CN111147638A - Fingerprint identification module and electronic equipment thereof - Google Patents
Fingerprint identification module and electronic equipment thereof Download PDFInfo
- Publication number
- CN111147638A CN111147638A CN201911402872.XA CN201911402872A CN111147638A CN 111147638 A CN111147638 A CN 111147638A CN 201911402872 A CN201911402872 A CN 201911402872A CN 111147638 A CN111147638 A CN 111147638A
- Authority
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- China
- Prior art keywords
- fingerprint identification
- identification module
- main body
- circuit board
- display screen
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
The application provides a fingerprint identification module and electronic equipment thereof, this fingerprint identification module includes: the fingerprint identification device comprises a fingerprint identification chip, a flexible circuit board, a supporting plate and a lead; fingerprint identification chip and flexible circuit board set up in the coplanar of backup pad. The flexible circuit board comprises a main body part and a connecting part which are of an integrated structure; the connecting part is arranged on one surface of the main body part close to the fingerprint identification chip, and the thickness of the connecting part in the direction far away from the support plate is smaller than that of the main body part in the direction far away from the support plate; the lead wires are respectively connected with the fingerprint identification chip and the connecting part. The application provides a fingerprint identification module has reduced the whole thickness of module, has still avoided the lead wire perk arc height to lead to the easy cracked problem of lead wire, has improved the reliability and the stability of fingerprint identification module.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a fingerprint identification module and electronic equipment thereof.
Background
No matter traditional fingerprint unblock adopts the positive scraping or presses the mode unblock, still adopts the back unblock, all can influence the outward appearance of electronic equipment such as cell-phone. For example, capacitive fingerprint unlocking requires a fingerprint acquisition window, which inevitably affects screen occupation. Therefore, to improve screen occupation, the unlocking of the finger print under the screen is carried out. However, as the mobile phone becomes thinner and lighter, the thickness of the fingerprint recognition module under the screen becomes a bottleneck limiting the thickness of the mobile phone.
Disclosure of Invention
An aspect of the embodiment of the present application provides a fingerprint identification module for electronic equipment, the fingerprint identification module includes: the fingerprint identification device comprises a fingerprint identification chip, a flexible circuit board, a supporting plate and a lead; the fingerprint identification chip and the flexible circuit board are arranged on the same surface of the supporting plate, and the fingerprint identification chip and the flexible circuit board are arranged at intervals; wherein: the flexible circuit board comprises a main body part and a connecting part which are of an integrated structure; the connecting part is arranged on one surface of the main body part, which is close to the fingerprint identification chip, and the thickness of the connecting part in the direction far away from the supporting plate is smaller than that of the main body part in the direction far away from the supporting plate; one end of the lead is connected with the fingerprint identification chip, and the other end of the lead is connected with the connecting part.
Another aspect of the embodiments of the present application provides an electronic device, including: the display screen, the shell, the mainboard and the fingerprint identification module; the display screen cover is arranged on the shell to form an accommodating space; the mainboard and the fingerprint identification module are arranged in the accommodating space; the mainboard with fingerprint identification module electric connection.
The fingerprint identification module that this application embodiment provided through with fingerprint identification chip and flexible circuit board setting in the one side of backup pad, has reduced the thickness of fingerprint identification module. The flexible circuit board comprises a main body part and a connecting part which are of an integral structure, the thickness of the connecting part in the direction far away from the supporting plate is smaller than the thickness of the main body part in the direction far away from the supporting plate, and therefore the connecting part and the fingerprint identification chip are poor in step difference, the tilting arc height of the lead is reduced, the problem that the tilting arc height of the lead is too high to cause easy breakage can be avoided, and the reliability and the stability of the fingerprint identification module are improved to a certain extent.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of some fingerprint recognition modules;
fig. 2 is a schematic structural diagram of an electronic device 10 provided in an embodiment of the present application;
FIG. 3 is an exploded view of the electronic device 10 of FIG. 2;
FIG. 4 is a schematic diagram of a planar structure of the electronic device 10 of FIG. 2;
FIG. 5 is a schematic diagram of a partial cross-sectional view of the electronic device 10 of FIG. 3 taken along line IV-IV;
FIG. 6 is a schematic diagram of a part of the fingerprint identification module 13 in FIG. 5;
FIG. 7 is an enlarged view of a portion of the fingerprint identification module 13 of FIG. 5;
FIG. 8 is a schematic view of another structure of the fingerprint identification module 13;
FIG. 9 is a schematic diagram of another structure of the fingerprint identification module 13;
FIG. 10 is a schematic diagram of another structure of the fingerprint identification module 13;
fig. 11 is a schematic cross-sectional structure diagram of the flexible circuit board 132 in fig. 5.
