JP6585706B2 - Fingerprint sensor module and manufacturing method thereof - Google Patents

Description

  The present invention relates to a fingerprint sensor module and a manufacturing method thereof, and more particularly, to a fingerprint sensor module having an improved waterproof function and capable of being firmly assembled and a manufacturing method thereof.

  Recently, public interest has been concentrated on portable electronic devices including a smart phone and a tablet PC, and research and development in related technical fields are actively progressing.

  Portable electronic devices often include a touch screen integrated with a display, which is a display device, as one of input devices for inputting a specific command from a user. In addition, the portable electronic device includes various function keys and soft keys as input devices other than the touch screen.

  Such a function key or soft key can operate as a home key. For example, a function to end a running application and return to the initial screen, or a back (BACK) key to return the user interface to the previous hierarchy or It can act as a menu key that invokes frequently used menus. Such function keys and soft keys may be realized by a method of sensing a capacitance of a conductor, a method of sensing an electromagnetic wave of an electromagnetic pen, or a composite method in which both methods are implemented. Can be embodied.

  Recently, as the use of portable electronic devices is rapidly expanded to services that require security, for reasons of high security, a biometric sensor having a function of measuring biological information is made portable. There is an increasing tendency to attach to electronic devices.

  The biometric information includes a fingerprint, a blood vessel on the back of the hand, a voice, an iris, and the like, and a fingerprint sensor is often used as a biometric recognition sensor.

  The fingerprint sensor is a sensor that senses the fingerprint of a human finger, and through user registration and authentication procedures via the fingerprint sensor, the data stored in the portable electronic device is protected, and security accidents are detected in advance. Can be prevented.

  The fingerprint sensor can be manufactured in the form of a module including peripheral parts and structures, and can be embodied by being integrated with a physical function key, so that it can be effectively mounted on various electronic devices.

  Recently, a navigation function for operating a pointer such as a cursor has been integrated into a fingerprint sensor, and the degree of its use has been further widened. Such a fingerprint sensor is used as a biometric track pad (BTP). Say.

  There are capacitive, optical, ultrasonic, thermal sensing, and non-contact types of fingerprint sensors, but it has excellent sensitivity, is robust to changes in the external environment, and is compatible with portable electronic devices. In recent years, a capacitance type fingerprint sensor excellent in resistance has been widely used.

  Note that a portable electronic device on which a fingerprint sensor is mounted can be exposed to various external environments, and in particular, inflow of moisture can occur in a place where it can come into contact with water or in an environment such as rainy weather. As an example, recently, a strict waterproof grade (IP67) is required for portable electronic devices.

  FIG. 1 is an exemplary diagram showing an example of a conventional portable electronic device equipped with a fingerprint sensor, and FIG. 2 is an exemplary diagram showing an example of a conventional fingerprint sensor.

  As shown in FIGS. 1 and 2, the fingerprint sensor 20 of the conventional portable electronic device 10 may be integrated with function buttons and the like. The fingerprint sensor 20 can be attached to the buttonhole 12 provided in the case 11 of the portable electronic device 10.

  The fingerprint sensor 20 can be mounted on the main board 30 of the portable electronic device 10, and at this time, the fingerprint sensor 20 can be mounted on the main board 30 by a surface mounting process (SMT: Surface Mount Technology).

  However, in general, in the substrate mounting by the surface mounting process, a part of the electrically connected terminals can be exposed. That is, referring to FIG. 2, when the terminal 21 of the fingerprint sensor 20 and the terminal 31 of the main board 30 are not accurately connected, portions 22 and 32 exposed to the outside are generated.

  Even if such terminal exposure occurs finely, it can be contacted during penetration by external moisture or moisture in the air in order to open the terminal. In addition, such contact with external moisture or moisture in the air causes a short circuit, which may cause a malfunction or damage of the fingerprint sensor.

  FIG. 3 is a view illustrating another example of a conventional fingerprint sensor. Referring to FIG. 3, a conventional fingerprint sensor 20a according to another embodiment has a fingerprint to block inflow of moisture or moisture. A sealing agent 50 may be further provided outside the sensor 20a.

