CN204791053U - Fingerprint sensor module - Google Patents
Fingerprint sensor module Download PDFInfo
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- CN204791053U CN204791053U CN201520434107.7U CN201520434107U CN204791053U CN 204791053 U CN204791053 U CN 204791053U CN 201520434107 U CN201520434107 U CN 201520434107U CN 204791053 U CN204791053 U CN 204791053U
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- 239000002184 metal Substances 0.000 claims abstract description 23
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- 239000000463 material Substances 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 6
- 239000004593 Epoxy Substances 0.000 claims description 5
- 239000012778 molding material Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract 2
- 230000001815 facial effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- 238000012536 packaging technology Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The utility model relates to a fingerprint sensor module, its sensing performance improves and economic nature improves. According to the utility model discloses a fingerprint sensor module of embodiment includes fingerprint sensor, encapsulation frame and metal wire. Wherein, fingerprint sensor has sensing pixel and a base plate, the sensing pixel is used for the sensing fingerprint, the base plate is formed with the portion of setting, the portion of setting up is equipped with input output terminal and has first face, first mask has and pastes the dress the height of sensing facial features of sensing pixel etc, encapsulation frame utilizes formed at the combination groove of upper surface and makes fingerprint sensor combines and exposes the sensing face to connecting portion have, run through in the connecting portion and be formed with a plurality of through -holes in order to provide the electricity connection, the metal wire be used for with the input output terminal with through -hole electricity is connected, and arrange for hug closely in first face with on the second face of connecting portion.
Description
Technical field
The utility model relates to a kind of fingerprint sensor module, particularly relates to a kind of sensing performance and improves and the improved fingerprint sensor module of economy.
Background technology
Recently, along with to comprise smart mobile phone (smartphone) or panel computer (tabletPC) portable electric appts masses care concentrate, the research and development of correlative technology field are carried out actively.
Portable electric appts is built-in more with the situation of the touch-screen (touchscreen) of the indicator integral as display device, and described touch-screen is for one of input media receiving particular command from user.And portable electric appts also possesses various function keys (functionkey) or the soft key (softkey) of the input media outside as touch-screen sometimes.
Such function key or soft key can be used as major key executable operations, such as, can perform and jump out operating application program and the function of getting back to initial picture, or can be used as retrogressing (BACK) key or Menu key executable operations, described back spacer is used for allowing user interface back to upper level interface, and described Menu key is for transferring conventional menu.Further, this function key or soft key can be embodied as physical button.In addition, such function key or soft key are by such as under type realization: the mode of the static capacity of sensing conductor, the electromagnetic mode of sensing time writer or this two kinds of modes all obtain the complex method embodied.
In addition, the purposes of recent smart mobile phone, to requiring that safe service is sharply expanded, makes the trend attempting fingerprint sensor being installed on smart mobile phone increase.Fingerprint sensor can be integrated with physical function key and realize.
Fingerprint sensor is a kind of sensor of the fingerprint for sensing human finger, utilizes fingerprint sensor and performs user's registration or authenticating step, thus the data that protection portable electric appts stores, and can security incident be prevented.
Fingerprint sensor can manufacture the component form comprising peripheral parts or structure, can effectively be installed on various electronic equipment accordingly.
In addition, sometimes also the navigation feature of the operation performing the indicator of cursor and so on is integrated in fingerprint sensor, the fingerprint sensor of this form is called bio-identification tracking plate (BTP; BiometricTrackPad).
The kind of fingerprint sensor comprises electrostatic capacity type, optical profile type, ultrasonic type, thermal, non-contact etc., recently many use electrostatic capacity type fingerprint sensors, excellent and the adaptive faculty of environmental change to external world of its sensitivity is strong, and conformability between portable electric appts is excellent.
Fig. 1 roughly represents the exemplary plot with the portable electric appts of bio-identification tracking plate of the prior art, and Fig. 2 is for representing chip on board of the prior art (ChipOnBoard; COB) the structure exemplary plot of the bio-identification tracking plate of the capacitance-type of type.
As depicted in figs. 1 and 2, portable electric appts 10 comprises: display part 20, has touch screen function; Cover glass 30, protection display part 20, and form the front of portable electric appts 10; Bio-identification tracking plate 40.
