CN110674686A

CN110674686A - Fingerprint identification device and electronic equipment

Info

Publication number: CN110674686A
Application number: CN201910764023.2A
Authority: CN
Inventors: 高久亮; 吕焱; 严斌; 蔡佩芝
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-08-19
Filing date: 2019-08-19
Publication date: 2020-01-10
Anticipated expiration: 2039-08-19
Also published as: CN115457607A; WO2021031878A1; CN110674686B

Abstract

The application provides a fingerprint identification device and electronic equipment, this fingerprint identification device includes fingerprint chip subassembly and base plate, through improving the base plate for the base plate is greater than in the long side parallel and level of the fingerprint chip subassembly that is located the homonymy in the long side of two relative long sides on the width direction (x direction) of base plate between two long sides of base plate size between two long sides of fingerprint chip subassembly can effectively reduce the size of fingerprint identification device in the x direction, thereby, when installing the fingerprint identification device on electronic equipment's side, can effectively reduce electronic equipment's main part at the size of x direction, with the whole thickness that reduces electronic equipment.

Description

Fingerprint identification device and electronic equipment

Technical Field

The present application relates to the field of electronic devices, and more particularly, to a fingerprint identification apparatus in an electronic device and an electronic device.

Background

Along with the continuous popularization of full-face screen, the structure of installing the fingerprint identification device in the side of electronic equipment obtains using, however, because the fingerprint identification device can occupy the thickness of the center of electronic equipment, can increase electronic equipment's complete machine thickness, influences user experience.

Disclosure of Invention

The application provides a fingerprint identification device and electronic equipment, through improving the base plate, make the base plate in the long side of two relative long sides on x direction (fingerprint identification device's width direction) with be located the long side parallel and level of the fingerprint chip subassembly of homonymy, size between two long sides of base plate is greater than the size between two long sides of fingerprint chip subassembly, can effectively reduce the size of fingerprint identification device in the x direction, thereby, when installing the fingerprint identification device on electronic equipment's side, can effectively reduce electronic equipment's main part at the size of x direction, in order to reduce electronic equipment's whole thickness.

In a first aspect, a fingerprint identification device is provided, which includes:

a fingerprint chip assembly including two long sides opposing in a first direction, the first direction being parallel to a width direction of the substrate;

the base plate, fixed connection is in on the fingerprint chip subassembly, include two relative long sides in the first direction, wherein, size between two long sides of base plate is greater than size between two long sides of fingerprint chip subassembly, a long side of base plate with be located the homonymy a long side parallel and level of fingerprint chip subassembly.

Therefore, the fingerprint identification device provided by the embodiment of the application can effectively reduce the size of the fingerprint identification device in the x direction when the fingerprint identification device is installed on the side surface of the main body by matching the extended part of the long side surface of the substrate relative to the side surface of the fingerprint chip assembly on the same side with the main body of the electronic device to clamp the fingerprint identification device on the main body, by designing the substrate in such a way that one of the two opposite long side surfaces of the substrate in the x direction (the width direction of the fingerprint identification device) is flush with one long side surface of the fingerprint chip assembly on the same side, and the size between the two long side surfaces of the substrate is larger than the size between the two long side surfaces of the fingerprint chip assembly, so that the size of the main body in the x direction can be effectively reduced, to reduce the overall thickness of the electronic device.

In addition, for the main body with the same size, the fingerprint identification device of the embodiment of the application can also reduce the cut-off part on the main body, and can effectively improve the strength of the whole machine.

Optionally, the fingerprint identification device further includes:

the circuit board of the U-shaped structure, which is arranged on the side, which is far away from the fingerprint chip assembly, of the substrate comprises a first part, a bent part and a second part, wherein the bent part is connected with the first part and the second part, and the first part is positioned between the substrate and the second part.

Therefore, the fingerprint identification device that this application embodiment provided, through the circuit board that sets up U type structure, can install fingerprint identification device and function key respectively at the first part of the circuit board of U type structure and second part to realize the electricity to fingerprint identification device and function key simultaneously, can reduce the button of the side of electronic equipment, in order to improve electronic equipment's succinct pleasing to the eye degree.

Optionally, the second portion includes a first positioning portion close to a reference side of the substrate, the first positioning portion includes two step sides opposite in the first direction, the step sides of the first positioning portion include an inner side, an outer side, and a connecting side connecting the inner side and the outer side, the two connecting sides of the first positioning portion are respectively located on two sides of the reference side, and the reference side is a short side connecting two long sides of the substrate.

Therefore, in the fingerprint identification device provided by the embodiment of the present application, the first positioning portion for detecting the positioning of the second portion in the x direction is disposed on the second portion of the circuit board, the first positioning portion includes two step sides, the step sides have connecting sides, and the positioning of the second portion of the circuit board in the x direction is detected by using the relative position relationship between the two connecting sides and the reference side of the substrate, so that the manufacturing process can be reduced, and the cost can be reduced. Specifically, the connecting side surfaces of the two step side surfaces of the first positioning portion are respectively located at two sides of the reference side surface of the substrate, that is, the positioning of the second portion of the circuit board in the x direction can be considered to meet the requirement.

Optionally, the first positioning portion is close to the bent portion of the circuit board.

Alternatively, the second part includes a second positioning part including two long sides opposing in the first direction, each of the long sides of the second positioning part being located inside the long side of the substrate on the same side.

Therefore, in the fingerprint identification device provided by the embodiment of the application, the second positioning part for detecting the positioning of the second part in the y direction is arranged on the second part of the circuit board, the first positioning part comprises two long side surfaces opposite in the x direction, and the additional positioning of the second part of the circuit board in the y direction is detected by utilizing the relative position relationship between the two long side surfaces and the long side surface of the substrate, so that the manufacturing process can be reduced, and the cost can be reduced. Specifically, each long side of the second positioning portion is located inside the long side of the substrate on the same side, i.e., the positioning of the second portion of the circuit board in the y direction can be considered to be satisfactory.

Optionally, the fingerprint recognition device further comprises a reinforcing member fixedly attached to a surface of the second portion facing the first portion; and the number of the first and second groups,

the reinforcing member includes a third positioning portion that is close to a reference side of the base plate, the third positioning portion including two step sides that are opposite in the first direction, the step sides of the third positioning portion including an inner side, an outer side, and a connection side that connects the inner side and the outer side, the two connection sides of the third positioning portion being located on both sides of the reference side, respectively, the reference side being a short side that connects two long sides of the base plate.

Therefore, in the fingerprint identification device provided by the embodiment of the application, the reinforcing component fixedly connected to the second part of the circuit board is provided with the third positioning part for detecting the positioning of the second part in the x direction, the third positioning part comprises two step sides, the step sides are provided with the connecting sides, and the positioning of the second part of the circuit board in the x direction is detected by utilizing the relative position relationship between the two connecting sides and the reference side of the substrate, so that the manufacturing process can be reduced, and the cost can be reduced. Specifically, the connection sides of the two step sides of the third positioning portion are located on both sides of the reference side of the substrate, respectively, i.e., it can be considered that the positioning of the second portion of the circuit board in the x direction is satisfactory.

Optionally, the third positioning portion is close to the bent portion of the circuit board.

the reinforcing member includes a fourth positioning portion including two long sides opposing in the first direction, each of the long sides of the fourth positioning portion being located inside a long side of the base plate on the same side.

Therefore, in the fingerprint identification device provided by the embodiment of the application, the reinforcing component is provided with the fourth positioning part for detecting the positioning of the second part of the circuit board in the y direction, the fourth positioning part comprises two long sides opposite in the x direction, and the additional positioning of the second part of the circuit board in the y direction is detected by utilizing the relative position relationship between the two long sides and the long sides of the substrate, so that the manufacturing process can be reduced, and the cost can be reduced. Specifically, each long side surface is located inside the long side surface of the substrate on the same side, i.e., the positioning of the second portion of the circuit board in the y direction can be considered to meet the requirement.

Optionally, the fingerprint chip assembly comprises a working surface for contacting with an external object, and the working surface is a slope or a cambered surface.

Therefore, the fingerprint identification device provided by the embodiment of the application can be well applied to a scene that the side surface of the main body of the electronic equipment has radian or inclination by setting the working surface of the fingerprint chip assembly to be an inclined surface or an arc surface so as to improve the integration of the fingerprint identification device and the main body and the use hand feeling of a user.

Optionally, the working surface includes a plurality of detection areas, the fingerprint chip assembly includes a plurality of gain modules corresponding to the plurality of detection areas, each gain module is configured to adjust a gain of a signal detected by the fingerprint chip assembly at the corresponding detection area, and gains of signals adjusted by at least two gain modules of the plurality of gain modules are different.

