CN110389626B

CN110389626B - Electronic device

Info

Publication number: CN110389626B
Application number: CN201910692149.3A
Authority: CN
Inventors: 金翔
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-07-29
Filing date: 2019-07-29
Publication date: 2021-07-30
Anticipated expiration: 2039-07-29
Also published as: CN110389626A

Abstract

The application provides an electronic equipment, electronic equipment include center, support piece, and fingerprint module, and the center includes the body and buckles the extension that extends from the body periphery, has seted up the through-hole on the body, and support piece and body set up for the components of a whole that can function independently, and support piece locates in the through-hole and support piece fixed connection body, and the fingerprint module is located on the support piece. This application supports the fingerprint module through the mode of addding support piece in the through-hole, has replaced and has seted up the technical scheme that the recess supported the fingerprint module on the body in correlation technique. Because the material and the thickness of the support piece can be selected, and the processing difficulty of the support piece is smaller, the problems that the difficulty of forming the groove on the body is larger, the middle frame is easy to deform after the groove is formed, and the reliability is poorer are solved.

Description

Electronic device

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to electronic equipment.

Background

With the continuous development of electronic devices, the electronic devices are favored by users due to their portability and rich and varied operability. But at the same time, the expectations and requirements of users for electronic devices are also increasing. For example, the electronic device is required to have an off-screen fingerprint unlocking function. But in present electronic equipment, install the fingerprint module in the display screen below can influence the performance of other parts in the electronic equipment to can make other problems appear in the electronic equipment again.

Disclosure of Invention

In view of this, this application provides an electronic equipment, supports fingerprint module through the mode of addding the support piece in the through-hole, has replaced and has seted up the technical scheme that the recess supported fingerprint module on the body among the correlation technique. Because the material and the thickness of the support piece can be selected, and the processing difficulty of the support piece is smaller, the problems that the difficulty of forming the groove on the body is larger, the middle frame is easy to deform after the groove is formed, and the reliability is poorer are solved.

The application provides an electronic equipment, electronic equipment includes center, support piece, and fingerprint module, the center include the body and certainly the extension that the body periphery was buckled and is extended, the through-hole has been seted up on the body, support piece with the body sets up for the components of a whole that can function independently, support piece locates in the through-hole just support piece fixed connection the body, the fingerprint module is located on the support piece.

The application provides an electronic equipment sets up the through-hole on the body of electronic equipment center to add support piece in the through-hole, make the fingerprint module install on support piece. This application supports the fingerprint module through the mode of addding support piece in the through-hole, has replaced and has seted up the technical scheme that the recess supported the fingerprint module on the body in correlation technique. Because the material and the thickness of the support piece can be selected, and the processing difficulty of the support piece is smaller, the problems that the difficulty of forming the groove on the body is larger, the middle frame is easy to deform after the groove is formed, and the reliability is poorer are solved.

Drawings

In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic view of an electronic device according to a first embodiment of the present application.

Fig. 2 is a sectional view taken along a-a in fig. 1.

Fig. 3 is a schematic structural diagram of an electronic device according to a first embodiment of the present application.

Fig. 4 is a schematic structural diagram of an electronic device according to a second embodiment of the present application.

Fig. 5 is a schematic structural diagram of an electronic device according to a third embodiment of the present application.

Fig. 6 is a schematic structural diagram of an electronic device according to a fourth embodiment of the present application.

Fig. 7 is a schematic structural diagram of an electronic device according to a fifth embodiment of the present application.

Fig. 8 is a schematic structural diagram of an electronic device according to a sixth embodiment of the present application.

Fig. 9 is a schematic structural diagram of an electronic device according to a seventh embodiment of the present application.

Fig. 10 is a schematic structural diagram of an electronic device according to an eighth embodiment of the present application.

Fig. 11 is a schematic structural diagram of an electronic device according to a ninth embodiment of the present application.

Fig. 12 is a schematic structural diagram of an electronic device according to a tenth embodiment of the present application.

Fig. 13 is a schematic structural diagram of an electronic device according to an eleventh embodiment of the present application.