Bio-identification tracking plate 40 to be provided on main substrate 41 and to have the fingerprint sensor 43 that encapsulated material 42 covers.Fingerprint sensor 43 has submounts 44 and is provided to the sensor pixel 45 on submounts 44, and can the fingerprint of sensing user finger 90, or by the movement of sensing user finger 90 pilot guide.Bonding line 46 is for being electrically connected submounts 44 with main substrate 41, and accordingly, fingerprint sensor 43 is electrically connected on main substrate 41 by bonding line 46.
In addition, in this electrostatic capacity type bio-identification tracking plate 40, user point 90 fingerprint and for sense static capacity sensor pixel 45 between distance D1 (that is, sensing gap (sensingclearance)) can be used as the key factor that determines performance and play a role.But for existing bio-identification tracking plate 40, the bonding line 46 that fingerprint sensor 43 is electrically connected with main substrate 41 is defined loop (loop).Therefore, in order to make bonding line 46 form loop, the minimum constructive height H1 of about 55 μm is approximately needed with current level.Moreover, when utilizing encapsulating material 42 seal bond zygonema 46, sensing gap is approximately increased to 100 μm of levels, and result will act on as the factor of restriction sensing performance raising.
In addition, in existing bio-identification tracking plate 40, employ submounts 44 to connect sensor pixel 45 and main substrate 41.So, owing to using submounts 44 and these two substrates of main substrate 41, therefore will act on as the factor of cost increase.
Further, very little with the size of main substrate 41 Comparatively speaking submounts 44, therefore may along with restriction in making the size of the sensor pixel 45 being mounted on submounts 44 increase.In addition, when increasing the size of sensor pixel 45, the problem that the density that also can run into the sensor pixel 45 once mounted reduces, therefore finally will act on as making the factor of cost increase.
Such problem not only comes across the bio-identification tracking plate of the capacitance-type of COB type, but there will be too in the fingerprint sensor package part taking the capacitance-type of COB type.
Utility model content
In order to solve technical matters as above, the purpose of this utility model is to provide a kind of sensing performance to improve and the improved fingerprint sensor module of economy.
In order to solve the problems of the technologies described above, an embodiment of the present utility model provides a kind of fingerprint sensor module, it is characterized in that, comprise: fingerprint sensor, have sensor pixel and substrate, described sensor pixel is for sensing fingerprint, and described substrate is formed with setting unit, described setting unit is equipped with input/output terminal and has first surface, and described first surface has the height equal with the sensing face of the described sensor pixel of attachment; Package shelf, utilization is formed at the engagement groove of upper surface and described fingerprint sensor is combined and exposes described sensing face, and has connecting portion, runs through and be formed with multiple through hole (via) to provide electrical connection in described connecting portion; And metal wire, for described input/output terminal is electrically connected with described through hole, and be arranged as on second that is close to described first surface and described connecting portion.
In an embodiment of the present utility model, described through hole can be formed along the thickness direction of described connecting portion.
In an embodiment of the present utility model, in described through hole, metallics can be filled with, or the medial surface of described through hole can metal-coated material.
In an embodiment of the present utility model, described second can have the height equal with described first surface.
In an embodiment of the present utility model, between described fingerprint sensor and described engagement groove, encapsulating material can also be filled with.
In an embodiment of the present utility model, described package shelf can be made up of epoxy molding material (EMC).
In an embodiment of the present utility model, described package shelf can be moulding or molded item.
In an embodiment of the present utility model, described connecting portion can be provided to the side of described package shelf, and described through hole can be arranged along the length direction of described connecting portion.
In an embodiment of the present utility model, described setting unit can be provided to the side of described substrate, and described fingerprint sensor is incorporated into described engagement groove with described setting unit adjacent to the mode of described connecting portion.
According to an embodiment of the present utility model, the metal wire for being electrically connected with the through hole of package shelf by the input/output terminal of substrate is arranged as second of first surface and the connecting portion being close to setting unit.So, can eliminate sensor pixel and user point between sensing gap or make sensing gap become minimum, therefore can improve sensing performance.
In addition, the first surface of setting unit is close to by metal wire and second of connecting portion above arranges, thus can prevent the height of fingerprint sensor module from increasing because of metal wire, and the thickness of fingerprint sensor module can be reduced on the whole, thus compacter design can be realized.
