognition chip 200 is at least partially housed in the accommodating chamber
100A.The support plate 300 is used to support the fingerprint recognition chip 200, and the support plate 300 is at least partially housed in described
Accommodating chamber 100A, the support plate 300 include the first surface 300a away from the fingerprint recognition chip 200, first table
Face 300a is bonded the protective case 100, and at least partly described first surface 300a offers diversion trench 400, the diversion trench 400
It is inside provided with colloid 500, the support plate 300 is fixedly connected by the colloid 500 with the protective case 100.
Optionally, the support plate 300 includes support portion 310 and the edge part extended from 310 edge of support portion
320, the support portion 310 is used to support the fingerprint recognition chip 200, and the diversion trench 400 is arranged in the edge part
320.At this point it is possible to avoid interference of the diversion trench 400 to support portion 310, and then avoid colloid 500 to fingerprint recognition chip 200
Influence, help to ensure that the identification sensitivity of fingerprint mould group 10.
Wherein, fingerprint recognition chip 200 is used to acquire the finger print information of user, refers to the chip of embedded fingerprint identification technology
Product is capable of the chip that on piece realizes the Image Acquisition of fingerprint, feature extraction, aspect ratio pair.The protective case 100 is silica gel
Set, for carrying out water proof and dust proof protection to fingerprint mould group 10.
Wherein, the colloid 500 is the solid adhesive formed after solidifying via liquid state colloid, or via liquid
The adhesive for the semisolid semi liquid state that colloid is formed after solidifying, the diversion trench 400 are used to flow for the liquid state colloid, liquid
The colloid 500 that state colloid is formed after solidifying is for being fixedly connected support plate 300 and protective case 100.Optionally, the glue
Body 500 is epoxy resin crystal glue-dropping, is made of high-purity epoxy resin, curing agent and its other modifications.Its cured product tool
Have the characteristics that water-fast, resistant to chemical etching, glittering and translucent.It can play a good protective effect to the surface of fingerprint mould group 10, may be used also
Increase its lustrous surface and brightness, further increases surface decoration effect.
Optionally, diversion trench 400 can extend straight, and curved can also extend.The quantity of the diversion trench 400 can
Think one, or a plurality of.The diversion trench 400 can be spaced setting, can also intersect.
Wherein, support plate 300 is steel disc stiffening plate, and for supporting and fixing to the formation of fingerprint recognition chip 200, composition refers to
The fingerprint bracket of line mould group 10.
The fingerprint mould group 10 that the technical program provides includes the fingerprint recognition chip 200 being stacked and support plate 300, is referred to
Line mould group 10 further includes protective case 100, and the protective case 100 forms accommodating chamber 100A, and 200 part of fingerprint recognition chip is received
It is dissolved in the accommodating chamber 100A, and the support plate 300 is partially housed in the accommodating chamber 100A, the support plate 300 is separate
The surface of the fingerprint recognition chip 200 offers diversion trench 400, and colloid 500, the glue are provided in the diversion trench 400
The support plate 300 is fixedly connected by body 500 with the protective case 100.Double-sided adhesive 600 is used to bond compared in traditional technology
Mode, the technical solution of the application can make the connection between the support plate 300 and the protective case 100 more firm
Gu to help to realize the water proof and dust proof of fingerprint mould group 10.
It is the structure of support plate in the fingerprint mould group of the offer of the embodiment of the present application two also referring to Fig. 1 (a) and Fig. 2, Fig. 2
Schematic diagram.The structure of embodiment two and the structure of embodiment one are essentially identical, the difference is that, it is in the present embodiment, described
In a ring, the protective case 100 covers at least partly described diversion trench 400 to diversion trench 400.
Specifically, in one embodiment, the 100 covering part diversion trench 400 of protective case, and the diversion trench
400 in a ring.Therefore, when towards filling liquid colloid in the diversion trench 400, liquid state colloid can be along the diversion trench
400 flowings, the colloid 500 that liquid state colloid is formed after solidifying fill entire diversion trench 400, so that protective case 100 and support
Plate 300 closely links together, to realize the water proof and dust proof effect of protective case 100, helps to extend fingerprint mould group 10
Service life.
Optionally, in another embodiment, the protective case 100 includes connected set ontology 110 and lug boss
120, the lug boss 120 extends from the set ontology 110 towards the support portion 310 of the support plate 300, the lug boss
120 are alternatively arranged, diversion trench 400 described in 120 covering part of lug boss, form gap between two neighboring lug boss 120
1112, the gap 1112 can be used for filling colloid 500.When towards filling colloid 500 in the gap 1112, so that
Protective case 100 and support plate 300 closely link together, to realize the water proof and dust proof effect of protective case 100, facilitate
Extend the service life of fingerprint mould group 10.And the colloid 500 can closely connect the lug boss 120 and the support plate 300
It connects, can prevent the protective case 100 from falling off, facilitate the water proof and dust proof performance for ensuring the fingerprint mould group 10.
