CN212425432U - Pressure sensor packaging structure and electronic equipment - Google Patents
Pressure sensor packaging structure and electronic equipment Download PDFInfo
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- CN212425432U CN212425432U CN202020715391.6U CN202020715391U CN212425432U CN 212425432 U CN212425432 U CN 212425432U CN 202020715391 U CN202020715391 U CN 202020715391U CN 212425432 U CN212425432 U CN 212425432U
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Abstract
The utility model provides a pressure sensor packaging structure and an electronic device, wherein the pressure sensor packaging structure comprises a substrate; the flexible shell and the substrate form a sealed cavity in a surrounding mode; pressure sensor sets up in the cavity, pressure sensor has first end and second end, first end orientation the base plate sets up, and is provided with external electrode, external electrode with the base plate electricity is connected, the second end orientation the inboard upper surface of flexible shell, the second end is provided with pressure sensitive portion and electric connection portion, and when receiving external pressure, flexible shell will power transmission extremely pressure sensitive portion, electric connection portion through conductive structure with external electrode electricity is connected. The utility model has the advantages of, improved pressure sensor packaging structure's reliability greatly, and enlarged pressure sensor packaging structure's application range.
Description
Technical Field
The utility model relates to a pressure sensor encapsulates the field, especially relates to a pressure sensor packaging structure and electronic equipment.
Background
The pressure sensor senses pressure signals through the pressure sensitive unit, converts the pressure signals into available output electric signals according to a certain rule, and processes the electric signals into analog output or digital output forms correspondingly required through the signal processing unit.
With the development of social economy, the pressure sensor is more and more widely applied, and the existing pressure sensor packaging structure can not meet the requirements.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a pressure sensor packaging structure and electronic equipment are provided, it can improve greatly pressure sensor packaging structure's reliability, and enlarge pressure sensor packaging structure's application range.
In order to solve the above problem, the utility model provides a pressure sensor packaging structure, it includes: a substrate; the flexible shell and the substrate form a sealed cavity in a surrounding mode; pressure sensor sets up in the cavity, pressure sensor has first end and second end, first end orientation the base plate sets up, and is provided with external electrode, external electrode with the base plate electricity is connected, the second end orientation the inboard upper surface of flexible shell, the second end is provided with pressure sensitive portion and electric connection portion, and when receiving external pressure, flexible shell will power transmission extremely pressure sensitive portion, electric connection portion through conductive structure with external electrode electricity is connected.
Further, the pressure sensor comprises a package body and at least one pressure sensor chip located in the package body, the package body is provided with a first surface and a second surface, one surface of the pressure sensor chip is provided with a pressure sensitive area and at least one chip electrode, the pressure sensitive area is exposed to the first surface of the package body and is used as the pressure sensitive part, the chip electrode is arranged on the first surface or located in the package body and is used as the electric connection part, and the external electrode is arranged on the second surface.
Further, the conductive structure comprises a redistribution layer and a conductive connecting piece, the redistribution layer is arranged on the first surface of the packaging body and is electrically connected with the chip electrodes so as to electrically redistribute the chip electrodes, and the conductive connecting piece penetrates through the packaging body and electrically connects the external electrode with the redistribution layer.
Further, the pressure sensor further comprises an isolation layer, and the isolation layer at least covers the redistribution layer.
Further, the packaging body comprises a packaging layer and a dielectric layer which are sequentially arranged, the pressure sensor chip is arranged on the surface of the packaging layer, the dielectric layer covers the pressure sensor chip, the pressure sensitive area and the chip electrode are arranged on the surface, deviating from the packaging layer, of the pressure sensor chip, the pressure sensitive area is exposed to the dielectric layer and serves as the pressure sensitive part, the chip electrode is arranged in the dielectric layer and serves as the electric connection part, and the external electrode is arranged on the surface, deviating from the dielectric layer, of the packaging layer.