Detailed Description
As used herein, an "electronic device" (or simply "terminal") includes, but is not limited to, an apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.
Referring to fig. 1, fig. 1 is a schematic structural diagram of some fingerprint recognition modules.
The inventor finds that some under-screen fingerprint unlocking schemes are that a fingerprint identification module is installed between a middle frame and a display screen. As shown in fig. 1, in a typical fingerprint recognition module, a stiffener 1, an FPC2(Flexible printed circuit board) and a chip 3 are stacked, so the thickness of the fingerprint recognition module limits the light and thin design of a mobile phone.
In order to solve the above problem, an embodiment of the present application provides a fingerprint identification module for an electronic device. The present application will be described in further detail with reference to the following drawings and examples. It is to be noted that the following examples are only illustrative of the present application, and do not limit the scope of the present application. Likewise, the following examples are only some examples and not all examples of the present application, and all other examples obtained by a person of ordinary skill in the art without any inventive work are within the scope of the present application.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
Referring to fig. 2 to 4, fig. 2 is a schematic structural diagram of an electronic device 10 according to an embodiment of the present disclosure, fig. 3 is a schematic exploded structural diagram of the electronic device 10 in fig. 2, fig. 4 is a schematic plan structural diagram of the electronic device 10 in fig. 2, and fig. 5 is a schematic partial sectional structural diagram of the electronic device 10 in fig. 3 along line iv-iv.
As shown in fig. 2 to fig. 5, the electronic device 10 provided in this embodiment may be a mobile phone, a tablet computer, a smart watch, and the like. The present embodiment is described below by taking a mobile phone as an example. The electronic device 10 includes: display screen 11, casing 12, fingerprint identification module 13, supporting pad 14 and mainboard 15. The display screen 11 is covered on the housing 12 to form an accommodating space 101. The fingerprint identification module 13, the supporting pad 14 and the main board 15 are disposed in the accommodating space 101.
The display screen 11 may be an OLED (Organic Light-Emitting Diode) screen. The display screen 11 may be a flat screen, a hyperboloid screen, or a four-curved screen in appearance, which is not limited in this embodiment.
The housing assembly 12 includes a middle frame 121 and a rear cover 122, the display screen 11 is covered on one side of the middle frame 121, and the rear cover 122 is covered on the other side of the middle frame 121 to form the accommodating space 101. The accommodation space 101 may also be used for installing: and functional devices such as a battery, a camera and a radio frequency chip. The middle frame 121 is further provided with a mounting groove 1211 close to the first surface 1210 of the display screen 11, and the fingerprint identification module 13 is mounted in the mounting groove 1211 and spaced from the display screen 11. Supporting pad 14 sets up between display screen 11 and fingerprint identification module 13, and supports display screen 11 and fingerprint identification module 13 for interval display screen 11 and fingerprint identification module 13 avoid display screen 11 and fingerprint identification module 13 too to press close to the problem that causes mutual interference. The supporting pad 14 can be made of plastic, foam and other flexible materials, can avoid scratching the display screen 11 and the fingerprint identification module 13, and can play a role in water proofing and buffering. Mainboard 15 and fingerprint identification module 13 electric connection to realize fingerprint identification module 13's fingerprint identification function. In some embodiments, the middle frame 121 and the rear cover 122 may also be an integral structure, and only the display screen 11 is required to be covered on one surface of the middle frame 121 far away from the rear cover 122 to form the accommodating space 101.
