CN103942530A - Fingerprint induction device with anti-fake function - Google Patents
Fingerprint induction device with anti-fake function Download PDFInfo
- Publication number
- CN103942530A CN103942530A CN201410074179.5A CN201410074179A CN103942530A CN 103942530 A CN103942530 A CN 103942530A CN 201410074179 A CN201410074179 A CN 201410074179A CN 103942530 A CN103942530 A CN 103942530A
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- Prior art keywords
- routing
- packaging
- electrode
- plastic cement
- insulation course
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
Abstract
A fingerprint induction device with the anti-fake function at least comprises a packaging substrate, a sensing wafer, a packaging bonded wire, a wire bonding electrode and a plastic insulating layer, wherein the sensing wafer is arranged on the packaging substrate and used for sensing approach information of the finger; the wire bonding electrode is composed of a wire bonding wire section and an electric conduction layer; the packaging substrate, the sensing wafer, the packaging bonded wire and the wire bonding electrode are packaged and covered with the plastic insulating layer. The fingerprint induction device has the advantages that the finger does not need to make direct contact with an inductor, and a fingerprint can be induced, electric shock emitting charges are exposed out of the surface of the fingerprint induction device and reach the finger, the charges are received by the built-in sensing wafer to obtain a 3D image of the fingerprint, the fingerprint induction device is provided with the coupling electrode with the appearance concealed, the packaging cost can be effectively reduced, overall beauty of the inductor can be controlled, and the size of the inductor is reduced.
Description
Technical field
The present invention relates to the anti-fraud functional fingerprint induction installation of a kind of fingerprint inductive module, particularly a kind of tool and do not need to point direct contact induction wafer, can sense the fingerprint induction installation of fingerprint.
Background technology
In modern society, often can run into the situation of identity authentication, for example, use passport status examination & verification when the use status of credit card is audited, gone abroad.Generally speaking, this status examination & verification is to carry out in the mode of comparatively coarse desk checking, the status examination & verification of for example credit card is the foundation using handwriting signature as examination & verification, and the use passport status of going abroad examination & verification is that comparison user's complexion and photo are as foundation.But the possibility of such status comparison mode existentially forgeable.Therefore manufacturer is then applied to fingerprint inductor and need to carries out the occasion of status comparison, the fingerprint aligning device even if the device that uses traditional fingerprint aligning device to be also very easy to use forgery is out-tricked.
Except the optics of common employing is taken the photograph phase mode print bidimensional image, also has a kind of semicoductor capacitor formula fingerprint inductor, such fingerprint inductor has a sensing chip, and user can, by the sensing element on the direct contact induction sheet of finger, allow sensing element detect line peak and the line paddy of finger print; By this, sensing element can be complete detect user's fingerprint pattern, to confirm user's status.But its sensing chip is outside being exposed to, therefore the sensing chip of fingerprint inductor is easy to be subject to static and artificial destruction or finger and buries dirt, and cause responding to malfunctioning, if and the sensing chip of fingerprint inductor bears the direct face contact of finger for a long time, also can cause sensing chip wearing and tearing, cannot fetching finger mark information.
Summary of the invention
The present invention is the defect existing according to prior art, the one proposing has anti-fraud functional fingerprint induction installation, it does not need to point direct contact induction device, can sense fingerprint, expose electrode transmitting electric charge to finger by fingerprint induction installation surface, the 3D image that is received electric charge and obtained simultaneously fingerprint by built-in sensing wafer, has the hiding lotus root composite electrode of outward appearance, can effectively reduce packaging cost, also can control the overall appearance of sensor, the size of dwindling sensor.
Of the present invention a kind ofly have anti-fraud functional fingerprint induction installation to realize fingerprint detection be that two groups of coupling electrodes that comprise by it are realized, wherein one group of corium that is finger is gone up and seen through to transmission electric charge to finger reflexes to finger surface, separately have one group to be receiver, the current potential, resistance or the temperature that receive finger reach the true and false of distinguishing finger.