  However, when the sealing agent 50 is provided outside the fingerprint sensor 20a, the sealing agent 50 occupies a certain area outside the fingerprint sensor 20a, so that the bezel 70 cannot be provided at a predetermined position. That is, by providing the sealing agent 50 in the portion where the bezel 70 is to be located, the bezel 70 and the fingerprint sensor 20a are spread at a distance D1 that is equal to or greater than a predetermined distance, and the bezel 70 is lifted. There is a problem that the main substrate 30 is not firmly bonded.

  In order to solve the above-described problems, an object of the present invention is to provide a fingerprint sensor module having an improved waterproof function and capable of being firmly assembled and a method for manufacturing the same.

  To achieve the above object, an embodiment of the present invention includes a fingerprint sensor having a sensing unit and an auxiliary substrate electrically connected to the sensing unit; a main substrate on which the fingerprint sensor is mounted; A conductive resin provided between the fingerprint sensor and the main substrate and electrically connecting the fingerprint sensor and the main substrate; wherein the conductive resin blocks moisture from flowing in from the outside. As described above, a fingerprint sensor module is provided, wherein the fingerprint sensor and the main substrate are hermetically sealed.

  In one embodiment of the present invention, the conductive resin may be entirely provided on one surface of the main substrate.

  In one embodiment of the present invention, the conductive resin may be an anisotropic conductive film (ACF).

  In one embodiment of the present invention, a first terminal and a second terminal are formed on one surface of the auxiliary substrate and the one surface of the main substrate so as to be inserted and coupled in pairs. The terminal and the second terminal may be electrically connected through the conductive resin.

  In one embodiment of the present invention, the first terminal may be protruded, and the second terminal may be recessed so that the first terminal is inserted.

  In one embodiment of the present invention, the first terminal may be recessed, and the second terminal may be protruded so as to be inserted into the first terminal.

  In one embodiment of the present invention, a first terminal and a second terminal are formed on the one surface of the auxiliary substrate and the one surface of the main substrate in shapes corresponding to positions corresponding to each other. The two terminals can be electrically connected via the conductive resin.

  In one embodiment of the present invention, the first terminal and the second terminal may be protruded.

  In one embodiment of the present invention, the first terminal and the second terminal may be recessed.

  In one embodiment of the present invention, the main board is further provided with a bezel so as to surround the fingerprint sensor, and the bezel and the main board may be hermetically sealed with the conductive resin.

  In one embodiment of the present invention, the bezel can send a driving signal for fingerprint sensing.

  In order to achieve the above object, an embodiment of the present invention includes a step of providing a fingerprint sensor having a sensing unit and an auxiliary substrate electrically connected to the sensing unit; A step of holding the fingerprint sensor on the jig holding portion so as to face the side; a step of providing a conductive resin on one surface of the main substrate; and a thermocompression bonding of the auxiliary substrate and the conductive resin. And bonding the main substrate and the fingerprint sensor, wherein the conductive resin seals between the fingerprint sensor and the main substrate so that moisture flowing from outside is blocked. A method for manufacturing a fingerprint sensor module is provided.

  In order to achieve the above object, an embodiment of the present invention includes a step of providing a fingerprint sensor having a sensing unit and an auxiliary substrate electrically connected to the sensing unit; A step in which a conductive resin is provided; a step in which the main substrate is held on a jig holding portion so that the conductive resin faces upward; and the auxiliary substrate and the conductive resin are thermocompression bonded. And bonding the fingerprint sensor and the main substrate, wherein the conductive resin seals between the fingerprint sensor and the main substrate such that moisture flowing from outside is blocked. A method for manufacturing a fingerprint sensor module is provided.

  In one embodiment of the present invention, the conductive resin may be provided on one surface of the main substrate when the conductive resin is provided.

  In one embodiment of the present invention, the conductive resin may be an anisotropic conductive film (ACF).

