CN220357617U - Fingerprint sensing chip's encapsulation apron, fingerprint chip - Google Patents
Fingerprint sensing chip's encapsulation apron, fingerprint chip Download PDFInfo
- Publication number
- CN220357617U CN220357617U CN202321843372.1U CN202321843372U CN220357617U CN 220357617 U CN220357617 U CN 220357617U CN 202321843372 U CN202321843372 U CN 202321843372U CN 220357617 U CN220357617 U CN 220357617U
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- Prior art keywords
- chip
- groove
- cover plate
- fingerprint
- package cover
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- 238000005538 encapsulation Methods 0.000 title description 5
- 238000004806 packaging method and process Methods 0.000 claims abstract description 33
- 230000006698 induction Effects 0.000 claims abstract description 30
- 239000003292 glue Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920002530 polyetherether ketone Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 description 5
- 239000010980 sapphire Substances 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Abstract
The utility model relates to the technical field of fingerprint sensing chips, in particular to a packaging cover plate of a fingerprint sensing chip and the fingerprint chip, wherein the packaging cover plate comprises a cover plate body, the cover plate body is provided with a first surface and a second surface which are arranged back to back and side surfaces surrounding the first surface and the second surface, the cover plate body is provided with a first groove and a second groove on the first surface, and a third groove which is communicated with the first surface and the second surface is formed on the side surfaces, wherein the second groove is communicated with the third groove; the IC chip is arranged in the first groove, and the FPC is arranged in the second groove and folded to the second surface along the third groove. The packaging cover plate has low cost and can effectively protect the fingerprint chip of which the induction chip and the IC chip are separated.
Description
Technical Field
The utility model relates to the technical field of fingerprint chips, in particular to a packaging cover plate of a fingerprint sensing chip and the fingerprint chip.
Background
Fingerprint sensing technology is widely used in modern life, such as unlocking mobile phones, identity verification and the like. The existing encapsulation cover plate of the fingerprint sensing chip is a shell for protecting and encapsulating the fingerprint sensing chip, and has the characteristics of high strength, wear resistance, corrosion resistance and the like so as to protect the chip from the influence of external environment. Meanwhile, the packaging cover plate is required to have good heat conduction performance so as to ensure the stability and reliability of the chip in the working process.
As shown in fig. 1, the sensing chip and the IC chip of the existing fingerprint chip 13 are in an integrated structure, a sapphire cover plate 11 is arranged above the fingerprint chip 13 for protecting the fingerprint chip 13, and the sapphire cover plate 11 is in direct contact with a finger. The gap is reserved between the fingerprint chip 13 and the sapphire cover plate 11, so that the acquired fingerprint signals are attenuated, the sensitivity is reduced, and the identification efficiency is reduced. In addition, the sapphire cover plate is used as a protective cover plate of the fingerprint chip, and is high in price. More importantly, the existing sapphire cover plate is of a planar structure, and a fingerprint chip with an induction chip and an IC chip separated cannot be protected.
Disclosure of Invention
The utility model aims to solve the technical problem of providing the packaging cover plate of the fingerprint sensing chip, which has low cost and can effectively protect the fingerprint chip with the sensing chip and the IC chip separated.
The utility model aims to solve the technical problems of providing a fingerprint chip which is low in cost, and can ensure that the acquired fingerprint signal is strong and high in sensitivity.
In order to solve the technical problems, in a first aspect, the utility model provides a packaging cover plate of a fingerprint sensing chip, which comprises a cover plate body, wherein the cover plate body is provided with a first surface, a second surface and side surfaces surrounding the first surface and the second surface, the first surface is provided with a first groove and a second groove, the side surfaces are provided with a third groove communicated with the first surface and the second surface, and the second groove is communicated with the third groove;
the IC chip is arranged in the first groove, and the FPC is arranged in the second groove and folded to the second surface along the third groove.
As an improvement of the above-mentioned scheme, the length of the first groove is longer than the length of the IC chip, the width of the first groove is longer than the width of the IC chip, and the depth of the first groove is longer than the height of the IC chip.
As an improvement of the scheme, the depth of the first groove is 10-50 μm larger than the height of the IC chip;
and/or the width of the first groove is 10-50 μm larger than the width of the IC chip.
As an improvement of the scheme, the depth of the first groove is 20-40 μm larger than the height of the IC chip;
and/or the width of the first groove is 20-40 μm larger than the width of the IC chip.
As an improvement of the above scheme, the cover plate body is provided with a plurality of reinforcing ribs on the second surface.
As an improvement of the scheme, the reinforcing ribs are arranged according to a preset pattern to form a plurality of accommodating cavities for accommodating electronic devices on the PCB.
As an improvement of the above scheme, the cover plate body is provided with a support column protruding towards the second surface along the side surface, and the support column is used for abutting against the PCB board.
As an improvement of the scheme, the material of the packaging cover plate is selected from one of polyether ether ketone, polytetrafluoroethylene, polyimide, polyphenylene sulfide and polysulfone.
In a second aspect, the utility model further provides a fingerprint chip, which comprises an induction chip, an IC chip and the packaging cover plate, wherein the IC chip is fixed on a non-contact surface of the induction chip, and the packaging cover plate covers the non-contact surface of the induction chip.
As an improvement of the scheme, sealing glue is filled between the non-contact surface of the induction chip and the first surface of the packaging cover plate.
The implementation of the utility model has the following beneficial effects:
in addition, the packaging cover plate provided by the utility model is provided with the third groove communicated with the second groove on the side surface, so that the FPC can be folded to the other surface of the packaging cover plate, and the overall structure rationality and packaging efficiency of the fingerprint chip are effectively improved. In addition, the packaging cover plate does not need to be contacted with fingers, so that materials with low price can be selected, and the cost is effectively reduced.
Drawings
FIG. 1 is a block diagram of a prior art fingerprint identification module;
FIG. 2 is a schematic perspective view of a first angle of a package cover according to the present utility model;
FIG. 3 is a schematic perspective view of a second angle of the package cover of the present utility model;
FIG. 4 is a schematic diagram of a fingerprint chip according to the present utility model;
fig. 5 is a schematic diagram of the fingerprint chip of fig. 4 mounted with a PCB board and FPC.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings, for the purpose of making the objects, technical solutions and advantages of the present utility model more apparent. It is only stated that the terms of orientation such as up, down, left, right, front, back, inner, outer, etc. used in this document or the imminent present utility model, are used only with reference to the drawings of the present utility model, and are not meant to be limiting in any way.
Referring to fig. 2 and 3, the utility model discloses a packaging cover plate of a fingerprint sensing chip, which comprises a cover plate body 1, wherein the cover plate body 1 is provided with a first surface 11, a second surface 12 and side surfaces 13 surrounding the first surface 11 and the second surface 12, the first surface 11 of the cover plate body 1 is provided with a first groove 2 and a second groove 3, the side surfaces 13 are provided with a third groove 4 communicated with the first surface 11 and the second surface 12, and the second groove 3 is communicated with the third groove 4; the IC chip is disposed in the first recess 2, and the FPC is disposed in the second recess 3 and folded over along the third recess 4 to the second surface 12.
The packaging cover plate is used for packaging fingerprint chips of a sensor off-chip structure, wherein the sensor off-chip structure is formed by separately designing and producing an induction chip and an IC chip in the fingerprint chips, the IC chip is fixed on the induction chip through a binding process and is in conductive connection with the induction chip, and the IC chip has obvious difference in structure with a silicon-based fingerprint chip of the existing sensor on-chip structure. The packaging cover plate is covered on the non-contact surface provided with the induction chip, not only covers the fingerprint identification array on the non-contact surface of the induction chip, but also covers the IC chip bound on the non-contact surface of the induction chip, wherein the first groove 2 is used for accommodating the IC chip, and the IC chip is electrically connected with the PCB board, and the PCB board is arranged on the second surface 12 of the packaging cover plate, so that the IC chip and the PCB board are electrically connected through the FPC. For this purpose, the utility model accommodates the FPC by providing a second recess 3 in the first surface 11 of the cover body 1 and a third recess 4 in communication with the second recess 3 in the side 13 of the cover body 1 so that the FPC is folded over to the second surface 12 of the package cover.
In order to prevent moisture, dust, etc. from entering the induction chip and the IC chip, the encapsulation glue is filled between the non-contact surface of the induction chip and the first surface 11 of the cover plate body 1, so that the cover plate body 1 is sealed and fixed on the non-contact surface of the induction chip.
In order to reserve a proper space for filling packaging glue, the sealing performance between the IC chip and the packaging cover plate is improved, wherein the length of the first groove 2 is larger than that of the IC chip, the width of the first groove 2 is larger than that of the IC chip, and the depth of the first groove 2 is larger than that of the IC chip.
It is found that when the depth of the first groove 2 is 10-50 μm larger than the height of the IC chip and the width of the first groove 2 is 10-50 μm larger than the width of the IC chip, the sealing performance between the IC chip and the package cover plate can be improved, and the overall volume of the package cover plate can be reduced to the greatest extent. Preferably, the depth of the first groove 2 is 20 to 40 μm larger than the height of the IC chip, and the width of the first groove 2 is 20 to 40 μm larger than the width of the IC chip.
It should be noted that, the packaging cover plate of the present utility model is not only used for packaging the sensing chip and the IC chip, but also can be used as a supporting substrate of the sensing chip to support the sensing chip. The thickness of the induction chip is thinner, so that the identification sensitivity is higher, and the packaging cover plate is covered on the non-contact surface of the induction chip, so that the identification sensitivity of the induction chip is not influenced, the induction chip is supported, and the reliability of the induction chip is improved.
Preferably, the cover body 1 is provided with several reinforcing ribs 5 on the second surface 12. The structure can further strengthen the overall strength of the packaging cover plate, and in addition, the reinforcing ribs 5 can be used for accommodating electronic devices on the PCB if being arranged into a plurality of accommodating cavities 6 according to preset patterns, so that the overall volume of the fingerprint module is further reduced.
