CN211184556U - Electronic equipment - Google Patents

Abstract

The utility model discloses an electronic device. The electronic device comprises a casing, a battery, a first circuit board and a heat sink. The battery is arranged in the casing, and the area on the casing is opposite to the battery. An escape space is provided; the first circuit board is arranged in the casing; the heat dissipation device is thermally connected to the first circuit board, and part of the heat dissipation device extends between the casing and the battery, and located within the avoidance space. At this time, a part of the heat dissipation device is hidden in the avoidance space, so that the stacked structure of the heat dissipation device and the battery occupies less housing space, thereby making the thickness of the electronic device smaller, thereby promoting the development of thin and light electronic devices.

Description

Electronic equipment

technical field

The utility model relates to the technical field of communication equipment, in particular to an electronic equipment.

Background technique

The electronic components of electronic equipment will generate heat when working. If the heat cannot be radiated in time, it will lead to heat accumulation, which may affect the normal use of the corresponding functions and even damage the electronic equipment.

The traditional heat dissipation method is mainly to attach heat dissipation components around the electronic components of the electronic equipment, and the heat dissipation components radiate heat out. In electronic equipment, the main arrangement of the heat sink is to attach the heat sink to the housing, a part of the heat sink is located between the housing and the battery, and the battery is bonded to the housing. At this time, the heat generated by the electronic components is transferred to the heat sink, and then to the middle frame and the battery. Since the temperature of the middle frame and the battery is low, the heat is radiated out to achieve the purpose of heat dissipation.

However, in the above structure, the radiator component is attached to the casing, and the battery is pressed on the radiator component. At this time, the size of the stack structure of the radiator component and the battery is relatively large, so that the radiator component and the battery occupy a large space in the casing, resulting in the loss of electronic components. The thickness of the device is relatively large, so that the thinness of the electronic device needs to be improved.

Utility model content

The utility model discloses an electronic device to solve the problem of the large thickness of the electronic device.

In order to solve the above-mentioned technical problems, the utility model is realized in this way:

The embodiment of the present utility model discloses an electronic device, comprising:

case;

a battery, the battery is arranged in the casing, and an escape space is provided in the area of the casing opposite to the battery;

a first circuit board, the first circuit board is arranged in the housing;

a heat dissipation device, the heat dissipation device is thermally connected to the first circuit board, and a part of the heat dissipation device extends between the casing and the battery, and is located in the avoidance space.

The technical scheme adopted by the utility model can achieve the following beneficial effects:

In the electronic device disclosed in the present invention, the area on the casing opposite to the battery is provided with an avoidance space, and a part of the heat dissipation component is located in the avoidance space. The stacked structure occupies less space in the housing, thereby making the thickness of the electronic device smaller, thereby promoting the development of thin and light electronic devices.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the following briefly introduces the accompanying drawings required for the description of the embodiments or the background technology. It is obvious to those skilled in the art that , on the premise of no creative labor, other drawings can also be obtained from these drawings.

1 is an exploded view of an electronic device disclosed in an embodiment of the present utility model;

2 is an exploded view of another direction of the electronic device disclosed in the embodiment of the present utility model;

3 is a partial structural schematic diagram of an electronic device disclosed in an embodiment of the present invention;

4 is a partial cross-sectional view of an electronic device disclosed in an embodiment of the present invention.

Description of reference numbers:

100-shell,

200-electric ground,

310-first circuit board, 320-electronic components, 330-shield cover, 331-first cover, 332-second cover, 340-heat transfer part, 350-heat dissipation filler,

400-radiation parts,

510-avoidance space, 520-accommodating groove,

600-Second circuit board,

700-Fixed piece,

810-first double-sided tape, 820-second double-sided tape, 830-bonding part.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

The technical solutions disclosed by the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

As shown in FIGS. 1 to 4 , an embodiment of the present invention discloses an electronic device, which may specifically include a housing 100 , a battery 200 , a first circuit board 310 , and a heat sink 400 .

The housing 100 provides installation space for the components of the electronic device. The housing 100 may specifically include an integrated middle frame, or may include a middle frame and an upper cover of the main board, and the upper cover of the main board is installed on the middle frame.