Fig. 14 is a schematic structural diagram of an electronic device according to a twelfth embodiment of the present application.

Description of the drawings:

the electronic device comprises an electronic device body 1, a display screen 2, a battery cover 3, a first accommodating space 4, a second accommodating space 5, a middle frame 10, a body 100, an extending portion 101, a through hole 102, a first sub through hole 1021, a second sub through hole 1022, a first surface 103, a second surface 104, a side wall 105, a first sub side wall 1051, a second sub side wall 1052, a first groove 106, a step structure 107, a connecting surface 108, a supporting member 20, a supporting member 21, a bending portion 22, a connecting portion 23, an accommodating groove 24, a fingerprint module 30, a sensing surface 31, a flattening member 40, a filling member 50, a sealing member 60 and a second groove 70.

Detailed Description

The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Before the technical solutions of the present application are introduced, the technical problems in the related art will be described in detail.

Currently, electronic devices are constantly exploring the technical trend of finger-print unlocking towards the screen. Now usually locate the below of display screen with the fingerprint module thereby realize fingerprint unblock function under the screen. And the fingerprint module is usually located on the center in order to fix, but the space undersize between center and the display screen can't hold the fingerprint module, consequently sets up the recess on the body of center usually at present, installs the fingerprint module in the recess. However, because the thickness of the middle frame is limited, if a groove capable of accommodating the fingerprint module is formed, the thickness of the bottom wall of the groove is very thin. Because the middle frame is usually made of plastic materials and the middle frame and the groove are integrally formed through an injection molding process, the processing difficulty of processing the groove with a thin bottom wall (with a large depth) is high. Even after the groove is machined, the bottom wall is thin, the middle frame is made of soft materials, and therefore the middle frame is easy to deform and poor in reliability.

In view of this, in order to solve the above problem, the present application provides an electronic device, which supports a fingerprint module by providing a through hole on a body of a middle frame and additionally providing a support member in the through hole, thereby solving the problems of difficulty in groove processing, easy variability of the middle frame, and poor reliability.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic view of an electronic device according to a first embodiment of the present disclosure. Fig. 2 is a sectional view taken along a-a in fig. 1. In this embodiment, the electronic device 1 includes a middle frame 10, a support member 20, and a fingerprint module 30. The middle frame 10 includes a body 100 and an extending portion 101 bent and extended from the periphery of the body 100, the body 100 is provided with a through hole 102, and the support member 20 and the body 100 are arranged separately. The supporting member 20 is disposed in the through hole 102, the supporting member 20 is fixedly connected to the body 100, and the fingerprint module 30 is disposed on the supporting member 20.

The present application provides an electronic device 1. The electronic device 1 provided by the present application includes, but is not limited to, a mobile terminal such as a mobile phone, a tablet Computer, a notebook Computer, a palmtop Computer, a Personal Computer (PC), a Personal Digital Assistant (PDA), a Portable Media Player (PMP), a navigation device, a wearable device, a smart band, a pedometer, and a fixed terminal such as a Digital TV, a desktop Computer, and the like.

The application provides a through hole 102 on a middle frame 10 of an electronic device 1, and a support member 20 is additionally arranged in the through hole 102. The support member 20 and the body 100 of the present application are provided separately, that is, the support member 20 and the body 100 are prepared through a plurality of processes, and it can also be understood that the support member 20 and the body 100 are separately prepared and then assembled. Alternative materials for support member 20 include, but are not limited to, stainless steel, aluminum alloy, and the like. This application supports fingerprint module 30 through the mode of addding support piece 20 in through-hole 102, has replaced and has seted up the technical scheme that the recess supported fingerprint module 30 on body 100 in the correlation technique. Because the material and thickness of the supporting member 20 can be selected, and the processing difficulty of the supporting member 20 is small, the through hole 102 and the supporting member 20 with a small thickness can be prepared first, and then the supporting member 20 is fixedly connected in the through hole 102, so that the preparation difficulty is greatly reduced, and the stability and reliability of the middle frame 10 are improved. The specific shape of the through hole 102 and the support member 20 will be described in detail below.