Further, the conductive structure comprises a conductive connecting piece and a conductive wire, the conductive connecting piece penetrates through the packaging layer and is electrically connected with the external electrode, the conductive wire is arranged in the medium layer, and the chip electrode is electrically connected with the conductive connecting piece through the conductive wire.
Further, the pressure sensor includes at least one pressure sensor chip having a first surface and a second surface, the first surface has a pressure sensitive region exposed to a first end of the pressure sensor to serve as the pressure sensitive portion, and at least one chip electrode serving as the electrical connection portion, the external electrode is disposed on the second surface of the pressure sensor chip, and the conductive structure penetrates through a peripheral region of the pressure sensor chip to electrically connect the chip electrode with the external electrode.
Further, the pressure sensor further comprises an isolation layer, wherein the isolation layer is arranged on the first surface of the pressure sensor chip and at least covers the chip electrode.
Further, the conductive structure is a conductive column or a conductive through hole.
Further, an inside upper surface of the flexible housing is in contact with the pressure sensitive portion to transmit force to the pressure sensitive portion.
Furthermore, the upper surface of the inner side of the flexible shell has a preset distance with the pressure sensitive part, and when the flexible shell is subjected to external pressure, the flexible shell deforms to enable the upper surface of the inner side of the flexible shell to be in contact with the pressure sensitive part, so that force is transmitted to the pressure sensitive part.
Further, the inner upper surface and/or the outer upper surface of the flexible housing has a protrusion disposed to correspond to the pressure sensitive portion.
Further, at least one connecting column is arranged at the edge of the flexible shell, the substrate is provided with at least one fixing hole, and the connecting column penetrates through the fixing hole so as to fix the flexible shell on the substrate.
The utility model also provides an electronic equipment, it includes accommodation space, accommodation space has the relative lateral wall and the work lateral wall that bears that sets up, as above pressure sensor packaging structure set up in the accommodation space, it bears to bear the lateral wall pressure sensor packaging structure, the work lateral wall with the sensitive portion of pressure corresponds, and external force passes through the work lateral wall is used in on the flexible shell, flexible shell produces deformation to conduct the power extremely the sensitive portion of pressure.
The utility model discloses pressure sensor packaging structure shell is flexible shell, and it can also make pressure sensor receive the change of two-sided power when protecting pressure sensor, has improved pressure sensor packaging structure's application range greatly, and simultaneously, flexible shell volume production size uniformity is good, has reduced pressure sensor packaging structure's error, and with low costs, is convenient for the volume production; additionally, the utility model discloses pressure sensor packaging structure's electric connection portion passes through conductive structure and is connected with external electrode electricity, has improved pressure sensor packaging structure's reliability greatly.
The utility model discloses electronic equipment adopts above-mentioned pressure sensor packaging structure as the forced induction component, has improved forced induction's reliability greatly and has reduced electronic equipment's cost.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the pressure sensor package structure of the present invention;
fig. 2 is a schematic structural diagram of a second embodiment of the pressure sensor package structure of the present invention;
fig. 3 is a schematic structural diagram of a third embodiment of the pressure sensor package structure of the present invention;
fig. 4 is a schematic structural diagram of a pressure sensor according to a fourth embodiment of the pressure sensor package structure of the present invention;
fig. 5 is a schematic structural diagram of a pressure sensor according to a fifth embodiment of the pressure sensor package structure of the present invention;
fig. 6 is a schematic partial structural diagram of an embodiment of an electronic device according to the present invention.
Detailed Description
The following describes in detail a specific embodiment of a pressure sensor package structure and an electronic device according to the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a first embodiment of a pressure sensor package structure of the present invention, please refer to fig. 1, the pressure sensor package structure includes a substrate 10, a flexible housing 11 and a pressure sensor 12.
The substrate 10 can carry the pressure sensor 12 and is electrically connected to the pressure sensor 12, thereby electrically connecting the pressure sensor 12 to an external device. The substrate 10 includes, but is not limited to, a Printed Circuit Board (PCB) or a flexible circuit board (FPC).