The battery 200 is disposed inside the casing 100 , and the battery 200 provides electrical power for the electronic device, so that the electronic device can work normally. Optionally, the battery 200 may be a lithium battery 200 . The battery 200 is adhered to the casing 100 by the first double-sided adhesive tape 810. An escape space 510 is defined in an area of the casing 100 opposite to the battery 200 . When the casing 100 is an integrated middle frame, the avoidance space 510 can be opened on the middle frame; when the casing 100 includes the middle frame and the main board upper cover, the avoidance space 510 can be opened on the main board upper cover. The escape space 510 may be an escape groove, or may be an escape through hole penetrating the casing 100 .

The first circuit board 310 is disposed in the housing 100 , and the first circuit board 310 may be a mainboard of an electronic device, or may be a circuit board connected to other functional devices. In the embodiment of the present invention, the first circuit board 310 may be a rigid circuit board or a circuit board with certain flexibility. For example, the first circuit board 310 may be a printed circuit board, or a rigid-flex board, or the first circuit board 310 may include a flexible circuit board and a reinforcing board that are attached to each other. Of course, other structural forms can also be used, which are not limited in this article.

The heat dissipation device 400 is thermally connected to the first circuit board 310 , and a part of the heat dissipation device 400 extends between the casing 100 and the battery 200 and is located in the avoidance space 510 . The heat generated by the electronic components 320 of the first circuit board 310 is transferred to the heat dissipation device 400 , and the heat dissipation device 400 transfers the heat to the middle frame and the battery 200 to radiate the heat to achieve the purpose of heat dissipation. Specifically, the heat dissipation device 400 may include at least one of a heat pipe and a vapor chamber, and the heat pipe and the vapor chamber are filled with a phase change medium, so that the heat dissipation performance of the electronic device can be improved.

In the embodiment of the present invention, the area of the casing 100 opposite to the battery 200 is provided with an avoidance space 510 , and a part of the heat dissipation device 400 is located in the avoidance space 510 . At this time, a part of the heat dissipation device 400 is hidden in the avoidance space 510 . The stacked structure of the heat dissipation device 400 and the battery 200 occupies less space in the casing 100, thereby making the thickness of the electronic device smaller, thereby promoting the development of thin and light electronic devices.

In the above embodiment, the avoidance space 510 may be an avoidance groove, or may be an avoidance through hole penetrating the casing 100 . Since the wall thickness of the casing 100 is relatively small, the size reduction of the thickness of the electronic device by opening the avoidance groove is limited. In order to further reduce the thickness of the electronic device and further improve the lightness and thinness of the electronic device, an optional embodiment Among them, the avoidance space 510 may be an avoidance through hole penetrating through the casing 100 . At this time, the heat dissipation component 400 extending between the casing 100 and the battery 200 is located in the avoidance through hole, which further reduces the space occupied by the heat dissipation component 400 and the battery 200 on the casing 100, thereby further reducing the thickness of the electronic device , which further improves the thinness and lightness of electronic devices.

In the above-mentioned embodiment, a part of the heat sink components 400 are located in the avoidance through holes, and another part of the heat sink components 400 are located outside the avoidance through holes. The size is relatively large, so that the heat dissipation device 400 and the first circuit board 310 occupy a relatively large space in the housing 100 . To this end, in another embodiment, the housing 100 is provided with an accommodating groove 520 on the side away from the first circuit board 310, and the accommodating groove 520 communicates with the avoidance space 510. At this time, the heat dissipation outside the avoidance through hole The device 400 is disposed in the receiving groove 520 . In this solution, the heat dissipation device 400 overlapping with the circuit board is disposed in the accommodating groove 520. At this time, a part of the heat dissipation device 400 can be hidden in the accommodating groove 520, so that the heat dissipation device 400 and the first circuit board 310 are opposite to each other. The height of the protruding portion of the housing 100 is reduced, so that the space occupied by the heat dissipation device 400 and the first circuit board 310 is reduced in the housing 100 . Meanwhile, the heat dissipation device 400 is installed on a side away from the first circuit board 310 so as not to interfere with the installation of the first circuit board 310 . Specifically, the heat dissipation device 400 is adhered in the accommodating groove 520 by the second double-sided adhesive tape 820 .

The electronic device further includes a second circuit board 600, and the second circuit board 600 electrically connects the first circuit board 310 with other circuit boards to realize signal transmission. In the background art, the second circuit board 600 can pass through the gap between the casing 100 and the battery 200, so that the disassembly of the battery 200 will not be affected. If the device 400 and the second circuit board 600 are arranged overlappingly, the thickness of the electronic device will increase, making the layout of the electronic device difficult; The reliability of the battery 200 is affected.