Further, for for the fingerprint sensor module of an embodiment of the present utility model, the substrate being pasted with sensor pixel is incorporated into the package shelf formed by injection or mold pressing, and is electrically connected by metal wire and is encapsulated.So, fingerprint sensor module only needs a substrate, therefore can reduce cost in the past compared with using the situation of 2 substrates, thus can improve economy.
The beneficial effects of the utility model are not limited to above-mentioned effect, should be understood to include all technique effects can derived from the formation of the utility model described in detailed description of the present utility model or claims.
Accompanying drawing explanation
Fig. 1 roughly represents the exemplary plot with the portable electric appts of bio-identification tracking plate of the prior art.
Fig. 2 is for representing chip on board of the prior art (ChipOnBoard; COB) the structure exemplary plot of the bio-identification tracking plate of the capacitance-type of type.
Fig. 3 represents the stereographic map according to the fingerprint sensor module of an embodiment of the present utility model.
Fig. 4 represents the exploded perspective view according to the fingerprint sensor module of an embodiment of the present utility model.
Fig. 5 represents the sectional illustrations figure according to the fingerprint sensor module of an embodiment of the present utility model.
Fig. 6 represents the stereographic map according to the fingerprint sensor of the fingerprint sensor module of an embodiment of the present utility model.
Fig. 7 is the A-A line sectional view of Fig. 6.
Fig. 8 represents the exemplary plot according to the packaging technology of the fingerprint sensor module of an embodiment of the present utility model.
Fig. 9 represents the sectional illustrations figure according to the packaging technology of the fingerprint sensor module of an embodiment of the present utility model.
Figure 10 represents the sectional illustrations figure according to the fingerprint sensor module of another embodiment of the present utility model.
Symbol description
100: fingerprint sensor 110: sensor pixel
111: sensing face 200: substrate
220: setting unit 221: first surface
230: input/output terminal 300: package shelf
310: engagement groove 320: connecting portion
321: the second faces 330: through hole
340: metallics 400: metal wire
500: encapsulating material
Embodiment
Below, with reference to accompanying drawing, the utility model is described.But the utility model realizes by multiple different shape, be therefore not limited to embodiment described herein.Eliminating irrelevant part to clearly state the utility model in the accompanying drawings in addition, running through whole instructions, similar Reference numeral is imparted to similar part.
In whole instructions, when mentioning certain part and " being connected " with other parts, the situation that it not only comprises " directly connecting ", and comprise the situation that centre arranges miscellaneous part and " indirectly connecting ".Further, when mentioning certain part and " comprising " a certain inscape, if there is no record contrary especially, then do not get rid of other inscapes, but represent to have other inscapes.
Below, embodiment of the present utility model is described in detail with reference to accompanying drawing.
Fig. 3 represents the stereographic map according to the fingerprint sensor module of an embodiment of the present utility model, Fig. 4 represents the exploded perspective view according to the fingerprint sensor module of an embodiment of the present utility model, Fig. 5 represents the sectional illustrations figure according to the fingerprint sensor module of an embodiment of the present utility model, Fig. 6 represents the stereographic map according to the fingerprint sensor of the fingerprint sensor module of an embodiment of the present utility model, and Fig. 7 is the A-A line sectional view of Fig. 6.
As shown in Fig. 3 to Fig. 7, fingerprint sensor 100, package shelf 300 and metal wire 400 can be comprised according to the fingerprint sensor module of an embodiment of the present utility model.
Wherein, fingerprint sensor 100 can have: sensor pixel (sensingpixel) 110, for sensing fingerprint; Substrate 200, for mounting sensor pixel 110.Substrate 200 can be made up of silicon wafer (SiliconDie) type.
Sensor pixel 110 can be arranged at the whole top of substrate 200 commodiously.
Sensor pixel 110 can be formed as various form, such as, can be arranged as array (array) form and have sensing region.Sensor pixel 110 can the difference of static capacity that caused by the difference in height of the peak of the fingerprint pointed based on user and the shape of paddy of identification, and can scan (scanning) and produce fingerprint image based on the fingerprint image of the movement of finger.
Sensor pixel 110 can be the bio-identification Trackpad (BTP) with fingerprint sensing function for sensing fingerprint and indicator operating function.And then sensor pixel 110 can have following indicator operating function: sense the whether close of user's finger or based on the input information of its movement or electrostatic, and move based on it and the indicator of cursor and so on is moved.