Optionally, please refer to fig. 3 together, and fig. 3 is a schematic structural diagram of an electronic device according to a first embodiment of the present application. The electronic device 1 of the present application may further include a display screen 2 and a battery cover 3, wherein the display screen 2 is installed on one side of the middle frame 10, and the battery cover 3 is installed on the other side of the middle frame 10. The display screen 2 and the middle frame 10 form a first accommodating space 4, and the battery cover 3 and the middle frame 10 form a second accommodating space 5. Other components of the electronic device 1 are installed in the first accommodating space 4 and the second accommodating space 5.

Please refer to fig. 4, fig. 4 is a schematic structural diagram of an electronic device according to a second embodiment of the present application. The structure of the electronic device 1 provided in the second embodiment of the present application is substantially the same as the structure of the electronic device 1 provided in the first embodiment of the present application, except that in the embodiment of the present application, the body 100 includes a first surface 103, a second surface 104 and a sidewall 105 connecting the first surface 103 and the second surface 104, the sidewall 105 encloses the through hole 102, the through hole 102 penetrates through the first surface 103 and the second surface 104, a first groove 106 is formed on the sidewall 105, the first groove 106 communicates with the through hole 102, and two opposite sides of the supporting member 20 are embedded into the first groove 106.

According to the present invention, the first groove 106 may be formed on the sidewall 105 forming the through hole 102, and then the opposite sides of the supporting member 20 are embedded into the first groove 106, which may also be understood as that the supporting member 20 is fixedly connected to the body 100 in the first groove 106, so that the opposite sides of the supporting member 20 may be supported by the body 100, thereby improving the fixing effect of the supporting member 20 on the body 100, and making the connection of the supporting member 20 more firm.

Please refer to fig. 5, and fig. 5 is a schematic structural diagram of an electronic device according to a third embodiment of the present application. The structure of the electronic device 1 provided in the third embodiment of the present application is substantially the same as the structure of the electronic device 1 provided in the first embodiment of the present application, except that in the embodiment of the present application, the main body 100 includes a step structure 107, the step structure 107 divides the through hole 102 into a first sub through hole 1021 and a second sub through hole 1022, and the supporting member 20 includes a supporting portion 21, a bending portion 22, and a connecting portion 23. The fingerprint module 30 is disposed on the supporting portion 21, the bending portion 22 is bent from the periphery of the supporting portion 21, the connecting portion 23 is bent from a side of the bending portion 22 away from the supporting portion 21, the connecting portion 23 is connected to the step structure 107, the supporting portion 21 and the bending portion 22 form an accommodating groove 24, and the accommodating groove 24 is used for accommodating the fingerprint module 30.

The present application sets the portion of the body 100 close to the through hole 102 as the step structure 107, so that the step structure 107 divides the originally same opening size of the through hole 102 from the first surface 103 to the second surface 104 into the first sub-through hole 1021 and the second sub-through hole 1022 with different opening sizes. The step structure 107 includes a first sub-sidewall 1051, a second sub-sidewall 1052 and a connecting surface 108 between the first sub-sidewall 1051 and the second sub-sidewall 1052, wherein the first sub-sidewall 1051 encloses a first sub-via 1021, and the second sub-sidewall 1052 encloses a second sub-via 1022. The step structure 107 of the present application can also be understood as a portion of the body 100 protruding toward the through hole 102, so as to divide the through hole 102 into a first sub-through hole 1021 and a second sub-through hole 1022. The side wall 105 of the convexly extended body 100 may be regarded as the second sub-side wall 1052, and the side wall 105 of the convexly extended body 100 may be regarded as the first sub-side wall 1051.

