CN110389626A - Electronic equipment - Google Patents
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- CN110389626A CN110389626A CN201910692149.3A CN201910692149A CN110389626A CN 110389626 A CN110389626 A CN 110389626A CN 201910692149 A CN201910692149 A CN 201910692149A CN 110389626 A CN110389626 A CN 110389626A
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- Prior art keywords
- electronic equipment
- hole
- supporting element
- ontology
- side wall
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
Abstract
This application provides a kind of electronic equipment, electronic equipment includes center, supporting element and fingerprint mould group, center includes ontology and the extension from the bending extension of ontology periphery, through-hole is offered on ontology, supporting element and ontology are split settings, supporting element is set in through-hole and supporting element is fixedly connected with ontology, and fingerprint mould is mounted on supporting element.The application supports fingerprint mould group by way of the extension supporting part in through-hole, instead of the technical solution for opening up groove support fingerprint mould group on the body in the related art.Due to supporting element material and thickness it can be selected that and supporting element difficulty of processing it is smaller, solve and open that upper groove difficulty is larger on the body, open up the problem that center is easily-deformable and reliability is poor after groove.
Description
Technical field
The application belongs to technical field of electronic products, and in particular to electronic equipment.
Background technique
With the continuous development of electronic equipment, due to the portability and rich and varied operability of electronic equipment,
Rely by the happiness of users.But user is also higher and higher to the desired value of electronic equipment and requirement simultaneously.Such as require electronics
Equipment has the function of to shield lower unlocked by fingerprint.But in current electronic equipment, fingerprint mould group is installed in below display screen can shadow
The performance for ringing the other component in electronic equipment, thus the problem of electronic equipment being made to occur other again.
Summary of the invention
In consideration of it, supporting fingerprint by way of the extension supporting part in through-hole this application provides a kind of electronic equipment
Mould group, instead of the technical solution for opening up groove support fingerprint mould group on the body in the related art.Due to the material of supporting element
Matter and thickness it can be selected that and supporting element difficulty of processing it is smaller, therefore solve that open upper groove difficulty on the body larger,
Open up the problem that center is easily-deformable and reliability is poor after groove.
This application provides a kind of electronic equipment, the electronic equipment includes center, supporting element and fingerprint mould group, described
Center includes ontology and the extension from ontology periphery bending extension, offers through-hole, the supporting element on the ontology
It is split settings with the ontology, the supporting element is set in the through-hole and the supporting element is fixedly connected with the ontology, institute
Fingerprint mould is stated to be mounted on the supporting element.
Electronic equipment provided by the present application opens up through-hole in the electronic device, and adds in through-hole on the ontology of frame
Supporting element is installed in fingerprint mould group on supporting element.The application supports fingerprint mould by way of the extension supporting part in through-hole
Group, instead of the technical solution for opening up groove support fingerprint mould group on the body in the related art.Due to the material of supporting element
With thickness it can be selected that and supporting element difficulty of processing it is smaller, therefore solve that open upper groove difficulty on the body larger, open
The problem that if center is easily-deformable after groove and reliability is poor.
Detailed description of the invention
It, below will be to institute in the application embodiment in order to illustrate more clearly of the technical solution in the application embodiment
Attached drawing to be used is needed to be illustrated.
Fig. 1 is the schematic diagram of the application first embodiment electronic equipment.
Fig. 2 is the sectional view in Fig. 1 along the direction A-A.
Fig. 3 is the concrete structure schematic diagram of the application first embodiment electronic equipment.
Fig. 4 is the structural schematic diagram of the application second embodiment electronic equipment.
Fig. 5 is the structural schematic diagram of the application third embodiment electronic equipment.
Fig. 6 is the structural schematic diagram of the 4th embodiment electronic equipment of the application.
Fig. 7 is the structural schematic diagram of the 5th embodiment electronic equipment of the application.
Fig. 8 is the structural schematic diagram of the application sixth embodiment electronic equipment.
Fig. 9 is the structural schematic diagram of the 7th embodiment electronic equipment of the application.
Figure 10 is the structural schematic diagram of the 8th embodiment electronic equipment of the application.
Figure 11 is the structural schematic diagram of the 9th embodiment electronic equipment of the application.
Figure 12 is the structural schematic diagram of the tenth embodiment electronic equipment of the application.