Therefore, according to the fingerprint identification device provided by the embodiment of the application, under the condition that the working surface of the fingerprint chip assembly is an inclined surface or an arc surface, by arranging the plurality of gain modules, one gain module detects the gain of the electric signal detected on one detection area of the working surface, and the gains of the signals adjusted by at least two gain modules are different, the signal intensity of the signals can be made to be the same as much as possible, so that the identification effect is improved.

Optionally, the fingerprint chip assembly comprises a working surface for contacting with an external object, and the edge of the working surface is a cambered surface or a bevel.

Therefore, the fingerprint identification device that this application embodiment provided sets up the edge of the working surface through with fingerprint chip subassembly into cambered surface or inclined plane, can make fingerprint identification device's width narrow down in vision and feeling to improve user experience.

Optionally, the fingerprint identification device further includes:

the circuit board is arranged on one side, away from the fingerprint chip assembly, of the substrate and comprises a connecting part fixedly connected to the substrate, the substrate comprises a first extending area and a second extending area, the first extending area and the second extending area extend outwards from two opposite long sides of the connecting part in the first direction respectively along the first direction, the first extending area and the second extending area are areas located between two ends of the connecting part in the second direction and face the surface of the circuit board, the extending area with the larger area in the first extending area and the second extending area is a dispensing area, and the second direction is parallel to the length direction of the substrate.

Therefore, the fingerprint identification device provided by the embodiment of the application, by providing two overhanging regions (for example, a first overhanging region and a second overhanging region) which are respectively overhanging along the x direction from two long sides of the connecting part on the substrate, wherein the two overhanging regions are both regions which are located between two ends of the connecting part in the y direction and face the surface of the circuit board, the overhanging region with a larger area is set as a dispensing region for dispensing, so that one-side dispensing can be performed on the dispensing region, and glue is infiltrated or diffused between the circuit board and the substrate through a capillary phenomenon, so as to achieve waterproofing between the circuit board and the substrate. In particular, the structure that only one dispensing area is arranged on the substrate is very suitable for the situation that the size of the substrate in the x direction is small, and the waterproof effect between the substrate and the circuit board can be achieved.

Optionally, the fingerprint chip assembly includes two short sides opposite to each other in a second direction, the substrate includes two short sides opposite to each other in the second direction, each short side of the substrate is located at an outer side of the short sides of the fingerprint chip assembly at the same side, and the second direction is parallel to a length direction of the substrate.

In a second aspect, a fingerprint identification device is provided, which includes:

a substrate including two long sides opposing in a first direction and a reference side connecting the two long sides, the first direction being parallel to a width direction of the substrate;

the circuit board is arranged on one side of the substrate and comprises a first part, a bent part and a second part, wherein the bent part is connected with the first part and the second part, the first part is positioned between the substrate and the second part, the second part of the circuit board comprises a first positioning part close to a reference side surface of the substrate, the first positioning part comprises two opposite step side surfaces in the first direction, the step side surfaces comprise an inner side surface, an outer side surface and a connecting side surface connecting the inner side surface and the outer side surface, and the two connecting side surfaces are respectively positioned on two sides of the reference side surface.

Optionally, the second part of the circuit board includes a second positioning portion including two long sides opposing in the first direction, each of the long sides of the second positioning portion being located inside a long side of the substrate on the same side.

In a third aspect, a fingerprint identification device is provided, including:

the circuit board is arranged on one side of the substrate and comprises a first part, a bent part and a second part, wherein the bent part is connected with the first part and the second part, and the first part is positioned between the substrate and the second part;

and a reinforcing member fixedly attached to a surface of the second portion facing the first portion, wherein the reinforcing member includes a third positioning portion adjacent to a reference side of the base plate, the third positioning portion includes two step sides opposing in the first direction, the step sides include an inner side, an outer side, and connection sides connecting the inner side and the outer side, and the two connection sides are respectively located on both sides of the reference side.

Alternatively, the reinforcing member includes a fourth positioning portion including two long sides opposing in the first direction, each of the long sides of the fourth positioning portion being located inside a long side of the base plate on the same side.

In a fourth aspect, an electronic device is provided, comprising:

the side surface of the main body is provided with a hole;

in a possible implementation manner of any one of the above first aspects, the fingerprint identification device passes through the hole and is connected to the main body.

Optionally, the body is integrally formed; and the number of the first and second groups,

the electronic equipment further comprises a reinforcing support which is fixedly connected with the main body and the fingerprint identification device respectively.

Therefore, by integrally molding the main body, the size of the main body can be reduced to reduce the size of the electronic apparatus.

In a fifth aspect, an electronic device is provided, comprising:

the side surface of the main body is provided with a hole;

the fingerprint identification device in any one of the possible implementations of the second aspect described above, wherein the fingerprint identification device passes through the hole and is connected to the body.

Optionally, the body comprises an integral molding; and the number of the first and second groups,

In a sixth aspect, an electronic device is provided, comprising:

the side surface of the main body is provided with a hole;

the fingerprint identification device in any one of the possible implementations of the third aspect, wherein the fingerprint identification device passes through the hole and is connected to the main body.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a fingerprint recognition device according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a structure in which a fingerprint chip assembly and a substrate are matched according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 5 is a schematic structural view of a fingerprint recognition device, a main body, and a cradle according to an embodiment of the present application.

Fig. 6 is a schematic cross-sectional view of a partial region of an electronic apparatus of an embodiment of the present application.

Fig. 7 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 8 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 9 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 10 is a schematic cross-sectional view of a partial region of an electronic apparatus of an embodiment of the present application.

Fig. 11 is a schematic diagram of a manufacturing process of a fingerprint identification device according to an embodiment of the present application.

Fig. 12 is a schematic structural view of a circuit board of a U-shaped structure of the embodiment of the present application.

Fig. 13 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 14 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 15 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 16 is a schematic structural view of a reinforcing member of an embodiment of the present application.

Fig. 17 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 18 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Fig. 19 is another schematic configuration diagram of a fingerprint recognition device according to an embodiment of the present application.

Fig. 20 is a schematic structural view of a fingerprint chip assembly of an embodiment of the present application.

FIG. 21 is a schematic view of a detection zone indicating a working surface of a chip assembly according to an embodiment of the present application.

Fig. 22 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

The electronic device of the embodiment of the present application may be various possible devices configured with a fingerprint identification device, for example, the electronic device may be a mobile phone, a tablet computer, a watch, a wearable device, or the like.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application. Referring to fig. 1, the electronic apparatus 100 includes a main body 10, a hole 101 provided at a side of the main body 10, and a fingerprint recognition device 20, the fingerprint recognition device 20 being mounted on the main body 10 through the hole 101, and optionally, the electronic apparatus 100 further includes a screen 30. Taking a mobile phone as an example, the main body 10 can be understood as a middle frame of the mobile phone.

For convenience of description, first, a coordinate system of the drawings of the embodiments of the present application will be explained. The x, y and z directions are perpendicular to each other, the x direction may be understood as a width direction of the fingerprint recognition device, the y direction may be understood as a length direction of the fingerprint recognition device, and the z direction may be understood as a thickness direction of the fingerprint recognition device. The fingerprint identification device may be installed on a side surface of the electronic device in the length direction, or may be installed on a side surface of the electronic device in the width direction, which is not limited in the embodiment of the present application. In the embodiment of the present application, the structures of the fingerprint recognition device and the electronic device will be described by taking the structure in which the fingerprint recognition device shown in fig. 1 is attached to the side surface of the electronic device in the longitudinal direction as an example. The first direction is hereinafter referred to as the x-direction and the second direction is hereinafter referred to as the y-direction.

It should be noted that, in the embodiments of the present application, the relationship between the long side and the short side of the component or structure of the fingerprint identification device is described in many places, and it should be understood that the long side should be broadly understood as the side of the component or structure in the length direction (y direction) thereof, and the short side should be broadly understood as the side of the component or structure in the width direction (x direction) thereof.

The embodiment of the application improves the fingerprint identification device in various ways to realize different purposes.

First, as described in the background art, the fingerprint recognition device is installed on the side surface of the electronic device, which occupies the thickness of the middle frame of the electronic device, and increases the overall thickness of the electronic device, thereby affecting the user experience. Based on this, the embodiment of the application provides a fingerprint identification device, through improving the base plate of fingerprint identification device, under the circumstances that can guarantee the base plate and the main part cooperation of electronic equipment, reduce the size of base plate in the width direction (x direction) of base plate to reduce the size of fingerprint identification device in the x direction, make the width of fingerprint identification device narrow, thereby, can be connected with the narrower main part cooperation of size in the x direction, with the size of reducing electronic equipment in the x direction, reach the purpose that reduces complete machine thickness.

Secondly, in order to improve the waterproof performance between the circuit board and the substrate, the embodiment of the application further provides a structure for performing one-side dispensing on one side of the substrate in the length direction (y direction), and the structure can be well applied to a fingerprint identification device with a small size in the width direction (x direction) of the substrate.

