CN217955141U - Fingerprint sensing chip packaging structure - Google Patents
Fingerprint sensing chip packaging structure Download PDFInfo
- Publication number
- CN217955141U CN217955141U CN202221853707.3U CN202221853707U CN217955141U CN 217955141 U CN217955141 U CN 217955141U CN 202221853707 U CN202221853707 U CN 202221853707U CN 217955141 U CN217955141 U CN 217955141U
- Authority
- CN
- China
- Prior art keywords
- fingerprint sensing
- sensing chip
- cover
- cover plate
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The application discloses fingerprint sensing chip packaging structure, its fingerprint sensing chip's induction zone need not set up filler material and carries out the plastic envelope, and the apron directly laminates in fingerprint sensing chip's induction zone for fingerprint sensing chip packaging structure's thickness attenuation has reduced the distance between the induction zone of finger contact surface to fingerprint sensing chip, has promoted fingerprint sensing chip packaging structure's sensitivity and recognition efficiency, and fingerprint sensing chip packaging structure equipment convenient and fast. The utility model provides a current fingerprint identification chip packaging structure's thickness thicker, and sensitivity low, the problem of discernment inefficiency.
Description
Technical Field
The utility model relates to a chip package technical field, concretely relates to fingerprint sensing chip packaging structure.
Background
Fingerprint sensing and identification technologies have become identification technologies commonly used for personal identification and personal information security authentication, and are now widely applied to multiple fields of personal information identification. With the development of electronic technology, electronic products such as mobile phones, tablet computers, notebook computers, etc. generally employ fingerprint identification technology. On the other hand, with the continuous miniaturization and multi-functionalization of electronic products, a package of fingerprint identification technology must satisfy a minute size and high sensitivity.
A sapphire cover plate and a plastic packaging material are arranged between a finger contact surface of an existing fingerprint identification chip packaging structure and an induction area of a fingerprint identification chip, the thickness of the fingerprint identification chip packaging structure is thick, collected fingerprint signals are attenuated, the sensitivity is reduced, and the identification efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects in the prior art, a fingerprint sensing chip packaging structure is provided so as to solve the problems of thicker thickness, low sensitivity and low recognition efficiency of the existing fingerprint recognition chip packaging structure.
In order to achieve the above object, a fingerprint sensor chip package structure is provided, which includes:
the substrate is provided with a front surface and a back surface which are opposite, and an accommodating groove is formed in the middle of the front surface;
the fingerprint sensing chip is arranged in the accommodating groove, an adhesive layer is filled between the fingerprint sensing chip and the inner wall of the accommodating groove, and the top of the fingerprint sensing chip is flush with the front surface of the substrate;
the cover plate is attached to the top of the fingerprint sensing chip and aligned to the sensing area of the fingerprint sensing chip;
the conductive gasket is arranged along the circumferential direction of the accommodating groove, one side of the conductive gasket is connected with the substrate in an overlapping mode, and the other side of the conductive gasket is connected with the outer edge of the top of the fingerprint sensing chip in an overlapping mode;
the anti-static cover is covered outside the cover plate and the conductive gasket, the inner wall of the anti-static cover is pressed against the cover plate, a through hole aligned with the cover plate is formed in the top of the anti-static cover, the anti-static cover is connected to the ground of the substrate, and the side wall of the anti-static cover is arc-shaped; and
and the packaging layer is filled in the anti-static cover and covers the cover plate and the conductive gasket.
Furthermore, a connecting flange is formed by extending the cover opening of the anti-static cover along the plate surface direction of the substrate, a circle of connecting flange is arranged along the circumferential direction of the anti-static cover, and the connecting flange is attached to the front surface of the substrate.
Furthermore, an annular clamping groove is formed at the lower port of the through hole, and the upper part of the cover plate is embedded in the annular clamping groove.
Further, the substrate is a rigid circuit board.
Further, the cover plate is a tempered glass cover plate.
