CN219716147U

CN219716147U - Capacitive fingerprint module and electronic equipment

Info

Publication number: CN219716147U
Application number: CN202320201769.4U
Authority: CN
Inventors: 雷红哲; 王海生; 孙建成
Original assignee: TIANJIN JIHAO TECHNOLOGY CO LTD
Current assignee: TIANJIN JIHAO TECHNOLOGY CO LTD
Priority date: 2023-01-31
Filing date: 2023-01-31
Publication date: 2023-09-19
Anticipated expiration: 2033-01-31

Abstract

The utility model provides a capacitor fingerprint module and electronic equipment, which relate to the technical field of biological identification, and comprise a circuit Board and a capacitor fingerprint bare chip, wherein the capacitor fingerprint bare chip is directly adhered to the circuit Board, so that the packaging link of the capacitor fingerprint bare chip is omitted, when the signal connection between the capacitor fingerprint bare chip and the circuit Board is realized, the capacitor fingerprint bare chip and the circuit Board can be electrically connected through a bonding wire, in other words, the assembly of the capacitor fingerprint bare chip and the circuit Board is realized through chip-on-Board (COB), therefore, the traditional packaging process of the bare chip, such as the Grid Array packaging (LGA) of the bare chip, is omitted, the assembly step is simplified, the assembly difficulty is reduced, and meanwhile, the cost is also effectively reduced.

Description

Capacitive fingerprint module and electronic equipment

Technical Field

The utility model relates to the technical field of biological recognition, in particular to a capacitive fingerprint module and electronic equipment.

Background

With the development of portable terminal devices typified by cellular phones, the application of biometric technology is becoming more widespread and deep. The capacitive fingerprint recognition scheme is used as one of the biological recognition technologies, and can be used for fingerprint recognition of users so as to perform identity verification, so that the capacitive fingerprint recognition scheme is widely applied.

In the prior art, a capacitor fingerprint module is generally packaged by mounting a sensing chip packaged by a contact array on a circuit board, and the packaging structure has the problems of complex packaging steps and high packaging cost.

Disclosure of Invention

The utility model aims to overcome the defects in the prior art and provide a capacitor fingerprint module and electronic equipment, which can improve the assembly difficulty of the capacitor fingerprint module and reduce the cost.

In order to achieve the above purpose, the technical scheme adopted by the embodiment of the utility model is as follows:

in one aspect of the embodiment of the utility model, a capacitor fingerprint module is provided, which comprises a circuit board and a capacitor fingerprint bare chip, wherein the capacitor fingerprint bare chip is adhered to the circuit board, and the capacitor fingerprint bare chip is electrically connected with the circuit board through a binding wire.

Optionally, the capacitor fingerprint module further comprises an assembly part arranged on the circuit board, the assembly part is matched with the circuit board to form a containing cavity, and the capacitor fingerprint bare chip is located in the containing cavity.

Optionally, the assembly includes a cover plate spaced from the circuit board to form a receiving cavity, the cover plate being bonded to a side of the capacitive fingerprint die facing away from the circuit board.

Optionally, the bonding area of the cover plate and the capacitor fingerprint bare chip at least covers the effective area of the bare chip.

Optionally, the cover plate is adhered to the capacitor fingerprint bare chip through conductive colloid.

Optionally, the conductive colloid is a film colloid, and the film colloid is positioned between the cover plate and the capacitor fingerprint bare chip; or, the conductive colloid is solidified glue, and the solidified glue is filled in the accommodating cavity and is used for coating the capacitor fingerprint bare chip and the binding wire.

Optionally, the capacitor fingerprint bare chip is adhered to the circuit board through an insulating colloid.

Optionally, the assembly further includes a side branch disposed on the circuit board, and the side branch is located at a peripheral side of the capacitor fingerprint bare chip.

Optionally, the side branch is supported between the cover plate and the circuit board.

Optionally, a concave clamping groove is formed in one side, close to the capacitor fingerprint bare chip, of the side support, and the periphery of the cover plate is fixed to the clamping groove.

Optionally, the cover plate is bonded with the slot wall of the slot.