In an optional embodiment, the second circuit board 600 is disposed between the casing 100 and the battery 200 , the second circuit board 600 is stacked with the heat sink 400 , and the second circuit board 600 is electrically connected to the first circuit board 310 . . At this time, part of the heat dissipation device 400 is located in the avoidance space, so the heat dissipation device 400 can be overlapped with the second circuit board 600 without affecting the thickness of the electronic device. The bonding area between the battery 200 and the casing 100 is affected, thereby improving the bonding reliability of the battery 200 .

Since the heat dissipation device 400 located in the avoidance space 510 is in a suspended state, this may cause the suspended part of the heat dissipation device 400 to shake, thereby causing the heat dissipation device 400 to break. Therefore, in an optional embodiment, the above electronic device further includes a fixing piece 700, the fixing piece 700 is located between the second circuit board 600 and the heat sink 400, the fixing piece 700 is connected to the second circuit board 600, the heat sink 400 and the The casings 100 are all connected, and the fixing piece 700 covers the avoidance space 510 . At this time, the fixing sheet 700 can fix the heat dissipation device 400, thereby preventing the heat dissipation device 400 from shaking, making the heat dissipation device 400 not easily broken, thereby improving the safety and reliability of the electronic device.

Since the heat sink 400 is located in the avoidance space 510 , if the rigidity of the fixing piece 700 is large, the heat sink 400 cannot be bent, so that the bonding area between the heat sink 400 and the fixing piece 700 is small, so that the fixing effect of the fixing piece 700 is poor. . In another embodiment, the fixing sheet 700 may be a flexible structural member. In this structure, the edge of the fixing sheet 700 is connected with the casing 100, and the middle area can be bent into the avoidance space 510, so as to be connected with the heat sink 400. At this time, the bonding area between the heat sink 400 and the fixing sheet 700 is relatively large. , so that the fixing sheet 700 and the heat dissipation device 400 are connected and fastened. Specifically, the fixing sheet 700 and the heat dissipation device 400 may be bonded by double-sided tape. The fixing sheet 700 can be made of PET (Polyethylene terephthalate, polyethylene terephthalate) material.

Specifically, the electronic device further includes an adhesive portion 830, the adhesive portion 830 has a first adhesive surface and a second adhesive surface disposed opposite to each other, the first adhesive surface is attached to the fixing sheet 700, and the second adhesive surface is The surface is attached to the second circuit board 600, and the adhesiveness of the first adhesive surface is greater than that of the second adhesive surface. At this time, when the electronic device is repaired, due to the difference in viscosity between the first adhesive surface and the second adhesive surface, the fixing sheet 700 and the heat sink 400 will not be affected when the second circuit board 600 is removed, so that the heat sink 400 is not easily damaged. , thereby improving the maintenance performance of electronic equipment.

In an optional embodiment, a part of the heat dissipation device 400 is disposed opposite to the first circuit board 310 , and the first circuit board 310 is provided with a shielding cover 330 . The interference of the electronic components 320, and at the same time, the electromagnetic wave interference between the electronic components 320 on the first circuit board 310 is reduced. The shielding cover 330 includes a first cover 331 and a second cover 332 . The first cover 331 is fixedly connected to the first circuit board 310 , the first cover 331 has a perforation, and at least one electronic component on the first circuit board 310 320 faces the through hole, the second cover body 332 is detachably connected to the first cover body 331 , the second cover body 332 covers the through hole, and the second cover body 332 is thermally connected to the heat dissipation device 400 . In this solution, after the second cover body 332 is separated from the first cover body 331, the electronic components 320 on the first circuit board 310 are exposed, so that the electronic components 320 can be maintained, which makes maintenance convenient, and at the same time, also The first circuit board 310 and the shielding cover 330 will not be damaged. Specifically, the first cover 331 can be welded to the first circuit board 310 , and then the second cover 332 can be connected to the first cover 331 by clamping.

Because the rigidity of the second cover 332 and the heat dissipation device 400 is relatively large, the second cover 332 and the heat dissipation device 400 may wear each other when they are in direct contact. Therefore, in one embodiment, the electronic device further includes a heat transfer part. 340, the heat transfer part 340 is thermally connected with the second cover body 332 and the heat dissipation component 400 respectively. The heat transfer portion 340 can buffer the second cover body 332 and the heat dissipation device 400 , thereby preventing the second cover body 332 and the heat dissipation device 400 from wearing each other. Specifically, the heat transfer part 340 may be thermally conductive silica gel, which has good elasticity and good thermal conductivity.