One of the present invention has anti-fraud functional fingerprint induction installation and at least comprises: base plate for packaging, sensing wafer, packaging and routing, routing electrode, plastic cement insulation course; Described sensing wafer is arranged on base plate for packaging, for the information that approaches of sensing finger; Described routing electrode is made up of routing line segment and conductive layer; Described packaging and routing connection encapsulation substrate and sensing wafer; Described routing line segment is electrically connected sensing wafer and base plate for packaging; Described plastic cement insulation course encapsulation covers base plate for packaging, sensing wafer, packaging and routing and routing electrode; A part for described routing line segment is exposed from the upper surface of plastic cement insulation course; Described plastic cement insulation course upper surface need arrange conductive layer and with routing segment link, as with the surface of finger contact.When finger contact lotus root composite electrode as one group of transmitting electric charge during to the metal level of molding bed of material upper surface.
Brief description of the drawings
Fig. 1 is structural representation Fig. 1 of fingerprint induction installation of the present invention;
Fig. 2 is structural representation Fig. 2 of fingerprint induction installation of the present invention;
Fig. 3 is structural representation Fig. 3 of fingerprint induction installation of the present invention;
Fig. 4 is structural representation Fig. 4 of fingerprint induction installation of the present invention.
Embodiment
For more detailed description technical solutions according to the invention, further set forth by following enforcement.
In embodiment of the present invention, described fingerprint induction installation is in order to finger sensing fingerprint F.
In semiconductor package process, generally used routing, so-called routing is generally the aluminium/gold/copper/silver-colored line of very fine, and its line is through being generally 20 to 50 microns, has high conductivity and naked eyes visual characteristic hardly.Technical solutions according to the invention utilize the characteristic of routing, allow one end of routing expose and mix in the molding bed of material, drive or for the electric connection point of sensing signal electrostatic defending to be provided or to provide; Enclose the thin metal of plating one deck in routing electrode part, to strengthen strengthening the induction area driving simultaneously.
Because routing has naked eyes visual characteristic hardly, therefore one of them characteristic of technical solutions according to the invention is formed in one, and does not have two different materials and assembles the error open defect causing, traditional sheet metal electrode can only provide simple function in addition, for example electrostatic defending or driving signal, technical solutions according to the invention, adopt routing to make routing electrode, can be that many routings interconnect, also can there is part routing to carry out separately different functions, for example can design it and have the function of sensing, for example measure mode by impedance and can be used as with the resistance of confirming skin the input that prevents prosthetic finger, utilize the mode of routing to make routing electrode, allow routing electrode can with finger contact, the signal lotus root providing and point is closed, for carrying out electrostatic protection function and/or driving sensing function to use, secondly, cover a conductor layer by one end of the routing electrode exposing, metal level, conductive adhesive layer etc. in this way, can effectively strengthen and the contact area of pointing, and has good identity again.
As shown in Figure 1, a kind of fingerprint induction installation of the present invention at least comprises a base plate for packaging 10, a sensing wafer 20, a plurality of packaging and routings 30, at least one routing electrode 40 and a plastic cement insulation course 50.
Described sensing wafer 20 is arranged on base plate for packaging 10, for the information that approaches of sensing finger F, as the line peak of finger and line paddy and the approaching information of sensing wafer 20, the particularly information of distance, comprehensive these approaching information, can obtain the pattern of hand fingerprint peaks and line paddy, namely the fingerprint pattern of common name.
A plurality of packaging and routings 30 by the weld pad of base plate for packaging 10 19 respectively routing be connected to the weld pad 29 of sensing wafer 20, for transmit power supply or electric signal between base plate for packaging 10 and sensing wafer 20.
Described routing electrode 40 is electrically connected to sensing wafer 20 and base plate for packaging 10 or one of at least described sensing wafer 20 and base plate for packaging 10.The quantity of described routing electrode 40 is not limited especially, as long as can reach good signal transmission.
The formation technology of described packaging and routing 30 adopts existing technology.It needs to be noted: in routing encapsulation process, described packaging and routing 30 can form with routing electrode 40 simultaneously, and the camber line vertical height of described packaging and routing 30 is not higher than 80 microns of sensing wafer upper surfaces; The vertical summit of camber line of described routing electrode 40 contacts higher than the camber line vertical height of packaging and routing 30 and with plastic cement insulation course 50 upper surfaces.
The vertical summit of the camber line optimum height of described routing electrode 40 is between 100 to 200 microns of sensing wafer upper surfaces.
Connected mode for routing electrode 40 can be carried out flexible design as required, and the connection sensing wafer 20 of the line electrode 40 of fighting each other below and/or the mode of base plate for packaging 10 conduct further description.
