CN209471455U - A kind of touching sensory package, fingerprint Identification sensor and electronic equipment - Google Patents

Abstract

The utility model belongs to fingerprinting detection technique field, provide a kind of touching sensory package, fingerprint Identification sensor and electronic equipment, the touching sensory package includes: to touch for incuding, and the multiple electrodes member of corresponding inductive signal is generated according to the touching；For fixing the first structure layer of multiple electrode members, wherein the first structure layer is equipped with multiple signal transmission lines, and multiple signal transmission lines connect one to one with multiple electrode members respectively；And the multiple interconnecting pieces to connect one to one with multiple signal transmission lines, by splitting fingerprint sensing electrode member mould group and sensing integrated chip mould group to form individually touching sensory package, achieve the purpose that the sensing area for increasing fingerprint Identification sensor using multiple touching sensory package combinations, large area fingerprint recognition and higher accuracy of identification can not be compatible with simultaneously by solving the problems, such as that existing fingerprint sensor technology exists.

Description

A kind of touching sensory package, fingerprint Identification sensor and electronic equipment

Technical field

The utility model belongs to fingerprinting detection technique field more particularly to a kind of touching sensory package, fingerprint recognition sensing Device and electronic equipment.

Background technique

With the development of science and technology fingerprint sensor is widely used in various electronic equipments, the type of fingerprint sensor is also Respectively there is superiority and inferiority, for example, having larger by the acquisition of optical sensing principle using the fingerprint sensor of optical finger print recognition principle Capture area the advantages of, but have simultaneously limited by optical path occur distortion, influenced by finger clean level capture, optics shines The disadvantages of bright and imaging system power is higher, volume is big；And the semiconductor chip using semiconductor identification, its advantage is that Small power consumption, small in size, image fault is small, it is small to be influenced by finger clean level, however has and limited no legal system by manufacture of semiconductor The disadvantage of standby large area fingerprint Identification sensor, wet finger capture exception.

Therefore, existing fingerprint sensor technology exists can not be compatible with large area fingerprint recognition and higher identification essence simultaneously The problem of spending.

Utility model content

The purpose of this utility model is to provide a kind of touching sensory package, fingerprint Identification sensor and electronic equipment, Large area fingerprint recognition and higher accuracy of identification can not be compatible with simultaneously by aiming to solve the problem that existing fingerprint sensor technology exists Problem.

In order to solve the above-mentioned technical problem, the utility model embodiment provides a kind of touching sensory package, the touching Sensory package includes:

It is touched for incuding, and generates the multiple electrodes member of corresponding inductive signal according to the touching；

For fixing the first structure layer of multiple electrode members, wherein multiple electrode members are set to first knot First face of structure layer, the first structure layer be equipped with multiple signal transmission lines, multiple signal transmission lines respectively with it is more A electrode member connects one to one；And

The multiple interconnecting pieces to connect one to one with multiple signal transmission lines, wherein multiple interconnecting pieces are set In the second face of the first structure layer.

Optionally, the first structure layer includes first substrate and the first dielectric structure layer, and the first of the first substrate Face is the first face of the first structure layer, first face paste in the second face of the first substrate and first dielectric structure layer It closes, the second face of first dielectric structure layer is the second face of the first structure layer；

The signal transmission line includes extending vertically area and horizontal extension area；

The first substrate, which is equipped with, extends vertically groove correspondingly with the electrode member, described to extend vertically in groove Wall is equipped with insulating layer, and described extend vertically in groove extends vertically area, multiple first ends for extending vertically area equipped with described It connects one to one with multiple electrode members；

First dielectric structure layer be equipped with multiple horizontal extension areas, the first end in multiple horizontal extension areas with it is multiple The second end for extending vertically area connects one to one, the second end in multiple horizontal extension areas and multiple interconnecting pieces It connects one to one, multiple interconnecting pieces are set to the second face of first dielectric structure layer.

