KR102183774B1 - ACF bonding method fingerprint device packaging method and apparatus - Google Patents

ACF bonding method fingerprint device packaging method and apparatus Download PDF

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KR102183774B1
KR102183774B1 KR1020200030420A KR20200030420A KR102183774B1 KR 102183774 B1 KR102183774 B1 KR 102183774B1 KR 1020200030420 A KR1020200030420 A KR 1020200030420A KR 20200030420 A KR20200030420 A KR 20200030420A KR 102183774 B1 KR102183774 B1 KR 102183774B1
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jig
fingerprint recognition
recognition sensor
product
bonding
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Korean (ko)
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김이환
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(주)밀스톤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

The present invention is to provide a method and apparatus for packaging a fingerprint recognition sensor without product deviation capable of producing a large amount of products at once by applying an AFC bonding process to the fingerprint recognition sensor and a PCB using heat-resistant tape and an ACF film. According to an embodiment of the present invention, the method for packaging a fingerprint recognition sensor of an ACF bonding method comprises the steps of: preparing a product seating jig having a plurality of receiving grooves in which the fingerprint recognition sensor is seated; applying or attaching a heat-resistant tape to the receiving groove of the product seating jig; and bonding the fingerprint recognition sensor of the receiving groove of the product seating jig using the heat-resistant tape.

Description

ACF 본딩 방식의 지문인식센서 패키징 방법 및 장치{ACF bonding method fingerprint device packaging method and apparatus}A method and apparatus for packaging a fingerprint recognition sensor using an ACF bonding method.

본 발명은 ACF 본딩 방식의 지문인식센서 패키징 방법 및 장치에 관한 것으로, 특히 제품안착지그와 지문인식센서를 내열테이프를 이용하여 접합하고, 히터블록을 통해 상하부에서 가열함으로써 한 번에 다량의 지문인식센서 본딩이 가능한 ACF 본딩 방식의 지문인식센서 패키징 방법 및 장치에 관한 것이다. The present invention relates to a method and apparatus for packaging a fingerprint recognition sensor of an ACF bonding method, and in particular, a product mounting jig and a fingerprint recognition sensor are bonded using a heat-resistant tape and heated at the top and bottom through a heater block to recognize a large amount of fingerprints at a time. The present invention relates to a method and apparatus for packaging a fingerprint recognition sensor of an ACF bonding method capable of sensor bonding.

지문인식센서는 모바일 기기의 보안기능 강화를 위하여 활발히 채택되고 있으며, 스마트카드, 모바일 결제와 같이 관련 응용 분야에서도 적용되고 있다.Fingerprint recognition sensors are being actively adopted to strengthen security functions of mobile devices, and are also applied in related application fields such as smart cards and mobile payments.

종래에 지문인식센서와 PCB 본딩 공정은 한 번에 한 셀만 작업이 가능하여 제품 하나를 생산하는 데 소요되는 시간이 긴 문제가 있다. 또한, 헤드 별 세팅이 상이하여 제품의 균일성이 떨어지고, 설비별 세팅 시간이 오래 걸리는 문제가 있다.In the conventional fingerprint recognition sensor and PCB bonding process, only one cell can be operated at a time, so there is a problem that it takes a long time to produce one product. In addition, there is a problem that the uniformity of the product is deteriorated because the setting for each head is different, and the setting time for each facility is long.

선행특허로는 한국공개특허 제10-2016-0002442호(모바일 기기의 지문인식센서 패키징 방법 및 구조)가 있으나, 지문인식센서의 색상 표현과 경도 향상을 위해 수회의 몰드형성단계와 코팅단계를 개시하고 있을 뿐이다. As a prior patent, Korean Patent Laid-Open Publication No. 10-2016-0002442 (a method and structure of packaging a fingerprint recognition sensor of a mobile device), but initiated several mold forming steps and coating steps to enhance the color expression and hardness of the fingerprint recognition sensor. I am just doing it.

본 발명이 해결하고자 하는 과제는 내열테이프 및 ACF필름을 사용하여 지문인식센서와 PCB를 AFC 본딩 공정을 적용함으로써 한 번에 대량의 제품 생산이 가능하고 제품간 편차가 없는 지문인식센서 패키징 방법 및 장치를 제공하는 데 있다. The problem to be solved by the present invention is to use a heat-resistant tape and ACF film to apply an AFC bonding process to a fingerprint recognition sensor and a PCB, so that a large amount of products can be produced at one time and there is no deviation between products. To provide.