Third, the embodiment of the present application further provides a fingerprint identification device having a positioning structure on a circuit board or a reinforcing component, and the positioning structure on the circuit board or the reinforcing component can be used for positioning detection, so that the manufacturing processes can be reduced, and the cost can be reduced.

Fourth, in order to embody the unity that fingerprint identification device and main part combine and improve user's use and feel, this application embodiment still provides and designs the working surface of fingerprint chip subassembly for cambered surface or inclined plane, and on this basis, also provides the scheme through designing a plurality of gain modules that are used for adjusting the gain of signal in order to improve the discernment effect.

Hereinafter, improvements of various aspects of the fingerprint identification device according to the embodiment of the present application will be described in detail with reference to fig. 2 to 22.

First aspect

Fig. 2 is a schematic structural diagram of a fingerprint recognition device according to an embodiment of the present application. Fig. 3 is a schematic structural diagram of a structure in which a fingerprint chip assembly and a substrate are mated according to an embodiment of the present application, where (a) in fig. 3 is a schematic structural diagram of a structure in which a fingerprint chip assembly and a substrate are mated according to an embodiment of the present application in an xz plane, and (b) in fig. 3 is a schematic structural diagram of a structure in which a fingerprint chip assembly and a substrate are mated according to an embodiment of the present application in an xy plane. Fig. 4 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application. Fig. 5 is a schematic structural view of a fingerprint recognition device, a main body, and a holder according to an embodiment of the present application, in which fig. 5 (a) is a perspective view of an identification device, a main body, and a holder according to an embodiment of the present application, and fig. 5 (b) is a sectional view of a partial area a of the main body according to an embodiment of the present application in an xz plane. Fig. 6 is a sectional view of a partial region of an electronic apparatus according to an embodiment of the present application.

Referring to fig. 2, the fingerprint recognition device 20 includes a fingerprint chip assembly 210, a substrate 220, and a circuit board 230, which are sequentially disposed along a z-direction. For example, the three components may be sequentially attached by using an adhesive, that is, the substrate 220 is attached to the fingerprint chip assembly 210, and the circuit board 230 is attached to the substrate 220. The circuit board 230 may be a flexible circuit board, a portion of the circuit board 230 is attached to the substrate 220 to achieve a fixed connection, and another portion of the circuit board 230 may extend into the main body to be fixedly connected with the main body of the electronic device and electrically connected with the main board in the main body. The fingerprint chip assembly 210 is configured to collect fingerprint information of a user, and the circuit board 230 receives the fingerprint information of the user and sends the fingerprint information of the user to the motherboard, so that the processor disposed on the motherboard performs corresponding authentication processing, for example, functions of fingerprint unlocking, fingerprint payment, and the like, based on the fingerprint information of the user.

Referring to fig. 3, the fingerprint chip assembly 210 includes two long sides opposite in the x-direction, and the substrate 220 includes two long sides opposite in the x-direction, wherein a dimension between the two long sides of the substrate 220 is greater than a dimension between the two long sides of the fingerprint chip assembly 210, and one long side of the substrate 220 is flush with one long side of the fingerprint chip assembly 210 located on the same side.

For convenience of description, two long sides of the fingerprint chip assembly 210 are respectively referred to as a first long side 211 and a second long side 212, and two long sides of the substrate 220 are respectively referred to as a first long side 221 and a second long side 222.

Illustratively, the first long side 221 of the substrate 220 and the first long side 211 of the fingerprint chip assembly 210 are located at one side of the fingerprint recognition device 20, and the second long side 222 of the substrate 220 and the second long side 212 of the fingerprint chip assembly 210 are located at the other side of the fingerprint recognition device 20. The second long side 222 of the substrate 220 is flush with the second long side 212 of the fingerprint chip assembly 210, the dimension between the first long side 221 of the substrate 220 and the second long side 222 of the substrate 220 is larger than the dimension between the first long side 211 of the fingerprint chip assembly 210 and the second long side 212 of the fingerprint chip assembly 210, or the first long side 221 of the substrate 220 extends outwards in the x-direction relative to the first long side 211 of the fingerprint chip assembly 210, and the first long side 221 of the substrate 220 is located outside the first long side 211 of the fingerprint chip assembly 210. For example, taking (b) in fig. 3 as an example, the dimension between the two long sides of the substrate 220 is L₂The dimension between the two long sides of the fingerprint chip assembly 210 is L₁The first long side 221 of the substrate 220 extends outward along the x-direction relative to the first long side 211 of the fingerprint chip assembly 210 by a dimension L₃。

It should be noted that the dimension between the two long sides of the substrate 220 is larger than the dimension between the two long sides of the fingerprint chip assembly 210, which can be broadly understood as the shortest dimension between the two long sides of the substrate 220 is larger than the longest dimension between the two long sides of the fingerprint chip assembly 210, and in the case that the second long side 222 of the substrate 220 is flush with the second long side 212 of the fingerprint chip assembly 210, the first long side 221 of the substrate 220 extends outward in the x direction relative to the first long side 211 of the fingerprint chip assembly 210, or the first long side 221 of the substrate 220 is located on the side of the first long side 211 of the fingerprint chip assembly 210 away from the fingerprint chip assembly 210.

It should be understood that the two long sides are flush as used herein, it is understood that the two long sides are substantially flush, in other words, the second long side 222 of the substrate 220 and the second long side 212 of the fingerprint chip assembly 210 substantially coincide in a projection onto the xy-plane.

It should also be understood that the outer side of the first long side 211 of the fingerprint chip assembly 210 refers to the side of the first long side 211 remote from the fingerprint chip assembly 210, and correspondingly, the inner side of the first long side 211 of the fingerprint chip assembly 210 refers to the side of the first long side 211 close to the fingerprint chip assembly 210. Similarly, the outer side of the component may be understood as the side of the component far from the component, and the inner side of the component may be understood as the side of the component near the component, which will not be described in detail later.

The positional relationship between the two short sides of the substrate 220 in the y-direction and the two short sides of the fingerprint chip assembly 210 in the y-direction is not limited.

Optionally, with continuing reference to (b) in fig. 3, the substrate 220 comprises two short side surfaces opposite in the y-direction, denoted as a first short side surface 223 and a second short side surface 224, the fingerprint chip assembly 210 comprises two short side surfaces opposite in the y-direction, denoted as a first short side surface 213 and a second short side surface 214, each short side surface of the substrate 220 being located outside the short side surfaces of the fingerprint chip assembly 210 on the same side.

For example, the first short side surface 223 of the substrate 220 and the first short side surface 213 of the fingerprint chip assembly 210 are located at one side of the fingerprint identification device, the second short side surface 224 of the substrate 220 and the second short side surface 214 of the fingerprint chip assembly 210 are located at the other side of the fingerprint identification device, the first short side surface 223 of the substrate 220 is located at the outer side of the first short side surface 213 of the fingerprint chip assembly 210, or the first short side surface 223 of the substrate 220 extends outwards along the y direction relative to the first short side surface 213 of the fingerprint chip assembly 210, and the second short side surface 224 of the substrate 220 is located at the outer side of the second short side surface 214 of the fingerprint chip assembly 210, or the second short side surface 224 of the substrate 220 extends outwards along the y direction relative to the second short side surface 214 of the fingerprint chip assembly 210.

Illustratively, one short side of the substrate 220 extends beyond the short side of the fingerprint chip assembly 210 on the same side, and the other short side of the substrate 220 may be flush with the short side of the fingerprint chip assembly 210 on the same side of the fingerprint identification device (not shown in the figures).

In addition, the shape and structure of the fingerprint chip assembly 210 and the substrate 220 are not limited, as long as one long side surface of the substrate 220 is flush with the long side surface of the fingerprint chip assembly 210 located on the same side, and the dimension between the two long side surfaces of the substrate 220 is larger than the dimension between the two long side surfaces of the fingerprint chip assembly 210.

In the case where the circuit board 230 is a flexible circuit board, in order to improve the strength of the fingerprint recognition device, a reinforcing member may be optionally provided in the fingerprint recognition device. Referring to fig. 4, the fingerprint identification device 20 includes a fingerprint chip assembly 210, a substrate 220, a circuit board 230, and a reinforcing member 241 sequentially arranged along a z-direction, wherein the reinforcing member 241 is attached to a surface of the circuit board 230 on a side away from the substrate 220. Alternatively, the material of the reinforcing member 241 may be steel, and such a reinforcing member made of steel may be referred to as a reinforcing steel sheet.

Based on the fingerprint identification device of this application embodiment, can adopt from inside to outside the equipment mode with fingerprint identification device installs on electronic equipment. Illustratively, referring to fig. 5 and 6, the main body 10 may be made of an integral molding, and the integral molding may be made of a pure metal (e.g., aluminum) or an aluminum-plastic alloy. The main body 10 is provided with a hole 101 (a non-hatched area shown in fig. 5 (b)), the fingerprint recognition device 20 is inserted into the hole 101 and the fingerprint recognition device 20 is pushed outward in the z direction in such a manner that the fingerprint recognition device is mounted from the inside to the outside, a portion of the substrate 220 extending out of the fingerprint chip assembly 210 is engaged with the main body 10, the substrate 220 is snapped on the main body 10 to restrict the position of the fingerprint recognition device 20, and one end of the circuit board 230 is fixedly connected to the main body 10. In the case where the main body 10 is integrally formed, the hole 101 may penetrate to the inner side of the main body 10, and a cut-away portion of the main body may be increased, and in order to increase the strength of the main body 10, a reinforcing bracket 40 may be provided as shown in fig. 5 (a), and the reinforcing bracket 40 may be fixedly connected to the fingerprint recognition device 20 and the main body 10, respectively.

With continued reference to fig. 6, the fingerprint chip assembly 210 is disposed in the hole 101 and is partially exposed out of the hole 101, so as to be pressed by the user to collect fingerprint information, and the first long side 221 of the substrate 220 is engaged with the main body 10 relative to the portion of the first long side 211 of the fingerprint chip assembly 210 extending outward along the x-direction, so as to clamp the fingerprint identification device 20 on the main body 10; in addition, if the short side surface (e.g., the first short side surface 223 or the second short side surface 224) of the substrate 220 is located at the outer side of the fingerprint chip assembly 210 at the same side, the overhanging portion of the short side surface of the substrate 220 opposite to the short side surface of the fingerprint chip assembly 210 is also matched with the main body 10, and the fingerprint recognition device 20 is further clamped on the main body 10. Alternatively, the reinforcing bracket 40 is fixedly connected to the reinforcing member 241 and to the main body 10.

At present, in the structure of assembling the fingerprint identification device on the side surface of the electronic equipment according to an inward-outward mode, each long side surface of the substrate extends outwards relative to the long side surface of the fingerprint chip assembly positioned on the same side, and each long side surface of the substrate is positioned on the outer side of the long side surface of the fingerprint chip assembly positioned on the same side, so that the width dimension of the substrate is large, the width dimension of the fingerprint identification device is increased, and the thickness of the electronic equipment is seriously influenced. In addition, since a portion of the main body needs to be cut off to mount the fingerprint recognition device, the fingerprint recognition device having a large width size may cut off a large number of portions of the main body, which affects the strength of the entire machine.

Therefore, the fingerprint identification device provided by the embodiment of the application, by making a relevant design on the substrate, one of the two opposite long side surfaces of the substrate in the width direction (x direction) of the substrate is flush with one of the long side surfaces of the fingerprint chip assembly located at the same side, the dimension between the two long side surfaces of the substrate is larger than the dimension between the two long side surfaces of the fingerprint chip assembly, the other long side surface of the substrate extends outwards relative to the long side surface of the fingerprint chip assembly located at the same side, and when the fingerprint identification device is clamped on the main body by matching the part of the long side surface of the substrate extending outwards relative to the long side surface of the fingerprint chip assembly located at the same side with the main body of the electronic device, the dimension of the fingerprint identification device in the x direction can be effectively reduced, so that when the fingerprint identification device is installed on the side surface of the main body, the dimension of the main body in the x direction, to reduce the overall thickness of the electronic device.

In addition, for the main body with the same size, the fingerprint identification device of the embodiment of the application can also reduce the cut-off part on the main body, and effectively improves the strength of the whole machine.

Second aspect of the invention

In the embodiment of the present disclosure, the circuit board 230 and the substrate 220 may be fixedly connected by adhering a viscous material, and in addition, in order to improve the waterproof performance, a dispensing area may be reserved on the substrate 220, and dispensing processing may be performed on the dispensing area, so that the glue may be fully diffused or infiltrated between the circuit board 230 and the substrate 220 by using a capillary phenomenon, so as to achieve the waterproof between the circuit board 230 and the substrate 220. For example, the entire area or a partial area of the substrate 220 located at the periphery of the circuit board 230 may be used as the dispensing area.

Under the condition that the width of the substrate is small, one-side dispensing can be carried out on the area, extending out of the circuit board in the x direction, of the surface, facing the circuit board, of the substrate, and water proofing between the circuit board and the substrate can also be achieved.

Fig. 7 is another schematic structural diagram of a fingerprint identification device according to an embodiment of the present application. Fig. 7 (a) and (b) are two-dimensional schematic structural diagrams of a fingerprint recognition device according to an embodiment of the present application in the xy plane, and fig. 7 (c) is a three-dimensional schematic structural diagram of a fingerprint recognition device according to an embodiment of the present application.

Referring to fig. 7, the circuit board 230 includes a connecting portion 231 fixedly connected to a surface of a side of the substrate 220 facing away from the fingerprint chip assembly 210, the connecting portion 231 includes two long sides opposite to each other in the x direction, which are denoted as a first long side 2311 and a second long side 2312, the substrate 220 includes a first overhanging region 2211 and a second overhanging region 2221 respectively overhanging from the two long sides of the connecting portion 231 in the x direction, the first overhanging region 2211 and the second overhanging region 2221 are regions located between two ends of the connecting portion 231 in the y direction and facing a surface of the circuit board 230, for example, the first overhanging region 2211 overhangs in the x direction relative to the first long side 2311 of the connecting portion 231, and the second overhanging region 2221 overhangs in the x direction relative to the second long side 2312 of the connecting portion 231. The area of the first overhanging region 2211 is different from the area of the second overhanging region 2221, and the overhanging region with a larger area in the first overhanging region 2211 and the second overhanging region 2221 is used as a dispensing region to perform single-side dispensing.

For example, the area of the first overhang area 2211 may be larger than the area of the second overhang area 2221, or may be smaller than the area of the second overhang area 2221. For example, referring to fig. 7 (a), the area of the first overhang region 2211 having a shaded portion is larger than that of the second overhang region 2221, the first overhang region 2211 is a dispensing region, and referring to fig. 7 (b), the area of the second overhang region 2221 having a shaded portion is larger than that of the first overhang region 2211, and the second overhang region 2221 is a dispensing region. In the manufacturing process, glue can be dispensed only on the overhanging region with a large area, dispensing on the overhanging region with a small area is not needed, and the glue is infiltrated or diffused between the circuit board 230 and the substrate 220 by utilizing the capillary phenomenon, so that the water resistance between the circuit board 230 and the substrate 220 is realized.

It should be noted that, in the dispensing process, the dispensing process may be performed on all or a part of the reserved dispensing area, and this is not limited herein. Referring to fig. 7 (c), the glue 201 may be dispensed only on a partial area of the overhang region where the substrate 220 overhangs in the x direction and has a large area, so as to utilize the capillary phenomenon, such that the glue 201 finally infiltrates or diffuses between the circuit board 230 and the substrate 220.

It should be noted that, as described above, a part of the circuit board 230 is fixedly connected to the substrate 220, and another part of the circuit board extends to the inside of the main body 10 and is fixedly connected to the main board of the main body 10 to achieve electrical connection, in the embodiment of the present application, a part where the circuit board 230 and the substrate 220 are fixedly connected is referred to as a connection part 231. Referring to (a) and (b) in fig. 7, in the xy plane, the projection of the substrate 220 on the xy plane surrounds the projection of the connection portion 231 on the xy plane, and a portion of the circuit board 230 corresponding to a region where the projection of the substrate 220 on the xy plane coincides with the projection of the circuit board 230 on the xy plane may be referred to as a connection portion 231.

Therefore, the fingerprint identification device provided by the embodiment of the application, by providing two overhanging regions (for example, a first overhanging region and a second overhanging region) which are respectively overhanging along the x direction from two long sides of the connecting part on the substrate, wherein the two overhanging regions are both regions which are located between two ends of the connecting part in the y direction and face the surface of the circuit board, the overhanging region with a larger area is set as a dispensing region for dispensing, so that one-side dispensing can be performed on the dispensing region, and glue is infiltrated or diffused between the circuit board and the substrate through a capillary phenomenon, so as to achieve waterproofing between the circuit board and the substrate. In particular, the structure in which only one dispensing region is provided on the substrate is very suitable for the case where the size of the substrate in the x direction is small (for example, the substrate in any one of the structures corresponding to fig. 2 to 5), and the waterproof effect between the substrate and the circuit board can also be achieved.

Fig. 8 shows two other structures for single-sided dispensing different from those of fig. 7. In this embodiment, only one overhanging region extending out of the circuit board along the x-direction may be disposed on the surface of the substrate facing the circuit board, and the overhanging region is the dispensing region.

Referring to fig. 8 (a), the second long side 222 of the substrate 220 is flush with the second long side 2312 of the connection portion 231, the first long side 221 of the substrate 220 extends outward in the x-direction relative to the first long side 2311 of the connection portion 231, and the first long side 221 of the substrate 220 is located outside the first long side 2311 of the connection portion 231.