The connected mode one of routing electrode 40:
As shown in Figure 2, described plastic cement insulation course 50 covers base plate for packaging 10, sensing wafer 20, packaging and routing 30 and routing electrode 40 and forms the molding bed of material; The two ends 40A of described routing electrode 40 and 40B are all connected on base plate for packaging 10, and the camber line top of routing electrode is exposed to the upper surface 51 of plastic cement insulation course 50, and the upper surface 51 of plastic cement insulation course 50 is as a surface contacting with finger F.When finger F touches the upper surface 51 of plastic cement insulation course 50, can be bonded to the end face that routing electrode 40 exposes by direct lotus root, meanwhile, finger F also can contact or approach the sensing face of sensing wafer 20.Thus, technical solutions according to the invention can provide electrostatic protection function and/or drive sensing function to use.
The connected mode two of routing electrode 40:
As shown in Figure 2, described routing electrode 40 can also be an open routing line segment 41, the first end 41A of described routing line segment 41 is connected with base plate for packaging 10 by weld pad, and the second end 41B of described routing line segment 41 is connected with the weld pad that is arranged on plastic cement insulation course 50 upper surfaces 51.
The connected mode three of routing electrode 40:
As shown in Figure 3, routing electrode 40 or routing line segment 41 between described base plate for packaging 10 and the upper surface 51 of plastic cement insulation course 50 can be many groups, to increase the sensitivity of fingerprint induction installation.
The connected mode four of routing electrode 40:
As shown in Figure 4, have a groove 45 on the upper surface 51 of described plastic cement insulation course 50, the two ends of described electric wire electrode 40 are connection encapsulation substrate 10 and described groove 45 respectively, in described groove 45, fills up conductive layer.
No matter how the connected mode of electrode routing 40 changes, and described plastic cement insulation course 50 upper surfaces 51 all need wire mark or vacuum coating or electroplated conductive layer, and described conductive layer is electrically connected to routing electrode or routing line segment.
Further, described routing electrode 40 is decomposed, it at least comprises: routing line segment 41 and conductive layer; Described routing line segment is soldered at least one of sensing wafer 20 and base plate for packaging 10; Described conductive layer is positioned at the upper surface of plastic cement insulation course 50 and is electrically connected to routing line segment 41.
The preparation method of induction fingerprint device of the present invention is:
The first step: sensing wafer 20 is arranged on base plate for packaging 10;
Second step: utilize a plurality of packaging and routings 30 that base plate for packaging 10 routings are connected to sensing wafer 20, and utilize routing electrode to be electrically connected at least one of sensing wafer 20 and base plate for packaging 10;
The 3rd step: use plastic cement insulation course 50 to cover base plate for packaging 10, sensing wafer 20, packaging and routing 30 and routing electrode, and an end points of routing electrode is exposed from the upper surface of plastic cement insulation course 50;
The 4th step: the upper surface of plastic cement insulation course 50 is returned to mill, make the upper surface exposed portions serve routing of plastic cement insulation course 50;
The 5th step: adopt wire mark or vacuum coating or plating mode, at described plastic cement insulation course 50 upper surfaces, conductive layer is set, and described conductive layer is electrically connected to routing electrode.
Utilize technical solutions according to the invention, can form taking routing electrode 40 as medium, use for electrostatic protection function and/or driving sensing function.Because routing electrode 40 and packaging and routing 30 can directly complete in encapsulation factory, can effectively dwindle the volume of fingerprint acquisition apparatus.Even use a lot of routing electrodes 40, because its wire diameter is quite small, it is that naked eyes are visual hardly, and mixes in plastic cement insulation course, almost only demonstrates the outward appearance of single moulding compound, can not show routing, can allow product appearance more beautiful.
In technical solutions according to the invention, by one groove being set at plastic cement insulation course 50 upper surfaces, and use conductive to fill up the groove of plastic cement insulation course 50, effectively like this avoid plastic cement insulation course 50 upper surfaces that weld pad is set and affect the planarization of finger contact face.Simultaneously due to conductive layer higher than plastic cement insulation course 50, and conductive layer is covered in packaging and routing 30 tops, can cover the extraneous noise for packaging and routing 30 and disturb.