Figure 13 is the structural schematic diagram of the 11st embodiment electronic equipment of the application.
Figure 14 is the structural schematic diagram of the 12nd embodiment electronic equipment of the application.
Detailed description of the invention:
Electronic equipment -1, display screen -2, battery cover -3, the first accommodating space -4, the second accommodating space -5, center -10, this
Body -100, extension -101, through-hole -102, the first sub-through hole -1021, the second sub-through hole -1022, first surface -103, the second
Surface -104, sub- side wall -1052, the first groove -106 of the sub- side wall -1051, the second of side wall -105, the first, step structure -107,
Joint face -108, supporting element -20, support portion -21, bending part -22, interconnecting piece -23, container -24, fingerprint mould group -30, sensing
Face -31, smooth part -40, filling member -50, sealing element -60, the second groove -70.
Specific embodiment
It is the preferred embodiment of the application below, it is noted that for those skilled in the art,
Under the premise of not departing from the application principle, several improvements and modifications can also be made, these improvements and modifications are also considered as this Shen
Protection scope please.
Before introducing the technical solution of the application, then the technical issues of be discussed in detail down in the related technology.
During electronic equipment is constantly being explored towards the technological trend for shielding lower unlocked by fingerprint at present.Typically now by fingerprint mould group
Set on the lower section of display screen to realize the lower unlocked by fingerprint function of screen.And fingerprint mould group is usually provided on center to be consolidated
It is fixed, but the space between center and display screen is too small, can not accommodate fingerprint mould group, therefore usually open on the ontology of center at present
If groove, fingerprint mould group is installed in groove.But due to the finite thickness of center, if opening up one to hold is fingerprint mould group
Groove, the thickness of groove bottom wall will be very thin.It is integrally formed since center is usually plastic cement material, and by Shooting Technique
Center and groove are formed, so the difficulty of processing for wanting to process the groove of bottom wall thickness very thin (depth is larger) is very big.Even if
After processing the groove, due to the thinner thickness of bottom wall, the material is soft for center, therefore center is easily-deformable and the reliability of center
It is poor.
In consideration of it, to solve the above-mentioned problems, this application provides a kind of electronic equipment, by opening on the ontology of center
If through-hole, and the mode of extension supporting part supports fingerprint mould group in through-hole, to solve that Pocket Machining difficulty is big and center
The poor problem of mutability, reliability.
Fig. 1 and Fig. 2 is please referred to, Fig. 1 is the schematic diagram of the application first embodiment electronic equipment.Fig. 2 is in Fig. 1 along A-
The sectional view in the direction A.In present embodiment, the electronic equipment 1 includes center 10, supporting element 20 and fingerprint mould group 30.It is described
Center 10 includes ontology 100 and the extension 101 from 100 periphery of ontology bending extension, is offered on the ontology 100 logical
Hole 102, the supporting element 20 are split settings with the ontology 100.The supporting element 20 is set in the through-hole 102 and described
Supporting element 20 is fixedly connected with the ontology 100, and the fingerprint mould group 30 is set on the supporting element 20.
This application provides a kind of electronic equipment 1.Electronic equipment 1 provided by the present application includes but is not limited to mobile phone, plate
Computer, laptop, palm PC, personal computer (Personal Computer, PC), personal digital assistant
(Personal Digital Assistant, PDA), portable media player (Portable Media Player, PMP),
The mobile terminals such as navigation device, wearable device, Intelligent bracelet, pedometer, and number TV, desktop computer etc. are fixed
Terminal.
The application opens up through-hole 102, and the extension supporting part 20 in through-hole 102 on the center 10 of electronic equipment 1.This Shen
Supporting element 20 and ontology 100 please is split settings, i.e. supporting element 20 and ontology 100 is prepared by multiple working procedure,
It can be appreciated that supporting element 20 is to be prepared separately to be assembled again with ontology 100.Optionally the material of supporting element 20 include but
It is not limited to stainless steel, aluminium alloy etc..The application supports fingerprint mould group 30 by way of the extension supporting part 20 in through-hole 102,
Instead of the technical solution for opening up groove support fingerprint mould group 30 on ontology 100 in the related art.Due to supporting element 20
Material and thickness it can be selected that and supporting element 20 difficulty of processing it is smaller, therefore can first prepare through-hole 102 and thinner thickness
Supporting element 20, then supporting element 20 is fixedly connected in through-hole 102, significantly reduces preparation difficulty, and improved
The Stability and dependability of frame 10.As for the concrete shape of through-hole 102 and supporting element 20, can introduce in greater detail below.