Optionally, the touching sensory package further include:

Primer set on the second face of the first structure layer；And

The second structure sheaf being fixedly connected by the primer with the first structure layer, second structure sheaf are equipped with more It is a to receive the inductive signal, and the corresponding signal processing unit for detecting signal is converted by the inductive signal, wherein it is more A signal processing unit connects one to one with multiple interconnecting pieces.

Optionally, the electrode member includes scan electrode and receiving electrode；

The signal processing unit includes:

It is electrically connected with the scan electrode, for controlling the scanning circuit of the scan electrode output scanning signal；With And

It is electrically connected with the receiving electrode, for receiving the reception circuit of the inductive signal.

Optionally, between the spacing between the adjacent signal processing unit is less than between adjacent electrode member Away from.

Optionally, the touching sensory package includes:

Multiple output weld pads set on the second face of the first structure layer, wherein multiple output weld pads and second Multiple signal output ends of structure sheaf connect one to one.

Optionally, the touching sensory package further include:

Set on the first face of the first structure layer, for covering the protective layer of multiple electrode members.

Optionally, the touching sensory package further include:

For covering the molding compound of second structure sheaf.

The utility model embodiment additionally provides a kind of fingerprint Identification sensor, and the fingerprint Identification sensor includes:

For generating the fingerprint image processing module of finger print information according to the inductive signal；And

The touching sensory package as described in any one of the above embodiments of multiple sequentials, wherein the touching sensory package with The detection signal processing module is electrically connected.

The utility model embodiment additionally provides a kind of electronic equipment with fingerprint identification function, comprising:

Fingerprint Identification sensor as described in any one of the above embodiments；And

For obtaining the finger print information, and export according to the finger print information processor of corresponding control instruction.

The utility model embodiment provides a kind of touching sensory package, fingerprint Identification sensor and electronic equipment, institute Stating touching sensory package includes: to touch for incuding, and the multiple electrodes member of corresponding inductive signal is generated according to the touching； For fixing the first structure layer of multiple electrode members, wherein multiple electrode members are set to the of the first structure layer On one side, the first structure layer be equipped with multiple signal transmission lines, multiple signal transmission lines respectively with multiple electricity Extremely member connects one to one；And the multiple interconnecting pieces to connect one to one with multiple signal transmission lines, wherein multiple The interconnecting piece be set to the first structure layer the second face, by by fingerprint sensing electrode member mould group and sensing integrated chip mould Group is split to form individually touching sensory package, is reached and is combined using multiple touching sensory packages to increase fingerprint recognition sensing The purpose of the sensing area of device, solve existing fingerprint sensor technology exist can not be compatible with simultaneously large area fingerprint recognition with The problem of higher accuracy of identification.

Detailed description of the invention

Fig. 1 is the structural schematic diagram for the touching sensory package that one embodiment of the utility model provides；

Fig. 2 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Fig. 3 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Fig. 4 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Fig. 5 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Fig. 6 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Fig. 7 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Fig. 8 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Fig. 9 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Figure 10 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Figure 11 is the structural schematic diagram for the touching sensory package that another embodiment of the utility model provides；

Figure 12 is the structural schematic diagram of fingerprint Identification sensor provided in this embodiment.

Specific embodiment

In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only used to explain The utility model is not used to limit the utility model.

In the description of the present invention, it should be understood that term " first ", " second " are used for description purposes only, and It cannot be understood as indicating or implying relative importance or implicitly indicate the quantity of indicated technical characteristic.It defines as a result, The feature of " first ", " second " can explicitly or implicitly include one or more of the features.

Fig. 1 is a kind of structural schematic diagram for touching sensory package provided by the embodiment of the utility model, as shown in Figure 1, this Touching sensory package in embodiment includes:

It is touched for incuding, and generates the multiple electrodes member 50 of corresponding inductive signal according to the touching；

For fixing the first structure layer 30 of multiple electrode members, wherein multiple electrodes members 50 are set to described the First face of one structure sheaf 30, the first structure layer 30 are equipped with multiple signal transmission lines 40, multiple signal transmssion lines Road connects one to one with multiple electrode members respectively；And

The multiple interconnecting pieces 44 being connect one by one with multiple signal transmission lines, wherein multiple interconnecting pieces 44 are set In the second face of the first structure layer 30.