본 발명의 실시예에 따른 ACF 본딩 방식의 지문인식센서의 패키징 방법은, 지문인식센서가 안착되는 다수개의 수용홈을 구비하는 제품안착지그를 준비하는 단계와, 상기 제품안착지그의수용홈에 내열테이프를 도포 또는 부착하는 단계와, 상기 제품안착지그의 수용홈의 지문인식센서를 내열테이프를 이용하여 지문인식센서를 접합하는 단계를 포함한다.The packaging method of the fingerprint recognition sensor of the ACF bonding method according to an embodiment of the present invention includes the steps of preparing a product seating jig having a plurality of receiving grooves in which the fingerprint recognition sensor is seated, and heat-resistant in the receiving groove of the product seating jig. And applying or attaching a tape, and bonding the fingerprint recognition sensor to the fingerprint recognition sensor of the receiving groove of the product mounting jig using a heat-resistant tape.

본 발명의 실시예에 따른 ACF 본딩 방식의 지문인식센서의 패키징 장치는, 지문인식센서가 안착되는 다수개의 수용홈을 구비하는 제품안착지그와, 상기 지문인식센서가 접합된 제품안착지그를 안착하는 히터블록지그와, 실리콘러버가 부착되고 히터블록지그와 결합하여 가열 본딩하는 히터블록으로 구성된다.The packaging device for a fingerprint recognition sensor of an ACF bonding method according to an embodiment of the present invention includes a product mounting jig having a plurality of receiving grooves in which the fingerprint recognition sensor is mounted, and a product mounting jig to which the fingerprint recognition sensor is bonded. It is composed of a heater block jig and a heater block to which a silicone rubber is attached and heat-bonded by bonding with the heater block jig.

본 발명에 의하면 한 번에 대량으로 지문인식센서 본딩 공정을 수행하여 텍트타임(tact time)을 줄일 수 있다.According to the present invention, a tact time can be reduced by performing a fingerprint recognition sensor bonding process in a large amount at a time.

또한, 히터블록을 이용하여 가열함으로써 열전도에 대한 열전도율이 높아 제품 간 편차를 줄여 균일성을 높일 수 있다.In addition, by heating using a heater block, the thermal conductivity for heat conduction is high, so it is possible to improve uniformity by reducing the variation between products.

도 1과 도 2는 본 발명의 실시예에 따른 제품안착지그와 지문인식센서를 접합하는 방법을 설명하는 도면이다.
도 3과 도 4는 본 발명의 실시예에 따른 지문인식센서 패키징 방법을 설명하는 흐름도이다.
도 5와 도 6은 본 발명의 실시예에 따른 제품안착지그와 ACF필름의 패키징 방법을 도시한 도면이다.1 and 2 are views for explaining a method of bonding a product mounting jig and a fingerprint recognition sensor according to an embodiment of the present invention.
3 and 4 are flowcharts illustrating a method of packaging a fingerprint recognition sensor according to an embodiment of the present invention.
5 and 6 are diagrams illustrating a product mounting jig and a packaging method of an ACF film according to an embodiment of the present invention.

본 명세서에 개시되어 있는 본 발명의 개념에 따른 실시예들에 대해서 특정한 구조적 또는 기능적 설명은 단지 본 발명의 개념에 따른 실시예들을 설명하기 위한 목적으로 예시 된 것으로서, 본 발명의 개념에 따른 실시예들은 다양한 형태들로 실시될 수 있으며 본 명세서에 설명된 실시예들에 한정되지 않는다.Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in the present specification are exemplified only for the purpose of describing embodiments according to the concept of the present invention, and embodiments according to the concept of the present invention They may be implemented in various forms and are not limited to the embodiments described herein.

본 발명의 개념에 따른 실시예들은 다양한 변경들을 가할 수 있고 여러 가지 형태들을 가질 수 있으므로 실시예들을 도면에 예시하고 본 명세서에서 상세하게 설명하고자 한다. 그러나 이는 본 발명의 개념에 따른 실시예들을 특정한 개시 형태들에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물 또는 대체물을 포함한다.Since the embodiments according to the concept of the present invention can apply various changes and have various forms, the embodiments will be illustrated in the drawings and described in detail in the present specification. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosed forms, and includes all modifications, equivalents, or substitutes included in the spirit and scope of the present invention.