  In one embodiment of the present invention, before the auxiliary substrate and the conductive resin are thermocompression bonded, the holding portion is further provided with a bezel, and the bezel is thermocompression bonded with the auxiliary substrate and the conductive resin. At the same time, it may be thermocompression bonded with the conductive resin.

  According to an embodiment of the present invention, a conductive resin is provided between the auxiliary substrate of the fingerprint sensor and the main substrate, and the auxiliary substrate and the main substrate can be electrically connected. The space can be sealed. As a result, the inflow of moisture or moisture in the atmosphere from the outside can be blocked, so that the waterproof function is improved, the paragraph of the electric circuit can be prevented, and the fingerprint sensor and the main board are firmly fixed by the bonding force of the conductive resin Can be combined.

  Also, according to one embodiment of the present invention, the conductive resin can be hermetically sealed between the bezel and the main substrate, thereby blocking the inflow of external moisture or moisture in the atmosphere, and further improving the waterproof function. can do.

  The effects of the present invention are not limited to the above-mentioned effects, but should be understood to include all effects that can be inferred from the detailed description of the present invention or the structure of the invention described in the claims. Don't be.

It is an illustration figure which shows an example of the conventional portable electronic device with which the fingerprint sensor was mounted | worn. It is an illustration figure which shows an example of the conventional fingerprint sensor. It is an illustration figure which shows the other example of the conventional fingerprint sensor. It is a perspective view showing a fingerprint sensor module according to an embodiment of the present invention. 1 is an exploded perspective view showing a fingerprint sensor module according to an embodiment of the present invention. 1 is a cross-sectional view illustrating a fingerprint sensor module according to an embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating terminal shapes of an auxiliary substrate and a main substrate of a fingerprint sensor module according to an embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating terminal shapes of an auxiliary substrate and a main substrate of a fingerprint sensor module according to an embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating terminal shapes of an auxiliary substrate and a main substrate of a fingerprint sensor module according to an embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating terminal shapes of an auxiliary substrate and a main substrate of a fingerprint sensor module according to an embodiment of the present invention. FIG. 8 is a plan view illustrating a terminal shape example of an auxiliary substrate and a main substrate of the fingerprint sensor module of FIG. 7. 3 is a flowchart illustrating a method of manufacturing a fingerprint sensor module according to an embodiment of the present invention. It is an exemplary view showing a holding jig used in a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention. It is an exemplary view for explaining a manufacturing process of a fingerprint sensor module according to an embodiment of the present invention. 6 is a flowchart illustrating a method of manufacturing a fingerprint sensor module according to another embodiment of the present invention. It is an exemplary view for explaining a manufacturing process of a fingerprint sensor module according to another embodiment of the present invention.

  Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be embodied in a variety of different forms, and thus is not limited to the embodiments described herein. In addition, in the drawings, in order to clearly describe the present invention, portions not related to the description are omitted, and similar portions are denoted by similar reference numerals throughout the specification.

  In the entire specification, when an arbitrary part is referred to as being “connected” to another part, this is not only in the case of being “directly connected” but also having another member in between. This includes cases where it is “indirectly linked”. Further, when any part refers to “including” a certain component, this does not exclude other components, and can further include other components unless otherwise stated to the contrary. Means.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  4 is a perspective view illustrating a fingerprint sensor module according to an embodiment of the present invention, FIG. 5 is an exploded perspective view illustrating a fingerprint sensor module according to an embodiment of the present invention, and FIG. It is an example of a section showing a fingerprint sensor module by one embodiment.

  4 to 6, the fingerprint sensor module according to an embodiment of the present invention may include a fingerprint sensor 100, a main substrate 300, and a conductive resin 500.

  Here, the fingerprint sensor 100 may include a sensing unit 110 and an auxiliary substrate 150 that is electrically connected to the sensing unit 110.

