CN109863507A - Fingerprint identification device and electronic equipment - Google Patents

Abstract

It provides a kind of fingerprint identification device and electronic equipment, fingerprint identification device is applied in the electronic equipment with display screen, fingerprint identification device includes: support plate；At least one fingerprint sensor chip, at least one fingerprint sensor chip are set to the upper surface of support plate；Fixing piece, fixing piece are set to the lower section of support plate；Wherein, fixing piece is used to be mounted on the center of electronic equipment, so that at least one fingerprint fingerprint sensor chip is located at the lower section of the display screen of electronic equipment.In the embodiment of the present application, by support plate and fixing piece, the cost and complexity of electronic equipment can reduce, and improve its maintenanceability.Particularly directed under the scene of multiple fingerprint sensor chips, installation complexity can be effectively reduced, and improve the installation effectiveness of fingerprint sensor chip.

Description

Fingerprint identification device and electronic equipment

Technical field

The present embodiments relate to electronic fields, and more particularly, to fingerprint identification device and electronic equipment.

Background technique

Optics or ultrasonic fingerprint identification mould group are fitted in organic light-emitting diodes currently, shielding lower fingerprinting scheme and referring to The bottom of (Organic Light-Emitting Diode, OLED) screen is managed, that is, also regardless of optical finger print identification mould group It is that ultrasonic fingerprint identification mould group requires together with bottom of screen luminescent layer tight bond.

But it directly fits since OLED screen curtain cost is very high and very fragile, therefore by fingerprint recognition mould group to OLED screen It is easy to make a mess of OLED screen curtain when curtain.Further, since fingerprint recognition mould group and OLED screen curtain are fully adhered to together, fingerprint such as occur It identifies the damage of mould group, damage OLED screen curtain is easy to when dismantling fingerprint recognition mould group.Moreover, fingerprint recognition mould group is directly pasted The attaching process for closing OLED screen curtain is also more complicated.

Due to problem above, the cost and complexity of electronic equipment are considerably increased, maintenanceability is low.

Summary of the invention

A kind of fingerprint identification device and electronic equipment are provided, can reduce the cost and complexity of electronic equipment, is improved Maintenanceability.Particularly directed under the scene of multiple fingerprint sensor chips, can be effectively reduced electronic equipment cost and Complexity substantially increases maintenanceability.

In a first aspect, providing a kind of fingerprint identification device, apply in the electronic equipment with display screen, the fingerprint is known Other device includes:

Support plate；

At least one fingerprint sensor chip, at least one described fingerprint sensor chip are set to the upper of the support plate Surface；

Fixing piece, the fixing piece are set to the lower section of the support plate；

Wherein, the fixing piece is used to be mounted on the center of the electronic equipment, so that at least one described fingerprint fingerprint Sensor chip is located at the lower section of the display screen of the electronic equipment；At least one described fingerprint fingerprint sensor chip is for connecing Receive the fingerprint detection signal for reflecting or scattering via the human finger above the display screen and return, the fingerprint detection signal For detecting the finger print information of the finger.

In the embodiment of the present application, after at least one described fingerprint sensor chip is fixedly installed in support plate, it can pass through Support plate is fixedly installed on the internal parts such as the center of electronic equipment by the fixed plate, avoid by it is described at least one refer to Line sensor chip is directly attached on the display screen of the electronic equipment, can reduce at least one described fingerprint sensor core The installation difficulty and complexity of piece, and improve maintenanceability.In addition, including more at least one described fingerprint sensor chip Under the scene of a chip, the multiple chip can be one-time fixed to the lower section for being installed on display screen, it is multiple to can reduce installation Miscellaneous degree, and improve installation effectiveness.

Second aspect provides a kind of electronic equipment, comprising:

Fingerprint identification device and display screen described in any possible display mode in first aspect or first aspect；Its In, the lower section of the display screen is arranged in realize fingerprint detection under screen in the fingerprint identification device.

The electronic equipment of the embodiment of the present application, at least one fingerprint that can not only be reduced in the fingerprint identification device pass The installation difficulty and complexity of sensor chip, and can be improved maintenanceability.In addition, at least one described fingerprint sensing Device chip includes that the multiple chip can be one-time fixed to the lower section for being installed on display screen, energy under the scene of multiple chips It is enough to reduce installation complexity, and improve installation effectiveness.

Detailed description of the invention

Fig. 1 is the floor map for the electronic equipment that the application can be applicable in.

Fig. 2 is the side diagrammatic cross-section of electronic equipment shown in FIG. 1.

Fig. 3 is the schematic block diagram of the fingerprint identification device of the embodiment of the present application.

Fig. 4 is the schematic diagram of the assembling fixture of the fingerprint identification device of the embodiment of the present application.

Fig. 5 is the schematic diagram of the center of the electronic equipment of the embodiment of the present application.

Fig. 6 is the side diagrammatic cross-section of the electronic equipment with fingerprint identification device shown in Fig. 3 of the embodiment of the present application.

Fig. 7 is the schematic diagram after the electronic equipment disassembly with fingerprint identification device shown in Fig. 3 of the embodiment of the present application.

Specific embodiment

Below in conjunction with attached drawing, technical solutions in the embodiments of the present application is described.

The technical solution of the embodiment of the present application can be applied to various electronic equipments.

For example, the portable or mobiles such as smart phone, laptop, tablet computer, game station calculate equipment, and Other electronic equipments such as electronic databank, automobile, ATM (automatic teller machine) (Automated Teller Machine, ATM).But The embodiment of the present application does not limit this.

The technical solution of the embodiment of the present application can be used for biometrics identification technology.Wherein, biometrics identification technology The including but not limited to identification technologies such as fingerprint recognition, personal recognition, iris recognition, recognition of face and vivo identification.In order to just In explanation, hereafter it is illustrated by taking fingerprint identification technology as an example.

The technical solution of the embodiment of the present application can be used for shielding lower fingerprint identification technology and shield interior fingerprint identification technology.

Fingerprint identification technology, which refers to, under shielding is mounted on fingerprint recognition mould group below display screen, to realize in display screen Fingerprint recognition operation is carried out in display area, does not need the region setting fingerprint collecting in electronic equipment front in addition to display area Region.Specifically, fingerprint recognition mould group carries out fingerprint induction using the light that the top surface of the display component from electronic equipment returns With other inductive operations.The light of this return carries the information of the object (such as finger) contacted with the top surface of display component, position Fingerprint recognition mould group below display component by acquisition and detects the light of this return to realize the lower fingerprint recognition of screen.Its In, the design of fingerprint recognition mould group can be for by being configured to acquire and detect the optical element of the light returned properly come real Existing desired optical imagery.

Correspondingly, (In-display) fingerprint identification technology refers to fingerprint recognition mould group or partial fingerprints identification in screen Mould group is mounted on inside display screen, is carried out fingerprint recognition operation in the display area of display screen to realize, is not needed in electricity Fingerprint collecting region is arranged in region of the sub- equipment front in addition to display area.

Figures 1 and 2 show that shielding the schematic diagram for the electronic equipment 100 that lower fingerprint identification technology can be applicable in, wherein Fig. 1 is The front schematic view of electronic equipment 100, Fig. 2 are the cut-away section structural schematic diagram of electronic equipment 100 shown in FIG. 1.