In the present embodiment, touching sensory package is mainly first by being set to the multiple electrodes in the first face of first structure layer 30 Outside touching is incuded, and generates corresponding inductive signal, when touching sensory package applied in fingerprint recognition, induction Signal includes the first inductive signal and the second inductive signal, multiple electrodes member sequential in the first face of first structure layer 30, When finger F touching, the wave crest of finger print touches corresponding electrode member 50, so that corresponding first inductive signal is generated, And there are a certain distance between the trough and electrode member 50 of finger print, therefore 50 generation of electrode corresponding with trough member is corresponding The second inductive signal, touching each of sensory package electrode member 50 generates corresponding induction when finger is touched and believes Number, the fingerprint signal processing chip of rear end receives multiple inductive signals so as to obtain corresponding finger print information.Another party Face is only used for generating corresponding inductive signal in touching by touching sensory package in this present embodiment, and can be by the Signal transmission line 40 in one structure sheaf 30 exports inductive signal as the first 50 corresponding interconnecting pieces 44 of electrode, then passes through The fingerprint signal processing chip that interconnecting piece 44 is connected to rear end passes multiple touchings so as to not limited by manufacturing process Sense component is applied in combination to form large area fingerprint induction zone, and corresponding inductive signal is then transmitted to finger by interconnecting piece 44 It is handled in line signal processing chip, has the advantages that low-power consumption, capture area are big, at low cost, not only can solve optics There is distortion, is influenced capture, illumination optical and imaging by finger clean level in existing limited by optical path of acquisition fingerprint sensor The power of system is higher, bulky problem, can also solve that semiconductor identification fingerprint Identification sensor is existing partly to be led System degree system can not prepare the problem of large area fingerprint Identification sensor, wet finger capture exception.

In one embodiment, the range of the pitch between adjacent electrode member 50 is between 25 microns to 80 microns.

In one embodiment, referring to fig. 2, the first structure layer 30 includes first substrate 31 and the first dielectric structure layer 32, the first face of the first substrate 31 is the first face of the first structure layer 30, the second face of the first substrate 31 with First face paste of first dielectric structure layer 32 is closed, and the second face of first dielectric structure layer 32 is the first structure layer 30 the second face；

The signal transmission line includes extending vertically area 42 and horizontal extension area 41；

The first substrate 31 is equipped with extends vertically groove with electrode member 50 correspondingly, it is described extend vertically it is recessed Slot inner wall is equipped with insulating layer 42A, it is described extend vertically area 42 be set to it is described extend vertically in groove, it is multiple described to extend vertically area 42 first end connects one to one with multiple electrode members 50；

First dielectric structure layer 32 is equipped with multiple horizontal extension areas 41, the first end in multiple horizontal extension areas 41 Connect one to one with multiple second ends for extending vertically area 42, the second end in multiple horizontal extension areas 41 with it is multiple The interconnecting piece 44 connects one to one, and multiple interconnecting pieces 44 are set to the second face of first dielectric structure layer 32.

In one embodiment, the first dielectric structure layer 32 can be an accurate intermediary layer, which can be print Printed circuit board, silicon intermediary layer, glass, ceramic material or other materials are formed by intermediary layer.Optionally, using silicon middle-class The technology that can use semiconductor fabrication process forms the first dielectric structure layer 32.

In one embodiment, the first dielectric structure layer 32 can be deposited by semiconductive thin film or photoetching technique is the It is formed on one substrate 31.Wherein, the first dielectric structure layer 32 can be used for protection signal transmission route 40, and be situated between to being set to first Signal transmission line 40 in electric structure sheaf 32 plays the role of Auxiliary support.