Further, fingerprint identification module 13 can be optical fingerprint identification module, and ultrasonic fingerprint identification module or other fingerprint identification modules that are applicable to fingerprint unblock scheme under the screen. This embodiment is not limited to this. The fingerprint identification module 13 has a sensing area 130 on the display area 111 of the display screen 11. When the user indicates that it is located induction zone 130, fingerprint identification module 13 can gather user's finger fingerprint image through display screen 11 to realize fingerprint identification under the screen. When the user's finger is located in the region outside the sensing region 130, the fingerprint recognition module 13 does not collect the finger fingerprint image of the user. It should be noted that fig. 4 is only a schematic illustration of the sensing area 130 of the fingerprint identification module 13, and the position of the sensing area 130 may not be limited to the position shown in the figure, and the specific position thereof may be set on the display area 111 according to actual requirements.
Referring to fig. 6 to 10, fig. 6 is a schematic structural diagram of the fingerprint identification module 13 in fig. 5, fig. 7 is a partially enlarged view of the fingerprint identification module 13 in fig. 5, fig. 8 is another schematic structural diagram of the fingerprint identification module 13, fig. 9 is another schematic structural diagram of the fingerprint identification module 13, and fig. 10 is still another schematic structural diagram of the fingerprint identification module 13.
As shown in fig. 6 to 7, the fingerprint recognition module 13 includes: fingerprint identification chip 131, flexible circuit board 132, support plate 133 and lead 134. The supporting plate 133 is disposed on a side of the middle frame 121 close to the display screen 11. Fingerprint identification chip 131 and flexible circuit board 132 set up in the one side that middle frame 121 was kept away from to backup pad 133, and fingerprint identification chip 131 and flexible circuit board 132 interval set up, avoid taking place to disturb between fingerprint identification chip 131 and the flexible circuit board 132. One end of the lead 134 is connected to the connection point 1310 of the fingerprint identification chip 131, and the other end is connected to the connection point 1320 of the flexible circuit board 132, so as to electrically connect the fingerprint identification chip 131 and the flexible circuit board 132.
Specifically, the supporting plate 133 is disposed in the mounting groove 1211 and is fixedly connected to the mounting groove 1211. For example, the supporting plate 133 can be adhered to the mounting groove 1211 through double-sided adhesive to fix the fingerprint identification module 13 on the middle frame 121, so that the fingerprint identification module 13 and the middle frame 121 are not easy to move relatively, and the reliability of the electronic device 10 is improved. The support plate 133 may be specifically a steel plate or a plastic plate. The steel sheet structural strength is higher, can increase fingerprint identification module 13's structural strength. The plastic slab not only can increase fingerprint identification module 13's structural strength, and compare in the steel sheet, the plastic slab can also alleviate fingerprint identification module 13's weight. The fingerprint identification chip 131 and the flexible circuit board 132 are disposed on a surface of the supporting plate 133 away from the middle frame 121. In this embodiment, the fingerprint identification chip 131 and the flexible circuit board 132 are adhered to the surface of the supporting plate 133 away from the middle frame 121 by an insulating adhesive, so as to prevent the supporting plate 133 from interfering with the fingerprint identification chip 131 and the flexible circuit board 132. The flexible circuit board 132 includes a main body 1321, a connecting portion 1322, and an extending portion 1323, which are integrally formed. The body portion 1321 is disposed around the fingerprint recognition chip 131. The connecting portion 1322 is disposed on a surface of the main body 1321 close to the fingerprint identification chip 131, and the connecting portion 1322 has a connecting point 1320. The extending portion 1323 is connected to the main body portion 1321, extends to the main board 15, and is electrically connected to the main board 15. The lead 134 may be a gold wire or an aluminum wire. One end of the lead 134 is connected to the connection point 1310 of the fingerprint recognition chip 131, and the other end is connected to the connection point 1320 of the connection portion 1322. Thereby realizing the electrical connection between the fingerprint identification chip 131 and the main board 15. The supporting pad 14 is disposed on the main body 1321 far away from the supporting plate 133, and a projection area of the supporting pad 14 on the main body 1321 is equal to or smaller than an area of the main body 1321 far away from the supporting plate 133, so as to prevent the supporting plate 14 from shielding the fingerprint identification chip 131.