The beneficial effects of the utility model reside in that, the utility model discloses a fingerprint sensing chip packaging structure's fingerprint sensing chip's induction area need not set up filler material and carries out the plastic envelope, and the apron directly laminates in fingerprint sensing chip's induction area for fingerprint sensing chip packaging structure's thickness attenuation has reduced the distance between the induction area of finger contact surface to fingerprint sensing chip, has promoted fingerprint sensing chip packaging structure's sensitivity and identification efficiency, and fingerprint sensing chip packaging structure equipment convenient and fast.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is a schematic structural diagram of a fingerprint sensing chip package structure according to an embodiment of the present invention.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that, in the present application, the embodiments and features of the embodiments may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1, the utility model provides a fingerprint sensing chip packaging structure, include: the fingerprint sensing device comprises a substrate 1, a fingerprint sensing chip 2, a cover plate 3, a conductive gasket 4, an anti-static cover 5 and a packaging layer 6.
The substrate 1 is a rigid circuit board. Specifically, the substrate is any one of a phenolic paper laminated board, an epoxy paper laminated board, a polyester glass felt laminated board and an epoxy glass cloth laminated board.
In the present embodiment, the substrate 1 has a front surface and a back surface opposite to each other. The middle part of the front surface is provided with an accommodating groove.
The fingerprint sensing chip 2 is arranged in the accommodating groove. The fingerprint sensing chip is arranged in a clearance with the groove wall of the accommodating groove, namely a clearance is formed between the fingerprint sensing chip and the groove wall of the accommodating groove. The bonding layer 21 is filled between the fingerprint sensing chip 2 and the inner wall of the accommodating groove. The top of the fingerprint sensing chip 2 is flush with the front surface of the substrate 1.
The adhesive layer is plastic or resin. The clearance between the cell wall of the holding recess of base plate and the fingerprint sensor chip has been filled with bonding material in order to form the adhesive linkage, and the adhesive linkage can increase fingerprint sensor chip's anti electrical fatigue performance for fingerprint sensor chip is more stable, and the reliability is higher.
The cover plate 3 is attached to the top of the fingerprint sensing chip 2 and aligned to the sensing area of the fingerprint sensing chip 2.
The conductive gasket 4 is disposed along the circumferential direction of the accommodation groove. One side of the conductive pad 4 is bonded to the substrate 1. The other side of the conductive pad 4 is connected to the outer edge of the top of the fingerprint sensing chip.
The antistatic cover 5 covers the cover plate 3 and the conductive gasket 4. The inner wall of the anti-static cover 5 is pressed against the cover plate 3. The top of the anti-static cover 5 is provided with a through hole aligned with the cover plate 3. The electrostatic shield 5 is connected to the ground of the substrate 1. The side wall of the antistatic cover 5 is arc-shaped. The whole anti-static cover is in a spherical crown shape, and the top of the anti-static cover is provided with a hole so that fingers can be attached to the cover plate conveniently.
In the present embodiment, the connection flange is formed in the cover opening of the antistatic cover 5 extending in the plate surface direction of the substrate 1. The connecting flange is provided with a circle along the circumferential direction of the antistatic cover 5, and the connecting flange is attached to the front surface of the substrate 1.
In a preferred embodiment, the lower port of the through hole is formed with a circular groove, and the upper portion of the cover plate 3 is fitted into the circular groove.
In the present embodiment, the cover plate 3 is a tempered glass cover plate.
The packaging layer 6 is filled in the anti-static cover 5 and covers the top of the fingerprint sensing chip 2, the cover plate 3 and the conductive pad 4. In this embodiment, the cover plate completely covers the sensing region, and the encapsulation layer is not in contact with the sensing region.
The utility model discloses a fingerprint sensing chip packaging structure's fingerprint sensing chip's induction zone need not set up filler material and carries out the plastic envelope, and the apron directly laminates in fingerprint sensing chip's induction zone for fingerprint sensing chip packaging structure's thickness attenuation has reduced the distance between the induction zone of finger contact surface to fingerprint sensing chip, has promoted fingerprint sensing chip packaging structure's sensitivity and recognition efficiency, and fingerprint sensing chip packaging structure equipment convenient and fast.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be understood by those skilled in the art that the scope of the present invention is not limited to the specific combination of the above-mentioned features, but also covers other embodiments formed by any combination of the above-mentioned features or their equivalents without departing from the spirit of the present invention. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.