Preferably, the cover plate body 1 is provided with the support column 7 protruding towards the second surface 12 along the side surface 13, when the finger presses on the contact surface of the sensing chip, the pressing force of the finger is transmitted to the packaging cover plate through the sensing chip, and the packaging cover plate can be abutted to the PCB through the support column 7, so that the reliability of the sensing chip is further improved.
After the packaging cover plate is covered on the induction chip, the packaging cover plate and the induction chip are required to be put into thinning liquid together for thinning the induction chip, and in order to protect a circuit structure and an IC chip on a non-contact surface of the induction chip, the packaging cover plate is required to be made of materials resistant to corrosion of the thinning liquid. Preferably, the material of the encapsulation cover plate is selected from one of polyetheretherketone, polytetrafluoroethylene, polyimide, polyphenylene sulfide and polysulfone.
Referring to fig. 4, the present utility model further provides a fingerprint chip, which includes an induction chip 100, an IC chip 200, and a package cover 300 of the present utility model, wherein the IC chip 200 is fixed on a non-contact surface of the induction chip 100, and the package cover 300 is covered on the non-contact surface of the induction chip 100. The IC chip 200 is inserted into the first groove 301 of the package cover 300, one end of the FPC500 for connecting the sensing chip 100 and the PCB 400 is bound to the non-contact surface of the sensing chip 100, and the other end is fixed to the components of the PCB 400, as shown in fig. 5. Specifically, one end of the FPC500 is disposed in the second recess 302 of the package cover 300, and the other end is folded along the third recess 303 of the package cover 300 to the PCB 400 on the second surface of the package cover.
In order to prevent moisture, dust, etc. from entering the sensing chip 100 and the IC chip 200, a packaging glue (not shown) is filled between the non-contact surface of the sensing chip 100 and the package cover 300, so that the package cover 300 is sealed and fixed on the non-contact surface of the sensing chip 100.
The sensing chip and the IC chip of the fingerprint chip are arranged separately, the sensing chip is directly contacted with the finger, the distance between the finger contact surface and the sensing area of the fingerprint chip is reduced, and the sensitivity of the fingerprint chip is improved.
The foregoing is a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model and are intended to be comprehended within the scope of the present utility model.
Claims (10)
1. The packaging cover plate of the fingerprint sensing chip is characterized by comprising a cover plate body, wherein the cover plate body is provided with a first surface, a second surface and side surfaces, the first surface and the second surface are arranged backwards, the side surfaces encircle the periphery of the first surface and the second surface, the first surface of the cover plate body is provided with a first groove and a second groove, the side surfaces are provided with a third groove communicated with the first surface and the second surface, and the second groove is communicated with the third groove;
the IC chip is arranged in the first groove, and the FPC is arranged in the second groove and folded to the second surface along the third groove.
2. The package cover of claim 1, wherein the first recess has a length greater than a length of the IC chip, a width greater than a width of the IC chip, and a depth greater than a height of the IC chip.
3. The package cover of claim 2, wherein the depth of the first groove is 10-50 μm greater than the height of the IC chip;
and/or the width of the first groove is 10-50 μm larger than the width of the IC chip.
4. The package cover of claim 3, wherein the depth of the first groove is 20-40 μm greater than the height of the IC chip;
and/or the width of the first groove is 20-40 μm larger than the width of the IC chip.
5. The fingerprint sensing chip package cover of claim 1, wherein the cover body has a plurality of ribs on the second surface.
6. The package cover for a fingerprint sensing chip of claim 5,
the reinforcing ribs are arranged according to a preset pattern to form a plurality of accommodating cavities for accommodating electronic devices on the PCB.
7. The package cover of claim 1, wherein the cover body is provided with support posts protruding along the side surface toward the second surface, the support posts for abutting against a PCB board.
8. The fingerprint sensing chip package cover of claim 1, wherein the material of the package cover is selected from one of polyetheretherketone, polytetrafluoroethylene, polyimide, polyphenylene sulfide, and polysulfone.
9. A fingerprint chip, characterized by comprising an induction chip, an IC chip and the package cover plate according to any one of claims 1-8, wherein the IC chip is fixed on a non-contact surface of the induction chip, and the package cover plate covers the non-contact surface of the induction chip.
10. The fingerprint chip of claim 9, wherein a sealing glue is filled between the non-contact surface of the sensing chip and the first surface of the package cover.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321843372.1U CN220357617U (en) | 2023-07-13 | 2023-07-13 | Fingerprint sensing chip's encapsulation apron, fingerprint chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321843372.1U CN220357617U (en) | 2023-07-13 | 2023-07-13 | Fingerprint sensing chip's encapsulation apron, fingerprint chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220357617U true CN220357617U (en) | 2024-01-16 |
Family
ID=89504957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321843372.1U Active CN220357617U (en) | 2023-07-13 | 2023-07-13 | Fingerprint sensing chip's encapsulation apron, fingerprint chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220357617U (en) |
-
2023
- 2023-07-13 CN CN202321843372.1U patent/CN220357617U/en active Active
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| GR01 | Patent grant |