As depicted in figs. 1 and 2, electronic equipment 100 may include display screen 120 and fingerprint recognition mould group 140.

Display screen 120 can be self light emitting display panel, use with self luminous display unit as display pixel.Than As display screen 120 can for Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen or Micro-led (Micro-LED) display screen.In other alternate embodiments, display screen 120 or liquid crystal Display screen (Liquid Crystal Display, LCD) or other passive light emitting displays, the embodiment of the present application do not limit this System.

In addition, display screen 120 can also be specially touching display screen, it can not only carry out picture and show, can also examine Touch or the pressing operation for surveying user, to provide a personal-machine interactive interface for user.For example, in one embodiment, Electronic equipment 100 may include touch sensor, the touch sensor can be specially touch panel (Touch Panel, TP), it can be set on 120 surface of display screen, partially can also integrate or be monolithically integrated into the display screen 120 Portion, to form the touching display screen.

Fingerprint recognition mould group 140 can identify mould group, such as optical fingerprint sensor for optical finger print.

Specifically, fingerprint recognition mould group 140 may include having the fingerprint sensor chip (back of optical sensor array Also referred to as optical fingerprint sensor).Wherein, optical sensor array includes multiple optical sensor units, each optical sensor unit Optical detector or photoelectric sensor can be specifically included.In other words, fingerprint recognition mould group 140 may include optical detector (Photo detector) array (or being photodetector array, photosensor arrays) comprising multiple is in array The optical detector of distribution.

As shown in Figure 1, the regional area in the lower section of the display screen 120 can be set in fingerprint recognition mould group 140, thus So that the fingerprint collecting region (or detection zone) 130 of fingerprint recognition mould group 140 is at least partially disposed at the aobvious of the display screen 120 Show in region 102.

Certainly, in other alternate embodiments, fingerprint recognition mould group 140 also be can be set in other positions, such as aobvious The non-transparent region in edge of the side or electronic equipment 100 of display screen 120.In this case, it can will be shown by light path design The optical signal of at least partly display area of display screen 120 directs into fingerprint recognition mould group 140, so that the fingerprint collecting area Domain 130 is physically located in the display area of the display screen 120.

In some embodiments of the present application, fingerprint recognition mould group 140 can only include a fingerprint sensor chip, this When fingerprint recognition mould group 140 fingerprint collecting region 130 area it is smaller and position is fixed, therefore user is carrying out fingerprint input When need for finger to be pressed into the specific position in the fingerprint collecting region 130, otherwise fingerprint recognition mould group 140 possibly can not adopt Collect fingerprint image and causes user experience bad.

In other embodiments of the application, fingerprint recognition mould group 140 can specifically include multiple fingerprint sensor cores Piece；The multiple fingerprint sensor chip can be disposed side by side on the lower section of the display screen 120 by connecting method, and described The induction region of multiple fingerprint sensor chips collectively forms the fingerprint collecting region 130 of the fingerprint recognition mould group 140.Namely It is to say, the fingerprint collecting region 130 of the fingerprint recognition mould group 140 may include multiple subregions, and each subregion is right respectively It should be in the induction region of one of fingerprint sensor chip, thus by the fingerprint collecting region of the optical finger print mould group 130 130 can extend to the main region of the lower half portion of the display screen, that is, the usual pressing area of finger be expanded to, to realize It is blind to be operated by the input of formula fingerprint.Alternatively, when the fingerprint sensor chip quantity is enough, the fingerprint detection region 130 can be extended to half of display area even entire display area, to realize half screen or full frame fingerprint detection.

It should be understood that the embodiment of the present application to the concrete form of the multiple fingerprint sensor chip without limitation.

It, can also be with for example, the multiple fingerprint sensor chip can be the fingerprint sensor chip of individual packages respectively The multiple chips (Die) being packaged in the same chip package body.

In another example can also be made in the different zones of the same chip (Die) by semiconductor technology described in formation Multiple fingerprint sensor chips.

As shown in Fig. 2, the region of the optical sensor array of fingerprint recognition mould group 140 or photoinduction range correspond to institute State the fingerprint collecting region 130 of fingerprint recognition mould group 140.Wherein, the fingerprint collecting region 130 of fingerprint recognition mould group 140 can be with Equal or different to the area or photoinduction range of the region of the optical sensor array of fingerprint recognition mould group 140, this Shen Please embodiment be not specifically limited in this embodiment.

For example, the light path design collimated by light, the fingerprint collecting region 130 of fingerprint recognition mould group 140 can be designed Area at the induction arrays with the fingerprint recognition mould group 140 is almost the same.

In another example the fingerprint can be made by the light path design of the light path design or reflection light that converge light Identify that the area in the fingerprint collecting region 130 of mould group 140 is greater than the area of 140 induction arrays of fingerprint recognition mould group.

The light path design of fingerprint recognition mould group 140 is illustrated below.

With the light path design of fingerprint recognition mould group 140 use with high-aspect-ratio through-hole array optics collimator for Example, the optics collimator can be specially collimator (Collimator) layer being made in semi-conductor silicon chip, have Multiple collimation units or micropore, the collimation unit can be specially aperture, from the reflected reflected light of finger, vertically The light for being incident on the collimation unit can be passed through and be received by fingerprint sensor chip below, and incident angle is excessive Light be attenuated inside the collimation unit by multiple reflections, therefore each fingerprint sensor chip substantially can only The reflected reflected light of fingerprint lines right above it is received, image resolution ratio can be effectively improved, and then improve fingerprint Recognition effect.

It further, can be each fingerprint sensing when fingerprint recognition mould group 140 includes multiple fingerprint sensor chips An optical sensor unit in the optical sensor array of device chip configures a collimation unit, and it is corresponding at its to be bonded setting The top of optical sensor unit.Certainly, the multiple optical sensor unit can also share a collimation unit, i.e., one Collimation unit has sufficiently large aperture to cover multiple optical sensor units.Since a collimation unit can correspond to multiple light Sensing unit is learned, the correspondence of the space periodic of display screen 120 and the space periodic of fingerprint sensor chip is destroyed, therefore, Even if the space structure of the optical sensor array of the space structure and fingerprint sensor chip of the luminescence display array of display screen 120 It is similar, it also can effectively avoid fingerprint recognition mould group 140 from carrying out fingerprint imaging using the optical signal by display screen 120 and generate not That striped, effectively increases the fingerprint recognition effect of fingerprint recognition mould group 140.

By taking light path design of the light path design of fingerprint recognition mould group 140 using optical lens as an example, the optical lens can To include optical lens (Lens) layer, there is one or more lens units, such as one or more non-spherical lens compositions Lens group, be used to that the induction battle array of fingerprint sensor chip below will to be converged to from the reflected reflected light of finger Column, so that the induction arrays can be imaged based on the reflected light, to obtain the fingerprint image of the finger.Institute Pin hole can also be formed in the optical path of the lens unit by stating optical lens mirror layer, and the pin hole can cooperate the optical lens Mirror layer expands the visual field of fingerprint recognition mould group 140, to improve the fingerprint imaging effect of the fingerprint recognition mould group 140.