  Further, the fingerprint sensor 100 may be mounted on the main substrate 300, and the conductive resin 500 is provided between the fingerprint sensor 100 and the main substrate 300, and the fingerprint sensor 100 and the main substrate 300 can be electrically connected. The conductive resin 500 can hermetically seal between the fingerprint sensor 100 and the main substrate 300, thereby blocking external moisture from flowing between the fingerprint sensor 100 and the main substrate 300.

  Specifically, the fingerprint sensor 100 may include a sensing unit 110 and an auxiliary board 150 that is electrically connected to the sensing unit 110.

  Various types may be applied to the fingerprint sensor 100 according to the present invention. For example, a capacitance type, an optical type, an ultrasonic method, a heat sensing method, a non-contact method, or the like can be applied to the fingerprint sensor 100. In the following, for convenience of explanation, the fingerprint sensor 100 will be described with a capacitance type.

  First, the sensing unit 110 may have various forms. For example, the sensing unit 110 may be formed using a conductor, and may include sensing pixels that are arranged in an array and have a sensing region. In addition, the sensing unit 110 may include a plurality of line-type drive electrodes and reception electrodes. In addition, the sensing unit 110 may be an AREA type having a plurality of image receiving units.

  In addition, the sensing unit 110 can search for a difference in capacitance due to a difference in height along the shape of the peaks and valleys of the fingerprint of the user's finger, scan the fingerprint image, and create a fingerprint image. it can. The sensing unit 110 can create a fingerprint image by scanning a fingerprint image not only when the user's finger touches but also when the user's finger moves.

  In addition, the sensing unit 110 may have a fingerprint sensing function for detecting a fingerprint and a pointer operation function, and thus the fingerprint sensor 100 may be implemented with a biometric trackpad (BTP).

  In addition, the sensing unit 110 may have a user finger position tracking function. That is, the sensing unit 110 can sense input information and static electricity based on whether or not a user's finger is accessible, and can have a pointer operation function for moving a pointer such as a cursor based on the movement.

  Further, the fingerprint sensor 100 may have a base 120 on which the sensing unit 110 is mounted.

  The base 120 may include a circuit electrically connected to the sensing unit 110, and the base 120 may be provided with a pad (not shown) so that an electric signal can be input and output. .

  The base 120 may be made of a silicone material, and the sensing unit 110 and the base 120 may be manufactured by a WLP (Wafer Level Package) process.

  In addition, the base 120 may be mounted on the auxiliary board 150, and the sensing unit 110 may be electrically connected to the auxiliary board 150 by electrically connecting the base 120 and the auxiliary board 150. The auxiliary board 150 may be an FPCB (Flexible Printed Circuit Board), and may have an external interface connection part 151 so that wiring is formed therein and can be connected to an external interface.

  The base 120 and the auxiliary substrate 150 may be electrically connected by various methods. For example, the base 120 and the auxiliary substrate 150 may be connected by a bonding wire, a through silicon via (TSV), or the like.

  The fingerprint sensor 100 may be formed by various packaging methods such as COB (Chip On Board), QFP (Quad Flat Package), and BGA (Ball Grid Array).

  In addition, the fingerprint sensor 100 may further include a sealing unit 170.

  The sealing part 170 can serve to fix the base 120 to the auxiliary substrate 150, and is formed to correspond to the shape of the auxiliary substrate 150, and can configure the outer shape of the fingerprint sensor 100.

  In addition, the sealing unit 170 may be formed to cover the base 120 and the sensing unit 110, thereby protecting the base 120 and the sensing unit 110.

  Although FIG. 5 illustrates that the sealing part 170 is provided on both sides of the base 120, the present invention is not limited to this. For example, the sealing part 170 covers the entire outside of the base 120. It can also be provided. In this case, the sealing portion 170 can seal the space between the base 120 and the auxiliary substrate 150, and can prevent external moisture or moisture in the atmosphere from penetrating. The sealing unit 170 may be made of an epoxy molding compound (EMC).

  Further, the fingerprint sensor 100 can be mounted on the main board 300.

  At this time, the main substrate 300 may be electrically connected to the auxiliary substrate 150 of the fingerprint sensor 100, and the main substrate 300 may be a PCB (Printed Circuit Board).