The electronic components 320 in the shielding cover 330 only rely on the air in the shielding cover 330 to transfer heat, so that the heat transfer efficiency is low. In an optional embodiment, the electronic device further includes a heat dissipation filler 350 , and the first cover 331 is filled with the heat dissipation filler 350 , so that the electronic components 320 are embedded in the heat dissipation filler 350 . At this time, the heat generated by the electronic components 320 is transferred to the shielding cover 330 through the heat dissipation filler 350, so that the heat transfer efficiency is high. At the same time, the electronic components 320 are embedded in the heat dissipation filler 350, which can protect the electronic components 320 in the first cover 331, which is beneficial to isolate the electronic components 320 from the moisture entering the first cover 331. To achieve better waterproof effect. In addition, the heat dissipation filler 350 makes the connection between the electronic component 320 and the first circuit board 310 more secure, thereby further improving the reliability of the electronic device. Specifically, the heat-dissipating filler 350 may be a thermally conductive gel.

The electronic device disclosed in the embodiment of the present invention may be a smart phone, a tablet computer, an electronic book reader or a wearable device. Of course, the electronic device may also be other devices, which are not limited in this embodiment of the present invention.

The above embodiments of the present invention mainly describe the differences between the various embodiments. As long as the different optimized features of the various embodiments are not contradictory, they can be combined to form better embodiments. Considering the conciseness of the text, here It will not be repeated.

The above descriptions are merely examples of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the scope of the claims of the present utility model.

Claims (10)

1. an electronic device, is characterized in that, comprises: case; a battery, the battery is arranged in the casing, and an escape space is provided in the area of the casing opposite to the battery; a first circuit board, the first circuit board is arranged in the housing; a heat dissipation device, the heat dissipation device is thermally connected to the first circuit board, and a part of the heat dissipation device extends between the casing and the battery, and is located in the avoidance space. 2 . The electronic device according to claim 1 , wherein the avoidance space is an avoidance through hole penetrating through the casing. 3 . 3 . The electronic device according to claim 2 , wherein the housing is provided with a receiving groove on a side away from the first circuit board, and the receiving groove is communicated with the avoidance space, and a part of the accommodating groove is in communication with the avoidance space. 4 . The heat dissipation device is arranged in the accommodating groove. 4. The electronic device according to claim 1, wherein the electronic device further comprises a second circuit board, the second circuit board is disposed between the casing and the battery, the second circuit board is A circuit board is stacked with the heat dissipation device, and the second circuit board is electrically connected with the first circuit board. 5 . The electronic device according to claim 4 , wherein the electronic device further comprises a fixing piece, the fixing piece is located between the second circuit board and the heat sink, and the fixing piece is connected to the heat sink. 6 . The second circuit board, the heat dissipating component and the housing are all connected, the fixing sheet covers the avoidance space, and the fixing sheet is a flexible structural member. 6 . The electronic device according to claim 5 , wherein the electronic device further comprises an adhesive part, the adhesive part has a first adhesive surface and a second adhesive surface arranged opposite to each other, the The first adhesive surface is attached to the fixing sheet, the second adhesive surface is attached to the second circuit board, and the viscosity of the first adhesive surface is greater than that of the second adhesive surface. viscosity. 7 . The electronic device according to claim 1 , wherein a part of the heat dissipation device is disposed opposite to the first circuit board, the first circuit board is provided with a shielding cover, and the shielding cover comprises a first circuit board. 8 . A cover body and a second cover body, the first cover body is fixedly connected to the first circuit board, the first cover body is provided with a through hole, and at least one electronic component on the first circuit board faces the through hole , the second cover is detachably connected to the first cover, the second cover covers the through hole, and the second cover is thermally connected to the heat sink. 8 . The electronic device according to claim 7 , wherein the electronic device further comprises a heat transfer part, and the heat transfer part is thermally connected to the second cover body and the heat dissipation device respectively. 9 . 9 . The electronic device according to claim 7 , wherein the electronic device further comprises a heat-dissipating filler, and the first cover is filled with the heat-dissipating filler, so that the electronic component is embedded in the in the heat-dissipating filler described above. 10. The electronic device according to any one of claims 1 to 9, wherein the heat dissipation component comprises at least one of a heat pipe and a vapor chamber.

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