And substrate 200 can have setting unit 220, setting unit 220 can be provided to the side of substrate 200.So sensor pixel 110 can be provided to substrate 200 more commodiously, can increase the area of sensing face 111 accordingly.If the area of sensing face 111 increases, then the size of the image generated by the image scanning of fingerprint can increase, and therefore can reduce the image scanning the number of working processes of fingerprint.In addition, the shortening of the image scanning the number of working processes of this fingerprint finally can bring the technique effect improving fingerprint sensing speed.
In addition, setting unit 220 can be equipped with input/output terminal 230, and input/output terminal 230 exposes laterally by the first surface 221 of setting unit 220.The first surface 221 of setting unit 220 is for being connected to the face of the upper surface 201 of substrate 200, and the first surface 221 of setting unit 220 can be formed with the height that the sensing face 111 of the sensor pixel 110 with attachment is equal.That is, when sensor pixel 110 is mounted on substrate 200, the sensing face 111 of sensor pixel 110 can form the height equal with the first surface 221 of setting unit 220.
Input/output terminal 230 can be electrically connected with sensor pixel 110, and such electrical connection realizes by the inside of substrate 200.
In addition, package shelf 300 can have engagement groove 310 and connecting portion 320.
Wherein, connecting portion 320 can be provided to the side of package shelf 300, can run through being furnished with multiple through hole (via) 330 in connecting portion 320 along the length direction of connecting portion 320.Metallics 340 can be filled in through hole 330.Or with the medial surface of metallics plated through hole 330, can also can provide electrical connection accordingly.Through hole 330 can be formed along the thickness direction of connecting portion 320, so through hole 330 can run through formation along the thickness direction of package shelf 300.
In addition, engagement groove 310 can be formed at the upper surface of package shelf 300.At this, connecting portion 320 is provided to the side of package shelf 300, thus engagement groove 310 can be made to be formed at the upper surface of package shelf 300 commodiously.So, both can minimize the size of package shelf 300, can be formed in package shelf 300 again can substrate 200 combine in conjunction with space, i.e. engagement groove 310.
Can in conjunction with fingerprint sensor 100 in engagement groove 310, now, fingerprint sensor 100 can be incorporated into engagement groove 310 with the setting unit 220 of substrate 200 adjacent to the mode of connecting portion 320.Further, fingerprint sensor 100 can be incorporated into engagement groove 310 in the mode of the sensing face 111 exposing sensor pixel 110.
Second face 321 of connecting portion 320 is the faces be connected with the upper surface 301 of package shelf 300, and when substrate 200 is incorporated into engagement groove 310, the second face 321 of connecting portion 320 can form the height equal with the first surface 221 of the setting unit 220 of substrate 200.Accordingly, when substrate 200 is incorporated into package shelf 300, the sensing face 111 of the upper surface 301 of package shelf 300, the second face 321 of connecting portion 320, the upper surface 201 of substrate 200, the first surface 221 of setting unit 220 and sensor pixel 110 all forms equal height, thus can entirely be formed on the whole.
According to embodiment of the present utility model, sensor pixel 110 is provided to the upper surface of fingerprint sensor module with exposure chamber, and the finger of user can be allowed directly to contact.Therefore, different from the past and can eliminate sensor pixel 110 and user point between sensing gap or make sensing gap become minimum, therefore can improve sensing performance.
In addition, package shelf 300 can by epoxy molding material (EpoxyMoldingCompound; EMC) form.And package shelf 300 can be the moulding or molded item that are made by the method based on injection or mold pressing.That is, by injection or the method for mold pressing, epoxy molding material is shaping and obtain package shelf 300.
In addition, input/output terminal 230 can be electrically connected with through hole 330 by metal wire 400.For this reason, an end of metal wire 400 can be connected to input/output terminal 230, and the other end can be connected to through hole 330.
Metal wire 400 can be close on the first surface 221 of setting unit 220 and the second face 321 of connecting portion 320 and arrange.Therefore, metal wire 400 can be made to be formed as height lower than existing bonding line 46 (with reference to figure 2).