  In addition, the conductive resin 500 is provided between the fingerprint sensor 100 and the main substrate 300 and can electrically connect the fingerprint sensor 100 and the main substrate 300.

  Here, the conductive resin 500 may be provided entirely on one surface of the main substrate 300, so that the conductive resin 500 is electrically conductive between the main substrate 300 and the fingerprint sensor 100 mounted on the main substrate 300. The resin 500 can be provided without leaking as a whole.

  As described above, the conductive resin 500 can electrically connect the main substrate 300 and the fingerprint sensor 100, and an anisotropic conductive film (ACF) may be used as the conductive resin 500.

  The conductive resin 500 can electrically connect the auxiliary substrate 150 of the fingerprint sensor 100 and the main substrate 300, and at the same time, can seal the space between the auxiliary substrate 150 and the main substrate 300. That is, the conductive particles 510 included in the conductive resin 500 can electrically connect the terminals 155 and 310 of the auxiliary substrate 150 and the main substrate 300. In addition, the epoxy 520 included in the conductive resin 500 flows between the auxiliary substrate 150 and the main substrate 300, can fill the gap, and can adhere a portion that is not electrically connected.

  As described above, in the fingerprint sensor module according to the present invention, since the conductive resin 500 is embedded between the auxiliary substrate 150 and the main substrate 300 to be airtight, the inflow of moisture or moisture in the atmosphere from the outside can be blocked. Accordingly, the waterproof function can be improved, a short circuit of the electric circuit can be prevented, and a firm bonding state can be maintained by the bonding force of the conductive resin 500.

  Note that the fingerprint sensor 100 may further include a bezel 700.

  The bezel 700 can be provided to surround the fingerprint sensor 100 and can be coupled to the main substrate 300. The bezel 700 may be formed with a step portion 710 for forming a space so that the external interface connection portion 151 of the auxiliary substrate 150 can be extended outward.

  The lower end portion of the bezel 700 can be bonded by the conductive resin 500, and the bezel 700 and the main substrate 300 can be electrically connected by the conductive particles 510 included in the conductive resin 500.

  The bezel 700 may be formed of a metal such as stainless steel, and may further have a function of sending a driving signal for fingerprint sensing.

  The conductive resin 500 can be hermetically sealed between the bezel 700 and the main substrate 300, whereby the inflow of external moisture or moisture in the atmosphere can be blocked.

  According to the present invention, the conductive resin 500 is not provided outside the fingerprint sensor 100 like the sealing agent 50 of the conventional fingerprint sensor 100 described above (see FIG. 3). An excessive gap is not generated between the bezel 700 and the bezel 700 and the main board 300, and a firm coupling force can be maintained.

  7 to 10 are cross-sectional exemplary views showing examples of terminal shapes of the auxiliary substrate and the main substrate of the fingerprint sensor module according to the embodiment of the present invention.

  According to the embodiment of the present invention, the terminals of the auxiliary board and the main board may be formed such that one terminal is inserted into and coupled to the other terminal in pairs.

  That is, as illustrated in FIG. 7, the first terminal 155 a may be protruded from one surface of the auxiliary substrate 150. In addition, the second terminal 310 a may be recessed on one surface of the main substrate 300 so that the first terminal 155 a is inserted. The first terminal 155 a and the second terminal 310 a are electrically connected via the conductive resin 500. Can be linked to.

  Accordingly, when the auxiliary substrate 150 and the main substrate 300 are coupled, the position alignment can be facilitated, and the coupling force and the sealing force can be increased in the process of coupling with the conductive resin 500.

  The shape of the terminal may be variously modified. Referring to FIG. 8, the first terminal 155 b formed on one surface of the auxiliary substrate 150 is recessed and the second terminal 310 b formed on one surface of the main substrate 300. May be protruded so as to be inserted into the first terminal 155b.

  The terminals of the auxiliary board and the main board are provided at positions corresponding to each other, and can be formed in a corresponding shape.

