CN215072487U - Chip packaging structure, chip functional module and electronic equipment - Google Patents

Abstract

The utility model is suitable for an optics and electron technical field provide a chip packaging structure, it includes: the substrate comprises a first surface and a second surface which are oppositely arranged along the thickness direction of the substrate; an integrated circuit die disposed on the first surface of the substrate and electrically connected to an external through the substrate; and the packaging part is arranged on the substrate and covers the integrated circuit bare chip, and part of the outer surface of the packaging part, which is back to the first surface, is a curved surface. The utility model also provides a chip function module and electronic equipment including this chip packaging structure.

Description

Chip packaging structure, chip functional module and electronic equipment

Technical Field

The utility model belongs to the technical field of the semiconductor package, especially, relate to a chip package structure, chip function module and electronic equipment.

Background

The exposed sensing surface of the existing fingerprint identification module for contacting with a finger is generally a plane, such as: set up the fingerprint identification module at the cell-phone is positive. However, with the changing design style of the electronic device, the fingerprint identification module is disposed on a curved surface of the electronic device, such as: a side bezel of an electronic device. At the moment, the flat exposed sensing surface of the existing fingerprint identification module cannot be well matched with the adjacent curved surface of the electronic equipment, so that the style uniformity of the overall appearance design of the electronic equipment is influenced.

Novel content

The utility model provides a can solve above-mentioned technical problem's chip packaging structure, still provide a chip function module and electronic equipment who uses this chip packaging structure.

The utility model discloses embodiment provides a chip packaging structure, it includes:

the substrate comprises a first surface and a second surface which are oppositely arranged along the thickness direction of the substrate;

an integrated circuit die disposed on the first surface of the substrate and electrically connected to an external through the substrate;

and the packaging part is arranged on the substrate and covers the integrated circuit bare chip, and part of the outer surface of the packaging part, which is back to the first surface, is a curved surface.

In some embodiments, the encapsulation portion is an integrally molded encapsulation body, and a portion of an outer surface of the encapsulation body facing away from the first surface is a curved surface.

In some embodiments, the package portion includes an integrally formed package body and a cover disposed on the package body, the package body encapsulates the ic die, a surface of the package body facing away from the first surface is defined as a third surface, the third surface is a plane, the cover is disposed on the third surface, and a portion of an outer surface of the cover facing away from the first surface is a curved surface.

In some embodiments, the shape of the package is directly molded by a mold; or

The packaging body is firstly molded into a preliminary shape through a mold, and then is constructed into a specific shape through a surface machining process.

In some embodiments, the material of the cover is selected from any one or more of glass, ceramic, plastic, and metal.

In some embodiments, the chip package structure has an elongated shape, and the substrate has a length direction and a width direction perpendicular to a thickness direction of the substrate.

In some embodiments, the substrate further comprises a first side surface connecting the first surface and the second surface, wherein one end of the first side surface along the length direction of the substrate is dug out to form a notch at a position close to the second surface.

In some embodiments, the second surface is provided with a plurality of terminals for external electrical connection, the terminals being arranged in sequence along the length of the substrate itself.

In some embodiments, the outer surface of the package portion includes a second side surface, an upper surface, and a lower surface, the upper surface and the lower surface are disposed opposite to each other along a thickness direction of the package portion, the second side surface is respectively connected to the upper surface and the lower surface, the lower surface is attached to the first surface of the substrate, and at least a portion of the upper surface is a curved surface.

In certain embodiments, the radius of curvature of each point on the curved surface ranges from 2mm to 10 mm.

In some implementations, the integrated circuit die is a capacitive fingerprinting die.

The utility model also provides a chip function module, it includes circuit board and the chip packaging structure of an above-mentioned arbitrary embodiment. The circuit board is attached to the second surface of the substrate and electrically connected to the chip package structure through terminals disposed on the second surface.