That is, according to embodiment of the present utility model, fingerprint sensor 100 is incorporated into the engagement groove 310 of package shelf 300 and makes the upper surface of fingerprint sensor 100 correspond to the upper surface of package shelf 300.That is, may correspond to the height in package shelf 300 according to the height of the fingerprint sensor module of embodiment of the present utility model.In addition, owing to being arranged as by metal wire on the second face 321 of the first surface 221 and connecting portion 320 being close to setting unit 220, the gross thickness of fingerprint sensor module can therefore be reduced.And according to embodiment of the present utility model, fingerprint sensor 100 can be incorporated into the package shelf 300 as moulding or molded item.Namely, only needing a substrate 200 for mounting sensor pixel 110 according to the fingerprint sensor module of embodiment of the present utility model, therefore can reduce cost in the past compared with using the situation of 2 substrates (main substrate 41 (with reference to figure 2), submounts 44 (with reference to figure 2)).
Metal wire 400 makes the input/output terminal 230 being electrically connected on sensor pixel 110 be electrically connected with through hole 330, thus the through hole 330 in the 3rd face 322 being exposed to connecting portion 320 can be electrically connected with other external connecting.
Below, the packaging technology of fingerprint sensor module is described in detail.
Fig. 8 a ~ Fig. 8 d represents the exemplary plot according to the packaging technology of the fingerprint sensor module of an embodiment of the present utility model, and Fig. 9 a ~ Fig. 9 d represents the sectional illustrations figure according to the packaging technology of the fingerprint sensor module of an embodiment of the present utility model.
As shown in Fig. 8 a and Fig. 9 a, plastic making package shelf 300.Package shelf 300 can be made up of epoxy molding material, and can be by injection or the shaping moulding of the method for mold pressing or molded item.
Package shelf 300 can have engagement groove 310 and connecting portion 320, and connecting portion 320 can be provided to the side of package shelf 300.In addition, multiple through hole 330 can be furnished with along the length direction of connecting portion 320 in connecting portion 320.Further, through hole 330 can run through towards the thickness direction of connecting portion 320 and be formed.
Form through hole 330 when package shelf 300 can be made shaping in the method by injection or mold pressing, but be not limited thereto, also after first molding package shelf 300, through hole 330 can be formed by processing connecting portion 320.
In addition, as shown in Fig. 8 b and Fig. 9 b, in through hole 330, metallics 340 can be filled.Or can at the medial surface metal lining material of through hole 330.Accordingly, through hole 330 can provide electrical connection.At this, when with the medial surface of plating morphosis through hole 330, in order to ensure reliability, in through hole 330, the nonmetallic materials such as metallics or epoxy resin can also be filled.
And, as shown in Fig. 8 c and Fig. 9 c, fingerprint sensor 100 can be incorporated into the engagement groove 310 of package shelf 300.The substrate 200 of fingerprint sensor 100 can be made up of silicon wafer flap-type, and sensor pixel 110 can be mounted on substrate 200.At this, the sensing face 111 of sensor pixel 110 can present the height equal with the first surface 221 of the setting unit 220 of substrate 200.
Fingerprint sensor 100 can be made to be incorporated into engagement groove 310 with the setting unit 220 being formed at substrate 200 adjacent to the mode of the connecting portion 320 being formed at package shelf 300.In addition, when reach fingerprint sensor 100 in package shelf 300 in conjunction with complete state time, the first surface 221 of the setting unit 220 of substrate 200 can have the height equal with the second face 321 of the connecting portion 320 of package shelf 300.Accordingly, the upper surface of fingerprint sensor module can entirely be formed on the whole.
In addition, Figure 10 represents the sectional illustrations figure according to the fingerprint sensor module of another embodiment of the present utility model, as shown in Figure 10, can also be filled with encapsulating material 500 between fingerprint sensor 100 and engagement groove 310.That is, carry out encapsulating (encapsulation) by recharging encapsulating material 500 between substrate 200 and engagement groove 310, accordingly, fingerprint sensor 100 can be incorporated into package shelf 300 more securely.Encapsulating material 500 can first be filled in engagement groove 310 before fingerprint sensor 100 is incorporated into engagement groove 310, or can be filled in after fingerprint sensor 100 is incorporated into engagement groove 310 in the gap between substrate 200 and engagement groove 310.
Then, as shown in Fig. 8 d and Fig. 9 d, the input/output terminal 230 being provided to setting unit 220 and the through hole 330 being formed at connecting portion 320 are electrically connected by metal wire 440.
At this, metal wire 400 can be close on the first surface 221 of setting unit 220 and the second face 321 of connecting portion 320 and arrange.So, can prevent the height of fingerprint sensor module from increasing because of metal wire 400, thus the thickness of fingerprint sensor module can be reduced on the whole and realize compact design.
