KR102546105B1 - Optical sensor package - Google Patents

Abstract

The present invention relates to an optical sensor package, comprising: a base substrate including a first substrate portion on which a recessed portion is located and a second substrate portion surrounding the recessed portion; and an optical sensor located within the recessed portion and having a thickness smaller than the depth of the recessed portion of the recessed portion. A sensor, a first edge portion and a second edge portion positioned opposite to each other and spaced apart from each other along a first direction, an optical filter positioned on the second substrate portion and covering the optical sensor, and a second direction intersecting the first direction A plurality of sensor pads located on at least one of the first edge portion and the second edge portion of the optical sensor positioned apart from each other and adjacent to at least one of the first edge portion and the second edge portion of the optical sensor. a plurality of substrate pads located on the rim of the recessed portion of the second substrate unit and surrounded by the recessed unit, and a plurality of connection units respectively connected to sensor pads and substrate pads facing each other on opposite sides; and a first molding part covering a separation space between at least one of the first edge part and the second edge part of the optical sensor and the optical filter positioned on the at least one part.

Description

Optical sensor package {OPTICAL SENSOR PACKAGE}

The present invention relates to an optical sensor package.

Recent electronic devices have the advantage of satisfying users by gradually reducing their size and improving their grip feeling as well as their elegant appearance.

However, contrary to the reduction in external size of electronic devices, functions mounted therein are becoming very diverse, and thus the number of parts accommodated inside electronic devices tends to increase. In particular, in the case of a portable electronic device such as a smart phone, various functions are added.

Among the functions added to these electronic devices, biometric information recognition functions such as photographing functions and fingerprint recognition exist, and optical sensors required to implement these functions have recently been widely used in electronic devices.

Accordingly, an optical sensor used as a fingerprint sensor for fingerprint recognition by detecting light emitted from or reflected by a sensing object, which is a sensing object, is also required to be miniaturized and slimmed down in order to reduce the size of the corresponding electronic device.

Republic of Korea Patent Registration No. 10-1457069 (registration date: October 27, 2014, title of invention: optical roughness sensor)

An object to be solved by the present invention is to reduce the thickness of an optical sensor package.

Another problem to be solved by the present invention is to prevent performance degradation of an optical sensor package due to external light.

An optical sensor package according to one feature of the present invention includes a base substrate including a first substrate portion on which a depression is located and a second substrate portion surrounding the depression, located within the depression and having a thickness smaller than the depression depth of the depression. An optical sensor, a first edge portion and a second edge portion positioned opposite to each other and spaced apart from each other along a first direction, and an optical filter covering the optical sensor by being located on the second substrate portion, and a second direction intersecting the first direction. A plurality of sensor pads located on at least one of the first edge portion and the second edge portion of the optical sensor located spaced apart from each other along the , at least one of the first edge portion and the second edge portion of the optical sensor A plurality of substrate pads located adjacently and located at the edge of the recessed portion of the second substrate portion surrounding the recessed portion, a plurality of connection parts connected to the sensor pad and the substrate pad facing each other on the opposite side, and the optical sensor and a first molding portion covering a separation space between at least one of the first edge portion and the second edge portion and the optical filter positioned above the at least one edge portion.

The first molding part may be positioned between an edge part of the optical filter positioned above the at least one of the optical sensor and an edge part of the recessed part.

The first molding part may be positioned between the at least one of the optical sensors and a lower surface of the optical filter positioned on the at least one upper part.

A lower surface of the optical filter may be positioned in contact with the first molding part.

The first molding part may contain a blocking material that blocks wavelengths blocked by the optical filter.

Among the depressions, a second depression between the first edge of the optical sensor and an edge portion of the first depression adjacent to the first edge and the second edge of the optical sensor and adjacent to the second edge At least one of the edges of the sub-edges may include a space not covered by the optical filter, and each connecting part is positioned on at least one of the rim of the first recessed part and the rim of the second recessed part through the space. It can be connected to a substrate pad that does.

The first molding part may be additionally positioned within the space.

The optical sensor package according to the present feature may further include a second molding part positioned at a junction of the second substrate and the first edge of the optical filter and a junction of the second substrate and the second edge of the optical filter. can

The second molding part may contain a blocking material that blocks wavelengths blocked by the optical filter.

According to this feature of the present invention, the exposed space between the optical sensor and the lower surface of the optical filter positioned thereon is covered with the molding part, so that external light introduced into the active area through the empty space connected to the outside can be blocked.