Further, it when fingerprint recognition mould group 140 includes multiple fingerprint sensor chips, can be passed for each fingerprint Sensor chip configures an optical lens and carries out fingerprint imaging, or configures an optical lens for multiple fingerprint sensor chips To realize light convergence and fingerprint imaging.Even, when there are two induction arrays (Dual for a fingerprint sensor chip tool Array) or when multiple induction arrays (Multi-Array), or the configuration of this fingerprint sensor chip is two or more Optical lens cooperates described two induction arrays or multiple induction arrays to carry out optical imagery, to reduce image-forming range and enhance Imaging effect.

By taking light path design of the light path design of fingerprint recognition mould group 140 using lenticule (Micro-Lens) layer as an example, institute Stating microlens layer can have the microlens array formed by multiple lenticules, can by semiconductor growing process or its His technique is formed in above the induction arrays of the fingerprint sensor chip, and each lenticule can correspond respectively to institute State one of sensing unit of induction arrays.Other optics can also be formed between the microlens layer and the sensing unit Film layer, such as dielectric layer or passivation layer, more specifically, can also include tool between the microlens layer and the sensing unit There is the light blocking layer of micropore, wherein the micropore is formed between its corresponding lenticule and sensing unit, the light blocking layer can be with Stop the optical interference between contiguous microlens and sensing unit, and converges to light in the micropore by the lenticule Portion is simultaneously transferred to the corresponding sensing unit of the lenticule via the micropore, to carry out optical finger print imaging.

It should be appreciated that several implementations of above-mentioned optical path guide structure can be used alone and can also be used in combination, than Such as, microlens layer can be further set below the collimator layer or the optical lens mirror layer.Certainly, in the collimation Device layer when perhaps the optical lens mirror layer is used in combination with the microlens layer its specific laminated construction or optical path may need It is adjusted according to actual needs.

Fingerprint recognition mould group 140 can be used for acquiring the finger print information (such as information in fingerprint) of user.

By taking display screen 120 is using OLED display screen as an example, display screen 120 can be using aobvious with spontaneous light display unit Display screen, such as Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen or miniature luminous Diode (Micro-LED) display screen.Fingerprint recognition mould group 140 can use OLED display screen be located at fingerprint collecting region The excitation light source that 130 display unit (i.e. OLED light source) detects as optical finger print.

When finger touch, press or close to (for ease of description, referred to collectively herein as pressing) in fingerprint collecting area When domain 130, display screen 120 issues light beam to the finger of 130 top of fingerprint collecting region, this light beam is sent out on the surface of finger It is raw to reflect to form reflected light or form scattering light after the scattering-in of finger, in the related patent applications, for convenient for Description, above-mentioned reflected light and scattering light are referred to as reflected light.Due to fingerprint ridge (ridge) with valley (vally) for the anti-of light Ability difference is penetrated, therefore, reflected light from fingerprint ridge and was occurred from fingerprint valley with different light intensity, reflected light passes through After crossing display screen 120, corresponding electric signal is received and converted to by the fingerprint sensor chip in fingerprint recognition mould group 140, That is fingerprint detection signal；Fingerprint image data can be obtained based on the fingerprint detection signal, and can be with further progress Fingerprint matching verifying, to realize optical finger print identification function in the electronic equipment 100.

It can be seen that only being needed when user needs to carry out unlocked by fingerprint or other fingerprint authentications to electronic equipment 100 By finger pressing in the fingerprint collecting region 130 for being located at display screen 120, the input operation of fingerprint characteristic can be realized.By It can be realized in the inside of the display area of display screen 120 102 in the acquisition of fingerprint characteristic, electronic equipment using the above structure 100 are arranged fingerprint key (such as Home key) without the special reserved space in its front, thus can be using screen scheme comprehensively.Cause This, the display area 102 of the display screen 120 can extend substantially to the entire front of the electronic equipment 100.

Certainly, in other alternative solutions, fingerprint recognition mould group 140 can also using built-in light source or external light source come Optical signal for carrying out fingerprint detection identification is provided.In this case, fingerprint recognition mould group 140 not only can be adapted for as The self light emitting display panels such as OLED display screen can be applicable to non-spontaneous smooth display screen, such as liquid crystal display or others Passive light emitting display.

For applying in the liquid crystal display with backlight module and liquid crystal display panel, under the screen to support liquid crystal display Fingerprint detection, the optical fingerprint systems of electronic equipment 100 can also include the excitation light source for optical finger print detection, described to swash The light source that light source can be specially infrared light supply or specific wavelength non-visible light is encouraged, can be set in the liquid crystal display Backlight module below or the fringe region that is arranged in below the cover sheet of electronic equipment 100, and fingerprint recognition mould group 140 It can be set below the fringe region of liquid crystal display panel or cover sheet and guided by optical path so that fingerprint detection light can be with Reach the fingerprint recognition mould group 140；Alternatively, fingerprint recognition mould group 140 also can be set below the backlight module, and institute Backlight module is stated by carrying out aperture or other optical designs to film layers such as diffusion sheet, blast piece, reflector plates to allow fingerprint Detection light passes through liquid crystal display panel and backlight module and reaches fingerprint recognition mould group 140.It is adopted when using the fingerprint recognition mould group 140 When providing the optical signal for carrying out fingerprint detection with built-in light source or external light source, testing principle can be identical.

As shown in Figure 1, electronic equipment 100 can also include cover sheet 110.

Cover board 110 can be specially transparent cover plate, such as glass cover-plate or sapphire cover board, be located at display screen 120 Top and cover the front of the electronic equipment 100, and 110 surface of cover board is also provided with protective layer.Therefore, the application In embodiment, so-called finger pressing display screen 120 can actually refer to that finger presses cover board square on the display screen 120 110 or the covering cover board 110 protective layer.

As shown in Figure 1, the lower section of fingerprint recognition mould group 140 is also provided with circuit board 150, such as flexible circuit board (Flexible Printed Circuit, FPC).

Fingerprint recognition mould group 140 can by pad solder to circuit board 150, and by circuit board 150 realize and other The electrical interconnection and signal transmission of the other elements of peripheral circuit or electronic equipment 100.For example, fingerprint recognition mould group 140 can To receive the control signal of the processing unit of electronic equipment 100 by circuit board 150, and can also be incited somebody to action by circuit board 150 The processing unit of fingerprint detection signal output electron equipment 100 from fingerprint recognition mould group 140 or control unit etc..

In certain embodiments, fingerprint identification device 140 can directly fix the lower surface for being fitted in display screen 120.

But since 120 cost of display screen is very high and very fragile, therefore fingerprint recognition mould group 140 is directly fitted to aobvious It is easy to make a mess of display screen 120 when display screen 120.

Further, since fingerprint recognition mould group 140 and display screen 120 are fully adhered to together, such as there is fingerprint recognition mould group 140 Damage is easy to damage display screen 120 when dismantling fingerprint recognition mould group 140.

Also, the attaching process that fingerprint recognition mould group 140 is directly attached to display screen 120 is also more complicated.

