CN111970812A - Fingerprint button module and electronic equipment - Google Patents
Fingerprint button module and electronic equipment Download PDFInfo
- Publication number
- CN111970812A CN111970812A CN202010794723.9A CN202010794723A CN111970812A CN 111970812 A CN111970812 A CN 111970812A CN 202010794723 A CN202010794723 A CN 202010794723A CN 111970812 A CN111970812 A CN 111970812A
- Authority
- CN
- China
- Prior art keywords
- fingerprint
- circuit board
- key module
- bending
- middle frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 claims abstract description 56
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 22
- 230000002787 reinforcement Effects 0.000 claims description 24
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000012423 maintenance Methods 0.000 description 10
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/12—Movable parts; Contacts mounted thereon
- H01H13/14—Operating parts, e.g. push-button
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
- H01H9/02—Bases, casings, or covers
- H01H9/0271—Bases, casings, or covers structurally combining a switch and an electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Push-Button Switches (AREA)
Abstract
The invention provides a fingerprint key module, which comprises a fingerprint chip, a fingerprint circuit board and a reinforcing piece, wherein the fingerprint chip is arranged on the fingerprint circuit board; the fingerprint circuit board comprises a fingerprint circuit board body and a bending part formed by bending one end of the fingerprint circuit board body, and the reinforcing piece comprises a reinforcing piece body and a first convex block arranged on one side of the reinforcing piece body; the fingerprint circuit board body is fixed on the other side opposite to the sensing surface of the fingerprint chip, the reinforcing piece body is fixed on the other side opposite to the fingerprint circuit board body and the fingerprint chip, and the bending part is bent and then adhered to the surface of the first bump. The invention also provides electronic equipment. According to the fingerprint key module and the electronic equipment, the middle frame does not need to be hollowed, the structural strength of the middle frame is improved, the middle frame does not have an inverted buckle structure, the mold does not need to be provided with an inclined top, the mold is simple in structure, and the manufacturing cost is low.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of keys, in particular to a fingerprint key module and electronic equipment.
[ background of the invention ]
With the progress of science and technology and the development of times, the design of electronic equipment is simplified frequently, and the structure of fingerprint module and power key integral type is more and more commonly used. At present, in the structure of fingerprint module and power key integral type, the circuit board of fingerprint module is qualified for the next round of competitions from the side, need leave one section area of straightening and walk the line. In order to avoid the circuit board in the straight extension area, the shell of the middle frame needs to be hollowed, the space requirement is large, and the structural strength of the whole machine is poor. And the hollowed position of the middle frame is of a back-off structure, the die needs to be manufactured into an inclined top, and the cost of the die is high. During assembly, the straight extending area of the wire outlet end needs to be laterally plugged into the middle frame, so that the assembly difficulty is increased, and the assembly efficiency is influenced. When the circuit board is maintained after sale, the circuit board in the side wire outlet straight extension area is easy to be torn off, so that material loss is caused, and the cost is increased.
In view of the above, it is desirable to provide a novel fingerprint key module and an electronic device to overcome the above-mentioned drawbacks.
[ summary of the invention ]
The invention aims to provide a fingerprint key module and electronic equipment, wherein the middle frame does not need to be hollowed, the structural strength of the middle frame is improved, the middle frame does not have an inverted buckle structure, a die does not need to be provided with an inclined top, the die is simple in structure, low in manufacturing cost and high in assembly efficiency, a fingerprint circuit board is not easy to tear during after-sale maintenance, and the maintenance cost is reduced.
In order to achieve the above object, in a first aspect, the present invention provides a fingerprint key module, including a fingerprint chip, a fingerprint circuit board, and a reinforcement; the fingerprint circuit board comprises a fingerprint circuit board body and a bending part formed by bending one end of the fingerprint circuit board body, and the reinforcing piece comprises a reinforcing piece body and a first convex block arranged on one side of the reinforcing piece body; the fingerprint circuit board body is fixed on the other side opposite to the sensing surface of the fingerprint chip, the reinforcing piece body is fixed on the other side opposite to the fingerprint circuit board body and the fingerprint chip, and the bending part is bent and then adhered to the surface of the first bump.
In a preferred embodiment, the bending portion includes a first bending portion formed by bending the fingerprint circuit board body and a second bending portion formed by bending the first bending portion, the first bump includes a top surface, a bottom surface opposite to the top surface, and a plurality of side surfaces connecting the top surface and the bottom surface, the first bending portion is adhered to one of the side surfaces, and the second bending portion is adhered to the bottom surface.
In a preferred embodiment, a second protrusion is further disposed on a side of the reinforcement body away from the first protrusion, and the first protrusion and the second protrusion are both provided with positioning holes penetrating through the top surface and the bottom surface.