The supporting portion 21 and the bending portion 22 of the present application form an accommodating groove 24, the accommodating groove 24 is used for accommodating the fingerprint module 30, that is, the fingerprint module 30 is disposed on the supporting portion 21, and the connecting portion 23 deviates from the bending portion 22, the one side of the supporting portion 21 is bent, optionally, the connecting portion 23 is bent toward a direction away from the supporting portion 21, and the connecting portion 23 is connected to the step structure 107, that is, the connecting portion 23 is fixedly connected to the connecting surface 108. In this way, when the fingerprint module 30 is disposed on the supporting portion 21, due to the existence of the connecting portion 23, the supporting member 20 can be erected on the step structure 107, that is, the bottom of the connecting portion 23 can be supported by the step structure 107, and when the supporting module is disposed on the supporting portion 21, the supporting member 20 is not easy to fall off from the body 100. Therefore, the supporting member 20 can be better fixed on the step structure 107, the fixing and connecting effect of the supporting member 20 on the body 100 is improved, and the supporting member 20 is connected more firmly.

Optionally, please refer to fig. 6 together, and fig. 6 is a schematic structural diagram of an electronic device according to a fourth embodiment of the present application. The structure of the electronic device 1 according to the fourth embodiment of the present application is substantially the same as the structure of the electronic device 1 according to the third embodiment of the present application, except that in the embodiment of the present application, the peripheral edge of the fingerprint module 30 is connected to the bent portion 22, and it can also be understood that the orthographic projection of the fingerprint module 30 on the support 20 coincides with the supporting portion 21. This application can not only make the bottom and the support piece 20 of fingerprint module 30 be connected, still can make the periphery of fingerprint module 30 also be connected with support piece 20 to fix fingerprint module 30 on support piece 20 better.

Optionally, please refer to fig. 7 together, and fig. 7 is a schematic structural diagram of an electronic device according to a fifth embodiment of the present application. The structure of the electronic device 1 according to the fifth embodiment of the present application is substantially the same as the structure of the electronic device 1 according to the third embodiment of the present application, except that in the embodiment of the present application, the bent portion 22 is connected to the side wall 105 of the second sub-through hole 1022 formed by the step structure 107, and it can also be understood that the bent portion 22 is connected to the second sub-side wall 1052. This application makes kink 22 connect second sub-lateral wall 1052, and then makes do not have the clearance between kink 22 and the stair structure 107, forms zonulae occludens's seal structure, can effectively prevent water, dust or impurity from through destroying other structures in the electronic equipment 1 from center 10, has improved electronic equipment 1's waterproof performance effectively.

Please refer to fig. 8, fig. 8 is a schematic structural diagram of an electronic device according to a sixth embodiment of the present application. The structure of the electronic device 1 provided in the sixth embodiment of the present application is substantially the same as the structure of the electronic device 1 provided in the third embodiment of the present application, except that in the embodiment of the present application, the body 100 includes a first surface 103, a second surface 104 and a sidewall 105 connecting the first surface 103 and the second surface 104, the sidewall 105 encloses the through hole 102, the through hole 102 penetrates through the first surface 103 and the second surface 104, the opening direction of the receiving groove 24 deviates from the second surface 104, the fingerprint module 30 has a sensing surface 31 for sensing a fingerprint, the sensing surface 31 deviates from the second surface 104, and one side of the supporting portion 21 deviating from the fingerprint module 30 is flush with the second surface 104.

The present application has been described above in detail with respect to the side wall 105, and will not be described in detail here. The present application defines a first surface 103 and a second surface 104. The surface close to the opening direction of the accommodating groove 24 is a first surface 103 in the present application, and the surface opposite to the first surface 103 is a second surface 104; it can also be understood that in fig. 7, the upper surface of the body 100 is the first surface 103 of the present application, and the lower surface of the body 100 is the second surface 104 of the present application. Since the electronic device 1 of the present application needs to be continuously equipped with other components, such as a battery, on the second surface 104 during the assembling process. Therefore, in order to flatten the second surface 104, the side of the supporting portion 21 away from the fingerprint module 30 is flush with the second surface 104, so as to improve the flatness of the second surface 104 of the body 100.

Please refer to fig. 9, fig. 9 is a schematic structural diagram of an electronic device according to a seventh embodiment of the present application. The electronic device 1 according to the seventh embodiment of the present application has a structure substantially the same as that of the electronic device 1 according to the sixth embodiment of the present application, except that in the embodiment of the present application, the electronic device 1 further includes a leveling member 40, and the leveling member 40 covers the second surface 104 and a side of the supporting portion 21 away from the fingerprint module 30.