In this structure, on the surface of the substrate 220 facing the circuit board 230, a region where the first long side 221 of the substrate 220 overhangs with respect to the first long side 2311 of the connection portion 231 and between both ends of the connection portion 231 in the y direction may be used as the dispensing region.

Referring to fig. 8 (b), the first long side 221 of the substrate 220 is flush with the first long side 2311 of the connection portion 231, the second long side 222 of the substrate 220 protrudes in the x direction relative to the second long side 2312 of the connection portion 231, and the second long side 222 of the substrate 220 is located outside the second long side 2312 of the connection portion 231.

In this structure, on the surface of the substrate 220 facing the circuit board 230, a region where the second long side 222 of the substrate 220 protrudes with respect to the second long side 2312 of the connection portion 231 and between both ends of the connection portion 231 in the y direction may be used as a dispensing region.

Therefore, according to the fingerprint identification device provided by the embodiment of the application, one long side of the two opposite long sides of the substrate in the x direction is flush with one long side of the connecting part which is located on the same side of the fingerprint identification device, the other long side of the substrate is located on the outer side of the long side of the connecting part which is located on the same side, on the surface of the substrate facing the circuit board, the area, extending outwards, of the long side of the substrate relative to the connecting part and located between the two ends of the connecting part in the y direction serves as a dispensing area, single-side dispensing is carried out on the dispensing area, glue is soaked or diffused between the circuit board and the substrate through the capillary phenomenon, and water proofing between the circuit board and the substrate is achieved. Similarly, for the situation that the size of the substrate in the x direction is small, the structure that only one dispensing area is arranged on the substrate is very suitable, and the waterproof effect between the substrate and the circuit board can be realized.

The foregoing embodiments all describe that the dispensing region is disposed on the region extending out of the circuit board along the x direction on the surface of the substrate facing the circuit board, optionally, the dispensing region may also be disposed on the region extending out of the circuit board along the y direction on the substrate in the embodiments of the present application, so as to further achieve a better waterproof effect. For example, taking fig. 7 (a) as an example, the area between one short side 2314 of the connection portion 231 and the short side 220 of the substrate 220 on the same side on the surface of the substrate 220 facing the circuit board 230 may be used as a dispensing area, and the dispensing may be performed on part or all of the dispensing area. Referring to (c) of fig. 7, the paste 202 may be spot-applied to an area between the short side 2314 of the connection portion and the short side 220 of the substrate 220 located on the same side.

Third aspect of the invention

In the embodiment of the application, the fingerprint identification device is arranged on the side surface of the electronic equipment, so that the number of keys on the side surface is too much, and the simplicity and the attractiveness of the electronic equipment are affected. Based on this, can unify fingerprint identification device and the function key such as volume key or power key that originally sets up in the side of electronic equipment two-in-one, can make the user also can press the function key when can making through pressing fingerprint identification device to realize fingerprint identification and function key's function simultaneously. In this embodiment, a circuit board of a U-shaped structure may be provided to simultaneously achieve electrical connection to the fingerprint recognition device and the function keys.

Referring to fig. 9, the fingerprint recognition device 20 includes a fingerprint recognition assembly 210, a base plate 220, and a circuit board 230 having a U-shaped structure, which are sequentially disposed along a z-direction, wherein the circuit board 230 includes a first portion 232, a bent portion 233, and a second portion 234, the bent portion 233 is bent and connects the first portion 232 and the second portion 234, and the first portion 232 is disposed between the base plate 220 and the second portion 234.

Specifically, the first portion 232 is a portion of the circuit board 230 closest to the substrate 220 and fixedly connected to the substrate 230, the second portion 234 is a portion extending from the bent portion 233 toward a direction away from the second portion 233, and the first portion 232 and the second portion 234 are approximately parallel or substantially parallel.

Optionally, with continued reference to fig. 9, the fingerprint recognition device 20 further includes a reinforcing member 242 and a reinforcing member 243, the reinforcing member 242 is fixedly connected with the first portion 232 of the circuit board 230, and the reinforcing member 243 is fixedly connected with the second portion 234 of the circuit board 230.

For example, the fingerprint identification device 20 may also include any one of the reinforcing member 242 or the reinforcing member 243, which is not limited in any way in the embodiment of the present application.

Based on the design idea of the U-shaped circuit board, the function keys 250 may be fixedly connected to the surface of the second portion 234 of the U-shaped circuit board 230 facing away from the first portion 232, so as to achieve mechanical and electrical connection between the function keys 250 and the circuit board.

Alternatively, based on the function keys 250 provided on the circuit board 230, a conductive base may be provided in the electronic device, which is fixedly connected to the reinforcing bracket 40 or the main body 10, and which is in contact with the function keys, during the installation of the fingerprint recognition device 20. .

Optionally, the material of the conductive base is a non-metallic material. The non-metallic material can be rubber, TPU and the like, the surface hardness of which is softer than that of metal and the material has weak elasticity, so that the functional key is not easy to damage when the functional key presses the conductive base.

Fig. 10 is a schematic structural diagram of an electronic device according to an embodiment of the present application. Referring to fig. 10, the electronic device includes a main body 10, a fingerprint identification device 20, a reinforcing bracket 40, and a conductive base 50, wherein the fingerprint identification device 20 includes a fingerprint identification assembly 210, a substrate 220, and a circuit board 230 having a U-shaped structure, which are sequentially disposed along a z-direction, a reinforcing member 242 fixedly connected to a first portion 232 of the circuit board 230, a reinforcing member 243 fixedly connected to a second portion 234 of the circuit board 230, and a function key 250 disposed opposite to the reinforcing member 243 and fixedly connected to the second portion 234 of the circuit board 230, the function key 250 contacts with the conductive base 50, the conductive base 50 is fixedly connected to the reinforcing bracket 40, and the reinforcing bracket 40 is fixedly connected to the main body 10.

When the working surface of the fingerprint recognition assembly 210 is pressed, the fingerprint recognition device 20 moves toward the inside of the main body 10 along the z direction by a certain displacement, by the pressing contact between the function key 250 and the conductive base 50, to simultaneously perform the functions of fingerprint recognition and function key.

For a fingerprint recognition device provided with a circuit board having a U-shaped structure, referring to fig. 11, during the manufacturing process, the circuit board 230 may be bent around the x-direction by an angle of approximately 180 degrees to form a circuit board having a U-shaped structure as shown in fig. 11, for example.

With reference to fig. 12, in the manufacturing process of the fingerprint recognition device provided with the reinforcing member fixedly connected to the circuit board having the U-shaped structure, the reinforcing member 242 and the reinforcing member 243 may be fixedly connected to the first portion 232 and the second portion 234 of the circuit board 230, respectively, and then the circuit board 230 fixedly connected to the reinforcing member 242 and the reinforcing member 243 may be bent around the x-direction by an angle of approximately 180 degrees to form the circuit board having the U-shaped structure as shown in fig. 11, for example.

In the process of bending the circuit board, which area the circuit board begins to bend and how much the circuit board bends are preset in advance, and after the circuit board is bent, in order to determine whether the bent circuit board is located at a preset position to reach a standard, positioning detection needs to be performed on the bent circuit board.

In the prior art, a positioning mark is made on a circuit board or a reinforcing part by adopting a copying ink mode, and whether the circuit board with a U-shaped structure formed after bending meets the positioning requirement is detected by detecting the positioning mark, but the cost is increased due to the need of an additional manufacturing process of copying ink. Based on this, the embodiment of the application provides a fingerprint identification device including a circuit board or a reinforcing component with a positioning structure, and the positioning detection is performed through the positioning structure of the circuit board or the reinforcing component, so that the manufacturing procedures can be reduced, and the cost can be reduced. The positioning structures can be used for detecting whether the positioning of the bent circuit board in the x direction and/or the y direction meets the positioning requirements or not. It is to be understood that in this case it is detected whether the positioning of the circuit board in the x-direction and/or the y-direction meets the positioning requirements, in fact it is detected whether the positioning of the second part of the circuit board in the x-direction and/or the y-direction meets the requirements, the detection direction being the z-direction. Hereinafter, the positioning structure on the circuit board and the positioning structure on the reinforcing member will be described in detail.

Positioning structure of circuit board

1. Detecting x-direction positioning

Referring to fig. 12 and 13, the second portion 234 of the circuit board 230 includes a first positioning portion 2341 near the reference side 225 of the substrate 220, the reference side 225 being a side connecting the first long side 221 of the substrate 220 and the second long side of the substrate 220, wherein the first positioning portion 2341 can be used to detect whether the positioning of the second portion 234 of the circuit board 230 after bending in the x direction is satisfactory.