It is the structure of support plate in the fingerprint mould group of the offer of the embodiment of the present application three also referring to Fig. 1 (a) and Fig. 3, Fig. 3
Schematic diagram.The structure of embodiment three and the structure of embodiment two are essentially identical, the difference is that, it is in the present embodiment, described
Diversion trench 400 includes the second sub- diversion trench 420 of the first sub- diversion trench 410 and annular of annular, the first sub- diversion trench 410
It is connected to the described second sub- diversion trench 420, the first sub- diversion trench 410 is arranged around the described second sub- diversion trench 420, the guarantor
Sheath 100 all covers the first sub- diversion trench 410, and 100 part of the protective case covers the second sub- diversion trench
420。
Specifically, the first sub- diversion trench 410 and the second sub- diversion trench 420 are in a ring, first son is led
It is connected between chute 410 and the second sub- diversion trench 420 by connectivity slot 430.In a better embodiment, the connection
The depth of slot 430 and the first sub- diversion trench 410 and the second sub- diversion trench 420 is consistent, so that colloid
500 can flow freely in the connectivity slot 430 and the first sub- diversion trench 410 and the second sub- diversion trench 420,
And then the protective case 100 and support plate 300 is fixed glued, so as to which protective case 100 and support plate 300 are connected more
Step up close, preferably realizes the water proof and dust proof effect of the fingerprint mould group 10.It should be noted that the item number of diversion trench 400 is not
Two are limited to, can be more items.
Optionally, the quantity of the connectivity slot 430 can be one, or a plurality of.When the number of the connectivity slot 430
When amount is a plurality of, the connectivity slot 430 is uniformly distributed in the support plate 300, and away from the branch of the support plate 300
The diverging distribution of support part 310, and then improve the glued efficiency between protective case 100 and support plate 300.
Further, when all the first sub- diversion trenches 410 of covering, and the second son of 100 part of protective case covering of protective case 100
When diversion trench 420, the colloid 500 can be filled from the second sub- diversion trench 420, so that colloid 500 passes through the connectivity slot 430
Into in the first sub- diversion trench 410, and due to whole the first sub- diversion trench 410 of covering of protective case 100, when colloid 500 enters the
When one sub- diversion trench 410, the gluing between protective case 100 and support plate 300 can be made even closer.In a preferable embodiment party
In formula, since the described second sub- diversion trench 420 is for filling colloid 500, the width of the second sub- diversion trench 420 is big
In the width of the described first sub- diversion trench 410, so as to preferably complete the movement of filler, and helps avoid leak adhesive, lacks
The problem of glue.
It is the finger that the embodiment of the present application four provides also referring to Fig. 1 (a), Fig. 1 (b), Fig. 4 (a) and Fig. 4 (b), Fig. 4 (a)
The structural schematic diagram of support plate in line mould group.Fig. 4 (a) is the structural schematic diagram of the AA cross-sectional view of support plate in Fig. 1 (b).Fig. 4
It (b) is that the section of diversion trench in Fig. 4 (a) forms the schematic diagram of groove.The structure of example IV and the structure of embodiment one are basic
It is identical, the difference is that, in the present embodiment, the diversion trench 400 includes bottom wall 410, the first side wall 420 and second sidewall
430, the bottom wall 410 connects the first side wall 420 and the second sidewall 430, the first side wall 420 and described second
Side wall 430 is oppositely arranged, and the first side wall 420 is arranged compared to the second sidewall 430 adjacent to the support portion 310, until
The angle formed between the bottom wall 410 and the first side wall 420 of small part diversion trench 400 is obtuse angle.
Wherein, the first side wall 420 intersects with the first surface 300a, the second sidewall 430 and described first
Surface 300a intersection.
Optionally, the angle formed between the bottom wall 410 and second sidewall 430 of at least partly diversion trench 400 is obtuse angle.
Specifically, the section of the diversion trench 400 forms groove 450, the groove 450 by connected first segment 450a,
Second segment 450b and third section 450c enclose and set to be formed, the first segment 450a and the third section 450c and the first surface
300a intersection, the third section 450c are arranged adjacent to the center of the support plate 300.The second segment 450b and the third section
450c is straight line, and the first angle α 1 between the second segment 450b and the third section 450c is obtuse angle.Described first
Section 450a is straight line, and the second angle α 2 between the first segment 450a and the second segment 450b is also obtuse angle.