The flexible housing 11 is disposed on the substrate 10, and encloses a sealed cavity 10A with the substrate 10. The flexible housing 11 is a housing with elasticity, which includes but is not limited to a rubber housing or a silicone housing.
In the first embodiment, the flexible casing 11 is provided with at least one connection post 110 at the edge, and the substrate 10 has at least one fixing hole 101. The connection post 110 passes through the fixing hole 101 to fix the flexible housing 11 on the substrate 10. Further, the connecting column 110 is in interference fit with the fixing hole 101 to prevent the connecting column 110 from being separated from the fixing hole 101. Wherein the connecting column 110 can be integrally formed with the flexible housing 11. In order to further prevent the connection post 110 from being separated from the fixing hole 101, a stopper 112 is provided at the end of the connection post 110. The blocking portion 112 limits the position of the connecting column 110 relative to the fixing hole 101, and prevents the connecting column 110 from being separated from the fixing hole 101. The shape of the stop 112 includes, but is not limited to, a semi-circle or a wedge.
In a second embodiment of the present invention, please refer to fig. 2, which is a schematic structural diagram of the second embodiment of the pressure sensor package structure of the present invention, the connecting column is not disposed at the edge of the flexible casing 11, and the flexible casing 11 is connected to the substrate 10 through the bonding layer 13 to form the cavity 10A.
With continued reference to fig. 1, the pressure sensor 12 is disposed within the chamber 10A. The pressure sensor 12 has a first end 12A and a second end 12B. In the first embodiment, the first end 12A is disposed opposite to the second end 12B, the first end 12A is a bottom end of the pressure sensor 12, and the second end 12B is a top end of the pressure sensor 12.
The first end 12A is disposed toward the substrate 10. An external electrode 121 is provided at the first end 12A. The external electrode 121 is electrically connected to the substrate 10. The number and arrangement of the external electrodes 121 may be set according to the actual design of the pressure sensor 12. The external electrode 121 includes but is not limited to a solder ball, an electrical connection pad, and other conductive structures.
The second end 12B faces the inner upper surface of the flexible housing 11. The second end 12B is provided with a pressure sensitive portion and an electrical connection portion. When the pressure sensor is subjected to external pressure, the flexible shell 11 transmits force to the pressure sensitive part, the pressure acts on the pressure sensitive part, and the pressure sensor 12 can generate an electric signal so as to measure the pressure. The electrical connection portion is electrically connected to the external electrode 121 through a conductive structure to transmit the electrical signal to the substrate 10.
In the present embodiment, the pressure sensor 12 includes a package 122 and at least one pressure sensor chip 123 located in the package 122. Only one of the pressure sensor chips 123 is illustrated in fig. 1, and in other embodiments of the present invention, the pressure sensor 12 includes a plurality of pressure sensor chips, and the plurality of pressure sensor chips are sequentially arranged along a direction parallel to the second end 12B.
The package body 122 is made of an insulating material, including but not limited to organic or inorganic materials, such as silicon, glass, epoxy fiberglass cloth, and the like. The package body 122 serves to protect a device (e.g., the pressure sensor chip 123) disposed therein and to isolate the device from an external environment. The package body 122 has a first surface 122A and a second surface 122B. In this embodiment, the first surface 122A corresponds to the second end 12B of the pressure sensor 12, i.e., an upper surface of the pressure sensor 12, and the second surface 122B corresponds to the first end 12A of the pressure sensor 12, i.e., a lower surface of the pressure sensor 12. In other embodiments of the present invention, the first surface 122A and the second surface 122B can also be adjacent surfaces, for example, the first surface 122A is an upper surface of the package body 122, and the second surface 122B is a side surface of the package body 122.