In some embodiments, the chip package structure is in an elongated shape, the substrate has a length direction and a width direction perpendicular to a thickness direction of the substrate, the substrate includes a first side surface connecting the first surface and the second surface, respectively, one end of the first side surface along the length direction of the substrate is cut away at a position close to the second surface to form a notch, and the circuit board is led out from a side of the substrate where the notch is formed.

In some embodiments, an underfill is applied around a region where the circuit board is electrically connected to the substrate, and the gap on the substrate is used for introducing the underfill.

The utility model also provides an electronic equipment, including the chip function module of an above-mentioned arbitrary embodiment.

In some embodiments, the electronic device includes a side frame having a curved shape, the chip functional module is disposed on the side frame, and an outer surface of a portion of the package portion exposed by the chip functional module is a curved surface, so that the curved surface and an adjacent surface of the side frame are matched in shape.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of the chip functional module in fig. 1.

Fig. 3 is a cross-sectional view of the functional module of the chip in fig. 2 taken along the line III-III.

Fig. 4 is a top view of the chip functional module of fig. 2.

Fig. 5 is a schematic structural diagram of the chip functional module according to another embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention. In the description of the present invention, it is to be understood that the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any order or number of indicated technical features. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; either mechanically or electrically or in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship or combination of two or more elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The following disclosure provides many different embodiments or examples for implementing different features of the invention. In order to simplify the disclosure of the present invention, only the components and settings of a specific example are described below. Of course, they are merely examples and are not intended to limit the present invention. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples, which are intended in order to facilitate and clarify the invention, and in no event is it intended that any particular relationship between the various embodiments and/or configurations discussed herein be so repeated. In addition, the various specific processes and materials provided in the following description of the present invention are only examples for implementing the technical solution of the present invention, but one of ordinary skill in the art should recognize that the technical solution of the present invention can also be implemented by other processes and/or other materials not described below.

Further, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to provide a thorough understanding of embodiments of the invention. One skilled in the relevant art will recognize, however, that the invention may be practiced without one or more of the specific details, or with other structures, components, and so forth. In other instances, well-known structures or operations are not shown or described in detail to avoid obscuring aspects of the invention.

Fig. 1 is a schematic structural diagram of an electronic device 100 according to an embodiment of the present invention, where the electronic device 100 includes a main body 10 and a chip function module 20 disposed on the main body 10. For convenience of description, a rectangular coordinate system of the electronic device 100 in fig. 1 is defined. The rectangular coordinate system in fig. 1 includes x, y and z axes, where the x axis is a width direction of the electronic apparatus 100, the y axis is a length direction of the electronic apparatus 100, and the z axis is a thickness direction of the electronic apparatus 100.

The main body 10 includes a front surface 101, a rear surface 103, and a side surface 102. The front surface 101 and the back surface 103 are sequentially disposed opposite to each other along a thickness direction z of the electronic device 100, and the side surfaces 102 are respectively connected to the front surface 101 and the back surface 103. Optionally, in some embodiments, the front surface 101 may be a side surface of the electronic device 100 that is mainly facing the user when in use, for example: the electronic device 100 is used for displaying a plane where a display surface of a picture is located. The side surface 102 is, for example, an outer surface of a side frame of the electronic device 100. The two opposite sides of the side surface 102 respectively connect the peripheral edge of the front surface 101 and the peripheral edge of the back surface 103. The side faces 102 extend in a length direction y and a width direction x of the electronic device 100.

Optionally, in some embodiments, the chip function module 20 is disposed on the side surface 102 of the electronic device 100. The side surface 102 is provided with a mounting hole 104, the chip functional module 20 is disposed on the main body 10 through the mounting hole 104, and a part of the outer surface of the chip functional module 20 is exposed from the mounting hole 104. It is understood that the shape of the exposed portion of the outer surface of the chip functional module 20 may match the shape of the adjacent portion of the side surface 102, so as to maintain the overall consistency of the appearance of the electronic device 100 and improve the grip feeling of the user. The shapes of the chip functional module 20 are matched with each other, which means that the exposed part of the outer surface of the chip functional module 20 and the adjacent part of the side surface 102 have the same shape, for example: the exposed outer surface of the chip functional module 20 has the same curvature as the adjacent side surface 102. Alternatively, the shape of the exposed part of the outer surface of the chip functional module 20 conforms to the shape change rule of the side surface 102 at this position, for example: the side surface 102 is a wave curved surface which changes periodically, and the shape of the exposed part of the outer surface of the chip functional module 20 is matched with the wave shape of the side surface 102 at the position of the mounting hole 104.