  That is, as shown in FIG. 9, the first terminal 155c formed on one surface of the auxiliary substrate 150 is protruded, and the second terminal 310c formed on one surface of the main substrate 300 corresponds to the first terminal 155c. It can also be provided to project. As shown in FIG. 10, the first terminal 155d formed on one surface of the auxiliary substrate 150 is recessed, and the second terminal 310d formed on one surface of the main substrate 300 is connected to the first terminal 155d. It can also be recessed to accommodate.

  11 is a plan view illustrating an example of terminal shapes of the auxiliary substrate and the main substrate of the fingerprint sensor module of FIG. 7. Referring to FIG. 11, the first terminal 155a and the main substrate protruding from the auxiliary substrate 150 are illustrated. The second terminal 310a recessed in the 300 may be formed in a size and shape that takes into account compensation for torsion and prevention of breakage of the terminal during assembly when the auxiliary board 150 and the main board 300 are assembled.

  In an exemplary embodiment of the present invention, the first terminal 155a protruding from the auxiliary board 150 may have a circular cross-sectional shape, and the second terminal 310a recessed in the main board 300 may have a square cross-sectional shape. Can have. Since the first terminal 155a to be inserted has a circular cross-sectional shape, even if the auxiliary board 150 or the main board 300 is twisted during assembly, the edge portion of the first terminal 155a is the second terminal 310a. It can be effectively prevented from being damaged by being pressed by the edge portion of the. In addition, the second terminal 310a may be formed in a size that allows the fingerprint sensor 100 (see FIG. 6) and the main board 300 to be assembled within the assembly tolerance range regardless of the coupling position of the first terminal 155a in the second terminal 310a. . For example, when the assembly tolerance of the fingerprint sensor 100 and the main board 300 is ± 0.2 mm and the diameter D2 of the first terminal 155a is 0.4 mm, the length L1 of one side of the second terminal 310 is 0.8 mm. Can be formed. Accordingly, the assembly tolerance of the fingerprint sensor 100 and the main board 300 can be within a range of ± 0.2 mm regardless of the position of the first terminal 155a in the second terminal 310a.

  Hereinafter, a method for manufacturing the fingerprint sensor module according to the present invention will be described.

  FIG. 12 is a flowchart illustrating a method of manufacturing a fingerprint sensor module according to an embodiment of the present invention, and FIG. 13 is an exemplary diagram illustrating a holding jig used in the manufacturing process of the fingerprint sensor module according to an embodiment of the present invention. FIG. 14 is an exemplary view for explaining a manufacturing process of the fingerprint sensor module according to the embodiment of the present invention.

  12 to 14, the method for manufacturing a fingerprint sensor module according to an embodiment of the present invention includes a sensing unit 110 and a fingerprint sensor having an auxiliary board 150 electrically connected to the sensing unit 110. Step S810 may be included.

  In addition, the method for manufacturing a fingerprint sensor module according to an exemplary embodiment of the present invention may include step S820 in which the fingerprint sensor 100 is held by the holding unit 910 of the jig 900 so that the sensing unit 110 faces downward.

  Referring to FIG. 13 and FIG. 14A, the jig 900 can have a plurality of holding portions 910. The holding part 910 may be formed in a shape corresponding to the main board 300, and may have an extension part 920 having a shape corresponding to the external interface connection part 151 (see FIG. 5) of the auxiliary board 150.

  The fingerprint sensor 100 can be held such that the sensing unit 110 faces the bottom surface of the holding unit 910.

  In addition, the method for manufacturing a fingerprint sensor module according to an embodiment of the present invention may include step S830 in which a conductive resin 500 is provided on one surface of the main substrate 300.

  Referring to FIG. 14B, in step S830, the conductive resin 500 may be provided on the entire surface of the main substrate 300. The conductive resin 500 may be formed of an anisotropic conductive film (ACF). ).

  Referring to FIG. 14C, in the method of manufacturing the fingerprint sensor module according to the embodiment of the present invention, the auxiliary substrate 150 and the conductive resin 500 are thermocompression bonded to the main substrate 300 and the fingerprint. A step S840 of coupling the sensor 100 may be included.