Claims (5)
1. A fingerprint sensing chip package structure, comprising:
the substrate is provided with a front surface and a back surface which are opposite, and an accommodating groove is formed in the middle of the front surface;
the fingerprint sensing chip is arranged in the accommodating groove, an adhesive layer is filled between the fingerprint sensing chip and the inner wall of the accommodating groove, and the top of the fingerprint sensing chip is flush with the front surface of the substrate;
the cover plate is attached to the top of the fingerprint sensing chip and aligned to the sensing area of the fingerprint sensing chip;
the conductive gasket is arranged along the circumferential direction of the accommodating groove, one side of the conductive gasket is lapped on the substrate, and the other side of the conductive gasket is lapped on the outer edge of the top of the fingerprint sensing chip;
the anti-static cover is covered outside the cover plate and the conductive gasket, the inner wall of the anti-static cover is pressed against the cover plate, a through hole aligned with the cover plate is formed in the top of the anti-static cover, the anti-static cover is connected to the ground of the substrate, and the side wall of the anti-static cover is arc-shaped; and
and the packaging layer is filled in the anti-static cover and covers the cover plate and the conductive gasket.
2. The fingerprint sensing chip package structure of claim 1, wherein the cover opening of the anti-static cover extends along a plate surface direction of the substrate to form a connection flange, the connection flange is disposed in a circle along a circumferential direction of the anti-static cover, and the connection flange is attached to the front surface of the substrate.
3. The fingerprint sensing chip package structure of claim 1, wherein the lower port of the through hole is formed with a circular groove, and an upper portion of the cover plate is fitted into the circular groove.
4. The fingerprint sensor chip package of claim 1, wherein the substrate is a rigid circuit board.
5. The fingerprint sensor chip package of claim 1, wherein the cover plate is a strengthened glass cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221853707.3U CN217955141U (en) | 2022-07-18 | 2022-07-18 | Fingerprint sensing chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221853707.3U CN217955141U (en) | 2022-07-18 | 2022-07-18 | Fingerprint sensing chip packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217955141U true CN217955141U (en) | 2022-12-02 |
Family
ID=84223200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221853707.3U Active CN217955141U (en) | 2022-07-18 | 2022-07-18 | Fingerprint sensing chip packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217955141U (en) |
-
2022
- 2022-07-18 CN CN202221853707.3U patent/CN217955141U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101503183B1 (en) | Finger sensor including encapsulating layer over sensing area and related methods | |
| US10090217B2 (en) | Chip packaging method and package structure | |
| KR101911710B1 (en) | Fingerprint recognition chip packaging structure and packaging method | |
| CN103886299B (en) | A kind of encapsulating structure of capacitive fingerprint sensing device | |
| US10108837B2 (en) | Fingerprint recognition chip packaging structure and packaging method | |
| US20180129848A1 (en) | Chip packaging structure and packaging method | |
| KR20170134585A (en) | Chip packaging method and chip packaging structure | |
| CN104794427B (en) | Fingerprint identification device, touch screen and terminal device | |
| US20220269918A1 (en) | Smart card for recognizing fingerprint | |
| CN104794428A (en) | Fingerprint recognition device, touch screen and terminal equipment | |
| CN217955141U (en) | Fingerprint sensing chip packaging structure | |
| CN109299637A (en) | Fingerprint mould group and fingerprint recognition panel equipped with the fingerprint mould group | |
| CN111191635A (en) | Fingerprint identification module and fingerprint identification display device | |
| KR20220032774A (en) | Smart ic substrate, smart ic module and ic card including the same | |
| JP2006074044A (en) | Chip module | |
| CN209057248U (en) | Protective film, display device and electronic equipment | |
| CN111240513B (en) | Protection structure for reverse folding part of display | |
| KR20140052539A (en) | Fingerprint sensor package and portable electronic device having the same | |
| KR20170126337A (en) | Fingerprint recognition sensor package and method of manufacturing the same | |
| CN207458083U (en) | Fingerprint recognition panel and touch-screen | |
| TWM504287U (en) | Touch panel with fingerprint identification function | |
| CN217719563U (en) | Packaging structure of fingerprint identification chip | |
| CN220357617U (en) | Fingerprint sensing chip's encapsulation apron, fingerprint chip | |
| CN210742964U (en) | Wafer-level ultrasonic chip device | |
| CN109800620A (en) | Fingerprint recognition panel and touch screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |