CN112153845B

CN112153845B - Electronic equipment and circuit module thereof

Info

Publication number: CN112153845B
Application number: CN202011158948.1A
Authority: CN
Inventors: 伍伟竞; 王鹏; 张恒
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2020-10-26
Filing date: 2020-10-26
Publication date: 2022-04-29
Anticipated expiration: 2040-10-26
Also published as: CN112153845A

Abstract

The application discloses electronic equipment and circuit module thereof, circuit module includes the mainboard, the shielding lid, flexible circuit board, first component group and second component group, wherein, first component group and shielding lid are all installed in the mainboard, and the shielding lid covers first component group, flexible circuit board includes interconnect's linkage segment and erection section, the one end and the mainboard electric connection that the linkage segment is close to the erection section, and the one end that the linkage segment deviates from the erection section is used for the device module electric connection with electronic equipment, the erection section sets up in one side that the shielding lid deviates from the mainboard, second component group and erection section electric connection, and second component group sets up the side surface that the erection section deviates from the shielding lid. The circuit module disclosed by the technical scheme can solve the problem that the increase of the length of the battery is still limited by the size of the main board under the condition that the size of the whole electronic equipment is not changed.

Description

Electronic equipment and circuit module thereof

Technical Field

The application relates to the technical field of communication equipment, in particular to electronic equipment and a circuit module thereof.

Background

With the progress of technology, the functions of electronic devices are more and more diversified, which makes the power consumption of electronic devices gradually increase, and therefore, in order to ensure that the electronic devices have stronger cruising ability, the size of batteries in the electronic devices needs to be increased. It is known that, in an electronic device, a battery is one of all components of the electronic device having the largest thickness, and therefore, if the thickness of the battery is increased, the entire thickness of the electronic device is directly affected, whereas electronic devices such as mobile phones are being developed to be thinner, and therefore, the capacity of the electronic device can be increased only by increasing the length of the battery.

In electronic equipment such as cell-phone, battery and mainboard distribute along electronic equipment's length direction, consequently, the battery can still be mutually the elbow with the mainboard size, under the unchangeable condition of complete machine size, the increase of battery length still can receive the restriction of mainboard size.

Disclosure of Invention

The application discloses electronic equipment and circuit module thereof to in solving present electronic equipment, under the unchangeable condition of whole machine size, the increase of battery length still can receive the problem of mainboard size's restriction.

In order to solve the above problem, the embodiments of the present application are implemented as follows:

in a first aspect, embodiments of the present application provide a circuit module applied to an electronic device, the electronic device including a device module, the circuit module comprises a mainboard, a shielding cover, a flexible circuit board, a first element group and a second element group, wherein the first element group and the shielding cover are both mounted to the main board, and the shielding cover covers the first element group, the flexible circuit board comprises a connecting section and a mounting section which are mutually connected, one end of the connecting section close to the mounting section is electrically connected with the mainboard, and one end of the connecting section departing from the mounting section is used for electrically connecting with the device module, the mounting section is arranged on one side of the shielding cover departing from the mainboard, the second element group is electrically connected with the mounting section, and the second element group is arranged on one side surface of the mounting section, which is far away from the shielding cover.

In a second aspect, an embodiment of the present application provides an electronic device, which includes a device module and the above circuit module, where the device module is connected to the motherboard through the flexible circuit board.

The embodiment of the application discloses circuit module, it can be used in electronic equipment, first component group among the circuit module is installed on the mainboard, first component group still is equipped with the shielding lid, set up the one side that deviates from first component group at the shielding lid through making second component group, make first component group and second component group can follow the setting of mainboard thickness direction stromatolite, this can promote circuit module to installation space along the utilization ratio of thickness direction among the electronic equipment, reduce the total number of tiling and install the component on the mainboard, and then can reduce the required area that occupies of mainboard in the plane of perpendicular to thickness direction, under the unchangeable condition of electronic equipment's overall dimension, can make the area that the battery can occupy in the plane of perpendicular to thickness direction increase, thereby increase the capacity of battery.