It optionally, is the concrete structure schematic diagram of the application first embodiment electronic equipment please also refer to Fig. 3, Fig. 3.
The electronic equipment 1 of the application may also include display screen 2 and battery cover 3, and display screen 2 is installed in the side of center 10, and battery cover 3
It is installed in the other side of center 10.Display screen 2 and center 10 will form the first accommodating space 4, and battery cover 3 will form with center 10
Second accommodating space 5.Other components of electronic equipment 1 are then installed in the first accommodating space 4 and the second accommodating space 5.
It is the structural schematic diagram of the application second embodiment electronic equipment please also refer to Fig. 4, Fig. 4.The application second
The structure substantially phase for the electronic equipment 1 that the structure for the electronic equipment 1 that embodiment provides is provided with the application first embodiment
Together, the difference is that, in the application embodiment, the ontology 100 includes first surface 103, the second table being oppositely arranged
The side wall 105 of face 104 and the connection first surface 103 and the second surface 104, the side wall 105, which encloses, to be set to form institute
Through-hole 102 is stated, and the through-hole 102 runs through the first surface 103 and the second surface 104, opens up on the side wall 105
There is the first groove 106, first groove 106 is connected to the through-hole 102, the opposite sides insertion of the supporting element 20 described the
In one groove 106.
The application can open up the first groove 106 on the side wall 105 for forming through-hole 102, then make the opposite of supporting element 20
Two sides are embedded in first groove 106, it is understood that for supporting element 20 are to be fixedly connected with ontology in the first groove 106
100, the opposite sides of such supporting element 20 can be by the supporting role of ontology 100, to improve supporting element 20 on ontology 100
Be fixedly connected with effect, make supporting element 20 connect it is stronger.
It is the structural schematic diagram of the application third embodiment electronic equipment please also refer to Fig. 5, Fig. 5.The application third
The structure substantially phase for the electronic equipment 1 that the structure for the electronic equipment 1 that embodiment provides is provided with the application first embodiment
Together, the difference is that, in the application embodiment, the ontology 100 includes step structure 107, and the step structure 107 will
The through-hole 102 is divided into the first sub-through hole 1021 and the second sub-through hole 1022, and the supporting element 20 includes support portion 21, bending part
22 and interconnecting piece 23.The fingerprint mould group 30 is set on the support portion 21, week of the bending part 22 from the support portion 21
Edge bending setting, the interconnecting piece 23 bend setting, the connection away from the side of the support portion 21 from the bending part 22
Portion 23 connects the step structure 107, and the support portion 21 and the bending part 22 form container 24, and the container 24 is used
In the receiving fingerprint mould group 30.
Ontology 100 is arranged to step structure 107 close to the part of through-hole 102 by the application, therefore step structure 107 will be former
This through-hole 102 is given from first surface 103 to the identical opening size of second surface 104 is divided into the first different son of opening size
Through-hole 1021 and the second sub-through hole 1022.The step structure 107 include the first sub- side wall 1051, the second sub- side wall 1052 and
The joint face 108 of first sub- side wall 1051 and the second sub- side wall 1052, the first sub- side wall 1051, which encloses, to be set to form the first sub-through hole
1021, the second sub- side wall 1052, which encloses, to be set to form the second sub-through hole 1022.The step structure 107 of the application is it can be appreciated that part
Ontology 100 is extended towards the direction of through-hole 102 protrusion, therefore through-hole 102 is divided into the first sub-through hole 1021 and second
Sub-through hole 1022.The side wall 105 for protruding the ontology 100 extended can regard the second sub- side wall 1052 as, and not protrude the sheet of extension
The side wall 105 of body 100 can regard the first sub- side wall 1051 as.
The support portion 21 and the bending part 22 of the application forms container 24, and the container 24 is for accommodating the finger
Line mould group 30, i.e. fingerprint mould group 30 are set on support portion 21, and interconnecting piece 23 deviates from the support portion 21 from the bending part 22
Side bend setting, optionally, interconnecting piece 23 be directed away from support portion 21 direction bending setting and interconnecting piece 23 then connect
Step structure 107, i.e. interconnecting piece 23 are fixedly connected with joint face 108.In this way, when fingerprint mould group 30 be set to support portion 21 on when due to
The presence of interconnecting piece 23 allows 20 frame of supporting element on step structure 107, i.e., the bottom of interconnecting piece 23 can be by Step-edge Junction
The support of structure 107, when branch hold mode group is placed on support portion 21, supporting element 20 is not easy to fall off from ontology 100.Therefore can make
Supporting element 20 is preferably fixed on step structure 107, is improved supporting element 20 and is fixedly connected with effect on ontology 100, makes
Supporting element 20 connects stronger.
It optionally, is the structural schematic diagram of the 4th embodiment electronic equipment of the application please also refer to Fig. 6, Fig. 6.This Shen
Please the 4th embodiment provide electronic equipment 1 structure and the application third embodiment provide electronic equipment 1 structure
It is substantially the same, the difference is that, in the application embodiment, the periphery of fingerprint mould group 30 connects bending part 22, can also manage
Solution is that orthographic projection of the fingerprint mould group 30 on supporting element 20 is overlapped with support portion 21.The application can not only make the bottom of fingerprint mould group 30
Portion is connect with supporting element 20, and the periphery of fingerprint mould group 30 can still connect with supporting element 20, thus preferably by fingerprint mould group
30 are fixed on supporting element 20.
It optionally, is the structural schematic diagram of the 5th embodiment electronic equipment of the application please also refer to Fig. 7, Fig. 7.This Shen
Please the 5th embodiment provide electronic equipment 1 structure and the application third embodiment provide electronic equipment 1 structure
It is substantially the same, the difference is that, in the application embodiment, bending part 22 connects step structure 107 and forms the second sub-through hole
1022 side wall 105, it is understood that connect the second sub- side wall 1052 for bending part 22.The application makes bending part 22 connect second
Sub- side wall 1052, and then make very close to each other between bending part 22 and step structure 107, close-connected sealing structure is formed, it can
It effectively prevent water, dust or impurity, by the other structures destroyed in electronic equipment 1, to effectively improve electronics from center 10
The waterproof performance of equipment 1.
It is the structural schematic diagram of the application sixth embodiment electronic equipment please also refer to Fig. 8, Fig. 8.The application the 6th
The structure substantially phase for the electronic equipment 1 that the structure for the electronic equipment 1 that embodiment provides is provided with the application third embodiment
Together, the difference is that, in the application embodiment, the ontology 100 includes first surface 103, the second table being oppositely arranged
The side wall 105 of face 104 and the connection first surface 103 and the second surface 104, the side wall 105, which encloses, to be set to form institute
Through-hole 102 is stated, and the through-hole 102 runs through the first surface 103 and the second surface 104, the container 24 is opened
Mouth direction deviates from the second surface 104, and the fingerprint mould group 30 has the sensing face 31 of sensing fingerprint, and the sensing face 31 is carried on the back
From the second surface 104, the support portion 21 is flushed away from the side of the fingerprint mould group 30 with the second surface 104.
The application is described in detail side wall 105 above, is no longer repeated herein.The application limits
First surface 103 and second surface 104.The close surface of the opening direction of container 24 is the first surface of the application
103, opposite with first surface 103 is second surface 104；It can be appreciated that the upper surface of ontology 100 is this in Fig. 7
The first surface 103 of application, the lower surface of ontology 100 are the second surface 104 of the application.Due to the electronic equipment of the application
1 need to continue to assemble other component, such as battery etc. on second surface 104 in assembling process.Therefore in order to make second surface
104 is smooth, and the application flushes support portion 21 with the second surface 104 away from the side of the fingerprint mould group 30, to mention
The flatness of high 100 second surface 104 of ontology.
It is the structural schematic diagram of the 7th embodiment electronic equipment of the application please also refer to Fig. 9, Fig. 9.The application the 7th
The structure substantially phase for the electronic equipment 1 that the structure for the electronic equipment 1 that embodiment provides is provided with the application sixth embodiment
Together, the difference is that, in the application embodiment, the electronic equipment 1 further includes smooth part 40, and the smooth part 40 covers
The second surface 104 and the support portion 21 deviate from the side of the fingerprint mould group 30.