Due to problem above, the cost and complexity of electronic equipment 100 are considerably increased, maintenanceability is low.

This application provides a kind of fingerprint identification devices, can reduce the cost and complexity of electronic equipment 100, improve Maintenanceability.

The fingerprint identification device 200 and electronic equipment 300 of the embodiment of the present application are described in detail below with reference to Fig. 3 to Fig. 7. It should be noted that for purposes of illustration only, in the embodiment of the present application, identical appended drawing reference for indicating identical component, and And for sake of simplicity, in different embodiments, omit the detailed description to same parts.

Fig. 3 is the schematic block diagram of the fingerprint identification device 200 of the embodiment of the present application.

Optionally, as shown in figure 3, fingerprint identification device 200 may include at least one fingerprint sensor chip 210 and branch Fagging 230, at least one described fingerprint sensor chip 210 can be set in the upper surface of the support plate 230.Specifically, As shown in figure 3, at least one described fingerprint sensor chip 210 may include 4 fingerprint sensor chips 210,4 fingers Line sensor chip 210 can be disposed side by side on the upper surface of the support plate 230, to be spliced into an optical fingerprint sensor 210 component of chip.

Specifically, each fingerprint sensor chip 210 can be fitted in the support plate 230 by the fixed glue 211 of chip Upper surface.Optionally, the fixed glue 211 of the chip can be solid-state glue or liquid glue.For example, the fixed glue of the chip 211 can be double-sided adhesive or glue.

Further, the fingerprint identification device 200 can also include fixing piece.The fixing piece can be rigid reinforcement Plate.The shape of the fixing piece can be the regular shapes such as rectangle or ellipse.For example, the fixing piece can be rectangular Shape.

The lower section of the support plate 230 is arranged in the fixing piece, for the support plate 230 to be fixedly mounted on electronics The internal parts such as the center of equipment, and at least one described fingerprint sensor chip 210 is allowed to be located at the electronics Below the display screen of equipment；At least one described fingerprint sensor chip 210 is for receiving via the people above the display screen The fingerprint detection signal of the reflection of body finger or scattering and return, wherein the fingerprint detection signal is used to detect the finger of the finger Line information.

The center etc. that support plate 230 is fixedly installed in electronic equipment by the fixing piece in the embodiment of the present application is internal Component avoids and directly at least one described fingerprint recognition chip 210 is mounted on the display screen of the electronic equipment, can The installation difficulty and complexity of at least one fingerprint sensor chip 210 are reduced, and improves maintenanceability.In addition, being directed to The multiple fingerprint sensor chip 210, can be by the multiple fingerprint sensor chip 210 1 by the support plate 230 Secondary property is fixedly installed in the lower section of display screen, can reduce installation complexity, and improve installation effectiveness.

It should be understood that fingerprint sensor chip 210 shown in Fig. 3 can be Fig. 1 and fingerprint identification device shown in Fig. 2 140 In fingerprint sensor chip 210, correlation function and structure explanation can refer to aforementioned associated description, for sake of simplicity, herein It repeats no more.

Optionally, as shown in figure 3, the fingerprint identification device 200 can also include circuit board 220.

As shown in figure 3, at least part setting of the circuit board 220 can be fitted in by the fixed glue 221 of circuit board The upper surface of support plate 230.Optionally, the fixed glue 221 of the circuit board can be solid-state glue or liquid glue.For example, described The fixed glue 221 of circuit board can be double-sided adhesive or glue.

Further, at least part of circuit board 200 can connect the margin location in the upper surface of the support plate 230 It sets, the circuit board 220 is connected at least one described fingerprint sensor chip 210.For example, the circuit board 220 is at least A part is connected to the marginal position of the close long side of the upper surface of the support plate 230, with increasing circuit plate 220 and support plate Contact area between 230, and then improve connection reliability.

For Fig. 3, the upper surface of the support plate 230 is rectangle, and 4 fingerprint sensor chips 210 are along described The longitudinal direction of the upper surface of support plate 230, close to the support plate 230 the first long side area arrangement in a row, institute State the region for the second long side that circuit board 220 can be fixed at close to the support plate 230.Wherein, first long side It is respectively two long sides of the support plate 230 with second long side.

Certainly, in other alternate embodiments, 4 fingerprint sensor chips 210 can also be along the support plate The short side direction of 230 upper surface is arranged side by side, at this point, at least part of the circuit board 220 can connect in the branch The marginal position of the close long side of the upper surface of fagging 230 or close short side.

It should be understood that circuit board 220 shown in Fig. 3 can be Fig. 1 and circuit board shown in Fig. 2 150, correlation function and knot Structure explanation can refer to aforementioned associated description, for sake of simplicity, details are not described herein.

Optionally, as shown in figure 3, the circuit board 220 is close to the one of the multiple optical fingerprint sensor chip 210 At least one bending slot 221 has can be set in end.

Further, the corresponding the multiple optical finger print of a bending slot 221 at least one described bending slot 221 passes The interval region between a pair of of adjacent chips in sensor chip 210.The support plate 230 is installed on electronic equipment as a result, A certain component when, performance can be influenced since bending occurs to avoid the circuit board 230, or even lost.The folding The shape of curved groove is U-shaped, is broken to avoid the circuit board in the position of the bending slot.Certainly, alternative at other In embodiment, at least one described bending slot 221 or other shapes or setting are in other positions, the embodiment of the present application It does not limit this.

Optionally, as shown in figure 3, the fingerprint identification device 200 can also include image processor 250, image procossing Device 250 is set on circuit board 220.

Described image processor 250 can be specially microprocessor (Micro Processing Unit, MCU), at image Reason device 250 be used to receive sent by the circuit board 220 from least one described sensor fingerprint detection signal (such as Fingerprint image), and fingerprint recognition is carried out based on fingerprint detection signal.Specifically, at least one described fingerprint sensor chip 210 It is received first from the reflected reflected light of user's finger and is imaged based on received optical signal, to generate fingerprint image； Then, fingerprint image is sent to image processor 250 by the circuit board 220, so that image processor 250 carries out image It handles and obtains fingerprint signal；Finally, carrying out fingerprint recognition to fingerprint signal by algorithm.

It should be appreciated that described image processor 250 can also be separately provided, at this point, institute in for his alternate embodiments Described image processor 250 can be connected to by the circuit board 220 by stating fingerprint sensor chip 210.

Optionally, described as shown in figure 3, the fingerprint identification device 200 can also include at least one capacitor 240 At least one capacitor 240 is arranged on the circuit board 220, for optimizing the acquisition of at least one fingerprint sensor chip 210 Fingerprint detection signal.For example, at least one described capacitor 240 is used for at least one described fingerprint sensor chip 210 The fingerprint detection signal of acquisition is filtered.Wherein, each fingerprint at least one described fingerprint sensor chip 210 Sensor chip 210 can correspond to one or more capacitor 240.

A fingerprint recognition chip 210 at least one described fingerprint sensor chip 210 can be correspondingly arranged on one A or multiple capacitors 240.