It is understood that in other embodiments, the chip functional module 20 may be disposed on other surfaces of the electronic device 100, and the same technical effect can be achieved by designing the shape of the exposed outer surface of the chip functional module 20 to match the shape of the surface on which the chip functional module is disposed.

Optionally, in some embodiments, the electronic device 100 is, for example but not limited to, a smart phone, a tablet computer, a notebook computer, a display, a television, a touch interactive screen, a smart door lock, a smart wearable device, a vehicle, a robot, an automatic numerical control machine, and the like.

Optionally, in some embodiments, the chip function module 20 may be a biometric module for recognizing biometric information of a user, including but not limited to skin texture information such as fingerprints, palm prints, ear prints, and foot prints, and other biometric information such as heart rate, veins, blood oxygen concentration, iris, voice prints, and the like. Specifically, chip function module 20 for example can be for the fingerprint identification module that is used for discerning the fingerprint, the identification principle of fingerprint identification module can be capacitanc fingerprint identification, optical type fingerprint identification or ultrasonic wave formula fingerprint identification, the utility model discloses do not limit to this.

Optionally, in some embodiments, the electronic device 100 may be a mobile phone. The chip function module 20, for example, a fingerprint recognition module, is disposed on a side frame of the mobile phone, and the side frame has a curved surface as a side surface of the mobile phone. The outer surface of the portion of the encapsulation 16 exposed by the functional chip module 20 is a curved surface having a curvature matching the adjacent side frame surface, so that the exposed portion of the functional chip module 20 matches the side frame surface in shape.

Alternatively, the chip function Module 20 may be integrated with a function component disposed on a side frame of the mobile phone, such as, but not limited to, a power key, a volume key, a Subscriber Identity Module (SIM) card slot, and the like. Alternatively, the chip function module 20 may also be separately disposed at a preset position on the side frame of the mobile phone, where the preset position is, for example, a position where a user holds the side frame with fingers when operating the mobile phone.

It should be noted that, limited by the size of the chip functional module 20 shown in fig. 1, the chip module 20 in fig. 1 is only exemplarily shown in a rectangular parallelepiped at the installation position on the electronic device 100, and the actual structure of the chip module 20 is not shown.

Fig. 2 is a schematic structural diagram of the chip functional module 20 shown in fig. 1. Fig. 3 is a cross-sectional view of the functional module of the chip in fig. 2 along the line III-III. Referring to fig. 1, fig. 2 and fig. 3, the chip functional module 20 includes a circuit board 30 and a chip package structure 10, the circuit board 30 is electrically connected to the chip package structure 10, and the chip package structure 10 is electrically connected to the outside through the circuit board 30.

The chip package structure 10 includes a substrate 12, an integrated circuit die 14, and a package portion 16. The substrate 12 includes a first surface 122 and a second surface 124 disposed opposite each other in a thickness direction thereof. The integrated circuit die 14 is disposed on the first surface 122 of the substrate 12 and is electrically connected to the outside through the substrate 12. The encapsulation 16 is disposed on the substrate 12 and covers the integrated circuit die 14 to protect the integrated circuit die 14.

For convenience of description, a rectangular coordinate system of the functional module 20 is defined, where the axis l is a length direction of the functional module 20, the axis w is a width direction of the functional module 20, and the axis t is a thickness direction of the functional module 20. Referring to fig. 1, the correspondence between the rectangular coordinate system wlt of the chip functional module 20 and the rectangular coordinate system xyz of the electronic apparatus 100 is: the length direction l of the chip functional module 20 is the same as the length direction y of the electronic device 100, the width direction w of the chip functional module 20 is the same as the thickness direction z of the electronic device 100, and the thickness direction t of the chip functional module 20 is the same as the width direction x of the electronic device 100.