A surface of the pressure sensor die 123 has a pressure sensitive region 1231 and at least one die electrode 1232. The pressure sensitive region 1231 is exposed to the first surface 122A of the package body 122 to serve as the pressure sensitive portion, and the chip electrode 1232 is disposed on the first surface 122A or in the package body 122 to serve as the electrical connection portion. In this embodiment, the chip electrode 1232 is disposed on the first surface 122A. In other embodiments of the present invention, for example, in the fourth embodiment of the present invention, the chip electrode 1232 is disposed in the package body 122. Further, the chip electrodes 1232 may be disposed around the pressure sensitive region 1231. The position of the pressure sensitive area 1231, the position and the number of the chip electrodes 1232 can be set according to the actual situation, the utility model discloses do not limit to this
The external electrode 121 is disposed on the second surface 122B of the package body 122. The external electrode 121 is electrically connected to the chip electrode 1232 through a conductive structure.
In the first embodiment, the conductive structure includes a redistribution layer 124 and a conductive connection 125.
The redistribution layer 124 is disposed on the first surface 122A of the package body 122 and electrically connected to the chip electrodes 1232 to electrically redistribute the chip electrodes 1232. The rerouting layer 124 includes, but is not limited to, a rerouting metal layer.
The conductive connection 125 penetrates the package body 122 and electrically connects the external electrode 121 and the redistribution layer 124. In this embodiment, the conductive connecting member 125 is a conductive column, and in other embodiments of the present invention, the conductive connecting member 125 can be a conductive through hole.
Further, in the first embodiment, the pressure sensor 12 further includes an isolation layer 126, and the isolation layer 126 covers at least the redistribution layer 124. The isolation layer 126 serves as a dielectric layer for electrical isolation, mechanical protection or stress buffering, and may be formed of Polyimide (PI), ink or bis-benzocyclobutene (BCB).
In this embodiment, the inner upper surface of the flexible housing 11 contacts the pressure sensitive region 1231 to transmit pressure to the pressure sensitive region 1231. Further, due to the existence of the isolation layer 126, when the inner upper surface of the flexible housing 11 is a plane, it cannot contact the pressure sensitive region 1231, so that a protrusion 111 is disposed at a position of the inner upper surface of the flexible housing 11 corresponding to the pressure sensitive region 1231, and the protrusion 111 contacts the pressure sensitive region 1231 to transmit pressure to the pressure sensitive region 1231, thereby improving the sensitivity of the pressure sensor.
Optionally, in this embodiment, a protrusion 112 is disposed on the outer upper surface of the flexible housing 11, the protrusion 112 is disposed to correspond to the pressure sensitive region 1231, when the pressure sensor package structure detects pressure, the protrusion 112 provides sufficient elastic deformation to effectively conduct force transmission, and the protrusion 112 can be used as an alignment mark to improve the sensitivity of the pressure sensor chip.
It is understood that in other embodiments of the present invention, the inner upper surface of the flexible housing 11 may not contact the pressure sensitive area 1231, and the inner upper surface of the flexible housing 11 may contact the pressure sensitive area only after the flexible housing 11 is stressed. For example, referring to fig. 3, which is a schematic structural diagram of a third embodiment of the pressure sensor package structure of the present invention, in the third embodiment, a predetermined distance is provided between the upper surface of the inner side of the flexible casing 11 and the pressure sensitive area 1231, that is, a gap is provided between the upper surface of the inner side of the flexible casing 110 and the pressure sensitive area 1231, when external pressure is applied, the flexible casing 11 deforms, and the upper surface of the inner side of the flexible casing 11 contacts with the pressure sensitive area 1231 to transmit the pressure to the pressure sensitive area 1231. In the third embodiment, a protrusion 112 corresponding to the pressure sensitive region 1231 is disposed on the outer upper surface of the flexible casing 11 to improve the sensitivity of the pressure sensor. Further, in other embodiments, a protrusion is also provided on the inner upper surface of the flexible housing 11 to improve the sensitivity of the pressure sensor.
