CN212133946U - Pressure sensor packaging structure - Google Patents
Pressure sensor packaging structure Download PDFInfo
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- CN212133946U CN212133946U CN202020714008.5U CN202020714008U CN212133946U CN 212133946 U CN212133946 U CN 212133946U CN 202020714008 U CN202020714008 U CN 202020714008U CN 212133946 U CN212133946 U CN 212133946U
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- pressure sensor
- pressure
- sensor package
- flexible housing
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Abstract
The utility model provides a pressure sensor packaging structure, it includes: a substrate; the flexible shell and the substrate form a sealed cavity in a surrounding mode; at least one pressure sensor chip, set up in the cavity, the pressure sensor chip has pressure sensitive face and electric connection face, the pressure sensitive face towards the inboard upper surface of flexible shell, when receiving external pressure, flexible shell will do all can transmit to the pressure sensitive face, the electric connection face towards the base plate, and with the base plate electricity is connected. The utility model discloses the advantage is, the shell is flexible shell, and it can also make the pressure sensor chip receive the change of two-sided power when protecting the pressure sensor chip, has improved pressure sensor packaging structure's application range greatly, and simultaneously, flexible shell volume production size uniformity is good, has reduced pressure sensor packaging structure's error, and with low costs, the volume production of being convenient for.
Description
Technical Field
The utility model relates to a pressure sensor field especially relates to a pressure sensor packaging structure.
Background
The pressure sensor senses pressure signals through the pressure sensitive unit, converts the pressure signals into available output electric signals according to a certain rule, and processes the electric signals into analog output or digital output forms correspondingly required through the signal processing unit.
With the development of social economy, the pressure sensor is more and more widely applied, and the existing pressure sensor packaging structure can not meet the requirements.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a pressure sensor packaging structure is provided, its pressure variation that can receive both sides about the pressure sensor packaging structure, application range is wide.
In order to solve the above problem, the utility model provides a pressure sensor packaging structure, it includes: a substrate; the flexible shell and the substrate form a sealed cavity in a surrounding mode; at least one pressure sensor chip, set up in the cavity, the pressure sensor chip has pressure sensitive face and electric connection face, the pressure sensitive face towards the inboard upper surface of flexible shell, when receiving external pressure, flexible shell will do all can transmit to the pressure sensitive face, the electric connection face towards the base plate, and with the base plate electricity is connected.
Further, an inside upper surface of the flexible housing is in contact with the pressure sensitive face to transfer force to the pressure sensitive face.
Furthermore, the inner side upper surface of the flexible shell and the pressure sensitive surface have a preset distance, and when the flexible shell is subjected to external pressure, the flexible shell deforms to enable the inner side upper surface of the flexible shell to be in contact with the pressure sensitive surface, so that force is transmitted to the pressure sensitive surface.
Further, the inner upper surface of the flexible shell is a surface with a plurality of protruding microstructures corresponding to the pressure sensitive surface, or is a flat surface.
Further, the upper surface of the outer side of the flexible shell is a surface with a plurality of protruding microstructures corresponding to the pressure sensitive surface, or is a flat surface.
Further, the upper surface of the outer side of the flexible shell is provided with at least one bulge extending towards the direction far away from the flexible shell, and the bulge corresponds to the pressure sensitive surface.
Further, the flexible enclosure is connected to the substrate by a bonding layer to form the sealed cavity.
Further, at least one connecting column is arranged at the edge of the flexible shell, the substrate is provided with at least one fixing hole, and the connecting column penetrates through the fixing hole so as to fix the flexible shell on the substrate.
Further, the connecting column and the fixing hole are in interference fit.
Furthermore, the tail end of the connecting column is provided with a blocking part, and the blocking part limits the connecting column so as to prevent the connecting column from being separated from the fixing hole.
Furthermore, a plurality of electric connection pads are arranged on the electric connection surface and electrically connected with the substrate.
Further, the pressure sensor packaging structure further comprises a lower support plate, and the substrate is arranged on the lower support plate.
Further, the pressure sensor packaging structure further comprises an upper pressing plate, the upper pressing plate is arranged above the flexible shell, and pressure acting on the upper pressing plate is transmitted to the pressure sensitive surface of the pressure sensor through the flexible shell.
Further, the flexible shell is a silica gel shell or a rubber shell.
Further, the substrate is a printed circuit board or a flexible circuit board.
The utility model discloses pressure sensor packaging structure's shell is flexible shell, and it can also make the pressure sensor chip receive the change of two-sided power when protecting the pressure sensor chip. Specifically, the force applied to the front surface of the pressure sensor structure can be transmitted to the pressure sensitive area of the pressure sensor chip through the flexible shell; the back of the pressure sensor packaging structure (namely the substrate side) is subjected to force which can act on the pressure sensitive area of the pressure sensor chip by pulling or extruding the flexible shell, so that the application range of the pressure sensor packaging structure is greatly improved, and meanwhile, the flexible shell has good consistency in volume production size, reduces the error of the pressure sensor packaging structure, and is low in cost and convenient for volume production.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of the pressure sensor package structure of the present invention;
fig. 2A is a schematic structural diagram of a second embodiment of the pressure sensor package structure of the present invention;
fig. 2B is a schematic diagram of a flexible housing of a second embodiment of a pressure sensor package according to the present invention after being subjected to a force;
fig. 3 is a schematic structural diagram of a third embodiment of the pressure sensor package structure of the present invention;
fig. 4 is a schematic structural diagram of a fourth embodiment of the pressure sensor package structure of the present invention;
fig. 5 is a schematic structural diagram of a fifth embodiment of the pressure sensor package structure of the present invention;
fig. 6 is a schematic structural diagram of a sixth embodiment of the pressure sensor package structure of the present invention;
fig. 7 is a schematic structural diagram of a seventh embodiment of the pressure sensor package structure of the present invention;
fig. 8 is a schematic structural diagram of an eighth embodiment of the pressure sensor package structure of the present invention.
Detailed Description
The following describes in detail a specific embodiment of the pressure sensor package structure provided by the present invention with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a first embodiment of the pressure sensor package structure of the present invention. Referring to fig. 1, the pressure sensor package structure includes a substrate 100, a flexible housing 110, and at least one pressure sensor chip 120.
The substrate 100 can support the pressure sensor chip 120 and is electrically connected to the pressure sensor chip 120, so as to electrically connect the pressure sensor chip 120 to an external device. The substrate 100 includes, but is not limited to, a Printed Circuit Board (PCB) or a flexible circuit board (FPC).
The flexible housing 110 is disposed on the substrate 100, and encloses a sealed cavity 100A with the substrate 100. In this embodiment, the flexible casing 110 is connected to the substrate 100 by an adhesive layer 111 to form the cavity 100A. The flexible housing 110 is a housing with elasticity, which includes but is not limited to a rubber housing or a silicone housing.
The pressure sensor chip 120 is disposed in the cavity 100A. In this embodiment, the pressure sensor package structure includes only one pressure sensor chip 120. In other embodiments of the present invention, the pressure sensor package structure includes a plurality of the pressure sensor chips 120, a plurality of the pressure sensor chips 120 are sequentially arranged along the horizontal direction and disposed in the cavity 100A.
The pressure sensor chip 120 has a pressure-sensitive surface 120A and an electrical connection surface 120B. In this embodiment, the pressure-sensitive surface 120A and the electrical connection surface 120B are disposed relatively, in other embodiments of the present invention, the pressure-sensitive surface 120A and the electrical connection surface 120B may also be disposed adjacently.
The pressure sensitive face 120A faces the inside upper surface of the flexible cover 110. When subjected to ambient pressure, the flexible housing 110 transmits force to the pressure sensitive face 120A. When pressure acts on the pressure-sensitive surface 120A, the pressure sensor chip 120 generates an electrical signal, thereby measuring the pressure. In this embodiment, the pressure sensor chip is a pressure-sensitive resistor type pressure sensor, and the pressure-sensitive resistor is disposed on the pressure-sensitive surface 120A.
The inner upper surface of the flexible cover 110 is in contact with the pressure-sensitive surface 120A to transmit pressure to the pressure-sensitive surface 120A. It is understood that in other embodiments of the present invention, the inner upper surface of the flexible housing 110 may not contact the pressure-sensitive surface 120A, and the inner upper surface of the flexible housing 110 may contact the pressure-sensitive surface 120A only after the flexible housing 110 is stressed. For example, referring to fig. 2A, which is a schematic structural diagram of a second embodiment of the pressure sensor package structure of the present invention, in the second embodiment, a predetermined distance is formed between the inner upper surface of the flexible housing 110 and the pressure-sensitive surface 120A, that is, a gap is formed between the inner upper surface of the flexible housing 110 and the pressure-sensitive surface 120A. Referring to fig. 2B, which is a schematic diagram of the flexible housing 110 after being stressed, when an external pressure F is applied, the flexible housing 110 deforms, and the upper surface of the inner side of the flexible housing 110 contacts the pressure-sensitive surface 120A, so as to transmit the pressure to the pressure-sensitive surface 120A.