In one embodiment, referring to Fig. 3, each described signal transmission line 40 extends vertically 42 He of area including multiple Multiple horizontal extension areas 41, wherein first dielectric structure layer 32 is equipped with multiple horizontal extension areas 41 and at least one hangs down Straight extension area 42, multiple horizontal extension areas 41 are stacked with area 42 is extended vertically, and are sequentially connected, to form signal transmssion line Road, so that the inductive signal that electrode member 50 generates is transmitted to interconnecting piece 44.

In one embodiment, referring to fig. 4, the touching sensory package further include:

Primer 48 set on the second face of the first structure layer；And

The second structure sheaf 10 being fixedly connected by the primer 48 with the first structure layer 30, second structure sheaf 10 are equipped with multiple reception inductive signals, and convert the inductive signal to the signal processing unit of corresponding detection signal 20, wherein multiple signal processing units 20 connect one to one with multiple interconnecting pieces 44.

In the present embodiment, the input signal pin of signal processing unit 20 is by signal transmission line 40 and set on first The electrode member 50 in the first face of structure sheaf 30 is electrically connected, specifically, each signal transmission line 40 includes orthogonal At least one horizontal extension 41 and at least one extend vertically area 42, the electrode member 50 set on the first face of first structure layer 30 Corresponding inductive signal is transported to corresponding signal processing unit 20, signal by signal transmission line 40 after sensing touching Processing unit 20 is handled the inductive signal after receiving the inductive signal, and generates corresponding output signal.Another party Face can be covered and be supported to interconnecting piece 44 by filling primer between first structure layer 30 and the second structure sheaf 10.

In one embodiment, shown in Figure 5, second structure sheaf 10 includes being used to form signal processing unit 20 The second substrate 11, and be electrically connected with signal processing unit 20, for receiving detection signal and will test signal and be converted to The fingerprint signal processing unit 12 of corresponding data image signal, wherein the second substrate 11 can be semiconductor substrate or print Printed circuit board, signal processing unit 20 are formed in the second substrate 11, which can be sensing integrated circuit Chip.

In one embodiment, fingerprint signal processing unit 12 can be the whole control chip of data, and the whole control chip of the data connects It receives by the progress data preparation of multiple detection signals after the detection signal that each signal processing unit 20 exports, it is corresponding to export Information in fingerprint.

In one embodiment, shown in Figure 5, it is also set between signal processing unit 20 and interconnecting piece 44 corresponding to it There is the second horizontal extension area 401, interconnecting piece 44 carries out letter with corresponding signal processing unit 20 by the second horizontal extension area 401 Number transmission.

In one embodiment, signal processing unit 20 can be sensing IC chip, the sensing ic core The signal receiving end of piece is connected by signal transmission line 40 with corresponding electrode member 50, which receives The inductive signal is handled after the inductive signal, and generates corresponding output signal.

In one embodiment, shown in Figure 6, the electrode member 50 includes scan electrode 51 and receiving electrode 52；

The signal processing unit 20 includes:

It is electrically connected with the scan electrode 51, the scanning circuit of scanning signal is exported for controlling the scan electrode 51 21；And

It is electrically connected with the receiving electrode 52, for receiving the reception circuit 22 of the inductive signal.

Specifically, in the present embodiment, multiple 51 sequentials of scan electrode, and pass through corresponding signal transmission line 40 It connects one to one with multiple scanning circuits 21 in the second structure sheaf 10, likewise, 52 sequential of multiple receiving electrodes, and It is connected one to one by corresponding signal transmission line 40 and multiple reception circuits 22 in the second structure sheaf 10, wherein letter Number transmission line 40 is sequentially electrically connected formation by multiple horizontal extension areas 41 and multiple areas 42 that extend vertically.