The utility model discloses pressure sensor packaging structure's shell is flexible shell, and it can also make pressure sensor receive the change of two-sided power when protecting pressure sensor. Specifically, the force applied to the front surface of the pressure sensor structure can be transmitted to the pressure sensitive part of the pressure sensor through the flexible shell; the back of the pressure sensor packaging structure (namely the substrate side) is subjected to force which can act on the pressure sensitive part of the pressure sensor by pulling or extruding the flexible shell, so that the application range of the pressure sensor packaging structure is greatly improved, and meanwhile, the flexible shell has good consistency in volume production size, reduces the error of the pressure sensor packaging structure, and is low in cost and convenient for volume production.
Additionally, the utility model discloses pressure sensor packaging structure's electric connection portion pass through conductive structure with external electrode electricity is connected, compares in traditional routing connection, the utility model discloses the connection method reliability is higher, difficult fracture.
The utility model discloses still provide a fourth embodiment. The fourth embodiment is different from the first embodiment in the structure of the package body.
Referring to fig. 4, which is a schematic structural diagram of a pressure sensor according to a fourth embodiment of the pressure sensor package structure of the present invention, in the fourth embodiment, the package body 122 includes a package layer 1221 and a dielectric layer 1222 sequentially disposed. The encapsulation layer 1221 is made of an insulating material, including but not limited to organic or inorganic materials, such as silicon, glass, epoxy fiberglass cloth, and the like. The dielectric layer 1222 is a dielectric layer for electrical isolation, mechanical protection or stress buffering, and may be formed of Polyimide (PI), ink or bis-benzocyclobutene (BCB).
The upper surface of the dielectric layer 1222 is the first surface 122A of the package body 122, and the lower surface of the encapsulation layer 1221 is the second surface 122B of the package body 122. The pressure sensor chip 123 is disposed on the surface of the encapsulation layer 1221, and the dielectric layer 1222 covers the pressure sensor chip 123. The pressure sensitive region 1231 and the chip electrode 1232 are disposed on a surface of the pressure sensor chip 123 facing away from the encapsulation layer 1221. The pressure sensitive region 1231 is exposed to the dielectric layer 1222 to serve as the pressure sensitive portion. The chip electrode 1232 is disposed within the dielectric layer 1222 to serve as the electrical connection portion. The external electrode 121 is disposed on a surface of the encapsulation layer 1221 facing away from the dielectric layer 1222. The chip electrode 1232 is electrically connected to the external electrode 121 through a conductive structure.
Further, in the fourth embodiment, the conductive structure includes a conductive connecting element 127 and a conductive line 128. The conductive connection member 127 penetrates the encapsulation layer 1221 and is electrically connected to the external electrode 121. The conductive connecting member 127 may be a conductive pillar or a conductive via. The conductive line 128 is located in the dielectric layer 1222, one end of the conductive line 128 is electrically connected to a chip electrode 1232, and the other end of the conductive line 128 is electrically connected to the conductive connection element 127, that is, the chip electrode 1232 and the conductive connection element 127 are electrically connected through the conductive line 128.
The utility model discloses still provide a fifth embodiment. The fifth embodiment is different from the first embodiment in that the chip electrode and the external electrode are connected in a different manner. Specifically, please refer to fig. 5, which is a schematic structural diagram of a pressure sensor according to a fifth embodiment of the pressure sensor package structure of the present invention, in which the pressure sensor includes at least one pressure sensor chip 123. The pressure sensor chip 123 is not limited in this embodiment, and a package is not provided outside the pressure sensor chip.
The pressure sensor chip 123 has a first surface 123A and a second surface 123B, the first surface 123A corresponds to the second end of the pressure sensor, and the second surface 123B corresponds to the first end of the pressure sensor. The first surface 123A has a pressure sensitive region 1231 and at least one chip electrode 1232. The pressure sensitive region 1231 is exposed at a first end of the pressure sensor. The pressure sensitive region 1231 serves as the pressure sensitive portion, and the chip electrode 1232 serves as the electrical connection portion. The external electrode 121 is disposed on the second surface 123B of the pressure sensor chip 123. The conductive structure 1234 penetrates through the peripheral region of the pressure sensor chip 123 to electrically connect the chip electrode 1232 with the external electrode 121. In the fifth embodiment, the conductive structure is formed by using a Through Silicon Via (TSV) technology, which directly penetrates through the peripheral region of the pressure sensor chip 123 to electrically connect the chip electrode 1232 with the external electrode 121. The conductive structures include, but are not limited to, conductive pillars or conductive vias.