And, for for the fingerprint sensor module of embodiment of the present utility model, the fingerprint sensor 100 with sensor pixel 110 and substrate 200 is incorporated into the package shelf 300 formed by injection or mold pressing, and is encapsulated after being electrically connected by metal wire 400.
That is, only comprise a substrate according to the fingerprint sensor module of embodiment of the present utility model, therefore can reduce cost in the past compared with using the situation of 2 substrates, thus can economy be improved.
Above-mentioned to explanation of the present utility model be intended to citing, the personnel in the technical field belonging to the utility model with general knowledge probably can understand and under the prerequisite not changing technological thought of the present utility model or essential feature, described embodiment can be deformed into other concrete forms easily.
Therefore, will be appreciated that the embodiment of above record is in all respects exemplary but not determinate.Such as, each inscape illustrated with monolithic devices also can disperse to implement, and the inscape in like manner illustrated with decentralized also can be implemented with the form combined.
Scope of the present utility model is determined by claims, and all changes can derived by the implication of claims, scope and equivalent concepts thereof or the form of distortion all should be interpreted as being contained in scope of the present utility model.
Claims (9)
1. a fingerprint sensor module, is characterized in that, comprising:
Fingerprint sensor, have sensor pixel and substrate, described sensor pixel is for sensing fingerprint, and described substrate is formed with setting unit, described setting unit is equipped with input/output terminal and has first surface, and described first surface has the height equal with the sensing face of the described sensor pixel of attachment;
Package shelf, utilization is formed at the engagement groove of upper surface and described fingerprint sensor is combined and exposes described sensing face, and has connecting portion, runs through and be formed with multiple through hole to provide electrical connection in described connecting portion; And
Metal wire, for being electrically connected with described through hole by described input/output terminal, and is arranged as on second that is close to described first surface and described connecting portion.
2. fingerprint sensor module as claimed in claim 1, it is characterized in that, described through hole is formed along the thickness direction of described connecting portion.
3. fingerprint sensor module as claimed in claim 1, is characterized in that, be filled with metallics in described through hole, or the metal-coated material of the medial surface of described through hole.
4. fingerprint sensor module as claimed in claim 1, it is characterized in that, described second mask has the height equal with described first surface.
5. fingerprint sensor module as claimed in claim 1, is characterized in that, be also filled with encapsulating material between described fingerprint sensor and described engagement groove.
6. fingerprint sensor module as claimed in claim 1, it is characterized in that, described package shelf is made up of epoxy molding material.
7. fingerprint sensor module as claimed in claim 6, it is characterized in that, described package shelf is moulding or molded item.
8. fingerprint sensor module as claimed in claim 1, it is characterized in that, described connecting portion is provided to the side of described package shelf, and described through hole is arranged along the length direction of described connecting portion.
9. fingerprint sensor module as claimed in claim 1, it is characterized in that, described setting unit is provided to the side of described substrate, and described fingerprint sensor is incorporated into described engagement groove with described setting unit adjacent to the mode of described connecting portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0076728 | 2014-06-23 | ||
| KR1020140076728A KR20150146305A (en) | 2014-06-23 | 2014-06-23 | Fingerprint sensor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204791053U true CN204791053U (en) | 2015-11-18 |
Family
ID=54531057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520434107.7U Expired - Fee Related CN204791053U (en) | 2014-06-23 | 2015-06-23 | Fingerprint sensor module |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20150146305A (en) |
| CN (1) | CN204791053U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105868726A (en) * | 2016-04-08 | 2016-08-17 | 深圳芯启航科技有限公司 | Fingerprint sensing method, circuit and apparatus |
-
2014
- 2014-06-23 KR KR1020140076728A patent/KR20150146305A/en not_active Application Discontinuation
-
2015
- 2015-06-23 CN CN201520434107.7U patent/CN204791053U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105868726A (en) * | 2016-04-08 | 2016-08-17 | 深圳芯启航科技有限公司 | Fingerprint sensing method, circuit and apparatus |
| CN105868726B (en) * | 2016-04-08 | 2019-05-14 | 深圳芯启航科技有限公司 | A kind of fingerprint inducing method, circuit and fingerprint sensing device |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150146305A (en) | 2015-12-31 |
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