1 is a plan view of an optical sensor package according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view obtained when the optical sensor package shown in FIG. 1 is cut along line II-II.
FIG. 3 is a cross-sectional view obtained when the optical sensor package shown in FIG. 1 is cut along line III-III.
FIG. 4 is a plan view of the optical sensor package shown in FIG. 1 before an optical filter is mounted thereon.
5 is a cross-sectional view obtained when cutting along line III-III in another example of an optical sensor package according to an embodiment of the present invention.
6 is a plan view of an optical sensor package according to another embodiment of the present invention.
FIG. 7 is a cross-sectional view obtained when the optical sensor package shown in FIG. 6 is cut along line VII-VII.
8 is a cross-sectional view obtained when the optical sensor package shown in FIG. 6 is cut along line VIII-VIII.
FIG. 9 is a side cross-sectional view of a first sensor molding part covering a sensor pad of the optical sensor package shown in FIG. 6 .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In describing the present invention, if it is determined that adding a detailed description of a technology or configuration already known in the related field may obscure the gist of the present invention, some of them will be omitted from the detailed description. In addition, the terms used in this specification are terms used to properly express the embodiments of the present invention, which may vary depending on people or customs related to the field. Therefore, definitions of these terms will have to be made based on the content throughout this specification.

The terminology used herein is intended only to refer to specific embodiments and is not intended to limit the present invention. As used herein, the singular forms also include the plural forms unless the phrases clearly indicate the opposite. As used herein, the meaning of 'comprising' specifies specific characteristics, regions, integers, steps, operations, elements and/or components, and other specific characteristics, regions, integers, steps, operations, elements, components and/or groups. does not exclude the presence or addition of

First, an optical sensor package according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 .

As shown in FIGS. 1 to 3, the optical sensor package 100 of the present example includes a base substrate 10 located at the bottom and an optical sensor located on the first surface (eg, upper surface) of the base substrate 10. 20 and an optical filter 30 positioned on the base substrate 10, a plurality of connection parts (eg, wires) for electrical and physical connection between the base substrate 10 and the optical sensor 20 (W20), A plurality of substrate pads (P10) and sensor pads (P20) respectively located on the corresponding surface (eg, upper surface) of the base substrate 10 and the optical sensor 20 for connection of each connection part (W20), a plurality of substrates A first substrate molding part C11 covering the pad P10 to protect a connection state and a second substrate molding part C12 protecting a bonding state between the optical filter 30 and the base substrate 10 may be provided. .

The optical sensor package 100 of this example is not limited to these components 10-30, W20, P10, P20, C11, and C12, and at least one component such as a housing may be added as needed. there is.

The base substrate 10 may be a part forming the bottom surface of the optical sensor package 100 of the present example.

The base substrate 10 may be made of a hard printed circuit board (HPCB), a flexible printed circuit board (FPCB) or a rigid flexible printed circuit board (RFPCB). can

As an example, the base substrate 10 of this example, as shown in FIG. 1, is a printed circuit board having a cavity S10 recessed to a predetermined depth in the upper surface, which is the corresponding surface of the base substrate 10. (eg cavity RFPCB).

Therefore, the base substrate 10 is a portion where the recessed portion S10 is located, and the first substrate portion 11 having an upper surface having a first height and the recessed portion S10 are not located and surround the recessed portion S10. It may include a second substrate portion 12 having an upper surface having a second height higher than the first height.

Therefore, the plane size of the depression S10 may be larger than the plane size of the optical sensor 20 located in the depression S10, so that the optical sensor 20 and the depression S10 adjacent to the optical sensor 20 may have a larger plane size. A separation space, which is a space formed by being spaced apart by the corresponding distance D11, may exist between the side surfaces of ).

In this case, the separation distance D11 may be the same regardless of the location or may be different depending on the location.

In this example, the thickness of the optical sensor 20 recessed into the recess S10 located on the base substrate 10 may be smaller than the recess depth of the recess S10, so that the optical sensor located in the recess S10 ( The height of the top surface of 20) may be lower than the height of the top surface of the second substrate unit 12.

Therefore, when the thickness of the optical sensor 20 is smaller than the depression depth of the depression portion S10, as shown in FIG. 2, the entire optical sensor 20 does not protrude outside the base substrate 10 and the depression portion S10 ) can be located inside.