All directional indications (such as up, down, left, right, front, and rear … …) in the embodiments of the present application are only used to explain the relative positional relationship between the components, the movement, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indication is changed accordingly. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.
As shown in fig. 8 to 10, in the present embodiment, a plurality of connecting portions 1322 may be further disposed to connect with the fingerprint identification chip 131, so as to avoid the problem that the wiring difficulty is increased due to too many wires of a single connecting portion 1322. As shown in fig. 9 to 10, in some embodiments, the main body 1321 may not be disposed around the fingerprint identification chip 131, for example, the main body 1321 and the fingerprint identification chip 131 may be disposed opposite to each other on the same surface of the supporting plate 133, or the main body 1321 is disposed to surround the fingerprint identification chip 131, and only the distance between the two is required to be ensured, which is not limited in this embodiment. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless explicitly specifically limited otherwise.
Further, the thickness of the connecting portion 1322 in the direction away from the supporting plate 133 is smaller than the thickness of the main body portion 1321 in the direction away from the supporting plate 133, so that the fingerprint recognition chip 131 and the connecting portion 1322 have a high step difference. When the wire bonding connection is performed between the wire bonding point 1310 and the wire bonding point 1320, since the step difference is provided between the fingerprint identification chip 131 and the connecting portion 1322, the tilting arc height of the lead 134 is not too high, so that the problem that the lead 134 is easily broken due to the tilting arc height of the lead 134 can be avoided, and the reliability and the stability of the fingerprint identification module 13 are improved. Specifically, the thickness of the connecting portion 1322 in the direction away from the support plate 133 may be 95 μm to 105 μm. The thickness of the main body 1321 in the direction away from the support plate 133 is 165 μm to 175 μm. For example, in the present embodiment, the specific thickness of the connection part 1322 may be 97.5 μm, and the specific thickness of the body part 1321 may be 169 μm. Therefore, the connecting portion 1322 and the main body portion 1321 have a step difference of 71.5 μm, while the thickness of the fingerprint identification chip 131 is generally higher than the height of the flexible circuit board 132 due to the structure, and different fingerprint identification chips 131 have different thickness values, which is not limited herein. Therefore, the fingerprint recognition chip 131 and the connection part 1322 have a step difference of more than 71.5 μm therebetween. When wire bonding is performed between contact 1310 and contact 1320, the step difference of 71.5 μm will reduce the tilting height of lead 134. Meanwhile, the present embodiment adopts a reverse bonding process (bonding from the bonding point 1320 of the connection portion 1321 to the bonding point 1310 of the fingerprint identification chip 131), so that the tilting height of the lead 134 can be controlled within 40 μm. Therefore, the problem that the lead 134 is easy to break due to the fact that the tilting arc height of the lead 134 is higher than the thickness of the fingerprint identification chip 131 is avoided. Because the thickness that makes the perk arc height of lead wire 134 be less than fingerprint identification chip 131 can also reduce the whole thickness of fingerprint identification module 13 to a certain extent.
Referring to fig. 11, fig. 11 is a schematic diagram of a stacked layer of the flexible circuit board 132 in fig. 5. It should be noted that fig. 11 is only a schematic illustration of the lamination of the flexible circuit board 132, and does not represent the structure of the actual flexible circuit board 132.