본 명세서에서 사용한 용어는 단지 특정한 실시예를 설명하기 위해 사용된 것으로서, 본 발명을 한정하려는 의도가 아니다. 단수의 표현은 문맥상 명백하게 다르게 뜻하지 않는 한, 복수의 표현을 포함한다. 본 명세서에서, "포함하다" 또는 "가지다" 등의 용어는 본 명세서에 기재된 특징, 숫자, 단계, 동작, 구성 요소, 부분품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성 요소, 부분품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.The terms used in this specification are used only to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprises" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described herein, but one or more other features. It is to be understood that the possibility of addition or presence of elements or numbers, steps, actions, components, parts, or combinations thereof is not preliminarily excluded.

이하, 본 명세서에 첨부된 도면들을 참조하여 본 발명의 실시예들을 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1과 도 2는 본 발명의 실시예에 따른 제품안착지그와 지문인식센서를 접합하는 방법을 설명하는 도면이다. 1 and 2 are views for explaining a method of bonding a product mounting jig and a fingerprint recognition sensor according to an embodiment of the present invention.

도 1과 도 2를 참조하면, 지문인식센서(140)가 안착되는 다수개의 수용홈(110)을 구비하는 제품안착지그(100)를 준비한다(S101). 제품안착지그의 양끝단의 상면에는 ACF필름고정핀(120)이 배치된다. 1 and 2, a product mounting jig 100 having a plurality of receiving grooves 110 in which the fingerprint recognition sensor 140 is mounted is prepared (S101). ACF film fixing pins 120 are disposed on the upper surfaces of both ends of the product mounting jig.

지문인식센서(140)는 다양한 종류의 센서가 적용될 수 있다. 예컨대, 정전용량식, 광학식, 초음파 방식, 열감지식, 비접촉식 방식 등이 적용될 수 있다. 본 명세서에서는 지문인식센서를 정전용량식을 기준으로 설명한다. The fingerprint recognition sensor 140 may be applied to various types of sensors. For example, a capacitive type, an optical type, an ultrasonic method, a thermal sensing type, a non-contact type, and the like may be applied. In this specification, the fingerprint recognition sensor will be described based on the capacitive type.

제품안착지그(100)의 수용홈(110)에 내열테이프(130)를 도포 또는 부착한다(S103). 내열테이프(130)의 도포 두께는 0.2mm 내지 3mm의 범위 내로 형성될 수 있다. The heat-resistant tape 130 is applied or attached to the receiving groove 110 of the product seating jig 100 (S103). The coating thickness of the heat-resistant tape 130 may be formed within a range of 0.2mm to 3mm.

이후에, 제품안착지그(100)의 수용홈(110)에 내열테이프를 이용하여 다수개의 지문인식센서(130)를 접합한다(S105). 내열테이프를 통해 접합된 지문인식센서는 제품안착지그의 상면보다 높게 형성될 수 있다. 즉, 본 발명은 제품안착지그의수용홈 내에 내열테이프를 미리 도포 또는 부착하여 내열테이프를 통해 지문인식센서를 부착함으로써 열전도에 대한 열전도율이 높아 제품 간 편차 없는 지문인식센서 생산이 가능하다.Thereafter, a plurality of fingerprint recognition sensors 130 are bonded to the receiving groove 110 of the product mounting jig 100 using a heat-resistant tape (S105). The fingerprint recognition sensor bonded through the heat-resistant tape may be formed higher than the upper surface of the product mounting jig. That is, in the present invention, by applying or attaching a heat-resistant tape in the receiving groove of the product mounting jig in advance and attaching the fingerprint recognition sensor through the heat-resistant tape, it is possible to produce a fingerprint recognition sensor without deviation between products due to high thermal conductivity for heat conduction.

도 3과 도 4는 본 발명의 실시예에 따른 지문인식센서 패키징 방법을 설명하는 흐름도이다. 3 and 4 are flowcharts illustrating a method of packaging a fingerprint recognition sensor according to an embodiment of the present invention.

도 3과 도 4를 참조하면, 지문인식센서 패키징 방법은 먼저 히터블록지그(200)상에 지문인식센서(140)가 접합된 제품안착지그(100)를 배치한다(S301).Referring to FIGS. 3 and 4, in the method of packaging a fingerprint recognition sensor, a product seating jig 100 to which the fingerprint recognition sensor 140 is bonded is first placed on the heater block jig 200 (S301).