The application is when support portion 21 is flushed away from the side of the fingerprint mould group 30 with the second surface 104, bending
Also there is gap between portion 22 and the second sub- side wall 1052；Alternatively, due in actual production between bending part 22 and evener
There are certain bendings by Cheng Zhonghui, cause the second surface 104 of ontology 100 cannot achieve absolutely smooth, and then installing other
The technical issues of assembly difficulty can be improved when components or generate other.Therefore it can be added in one embodiment of the application smooth
Part 40, and make the side that smooth part 40 covers the second surface 104 and the support portion 21 deviates from the fingerprint mould group 30,
It can be understood as smooth part 40 and connect second surface 104 and support portion 21 away from the side of fingerprint mould group 30, and then make ontology 100
The side of second surface 104 achievees the effect that smooth, reduces the assembly difficulty of other components electronic equipment 1 Nei.
It is the structural schematic diagram of the 8th embodiment electronic equipment of the application please also refer to Figure 10, Figure 10.The application
The structure for the electronic equipment 1 that the structure and the application sixth embodiment for the electronic equipment 1 that eight embodiments provide provide is substantially
It is identical, the difference is that, in the application embodiment, the electronic equipment 1 further includes filling member 50, and the filling member 50 is filled out
It fills between the side wall 105 that the bending part 22 and the step structure 107 form second sub-through hole 1022, and described fills out
Part 50 is filled to flush away from the side of the first surface 103 with the second surface 104.
Identical with the 7th embodiment of the application, present embodiment deviates from the side of the fingerprint mould group 30 when support portion 21
When flushing with the second surface 104, also there is gap between bending part 22 and the second sub- side wall 1052；Alternatively, bending part 22
Due to that there can be certain bending in the actual production process between evener, cause the second surface 104 of ontology 100 can not
Realize it is absolutely smooth, and then the technical issues of can improve assembly difficulty when installing other components or generate other.Therefore originally
Apply that filling member 50 can be added in another embodiment, the filling member 50 is made to be filled in the bending part 22 and the Step-edge Junction
Structure 107 is formed between the side wall 105 of second sub-through hole 1022, makes bending part 22 and the second son by the filling of filling member 50
It is very close to each other between side wall 1052.In addition, side and the second surface of the filling member 50 away from the first surface 103
104 flush, and the flatness of 100 second surface 104 of ontology can be improved, and the assembly for reducing other components electronic equipment 1 Nei is difficult
Degree.
It is the structural schematic diagram of the 9th embodiment electronic equipment of the application please also refer to Figure 11, Figure 11.The application
The structure for the electronic equipment 1 that the structure and the application third embodiment for the electronic equipment 1 that nine embodiments provide provide is substantially
It is identical, the difference is that, in the application embodiment, the interconnecting piece 23 is away from described in the connection of the side of the bending part 22
Step structure 107 forms the side wall 105 of first sub-through hole 1021.It is also understood that interconnecting piece 23 deviates from bending part 22
Side connect the first sub- side wall 1051.The application makes interconnecting piece 23 connect the first sub- side wall away from the side of bending part 22
1051, to make that gap is not present between interconnecting piece 23 and the first sub- side wall 1051, realizes good sealing effect, can effectively prevent
The gap of sealing, dust or impurity between interconnecting piece 23 and the first sub- side wall 1051 is destroyed by the other side of center 10
Other components of electronic equipment 1, effectively improve the waterproof performance of electronic equipment 1.
It optionally, is the structural schematic diagram of the tenth embodiment electronic equipment of the application please also refer to Figure 12, Figure 12.This
The knot of the structure for the electronic equipment 1 that tenth embodiment provides and the electronic equipment 1 of the 9th embodiment of the application offer is provided
Structure is substantially the same, the difference is that, in the application embodiment, the interconnecting piece 23 forms institute with the step structure 107
It states and is additionally provided with sealing element 60 between the side wall 105 of the first sub-through hole 1021.Optionally, the application can also make to connect by sealing element 60
Socket part 23 is together with the first sub- 1051 double hit of side wall, i.e., the side of sealing element 60 connects interconnecting piece 23, other side connection first
Sub- side wall 1051.The application can by add sealing element 60 further increase it is close between interconnecting piece 23 and the first sub- side wall 1051
Effect is sealed, the waterproof performance of electronic equipment 1 is improved.Still optionally further, sealing element 60 includes but is not limited to silica gel, waterproof foam
Deng.
It is the structural schematic diagram of the 11st embodiment electronic equipment of the application please also refer to Figure 13, Figure 13.The application
The structure for the electronic equipment 1 that the structure and the application third embodiment for the electronic equipment 1 that 11st embodiment provides provide
It is substantially the same, the difference is that, in the application embodiment, the step structure 107 includes joint face 108, the connection
Face 108 connects side wall 105 and the step structure 107 formation that the step structure 107 forms first sub-through hole 1021
The side wall 105 of second sub-through hole 1022, the joint face 108 are equipped with the second groove 70, and the interconnecting piece 23 is embedded in institute
It states in the second groove 70.It can be appreciated that joint face 108 connects the first sub- side wall 1051 and the second sub- side wall 1052.The application
The second groove 70 is opened up on joint face 108, and is embedded in interconnecting piece 23 in second groove 70, and then increases supporting element 20 and platform
The product of joint face 108 of stage structure 107, further increases fixed effect of the supporting element 20 on step structure 107.In addition, will be even
Socket part 23 is embedded in the second groove 70, can also further prevent water to flow to the other side of center 10 from the side of center 10, into one
Step improves the waterproof performance of electronic equipment 1.
It is the structural schematic diagram of the 12nd embodiment electronic equipment of the application please also refer to Figure 14, Figure 14.The application
The knot for the electronic equipment 1 that the structure and the 11st embodiment of the application for the electronic equipment 1 that 12nd embodiment provides provide
Structure is substantially the same, the difference is that, in the application embodiment, second groove 70 and the step structure 107 formation
It is arranged between the side wall 105 of second sub-through hole 1022 in angle.The application makes the second groove 70 and the step structure 107
It is formed between the side wall 105 of second sub-through hole 1022 and is arranged in angle, to further increase supporting element 20 and Step-edge Junction
The product of joint face 108 of structure 107, to further increase fixed effect of the supporting element 20 on step structure 107.Optionally,
Two grooves 70 are axisymmetricly arranged along the axial direction of through-hole 102, are assemblied on step structure 107 to reduce supporting element 20
Assembly difficulty.
Content provided by the application embodiment is described in detail above, herein to the principle of the application and reality
The mode of applying is expounded and illustrates, described above to be merely used to help understand the present processes and its core concept；Meanwhile
For those of ordinary skill in the art, according to the thought of the application, has change in specific embodiments and applications
Become place, in conclusion the contents of this specification should not be construed as limiting the present application.
Claims (10)
1. a kind of electronic equipment, which is characterized in that the electronic equipment includes center, supporting element and fingerprint mould group, the center
Including ontology and the extension extended from ontology periphery bending, through-hole, the supporting element and institute are offered on the ontology
Stating ontology is split settings, and the supporting element is set in the through-hole and the supporting element is fixedly connected with the ontology, the finger
Line mould is mounted on the supporting element.
2. electronic equipment as described in claim 1, which is characterized in that the ontology includes the first surface being oppositely arranged,
The side wall of two surfaces and the connection first surface and the second surface, the side wall, which encloses, to be set to form the through-hole, and institute
It states through-hole and offers the first groove on the first surface and the second surface, the side wall, first groove connects
Lead to the through-hole, the opposite sides of the supporting element is embedded in first groove.
3. electronic equipment as described in claim 1, which is characterized in that the ontology includes step structure, the step structure
The through-hole is divided into the first sub-through hole and the second sub-through hole, the supporting element includes support portion, bending part and interconnecting piece, institute
It states fingerprint mould to be mounted on the support portion, the bending part bends setting from the periphery of the support portion, and the interconnecting piece is certainly
The bending part bends setting away from the side of the support portion, and the interconnecting piece connects the step structure, the support portion
And the bending part forms container, the container is for accommodating the fingerprint mould group.
4. electronic equipment as claimed in claim 3, which is characterized in that the ontology includes the first surface being oppositely arranged,
The side wall of two surfaces and the connection first surface and the second surface, the side wall, which encloses, to be set to form the through-hole, and institute
Through-hole is stated through the first surface and the second surface, the opening direction of the container deviates from the second surface, institute
The sensing face that fingerprint mould group has sensing fingerprint is stated, the sensing face deviates from the second surface, and the support portion is away from described
The side of fingerprint mould group is flushed with the second surface.
5. electronic equipment as claimed in claim 4, which is characterized in that the interconnecting piece is connected away from the side of the bending part
The step structure forms the side wall of first sub-through hole.
6. electronic equipment as claimed in claim 5, which is characterized in that the interconnecting piece and the step structure form described the
Sealing element is additionally provided between the side wall of one sub-through hole.
7. electronic equipment as claimed in claim 5, which is characterized in that the electronic equipment further includes smooth part, described smooth
Part covers the second surface and the support portion deviates from the side of the fingerprint mould group.
8. electronic equipment as claimed in claim 5, which is characterized in that the electronic equipment further includes filling member, the filling
Part is filled in the bending part and the step structure is formed between the side wall of second sub-through hole, and the filling member deviates from
The side of the first surface is flushed with the second surface.
9. electronic equipment as claimed in claim 3, which is characterized in that the step structure includes joint face, the joint face
Connect that the step structure forms the side wall of first sub-through hole and the step structure forms the side of second sub-through hole
Wall, the joint face are equipped with the second groove, and the interconnecting piece is embedded in second groove.
10. electronic equipment as claimed in claim 9, which is characterized in that second groove and the step structure form institute
It states and is arranged between the side wall of the second sub-through hole in angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910692149.3A CN110389626B (en) | 2019-07-29 | 2019-07-29 | Electronic device |
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|---|---|---|---|
| CN201910692149.3A CN110389626B (en) | 2019-07-29 | 2019-07-29 | Electronic device |
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| CN110389626B CN110389626B (en) | 2021-07-30 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712082A (en) * | 2020-07-02 | 2020-09-25 | Oppo广东移动通信有限公司 | Shell assembly of electronic equipment, electronic equipment and assembling method |
| CN114340279A (en) * | 2020-09-27 | 2022-04-12 | 北京小米移动软件有限公司 | Folding screen cover plate, preparation method, folding screen and electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202262106U (en) * | 2010-02-02 | 2012-05-30 | 苹果公司 | Casing of electronic equipment |
| CN106775118A (en) * | 2017-01-11 | 2017-05-31 | 苏州迈瑞微电子有限公司 | A kind of pressure sensitive device and equipment |
| US20180218194A1 (en) * | 2017-02-02 | 2018-08-02 | Lg Electronics Inc. | Key module and mobile terminal having the same |
| US20190005292A1 (en) * | 2014-07-07 | 2019-01-03 | Shenzhen GOODIX Technology Co., Ltd. | Integration of touch screen and fingerprint sensor assembly |
| CN109791611A (en) * | 2018-12-29 | 2019-05-21 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN109791610A (en) * | 2018-12-29 | 2019-05-21 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN109844765A (en) * | 2019-01-14 | 2019-06-04 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN109863507A (en) * | 2019-01-23 | 2019-06-07 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
-
2019
- 2019-07-29 CN CN201910692149.3A patent/CN110389626B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202262106U (en) * | 2010-02-02 | 2012-05-30 | 苹果公司 | Casing of electronic equipment |
| US20190005292A1 (en) * | 2014-07-07 | 2019-01-03 | Shenzhen GOODIX Technology Co., Ltd. | Integration of touch screen and fingerprint sensor assembly |
| CN106775118A (en) * | 2017-01-11 | 2017-05-31 | 苏州迈瑞微电子有限公司 | A kind of pressure sensitive device and equipment |
| US20180218194A1 (en) * | 2017-02-02 | 2018-08-02 | Lg Electronics Inc. | Key module and mobile terminal having the same |
| CN109791611A (en) * | 2018-12-29 | 2019-05-21 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN109791610A (en) * | 2018-12-29 | 2019-05-21 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN109844765A (en) * | 2019-01-14 | 2019-06-04 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
| CN109863507A (en) * | 2019-01-23 | 2019-06-07 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and electronic equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111712082A (en) * | 2020-07-02 | 2020-09-25 | Oppo广东移动通信有限公司 | Shell assembly of electronic equipment, electronic equipment and assembling method |
| CN114340279A (en) * | 2020-09-27 | 2022-04-12 | 北京小米移动软件有限公司 | Folding screen cover plate, preparation method, folding screen and electronic equipment |
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| CN110389626B (en) | 2021-07-30 |
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