As shown in fig. 11, the connecting portion 1322 includes a first base 13221, a first conductive layer 13222, a first protective layer 13223, a first ink layer 13224, and a first plating layer 13225, which are stacked in this order in a direction away from the supporting plate 133. The first base material 13221 is disposed on a side of the supporting plate 133 away from the middle frame 121. The main body 1321 includes a second ink layer 13211, a second protective layer 13212, a second conductive layer 13213, a second base 13214, a third conductive layer 13215, a third protective layer 13216, a third ink layer 13217, and a second plating layer 13218, which are stacked in this order in a direction away from the supporting plate 133. The second ink layer 13211 is disposed on a surface of the supporting board 133 away from the middle frame 121. Wherein: the first substrate 13221 and the second substrate 13214 are of an integral structure; the first protective layer 13223 and the third protective layer 13216 are an integral structure; first conductive layer 13222 is integral with third conductive layer 13215; first ink layer 13224 and third ink layer 13217 are a unitary structure. The second conductive layer 13213 and the third conductive layer 13215 are electrically connected by a punched copper plating. The connecting portion 1322 is bent to a surface of the supporting plate 133 away from the middle frame 121 and attached to the surface.
Specifically, the first base material 13221 and the second base material 13214 may be polyimide to improve high temperature resistance of the flexible circuit board 132. The specific thickness of the first substrate 13221 and the second substrate 13214 may be 20 μm. The first protective layer 13223 and the third protective layer 13216 each include a polyimide layer and a polyethylene layer, and cover the first conductive layer 13222 and the third conductive layer 13215, with the polyethylene layer therebetween for adhesion. The thickness of the polyimide layer may be 12.5 μm and the thickness of the polyethylene layer may be 15 μm. The first conductive layer 13222 and the third conductive layer 13215 each include a copper foil layer and a copper plated layer for performing the conductive function of the flexible circuit board 132. The thickness of the copper foil layer may be 6 μm and the thickness of the copper plated layer may be 8 μm. The first ink layer 13224 and the third ink layer 13217 may be photosensitive inks for protecting the conductive traces, and may have a thickness of 30 μm. First electroplated layer 13225 and second electroplated layer 13218 are each nickel palladium gold to increase the oxidation resistance, wear resistance, and electrical conductivity of the conductive layer. The specific thickness thereof may be 6 μm. It should be noted that the thickness values of the connecting portion 1322 and the main body portion 1321 are not limited to the above thickness values, and the thickness values may be specifically set according to actual requirements, which is not described in detail herein. The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.
The fingerprint identification module 13 and electronic equipment 10 thereof that this application embodiment provided through setting up fingerprint identification chip 131 and flexible circuit board 132 in the one side of backup pad 133, have reduced the thickness of fingerprint identification module 13. The flexible circuit board 132 includes a main body 1321 and a connecting portion 1322 of an integral structure, the thickness of the connecting portion 1322 in the direction away from the supporting plate 133 is smaller than the thickness of the main body 1321 in the direction away from the supporting plate 133, so that the connecting portion 1322 and the fingerprint identification chip 131 have a step difference, so that the tilting arc height of the lead 134 is reduced, the problem that the tilting arc height of the lead 134 is too high to cause easy breakage can be avoided, and the reliability and stability of the fingerprint identification module 13 are improved to a certain extent.
The above description is only a part of the embodiments of the present application, and not intended to limit the scope of the present application, and all equivalent devices or equivalent processes performed by the content of the present application and the attached drawings, or directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (10)
1. The utility model provides a fingerprint identification module for electronic equipment, a serial communication port, the fingerprint identification module includes: the fingerprint identification device comprises a fingerprint identification chip, a flexible circuit board, a supporting plate and a lead;
the fingerprint identification chip and the flexible circuit board are arranged on the same surface of the supporting plate, and the fingerprint identification chip and the flexible circuit board are arranged at intervals; wherein:
the flexible circuit board comprises a main body part and a connecting part which are of an integrated structure;
the connecting part is arranged on one surface of the main body part, which is close to the fingerprint identification chip, and the thickness of the connecting part in the direction far away from the supporting plate is smaller than that of the main body part in the direction far away from the supporting plate;
one end of the lead is connected with the fingerprint identification chip, and the other end of the lead is connected with the connecting part.