이후에, 히터블록지그(200)에 안착된 제품안착지그(100) 양끝단의 상면에 배치된 ACF고정핀(120)을 이용하여 ACF필름(ACF; Anisotropic conductive film)을 표면 실장한다(S303). ACF필름은 필름형태의 에폭시나 아크릴수지 중에 수 ㎛의 도전볼 입자를 분산시킨 양면접착테이프이고, 지문인식센서와 FPCB 사이에 배치하고 가열, 가압을 해줌으로써 대향전극의 전기적인 접속, 인접전극의 절연 및 전극간 스페이스의 봉지를 한 공정으로 할 수 있는 특수 양면테이프로써 미세한 다수 고밀도회로의 동시 일괄 접속을 가능하게 할 수 있다. 즉, ACF필름을 통해 지문인식센서와 PCB에 연결함에 있어 기존 커넥터 방식이 아닌 본드(ACF)로 결합할 수 있다.Thereafter, an anisotropic conductive film (ACF) is surface-mounted using the ACF fixing pins 120 disposed on the upper surfaces of the product mounting jig 100 mounted on the heater block jig 200 (S303). . ACF film is a double-sided adhesive tape in which conductive ball particles of several µm are dispersed in an epoxy or acrylic resin in the form of a film. It is placed between the fingerprint recognition sensor and the FPCB and heated and pressurized to make electrical connection of the counter electrode and the adjacent electrode. It is a special double-sided tape that can seal insulation and inter-electrode spaces in one process, enabling simultaneous batch connection of multiple fine high-density circuits. In other words, when connecting the fingerprint recognition sensor to the PCB through the ACF film, it can be combined with a bond (ACF) instead of the conventional connector method.

이후에, 지문인식센서(140)와 PCB(300)를 몰딩한다(S305). 이때, PCB는 기존의 PCB뿐 아니라 FPCB(Flexible printed circuit)를 포함한다. 지문인식센서(140)의 상면의 핀과 PCB(300)의 하면에 배치된 핀(310)이 연결된다. 이후에, 실리콘러버(230)가 부착된 히터블록(210)이 히터블록지그(200)와 결합하여 가열 본딩한다(S307). After that, the fingerprint recognition sensor 140 and the PCB 300 are molded (S305). At this time, the PCB includes not only the existing PCB but also a flexible printed circuit (FPCB). The pins on the upper surface of the fingerprint recognition sensor 140 and the pins 310 disposed on the lower surface of the PCB 300 are connected. Thereafter, the heater block 210 to which the silicone rubber 230 is attached is combined with the heater block jig 200 to perform heat bonding (S307).

히터블록지그(200)와 히터블록(210)은 히터케이블(220, 240)를 구비한다. 실리콘러버의 두께는 0.2mm 내지 3mm의 범위내로 형성될 수 있다. 본 발명은 히터블록지그(200)와 히터블록(210)을 통해 상하부에서 열가압을 하고 내열테이프를 사용하여 지문인식센서를 접합함에 따라 열전도율이 높아 제품 간 편차가 없는 효과가 있다. The heater block jig 200 and the heater block 210 are provided with heater cables 220 and 240. The thickness of the silicone rubber may be formed in the range of 0.2mm to 3mm. In the present invention, heat is applied from the upper and lower portions through the heater block jig 200 and the heater block 210 and the fingerprint recognition sensor is bonded using a heat-resistant tape, so that the thermal conductivity is high and there is no variation between products.

도 5와 도 6은 본 발명의 실시예에 따른 제품안착지그와 ACF필름의 패키징 방법을 도시한 도면이다.5 and 6 are diagrams illustrating a product mounting jig and a packaging method of an ACF film according to an embodiment of the present invention.

제품안착지그(100)의 ACF필름고정핀(120)을 이용하여 ACF부착영역(410)을 포함하는 ACF필름(400)이 표면실장되며, ACF필름을 통해 제품안착지그(100)의 지문인식센서와 PCB가 부착될 수 있다.The ACF film 400 including the ACF attachment area 410 is surface mounted using the ACF film fixing pin 120 of the product seating jig 100, and the fingerprint recognition sensor of the product seating jig 100 through the ACF film And PCB can be attached.