Optionally, the side support is located at a peripheral side of the cover plate, and the side support abuts against the peripheral side of the cover plate.

Optionally, the capacitor fingerprint module further includes a support member, and the support member is disposed on a side of the circuit board away from the capacitor fingerprint bare chip.

Optionally, the circuit board includes first circuit board and the second circuit board that the interval set up and electricity is connected, and the bare chip of electric capacity fingerprint bonds in first circuit board, and support piece supports between first circuit board and second circuit board.

In another aspect of the embodiments of the present utility model, an electronic device is provided, including any one of the capacitive fingerprint modules described above.

The beneficial effects of the utility model include:

the utility model provides a capacitor fingerprint module and electronic equipment, which comprises a circuit Board and a capacitor fingerprint bare chip, wherein the capacitor fingerprint bare chip is directly adhered to the circuit Board, so that the packaging link of the capacitor fingerprint bare chip is omitted, when the signal connection between the capacitor fingerprint bare chip and the circuit Board is realized, the capacitor fingerprint bare chip and the circuit Board can be electrically connected through a bonding wire, in other words, the capacitor fingerprint module and the circuit Board are assembled by adopting Chip On Board (COB), therefore, the traditional packaging process of the bare chip, such as the Grid Array packaging (LGA) of the bare chip, is omitted, the assembly step is simplified, the assembly difficulty is reduced, and meanwhile, the cost is effectively reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model;

FIG. 2 is a second schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model;

FIG. 3 is a third schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model;

FIG. 5 is a schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model;

FIG. 6 is a schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model;

FIG. 7 is a schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model;

FIG. 8 is a schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model;

fig. 9 is a schematic diagram of a capacitive fingerprint module according to an embodiment of the present utility model.

Icon: 110-a circuit board; a 111-connector; 112-a first circuit board; 113-a third circuit board; 114-a second circuit board; 120-a capacitor fingerprint bare chip; 130-insulating colloid; 140-film colloid; 150-binding lines; 160-cover plate; 170-side branch; 171-a clamping groove; 180-reinforcing plates; 190-colloid; 210-a support; 220-curing glue; 230-fitting; 231-receiving cavity.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. It should be noted that, under the condition of no conflict, the features of the embodiments of the present utility model may be combined with each other, and the combined embodiments still fall within the protection scope of the present utility model.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the product of the application, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," "third," and the like are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In an aspect of the embodiment of the present utility model, as shown in fig. 1 to 9, a capacitive fingerprint module is provided, which includes a circuit Board 110 and a capacitive fingerprint bare chip 120 (the capacitive fingerprint bare chip means a chip that is not packaged), where the capacitive fingerprint bare chip 120 is directly bonded to the circuit Board 110, so that a packaging link of the capacitive fingerprint bare chip 120 is omitted, and when a signal connection between the capacitive fingerprint bare chip 120 and the circuit Board 110 is implemented, the capacitive fingerprint module can be implemented through a wire bonding process, that is, the capacitive fingerprint bare chip 120 is electrically connected to the circuit Board 110 through a bonding (bonding) wire 150, in other words, the assembly of the capacitive fingerprint bare chip 120 and the circuit Board 110 is implemented through Chip On Board (COB), so that a conventional packaging process of first packaging the bare chip, for example, a Land Grid Array packaging (LGA) is omitted, so that an assembly step is simplified, and meanwhile, a cost can be effectively reduced.

In actual use, the capacitor fingerprint bare chip 120 can collect fingerprint information of a user by utilizing a corresponding relation between capacitance change and concave-convex positions of the fingerprint of the user, and the collected fingerprint information can realize identity verification of the user through links such as data analysis and processing.

Alternatively, the bonding wire 150 may be a variety of metal wires such as gold wire, silver wire, copper wire, etc.

In order to enable the capacitor fingerprint bare chip 120 packaged by the COB to have better stability and reliability in use, as shown in fig. 1 to 9, a fitting 230 may be further provided, and the fitting 230 cooperates with the circuit board 110 to form a receiving cavity 231 to protect the capacitor fingerprint bare chip 120 located in the receiving cavity 231, thereby enabling the capacitor fingerprint bare chip 120 to have better impact resistance. For example, as shown in fig. 1 to 9, the assembly 230 is located at the periphery of the bare capacitive fingerprint chip 120, so that the bare capacitive fingerprint chip 120 is accommodated in the accommodating cavity 231, in practical use, a pressing portion in contact with a user may be provided on the assembly 230, so that the user may contact with the pressing portion, and form a capacitance change with the bare capacitive fingerprint chip 120 through the pressing portion, so that the bare capacitive fingerprint chip 120 is convenient to collect fingerprint information of the user, meanwhile, direct contact between the user and the bare capacitive fingerprint chip 120 is avoided, and reliability of the bare capacitive fingerprint chip 120 is improved.

Alternatively, as shown in fig. 1 to 9, the assembly 230 includes a cover 160, where the cover 160 is opposite to the circuit board 110 and is spaced by a predetermined distance, so that a receiving cavity 231 can be formed between the cover 160 and the circuit board 110, the bare capacitor fingerprint chip 120 is located between the cover 160 and the circuit board 110, and the cover 160 is adhered to a side of the bare capacitor fingerprint chip 120 facing away from the circuit board 110, that is, a bottom of the bare capacitor fingerprint chip 120 is adhered to the circuit board 110, and a top of the bare capacitor fingerprint chip 120 is adhered to the cover 160, so that the cover 160 can replace the bare capacitor fingerprint chip 120 to directly contact with a user's finger, so that a certain distance is formed between the user's finger and the bare capacitor fingerprint chip 120, and different capacitance values are generated, thereby facilitating the collection of fingerprint information by the bare capacitor fingerprint chip 120.

In order to facilitate the capacitive fingerprint bare chip 120 to sense the capacitive change generated when the user touches the cover plate 160, the bonding area between the cover plate 160 and the capacitive fingerprint bare chip 120 may cover at least the effective area (i.e. the fingerprint signal detection area) of the capacitive fingerprint bare chip 120, in other words, the effective area of the capacitive fingerprint bare chip 120 is well bonded with the cover plate 160.

The portion of the cover 160 corresponding to the effective area is used as a pressing portion of the assembly 230, and a surface of the pressing portion facing away from the capacitor fingerprint bare chip 120 may be used to contact with a user, so as to perform fingerprint acquisition.

In order to facilitate the capacitor fingerprint bare chip 120 to accurately sense the capacitance change generated when the user touches the cover plate 160, the cover plate 160 may be bonded to the capacitor fingerprint bare chip 120 through conductive adhesive, i.e., the effective areas of the capacitor fingerprint bare chip 120 may be bonded to the cover plate 160 through conductive adhesive.

Alternatively, as shown in fig. 1 to 6, in order to make the glue distribution smoother when the cover plate 160 is adhered to the bare capacitor fingerprint chip 120, so that the bare capacitor fingerprint chip 120 can accurately sense the capacitance change generated when the user touches the cover plate 160, the conductive glue between the cover plate 160 and the bare capacitor fingerprint chip 120 can be the film glue 140, and a smoother adhesion surface can be provided through the film glue 140, so that the adhesion between the cover plate 160 and the bare capacitor fingerprint chip 120 is smooth and the glue is distributed more uniformly in the adhesion area. For example, the Film colloid 140 may be a Die Attach Film (DAF). For example, in one embodiment, the film gel 140 may cover the active area of the capacitive fingerprint die 120; in another embodiment, as shown in fig. 1 to 6, the film colloid 140 may further cover the connection end of the binding line 150 and the capacitor fingerprint bare chip 120 outside the effective area of the capacitor fingerprint bare chip 120, that is, the film colloid 140 may partially cover the binding line 150, thereby increasing the stability and reliability of the connection between the binding line 150 and the connection end of the capacitor fingerprint bare chip 120.