Specifically, first positioning portion 2341 includes two stepped side surfaces opposing in the x direction, denoted as a first stepped side surface and a second stepped side surface, the first stepped side surface includes inner side surface 2341-11, outer side surface 2341-12, and connecting side surface 2341-13 connecting inner side surface 2341-11 and outer side surface 2341-12, the second stepped side surface includes inner side surface 2341-21, outer side surface 2341-22, and connecting side surface 2341-23 connecting inner side surface 2341-21 and outer side surface 2341-22, connecting side surface 2341-13 and connecting side surface 2341-23 are respectively located on both sides of reference side surface 225 of base plate 220, for example, as shown in (c) of fig. 13, connecting side surface 2341-13 is located on the outer side of reference side surface 225, connecting side surface 2341-23 is located on the inner side of reference side surface 225, and conversely, connecting side surfaces 2341-13 may be located on the inner side of reference side surface 234225, the connection sides 2341-23 are located outside the reference side 225 (not shown in the figures).

The first positioning portion 2341 may be understood as being located in the vicinity of two connecting sides, the vicinity including a step side including an inner side, an outer side, and the connecting side, the inner side being located near the center of the circuit board with respect to the outer side.

Optionally, the first positioning portion 2341 is close to the bent portion 233 of the circuit board 230.

The first positioning portion 2341 may be various possible structures of the second portion 234 near the reference surface 225 as long as two stepped sides may be formed, and the connecting sides of the two stepped sides are located at both sides of the reference side, respectively. As an example. Referring to (c) of fig. 13, the first positioning portion 2341 may be a structure formed by protruding both ends of the second portion 234 near the reference side 225 outward, and this structure may be well suited for a case where the width dimension of the circuit board is small. For example, referring to fig. 14 (a), the first positioning portion 2341 may also be a structure formed by recessing both ends of the second portion 234 near the reference side 225 inward, and such a structure may be well suited for the case where the width dimension of the circuit board is large.

The reference side surface is a side surface located between two long side surfaces of the substrate, one short side surface of the substrate 220 may be understood as the reference side surface, the reference side surface may be a plane or a curved surface, and an edge of the reference side surface may be, for example, a circular arc as shown in fig. 13 or may be a slope, and the like.

Similarly, the connecting side surface of the step side surface may be an arc surface as shown in fig. 13, or may be a flat surface as shown in (a) in fig. 15, for example, and the embodiment of the present application is not limited in any way.

In the design process, in the direction perpendicular to the reference side, the distance between the connecting side and the reference side can be limited within an allowable error range, and is recorded as +/-x, so that the detection is facilitated.

It is contemplated that where the connecting side and the reference side are planar, the distance between the two sides in the direction perpendicular to the reference side (i.e., the y-direction) may be substantially uniform for ease of detection. In some embodiments, the edge of the reference side 225 may be an arc, such as shown in fig. 13, only the edge of the reference side 225 may be an arc, or the entire reference side 225 may be an arc, and in order to keep the distance between the connection side and the reference side 225 as uniform as possible and facilitate detection, the edge of the reference side 225 may be an arc and the connection side of each step side may also be an arc.

Based on the step side surface of the first positioning portion, there is also a difference in detection standard due to the positional relationship between the connection side surface of the step side surface and the long side surface of the substrate.

Illustratively, referring to (c) in fig. 13 and (a) in fig. 14, if the width dimension of the first positioning portion 2341 is smaller than or equal to the width dimension of the substrate 220 so that the connecting sides are all located inside the long sides of the substrate, then, in the process of bending the circuit board 230, if only the connecting sides 2341-13 are visible, meaning that the connecting sides 2341-23 are already located inside the reference side 225, the positioning of the second portion 234 in the x direction may be considered satisfactory.

Illustratively, referring to fig. 14 (b), if the maximum width dimension of the first positioning portion 2341 is greater than the width dimension of the substrate so that at least a portion of the connecting side surface protrudes beyond the long side surface of the substrate, the positioning of the second portion 234 in the x direction may be considered satisfactory if, during the bending of the circuit board 230, at least a portion of the connecting side surfaces 2341-13 is seen to be located outside the reference side surface 225 and at least a portion of the connecting side surfaces 2341-23 is seen to be located inside the reference side surface 225, as viewed in the z direction.

Therefore, in the fingerprint identification device provided by the embodiment of the present application, the first positioning portion for detecting the positioning of the second portion in the x direction is disposed on the second portion of the circuit board, the first positioning portion includes two step sides, the step sides include a connection side, and the positioning of the second portion of the circuit board in the x direction is detected by using the relative position relationship between the two connection sides and the reference side of the substrate, so that the manufacturing process can be reduced, and the cost can be reduced. Specifically, the connecting side surfaces of the two step side surfaces of the first positioning portion are respectively located at two sides of the reference side surface of the substrate, that is, the positioning of the second portion of the circuit board in the x direction can be considered to meet the requirement.

2. Detecting positioning in the y-direction

Referring to fig. 12 and 15, the second portion 234 of the circuit board 230 includes a second positioning portion 2342, which can be used to detect whether the positioning of the second portion 234 of the circuit board 230 after bending in the y direction is satisfactory.

Specifically, the second positioning portion 2342 includes two long side surfaces opposing in the x direction, denoted as a first long side surface 2342-1 and a second long side surface 2342-2, each long side surface of the second positioning portion 2342 being located inside the long side surface of the base plate 220 on the same side. Illustratively, the first long side 2342-1 of the second positioning portion 2342 and the first long side 221 of the base plate 220 are disposed at one side of the fingerprint recognition device 20, and the second long side 2342-2 of the second positioning portion 2342 and the second long side 222 of the base plate 220 are disposed at the other side of the fingerprint recognition device 20, wherein the first long side 2342-1 of the second positioning portion 2342 is retracted in the x direction with respect to the first long side 221 of the base plate 220, i.e., the first long side 2342-1 of the second positioning portion 2342 is located inside the first long side 221 of the base plate 220, and the second long side 2342-2 of the second positioning portion 2342 is retracted in the x direction with respect to the second long side 222 of the base plate 220, i.e., the second long side 2342-2 of the second positioning portion 2342 is located inside the second long side 222 of the base plate 220.

The second positioning portion 2342 may be any area of the second portion 234, and is not limited thereto. Alternatively, with continued reference to fig. 12, the second positioning portion 2342 may be a region near an end of the second portion 234 remote from the bent portion 233 of the circuit board 230.

In the design process, the size of the second positioning portion 2342 is smaller than that of the base plate 220 in the x direction, and the distance between each long side of the base plate 220 and the long side of the second positioning portion on the same side can be limited to an allowable error range, which is recorded as ± y, for easy detection.

Referring to fig. 15, in the process of bending the circuit board 230, if the two long sides of the second positioning portion 2342 are not visible, as viewed in the z direction, meaning that each long side of the second positioning portion 2342 is already located inside the long side of the substrate 220 on the same side, the positioning of the second portion 234 in the y direction may be considered satisfactory.

Positioning structure of reinforcement component

As described above, in the fingerprint recognition device provided with the reinforcing member fixedly connected to the circuit board having the U-shaped structure, the reinforcing member 242 and the reinforcing member 243 may be fixedly connected to the first portion 232 and the second portion 234 of the circuit board 230, respectively, and then the circuit board 230 fixedly connected to the reinforcing member 242 and the reinforcing member 243 may be bent at an angle of approximately 180 degrees around the x-direction to form the circuit board having the U-shaped structure as shown in fig. 11, for example.

In the manufacturing process, the reinforcing component and the circuit board are accurately positioned, so that whether the positioning of the second part of the circuit board meets the requirement can be indirectly detected through the positioning structure fixedly connected to the reinforcing component on the second part.

1. Detecting x-direction positioning

Referring to fig. 16 and 17, the reinforcing member 243 includes a third positioning portion 2431 adjacent to the reference side 225 of the base plate 220, the reference side 225 being a side connecting the first long side 221 of the base plate 220 and the second long side 222 of the base plate 220, wherein the third positioning portion 2341 may be used to detect whether the positioning of the second portion 234 of the circuit board 230 after bending in the x direction is satisfactory.

Specifically, the third positioning portion 2431 includes two step sides opposite in the x direction, denoted as a third step side and a fourth step side, the third step side includes an inner side surface 2431-11, an outer side surface 2431-12, and a connecting side surface 2431-13 connecting the inner side surface 2431-11 and the outer side surface 2431-12, the fourth step side includes an inner side surface 2431-21, an outer side surface 2431-22, and a connecting side surface 2431-23 connecting the inner side surface 2431-21 and the outer side surface 2431-22, the connecting side surface 2431-13 and the connecting side surface 2431-23 are respectively located on both sides of the reference side surface 225 of the base plate 220, for example, as shown in (c) of fig. 17, the connecting side surface 2431-13 is located on the outer side of the reference side surface 225, the connecting side surfaces 2431-23 are located on the inner side of the reference side surface 225, and vice versa, the connecting side surfaces 2431-13, the connecting sides 2431-23 are located outside the reference side 225 (not shown in the figures).