  Note that a bezel 700 may be further provided in the holding portion 910 before the auxiliary substrate 150 and the conductive resin 500 are thermocompression bonded. In addition, the bezel 700 can be thermocompression bonded to the conductive resin 500 at the same time as the auxiliary substrate 150 and the conductive resin 500 are thermocompression bonded.

  Therefore, the conductive resin 500 can seal between the fingerprint sensor 100 and the main board 300 and between the bezel 700 and the main board 300 so that moisture does not flow from the outside. Can be improved.

  Further, the conductive resin 500 can provide a sufficient bonding force between the fingerprint sensor 100 and the main substrate 300 and between the bezel 700 and the main substrate 300.

  FIG. 15 is a flowchart illustrating a method of manufacturing a fingerprint sensor module according to another embodiment of the present invention, and FIG. 16 is an exemplary view for explaining a manufacturing process of a fingerprint sensor module according to another embodiment of the present invention. is there.

  Referring to FIGS. 15 and 16, the method for manufacturing a fingerprint sensor module according to another embodiment of the present invention includes a sensing unit 110 and an auxiliary substrate 150 electrically connected to the sensing unit 110. The step S1110 is provided, and the step S1120 is provided where the conductive resin 500 is provided on one surface of the main substrate 300.

  In addition, the method for manufacturing a fingerprint sensor module according to another embodiment of the present invention may include step S1130 in which the main substrate 300 is held by the holding unit 910 of the jig 900 so that the conductive resin 500 faces upward. (Refer to FIG. 16A).

  That is, in the method of manufacturing the fingerprint sensor module according to another embodiment of the present invention, unlike the above-described embodiment, the main substrate 300 in which the conductive resin 500 is provided on the jig 900 is held first. it can.

  In addition, the method for manufacturing a fingerprint sensor module according to another embodiment of the present invention includes step S1140 of combining the fingerprint sensor 100 and the main substrate 300 such that the auxiliary substrate 150 and the conductive resin 500 are thermocompression bonded. (See (b) and (c) of FIG. 16).

  Also in the present embodiment, the bezel 700 can be further provided on the holding portion 910 before the auxiliary substrate 150 and the conductive resin 500 are thermocompression bonded. At this time, the bezel 700 may be provided on the conductive resin 500 of the main substrate 300.

  In addition, the bezel 700 can be thermocompression bonded to the conductive resin 500 at the same time as the auxiliary substrate 150 and the conductive resin 500 are thermocompression bonded.

  The above description of the present invention is for illustrative purposes only, and those having ordinary knowledge in the technical field to which the present invention pertains can be used without changing the technical idea and essential features of the present invention. It can be understood that it can be easily transformed into a specific form. Therefore, it should be understood that the embodiments described above are illustrative in all aspects and not limiting. For example, each component described in a single type may be implemented in a distributed manner, and similarly, components described as being distributed may be implemented in a combined form.

  The scope of the present invention is indicated by the scope of the claims to be described later, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof are included in the scope of the present invention. Must be interpreted.

100 Fingerprint sensor 110 Sensing unit 120 Base 150 Auxiliary substrate 155a, 155b, 155c, 155d First terminal 170 Sealing unit 300 Main substrate 310a, 310b, 310c, 310d Second terminal 500 Conductive resin 700 Bezel 900 Jig 910 Holding unit

Claims (10)