Optionally, as shown in fig. 7 to fig. 9, in order to better protect the capacitor fingerprint bare chip 120, the conductive adhesive may be the curing adhesive 220, so before the curing adhesive 220 is cured, because it has a certain fluidity, the curing adhesive 220 may be filled in the accommodating cavity 231, and then the curing adhesive 220 that encapsulates the capacitor fingerprint bare chip 120 and the bonding wire 150 is formed by curing, so that the capacitor fingerprint bare chip 120 and the bonding wire 150 can be well protected by using the curing adhesive 220 in a sealing and encapsulating manner, and corrosion of water vapor and dust is avoided.

Alternatively, as shown in fig. 1 to 9, when the bare capacitor fingerprint chip 120 is bonded to the circuit board 110, the bare capacitor fingerprint chip 120 may be bonded to the circuit board 110 through the insulating gel 130, and the insulating gel 130 may also be a film gel 140 with insulating property, such as insulating DAF gel, so that a relatively flat bonding surface can be provided when the bare capacitor fingerprint chip 120 is bonded to the circuit board 110, so as to facilitate reliable bonding between the bare capacitor fingerprint chip 120 and the circuit board 110.

Optionally, as shown in fig. 1 to 9, in order to better protect the bare capacitive fingerprint chip 120, the assembly 230 further includes a side support 170 disposed on the circuit board 110, where the side support 170 may be fixed around the bare capacitive fingerprint chip 120 by using an adhesive manner, so that the bare capacitive fingerprint chip 120 is further enclosed by the mating cover 160 and the circuit board 110, so that the bare capacitive fingerprint chip 120 can be protected from the side by the side support 170, and the cover 160 can provide protection to the bare capacitive fingerprint chip 120 from the front.

Optionally, the side support 170 may be a plurality of limiting posts disposed around the periphery of the capacitor fingerprint bare chip 120, or may be a cylinder disposed around the periphery of the capacitor fingerprint bare chip 120, the opposite ends of the cylinder are provided with through openings, the opening at the bottom of the cylinder accommodates the capacitor fingerprint bare chip 120 and is fixedly adhered to the circuit board 110, and the opening at the top of the cylinder is adapted to the cover plate 160.

In order to enable the cover plate 160 to provide better protection capability, the side support 170 may be matched with the cover plate 160, so as to limit or support the cover plate 160, prevent the cover plate 160 from larger displacement generated after being impacted from acting on the capacitor fingerprint bare chip 120, and improve the impact resistance capability of the capacitor fingerprint bare chip 120.

In one embodiment, as shown in fig. 1, the side support 170 may be located at a peripheral side of the cover 160, that is, the side support 170 may limit the peripheral side wall of the cover 160 in a plane direction of the cover 160, thereby reducing displacement of the cover 160 in the plane direction of the cover 160, such as lateral displacement in fig. 1, by the side support 170 after the cover 160 is impacted.

In one embodiment, as shown in fig. 2, the side support 170 may be supported between the cover 160 and the circuit board 110, that is, the bottom end of the side support 170 is fixedly bonded to the circuit board 110, and the top end of the side support 170 abuts against the periphery of the bottom wall of the cover 160, so that the side support 170 is used to limit the cover 160 in a direction perpendicular to the plane of the cover 160, and after the cover 160 is impacted, the vertical support of the side support 170 can reduce the displacement of the cover 160 in the direction perpendicular to the plane of the cover 160, such as the vertical displacement in fig. 1. To further improve stability, glue may be provided between the top ends of the side legs 170 and the bottom wall of the cover 160 for bonding.

In one embodiment, as shown in fig. 3, the side support 170 may have a concave clamping groove 171 near one side of the capacitor fingerprint bare chip 120, and the cover 160 is laterally and vertically limited by using the bottom wall and the side wall of the clamping groove 171 in a manner that the clamping groove 171 is fixed (may be inserted, overlapped, etc.) with the peripheral side of the cover 160, for example, in fig. 3, the side support 170 is vertically supported by the cover 160 through the bottom wall of the clamping groove 171, and limits the peripheral side wall of the cover 160 in the lateral direction through the side wall of the clamping groove 171, so that the side support 170 can simultaneously generate lateral and vertical limits on the cover 160, and after the cover 160 is impacted, the lateral and vertical limits on the cover 160 can be added through the lateral and vertical limits on the side support 170, so as to reduce the displacement of the cover 160 in the lateral and vertical directions.