고정지그(500)는 수용홈(510)을 포함하며, 제품안착지그(100a)의 양측면에 배치된 돌출부(130a)와 수용홈(510)이 결합하여 제품안착지그 본딩시 고정을 할 수 있다. 제품안착지그(100a)에 대한 본딩 공정이 완료되면, 돌출부(130b)와 수용홈이 결합되도록 수동으로 밀어 제2제품안착지그(100b)의 본딩 공정이 시작될 수 있다. 즉, 다량의 지문인식센서들을 동시에 본딩 공정을 수행할 수 있도록 어레이로 구성함으로써 대량생산이 가능한 효과가 있다.The fixing jig 500 includes a receiving groove 510, and the protrusion 130a and the receiving groove 510 disposed on both sides of the product seating jig 100a are combined to fix the product seating jig during bonding. When the bonding process for the product mounting jig 100a is completed, the bonding process of the second product mounting jig 100b may be started by manually pushing the protrusion 130b and the receiving groove to be coupled. That is, there is an effect that mass production is possible by configuring a large number of fingerprint recognition sensors as an array to perform the bonding process at the same time.

발명의 도면에 도시된 실시예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시 예가 가능하다는 점을 이해할 것이다. 따라서, 본 발명의 진정한 기술적 보호 범위는 첨부된 등록청구범위의 기술적 사상에 의해 정해져야 할 것이다.Although it has been described with reference to the embodiments shown in the drawings of the invention, this is only exemplary, and those of ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the attached registration claims.

10; 지문인식센서 패키지 100; 제품안착지그
120; 제품안착지그 130; 가열테이프
140; 지문인식센서 200; 히터블록지그
210; 히터블록 220, 240; 히터케이블
230; 실리콘 러버 300; PCB10; Fingerprint recognition sensor package 100; Product mounting jig
120; Product seating jig 130; Heating tape
140; Fingerprint recognition sensor 200; Heater block jig
210; Heater block 220, 240; Heater cable
230; Silicone rubber 300; PCB

Claims (6)