In a preferred embodiment, a buffer member is fixed to one side surface of each of the first protrusion and the second protrusion, the side surface being away from the reinforcement body.
In a preferred embodiment, a key post is further disposed on one side of the reinforcement body, and a key conductive base is disposed on one end of the key post, which is far away from the reinforcement body.
In a preferred embodiment, the key conductive base is fixed on the key post by glue dispensing or adhesive backing.
In a preferred embodiment, the fingerprint circuit board body and the fingerprint chip are fixed in a dispensing manner.
In a preferred embodiment, the reinforcing member body and the fingerprint circuit board body are fixed by cold welding.
In a second aspect, the present invention further provides an electronic device, including a middle frame, a bracket, and the fingerprint key module described above, where the middle frame is provided with an accommodating cavity, and the fingerprint key module is accommodated in the accommodating cavity; the middle frame is further provided with a groove communicated with the accommodating cavity, the fingerprint key module further comprises an extension walking line part connected with the bent part, one end of the extension walking line part is accommodated in the groove, the other end of the extension walking line part is electrically connected with a main board of the electronic equipment, and the support is used for fixing the fingerprint key module on the middle frame.
In a preferred embodiment, one end of the extended routing part is provided with a connector electrically connected with a main board of the electronic device.
Compared with the prior art, according to the fingerprint key module and the electronic equipment, the first bump is arranged on one side of the reinforcing piece body, the bent part of the fingerprint circuit board is adhered to the surface of the first bump after being bent, the bent part does not need to occupy the space of the middle frame, the middle frame does not need to be hollowed, and the structural strength of the middle frame is improved; the middle frame has no inverted buckle structure, the die does not need to be provided with an inclined top, the die has a simple structure and low manufacturing cost; the packaging efficiency of fingerprint button module is high, and the difficult tear of fingerprint circuit board when the after-sale maintenance has reduced cost of maintenance.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a three-dimensional structure diagram of a fingerprint key module provided by the invention;
fig. 2 is another three-dimensional structure diagram of the fingerprint key module provided by the invention;
fig. 3 is a plan view of the fingerprint key module according to the present invention;
FIG. 4 is a plan view of an electronic device according to the present invention;
fig. 5 is another plan structure diagram of the electronic device provided by the present invention.
[ detailed description ] embodiments
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, 2 and 3, the present invention provides a fingerprint key module 100, which includes a fingerprint chip 10, a fingerprint circuit board 20 and a reinforcement 30.
The fingerprint circuit board 20 includes a fingerprint circuit board body 21 and a bending portion 22 formed by bending one end of the fingerprint circuit board body 21, and the reinforcement member 30 includes a reinforcement member body 31 and a first protrusion 32 disposed on one side of the reinforcement member body 31. The fingerprint circuit board body 21 is fixed on the other side opposite to the sensing surface 11 of the fingerprint chip 10, the reinforcement body 31 is fixed on the other side of the fingerprint circuit board body 21 opposite to the fingerprint chip 10, and the bending part 22 is adhered to the surface of the first bump 32 after being bent.
According to the fingerprint key module 100 provided by the invention, the first bump 32 is arranged on one side of the reinforcing piece body 31, the bent part 22 of the fingerprint circuit board 20 is adhered to the surface of the first bump 32 after being bent, the bent part 22 does not need to occupy the space of the middle frame additionally, the middle frame does not need to be hollowed, the structural strength of the middle frame is improved, the middle frame does not have an inverted buckle structure, a die does not need to be provided with an inclined top, the die is simple in structure and low in manufacturing cost, the assembling efficiency of the fingerprint key module 100 is high, the fingerprint circuit board 20 is not easy to tear during after-sale maintenance, and the maintenance cost is reduced.
It can be understood that the fingerprint chip 10, i.e. a chip embedded with fingerprint identification technology, can realize the functions of image acquisition, feature extraction and feature comparison of fingerprints. The fingerprint Circuit Board 20 is an FPC (Flexible Printed Circuit Board), and the fingerprint Circuit Board 20 is electrically connected to the fingerprint chip 10 and a main Board of the electronic device to implement the function of the fingerprint chip 10.