In one embodiment, when the side support 170 and the cover 160 form a lateral and vertical bi-directional limit through the concave clamping groove 171, as shown in fig. 4, in order to further improve stability, a glue 190 may be further disposed between the bottom wall of the clamping groove 171 of the side support 170 and the bottom wall of the cover 160 for bonding.

In one embodiment, as shown in fig. 7 to 9, when the conductive glue is the cured glue 220, the cured glue 220 may be filled in the accommodating cavity 231, the cured glue 220 is wrapped around the periphery and the top surface of the capacitor fingerprint bare chip 120, and further a part of the cured glue 220 may be further provided in the card slot 171, so that the adhesion between the cover plate 160 and the card slot 171 and the adhesion between the cover plate 160 and the surface of the capacitor fingerprint bare chip 120 can be simultaneously achieved by using the cured glue 220. Furthermore, the coating of the capacitor fingerprint bare chip 120 and the bonding wires 150 by the cured glue 220 can provide better stability.

Optionally, considering that the capacitive fingerprint module has multiple application scenarios, the thickness requirements for the capacitive fingerprint module are different according to the application scenarios, and the thickness of the capacitive fingerprint module generally refers to the thickness perpendicular to the direction of the capacitive fingerprint bare chip 120, i.e. the vertical thickness in fig. 1 to 9.

When the capacitor fingerprint module is used as the side fingerprint module, if the capacitor fingerprint module has a thinner thickness, the schemes corresponding to fig. 1 to 4 and 7 can be correspondingly adopted.

On this basis, if there is a thicker demand, the schemes shown in fig. 5, 6, 8 and 9 can be adopted, and when the thickness demand is only the total thickness of the whole capacitive fingerprint module, the scheme shown in fig. 5 or 8 can be adopted, specifically: the capacitive fingerprint module further includes a supporting member 210, when the circuit board 110 has only one layer, the supporting member 210 is disposed on a side of the circuit board 110 facing away from the capacitive fingerprint bare chip 120, thereby increasing the overall thickness of the capacitive fingerprint module by using the thickness of the supporting member 210.

When the thickness requirement is the thickness from the circuit board 110 to the cover plate 160, the scheme shown in fig. 6 or fig. 9 may be adopted, and in particular: as shown in fig. 6 or 9, the circuit board 110 includes a first circuit board 112 and a second circuit board 114 opposite to each other and spaced apart from each other, and the first circuit board 112 and the second circuit board 114 are electrically connected, so that communication between the two is achieved, the assembly 230 and the bare capacitor fingerprint chip 120 are adhered to a side of the first circuit board 112 facing away from the second circuit board 114, where the thickness requirement refers to an overall thickness from the second circuit board 114 to a top end (e.g., the cover 160), the capacitor fingerprint module further includes a supporting member 210, and the supporting member 210 is supported between the first circuit board 112 and the second circuit board 114, so that the required thickness is increased by using the thickness of the supporting member 210. For example: the circuit board 110 further includes a third circuit board 113, and the third circuit board 113 connects the first circuit board 112 and the second circuit board 114 at the same side of the first circuit board 112 and the second circuit board 114, respectively, and in particular, the circuit board 110 may be a flexible circuit board 110, and is bent, thereby forming the first circuit board 112, the second circuit board 114, and the third circuit board 113 shown in fig. 6 and 9.

Alternatively, the material of the supporting member 210 may be a plurality of materials such as stainless steel, aluminum alloy, hard plastic, resin, etc.

Optionally, as shown in fig. 1 to 9, a connector 111 is further disposed on the circuit board 110, and the connector 111 may be electrically connected to the bare capacitive fingerprint chip 120 through the circuit board 110 and the bonding wire 150, so that when the capacitive fingerprint module is connected to an external device through the connector 111, electrical connection between the external device and the bare capacitive fingerprint chip 120 may be achieved.