In one embodiment, multiple scan electrodes 51 and the orthogonal intertexture of multiple receiving electrodes 52, the vertical intertexture For perpendicularly across but do not generate electrical connection, specifically, the connecting line between multiple scan electrodes 51 and multiple receiving electrodes 52 Between connecting line be located at different metal layers so that the connecting line between multiple scan electrodes 51 and multiple receptions Connecting line between electrode 52 perpendicularly across but do not generate electrical connection.

In one embodiment, each scanning circuit 21 in signal processing unit 20 can be by sweeping with corresponding a line Electrode electrical connection is retouched, to execute scanning motion to exporting scanning signal, each reception circuit 22 in signal processing unit 20 It can be by being electrically connected with corresponding column receiving electrode 52, to execute reception movement to obtain inductive signal.

In one embodiment, scan electrode 51 and receiving electrode 52 can be arranged in array in a manner of square, Array can be arranged in by the way of diamond shape, to achieve the purpose that improve coverage rate.

In one embodiment, the spacing between the adjacent signal processing unit 20 is less than adjacent electrode member Spacing between 50.In the present embodiment, signal processing unit 20 and electrode member 50 be due to being located at different structure sheafs, The second dielectric structure layer 13 in second structure sheaf 10 can be different from the area of first structure layer 30, i.e. in the second structure sheaf 10 Silicon chip horizontal area it is different from the fingerprint sensing area of first structure layer 30, so as to by signal processing unit 20 The very little of volume design achievees the purpose that further to reduce cost.

For example, in one example, signal processing unit 20 senses integrated electricity using sensing IC chip array Road chip array is because be complete IC chip manufacturing process, therefore it is required that each sensing IC chip is each other Pitch is contracted to such as 25um, due to the pitch between electrode member 50 still maintain original product requirement specification (such as Commercial fingerprint acquisition apparatus requires at least 500dpi, indicates that the pitch of electrode member 50 is about 50um), since the utility model is implemented Signal transmission line 40 in example using diverging carries out the electric connection between electrode member 50 and signal processing unit 20, therefore, The sensing electrode member array area that the area of sensing IC chip array in the present embodiment forms only electrode member 50 1/4, so as to substantially save sensing IC chip cost.

Optionally, the sensing electrode member array that electrode member 50 is formed can be only by printed circuit board or IC manufacturing work The plain conductor of skill back segment is made, relative inexpensiveness, and can make biggish printed circuit board sensing electrode number Group and lower section are combined with multiple single stone-type IC chips.

It optionally, in one embodiment, can be by utilizing such as dimpling block (micro-bump) or flip (Flip- Chip) structure, which is mutually connected, is electrically connected sensing IC chip with electrode member, to be formed one-to-one It is corresponding.

Optionally, which can be 2 to 3 layers.

In one embodiment, referring to Fig. 7, the touching sensory package further include:

Set on the first face of the first structure layer 30, for covering the protective layer 33 of multiple electrode members 50.Pass through Protective layer is set in the first face of first structure layer 30, can be contaminated or damage in use to avoid electrode member 50 It is bad.

In one embodiment, between 0.1 micron and 60 microns, which can to protect the thickness of protective layer 33 Layer 33 impacts while guard electrode member 50 without the sensitivity to electrode member 50.

In one embodiment, the protective layer 33 includes dielectric material, hydrophobic material, oleophobic material and high dielectric material Any one or multinomial in material.

In one embodiment, shown in Figure 8, the touching sensory package further include:

For covering the molding compound 45 of second structure sheaf 10.Specifically, molding compound 45 is covered in the second structure Second face of layer 10, so that molding compound 45 is packaged the second structure sheaf 10, wherein the first of the second structure sheaf 10 It is closed by the second face paste of primer 48 and first structure layer 30 in face.

In one embodiment, molding compound 45 can be coated with first structure layer 30 and the second structure sheaf 10, thus right First structure layer 30 and the second structure sheaf 10 are fixed.

In one embodiment, package substrate can also be arranged in 45 surface of molding compound, can not only play protection molding The effect of the bed of material 45 can also play beautiful effect.