Optionally, in some embodiments, the chip functional module 20 is in a shape of an elongated bar, the chip functional module 20 is mounted along the length direction y of the electronic device 100 according to the length direction l of the chip packaging structure 10, and the packaging portion 16 is oriented to the outer side of the electronic device 100. The portion 165 of the outer surface of the package 16 facing away from the first surface 122 becomes the exposed portion of the outer surface of the whole chip functional module 20, and needs to match the shape of the side 102 of the adjacent electronic device 100, for example: if the side surface 102 of the electronic device 100 adjacent to the side surface is a curved surface, a portion of the outer surface 165 of the package portion 16 facing away from the first surface 122 is also a curved surface.

Optionally, in some embodiments, the chip package structure 10 is an elongated strip, and its corresponding components, such as: the substrate 12, the ic die 14, the package 16, etc. are also correspondingly shaped like a strip, and can be described by using the cartesian coordinates wlt of the chip functional module 20 as a reference.

The substrate 12 has a length direction l and a width direction w perpendicular to the thickness direction t thereof, respectively. The substrate 12 further includes a first side 126 connecting the first surface 122 and the second surface 124, wherein one end of the first side 126 along the length direction l of the substrate 12 is cut away near the second surface 124 to form a notch 125. A plurality of terminals 127 are disposed on the second surface 124 of the substrate 12 for external electrical connection, and the integrated circuit die 14 is disposed on the first surface 122 of the substrate 12 and electrically connected to the terminals 127 through a circuit (not shown) disposed in the substrate 12.

Referring to fig. 4, fig. 4 is a top view of the chip functional module 20 shown in fig. 2. As shown in fig. 4, optionally, in some embodiments, the terminals 127 are arranged in sequence along the length direction l of the substrate 12 itself.

The circuit board 30 is attached to the second surface 124 of the substrate 12 and electrically connected to the chip package structure 10 through the terminals 127 on the second surface 124. Optionally, in some embodiments, the circuit board 30 is in the shape of an elongated strip. The length direction of the circuit board 30 is the same as the length direction of the substrate 12, and is the length direction l of the chip functional module 20. The width direction of the circuit board 30 is the same as the width direction of the substrate 12, and is the width direction w of the chip functional module 20. Optionally, the width of the circuit board 30 itself is smaller than the width of the substrate 12 itself. The circuit board 30 is led out from the side of the substrate 12 where the notch 125 is opened.

The circuit board 30 is electrically connected to the terminals 127 of the substrate 12 through the conductive adhesive 50, and the area where the terminals 127 are located on the second surface 124 is the area where the circuit board 30 is electrically connected to the substrate 12. In order to improve the reliability of the electrical connection between the circuit board 30 and the terminals 127 of the substrate 12, an underfill 60(underfills) needs to be applied around the electrical connection area between the circuit board 30 and the substrate 12, the gap 125 on the substrate 12 is used for introducing the underfill 60, and the underfill 60 flows through capillary phenomenon after being introduced from the gap 125 to fill the electrical connection area between the circuit board 30 and the substrate 12.

Optionally, in some embodiments, the Circuit board 30 is a Flexible Printed Circuit (FPC). The chip functional module 20 further includes a reinforcing plate 40, one side surface of the FPC is electrically connected to the chip packaging structure 10, and the reinforcing plate 40 is disposed on the other side surface of the FPC facing away from the chip packaging structure 10 to improve the strength of the FPC.

The outer surface of the package portion 16 includes a second side surface 162, an upper surface 165, and a lower surface 166, the upper surface 165 and the lower surface 166 are disposed opposite to each other along the thickness direction t of the package portion 16, and the second side surface 162 connects the upper surface 165 and the lower surface 166, respectively. The lower surface 166 is attached to the first surface 122 of the substrate 12. The upper surface 165 is a portion of the outer surface of the package portion 16 facing away from the first surface 122 of the substrate 12. At least a portion of the upper surface 165, which is the exposed portion of the outer surface of the entire chip module 20, needs to match the shape of the adjacent surface of the electronic device 100.