With reference to fig. 1, the electrical connection surface 120B faces the substrate 100 and is electrically connected to the substrate 100. The electrical signal generated by the pressure sensor chip 120 is conducted to the substrate 100 through the electrical connection surface 120B, and then conducted to an external device. Further, a plurality of electrical connection pads 130 are disposed on the electrical connection surface 120B, and the electrical connection pads 130 are electrically connected to the substrate 100. The electrical connection pads 130 include but are not limited to conductive structures such as solder balls.
The utility model discloses pressure sensor packaging structure's shell is flexible shell 110, and it can also make the pressure sensor chip receive the change of two-sided power when protecting the pressure sensor chip. Specifically, the force applied to the front surface of the pressure sensor structure can be transmitted to the pressure sensitive area 120A of the pressure sensor chip 120 through the flexible housing; the force received by the back surface (namely the substrate side) of the pressure sensor packaging structure can act on the pressure sensitive area 120A of the pressure sensor chip 120 by pulling or extruding the flexible shell 110, so that the application range of the pressure sensor packaging structure is greatly improved, and meanwhile, the flexible shell 110 is good in mass production size consistency, the error of the pressure sensor packaging structure is reduced, the cost is low, and the mass production is facilitated.
In this embodiment, the inner upper surface of the flexible housing 110 is a flat surface, and the outer upper surface of the flexible housing 110 is also a flat surface. In other embodiments of the present invention, the inner upper surface of the flexible housing 110 and the outer upper surface of the flexible housing 110 may be non-flat surfaces.
Please refer to fig. 3, which is a schematic structural diagram of a third embodiment of the pressure sensor package structure of the present invention, in which the inner upper surface of the flexible casing 110 is a surface having a plurality of protruding microstructures 112 corresponding to the pressure-sensitive surface 120A. When the flexible housing 110 is stressed, the protruding microstructures 112 act on the pressure-sensitive surface 120A to improve the sensitivity of the pressure sensor chip 120.
Please refer to fig. 4, which is a schematic structural diagram of a fourth embodiment of the pressure sensor package structure of the present invention, in the fourth embodiment, an outer upper surface of the flexible housing 110 is a surface having a plurality of protruding microstructures 113 corresponding to the pressure-sensitive surface, and the protruding microstructures 113 correspond to the pressure-sensitive surface 120A. When the pressure sensor package structure detects pressure, the protruding microstructures 113 can be used as alignment marks to improve the sensitivity of the pressure sensor chip.
It is understood that in another embodiment of the present invention, the flexible housing 110 has a plurality of protruding microstructures corresponding to the pressure-sensitive surface 120A on both the inner and outer upper surfaces.
The utility model discloses still provide a fifth embodiment of pressure sensor packaging structure. Please refer to fig. 5, which is a schematic structural diagram of a fifth embodiment of the pressure sensor package structure of the present invention, the difference between the fifth embodiment and the first embodiment is that the outer upper surface of the flexible housing 110 has at least one protrusion 114 extending in a direction away from the flexible housing 110, and the protrusion 114 corresponds to the pressure sensitive surface 120A to provide sufficient elastic deformation for effectively transmitting force.
In the first embodiment of the present invention, the flexible housing 110 is connected to the substrate 100 through the bonding layer 111, and in other embodiments of the present invention, the flexible housing 110 may be connected to the substrate 100 through other methods. For example, referring to fig. 6, which is a schematic structural view illustrating a sixth embodiment of the pressure sensor package structure of the present invention, at least one connection post 115 is disposed at an edge of the flexible casing 110, and the substrate 100 has at least one fixing hole 101. The connection post 115 passes through the fixing hole 101 to fix the flexible cover 110 on the substrate 100. Further, the connection post 115 and the fixing hole 101 are in interference fit to prevent the connection post 115 from being separated from the fixing hole 101. Wherein the connection post 115 may be integrally formed with the flexible housing 110.
In order to further strengthen the connection between the flexible housing 110 and the substrate 100, the present invention further provides a seventh embodiment of the pressure sensor package structure. Referring to fig. 7, in this embodiment, the end of the connection post 115 has a stopper 115A, and the stopper 115A limits the connection post 115 to prevent the connection post 115 from being separated from the fixing hole 101. The shape of the blocking portion 115A includes, but is not limited to, a semi-circle or a wedge.