When the side of the supporting portion 21 away from the fingerprint module 30 is flush with the second surface 104, a gap is formed between the bending portion 22 and the second sub-sidewall 1052; alternatively, the second surface 104 of the body 100 cannot be absolutely flat due to a certain bending between the bent portion 22 and the flat portion in the actual production process, so that the assembling difficulty is increased or other technical problems may occur when other components are mounted. Therefore, in an embodiment of the present application, the leveling member 40 can be additionally provided, and the leveling member 40 covers the second surface 104 and the side of the supporting portion 21 deviating from the fingerprint module 30, and it can also be understood that the leveling member 40 connects the second surface 104 and the side of the supporting portion 21 deviating from the fingerprint module 30, so that the leveling effect is achieved on the side of the second surface 104 of the body 100, and the assembly difficulty of other components in the electronic device 1 is reduced.

Please refer to fig. 10, fig. 10 is a schematic structural diagram of an electronic device according to an eighth embodiment of the present application. The structure of the electronic device 1 provided in the eighth embodiment of the present application is substantially the same as the structure of the electronic device 1 provided in the sixth embodiment of the present application, except that in the embodiment of the present application, the electronic device 1 further includes a filler 50, the filler 50 is filled between the bending portion 22 and the sidewall 105 of the second sub-via 1022 formed by the step structure 107, and a side of the filler 50 facing away from the first surface 103 is flush with the second surface 104.

Like the seventh embodiment of the present application, in this embodiment, when the side of the supporting portion 21 away from the fingerprint module 30 is flush with the second surface 104, a gap is formed between the bending portion 22 and the second sub-sidewall 1052; alternatively, the second surface 104 of the body 100 cannot be absolutely flat due to a certain bending between the bent portion 22 and the flat portion in the actual production process, so that the assembling difficulty is increased or other technical problems may occur when other components are mounted. Therefore, in another embodiment of the present application, a filler 50 may be additionally provided, such that the filler 50 is filled between the bent portion 22 and the sidewall 105 of the step structure 107 forming the second sub-through hole 1022, and no gap is formed between the bent portion 22 and the second sub-sidewall 1052 by the filling of the filler 50. In addition, the side of the filling member 50 away from the first surface 103 is flush with the second surface 104, which can improve the flatness of the second surface 104 of the body 100 and reduce the difficulty in assembling other components in the electronic device 1.

Please refer to fig. 11, fig. 11 is a schematic structural diagram of an electronic device according to a ninth embodiment of the present application. The electronic device 1 according to the ninth embodiment of the present application has a structure substantially the same as the electronic device 1 according to the third embodiment of the present application, except that in the embodiment of the present application, a side of the connecting portion 23 away from the bending portion 22 is connected to the step structure 107 to form a sidewall 105 of the first sub through hole 1021. It can also be understood that the side of the connecting portion 23 facing away from the bending portion 22 connects the first sub-sidewall 1051. This application makes connecting portion 23 deviate from one side of kink 22 and connects first sub lateral wall 1051 to there is not the clearance between making connecting portion 23 and first sub lateral wall 1051, realize good sealed effect, can prevent effectively that water, dust or impurity from the opposite side that the clearance between connecting portion 23 and first sub lateral wall 1051 passes through center 10 and then destroy electronic equipment 1's other spare parts, improved electronic equipment 1's waterproof performance effectively.

Optionally, please refer to fig. 12 together, and fig. 12 is a schematic structural diagram of an electronic device according to a tenth embodiment of the present application. The electronic apparatus 1 according to the tenth embodiment of the present application has a structure substantially the same as that of the electronic apparatus 1 according to the ninth embodiment of the present application, except that a sealing member 60 is further disposed between the connecting portion 23 and the sidewall 105 of the stepped structure 107 forming the first sub-through hole 1021 in the embodiment of the present application. Alternatively, the present application may also use the sealing member 60 to connect the connecting portion 23 and the first sub-sidewall 1051, that is, one side of the sealing member 60 is connected to the connecting portion 23, and the other side is connected to the first sub-sidewall 1051. This application accessible adds sealing member 60 and further improves the sealed effect between connecting portion 23 and first sub-lateral wall 1051, improves electronic equipment 1's waterproof performance. Further optionally, the seal 60 includes, but is not limited to, silicone, waterproof foam, and the like.