Further, the fingerprint circuit board body 21 and the fingerprint chip 10 are fixed by dispensing. The bending portion 22 includes a first bending portion 221 formed by bending the fingerprint circuit board body 21 and a second bending portion 222 formed by bending the first bending portion 221, the first bump 32 includes a top surface 321, a bottom surface 322 opposite to the top surface 321, and a plurality of side surfaces 323 connecting the top surface 321 and the bottom surface 322, the first bending portion 221 is adhered to one of the side surfaces 323, and the second bending portion 222 is adhered to the bottom surface 322. Specifically, the first bending portion 221 is formed by bending one end of the fingerprint circuit board body 21 in a direction perpendicular to the length direction of the fingerprint circuit board body 21, the second bending portion 222 is formed by bending one end of the first bending portion 221 in a direction perpendicular to the length direction of the first bending portion 221, and both the first bending portion 221 and the second bending portion 222 are used for outgoing lines of the fingerprint circuit board 20. In this embodiment, the first bending portion 221 is adhered to the side 323 through the back adhesive after being bent, and the second bending portion 222 is adhered to the bottom 322 through the back adhesive after being bent, so that the first bending portion 221 and the second bending portion 222 do not need to occupy additional space of the middle frame, thereby improving the structural strength of the middle frame, and during assembly, the step of plugging the bending portion 22 into the middle frame from the side is avoided, thereby improving the assembly efficiency, and during after-sale maintenance, the fingerprint circuit board 20 is prevented from being torn off when the bending portion 22 is removed from the side, thereby facilitating after-sale maintenance. In this embodiment, the first bump 32 is perpendicular to the reinforcement body 31, and the first bending portion 221 is bent by 90 ° and then adhered to the side 323 by the back adhesive, which is beneficial to CNC (Computer Numerical Control) processing. It is understood that the circuit board 20 is flexible, and the bent portion 22 is bent to adhere to the outer surface of the reinforcing member 30 for fixing. In other embodiments, when the first bump 32 of the reinforcement 30 is not perpendicular to the reinforcement body 31, the bending angle of the bending portion 22 changes accordingly.
Further, the material of the reinforcing member 30 may be stainless steel or aluminum alloy, the reinforcing member 30 has supporting and reinforcing functions, and the reinforcing member body 31 and the fingerprint circuit board body 21 are fixed by cold welding. In this embodiment, a second protrusion 33 is further disposed on a side of the reinforcement body 31 away from the first protrusion 32, the first protrusion 32 and the second protrusion 33 are both provided with a positioning hole 331 penetrating through the top surface 321 and the bottom surface 322, the second protrusion 33 can further improve the overall structural strength of the fingerprint key module 100, and the positioning hole 331 is beneficial to positioning when the fingerprint key module 100 is assembled to the middle frame, so as to improve the assembly efficiency.
Further, a cushion member 34 is fixed to one side 323 of the first projection 32 and the second projection 33 away from the reinforcement body 31. Specifically, the buffer 34 is adhered to the first bump 32 and the second bump 33 by the back adhesive, the buffer 34 can buffer the pressure from the reinforcement 30, the fingerprint circuit board 20 and the fingerprint chip 10, and the material of the buffer 34 can be foam or a silicone gasket.
In this embodiment, a key pillar 35 is further disposed on one side of the reinforcement body 31, a key conductive base 36 is disposed on one end of the key pillar 35 away from the reinforcement body 31, the key pillar 35 is located between the first bump 32 and the second bump 33, and the key pillar 35 and the key conductive base 36 can transmit the pressure of the fingerprint chip 10 to realize the key function. Specifically, the key conductive base 36 is fixed on the key post 35 by dispensing or applying an adhesive, and the key conductive base 36 is made of silica gel or TPU (Thermoplastic polyurethane elastomer rubber), and can protect a key dome (commonly called a dome sheet) of the key circuit board.
Referring to fig. 4 and 5, the present invention further provides an electronic device 200, which includes a middle frame 201, a bracket 202, and the fingerprint key module 100 according to any of the above embodiments, wherein the middle frame 201 has an accommodating cavity 203, and the fingerprint key module 100 is accommodated in the accommodating cavity 203; the middle frame 201 is further provided with a groove 204 communicated with the accommodating cavity 203, the fingerprint key module 100 further comprises an extension routing portion 23 connected with the bending portion 22, one end of the extension routing portion 23 is accommodated in the groove 204, the other end of the extension routing portion 23 is used for being electrically connected with a main board (not shown) of the electronic device 200, the bracket 202 is used for fixing the fingerprint key module 200 on the middle frame 201, specifically, the bracket 202 fixes the fingerprint key module on the middle frame 201 through bolts, and one end of the extension routing portion 23 is provided with a connector 231 (see fig. 1) electrically connected with the main board of the electronic device.
It can be understood that the electronic device 200 may be, but is not limited to, a mobile phone, a tablet computer, and a notebook computer, and all embodiments of the fingerprint key module 100 provided by the present invention are applicable to the electronic device 200 provided by the present invention, and can achieve the same or similar beneficial effects.