Further, in the fifth embodiment, the pressure sensor 12 further includes an isolation layer 129, and the isolation layer 129 is disposed on the first surface 123A of the pressure sensor chip 123 and covers at least the chip electrode 1232. The isolation layer 129 serves as a dielectric layer for electrical isolation, mechanical protection or stress buffering, and may be formed of Polyimide (PI), ink or bis-benzocyclobutene (BCB). The pressure sensitive region 1231 is not covered by the isolation layer 129 such that the pressure sensitive region 1231 is exposed to the second end of the pressure sensor.
The utility model also provides an electronic equipment who adopts above-mentioned pressure sensor packaging structure. Fig. 6 is a partial schematic structural diagram of an embodiment of the electronic device of the present invention, please refer to fig. 6 and fig. 1, the electronic device includes an accommodating space 60, and the accommodating space 60 has a working sidewall 60A and a carrying sidewall 60B disposed oppositely. A pressure sensor package structure 61, which is the same as the pressure sensor package structure described above, is provided in the accommodating space 60. The bearing side wall 60B bears the pressure sensor package structure 61 and electrically connects it with the electronic device, and transmits the electrical signal of the pressure sensor package structure to the electronic device. The working side wall 60A corresponds to the pressure sensitive portion. An external force F acts on the flexible shell 11 through the working side wall 60A, the flexible shell 11 deforms, the force is transmitted to the pressure sensitive portion, and then the pressure sensor measures the pressure. The working side wall 60A may be configured as a button to be moved by force to enable force transmission.
Including, but not limited to, a mobile terminal, a computer, a digital broadcast terminal, a messaging device, a gaming console, a tablet device, a medical device, a fitness device, or a personal digital assistant, etc.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (14)
1. A pressure sensor package structure, comprising:
a substrate;
the flexible shell and the substrate form a sealed cavity in a surrounding mode;
pressure sensor sets up in the cavity, pressure sensor has first end and second end, first end orientation the base plate sets up, and is provided with external electrode, external electrode with the base plate electricity is connected, the second end orientation the inboard upper surface of flexible shell, the second end is provided with pressure sensitive portion and electric connection portion, and when receiving external pressure, flexible shell will power transmission extremely pressure sensitive portion, electric connection portion through conductive structure with external electrode electricity is connected.
2. The pressure sensor package structure of claim 1, wherein the pressure sensor comprises a package and at least one pressure sensor chip located in the package, the package has a first surface and a second surface, a surface of the pressure sensor chip has a pressure sensitive region and at least one chip electrode, the pressure sensitive region is exposed on the first surface of the package to serve as the pressure sensitive portion, the chip electrode is disposed on the first surface or located in the package to serve as the electrical connection portion, and the external electrode is disposed on the second surface.
3. The pressure sensor package of claim 2, wherein the conductive structure includes a redistribution layer disposed on the first surface of the package and electrically connected to the chip electrodes for electrically redistributing the chip electrodes, and a conductive connector extending through the package and electrically connecting the external electrode to the redistribution layer.
4. The pressure sensor package of claim 3, wherein the pressure sensor further comprises an isolation layer covering at least the redistribution layer.
5. The pressure sensor package structure of claim 2, wherein the package body includes a package layer and a dielectric layer sequentially disposed thereon, the pressure sensor chip is disposed on a surface of the package layer, the dielectric layer covers the pressure sensor chip, the pressure sensitive area and the chip electrode are disposed on a surface of the pressure sensor chip away from the package layer, the pressure sensitive area is exposed on the dielectric layer to serve as the pressure sensitive portion, the chip electrode is disposed in the dielectric layer to serve as the electrical connection portion, and the external electrode is disposed on a surface of the package layer away from the dielectric layer.