Please refer to fig. 13 together, and fig. 13 is a schematic structural diagram of an electronic device according to an eleventh embodiment of the present application. The structure of the electronic device 1 provided in the eleventh embodiment of the present application is substantially the same as the structure of the electronic device 1 provided in the third embodiment of the present application, except that in the embodiment of the present application, the step structure 107 includes a connection surface 108, the connection surface 108 connects the sidewall 105 of the first sub through hole 1021 formed by the step structure 107 and the sidewall 105 of the second sub through hole 1022 formed by the step structure 107, the connection surface 108 is provided with a second groove 70, and the connection portion 23 is embedded in the second groove 70. It can also be understood that the connecting surface 108 connects the first sub-sidewall 1051 and the second sub-sidewall 1052. This application sets up second recess 70 on connecting face 108 to make connecting portion 23 imbed in second recess 70, and then increase the connection face 108 area of support piece 20 and stair structure 107, further improve the fixed effect of support piece 20 on stair structure 107. In addition, the connection portion 23 is embedded in the second groove 70, so that water is further prevented from flowing from one side of the middle frame 10 to the other side of the middle frame 10, and the waterproof performance of the electronic device 1 is further improved.

Please refer to fig. 14, fig. 14 is a schematic structural diagram of an electronic device according to a twelfth embodiment of the present application. The structure of the electronic device 1 provided in the twelfth embodiment of the present application is substantially the same as the structure of the electronic device 1 provided in the eleventh embodiment of the present application, except that, in the embodiment of the present application, the second groove 70 and the sidewall 105 of the step structure 107 forming the second sub through hole 1022 are disposed at an included angle. This application makes second recess 70 with stair structure 107 forms be the contained angle setting between the lateral wall 105 of second sub-through-hole 1022 to further increase the connection face 108 area of support piece 20 and stair structure 107, thereby further improve the fixed effect of support piece 20 on stair structure 107. Optionally, the second grooves 70 are arranged in an axial symmetry along the axial direction of the through hole 102, so as to reduce the assembling difficulty of the support member 20 on the step structure 107.

The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An electronic device, comprising a middle frame, a support member, a sealing member, and a fingerprint module, wherein the middle frame comprises a body and an extending portion bent and extending from the periphery of the body, the body is provided with a through hole, the support member and the body are arranged separately, the support member is arranged in the through hole and is fixedly connected with the body, the fingerprint module is arranged on the support member, the body comprises a step structure which divides the through hole into a first sub-through hole and a second sub-through hole, the support member comprises a support portion, a bending portion and a connecting portion, the fingerprint module is arranged on the support portion, the bending portion is bent from the periphery of the support portion, the connecting portion is bent from one side of the bending portion away from the support portion, and the connecting portion is connected with the step structure, the supporting portion and the bending portion form an accommodating groove, the accommodating groove is used for accommodating the fingerprint module, and the sealing element is connected between the connecting portion and the side wall of the first sub through hole.

2. The electronic device of claim 1, wherein the body includes a first surface, a second surface and a sidewall connecting the first surface and the second surface, the sidewall encloses the through hole, the through hole penetrates the first surface and the second surface, an opening direction of the receiving groove is away from the second surface, the fingerprint module has a sensing surface for sensing a fingerprint, the sensing surface is away from the second surface, and a side of the supporting portion away from the fingerprint module is flush with the second surface.

3. The electronic device of claim 2, further comprising a leveling member covering the second surface and a side of the support portion facing away from the fingerprint module.

4. The electronic device according to claim 2, further comprising a filling member, wherein the filling member is filled between the bending portion and a sidewall of the step structure forming the second sub-via, and a side of the filling member facing away from the first surface is flush with the second surface.