Due to this, even when the optical sensor 20 is mounted on the base substrate 10, the optical sensor 20 does not protrude from the upper surface of the second substrate 12, and thus the optical sensor 20 mounted on the base substrate 10 ) does not cause the total thickness of the optical sensor package 100 to increase.

In addition to the optical sensor 20 and the optical filter 30, electronic components (not shown) such as various types of active elements or passive elements may be mounted on the upper and lower surfaces of the base substrate 10, and the mounted electronic components may be mounted thereon. For electrical and physical connection between components and electronic components, various patterns such as pads and signal lines (not shown) such as pads P10 made of a conductive material may be printed on the substrate.

Therefore, electrical signals and power are supplied to the corresponding electronic component through the pad P10 and the signal line so that the corresponding electronic component can operate.

In this example, the base substrate 10 is composed of one substrate having two parts 11 and 12 having different thicknesses depending on positions.

However, in an alternative example, the base substrate 10 may include a first substrate portion and a second substrate portion that are two different substrates. In this case, the first substrate portion may have an empty space at the center thereof having the same planar shape as the recessed portion S10 and penetrating completely in the thickness direction of the first substrate portion, and the second substrate portion may be located below the first substrate portion. Thus, the empty space may be blocked to form the lower surface of the base substrate. In this case, the optical sensor 20 may be located on the first substrate in the empty space.

The optical sensor 20 that may be located in the recessed portion S10 of the base substrate 10 may receive light incident through the optical filter 30 located thereon and output an electrical signal in a corresponding state.

The optical sensor 20 may be mounted in the recessed portion S10 of the base substrate 10 using surface mounting technology (SMT) or the like.

At this time, the depression depth of the depression S10 is greater than the maximum height of the optical sensor 20 located therein, so that the upper surface of the optical sensor 20 and the lower surface of the optical filter 30 located thereon are spaced apart. space can be located.

In this example, the upper surface of the optical sensor 20 facing the optical filter 30 is a light-receiving surface on which light passing through the optical filter 30 is incident, and at least a part of the light-receiving surface is the optical sensor 20 It can operate as an active area 21 in which a plurality of light-receiving elements are integrated to detect the light irradiated with the detected light and generate and output an electrical signal in a corresponding state according to the sensed light.

The plurality of light-receiving elements located in the active region 21 of the optical sensor 20 are set to operate most appropriately in a predetermined wavelength band, but, unlike this, they can also sense light other than the predetermined wavelength band. Accordingly, the optical sensor 20 may recognize light outside of a predetermined wavelength band as noise.

Accordingly, the active region 21 may be covered with an optical filter 30 that passes only light of a predetermined wavelength band or blocks light of a predetermined wavelength band.

The optical sensor 20 may supply power and input/output signals through the base substrate 10, and for this purpose, may be electrically and physically connected to the base substrate 10 in various ways.

To this end, as already described, the optical sensor package 100 is coupled to a plurality of substrate pads P10, a plurality of sensor pads P20, and the substrate pads P10 and sensor pads P20 corresponding to each other, respectively. A plurality of wires W20 electrically and physically connecting the substrate pad P10 and the sensor pad P20 may be provided.

In this case, the plurality of wires W20 may be connected to the substrate pad P10 and the sensor pad P20 corresponding to each other using a wire bonding process.

The plurality of substrate pads P10 and the plurality of sensor pads P20 may be positioned at corresponding positions on corresponding surfaces (eg, upper surfaces) of the base substrate 10 and the optical sensor 20 , respectively.

In this case, the plurality of substrate pads P10 and the plurality of sensor pads P20 may be formed through a printing operation using a conductive material such as gold (Au).

Each of the pads P10 and P20 may have various planar shapes such as a rectangle.

In addition, the plurality of wires W20 also contain a conductive material such as gold, so that electrical signals can be transmitted between the substrate pad P10 and the sensor pad P20 connected to each other through the wires W20.

A plurality of sensor pads (P20) located on the optical sensor 20 are spaced apart in a first direction (eg, horizontal direction or vertical direction) (X1) from the optical sensor 20 having a rectangular planar shape, and at opposite sides of each other. At least one of a pair of spaced apart facing edges (eg, a pair of vertical side edges, a left edge and a right edge) may be located.