Optionally, in some embodiments, the second side surface 162 is perpendicular to the first surface 122 of the substrate 12, and at least a portion of the upper surface 165 is a curved surface, and a radius of curvature of each point on the curved surface ranges from 2mm to 10 mm.

It is understood that in other embodiments, the second side 162 may be inclined to the first surface 122 of the substrate 12.

Optionally, in some embodiments, the package portion 16 is an integrally molded package body 160, that is, the package body 160 is the entire package portion 16, and has the same shape as the package portion 16, for example, the outer surface of the package body 160 includes the second side surface 162, the upper surface 165, and the lower surface 166. The upper surface 165 of the package body 160 is an outer surface of the package portion 16 facing away from the first surface 122 of the substrate 12, and at least a portion of the outer surface of the upper surface 165, which is exposed as the whole chip functional module 20, needs to match with the surface shape of the adjacent electronic device 100. Optionally, at least a portion of the upper surface 165 of the package body 160 is a curved surface.

Optionally, referring to fig. 3 and fig. 5, in other embodiments, the package portion 16 includes an integrally formed package body 160 and a cover 167 disposed on the package body 160. The package body 160 is disposed on the substrate 12 and encapsulates the integrated circuit die 14. The package body 160 includes a third surface 163 and a fourth surface 164 oppositely disposed along the thickness direction t thereof, and a third side 168 connecting the third surface 163 and the fourth surface 164. The third surface 163 is defined as a surface of the package body 160 facing away from the first surface 122 of the substrate 12. Optionally, the third surface 163 is a plane, and the cover 167 is disposed on the third surface 163. The fourth surface 164 is a surface of the package 160 attached to the first surface 122 of the substrate 12, and corresponds to the lower surface 166 of the entire package portion 16. The third side 168 corresponds to at least a portion of the second side 162 of the entire package 16.

The cover 167 is attached to the third surface 163, and a portion of the outer surface 169 of the cover 167 facing away from the first surface 122 of the substrate 12 is required to match the surface shape of the adjacent electronic device 100 as the exposed portion of the outer surface of the whole chip functional module 20. Optionally, the portion of the outer surface 169 of the cover 167 facing away from the first surface 122 of the substrate 12 is curved.

The material of the cover 167 is selected from any one or a combination of a plurality of glass, ceramic, plastic and metal. The cover 167 is disposed above the package body 160 to serve as an exposed portion of the whole chip functional module 20, and the third surface 163 of the package body 160 may be configured to be a plane, so as to reduce the manufacturing difficulty of the chip package structure 10.

Alternatively, in some embodiments, the shape of the package body 160 may be directly formed by a mold. Alternatively, in other embodiments, the package body 160 is first molded into a preliminary shape by a mold and then formed into a specific shape by a surface processing process. For example: if a part of the outer surface of the package body 160 is required to be configured as a curved surface as an exposed portion of the whole chip functional module 20, the part of the outer surface of the package body 160 may be directly molded into a curved surface by a customized mold, or the part of the outer surface of the package body 160 may be molded into a plane by a mold and then processed into a curved surface by a surface processing process. Such as, but not limited to, Computer Numerical Control (CNC) machining, and the like.

The package body 160 is used to encapsulate the integrated circuit die 14 on the substrate 12 to support and protect the entire chip package structure 10. The material of the package body 160 is, for example, but not limited to, Polyimide (PI), Epoxy Molding Compound (EMC), silicone, and the like.

Optionally, in some embodiments, the integrated circuit die 14 is a fingerprint identification die, and correspondingly, the chip package structure 10 is a fingerprint identification chip. According to the principle that the chip function module 20 implements the fingerprint recognition function, the integrated circuit die 14 is, for example, but not limited to, a capacitive fingerprint recognition die, an optical fingerprint recognition die, and an ultrasonic fingerprint recognition die.