In one embodiment, the structure for the touching sensory package that Fig. 9 provides for one embodiment of the utility model is shown It is intended to, shown in Figure 9, the touching sensory package includes:

Multiple output weld pads 43 set on the second face of the first structure layer 30, wherein multiple output weld pads 43 It connects one to one with multiple signal output ends 13 of the second structure sheaf 10.

Specifically, in the present embodiment, multiple output weld pads 43 pass through corresponding horizontal extension area 403 and contact 404 It connects one to one with multiple signal output ends 13 of fingerprint signal processing unit 12, at this point, multiple electrodes member 50 is by candid photograph The corresponding inductive signal of information in fingerprint generation passes sequentially through corresponding signal transmission line 40 and interconnecting piece 44 is input to In signal processing unit 20, the inductive signal is converted corresponding detection signal by signal processing unit 20, and passes through fingerprint Received detection signal is converted corresponding data image signal by signal processing unit 12, and by multiple output contacts 13 with And the detection signal is transmitted to output weld pad 43 by output end 404 and corresponding horizontal extension area 403, wherein horizontal extension Area 403 is not in contact with each other with horizontal extension area 41.

In one embodiment, multiple signal processing units 20 in the second structure sheaf 10 can integrate collects in a sensing At in circuit chip, wherein each signal processing unit 20 can pass sequentially through corresponding with the signal processing unit 20 The inductive signal of 50 output of interconnecting piece 44 and 40 receiving electrode of signal transmission line member, and the inductive signal is converted into correspondence Detection signal export to fingerprint signal processing unit 12.

In one embodiment, shown in Figure 10, multiple output weld pads 43 pass through in tin ball 46 and printed circuit board 90 Circuit be attached, optionally, can be by molding compound if 10 surface of the second structure sheaf is covered with molding compound 45 45 setting grooves to expose the predeterminable area in the second face of first structure layer 30, and are arranged in the second face of first structure layer 30 The output weld pad 43 being connect with horizontal extension area 41.

In one embodiment, shown in Figure 11, multiple output weld pads 43 can also pass through connecting line 47 and printing electricity Road plate 90 connects, and optionally, can also be encapsulated connecting line 47 and output weld pad 43 by adhesive layer 80.

In one embodiment, a kind of fingerprint Identification sensor is present embodiments provided, Figure 12 is provided in this embodiment The structural schematic diagram of fingerprint Identification sensor, as shown in figure 12, the fingerprint Identification sensor includes:

For generating the fingerprint image processing module 902 of finger print information according to the inductive signal；And

The touching sensory package 901 as described in any of the above-described embodiment of multiple sequentials, wherein the touching passes Feel component 901 and the fingerprint image processing module 902 is electrically connected.

In the present embodiment, it can not contract by using touching sensory package 901 described in any of the above-described embodiment Adjacent the distance between signal processing unit 20 is reduced in the case where the pitch of small adjacent electrode member 50, so as to pass through The volume of signal processing unit 20 is reduced to reduce the cost of fingerprint Identification sensor.

In one example, former fingerprint sensor will can be split as being used for the fingerprint sensing layer (i.e. to outer contacting One structure sheaf 30) and chip layer (i.e. the second structure sheaf 10), specifically, by by fingerprint sensing electrode member mould group (fingerprint sensing Face) it is split with sensing integrated chip mould group to form individually touching sensory package, reach and utilizes multiple touching sensory package groups It closes to increase the purpose of the sensing area of fingerprint Identification sensor, then by forming multiple touching sensory packages shown in Figure 12 Fingerprint Identification sensor, then by the whole control chip of peripheral data (i.e. fingerprint image processing module 902), integrated circuit will be sensed Chip handle these sensing signals respectively with obtain multiple output signals separately converge it is whole further can to the whole control chip of a data The whole control chip of data to be also placed in the second structure sheaf.The output signals of multiple sensing IC chips outputs converge whole arrive again The whole control chip of this data and obtain entire complete finger print image, and then output is carried out to complete fingerprint image or immediately at identification Corresponding recognition result is managed and exported, existing fingerprint sensor technology is solved and knows in the presence of large area fingerprint can not be compatible with simultaneously Not with higher accuracy of identification the problem of.