And the second component group is installed on the installation section of the flexible circuit board, and the installation section is electrically connected with the main board and the device module through the connecting section, so that the second component can be ensured to normally work.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:

fig. 1 is an exploded view of a circuit module according to an embodiment of the disclosure;

fig. 2 is a schematic structural diagram of a circuit module according to an embodiment of the disclosure;

FIG. 3 is a schematic cross-sectional view of the circuit module shown in FIG. 2 along the A-A direction;

fig. 4 is an enlarged view of a portion I of the structure shown in fig. 3.

Description of reference numerals:

100-main board,

200-shielding cover, 210-mounting groove,

300-flexible circuit board, 310-connecting section, 320-transition section, 330-mounting section,

400-double-sided adhesive tape,

500-second element group, 510-driving chip, 530-peripheral component,

610-the first stiffening plate, 620-the second stiffening plate,

710-male seat, 720-female seat.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the technical solutions of the present application will be described in detail and completely with reference to the following specific embodiments of the present application and the accompanying drawings. It should be apparent that the described embodiments are only some of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Technical solutions disclosed in the embodiments of the present application are described in detail below with reference to the accompanying drawings.

As shown in fig. 1-4, an embodiment of the present application discloses a circuit module, which can be applied to an electronic device, where the electronic device includes a device module, and the device module may be a display module or a sub-board, which is not limited herein. The circuit module includes a main board 100, a shielding cover 200, a flexible circuit board 300, a first component group (not shown), and a second component group 500.

The first element group and the shielding cover 200 are both installed on the motherboard 100, specifically, the first element group may include a plurality of elements, the plurality of elements may include electronic elements such as a processor chip, the first element group and the motherboard 100 may form a fixed connection relationship therebetween in a manner of welding, and the first element group and the motherboard 100 may form an electrical connection relationship therebetween, so that the assembly efficiency is improved. The shielding cover 200 can be made of shielding materials such as copper or aluminum, the shielding cover 200 can be fixed on the motherboard 100 in a patch mode, the shielding cover 200 and the first element group are located on the same side of the motherboard 100, and the shielding cover 200 covers the first element group, so that the shielding cover 200 can provide shielding effect for the first element group, prevent the first element group from being interfered by other electronic elements, and ensure normal and stable operation of the first element group.

As shown in fig. 1, the flexible circuit board 300 includes a connection section 310 and a mounting section 330, and the connection section 310 and the mounting section 330 are connected to each other. Specifically, the connecting section 310 and the mounting section 330 may be of a split structure, and the connecting section 310 and the mounting section 330 are connected by welding or the like; alternatively, the connection section 310 and the mounting section 330 are of an integral structure, and by making the length of the flexible circuit board 300 relatively long, one part of the flexible circuit board 300 can be the connection section 310, and another part of the flexible circuit board 300 can be the mounting section 330, which also ensures that the flexible circuit board 300 includes the connection section 310 and the mounting section 330 that are connected to each other, and also makes the connection reliability between the connection section 310 and the mounting section 330 better.

Moreover, one end of the connecting section 310 close to the mounting section 330 is electrically connected to the motherboard 100, and one end of the connecting section 310 away from the mounting section 330 is electrically connected to the device module, that is, the device module and the motherboard 100 can form a connection relationship through the connecting section 310, so that the motherboard 100 can transmit electric energy to the device module, and interaction of communication information such as signals can be performed between the motherboard 100 and the device module. Specifically, the main board 100 and the device module may be connected to the connection section 310 by soldering or the like.

The mounting section 330 is disposed on a side of the shielding cover 200 away from the motherboard 100, that is, the mounting section 330, the shielding cover 200, and the first element group are arranged along a thickness direction of the motherboard 100, and the second element group 500 is electrically connected to the mounting section 330, and accordingly, the second element group 500 may be directly fixed on the mounting section 330 by welding or the like, so that the second element group 500 may be electrically connected to the motherboard 100 and/or the device module by the mounting section 330 and the connection section 310 which are connected to each other. Meanwhile, the second element group 500 is disposed on a side surface of the mounting section 330 facing away from the shielding cover 200, that is, the second element group 500 and the first element group are disposed on opposite sides of the shielding cover 200, respectively, and the second element group 500 and the first element group are stacked and spaced apart from each other by the shielding cover 200.

The embodiment of the application discloses circuit module, it can be used in electronic equipment, first component group among the circuit module is installed on mainboard 100, first component group still is equipped with shielding lid 200, set up the one side that deviates from first component group at shielding lid 200 through making second component group 500, make first component group and second component group 500 can follow mainboard 100's thickness direction stromatolite setting, this can promote circuit module to installation space along thickness direction's among the electronic equipment utilization ratio, reduce the total number of the component of tiling installation on mainboard 100, and then can reduce the required area that occupies of mainboard 100 in the plane of perpendicular to thickness direction, under the unchangeable condition of electronic equipment's overall dimension, can make the area that can occupy of battery in the plane of perpendicular to thickness direction increase, thereby increase the capacity of battery.

And, the second component group 500 is mounted on the mounting section 330 of the flexible circuit board 300, and the mounting section 330 is electrically connected with the main board 100 and the device module through the connection section 310, which can ensure that the second component can work normally.

As described above, the first element group may include a plurality of elements whose sizes in the thickness direction of the main board 100 are not completely equal, and in this case, one or several of the plurality of elements whose sizes are smaller in the thickness direction may be collectively mounted in a certain region below the shield cover 200, and one or several of the plurality of elements whose sizes are larger may be mounted in other regions than the aforementioned region in the shield cover 200. Further, the shielding cover 200 may be provided with a mounting groove 210, the mounting groove 210 is recessed toward a direction close to the motherboard 100, and the mounting section 330 is disposed in the mounting groove 210, so that a distance between the mounting section 330 and the motherboard 100 is smaller, and a distance between a side of the motherboard 100 departing from the shielding cover 200 and an end surface of the second element group 500 mounted on the mounting section 330 departing from the motherboard 100 is smaller, thereby further reducing the maximum thickness of the circuit module.

Specifically, the mounting groove 210 may be formed on the shielding cover 200 through a process of sheet metal, etc., and specific parameters of the mounting groove 210 may be determined according to a specific structure in the first element group. As described above, one or more of the first element groups having a smaller size in the thickness direction of the main board 100 may be distributed collectively, and a specific parameter range of the recess depth of the mounting groove 210 may be determined by combining the maximum value of the first element group in the thickness direction of the main board 100, according to the size of the one or more smaller sizes in the thickness direction of the main board 100. Also, the groove bottom of the mounting groove 210 may be made as close as possible to the smaller-sized component of the first component group, so that the depth of the mounting groove 210 is made as large as possible, which may further reduce the maximum distance between the first component group and the second component group 500, thereby enabling the maximum thickness of the circuit module to be reduced.

In addition, in the case that the thickness of the electronic device including the circuit module is constant, compared to the embodiment in which the shielding cover 200 is not provided with the mounting groove 210, in the present embodiment, the thickness space at the mounting groove 210 is increased based on the existence of the mounting groove 210, and further, some components that cannot be stacked with other components on the main board 100 due to a relatively large thickness can be disposed at the mounting groove 210, so that the total number of components that have to be tiled and mounted on the main board 100 due to a relatively large thickness is further reduced, and the area occupied by the surface of the main board 100 in the direction perpendicular to the thickness can be further reduced, and accordingly, even though the overall size of the electronic device is kept unchanged, the size of the battery can be further increased, and the capacity of the battery can be increased.