The function of utilizing technical solutions according to the invention routing electrode 40 can be designed to it to have sensing, for example two routing electrodes 40 touch finger F simultaneously, measure mode to confirm the resistance of skin by impedance, can be used as the input that prevents prosthetic finger; Also treatment circuit and routing electrode 40 can be seen through and measure the various physical features of finger F, as temperature, sliding speed, electrostatic belt electric weight etc.It should be noted that: above-mentioned antistatic protection function, driving signal provides function and physical features measurement brake to be independently present in fingerprint sensing device, or all or part of being jointly present in fingerprint sensing device.
Of the present invention a kind ofly have anti-fraud functional fingerprint induction installation to realize fingerprint detection be that two groups of coupling electrodes that comprise by fingerprint induction installation are realized, first group of electrode is routing electrode, routing electrode mainly complete send electric charge to finger go up and see through point corium reflex to finger surface, second group of receiver that electrode is made up of packaging and routing connection sensing wafer and base plate for packaging, main current potential, resistance or the temperature that receives finger reaches the true and false of distinguishing finger.
A kind of fingerprint induction installation of the present invention is in the time of practical application, and user's finger can touch the plastic cement insulation course 50 of fingerprint induction installation; First group of square wave meeting directive finger that routing limit 40 is launched, and the energy of square wave can be through the reflection of finger epidermis lines, and this energy can penetrate plastic cement insulation course 50 via the contact between user's finger and fingerprint induction installation; When the energy of square wave is pointed after reflection certainly, can be by the 20 active receptions of induction wafer.When induction wafer 20 senses after the square wave of reflection, can calculate information or the energy of the square wave being reflected back, and obtain the lines pattern of user's finger print F.When induction wafer 20 obtains after user's the lines pattern of finger print F, the lines pattern of finger print F can be passed to electronic processing wafer, carry out the functions such as status identification, data encryption, data storage, financial function, Electronic Signature for electronic processing wafer.
Claims (9)
1. have an anti-fraud functional fingerprint induction installation, it is characterized in that, described fingerprint induction installation at least comprises: base plate for packaging, sensing wafer, packaging and routing, routing electrode and plastic cement insulation course; Described plastic cement insulation course encapsulation covers base plate for packaging, sensing wafer, packaging and routing and routing electrode;
Described packaging and routing connection encapsulation substrate and sensing wafer;
Described sensing wafer is arranged on base plate for packaging, for the information that approaches of sensing finger;
Described routing electrode is made up of routing line segment and conductive layer;
Described routing line segment is electrically connected sensing wafer and base plate for packaging, and a part for routing line segment is exposed from the upper surface of plastic cement insulation course;
The plastic cement insulation course upper surface that described conductive layer is arranged at and with routing segment link.
2. one as claimed in claim 1 has anti-fraud functional fingerprint induction installation, it is characterized in that: the two ends of described routing electrode all can be connected on base plate for packaging.
3. one as claimed in claim 1 has anti-fraud functional fingerprint induction installation, it is characterized in that: one end of described routing electrode is connected on base plate for packaging, and one end is connected in the upper surface of plastic cement insulation course.
4. one as claimed in claim 1 has anti-fraud functional fingerprint induction installation, it is characterized in that: adopt wire mark or vacuum coating or plating mode, at described plastic cement insulation course upper surface, conductive layer is set, and described conductive layer is electrically connected to routing electrode.
5. one as claimed in claim 1 has anti-fraud functional fingerprint induction installation, it is characterized in that: described plastic cement insulation course upper surface can also arrange a groove, in described groove, fills up conductive material, and described conductive material is electrically connected with routing line segment.
6. as required the one as described in 1 to there is anti-fraud functional fingerprint induction installation in power, it is characterized in that: the camber line vertical height of described packaging and routing is not higher than 80 microns of sensing wafer upper surfaces; The vertical summit of camber line of described routing electrode contacts higher than the camber line vertical height of packaging and routing and with plastic cement insulation course upper surface.
7. as required the one as described in 1 to there is anti-fraud functional fingerprint induction installation in power, it is characterized in that: the vertical summit of the camber line optimum height of described routing electrode 40 is between 100 to 200 microns of sensing wafer upper surfaces.