Optionally, as shown in figure 3, at least one first positioning hole has can be set in the support plate 230.The fixing piece It is provided at least one second location hole corresponding at least one described first positioning hole.Thus, it is possible to by described in it The support plate 230 is fixed at the fixation by least one first positioning hole and at least one described second location hole The upper surface of part.

Longitudinal direction of the support plate 230 in the upper surface along the support plate 230 is provided with multiple optical finger prints and passes When sensor chip 210, the support plate 230 can be in each pair of adjacent core in the multiple optical fingerprint sensor chip 210 The interval region of piece is provided with the first positioning hole.For example, the support plate 230 is sensed in the multiple optical finger print The middle position of the interval region of each pair of adjacent chips in device chip 210 is provided with the first positioning hole.

For Fig. 3, the upper surface of the support plate 230 is rectangle, and the upper surface of the support plate 230 is provided with 4 fingerprint sensor chips 210, each pair of adjacent finger of the support plate 230 in this described 4 fingerprint sensor chips 210 A first positioning hole 231 is respectively set in the middle position of the interval region of line sensor chip 210.

Certainly, the support plate 230 is between each pair of adjacent chips in 4 optical fingerprint sensor chips 210 Septal area domain is provided with a kind of example that a first positioning hole 231 is only the application, should not be construed as the limitation to the application.Example Such as, in other alternate embodiments, the support plate 230 can be specific at least a pair of adjacent in the multiple chip A location hole is arranged in the interval region of chip.For example, the support plate 230 only most intermediate one in the multiple chip One location hole is arranged to the interval region of adjacent chips.

Optionally, as shown in figure 3, the fingerprint identification device 200 can also include at least one optical filter 270.It is described At least one optical filter 270 can be set in the top of at least one fingerprint sensor chip 210.Specifically, such as Fig. 3 institute Show, an optical filter 270 has can be set in the top of each fingerprint sensor chip 210.

Certainly, in other alternate embodiments, at least one described optical filter 270 and at least one described fingerprint sensing Device chip 210 can not be one-to-one relationship.For example, can only be set above at least one described fingerprint sensor chip 210 It is equipped with an optical filter 270, the area of one optical filter 270 is sufficiently large, passes so that at least one described fingerprint is completely covered Sensor chip 210.

The optical filter 270 may include one or more optical filters, and one or more optical filters can match Be set to such as bandpass filters, to allow the transmission of the light of OLED pixel emission, while stop infrared light in sunlight etc. its His light component.When the fingerprint identification device 200 under outdoor application screen, this optical filtering be can be effectively reduced by too Bias light caused by sunlight.One or more optical filters can be implemented as such as optical filtering coating, optical filtering coating It is formed on one or more continuous interfacials, or can be implemented as on one or more discrete interfaces.It should be understood that optical filter 270 can be produced on the surface of any optical component, or along to the reflected light reflected to form via finger to Cheng Suoshu On the optical path of at least one fingerprint sensor chip 210.

In the embodiment of the present application, optical filter 270 is used to reduce the undesirable environment light in fingerprint induction, to improve extremely Few optical sensor of the fingerprint sensor chip 210 to the light received.Optical filter 270 specifically can be used for filtering out specific The light of wavelength, for example, near infrared light and partial feux rouges etc..For example, the energy of light of human finger's absorbing wavelength lower than~580nm Major part in amount, if one or more optical filter or optical filter layer are designed to wavelength-filtered from 580nm to red Outer light can then greatly reduce influence of the environment light to the optical detection in fingerprint induction.

In addition, the entering light face of the optical filter 270 is also provided with optical inorganic plated film or organic melanism coating, so that The reflectivity for obtaining the entering light face of optical filter 270 is lower than first threshold, such as 1%, so as to guarantee at least one described fingerprint Sensor chip 210 can receive it is enough, and then promoted fingerprint recognition effect.

The optical filter 270 can be passed at least one described fingerprint sensor chip 210 at least one described fingerprint The non-photo-sensing region of sensor chip 210 carries out dispensing and fixes, and the optical filter 270 and at least one described fingerprint sensor core There are gaps between the photosensitive region of piece 210；Or the lower surface of the optical filter 270 is lower than default refractive index by refractive index Glue be fixed on the upper surface of at least one fingerprint sensor chip 210.For example, the lower surface of the optical filter 270 Glue by refractive index lower than 1.3 is fixed on the upper surface of at least one fingerprint sensor chip 210.

It should be understood that Fig. 3 is only a kind of example of the application, the limitation to the application should not be construed as.

For example, in other alternative embodiments, the fingerprint identification device 200 can only include less than 4 or Fingerprint sensor chip 210 more than 4.

Fig. 4 is the schematic diagram of the assembling fixture 390 of the fingerprint identification device 200 of the embodiment of the present application.Such as Fig. 4 institute Show, the upper surface of the assembling fixture 390 may include at least one positioning column 391, at least one described first positioning hole and At least one described second location hole is correspondingly arranged at least one described positioning column 391.

In specific installation process, firstly, the support plate 230 can be consolidated by least one described first positioning hole Surely it is placed on the upper surface of the assembling fixture 390, it then, can be by the fixation by least one described second location hole Part is fixedly mounted on the upper surface of the support plate 230.Specifically, the support plate 230 can be closed by reinforcement fixing plaster In the upper surface of the fixing piece.Optionally, the fixed glue of the reinforcement can be solid-state glue or liquid glue.For example, the benefit It is strong that determine glue can be double-sided adhesive or glue.

The fingerprint identification device 200 can be mounted on the center of electronic equipment by the fixing piece.

Fig. 5 is the schematic diagram of the center 380 of the embodiment of the present application.

As shown in figure 5, the center 330 is provided with opening 331, the first side of the opening 331 and with described first The opposite second side in side is respectively arranged with the first groove 332 and the second groove 333, and the both ends of the fixing piece are fixed respectively In in first groove 332 and second groove 333.For example, can be by being bent the fixing piece, by the fixing piece Both ends be fixedly installed in first groove 332 and second groove 333 respectively.Optionally, first groove 332 The side wall of 330 both sides of the edge of center can be respectively formed at second groove 333, by the fixation of the fixing piece In the side wall of the center 330.

Further, first groove 332 and second groove 333 are in the upper surface close to the center 330 One end of cell wall is respectively arranged with the first notch 334 and the second notch 335, first notch 334 and second notch 335 It is symmetrical arranged.I.e. described first notch 334 and second notch 335 form installing port, the installing port, the first groove 332 And second groove 333 form the guide groove of the fixing piece, the fixing piece can pass through the guide groove and be inserted into institute as a result, It states in center 330.The embodiment of the present application can be effectively reduced described by first notch 334 and second notch 335 The installation difficulty of fixing piece.

Further, the lower surface close to the center 330 of first groove 332 and second groove 333 The lower surface of the relatively described center 330 of inner surface of cell wall be respectively arranged with first gradient and second gradient, described first The gradient is equal to second gradient.