The third positioning portion 2431 can be understood as a vicinity area of the reinforcing member located in the vicinity of the two connection sides, the vicinity area including a step side including an inner side, an outer side, and a connection side, the inner side being close to the center of the circuit board with respect to the outer side.

Optionally, the third positioning portion 2431 is adjacent to the bent portion 233 of the circuit board 230.

The third positioning portion 2431 may be various possible structures of the reinforcing member 243 near the reference surface 225 as long as it can be formed as two step sides, and the connection sides of the two step sides are located at both sides of the reference side, respectively. Exemplarily, referring to (c) of fig. 17, the third positioning portion 2431 may be a structure formed by both ends of the reinforcing member 243 near the reference side 225 being outwardly protruded, which may be well adapted to a case where the width dimension of the reinforcing member is small. Exemplarily, referring to (a) of fig. 18, the third positioning portion 2431 may also be a structure formed by both ends of the reinforcing member 243 near the reference side 225 being recessed inward, which may be well suited to a case where the width dimension of the reinforcing member is large.

The reference side surface 220 may be a flat surface or a curved surface, and the edge of the reference side surface may be, for example, an arc shape as shown in fig. 17 or a shape such as an inclined surface, which is not limited in this embodiment.

The connection side of the step side of the reinforcing member may be, for example, an arc surface as shown in fig. 17, or may be, for example, a flat surface as shown in (a) in fig. 18, and the embodiment of the present application is not limited in any way.

In the design process, the distance between the connection side of the reinforcing member and the reference side of the base plate can be limited within an allowable error range in each direction perpendicular to the reference side for detection.

In some embodiments, the edge of the reference side 225 may be an arc, such as shown in fig. 17, only the edge of the reference side 225 may be an arc, or the entire reference side 225 may be an arc, and in order to keep the distance between the connection side of the reinforcing member and the reference side 225 of the substrate as uniform as possible and facilitate detection, the edge of the reference side 225 may be an arc and the connection side of each step side of the reinforcing member may also be an arc.

The detection standard also differs depending on the positional relationship between the connection side of the stepped side of the reinforcing member and the long side of the substrate.

Referring to (c) of fig. 17 and (a) of fig. 18, if the width dimension of the reinforcing member 243 is smaller than or equal to the width dimension of the base plate 220 so that the connecting side surfaces of the reinforcing member 243 are both located inside the long side surfaces of the base plate, then in the process of bending the circuit board 230, if only the connecting side surfaces 2431-13 of the reinforcing member can be seen, as viewed from the z direction, meaning that the connecting side surfaces 2431-23 are already located inside the reference side surfaces 225, it can be considered that the positioning of the second portion 234 of the circuit board 230 in the x direction is satisfactory.

Referring to fig. 18 (b), if the maximum width dimension of the reinforcing member 243 is greater than the width dimension of the base plate 220 such that at least a portion of the connecting side surface of the reinforcing member 243 protrudes beyond the long side surface of the base plate 220, the positioning of the second portion 234 of the circuit board 230 in the x direction may be considered satisfactory if the connecting side surfaces 2431-13 are seen to be located outside the reference side surface 225 and the connecting side surfaces 2431-23 are seen to be located inside the reference side surface 225, as viewed from the z direction, during the bending of the circuit board 230.

2. Detecting positioning in the y-direction

Referring to fig. 16 and 19, the reinforcing member 243 includes a fourth positioning portion 2432, which can be used to detect whether the positioning of the second portion 234 of the bent circuit board 230 in the y direction is satisfactory.

Specifically, the fourth positioning portion 2432 includes two long sides, which are opposite in the x direction, and each of the long sides of the fourth positioning portion 2432 is located inside the long side of the base plate 220 at the same side, which is denoted as a first long side 2432-1 and a second long side 2432-2. Illustratively, the first long side 2432-1 of the fourth positioning portion 2432 and the first long side 221 of the base plate 220 are located at one side of the fingerprint recognition device, the second long side 2432-2 of the fourth positioning portion 2432 and the second long side 222 of the base plate 220 are located at the other side of the fingerprint recognition device, the first long side 2432-1 of the fourth positioning portion 2432 is inwardly retracted in the x-direction with respect to the first long side 221 of the base plate 220, the first long side 2432-1 of the fourth positioning portion 2432 is located inside the first long side 221 of the base plate 220, the second long side 2432-2 of the fourth positioning portion 2432 is inwardly retracted in the x-direction with respect to the second long side 222 of the base plate 220, and the second long side 2432-2 of the fourth positioning portion 2432 is located inside the second long side 222 of the base plate 220.

The fourth positioning portion 2432 may be any region of the reinforcing member 243 without any limitation thereto. Alternatively, with continued reference to fig. 16 and 17, the fourth positioning portion 2432 may be an area near one end of the reinforcing member 243 remote from the bent portion 233 of the circuit board 230.

In the design process, the size of the fourth positioning portion 2432 is smaller than that of the substrate 220 in the x direction, and the distance between each long side of the substrate 220 and the long side of the fourth positioning portion on the same side can be limited within an allowable error range, which is recorded as ± y, so as to facilitate detection.

Referring to fig. 19, in the process of bending the circuit board 230, if both long sides of the fourth positioning portion 2432 are not seen, meaning that each long side of the fourth positioning portion 2432 is already located inside the long side of the substrate 220 on the same side, as viewed from the z direction, it can be considered that the positioning of the third portion 234 in the y direction is satisfactory.

Fourth aspect of the invention

The fingerprint identification device of the embodiment of the application is used for being installed on the side face of electronic equipment, and specifically, the fingerprint identification device is installed by digging a hole in the side face of a main body of the electronic equipment. In some scenes, the side of the main body of the electronic device has a certain radian or inclination, and in order to embody the integration of the fingerprint identification device and the main body and improve the use hand feeling of a user, the embodiment of the application provides an improvement on the fingerprint chip assembly.

Referring to fig. 20, the fingerprint chip assembly 210 includes a working surface 215 for contacting an external object, and the working surface 215 is a curved surface (as shown in (a) of fig. 20) or a slope surface (as shown in (b) of fig. 20).

With continued reference to fig. 20, the fingerprint chip assembly 210 is generally comprised of a chip 216 and an EMC case encasing the chip 216, the surface in the EMC case for contact with external objects being the working surface of the fingerprint chip assembly 210.

Illustratively, during fabrication, the work surface 215 may be machined using Computer Numerical Control (CNC).

The fingerprint identification device of the embodiment of the application can be used for capacitive fingerprint identification, and the capacitance difference is formed by the chip and the conductive subcutaneous electrolyte so as to obtain fingerprint information. In addition, in order to make the measured electrical signal meet the actual requirements, a gain module may be provided in the fingerprint chip assembly for adjusting the measured electrical signal.

In the fingerprint recognition process, a finger presses on the working surface 215 of the fingerprint chip assembly 210 to form a capacitance difference between the working surface 215 and the chip 216, and in the case that the working surface 215 is a non-planar surface (a curved surface or a slope), different regions of the chip 216 have different distances from the working surface 215, for example, with reference to fig. 20, the distance from the point a on the working surface 215 to the chip 216 is short, the measured electrical signal is strong, the distance from the point B on the working surface 215 to the chip 216 is long, the measured electrical signal is weak, and the measured electrical signals of different sizes may affect the recognition effect.

Based on this, this application embodiment proposes another fingerprint chip subassembly. Optionally, the working surface 215 comprises a plurality of detection areas, the fingerprint chip assembly 210 comprises a plurality of gain modules corresponding to the plurality of detection areas, each gain module is used for adjusting the gain of the electrical signal detected by the fingerprint chip assembly 210 at the corresponding detection area, and the gains of the signals adjusted by at least two gain modules are different. The at least two gain modules represent two or more gain modules, and the difference in the gains of the signals adjusted by the at least two gain modules may be understood as the difference in the gains of the signals adjusted by any two gain modules in the at least two gain modules.

Thus, the signal intensity of the obtained signals can be made as uniform as possible to improve the recognition effect.

Here, the detection area on the working surface 215 may be divided according to the distance from the working surface 215 to the chip 216, and one detection area may be understood as a line formed by a plurality of detection points, or one detection area may be understood as an area including a plurality of detection points.