6. The pressure sensor package of claim 5, wherein the conductive structure comprises a conductive connector and a conductive wire, the conductive connector extending through the encapsulation layer and electrically connected to the external electrode, the conductive wire disposed within the dielectric layer, the conductive wire electrically connecting the chip electrode to the conductive connector.
7. The pressure sensor package structure of claim 1, wherein the pressure sensor comprises at least one pressure sensor chip, the pressure sensor chip has a first surface and a second surface, the first surface has a pressure sensitive region and at least one chip electrode, the pressure sensitive region is exposed to a first end of the pressure sensor to serve as the pressure sensitive portion, the chip electrode serves as the electrical connection portion, the external connection electrode is disposed on the second surface of the pressure sensor chip, and the conductive structure penetrates through a peripheral region of the pressure sensor chip to electrically connect the chip electrode and the external connection electrode.
8. The pressure sensor package of claim 7, wherein the pressure sensor further comprises an isolation layer disposed on the first surface of the pressure sensor die and covering at least the die electrodes.
9. The pressure sensor package of claim 7, wherein the conductive structure is a conductive post or a conductive via.
10. The pressure sensor package of any of claims 1-9, wherein an inner upper surface of the flexible housing contacts the pressure sensitive portion to transmit force to the pressure sensitive portion.
11. The pressure sensor package structure of any one of claims 1 to 9, wherein the inner upper surface of the flexible casing is a predetermined distance away from the pressure sensitive portion, and when the flexible casing is subjected to an external pressure, the flexible casing deforms such that the inner upper surface of the flexible casing contacts the pressure sensitive portion, thereby transmitting a force to the pressure sensitive portion.
12. The pressure sensor package structure according to any one of claims 1 to 9, wherein the inner upper surface and/or the outer upper surface of the flexible housing has a protrusion, and the protrusion is disposed to correspond to the pressure sensitive portion.
13. The pressure sensor package structure according to any one of claims 1 to 9, wherein the flexible housing is provided at an edge thereof with at least one connection post, and the substrate has at least one fixing hole, and the connection post passes through the fixing hole to fix the flexible housing on the substrate.
14. An electronic device, comprising a receiving space, wherein the receiving space has a carrying sidewall and a working sidewall, the carrying sidewall and the working sidewall are disposed opposite to each other, the pressure sensor package structure according to any one of claims 1 to 13 is disposed in the receiving space, the carrying sidewall carries the pressure sensor package structure, the working sidewall corresponds to the pressure sensitive portion, an external force acts on the flexible housing through the working sidewall, and the flexible housing deforms to transmit the force to the pressure sensitive portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020715391.6U CN212425432U (en) | 2020-04-30 | 2020-04-30 | Pressure sensor packaging structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020715391.6U CN212425432U (en) | 2020-04-30 | 2020-04-30 | Pressure sensor packaging structure and electronic equipment |
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| CN212425432U true CN212425432U (en) | 2021-01-29 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113582126A (en) * | 2020-04-30 | 2021-11-02 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure and electronic equipment |
| WO2022170749A1 (en) * | 2021-02-09 | 2022-08-18 | 深圳市汇顶科技股份有限公司 | Pressure detection module and electronic device for pressure detection |
-
2020
- 2020-04-30 CN CN202020715391.6U patent/CN212425432U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113582126A (en) * | 2020-04-30 | 2021-11-02 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure and electronic equipment |
| CN113582126B (en) * | 2020-04-30 | 2024-05-10 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure and electronic equipment |
| WO2022170749A1 (en) * | 2021-02-09 | 2022-08-18 | 深圳市汇顶科技股份有限公司 | Pressure detection module and electronic device for pressure detection |
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