Distance of the opening 331 between third side and the 4th side is less than preset threshold, described to be open 331 in institute Stating the distance between third side and the 4th side can be the width of the opening 331, the third side and described It 4th side can be perpendicular to the first side and the second side.For example, the width of the opening 331 can be equal to institute The width of fixing piece is stated, alternatively, the width of the opening 331 can be slightly larger than the width of the fixing piece.The center as a result, 330 could be formed with the structure for limiting the movement of the fixing piece in the direction of the width.For example, as shown in figure 3, the fixing piece When being installed on the center 330, the third side 336 and the 4th side 336 of the center can limit the fixing piece in institute State the movement in width direction.

The embodiment of the present application also provides it is a kind of may include above-mentioned fingerprint identification device 200 electronic equipment.Fig. 6 is this Apply for the side diagrammatic cross-section of the electronic equipment 300 with fingerprint identification device 200 shown in Fig. 3 of embodiment.Fig. 7 is this Shen Please embodiment electronic equipment 300 with fingerprint identification device 200 shown in Fig. 3 dismantle after schematic diagram.

As shown in Figure 6 and Figure 7, the electronic equipment 300 may include such as the fingerprint in the various embodiments of above-mentioned the application Identification device 200 and display screen.Wherein, the fingerprint identification device 200 can be set in the lower section of the display screen, for connecing It receives optical signal reflect via finger and by the display screen and carries out fingerprint detection.

Specifically, the support plate 230 of the fingerprint recognition mould group 200 can be fixed to the electronics by fixing piece 280 On the internal parts such as the center 330 of equipment 300, set so that the fingerprint identification device 200 can be fixed on the electronics The lower section of standby 300 display screen.

For example, the support plate 230 of the fingerprint identification device 200 can be arranged by fixing piece 280 in electronic equipment 300 Display screen lower section, the lower section in the intermediate region of display screen specifically can be set, meet the use habit of user, convenient for use Family is held.

As shown in Figure 6 and Figure 7, the display screen may include the light shield layer of display component 310 and the display component 310 320.Optionally, windowing 321 has can be set in the light shield layer 320, and the fingerprint identification device 200 passes through the windowing 321 The optical signal formed after receive that the display component 310 issues reflect via human finger, the optical signal is for fingerprint knowledge Not.

In the embodiment of the present application, the fingerprint identification device 200 of electronic equipment 300 and the display screen of the electronic equipment 300 It is separate design, but the embodiment of the present application is between the fingerprint identification device 200 and the display screen of the electronic equipment Relative distance is without limitation.

Specifically, the fingerprint identification device 200 can be contacted with the lower surface of the display component 310, alternatively, described May exist gap between the upper surface of fingerprint identification device 200 and the lower surface of the display component 310.For example, fingerprint is known The upper surface of other device 200 can with the lower surface of display screen the distance between can be less than or equal to specific threshold, such as 600 μm, to guarantee the photosensitive region for thering are enough optical signals to be incident at least one fingerprint sensor chip 210.

In the embodiment of the present application, if the lower surface of fingerprint identification device 200 and display screen does not contact, retain therebetween solid Fixed gap, gap can be the air gap (air gap) for being not filled with any auxiliary material, can guarantee when display screen by It is not in the following table that fingerprint identification device 200 touches display screen when occurring falling or colliding to pressing or electronic equipment Face will not influence the stability and performance of the fingerprint recognition of fingerprint identification device 200.

It should be understood that Fig. 6 and display component shown in Fig. 7 310 can refer to and be referred to retouching previously with regard to display screen 120 It states, for sake of simplicity, details are not described herein.

It should be understood that the light shield layer 320 is also used as heat dissipating layer and/or buffer layer, wherein the light shield layer is for blocking Other regions except fingerprint detection region enter fingerprint sensor chip 210 to avoid the optical signal in other described regions, Influence fingerprint detection effect.When the light shield layer 320 is used as heat dissipating layer, it can be also used for generating the luminescence unit in display screen Heat radiate, the light shield layer 320 be used as buffer layer when, can be used for buffering the extruding or touch that electronic equipment is subject to It hits, to reduce the damage to display screen.

Optionally, as shown in fig. 6, the fingerprint identification device 200 can also include gold thread 260, the circuit board 220 is logical Gold thread 260 is crossed to be connected at least one described fingerprint sensor chip 210.

Specifically, the gold thread 260 is for realizing between at least one fingerprint sensor chip 210 and circuit board 220 Communication, and realized and other in other peripheral circuits or electronic equipment as shown in Figure 1 or 2 by circuit board 220 The electrical interconnection and signal transmission of element.For example, at least one described fingerprint sensor chip 210 can pass through the gold thread 260 receive the control signal of the processing unit of electronic equipments, and can also be by the gold thread 260 by fingerprint detection signal (such as fingerprint image) is exported to the image processor of the fingerprint identification device 200 or the processor of electronic equipment 300.

Further, the height of the sealing of the height and gold thread 260 of the gold thread 260 can be respectively lower than the filter The height of mating plate 270, to reduce the thickness of the fingerprint identification device 200 and reduce its installation difficulty.

Optionally, as shown in Figure 6 and Figure 7, the electronic equipment 300 can also include center 330, and the center 330 is used In the support display screen.Specifically, center 330 can be used for for being set between display screen and battery for electronic equipment 300 Carrying the frame of internal various assemblies, internal various assemblies include but is not limited to mainboard, camera, winding displacement, various inductors, Microphone, earpiece etc. components.

It is understood that in the embodiment of the present application only for fingerprint identification device 200 to be fixed on center 330 into Row description, in other alternate embodiments, fingerprint identification device 200 can be by being fixedly connected on having for electronic equipment 300 The lower section that fingerprint identification device 200 is mounted on to display screen is realized in the other structures of support function.As long as can guarantee Above-mentioned fingerprint identification device 200 can be fixed at the lower section of display screen with separate mode.

For example, fingerprint identification device 200 can be fixed to rear cover, mainboard and the battery etc. of electronic equipment has support In the structure or device of function, it is further made to be fixed at the lower section of display screen.

Optionally, as shown in Figure 6 and Figure 7, the fixing piece 280 can be fixedly mounted in the groove of the center 330. For example, the mode that the fixing piece 280 can lead to insertion is mounted in the first groove 332 of the center 330.

Optionally, as shown in Figure 6 and Figure 7, the electronic equipment 300 can also include at least one foam 340, it is described extremely A few foam 340 is set between the support plate 230 and the center 330.Part at least one described foam or Whole foams are two-sided gum foam, to improve the connection reliability between the support plate 230 and the center 330.

Further, at least one fingerprint sensor core in fingerprint identification device described at least one described foam 340 Relationship between piece 210 is one-to-one relationship.

For Fig. 7, when the fingerprint identification device 200 includes 4 fingerprint sensor chips 210, the electronics is set Standby 300 may include 4 pieces of foams corresponding with 4 fingerprint sensor chips 210, wherein each fingerprint sensor chip The size of 210 lower surface is identical with the size of upper surface of its corresponding foam 340.

Further, at least one described foam 340 thickness of each foam 340 with by the center 330 and institute State at least one fingerprint sensor chip 210 in the distance between display screen and the fingerprint identification device 200 and described The distance between display screen (such as described display component 310) is related.Each foam 340 at least one described foam 340 Thickness respectively with by the distance between the center 330 and described display screen and the fingerprint identification device 200 at least The distance between one fingerprint sensor chip 210 and the display screen are inversely proportional.For example, at least one described foam 340 The thickness of each foam 340 makes the upper surface of at least one fingerprint sensor chip 210 and the following table of the display screen The distance between face is less than or equal to 600 μm.