8. preparing a kind of technique with anti-fraud functional fingerprint induction installation is as claimed in claim 1:
The first step: sensing wafer is arranged on base plate for packaging;
Second step: utilize a plurality of packaging and routings that base plate for packaging routing is connected to sensing wafer, and utilize routing electrode to be electrically connected at least one of sensing wafer and base plate for packaging;
The 3rd step: use plastic cement insulation course to cover base plate for packaging, sensing wafer, packaging and routing and routing electrode, and an end points of routing electrode is exposed from the upper surface of plastic cement insulation course;
The 4th step: the upper surface of plastic cement insulation course is returned to mill, make the upper surface exposed portions serve routing of plastic cement insulation course;
The 5th step: adopt wire mark or vacuum coating or plating mode, at described plastic cement insulation course upper surface, conductive layer is set, and described conductive layer is electrically connected to routing electrode.
9. as claimed in claim 1 a kind ofly have anti-fraud functional fingerprint induction installation to realize fingerprint detection be that two groups of coupling electrodes that comprise by fingerprint induction installation are realized, first group of electrode is routing electrode, routing electrode mainly complete send electric charge to finger go up and see through point corium reflex to finger surface, second group of receiver that electrode is made up of packaging and routing connection sensing wafer and base plate for packaging, main current potential, resistance or the temperature that receives finger reaches the true and false of distinguishing finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410074179.5A CN103942530A (en) | 2014-03-03 | 2014-03-03 | Fingerprint induction device with anti-fake function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410074179.5A CN103942530A (en) | 2014-03-03 | 2014-03-03 | Fingerprint induction device with anti-fake function |
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| Publication Number | Publication Date |
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| CN103942530A true CN103942530A (en) | 2014-07-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410074179.5A Pending CN103942530A (en) | 2014-03-03 | 2014-03-03 | Fingerprint induction device with anti-fake function |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105335687A (en) * | 2014-07-25 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | Fingerprint identification chip and manufacturing method therefor |
| CN106206331A (en) * | 2015-05-08 | 2016-12-07 | 华邦电子股份有限公司 | Stacked package device and manufacture method thereof |
| WO2017206035A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing module, biosensing chip, and electronic device |
| CN107785330A (en) * | 2016-08-31 | 2018-03-09 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| US9984275B2 (en) | 2016-03-30 | 2018-05-29 | Elan Microelectronics Corporation | Fingerprint sensor having electrostatic discharge protection |
| CN108428675A (en) * | 2017-02-13 | 2018-08-21 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| US10395087B2 (en) | 2016-05-30 | 2019-08-27 | Shenzhen Xinwei Technology Co, Ltd. | Biometric sensing chip and electronic device using same |
| CN111554583A (en) * | 2020-04-28 | 2020-08-18 | 深圳芯邦科技股份有限公司 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
-
2014
- 2014-03-03 CN CN201410074179.5A patent/CN103942530A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105335687A (en) * | 2014-07-25 | 2016-02-17 | 中芯国际集成电路制造(上海)有限公司 | Fingerprint identification chip and manufacturing method therefor |
| CN106206331A (en) * | 2015-05-08 | 2016-12-07 | 华邦电子股份有限公司 | Stacked package device and manufacture method thereof |
| CN106206331B (en) * | 2015-05-08 | 2019-02-01 | 华邦电子股份有限公司 | Stacked package device and its manufacturing method |
| US9984275B2 (en) | 2016-03-30 | 2018-05-29 | Elan Microelectronics Corporation | Fingerprint sensor having electrostatic discharge protection |
| WO2017206035A1 (en) * | 2016-05-30 | 2017-12-07 | 深圳信炜科技有限公司 | Biosensing module, biosensing chip, and electronic device |
| US10395087B2 (en) | 2016-05-30 | 2019-08-27 | Shenzhen Xinwei Technology Co, Ltd. | Biometric sensing chip and electronic device using same |
| CN107785330A (en) * | 2016-08-31 | 2018-03-09 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN108428675A (en) * | 2017-02-13 | 2018-08-21 | 矽品精密工业股份有限公司 | Package structure and method for fabricating the same |
| CN111554583A (en) * | 2020-04-28 | 2020-08-18 | 深圳芯邦科技股份有限公司 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
| CN111554583B (en) * | 2020-04-28 | 2022-05-31 | 深圳芯邦科技股份有限公司 | Fingerprint chip module preparation method, fingerprint chip module and electronic equipment |
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Application publication date: 20140723 |