As described above, the first element group is mounted on the main board 100, and the flexible circuit board 300 is also connected to the main board 100, and further, the main board 100 includes a mounting area and a connection area, and the connection area is located outside the mounting area. Specifically, the specific ranges of the mounting area and the connection area may be determined according to the shape and size of the motherboard 100, the number and kinds of elements in the first element group, and other parameters, wherein both the mounting area and the connection area may be areas with a more regular shape, or at least one of the two areas may be areas with an irregular shape. It should be noted that no obvious boundary mark or object may be provided between the mounting area and the connection area, and the mounting area and the connection area are both part of the motherboard 100, but there is a difference in function.

The first element group and the shielding cover 200 are both disposed in the mounting area, and one end of the connection section 310 close to the mounting section 330 is electrically connected to the connection area, specifically, the first element group may be mounted in the mounting area by welding, and the connection section 310 is electrically connected to the connection area. By adopting the technical scheme, the assembly efficiency of the circuit module can be improved through reasonable region division, the distribution compactness of each element on the mainboard 100 can be improved, the layout of each element on the mainboard 100 is more reasonable, and the space utilization rate of the mainboard 100 is improved; moreover, the connecting area is located outside the mounting area, so that the connection confusion between different functional areas on the main board 100 can be avoided basically, the short circuit condition caused by the error contact between elements in the circuit module is not easy to occur, the safety performance of the circuit module is improved, and the service life of the circuit module can be prolonged.

Based on the above-described embodiment, in the process of assembling the circuit module, the mounting section 330 in the flexible circuit board 300 may be made to pass over the connection region to be disposed on the side of the shield cover 200 facing away from the main board 100, and the mounting section 330 is disposed on the shield cover 200. In this case, the connection section 310 of the flexible circuit board 300 connected to the mounting section 330 may be directed toward the connection area, which facilitates the connection between the connection section 310 and the connection area of the motherboard 100, and the flexible circuit board 300 has substantially no longer redundant portion, thereby further improving the utilization of the space in the electronic device.

Meanwhile, as shown in fig. 1, the mounting groove 210 may be located at an end of the shield cover 200 near the connection region, in which case the mounting section 330 is allowed to be directly mounted in the mounting groove 210 after passing over the connection region, and the distance between the mounting groove 210 and the side of the flexible circuit board 300 is reduced to further reduce the overall length of the flexible circuit board 300. Moreover, when the above-mentioned technical solution is adopted, when the mounting segment 330 extends from the connection area with a smaller thickness to the shielding cover 200, since the side wall is not disposed at the side of the mounting groove 210 close to the connection area, the height that the mounting segment 330 needs to be lifted away from the motherboard 100 is smaller than the thickness of the shielding cover 200, which can also reduce the length of the flexible circuit board 300 to a certain extent.

Further, as shown in fig. 4, the flexible circuit board 300 may further include a transition section 320, and the mounting section 330 is connected to the connection section 310 through the transition section 320, so that the mounting section 330 and the connection section 310 form a physical connection and an electrical connection relationship, and more specifically, the mounting section 330, the transition section 320 and the connection section 310 may be formed in an integral manner, that is, different portions of the flexible circuit board 300 are the mounting section 330, the transition section 320 and the connection section 310, respectively.

Meanwhile, the length of the transition section 320 may be made greater than the distance between the mounting section 330 and the connection section 310, in which case, as shown in fig. 4, the transition section 320 may be accommodated in the space between the mounting section 330 and the connection section 310 by generating a certain curl, in which case, during the process of mounting the flexible circuit board 300, the transition section 320 may provide a mounting margin for the mounting section 330 and the connection section 310, and may also prevent the mounting section 330 and the connection section 310 from being in a tight state for a long time to adversely affect the connection reliability between the mounting section 330 and the shielding cover 200, and between the connection section 310 and the motherboard 100, improve the reliability of the circuit module, and may improve the service life of the flexible circuit board 300 to a certain extent.