It should be understood that Fig. 6 and Fig. 7 are only a kind of example of the application, the limitation to the embodiment of the present application should not be construed as.

For example, the fingerprint identification device 200 can be fixedly installed in the electronics in other alternative embodiments Other components of equipment 300.

It should also be understood that the embodiment of the present application does not do specifically the parameters such as the material and shape of the support plate 230 and size It limits.

For example, the thickness range of support plate 230 is 0.075mm-0.30mm, to control the fingerprint identification device 200 Thickness.

In another example the flexibility stiffening plate includes but is not limited to polyimides reinforcement when support plate 230 is flexible stiffening plate Plate, so as to improve the heat dissipation performance of the fingerprint identification device 200.

In another example the surface roughness (Ra) of support plate 230 is greater than a certain threshold value, such as 0.25um, to improve imaging effect Fruit；Specifically, optical signal can be scattered by surface, energy when the surface roughness of support plate 230 is greater than a certain threshold value Enough effectively reduce display screen sending and in the optical signal that the inside of fingerprint identification device 200 is reflected, and then avoid light anti- It penetrates and imaging is impacted；In addition, the support plate can be increased when the surface roughness of support plate 230 is greater than a certain threshold value Connection reliability between 230 and other component.Such as the support plate 230 and at least one described sensor and the circuit Connection reliability and the support plate 230 between plate 220 and the connection between the component for fixing the support plate 230 Reliability.

In another example the color of support plate 230 is dark color, to increase the extinction effect of the support plate 230, and then institute is avoided It states the light that support plate 230 reflects upwards and interference is generated to the light that at least one described fingerprint sensor chip 210 receives. Such as black or dark-brown.

In another example the lower surface of support plate 230 is square or rectangle, in order to which the support plate 230 to be mounted on The inside of the electronic equipment 300.

It should also be understood that the embodiment of the present application to parameters such as the type of the circuit board 220 and shapes also without limitation, can Selection of land, the shape of the circuit board can be irregular shape or regular shape.For example, rectangle or square.

For example, the shape of the circuit board 220 is T-type such as Fig. 3.

In another example the shape of the circuit board 220 can also be the distressed structure of T shape in other alternate embodiments.

It should also be understood that the embodiment of the present application does not do specifically the parameters such as the material and shape of the fixed frame 280 and size It limits.

For example, the thickness range of fixed frame 280 is 0.15mm-0.30mm, to control the thickness of the fingerprint identification device 200 Degree, and guarantee the fixed frame 280 have certain intensity.

In another example the rigidity stiffening plate includes but is not limited to stainless steel reinforcement when fixed frame 280 is rigid stiffening plate Plate, to improve the intensity for guaranteeing the fixed frame 280.

In another example the surface roughness (Ra) of fixed frame 280 is greater than a certain threshold value, such as 0.25um, to improve imaging effect Fruit；Specifically, optical signal can be scattered by surface, energy when the surface roughness of fixed frame 280 is greater than a certain threshold value Enough effectively reduce display screen sending and in the optical signal that the inside of fingerprint identification device 200 is reflected, and then avoid light anti- It penetrates and imaging is impacted；In addition, the fixed frame can be increased when the surface roughness of fixed frame 280 is greater than a certain threshold value Connection reliability between 280 and other component.Such as the company between the fixed frame 280 and the component of support frame as described above 230 Connect reliability.

In another example the color of fixed frame 280 is dark color, to increase the extinction effect of the fixed frame 280, and then institute is avoided It states the light that fixed frame 280 reflects upwards and interference is generated to the light that at least one described fingerprint sensor chip 210 receives. Such as black or dark-brown.

In another example the lower surface of fixed frame 280 is square or rectangle, in order to which the fixed frame 280 to be mounted on The inside of the electronic equipment 300.

It should be understood that Fig. 6 is only a kind of example of the application, the limitation to the embodiment of the present application should not be construed as.For example, In other alternative embodiments, the electronic equipment 300 can only include one piece of foam, and one piece of foam is provided with and institute State the corresponding through-hole of at least one location hole in support plate 230.

It should be understood that the specific example in the embodiment of the present application is intended merely to that those skilled in the art is helped to more fully understand The embodiment of the present application, rather than limit the range of the embodiment of the present application.

It should be understood that the term used in the embodiment of the present application and the appended claims is only merely for the specific reality of description The purpose for applying example, is not intended to be limiting the embodiment of the present application.For example, being made in the embodiment of the present application and the appended claims The "an" of singular, " above-mentioned " and " described " are also intended to including most forms, unless context clearly shows that it His meaning.

Those of ordinary skill in the art may be aware that list described in conjunction with the examples disclosed in the embodiments of the present disclosure Member can be realized with electronic hardware, computer software, or a combination of the two, can in order to clearly demonstrate hardware and software Interchangeability generally describes each exemplary composition and step according to function in the above description.These functions are actually It is implemented in hardware or software, the specific application and design constraint depending on technical solution.Professional technician Each specific application can be used different methods to achieve the described function, but this realization is it is not considered that exceed Scope of the present application.

In several embodiments provided herein, it should be understood that arriving, disclosed system, device can pass through Other modes are realized.For example, the apparatus embodiments described above are merely exemplary, for example, the division of the unit, Only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units or components can be with In conjunction with or be desirably integrated into another system, or some features can be ignored or not executed.In addition, shown or discussed Mutual coupling, direct-coupling or communication connection can be through some interfaces, the INDIRECT COUPLING of device or unit or logical Letter connection is also possible to electricity, mechanical or other form connections.

The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple In network unit.Some or all of unit therein can be selected to realize the embodiment of the present application scheme according to the actual needs Purpose.

It, can also be in addition, each functional unit in each embodiment of the application can integrate in one processing unit It is that each unit physically exists alone, is also possible to two or more units and is integrated in one unit.It is above-mentioned integrated Unit both can take the form of hardware realization, can also realize in the form of software functional units.

If the integrated unit is realized in the form of SFU software functional unit and sells or use as independent product When, it can store in a computer readable storage medium.Based on this understanding, the technical solution of the application is substantially The all or part of the part that contributes to existing technology or the technical solution can be with the shape of software product in other words Formula embodies, and the computer software product is stored in a storage medium, including some instructions are used so that a meter It calculates machine equipment (can be personal computer, server or the network equipment etc.) and executes each embodiment the method for the application All or part of the steps.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can store journey The medium of sequence code.

The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any Those familiar with the art within the technical scope of the present application, can readily occur in various equivalent modifications or replace It changes, these modifications or substitutions should all cover within the scope of protection of this application.Therefore, the protection scope of the application should be with right It is required that protection scope subject to.