Optionally, at least partly the first side wall 420 of diversion trench 400 is curved surface, and the center of curvature of curved surface deviates from
The support portion 310.The i.e. described third section 450c is curve, and the center of curvature of the third section 450c, which is located at, deviates from the support
The side in portion 310.
Optionally, in a better embodiment, it is arranged in the bottom wall 410, the first side wall 420 and second sidewall 430
There is micro-structure, the micro-structure is used to increase the adhesive force of the colloid 500, and the attachment surface for increasing the colloid 500
Product.The micro-structure is evenly distributed, and the micro-structure can be the structure of splitter shape, can cover more colloids 500, from
And make the connection between protective case 100 and support plate 300 even closer, preferably realize the water proof and dust proof effect of fingerprint mould group 10
Fruit extends the service life of fingerprint mould group 10.
Referring to Fig. 5, Fig. 5 is the structural schematic diagram for the fingerprint mould group that the embodiment of the present application five provides.The knot of embodiment five
Structure and the structure of embodiment one are essentially identical, the difference is that, in the present embodiment, described in the first surface 300a fitting
The position of protective case 100 is provided with double-sided adhesive 600, and the double-sided adhesive 600 at least partly covers the diversion trench 400, described double
Face glue 600 is for the support plate 300 to be fixedly connected with the protective case 100.
Specifically, in one embodiment, the 600 one side covering part diversion trench 400 of double-sided adhesive, another party
Face, the double-sided adhesive 600 directly fit with protective case 100 and support plate 300, thus by the support plate 300 and described
Protective case 100 is fixedly connected.Optionally, in another embodiment, the double-sided adhesive 600 all covers the diversion trench
400, when filling colloid 500 in the diversion trench 400, the double-sided adhesive 600 can cover the colloid 500, thus to institute
The effect that colloid 500 plays sealing is stated, prevents the colloid 500 from overflowing, influences the performance of fingerprint mould group 10.
Referring to Fig. 6, Fig. 6 is the structural schematic diagram for the fingerprint mould group that the embodiment of the present application six provides.The knot of embodiment six
Structure and the structure of embodiment one are essentially identical, the difference is that, in the present embodiment, the fingerprint mould group 10 further includes flexibility
Circuit board 700, the flexible circuit board 700 are located at side of the support plate 300 far from the fingerprint recognition chip 200, institute
Flexible circuit board 700 is stated to be electrically connected with the fingerprint recognition chip 200.
Wherein, flexible circuit board 700 (Flexible Printed Circuit, FPC) is with polyimides or polyester
Film is that one kind made of substrate has height reliability, excellent flexible printed circuit.The high, weight with Distribution density
Gently, the feature that thickness is thin, bending is good.
Specifically, one end of the flexible circuit board 700 is electrically connected with the fingerprint recognition chip 200, the other end and electricity
The main circuit board of sub-device is electrically connected.When user presses the fingerprint recognition chip 200 of fingerprint mould group 10, the flexible electrical
Road plate 700 receives the fingerprint signal of the fingerprint recognition chip 200, and fingerprint signal is sent to main circuit board, the main electricity
Road plate sends feedback signal according to the fingerprint signal, and the feedback signal is sent to fingerprint recognition by flexible circuit board 700
Chip 200, to realize the fingerprint identification function of the fingerprint mould group 10.
Referring to Fig. 7, Fig. 7 is the structural schematic diagram for the electronic device that one preferred embodiment of the application provides.The electronics
Device 1 includes the fingerprint mould group 10 that any embodiment as above provides.
Optionally, the electronic device 1 can be any equipment for having communication and store function.Such as: tablet computer,
Mobile phone, electronic reader, remote controler, personal computer (Personal Computer, PC), laptop, mobile unit,
Web TV, wearable device etc. have the smart machine of network function.
Optionally, the electronic device 1 includes cover board 910, the display panel 920, backlight module being cascading
930, center 940 and rear cover 950.Fingerprint mould group 10 can be located at the viewing area 1A of the display panel 920 of electronic device 1.This reality
The attached drawing for applying example is illustrated so that fingerprint mould group 10 is located at the viewing area 1A of electronic device 1 as an example, when fingerprint mould group 10 is located at electricity
When the viewing area 1A of the display panel 920 of sub-device 1, constitutes and shield lower fingerprint, since fingerprint mould group is located at viewing area 1A,
The screen accounting for helping to improve electronic device 1 helps to realize comprehensive screen design of electronic device 1.
It should be understood that in other embodiments, fingerprint mould group 10 can be located at the display panel 920 of electronic device 1
Non-display area, on rear cover 950 or center 940.