The utility model discloses still provide an eighth embodiment of pressure sensor packaging structure. Referring to fig. 8, the eighth embodiment is different from the first embodiment in that, in the eighth embodiment, the pressure sensor package further includes a lower supporting plate 140 and an upper pressing plate 150. The substrate 100 is disposed on the lower support plate 140. The lower support plate 140 is used to support the substrate 100. The upper pressing plate 150 is disposed above the flexible casing 110, and a pressing force applied to the upper pressing plate 150 is transmitted to the pressure sensitive surface 120A of the pressure sensor through the flexible casing 110. The upper button plate 150 includes, but is not limited to, a touch pad or a touch key.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (15)
1. A pressure sensor package structure, comprising:
a substrate;
the flexible shell and the substrate form a sealed cavity in a surrounding mode;
at least one pressure sensor chip, set up in the cavity, the pressure sensor chip has pressure sensitive face and electric connection face, the pressure sensitive face towards the inboard upper surface of flexible shell, when receiving external pressure, flexible shell will do all can transmit to the pressure sensitive face, the electric connection face towards the base plate, and with the base plate electricity is connected.
2. The pressure sensor package of claim 1, wherein an inside upper surface of the flexible housing is in contact with the pressure sensitive face to transmit force to the pressure sensitive face.
3. The pressure sensor package of claim 1, wherein the inner top surface of the flexible housing is a predetermined distance from the pressure sensitive surface, and when the flexible housing is subjected to an external pressure, the flexible housing deforms such that the inner top surface of the flexible housing contacts the pressure sensitive surface to transmit a force to the pressure sensitive surface.
4. The pressure sensor package of claim 1, wherein the inner upper surface of the flexible housing is a surface having a plurality of raised microstructures corresponding to the pressure sensitive surface or a flat surface.
5. The pressure sensor package of claim 1, wherein the outer upper surface of the flexible housing is a surface having a plurality of raised microstructures corresponding to the pressure sensitive surface, or a flat surface.
6. The pressure sensor package of claim 1, wherein the outer upper surface of the flexible housing has at least one protrusion extending away from the flexible housing, the protrusion corresponding to the pressure sensitive surface.
7. The pressure sensor package of claim 1, wherein the flexible housing is coupled to the substrate by an adhesive layer to form the sealed cavity.
8. The pressure sensor package of claim 1, wherein the flexible housing has at least one connection post disposed on a periphery thereof, and the substrate has at least one fastening hole, the connection post passing through the fastening hole to fasten the flexible housing to the substrate.
9. The pressure sensor package of claim 8, wherein the connecting stud is an interference fit with the securing hole.
10. The pressure sensor package structure of claim 8, wherein the connection post has a stopper at a distal end thereof, the stopper limiting the connection post to prevent the connection post from being separated from the fixing hole.
11. The pressure sensor package of claim 1, wherein a plurality of electrical connection pads are disposed on the electrical connection face, the electrical connection pads being electrically connected to the substrate.
12. The pressure sensor package of claim 1, further comprising a lower support plate, the substrate being disposed on the lower support plate.
13. The pressure sensor package of claim 1, further comprising an upper push plate disposed above the flexible housing, wherein pressure applied to the upper push plate is transmitted through the flexible housing to the pressure sensitive surface of the pressure sensor.
14. The pressure sensor package of claim 1, wherein the flexible housing is a silicone housing or a rubber housing.
15. The pressure sensor package structure of any one of claims 1 to 14, wherein the substrate is a printed circuit board or a flexible circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020714008.5U CN212133946U (en) | 2020-04-30 | 2020-04-30 | Pressure sensor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020714008.5U CN212133946U (en) | 2020-04-30 | 2020-04-30 | Pressure sensor packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN212133946U true CN212133946U (en) | 2020-12-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020714008.5U Active CN212133946U (en) | 2020-04-30 | 2020-04-30 | Pressure sensor packaging structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112268651A (en) * | 2020-12-22 | 2021-01-26 | 北京翔东智能科技有限公司 | Based on high performance wide range area temperature sensitive type film pressure sensitive chip |
| CN113588143A (en) * | 2020-04-30 | 2021-11-02 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure |
-
2020
- 2020-04-30 CN CN202020714008.5U patent/CN212133946U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113588143A (en) * | 2020-04-30 | 2021-11-02 | 苏州敏芯微电子技术股份有限公司 | Pressure sensor packaging structure |
| CN112268651A (en) * | 2020-12-22 | 2021-01-26 | 北京翔东智能科技有限公司 | Based on high performance wide range area temperature sensitive type film pressure sensitive chip |
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