Claims (29)

1. a kind of fingerprint identification device is applied in the electronic equipment with display screen, which is characterized in that the fingerprint identification device Include:

Support plate；

At least one fingerprint sensor chip, at least one described fingerprint sensor chip are set to the upper table of the support plate Face；

Fixing piece, the fixing piece are set to the lower section of the support plate；

Wherein, the fixing piece is used to be mounted on the center of the electronic equipment, so that at least one described fingerprint fingerprint sensing Device chip is located at the lower section of the display screen of the electronic equipment；At least one described fingerprint fingerprint sensor chip is for receiving warp The fingerprint detection signal returned by the human finger reflection or scattering above the display screen, the fingerprint detection signal are used to Detect the finger print information of the finger.

2. fingerprint identification device according to claim 1, which is characterized in that the fingerprint identification device further include:

Circuit board, at least part of the circuit board are set to the marginal position of the upper surface of the support plate, the circuit Plate is connected at least one described fingerprint fingerprint sensor chip.

3. fingerprint identification device according to claim 2, which is characterized in that at least part of the circuit board is set to The marginal position of the close long side of the upper surface of the support plate.

4. fingerprint identification device according to any one of claim 1 to 3, which is characterized in that at least one described fingerprint Sensor chip includes multiple optical fingerprint sensor chips, and the multiple optical fingerprint sensor chip is by being disposed side by side on The upper surface of the support plate, to be spliced into an optical fingerprint sensor chip component.

5. fingerprint identification device according to any one of claim 1 to 4, which is characterized in that the support plate is provided with At least one first positioning hole, the fixing piece are provided at least one second positioning corresponding at least one described location hole Hole.

6. fingerprint identification device according to claim 5, which is characterized in that at least one described fingerprint sensor chip packet Multiple optical fingerprint sensor chips of the longitudinal direction setting along the upper surface of the support plate are included, the support plate is described The interval region of each pair of adjacent chips in multiple optical fingerprint sensor chips is provided with the first positioning hole.

7. fingerprint identification device according to any one of claim 1 to 6, which is characterized in that at least one described fingerprint Sensor chip includes multiple optical fingerprint sensor chips, and the circuit board is close to the multiple optical fingerprint sensor core One end of piece is provided at least one bending slot, and a bending slot at least one described bending slot corresponds to the multiple optics The interval region between a pair of of adjacent chips in fingerprint sensor chip.

8. fingerprint identification device according to claim 7, which is characterized in that the shape of the bending slot is U-shaped.

9. fingerprint identification device according to any one of claim 1 to 8, which is characterized in that the fingerprint identification device Further include:

The top of at least one fingerprint sensor chip is arranged in optical filter, the optical filter.

10. fingerprint identification device according to claim 9, which is characterized in that the entering light face of the optical filter is provided with light Learn inorganic plated film or organic melanism coating.

11. fingerprint identification device according to claim 9, which is characterized in that the optical filter and it is described at least one refer to Line sensor chip carries out dispensing in the non-photo-sensing region of at least one fingerprint sensor chip and fixes, and the optical filter There are gaps between the photosensitive region of at least one fingerprint sensor chip；Or the lower surface of the optical filter passes through The glue that refractive index is lower than default refractive index is fixed on the upper surface of at least one fingerprint sensor chip.

12. fingerprint identification device according to claim 9, which is characterized in that the circuit board by gold thread and it is described extremely A few fingerprint sensor chip is connected, and the height of the sealing of the height of the gold thread and the gold thread is respectively lower than the optical filtering The height of piece.

13. fingerprint identification device according to any one of claim 1 to 12, which is characterized in that the table of the support plate Surface roughness is greater than 0.25um.

14. fingerprint identification device according to any one of claim 1 to 13, which is characterized in that the circuit board is T-type Flexible circuit board, and multiple capacitors are provided with above the T-type flexible circuit board, the multiple capacitor is correspondingly connected with At least one described fingerprint sensor chip

15. according to claim 1 to fingerprint identification device described in any one of 14, which is characterized in that the fixing piece is length The difference of square plate, the width of the center of the length and electronic equipment of the rectangle steel plate is less than or equal to preset value.

16. according to claim 1 to fingerprint identification device described in any one of 15, which is characterized in that the electronic equipment Center is provided with opening, and the first side of the opening and the second side opposite with the first side are respectively arranged with first Groove and the second groove, the both ends of the fixing piece are respectively used to be fixed in first groove and second groove.

17. fingerprint identification device according to claim 16, which is characterized in that first groove and second groove It is respectively formed at the side wall of the center both sides of the edge, by the side wall for being fixed on the center of the fixing piece.

18. fingerprint identification device according to claim 17, which is characterized in that first groove and second groove Be respectively arranged with the first notch and the second notch in one end of the cell wall of the upper surface close to the center, first notch and Second notch is symmetrical arranged.

19. fingerprint identification device according to claim 17, which is characterized in that first groove and second groove The lower surface of the relatively described center of inner surface of cell wall of the lower surface close to the center be respectively arranged with first gradient With second gradient, first gradient is equal to second gradient.

20. a kind of electronic equipment characterized by comprising

Fingerprint identification device described in any one of claims 1 to 19 and display screen；

Wherein, the lower section of the display screen is arranged in realize fingerprint detection under screen in the fingerprint identification device.

21. electronic equipment as claimed in claim 20, which is characterized in that the display screen includes:

Display component；

Light shield layer, the light shield layer are set to the lower section of the display component, and the light shield layer is provided with windowing, and the fingerprint is known Other device by the windowing receive that the display component issues reflected via human finger after the optical signal that is formed, the light Signal is used for fingerprint recognition；

Wherein, the fingerprint identification device is contacted with the lower surface of the display component, alternatively, the fingerprint identification device and institute Stating the lower surface of display component, there are gaps.

22. electronic equipment according to claim 21, which is characterized in that the electronic equipment further include:

Center, the center are used to support the display screen；

Wherein, the fixing piece of the fingerprint recognition mould group is fixedly installed in the center.

23. electronic equipment according to claim 22, which is characterized in that the center is provided with opening, the opening First side and the second side opposite with the first side are respectively arranged with the first groove and the second groove, the fixing piece Both ends be individually fixed in first groove and second groove.

24. electronic equipment according to claim 23, which is characterized in that first groove and second groove difference It is formed in the side wall of the center both sides of the edge, by the side wall for being fixed on the center of the fixing piece.

25. electronic equipment according to claim 24, which is characterized in that first groove and second groove are leaning on One end of the cell wall of the upper surface of the nearly center is respectively arranged with the first notch and the second notch, first notch and described Second notch is symmetrical arranged.

26. electronic equipment according to claim 24, which is characterized in that first groove and second groove lean on The lower surface of the relatively described center of inner surface of the cell wall of the lower surface of the nearly center is respectively arranged with first gradient and the Two gradients, first gradient are equal to second gradient.

27. the electronic equipment according to any one of claim 21 to 26, which is characterized in that the electronic equipment also wraps It includes:

At least one foam, at least one described foam are set between the support plate and the center.

28. electronic equipment according to claim 27, which is characterized in that the thickness of each foam at least one described foam Degree depends on will be between the distance between the center and the display screen and the fingerprint identification device and the display screen Distance.

29. electronic equipment according to claim 27, which is characterized in that at least one described foam is corresponded in described At least one fingerprint sensor chip in fingerprint identification device.