Optionally, a stiffener 180 is further disposed on the circuit board 110, as shown in fig. 1 to 4 and 7, where the stiffener 180 may be adhered to a side of the circuit board 110 facing away from the capacitor fingerprint bare chip 120, or, as shown in fig. 5 and 8, the stiffener 180 may be adhered to a side of the support 210 facing away from the capacitor fingerprint bare chip 120, or, as shown in fig. 6 and 9, the stiffener 180 may be adhered to a side of the second circuit board 114 facing away from the capacitor fingerprint bare chip 120, thereby further improving the strength of the region of the capacitor fingerprint bare chip 120 through the stiffener.

The electronic device may have a capacitive fingerprint module, in which a fingerprint identification method may be preset, where the fingerprint identification method generally includes steps of fingerprint image acquisition, preprocessing, feature extraction, feature matching, and the like. Some or all of the above steps may be implemented by conventional computer vision (ComputerVision, CV) algorithms, or by artificial intelligence (Artificial Intelligence, AI) based deep learning algorithms. The fingerprint identification technology can be applied to portable or mobile terminals such as smart phones, tablet computers and game devices, and other electronic devices such as intelligent door locks, automobiles and bank automatic teller machines, and is used for fingerprint unlocking, fingerprint payment, fingerprint attendance checking, identity authentication and the like.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The capacitor fingerprint module is characterized by comprising a circuit board and a capacitor fingerprint bare chip, wherein the capacitor fingerprint bare chip is adhered to the circuit board, and the capacitor fingerprint bare chip is electrically connected with the circuit board through a binding wire.

2. The capacitive fingerprint module of claim 1, further comprising a fitting disposed on the circuit board, the fitting mating with the circuit board to form a receiving cavity, the capacitive fingerprint die being located within the receiving cavity.

3. The capacitive fingerprint module of claim 2, wherein the fitting includes a cover plate spaced from the circuit board to form the receiving cavity, the cover plate being bonded to a side of the capacitive fingerprint die facing away from the circuit board.

4. The capacitive fingerprint module of claim 3, wherein an adhesive area of the cover plate and the die covers at least an active area of the capacitive fingerprint die.

5. The capacitive fingerprint module of claim 3, wherein the cover plate is bonded to the capacitive fingerprint die by a conductive gel.

6. The capacitive fingerprint module of claim 5, wherein the conductive gel is a film gel positioned between the cover plate and the capacitive fingerprint bare chip;

or, the conductive colloid is curing glue, and the curing glue is filled in the accommodating cavity and is used for coating the capacitor fingerprint bare chip and the binding line.

7. The capacitive fingerprint module of any one of claims 1-6, wherein the capacitive fingerprint bare chip is bonded to the circuit board by an insulating gel.

8. The capacitive fingerprint module of any one of claims 3-6, wherein the fitting further comprises a side branch disposed on the circuit board, the side branch being located on a peripheral side of the capacitive fingerprint die.

9. The capacitive fingerprint module of claim 8, wherein the side branch is supported between the cover plate and the circuit board.

10. The capacitive fingerprint module of claim 9, wherein a side of the side branch adjacent to the capacitive fingerprint bare chip has a concave clamping groove, and a peripheral side of the cover plate is fixed to the clamping groove.

11. The capacitive fingerprint module of claim 10, wherein the cover plate is bonded to a slot wall of the slot.

12. The capacitive fingerprint module of claim 8, wherein the side branch is located on a peripheral side of the cover plate, and the side branch abuts the peripheral side of the cover plate.

13. The capacitive fingerprint module of any one of claims 3-6, further comprising a support disposed on a side of the circuit board facing away from the capacitive fingerprint die.

14. The capacitive fingerprint module of claim 13, wherein the circuit board includes a first circuit board and a second circuit board disposed in spaced apart electrical connection, the capacitive fingerprint die being bonded to the first circuit board, the support being supported between the first circuit board and the second circuit board.

15. An electronic device comprising a capacitive fingerprint module according to any one of claims 1 to 14.