The utility model provides a chip function module 20 matches the shape on the surface that exposes of the encapsulation portion 16 of chip package structure 10 and the electronic equipment 100 that borders on each other, makes electronic equipment 100 keeps the whole uniformity of outward appearance.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and all modifications, equivalents, improvements and the like that are made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (17)

1. A chip package structure, comprising:

the substrate comprises a first surface and a second surface which are oppositely arranged along the thickness direction of the substrate;

an integrated circuit die disposed on the first surface of the substrate and electrically connected to an external through the substrate;

and the packaging part is arranged on the substrate and covers the integrated circuit bare chip, and part of the outer surface of the packaging part, which is back to the first surface, is a curved surface.

2. The chip package structure according to claim 1, wherein the package portion is an integrally formed package body, and a portion of an outer surface of the package body facing away from the first surface is a curved surface.

3. The chip package structure according to claim 1, wherein the package portion includes an integrally formed package body and a cover disposed on the package body, the package body encapsulates the ic die, a surface of the package body facing away from the first surface is defined as a third surface, the third surface is a plane, the cover is disposed on the third surface, and a portion of an outer surface of the cover facing away from the first surface is a curved surface.

4. The chip package structure according to any one of claims 2 or 3, wherein the shape of the package body is directly molded by a mold; or

The packaging body is formed into a preliminary shape through a die, and then is further processed through a surface processing technology.

5. The chip package structure according to claim 3, wherein the cover is made of a material selected from one or more of glass, ceramic, plastic, and metal.

6. The chip package structure according to claim 1, wherein the chip package structure has an elongated shape, and the substrate has a length direction and a width direction perpendicular to a thickness direction of the substrate.

7. The chip package structure of claim 6, wherein the substrate further comprises a first side surface connecting the first surface and the second surface, wherein one end of the first side surface along the length of the substrate is cut away near the second surface to form a notch.

8. The chip package structure according to claim 6, wherein the second surface has a plurality of terminals for external electrical connection, the terminals being arranged in sequence along a length direction of the substrate itself.

9. The chip package structure according to claim 1, wherein the outer surface of the package portion includes a second side surface, an upper surface, and a lower surface, the upper surface and the lower surface are disposed opposite to each other along a thickness direction of the package portion, the second side surface is respectively connected to the upper surface and the lower surface, the lower surface is attached to the first surface of the substrate, and at least a portion of the upper surface is a curved surface.

10. The chip package structure according to claim 1, wherein a radius of curvature of each point on the curved surface ranges from 2mm to 10 mm.

11. The chip package structure of claim 1, in which the integrated circuit die is a capacitive fingerprint identification die.

12. A chip functional module comprising a circuit board and the chip packaging structure of any one of claims 1-11, wherein the circuit board is attached to the second surface of the substrate and electrically connected to the chip packaging structure through terminals disposed on the second surface.

13. The chip function module of claim 12, wherein the circuit board is in the form of an elongated strip, and the width of the circuit board is smaller than the width of the substrate.

14. The chip module as recited in claim 12, wherein the chip package structure is in the form of an elongated strip, the substrate has a length direction and a width direction perpendicular to the thickness direction of the substrate, the substrate includes a first side surface connecting the first surface and the second surface, respectively, the first side surface is cut away at a position close to the second surface along one end of the length direction of the substrate to form a notch, and the circuit board is led out from the side of the substrate where the notch is formed.

15. The chip function module of claim 14, wherein an underfill is applied around the area where the circuit board is electrically connected to the substrate, and the gap on the substrate is used for guiding the underfill.

16. An electronic device comprising the chip functional module according to any one of claims 12-15.

17. The electronic device of claim 16, wherein: the electronic equipment comprises a side frame with a bent shape, the chip functional module is arranged on the side frame, and the outer surface of the exposed part of the packaging part of the chip functional module is a curved surface, so that the curved surface is matched with the surface shape of the adjacent side frame.

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