Fig. 21 is a schematic diagram showing a detection area of the working surface, and by way of example, taking the working surface shown in fig. 20 as an example, referring to fig. 21, each vertex of each cell can be understood as a detection point for detecting an electrical signal (or, a fingerprint signal), and the working surface 215 is separated by 8 lines along the x direction, and it can be understood that electrical signals detected at a plurality of detection points on each line in the x direction are approximately the same, and electrical signals detected at detection points on two adjacent lines in the x direction are different. Therefore, for example, one gain block may be arranged for all the detection points on each line, or, if the difference between the electric signals detected at the detection points on the lines is small, one gain block may be arranged for all the detection points on the lines, or, as shown in fig. 21, one gain block may be arranged for the detection points on two lines, where one detection area may be understood as two lines including a plurality of detection points, or one detection area may be understood as an area including a line including a plurality of detection points (for example, a plurality of small squares formed by a first line and a second line). Taking the arc surface shown in (a) of fig. 20 as an example, it can be understood that the distance from the detection region corresponding to the gain module 1 to the chip is smaller, and the detected electrical signal is larger, so that the gain of the adjusted electrical signal is smaller, the distance from the detection region corresponding to the gain module 2 to the chip is larger, and the detected electrical signal is smaller, so that the gain of the adjusted electrical signal is larger, and thus, electrical signals with approximately the same signal intensity can be obtained.

In order to improve the user experience, the edge of the working surface of the fingerprint chip assembly 210 for contacting with an external object may be chamfered or rounded to form a curved surface or a slant surface, so that the width of the fingerprint identification device may be narrowed in view of the user and the user's hand, thereby improving the user experience. It should be understood that the working surface of the fingerprint chip assembly 210 may be understood as a finger-contacted surface that receives a press from a user's finger.

Referring to (a) and (b) of fig. 22, the fingerprint chip assembly 210 includes a working surface 215, and an edge 215-a of the working surface 215 is a bevel surface which may be obtained by chamfering the edge of the working surface 215. Referring to fig. 22 (c), the edge 215-a of the working surface 215 is a curved surface, and may be obtained by rounding the edge of the working surface 215. Alternatively, the working surface 215 of the fingerprint chip assembly 210 may be a slope or a circular arc at the intersection with a side surface, which is a surface formed around the working surface 215.

The fingerprint recognition device according to the embodiment of the present application is described in detail above. In addition, the embodiment of the present application also provides an electronic device equipped with the fingerprint recognition device, and referring to fig. 1, 5 and 6, the electronic device includes a main body 10 and a fingerprint recognition device 20, a side surface of the main body 10 is provided with a hole 101, and the fingerprint recognition device 20 passes through the hole 101 and is connected to the main body 10. Optionally, the main body 10 is integrally formed, and the electronic device further includes a reinforcing bracket 40 fixedly connected to the main body 10 and the fingerprint recognition device 20, respectively.

The fingerprint recognition device 20 includes: the fingerprint chip assembly 210, the substrate 220 and the circuit board 230 are arranged in sequence. Alternatively, the circuit board 230 may be a U-shaped structure circuit board. Optionally, the fingerprint recognition device 20 further comprises a reinforcing member 240 fixedly connected to the circuit board 230.

For a detailed description of the improvement of each part in the fingerprint identification device, reference may be made to the above description of the embodiments corresponding to each of fig. 1 to 22, and for brevity, no further description is provided here.

It should be understood that in the embodiments of the present application, the terms "connected," "fixedly connected," and "contacting" are to be interpreted broadly unless otherwise explicitly stated or limited. Specific meanings of the above-mentioned various terms in the embodiments of the present application can be understood by those skilled in the art according to specific situations.

For example, the "connection" may be various connection manners such as fixed connection, rotational connection, flexible connection, movable connection, integral molding, electrical connection, and the like; may be directly connected to one another or may be indirectly connected to one another through intervening media, or may be interconnected within two elements or in an interactive relationship between the two elements.

By way of example, with respect to "fixedly attached," one element may be directly or indirectly fixedly attached to another element; the fixed connection may include mechanical connection, welding, bonding, and the like, wherein the mechanical connection may include riveting, bolting, screwing, keying, snapping, latching, plugging, and the like, and the bonding may include adhesive bonding, solvent bonding, and the like.

For example, the explanation of "contact" may be that one element is in direct contact or indirect contact with another element, and furthermore, the contact between two elements described in the embodiments of the present application may be understood as a contact within an allowable range of mounting error, and there may be a small gap due to the mounting error.

It should also be understood that "parallel" or "perpendicular" as described in the embodiments of the present application may be understood as "approximately parallel" or "approximately perpendicular".

It will be further understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the present application and to simplify description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the present application.

It should be noted that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. The features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A fingerprint recognition device, comprising:

2. The fingerprint recognition device of claim 1, further comprising:

3. The fingerprint recognition device according to claim 2, wherein the second portion includes a first positioning portion adjacent to a reference side of the base plate, the first positioning portion includes two step sides opposite in the first direction, the step sides of the first positioning portion include an inner side, an outer side, and a connecting side connecting the inner side and the outer side, the two connecting sides of the first positioning portion are located on both sides of the reference side, respectively, and the reference side is a short side connecting two long sides of the base plate.

4. The fingerprint recognition device according to claim 2 or 3, wherein the second part includes a second positioning portion including two long sides opposing in the first direction, each of the long sides of the second positioning portion being located inside a long side of the base plate on the same side.

5. The fingerprint identification device of any one of claims 2 to 4, further comprising a stiffening member fixedly attached to a surface of the second portion facing the first portion; and the number of the first and second groups,

6. The fingerprint identification device of any one of claims 2 to 5, further comprising a stiffening member fixedly attached to a surface of the second portion facing the first portion; and the number of the first and second groups,

7. The fingerprint recognition device according to any one of claims 1 to 6, wherein the fingerprint chip assembly comprises a working surface for contacting with an external object, the working surface being a bevel or a cambered surface.

8. The fingerprint recognition device of claim 7, wherein the working surface comprises a plurality of detection areas, the fingerprint chip assembly comprises a plurality of gain modules corresponding to the plurality of detection areas, each gain module is configured to adjust a gain of a signal detected by the fingerprint chip assembly at the corresponding detection area, and the gains of the signals adjusted by at least two gain modules of the plurality of gain modules are different.

9. The fingerprint recognition device according to any one of claims 1 to 8, wherein the fingerprint chip assembly comprises a working surface for contacting with an external object, and the edge of the working surface is a cambered surface or a bevel surface.

10. The fingerprint recognition device according to any one of claims 1 to 9, further comprising:

the circuit board is arranged on one side of the substrate, which is far away from the fingerprint chip assembly, and comprises a connecting part fixedly connected to the substrate, the substrate comprises a first extending region and a second extending region, wherein the first extending region and the second extending region extend outwards from two opposite long sides of the connecting part in the first direction respectively along the first direction, the first extending region and the second extending region are regions which are located between two ends of the connecting part in the second direction and face the surface of the circuit board, the extending region with the larger area in the first extending region and the second extending region is a dispensing region, and the second direction is parallel to the length direction of the substrate.

11. The fingerprint recognition device according to any one of claims 1 to 10, wherein the fingerprint chip assembly comprises two short sides opposite in a second direction, the substrate comprises two short sides opposite in the second direction, each short side of the substrate is located outside the short sides of the fingerprint chip assembly on the same side, and the second direction is parallel to the length direction of the substrate.

12. A fingerprint recognition device, comprising:

the circuit board is arranged on one side of the substrate and comprises a first part, a bent part and a second part, wherein the bent part is connected with the first part and the second part, the first part is positioned between the substrate and the second part, the second part comprises a first positioning part close to a reference side surface of the substrate, the first positioning part comprises two step side surfaces opposite in the first direction, the step side surfaces comprise an inner side surface, an outer side surface and a connecting side surface connecting the inner side surface and the outer side surface, and the two connecting side surfaces are respectively positioned on two sides of the reference side surface.

13. The fingerprint recognition device according to claim 12, wherein the second portion includes a second positioning portion including two long sides opposing in the first direction, each of the long sides of the second positioning portion being located inside a long side of the substrate on the same side.

14. A fingerprint recognition device, comprising:

15. The fingerprint recognition device according to claim 14, wherein the reinforcing member includes a fourth positioning portion including two long sides opposing in the first direction, each of the long sides of the fourth positioning portion being located inside a long side of the base plate on the same side.

16. An electronic device, comprising:

the side surface of the main body is provided with a hole;

the fingerprint recognition device according to any one of claims 1 to 11, said fingerprint recognition device passing through said hole and being connected to said body.

17. The electronic device of claim 16, wherein the body is integrally formed; and the number of the first and second groups,

18. An electronic device, comprising:

the side surface of the main body is provided with a hole;

the fingerprint recognition device of claim 12 or 13, said fingerprint recognition device passing through said aperture and being connected to said body.

19. The electronic device of claim 18, wherein the body is integrally formed; and the number of the first and second groups,

20. An electronic device, comprising:

the side surface of the main body is provided with a hole;

the fingerprint recognition device of claim 14 or 15, said fingerprint recognition device passing through said aperture and being connected to said body.

21. The electronic device of claim 20, wherein the body is integrally formed; and