In summary, according to the fingerprint key module 100 and the electronic device 200 provided by the present invention, the first bump 32 is disposed on one side of the reinforcement body 31, the bending portion 22 of the fingerprint circuit board 20 is adhered to the surface of the first bump 32 after being bent, the bending portion 22 does not need to occupy additional space of the middle frame, the middle frame does not need to be hollowed, the structural strength of the middle frame is improved, the middle frame does not have an inverted buckle structure, the mold does not need to be provided with a lifter, the mold has a simple structure and a low manufacturing cost, the assembly efficiency of the key module 100 is high, the fingerprint circuit board 20 is not easily torn off during after-sale maintenance, and the maintenance cost is reduced.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A fingerprint key module is characterized by comprising a fingerprint chip, a fingerprint circuit board and a reinforcing piece; the fingerprint circuit board comprises a fingerprint circuit board body and a bending part formed by bending one end of the fingerprint circuit board body, and the reinforcing piece comprises a reinforcing piece body and a first convex block arranged on one side of the reinforcing piece body; the fingerprint circuit board body is fixed on the other side opposite to the sensing surface of the fingerprint chip, the reinforcing piece body is fixed on the other side opposite to the fingerprint circuit board body and the fingerprint chip, and the bending part is bent and then adhered to the surface of the first bump.
2. The fingerprint key module of claim 1, wherein the bending portion comprises a first bending portion formed by bending the fingerprint circuit board body and a second bending portion formed by bending the first bending portion, the first protrusion comprises a top surface, a bottom surface opposite to the top surface and a plurality of side surfaces connecting the top surface and the bottom surface, the first bending portion is adhered to one of the side surfaces, and the second bending portion is adhered to the bottom surface.
3. The fingerprint key module of claim 1, wherein a second protrusion is further disposed on a side of the reinforcement body away from the first protrusion, and the first protrusion and the second protrusion are both provided with positioning holes penetrating through the top surface and the bottom surface.
4. The fingerprint key module of claim 3, wherein a buffer is fixed on one side of the first protrusion and the second protrusion away from the reinforcement body.
5. The fingerprint key module of claim 1, wherein a key post is further disposed on one side of the reinforcement body, and a key conductive base is disposed on an end of the key post away from the reinforcement body.
6. The fingerprint key module of claim 5, wherein the key conductive base is fixed on the key post by glue dispensing or adhesive backing.
7. The fingerprint key module of claim 1, wherein the fingerprint circuit board body and the fingerprint chip are fixed by dispensing.
8. The fingerprint key module of claim 1, wherein the reinforcement body is fixed to the fingerprint circuit board body by cold welding.
9. An electronic device is characterized by comprising a middle frame, a support and the fingerprint key module as in any one of 1-8, wherein the middle frame is provided with an accommodating cavity, and the fingerprint key module is accommodated in the accommodating cavity; the middle frame is further provided with a groove communicated with the accommodating cavity, the fingerprint key module further comprises an extension walking line part connected with the bent part, one end of the extension walking line part is accommodated in the groove, the other end of the extension walking line part is electrically connected with a main board of the electronic equipment, and the support is used for fixing the fingerprint key module on the middle frame.
10. The electronic device of claim 9, wherein one end of the extended routing portion is provided with a connector electrically connected to a main board of the electronic device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010794723.9A CN111970812B (en) | 2020-08-10 | 2020-08-10 | Fingerprint key module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010794723.9A CN111970812B (en) | 2020-08-10 | 2020-08-10 | Fingerprint key module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111970812A true CN111970812A (en) | 2020-11-20 |
| CN111970812B CN111970812B (en) | 2024-03-19 |
Family
ID=73365490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010794723.9A Active CN111970812B (en) | 2020-08-10 | 2020-08-10 | Fingerprint key module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111970812B (en) |
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| US20180039814A1 (en) * | 2016-08-05 | 2018-02-08 | Primax Electronics Ltd. | Method for assembling fingerprint identification module |
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| CN111506161A (en) * | 2020-04-24 | 2020-08-07 | 华勤通讯技术有限公司 | Fingerprint module fixing device and terminal equipment |
-
2020
- 2020-08-10 CN CN202010794723.9A patent/CN111970812B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007234971A (en) * | 2006-03-02 | 2007-09-13 | Sharp Corp | Flexible printed wiring board and method of inserting flexible printed wiring board to connector |
| CN107004698A (en) * | 2014-12-15 | 2017-08-01 | 乐金显示有限公司 | Flexible display apparatus with the supporting course including rounded edges |
| CN105825194A (en) * | 2016-03-25 | 2016-08-03 | 邓力 | Integrated fingerprint identification module and preparation method thereof |
| US20180039814A1 (en) * | 2016-08-05 | 2018-02-08 | Primax Electronics Ltd. | Method for assembling fingerprint identification module |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111970812B (en) | 2024-03-19 |
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