In one embodiment, the present embodiment provides a kind of electronic equipments with fingerprint identification function, comprising:

Fingerprint Identification sensor described in any of the above embodiments；And

For obtaining the finger print information, and export according to the finger print information processor of corresponding control instruction.

In one embodiment, the electronic equipment in the present embodiment includes smart phone, tablet computer, PC (PC), the terminals such as personal digital assistant (PDA), learning machine, wherein fingerprint Identification sensor can be used as the input of electronic equipment Device.

Further, which can also include the memory for storing finger print information, and memory may include Read-only memory and random access memory, and instruction and data is provided to processor.Part or all of memory may be used also To include nonvolatile RAM.For example, memory can be with the information of storage device type.

Optionally, the memory is stored with computer program, and the computer program can be run on the processor.

In one embodiment, the processor in the present embodiment can be central processing unit (Central Processing Unit, CPU), which can also be other general processors, digital signal processor (Digital Signal Processor, DSP), specific integrated circuit (Application Specific Integrated Circuit, ASIC), field programmable gate array (Field-Programmable Gate Array, FPGA) or other programmable logic Device, discrete gate or transistor logic, discrete hardware components etc..General processor can be microprocessor or this at Reason device is also possible to any conventional processor etc..

The utility model embodiment provides a kind of touching sensory package, fingerprint Identification sensor and electronic equipment, institute Stating touching sensory package includes: to touch for incuding, and the multiple electrodes member of corresponding inductive signal is generated according to the touching； For fixing the first structure layer of multiple electrode members, wherein multiple electrode members are set to the of the first structure layer On one side, the first structure layer be equipped with multiple signal transmission lines, multiple signal transmission lines respectively with multiple electricity Extremely member connects one to one；And the multiple interconnecting pieces to connect one to one with multiple signal transmission lines, wherein multiple The interconnecting piece be set to the first structure layer the second face, by by fingerprint sensing electrode member mould group and sensing integrated chip mould Group is split to form individually touching sensory package, is reached and is combined using multiple touching sensory packages to increase fingerprint recognition sensing The purpose of the sensing area of device, solve existing fingerprint sensor technology exist can not be compatible with simultaneously large area fingerprint recognition with The problem of higher accuracy of identification.

In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in detail or remembers in some embodiment The part of load may refer to the associated description of other embodiments.

Those of ordinary skill in the art may be aware that list described in conjunction with the examples disclosed in the embodiments of the present disclosure Member and algorithm steps can be realized with the combination of electronic hardware or computer software and electronic hardware.These functions are actually It is implemented in hardware or software, the specific application and design constraint depending on technical solution.Professional technician Each specific application can be used different methods to achieve the described function, but this realization is it is not considered that exceed Scope of the present application.

In embodiment provided herein, it should be understood that disclosed device/terminal and method can pass through Other modes are realized.For example, device/terminal embodiment described above is only schematical, for example, the module or The division of unit, only a kind of logical function partition, there may be another division manner in actual implementation, such as multiple units Or component can be combined or can be integrated into another system, or some features can be ignored or not executed.Another point, institute Display or the mutual coupling or direct-coupling or communication connection discussed can be through some interfaces, device or unit INDIRECT COUPLING or communication connection can be electrical property, mechanical or other forms.

The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme 's.

It, can also be in addition, each functional unit in each embodiment of the application can integrate in one processing unit It is that each unit physically exists alone, can also be integrated in one unit with two or more units.Above-mentioned integrated list Member both can take the form of hardware realization, can also realize in the form of software functional units.