Optionally, the mounting segment 330 is fixed on the surface of the shielding cover 200 by bonding, specifically, the mounting segment 330 may be bonded on the surface of the shielding cover 200 by glue, in another embodiment of the present application, the mounting segment 330 may be bonded and fixed on the surface of the shielding cover 200 by a double-sided tape 400, so as to prevent problems such as glue overflow on one hand, and on the other hand, ensure that the fitting relationship between any position on the mounting segment 330 and the shielding cover 200 is reliable.

Optionally, as shown in fig. 4, the circuit module further includes a first reinforcing plate 610, the first reinforcing plate 610 may be made of a material with a relatively high structural strength, such as metal, and the first reinforcing plate 610 is disposed on a side surface of the mounting section 330 facing the shielding cover 200, so that under the action of the first reinforcing plate 610, on one hand, the structural strength of the mounting section 330 can be improved, and on the other hand, by means of the first reinforcing plate 610, the surface of the mounting section 330 can be as flat as possible, and the mounting section 330 has a relatively high supporting capability, so as to reduce the difficulty in assembling the second element group 500 and the mounting section 330; in addition, in the case that the first reinforcing plate 610 is disposed on the side surface of the mounting section 330 facing the shielding cover 200, the first reinforcing plate 610 may be fixed on the shielding cover 200, and as described above, the first reinforcing plate 610 may be adhesively fixed on the shielding cover 200 by the double-sided tape 400, so that the mounting section 330 and the shielding cover 200 are ensured to form a stable fixed relationship, and the difficulty of fixing and connecting the mounting section 330 and the shielding cover 200 is relatively low.

Further, one end of the connection section 310 close to the mounting section 330 may be electrically connected to the main board 100 through a Board To Board (BTB) connection seat, which may reduce the connection difficulty between the flexible circuit board 300 and the main board 100 and may improve the connection reliability therebetween. The BTB connector base includes a male base 710 and a female base 720, one of the male base 710 and the female base 720 is mounted on the motherboard 100, the other is mounted in a predetermined area of the connecting section 310, the predetermined area of the connecting section 310 is an area where a part of the structure of the connecting section 310 where the male base 710 or the female base 720 is mounted is located, and more specifically, the predetermined area of the connecting section 310 may be a part where the connecting section 310 is connected with the mounting section 330, so as to prevent redundancy of the connecting section 310 or the mounting section 330, and further reduce the total length of the flexible circuit board 300. Optionally, the female socket 720 is installed at the connection region of the motherboard 100 by soldering or the like, and the male socket 710 is installed in a predetermined region of the connection section 310 in the flexible circuit board 300, so that the male socket 710 is inserted into the female socket 720 during the process of assembling the flexible circuit board 300 and the motherboard 100, thereby further improving the assembling efficiency.

Further, as shown in fig. 4, the circuit module may further include a second reinforcing plate 620, the second reinforcing plate 620 may be made of a material with relatively high structural strength, such as metal, the second reinforcing plate 620 is disposed on a side surface of the predetermined area of the connecting section 310, which is away from the main board 100, the size parameter of the second reinforcing plate 620 may be determined according to the size of the predetermined area of the connecting section 310, and the sizes of the second reinforcing plates 620 may each be made slightly larger than the size of a preset area in the corresponding direction, so that in the process of connecting the main board 100 and the flexible circuit board 300 through the BTB connector holder, the second reinforcing plate 620 may provide a reliable supporting function to a portion of the connection section 310 located at a predetermined region, therefore, in the process of inserting the male seat 710 and the female seat 720, a certain force can be applied to the second reinforcing plate 620, so that the male seat 710 and the female seat 720 can be easily inserted into a whole.