Accordingly, the plurality of sensor pads P20 are arranged side by side and spaced apart along the left edge in a second direction (eg, a vertical direction or a horizontal direction) Y1 intersecting the first direction X1. The portion P21 and the right edge portion may be divided into a second sensor pad portion P22 arranged side by side and spaced apart from each other along the second direction Y1.

As shown in FIG. 1, in the case of this example, a pair of edge portions (eg, a pair of side edge portions, a front edge portion and a rear side edge portion) are spaced apart in the second direction Y1 and face each other on opposite sides. The sensor pad P20 may not be positioned at the edge portion).

In the case of this example, since the plurality of sensor pads P20 are located on the left and right edges of the optical sensor 20, respectively, the sensor pads P20 are located opposite to each other. The plurality of substrate pads P10 may also be divided into two groups.

Therefore, the plurality of substrate pads P10 are positioned adjacent to the first sensor pad portion P21 and connected to each first sensor pad portion P21 through a corresponding wire W20. and a second substrate pad part P12 positioned adjacent to the second sensor pad part P22 and connected to each second sensor pad part P22 through a corresponding ear W20.

As described above, the first and second substrate pad parts P21 and P22 are located adjacent to the first and second sensor pad parts P11 and P12 located in the recessed part S10, respectively, of the second substrate part 12. part, that is, it may be located in the rim portion of the depression surrounding the depression (S10).

Therefore, as shown in FIG. 1, since the first and second sensor pad parts P21 and P22 are located at the left and right edges of the optical sensor 20, respectively, the first and second substrate pad parts P11, P12) is also located on the left and right sides of the depression S10, and may be located on the left and right edges of the depression forming the rim of the depression, respectively.

In an alternative example, the substrate pad (P10), unlike the sensor pad (P20), is located on the front side and the rear side with the depression (S10 as the center), respectively, and also the front side depression edge portion and the rear side constituting the depression edge portion It may be additionally located on at least one of the edge portions of the side depressions to electrically connect electric and electronic components located on the base substrate 10 .

The optical filter 30 may be located on the upper surface of the base substrate 10 , that is, on the upper surface of the second substrate portion 12 where the depression S10 is not located. In this case, the optical filter 30 may be bonded to a corresponding portion of the upper surface of the second substrate unit 12 through an adhesive or the like.

In this example, the width (eg, horizontal) of the optical filter 30 in the first direction X1 is the length (eg, the length in the first direction) of the optical filter 30 extending in the first direction X1. width) is smaller than the width (eg, horizontal width) of the depression S20 formed in the first direction X1, but the length (eg, in the second direction) of the optical filter 30 extending in the second direction Y The width (eg, vertical width) of the optical filter 30 in the second direction Y1 (length of there is.

Therefore, as shown in FIG. 1, the front edge EP21 and the rear edge EP22 of the optical filter 30 facing each other along the second direction Y1 are recessed portions located at the lower portion, respectively. It may be located across the upper surface of the second substrate portion 12 of the base substrate 10 past the corresponding end of (S20).

However, the left edge EP11 and the right edge EP12 of the optical filter 30 facing each other along the first direction X1 cannot cross over the corresponding ends of the recessed portion S20 located below. can

Accordingly, an upper part of the space S11 in which the optical sensor 20 is not located in the depression S20 where the optical sensor 20 is located may be covered and blocked by the optical filter 30 .

For example, at least a part of the upper portion of the space S11 adjacent to the front and rear side recessed edges located along the second direction Y1 is completely covered by the optical filter 30, and the corresponding space S11 ) is not exposed to the outside, while at least a part of the upper portion of the space S11 adjacent to the left and right concave edge portions along the first direction X1 is not covered by the optical filter 30 and It is exposed to the outside and can communicate with the outside.

As such, since there is a portion connected to the outside in the empty space S11, the wire W20 is located in the open empty space S11 and is located on the base substrate 10 at different heights. P10) and the sensor pad P20 located on the optical sensor 20 may be electrically and physically connected.

The first substrate molding part C11 located on the base substrate 10 stably maintains the coupled state of the substrate pad P10, protects the corresponding pad P10 from foreign substances such as moisture or dust, and furthermore, base substrate This is to cover the empty space between (10) and the optical filter 30 to block external light from entering the optical sensor 20 through the empty space.

The molding part C11 may be made of a non-conductive resin material such as an epoxy resin material. At this time, the resin material for the first substrate molding part C11 is light of a specific wavelength introduced toward the optical sensor 20 (eg For example, it may contain a blocking material (for example, an infrared blocking material) for blocking infrared rays). In this case, the specific wavelength may be the same wavelength as the wavelength blocked by the optical filter 30 .

Therefore, the first substrate molding portion C11 is positioned on the plurality of first substrate pad portions P11 and between the pad portions P11 and the left edge portion of the optical filter 30 adjacent to the first substrate pad portion P11. The first pad molding part C111 covering the empty space between the pad part P11 and the left edge of the optical filter 30, and on the plurality of second substrate pad parts P12 and on the pad part P12 A second pad molding part C112 located between the right edges of adjacent optical filters 30 and covering an empty space between the second substrate pad part P12 and the right edge of the optical filter 30 may be provided. can

At this time, the plurality of first substrate pad parts P11 and the plurality of second substrate pad parts P12 are completely buried in the first substrate molding part C111 and the second substrate molding part C121, so that the corresponding substrate molding part ( C111, C112) can be completely covered.

Therefore, each of the substrate pads P11 and P12 connected to the corresponding wire W20 is completely covered with the corresponding first substrate molding portion C11, so that only the portion connected to the wire W20 and not connected to the wire W20 are completely covered. All portions of the substrate pads P11 and P12 may be covered with the first substrate molding portion C11 so that the substrate pad P10 exposed to the outside may not exist.

At this time, a portion of the wire W20 connected to the corresponding substrate pad P10, that is, one end of the wire W20 bonded to the substrate pad P10 and a lower portion of the wire W20 adjacent thereto also include the first portion of the wire W20. It may be buried in the substrate molding part C11.

In this case, the first substrate molding portion C11 may be seamlessly present between adjacent substrate pads P10.

As already described, the first substrate molding part C111 and the second substrate molding part C112 may extend to the upper left edge and the right edge of the adjacent optical filter 30 , respectively.

Therefore, the exposed space S11 between the base substrate 10 and the optical filter 30, more specifically, the separation space between the upper surface of the optical sensor 20 and the lower surface of the optical filter 30 located thereon is Light introduced toward the optical sensor 20 through the space S11 completely covered by the first and second substrate molding parts C111 and C112 may be completely blocked.

Eventually, due to the existence of the first substrate pad molding part C111 and the second substrate pad molding part C112, through an empty gap that is an open space between the optical sensor 20 and the optical filter 30. Since the amount of light directly applied to the active region 21 of the optical sensor 20 without passing through the optical filter 30 is blocked, reliability of operation of the optical sensor 20 may be improved.

As shown in FIG. 1 , the second substrate molding portion C12 includes the front and rear edge portions EP21 and EP22 of the optical filter 30 positioned in contact with the second substrate portion 12 of the base substrate 10 . ), it is located on the corresponding ends (EP21, EP22) to cover the corresponding ends (EP21, EP22).

Therefore, the junction between the first substrate portion 12 of the base substrate 10 and the ends EP21 and EP22 of the front and rear edge portions of the optical filter 30 may be sealed by the second molding portion C12. there is. In this case, the position of the optical filter 30 is stably fixed to the first substrate part 12 of the base substrate 10 to prevent positional fluctuations due to external shocks and the like, and to prevent foreign substances such as dust from entering the recessed part S10. inflow can be prevented.

The second substrate molding unit C12 may be made of the same material as the first substrate molding unit C11, and in this case, the first substrate molding unit C11 and the second substrate molding unit C12 may perform the same process. It is formed through, and can be positioned without interruption while following the edge portion of the depression. As described above, a plurality of substrate pads P10 may be located on the rim of the depression.

When the second substrate molding part C12 is made of a material different from that of the first substrate molding part C11, the second substrate molding part C12 does not contain a blocking material that blocks light of a specific wavelength, but only the corresponding junction part. It may be made of a non-conductive resin material that can perform only the bonding function of. In this case, the first substrate molding part C11 and the second substrate molding part C12 may be formed through different processes.

However, the second substrate molding part C12 may be omitted if necessary.

As shown in FIG. 3 , the first substrate molding part C111 and the second substrate molding part C112 are positioned only on the upper surface of the base substrate 10 and the optical filter 30 .