A fingerprint sensor having a sensing unit and an auxiliary substrate electrically connected to the sensing unit;
A main board on which the fingerprint sensor is mounted;
A conductive resin provided between the fingerprint sensor and the main substrate and electrically connecting the fingerprint sensor and the main substrate;
The conductive resin is generally provided on one surface of the main substrate and hermetically seals between the fingerprint sensor and the main substrate so that moisture inflow is blocked from the outside .
A first terminal is formed on one surface of the auxiliary substrate, a second terminal is formed on one surface of the main substrate, and the first terminal and the second terminal are electrically connected through the conductive resin, Any one of the first terminal and the second terminal is formed to protrude, and the other one is formed to be recessed, so that the terminal formed to be inserted is inserted into the recessed terminal. The terminal formed in the depression is larger in size than the protruding terminal so that the one terminal and the second terminal can be assembled within an assembly tolerance range, and the auxiliary board and the main terminal are formed. A fingerprint sensor module that is configured to be guaranteed against displacement during assembly of the substrate and to prevent damage to the terminals .   The fingerprint sensor module according to claim 1, wherein the conductive resin is an anisotropic conductive film (ACF). The fingerprint sensor module according to claim 1 , wherein the first terminal is protruded and the second terminal is recessed so that the first terminal is inserted. The fingerprint sensor module according to claim 1 , wherein the first terminal is recessed, and the second terminal is protruded so as to be inserted into the first terminal.   The fingerprint according to claim 1, wherein a bezel is further provided on the main substrate so as to surround the fingerprint sensor, and the bezel and the main substrate are hermetically sealed by the conductive resin. Sensor module. The fingerprint sensor module according to claim 5 , wherein the bezel sends a driving signal for fingerprint sensing. Providing a fingerprint sensor having a sensing unit and an auxiliary substrate electrically connected to the sensing unit;
A step of holding the fingerprint sensor on a jig holding portion so that the sensing portion is directed downward;
A step of providing a conductive resin on one surface of the main substrate;
Bonding the main substrate and the fingerprint sensor such that the auxiliary substrate and the conductive resin are thermocompression bonded,
The conductive resin is generally provided on one surface of the main substrate, and hermetically seals between the fingerprint sensor and the main substrate so that moisture flowing from the outside is blocked .
A first terminal is formed on one surface of the auxiliary substrate, a second terminal is formed on one surface of the main substrate, and the first terminal and the second terminal are electrically connected through the conductive resin, Any one of the first terminal and the second terminal is formed to protrude, and the other one is formed to be recessed, so that the terminal formed to be inserted is inserted into the recessed terminal. The terminal formed in the depression is larger in size than the protruding terminal so that the one terminal and the second terminal can be assembled within an assembly tolerance range, and the auxiliary board and the main terminal are formed. A method for manufacturing a fingerprint sensor module , which is configured to guarantee a deviation during assembly of a substrate and prevent damage to terminals . Providing a fingerprint sensor having a sensing unit and an auxiliary substrate electrically connected to the sensing unit;
A step of providing a conductive resin on one surface of the main substrate;
A step of holding the main board on a jig holding part so that the conductive resin faces upward;
Bonding the fingerprint sensor and the main substrate such that the auxiliary substrate and the conductive resin are thermocompression bonded,
The conductive resin is generally provided on one surface of the main substrate, and hermetically seals between the fingerprint sensor and the main substrate so that moisture flowing from the outside is blocked .
A first terminal is formed on one surface of the auxiliary substrate, a second terminal is formed on one surface of the main substrate, and the first terminal and the second terminal are electrically connected through the conductive resin, Any one of the first terminal and the second terminal is formed to protrude, and the other one is formed to be recessed, so that the terminal formed to be inserted is inserted into the recessed terminal. The terminal formed in the depression is larger in size than the protruding terminal so that the one terminal and the second terminal can be assembled within an assembly tolerance range, and the auxiliary board and the main terminal are formed. A method for manufacturing a fingerprint sensor module , which is configured to guarantee a deviation during assembly of a substrate and prevent damage to a terminal . The conductive resin, the manufacturing method of the fingerprint sensor module according to claim 7 or 8, characterized in that an anisotropic conductive film (ACF). Before the auxiliary substrate and the conductive resin are thermocompression bonded, the holding portion is further provided with a bezel, and the bezel is electrically conductive with the auxiliary substrate and the conductive resin at the same time. method for producing a fingerprint sensor module according to claim 7 or 8, characterized in that it is a resin and thermocompression bonding.