As described above, the flexible circuit board 300 is connected to the main board 100, the second element group 500 mounted on the mounting section 330 of the flexible circuit board 300 is also connected to the flexible circuit board 300, and the flexible circuit board 300 is further electrically connected to the device module in the electronic apparatus. Wherein, the components in the second component group 500 can be matched with a plurality of device modules. For example, the second component group 500 includes a processor chip, in the electronic apparatus, the processor chip is connected to a plurality of device modules in the electronic apparatus, such as a screen module, a fingerprint identification module, a lens module, and the like, and if the processor chip is mounted on the flexible circuit board 300, the processor chip needs to pass through the flexible circuit board 300, the main board 100, and another flexible circuit board to be connected to other device modules, which may adversely affect the data processing capability and the data processing speed of the processor chip.

Further, optionally, the second component group 500 includes a driving chip 510 of the device module and a peripheral component 530, where the driving chip 510 is a chip of the driving device module, and the peripheral component 530 is a component related to the driving chip 510. The second component group 500 may be connected to the device module through the flexible circuit board 300, so as to ensure that the driving chip 510 and the peripheral component 530 can provide a driving function for the device module. In addition, the connection path between the second component group 500 and the device module is short, so that the communication efficiency between the second component group 500 and the device module can be ensured to be high. Correspondingly, under the condition of adopting the technical scheme, elements such as a processor and the like which are connected with a plurality of device modules can be directly installed on the mainboard 100 to form a first element group, so that the communication efficiency between the first element group and different device modules is relatively high, and the response speed of the circuit modules is improved.

Based on the circuit module disclosed in any of the above embodiments, the embodiment of the present application further discloses an electronic device, the electronic device includes a device module and any of the above circuit modules, the circuit module includes a motherboard 100, a shielding cover 200, a flexible circuit board 300, a first element group and a second element group 500, and the device module is electrically connected to the motherboard 100 through the flexible circuit board 300.

The electronic device disclosed by the embodiment of the application can be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, which is not limited in this embodiment of the application.

In the embodiments of the present application, the difference between the embodiments is described in detail, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in view of brevity of the text.

The above description is only an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A circuit module is applied to electronic equipment which comprises a device module and is characterized in that the circuit module comprises a mainboard, a shielding cover, a flexible circuit board, a first element group and a second element group, wherein the mainboard comprises a mounting area and a connecting area, the connecting area is positioned outside the mounting area, the first element group and the shielding cover are both arranged in the mounting area, the shielding cover covers the first element group, the shielding cover is provided with a mounting groove, the mounting groove is sunken towards the direction close to the mainboard, the mounting groove is positioned at one end, close to the connecting area, of the shielding cover, the flexible circuit board comprises a connecting section and a mounting section which are connected with each other, one end, close to the mounting section, of the connecting section is electrically connected with the connecting area, and one end, away from the mounting section, of the connecting section is electrically connected with the device module, the mounting section crosses the connecting area set up in the shielding cover deviates from one side of mainboard, just the mounting section set up in mounting groove, the second component group with mounting section electric connection, just the second component group sets up in the mounting section deviates from a side surface of shielding cover.

2. The circuit module of claim 1, wherein the flexible circuit board further comprises a transition section, the mounting section is connected with the connection section through the transition section, and the length of the transition section is greater than the distance between the mounting section and the connection section.

3. The circuit module of claim 1, wherein the mounting segment is adhesively secured to a surface of the shield cover.

4. The circuit module according to claim 1, further comprising a first reinforcing plate disposed on a side surface of the mounting section facing the shielding cover.

5. The circuit module as claimed in claim 1, wherein an end of the connecting section near the mounting section is electrically connected to the motherboard via a BTB connecting seat, the BTB connecting seat includes a male seat and a female seat, one of the male seat and the female seat is mounted on the motherboard, and the other one of the male seat and the female seat is mounted on a predetermined region of the connecting section.

6. The circuit module according to claim 5, further comprising a second stiffener, wherein the second stiffener is disposed on a side surface of the predetermined area facing away from the main board.

7. The circuit module of claim 1, wherein the second element group comprises a driver chip and peripheral components of the device module.

8. An electronic device comprising a device module and the circuit module according to any one of claims 1 to 7, wherein the device module is connected to the main board through the flexible circuit board.