ACF 본딩 방식의 지문인식센서의 패키징 방법에 있어서,
지문인식센서(140)가 안착되는 다수개의 수용홈을 구비하는 제품안착지그(100)를 준비하는 단계;
상기 제품안착지그(100)의 수용홈의 하부면 및 양측면 일부영역에 내열테이프(130)를 도포 또는 부착하는 단계; 및
상기 제품안착지그(100)의 수용홈의 지문인식센서를 내열테이프를 이용하여 지문인식센서를 접합하는 단계;
히터블록지그(200)상에 지문인식센서(140)가 접합된 제품안착지그를 배치하는 단계;
상기 제품안착지그(100)의 양끝단의 상면에 배치된 ACF필름고정핀(120)을 이용하여 ACF필름(ACF; Anisotropic conductive film)을 표면 실장하는 단계를 포함하고,
상기 지문인식센서는 상기 제품안착지그의 상면보다 높게 형성되고,
상기 제품안착지그는 제1제품안착지그와 제2제품안착지그를 포함하고, 제1제품안착지그의 양측면에 배치된 돌출부(130a)와, 고정지그의 수용홈(510)이 결합하여 제품안착지그 본딩시 고정이 가능하고, 안착지그(100a)에 대한 본딩 공정이 완료되면, 돌출부(130b)와 수용홈이 결합되어 제2제품안착지그(100b)의 본딩 공정을 수행하는 것을 특징으로 하는 ACF 본딩 방식의 지문인식센서의 패키징 방법.In the packaging method of the fingerprint recognition sensor of the ACF bonding method,
Preparing a product mounting jig 100 having a plurality of receiving grooves in which the fingerprint recognition sensor 140 is mounted;
Applying or attaching a heat-resistant tape 130 to partial areas of the lower surface and both side surfaces of the receiving groove of the product seating jig 100; And
Bonding the fingerprint recognition sensor of the receiving groove of the product mounting jig 100 to the fingerprint recognition sensor using a heat-resistant tape;
Arranging a product mounting jig to which the fingerprint recognition sensor 140 is bonded on the heater block jig 200;
Including the step of surface-mounting an ACF film (ACF; anisotropic conductive film) using the ACF film fixing pins 120 disposed on the upper surface of both ends of the product mounting jig 100,
The fingerprint recognition sensor is formed higher than the upper surface of the product mounting jig,
The product seating jig includes a first product seating jig and a second product seating jig, and the protrusions 130a disposed on both sides of the first product seating jig and the receiving grooves 510 of the fixing jig are combined to provide a product seating jig. ACF bonding, characterized in that fixing is possible during bonding and when the bonding process for the mounting jig 100a is completed, the protrusion 130b and the receiving groove are combined to perform the bonding process of the second product mounting jig 100b Method of packaging fingerprint recognition sensor. 삭제delete 제1항에 있어서,
상기 지문인식센서와 PCB를 몰딩하는 단계;
실리콘러버가 부착된 히터블록이 히터블록지그와 결합하여 가열 본딩하는 단계를 더 포함하는 ACF 본딩 방식의 지문인식센서의 패키징 방법.The method of claim 1,
Molding the fingerprint recognition sensor and the PCB;
A method for packaging a fingerprint recognition sensor of an ACF bonding method, further comprising: heating the heater block to which the silicone rubber is attached to the heater block jig and performing heat bonding. 제1항에 있어서,
상기 내열테이프의 두께는 0.2mm 내지 3mm의 범위인 것을 특징으로 하는 ACF 본딩 방식의 지문인식센서의 패키징 방법.The method of claim 1,
The packaging method of the fingerprint recognition sensor of the ACF bonding method, characterized in that the thickness of the heat-resistant tape is in the range of 0.2mm to 3mm. ACF 본딩 방식의 지문인식센서의 패키징 장치에 있어서,
지문인식센서가 안착되는 다수개의 수용홈을 구비하는 제품안착지그;
상기 지문인식센서가 접합된 제품안착지그를 안착하는 히터블록지그; 및
실리콘러버가 부착되고 히터블록지그와 결합하여 가열 본딩하는 히터블록을 포함하고,
상기 지문인식센서는 상기 제품안착지그의 상면보다 높게 형성되고,
상기 제품안착지그는 제1제품안착지그와 제2제품안착지그를 포함하고, 제1제품안착지그의 양측면에 배치된 돌출부(130a)와, 고정지그의 수용홈(510)이 결합하여 제품안착지그 본딩시 고정이 가능하고, 안착지그(100a)에 대한 본딩 공정이 완료되면, 돌출부(130b)와 수용홈이 결합되어 제2제품안착지그(100b)의 본딩 공정을 수행하는 것을 특징으로 하는 ACF 본딩 방식의 지문인식센서의 패키징 장치.In the packaging device of the fingerprint recognition sensor of the ACF bonding method,
Product mounting jig having a plurality of receiving grooves in which the fingerprint recognition sensor is mounted;
A heater block jig for mounting a product mounting jig to which the fingerprint recognition sensor is bonded; And
A silicone rubber is attached and includes a heater block for heat bonding by bonding with a heater block jig,
The fingerprint recognition sensor is formed higher than the upper surface of the product mounting jig,
The product seating jig includes a first product seating jig and a second product seating jig, and the protrusions 130a disposed on both sides of the first product seating jig and the receiving grooves 510 of the fixing jig are combined to provide a product seating jig. ACF bonding, characterized in that fixing is possible during bonding, and when the bonding process for the mounting jig 100a is completed, the protrusion 130b and the receiving groove are combined to perform the bonding process of the second product mounting jig 100b The packaging device of the fingerprint recognition sensor. 제5항에 있어서,
상기 제품안착지그의 양측면에 배치된 돌출부와 결합하는 수용홈을 포함하는 고정지그를 더 포함하는 ACF 본딩 방식의 지문인식센서의 패키징 장치.
The method of claim 5,
An ACF bonding type fingerprint recognition sensor packaging device further comprising a fixing jig including a receiving groove coupled with protrusions disposed on both sides of the product mounting jig.
KR1020200030420A 2020-03-11 2020-03-11 ACF bonding method fingerprint device packaging method and apparatus KR102183774B1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010074571A (en) * 2001-05-08 2001-08-04 김성규 Printed circuit board fixing apparatus
KR20130109826A (en) * 2012-03-28 2013-10-08 주식회사 이엔지코리아 Pannel moving device for touch screen pannel producing apparatus
JP2015084388A (en) * 2013-10-25 2015-04-30 シャープ株式会社 Mounted component housing tool, multi-component mounting device, and multi-component mounting method
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