However, unlike this, as shown in FIG. 5, in an alternative example, at least one of the first substrate molding part C111 and the second substrate molding part C112 is in the empty space S11 in the recessed part S10. can be located

Accordingly, a portion of the empty space S11 between the upper surface of the first substrate portion 11, which is the bottom surface of the recessed portion S10, and the lower surface of the optical filter 30 is filled with the first substrate molding portion C11. can

Also, a part of the first substrate molding part C11 may be located on an upper surface of an adjacent optical filter 20 .

As such, the separation space S11 that is not substantially covered with the optical filter 30 is covered with the first substrate molding part C11, and flows into the active region 21 through the empty space S11 connected to the outside. External light can be completely blocked.

In this example, both the end EP11 of the left edge and the end EP12 of the right edge of the optical filter 30 cannot go beyond the corresponding end of the depression S20 located at the bottom, and thus the left edge of the optical filter 30 An exposed empty space exists between the right edge portion and the left edge portion of the recessed portion adjacent thereto and the edge portion of the right recessed portion adjacent thereto.

However, unlike this, only one of the end EP11 of the left edge and the end EP12 of the right edge of the optical filter 30 cannot exceed the corresponding end of the depression S20, so that the left part or the end of the depression S10 Only the right portion may not be covered with the optical filter 30 . In this case, the first substrate molding part C11 includes the rim of the corresponding depression (eg, the left rim of the depression) and the corresponding edge (eg, the left edge) of the optical filter 30 adjacent thereto. ), and may be covered with the second substrate molding portion C12 of the edge portion of the remaining recessed portion of the first substrate portion 12 that is in contact with the optical filter 30 .

Next, an optical sensor package according to another embodiment of the present invention will be described with reference to FIGS. 6 to 9 .

Compared to the optical sensor package 100 of FIGS. 1 to 5, components of the optical sensor package 100a of this example having the same structure and performing the same function are given the same reference numerals as the optical sensor package 100. and a detailed description thereof is omitted.

As shown in FIG. 6, the optical sensor package 100a of this example also includes a base substrate 10 having a first substrate portion 11 and a second substrate portion 12 located at the bottom, and the base substrate 10 An optical sensor 20 positioned on the first substrate portion 11 of the base substrate 10 and an optical filter 30 positioned on the second substrate portion 12 of the base substrate 10 may be provided.

The left edge and the right edge of the second substrate 12 of the base substrate 10 are provided with first and second substrate pad portions P11 and P12, and the optical sensor 20 also has first and second substrate pad portions P11 and P12. First and second sensor pad parts P21 and P22 may be provided to correspond to the second substrate pad parts P11 and P12.

Accordingly, the optical sensor package 100a may include a plurality of wires W20 electrically and physically connecting the corresponding substrate pad parts P11 and P12 and the sensor pad parts P21 and P22.

In this example, the optical filter 30 may be bonded to a corresponding portion of the second substrate 12 of the base substrate 10 through the adhesive B30 as shown in FIG. 7 . In this example as well, as shown in FIG. 1 , the molding part C12 is located at the joint between the optical filter 30 and the second substrate 12, so that the bonding force between the optical filter 30 and the second substrate 12 is strong. It is possible to increase and protect the wire W20 from foreign substances.

However, unlike FIGS. 1 to 5, the optical sensor package 100a of this example is located on the first sensor pad part P21 and the second sensor pad part P22, respectively, and the first sensor pad part P21 and A sensor molding part (eg, a third molding part) C20 having a first sensor molding part C21 covering the second sensor pad part P22 and a second sensor molding part C22 may be provided. .

As shown in FIG. 9, the first sensor molding part C21 and the second sensor molding part C22 are adjacent to the first sensor pad part P21 and the second sensor pad part P22, respectively, as well as the two adjacent sensors. It may also be located between the pad parts P21 and P22.

Therefore, the first sensor molding part C21 and the second sensor molding part C22 are respectively, as shown in FIG. 9 , along the second direction Y1 without interruption along the left edge of the corresponding side edge of the optical sensor 20. It may have a dam shape extending to the right edge portion and the right edge portion.

Due to this, the bottom part of the optical filter 30 of the present example located on the first sensor pad part P21 and the second sensor pad part P22 of the optical sensor 20 without being located on the substrate part 12, that is, As shown in FIG. 8 , the lower surfaces of the left edge and the right edge may be located on the first sensor molding part C21 and the second sensor molding part C22 in contact with the corresponding sensor molding parts C21 and C22. .