Embodiment described above is only to illustrate the technical solution of the application, rather than its limitations；Although referring to aforementioned reality Example is applied the application is described in detail, those skilled in the art should understand that: it still can be to aforementioned each Technical solution documented by embodiment is modified or equivalent replacement of some of the technical features；And these are modified Or replacement, the spirit and scope of each embodiment technical solution of the application that it does not separate the essence of the corresponding technical solution should all Comprising within the scope of protection of this application.

Claims (10)

1. a kind of touching sensory package, which is characterized in that the touching sensory package includes:

It is touched for incuding, and generates the multiple electrodes member of corresponding inductive signal according to the touching；

For fixing the first structure layer of multiple electrode members, wherein multiple electrode members are set to the first structure layer The first face, the first structure layer be equipped with multiple signal transmission lines, multiple signal transmission lines respectively with multiple institutes Electrode member is stated to connect one to one；And

The multiple interconnecting pieces to connect one to one with multiple signal transmission lines, wherein multiple interconnecting pieces are set to institute State the second face of first structure layer.

2. touching sensory package as described in claim 1, which is characterized in that the first structure layer includes first substrate and the One dielectric structure layer, the first face of the first substrate are the first face of the first structure layer, the second of the first substrate First face paste of face and first dielectric structure layer is closed, and the second face of first dielectric structure layer is the first structure layer The second face；

The signal transmission line includes extending vertically area and horizontal extension area；

The first substrate, which is equipped with, extends vertically groove correspondingly with the electrode member, and the groove inner wall that extends vertically is set Have an insulating layer, it is described extend vertically be equipped in groove it is described extend vertically area, multiple first ends for extending vertically area and more A electrode member connects one to one；

First dielectric structure layer be equipped with multiple horizontal extension areas, the first end in multiple horizontal extension areas with it is multiple described The second end for extending vertically area connects one to one, and the second end in multiple horizontal extension areas and multiple interconnecting pieces are one by one It is correspondingly connected with, multiple interconnecting pieces are set to the second face of first dielectric structure layer.

3. touching sensory package as described in claim 1, which is characterized in that the touching sensory package further include:

Primer set on the second face of the first structure layer；And

The second structure sheaf being fixedly connected by the primer with the first structure layer, second structure sheaf are equipped with multiple connect The inductive signal is received, and converts the inductive signal to the signal processing unit of corresponding detection signal, wherein Duo Gesuo Signal processing unit is stated to connect one to one with multiple interconnecting pieces.

4. touching sensory package as claimed in claim 3, which is characterized in that the electrode member includes scan electrode and receives electric Pole；

The signal processing unit includes:

It is electrically connected with the scan electrode, for controlling the scanning circuit of the scan electrode output scanning signal；And

It is electrically connected with the receiving electrode, for receiving the reception circuit of the inductive signal.

5. touching sensory package as claimed in claim 4, which is characterized in that between the adjacent signal processing unit Away from the spacing being less than between adjacent electrode member.

6. touching sensory package as described in claim 1, which is characterized in that the touching sensory package further include:

Set on the first face of the first structure layer, for covering the protective layer of multiple electrode members.

7. touching sensory package as claimed in claim 3, which is characterized in that the touching sensory package further include:

For covering the molding compound of second structure sheaf.

8. touching sensory package as described in claim 1, which is characterized in that the touching sensory package includes:

Multiple output weld pads set on the second face of the first structure layer, wherein multiple output weld pads and the second structure Multiple signal output ends of layer connect one to one.

9. a kind of fingerprint Identification sensor, which is characterized in that the fingerprint Identification sensor includes:

For generating the fingerprint image processing module of finger print information according to the inductive signal；And

Multiple sequentials such as the described in any item touching sensory packages of claim 1-8, wherein the touching sensory package It is electrically connected with the fingerprint image processing module.

10. a kind of electronic equipment with fingerprint identification function characterized by comprising

Fingerprint Identification sensor as claimed in claim 9；And

For obtaining the finger print information, and export according to the finger print information processor of corresponding control instruction.