2. The fingerprint identification module of claim 1, wherein the main body portion is disposed around the fingerprint identification chip, and the connecting portion is disposed on a side of the main body portion close to the fingerprint identification chip.
3. The fingerprint identification module of claim 1, wherein the thickness of the connecting portion in a direction away from the support plate is 95 μm to 105 μm.
4. The fingerprint identification module of claim 3, wherein the connecting portion comprises a first substrate, a first conductive layer, a first protective layer, a first ink layer, and a first plating layer, which are sequentially stacked in a direction away from the supporting board.
5. The fingerprint identification module of claim 4, wherein the thickness of the main body portion in a direction away from the support plate is 165 μm to 175 um.
6. The fingerprint identification module of claim 5, wherein the main body portion comprises a second ink layer, a second protective layer, a second conductive layer, a second substrate, a third conductive layer, a third protective layer, a third ink layer, and a second electroplated layer, which are sequentially stacked in a direction away from the support plate; wherein:
the first substrate and the second substrate are of an integrated structure;
the first protective layer and the third protective layer are of an integrated structure;
the first conductive layer and the third conductive layer are of an integrated structure;
the first ink layer and the third ink layer are of an integral structure.
7. The fingerprint identification module of claim 6, wherein the first substrate and the second substrate are each polyimide.
8. An electronic device, characterized in that the electronic device comprises: the fingerprint identification module comprises a display screen, a shell, a main board and a fingerprint identification module set according to any one of claims 1-7;
the display screen cover is arranged on the shell to form an accommodating space;
the mainboard and the fingerprint identification module are arranged in the accommodating space;
the mainboard with fingerprint identification module electric connection.
9. The electronic device of claim 8, wherein the housing comprises: a middle frame and a rear cover;
the rear cover is covered on one surface of the middle frame, which is far away from the display screen;
the fingerprint identification module set up in the center is close to the display screen one side, and with the display screen interval sets up.
10. The electronic device of claim 9, further comprising: a support pad;
the supporting pad set up in the fingerprint identification module with between the display screen, with the interval the fingerprint identification module with the display screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911402872.XA CN111147638A (en) | 2019-12-30 | 2019-12-30 | Fingerprint identification module and electronic equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911402872.XA CN111147638A (en) | 2019-12-30 | 2019-12-30 | Fingerprint identification module and electronic equipment thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111147638A true CN111147638A (en) | 2020-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911402872.XA Pending CN111147638A (en) | 2019-12-30 | 2019-12-30 | Fingerprint identification module and electronic equipment thereof |
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| CN (1) | CN111147638A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613932A (en) * | 2022-03-24 | 2022-06-10 | 深圳吉阳智能科技有限公司 | Pole piece structure and battery |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN204577415U (en) * | 2015-04-28 | 2015-08-19 | 上海思立微电子科技有限公司 | Bio-identification module |
| CN107066946A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic equipment |
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2019
- 2019-12-30 CN CN201911402872.XA patent/CN111147638A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204577415U (en) * | 2015-04-28 | 2015-08-19 | 上海思立微电子科技有限公司 | Bio-identification module |
| CN107066946A (en) * | 2017-03-13 | 2017-08-18 | 广东欧珀移动通信有限公司 | fingerprint module, display screen and mobile terminal |
| CN110071994A (en) * | 2019-04-25 | 2019-07-30 | Oppo广东移动通信有限公司 | Electronic equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114613932A (en) * | 2022-03-24 | 2022-06-10 | 深圳吉阳智能科技有限公司 | Pole piece structure and battery |
| CN114613932B (en) * | 2022-03-24 | 2024-04-19 | 深圳吉阳智能科技有限公司 | Pole piece structure and battery |
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Application publication date: 20200512 |
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| RJ01 | Rejection of invention patent application after publication |