The embodiment of the present application is described in detail above, specific case used herein to the principle of the application and
Embodiment is expounded, the description of the example is only used to help understand the method for the present application and its core ideas；
At the same time, for those skilled in the art can in specific embodiments and applications according to the thought of the application
There is change place, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (11)
1. a kind of fingerprint mould group, it is applied to electronic device, which is characterized in that the fingerprint mould group includes:
Protective case, the protective case form accommodating chamber；
Fingerprint recognition chip, the fingerprint recognition chip are at least partially housed in the accommodating chamber；
Support plate, the support plate are used to support the fingerprint recognition chip, and the support plate is at least partially housed in the receipts
Cavity, the support plate include the first surface away from the fingerprint recognition chip, and the first surface is bonded the protective case,
At least partly described first surface offers diversion trench, is provided with colloid in the diversion trench, and the colloid is by the support plate
It is fixedly connected with the protective case.
2. fingerprint mould group as described in claim 1, which is characterized in that the diversion trench in a ring, the protective case cover to
Diversion trench described in small part.
3. fingerprint mould group as claimed in claim 2, which is characterized in that the diversion trench include annular the first sub- diversion trench and
Second sub- diversion trench of annular, the first sub- diversion trench are connected to the second sub- diversion trench, and the first sub- diversion trench surrounds
The second sub- diversion trench setting, the protective case all covers the first sub- diversion trench, and the protective case part covers
The second sub- diversion trench.
4. fingerprint mould group as described in claim 1, which is characterized in that the support plate includes support portion and from the support portion
The edge part that edge extends, the support portion are used to support the fingerprint recognition chip, and the diversion trench is arranged at the edge
Portion.
5. fingerprint mould group as claimed in claim 4, which is characterized in that the diversion trench includes bottom wall, the first side wall and second
Side wall, the bottom wall connect the first side wall and the second sidewall, and the first side wall is opposite with the second sidewall to be set
It sets, the first side wall is arranged compared to the second sidewall adjacent to the support portion, at least partly the bottom wall of diversion trench and
The angle formed between one side wall is obtuse angle.
6. fingerprint mould group as claimed in claim 5, which is characterized in that at least partly between the bottom wall and second sidewall of diversion trench
The angle of formation is obtuse angle.
7. fingerprint mould group as claimed in claim 5, which is characterized in that at least partly the first side wall of diversion trench is song
Face, and the center of curvature of curved surface deviates from the support portion.
8. fingerprint mould group as described in claim 1, which is characterized in that the first surface offers recessed portion, at least partly
The setting of diversion trench described in the recessed portion face, the recessed portion is for colloid described in accommodating portion.
9. fingerprint mould group as described in claim 1, which is characterized in that the position that the first surface is bonded the protective case is set
It is equipped with double-sided adhesive, the double-sided adhesive at least partly covers the diversion trench, and the double-sided adhesive is used for the support plate and described
Protective case is fixedly connected.
10. fingerprint mould group as described in any one of claims 1-9, which is characterized in that the fingerprint mould group further include:
Flexible circuit board, the flexible circuit board is located at side of the support plate far from the fingerprint recognition chip, described soft
Property circuit board is electrically connected with the fingerprint recognition chip.
11. a kind of electronic device, which is characterized in that the electronic device includes such as the described in any item fingerprints of claim 1-10
Mould group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821118811.1U CN208421844U (en) | 2018-07-13 | 2018-07-13 | Fingerprint mould group and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821118811.1U CN208421844U (en) | 2018-07-13 | 2018-07-13 | Fingerprint mould group and electronic device |
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| Publication Number | Publication Date |
|---|---|
| CN208421844U true CN208421844U (en) | 2019-01-22 |
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ID=65124226
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821118811.1U Active CN208421844U (en) | 2018-07-13 | 2018-07-13 | Fingerprint mould group and electronic device |
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| CN (1) | CN208421844U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109711393A (en) * | 2019-02-19 | 2019-05-03 | 昆山丘钛微电子科技有限公司 | Fingerprint recognition mould group and electronic product |
| CN109863507A (en) * | 2019-01-23 | 2019-06-07 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
-
2018
- 2018-07-13 CN CN201821118811.1U patent/CN208421844U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109863507A (en) * | 2019-01-23 | 2019-06-07 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| WO2020150939A1 (en) * | 2019-01-23 | 2020-07-30 | 深圳市汇顶科技股份有限公司 | Fingerprint recognition apparatus and electronic device |
| CN109711393A (en) * | 2019-02-19 | 2019-05-03 | 昆山丘钛微电子科技有限公司 | Fingerprint recognition mould group and electronic product |
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