Therefore, the separation space, which is the exposed space between the upper surface of the optical sensor 20 where the first sensor pad part P21 and the second sensor pad part P22 are located, and the lower surface of the optical filter 30 located thereon is It may be completely blocked by being covered with the first sensor molding part C21 and the second sensor molding part C22.

In addition, the first sensor molding part C21 and the second sensor molding part C22 protect the connection state of the first sensor pad part P21 and the second sensor pad part P22 and protect the sensor pad P20 from foreign substances. can protect

As shown in FIG. 8, the first sensor molding part C21 and the second sensor molding part C22 are located on the upper surface of the optical sensor 20 and in the depression S10 where the optical sensor 20 is seated. Or, as shown in FIG. 9 , it may be located only on the upper surface of the optical sensor 20 .

Accordingly, the left and right edges, which are parts of the optical sensor 20 where the first sensor molding part C21 and the second sensor molding part C22 are located, are the first sensor molding part C21 and the second sensor molding part. (C22), and the separation space between the corresponding sensor pad parts P21 and P22 and the optical filter 30 located thereon is formed by the first sensor molding part C21 and the second sensor molding part C22. become blocked

Due to this, the first sensor molding part C21 and the second sensor molding part C22 are not covered by the optical filter 30 and are active without passing through the optical filter 30 through an empty gap connected to the outside. Since optical directly applied to the region 21 is blocked, reliability of operation of the optical sensor 20 can be improved.

In the above, the embodiments of the optical sensor package of the present invention have been described. The present invention is not limited to the above-described embodiments and accompanying drawings, and various modifications and variations will be possible from the viewpoint of those skilled in the art to which the present invention belongs. Therefore, the scope of the present invention should be defined by not only the claims of this specification but also those equivalent to these claims.

100, 100a: optical sensor package 10: base substrate
11: first substrate portion 12: second substrate portion
20: optical sensor 30: optical filter
S10: depression S11: empty space
W20: wire P10: board pad
P11: first substrate pad portion P12: second substrate pad portion
P20: sensor pad P21: first sensor pad part
P22: second sensor pad part C11: first substrate molding part
C12: second substrate molding portion C111: first substrate molding portion
C112: second substrate molding part C20: sensor molding part
C21: first sensor molding part C22: second sensor molding part

Claims (9)

a base substrate including a first substrate portion on which the depression is located and a second substrate portion surrounding the depression portion;
an optical sensor positioned within the depression and having a thickness smaller than a depression depth of the depression;
an optical filter having a first edge portion and a second edge portion positioned opposite to each other and spaced apart from each other along a first direction and covering the optical sensor by being positioned on the second substrate portion;
a plurality of sensor pads positioned on at least one of a first edge portion and a second edge portion of the optical sensor spaced apart from each other along a second direction crossing the first direction;
a plurality of substrate pads positioned adjacent to at least one of the first edge portion and the second edge portion of the optical sensor and positioned at an edge portion of the recessed portion of the second substrate portion surrounding the recessed portion;
a plurality of connection parts respectively connected to the sensor pad and the substrate pad facing each other on opposite sides; and
A first molding part covering a separation space between at least one of the first edge part and the second edge part of the optical sensor and the optical filter disposed on the at least one part.
including,
The optical sensor package of claim 1 , wherein the first molding part contains a blocking material that blocks wavelengths blocked by the optical filter. According to claim 1,
The first molding part is positioned between an edge part of the optical filter positioned on the at least one upper part of the optical sensor and an edge part of the recessed part. According to claim 1,
The first molding part is located between the at least one of the optical sensor and the lower surface of the optical filter located on the at least one upper part of the optical sensor package. According to claim 3,
The lower surface of the optical filter is located in contact with the first molding part optical sensor package. delete According to claim 1,
Among the depressions, a second depression between the first edge of the optical sensor and an edge portion of the first depression adjacent to the first edge and the second edge of the optical sensor and adjacent to the second edge At least one of the sub-edge portions has a space not covered by the optical filter;
Each connection part is connected to a substrate pad positioned on at least one of the rim of the first recessed part and the rim of the second recessed part through the space. According to claim 6,
The first molding part is additionally located in the optical sensor package. According to claim 1,
The optical sensor package further includes a second molding part positioned at a junction between the second substrate and the first edge of the optical filter and at a junction between the second substrate and the second edge of the optical filter. According to claim 8,
The second molding part contains a blocking material that blocks wavelengths blocked by the optical filter.

Images