CN203733134U - Fingerprint sensing device with anti-counterfeiting function - Google Patents
Fingerprint sensing device with anti-counterfeiting function Download PDFInfo
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- CN203733134U CN203733134U CN201420092798.2U CN201420092798U CN203733134U CN 203733134 U CN203733134 U CN 203733134U CN 201420092798 U CN201420092798 U CN 201420092798U CN 203733134 U CN203733134 U CN 203733134U
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- routing
- packaging
- electrode
- plastic cement
- insulation course
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Abstract
The utility model relates to a fingerprint sensing device with an anti-counterfeiting function, which at least comprises a package substrate, a sensing chip, package bonding wires, a wire bonding electrode and a plastic insulating layer, wherein the sensing chip is arranged on the package substrate and used for sensing approaching information of a finger; the wire bonding electrode is composed of a bonding wire segment and a conductive layer; and the plastic insulating layer packages and covers the package substrate, the sensing chip, the package bonding wires and the wire bonding electrode. Adoption of the fingerprint sensing device provided by the utility model has the beneficial effects that the fingerprint can be sensed without a need of requiring the finger to be directly contacted with the sensing device, electric shock emission charge is exposed to the finger through the surface of the fingerprint sensing device, the charge is received through the built-in sensing chip at the same time to acquire a 3D image of the fingerprint, a coupling electrode with the hidden appearance is provided, the packaging cost can be effectively reduced, the overall beauty of the sensing device can also be controlled, and the size of the sensing device is reduced.
Description
Technical field
The utility model relates to the anti-fraud functional fingerprint induction installation of a kind of fingerprint inductive module, particularly a kind of tool and does not need to point direct contact induction wafer, can sense the fingerprint induction installation of fingerprint.
Background technology
In modern society, often can run into the situation of identity authentication, for example, use passport status audit when the use status of credit card is examined, gone abroad.Generally speaking, this status audit is to carry out in the mode of comparatively coarse desk checking, for example the status of credit card audit is to using handwriting signature as the foundation of audit, and the use passport status of going abroad audit is that comparison user's complexion and photo are as foundation.Yet the possibility of such status comparison mode existentially forgeable.Therefore manufacturer is applied to fingerprint inductor to carry out the occasion of status comparison then, the fingerprint aligning device even if the device that uses traditional fingerprint aligning device to be also very easy to use forgery is out-tricked.
Except the optics of common employing is taken the photograph phase mode print bidimensional image, also has a kind of semicoductor capacitor formula fingerprint inductor, such fingerprint inductor has a sensing chip, and user can, by the sensing element on the direct contact induction sheet of finger, allow sensing element detect line peak and the line paddy of finger print; By this, sensing element can be complete detect user's fingerprint pattern, to confirm user's status.Yet its sensing chip is outside being exposed to, therefore the sensing chip of fingerprint inductor is easy to be subject to static and artificial destruction or finger and buries dirt, and cause responding to malfunctioning, if and the sensing chip of fingerprint inductor bears the direct face contact of finger for a long time, also can cause sensing chip wearing and tearing, cannot fetching finger mark information.
Summary of the invention
The utility model is the defect existing according to prior art, what propose a kind ofly has an anti-fraud functional fingerprint induction installation, it does not need to point direct contact induction device, can sense fingerprint, by fingerprint induction installation surface, expose electrode transmitting electric charge to finger, by built-in sensing wafer, receive the 3D image that electric charge obtains fingerprint simultaneously, there is the hiding lotus root composite electrode of outward appearance, can effectively reduce packaging cost, also can control the overall appearance of sensor, the size of dwindling sensor.
Described in the utility model a kind ofly have anti-fraud functional fingerprint induction installation to realize fingerprint detection be that two groups of coupling electrodes that comprise by it are realized, wherein one group of corium of going up and see through finger to finger for transmission electric charge reflexes to finger surface, separately have one group to be receiver, the current potential, resistance or the temperature that receive finger reach the true and false of distinguishing finger.
Described in the utility model a kind ofly have anti-fraud functional fingerprint induction installation and at least comprise: base plate for packaging, sensing wafer, packaging and routing, routing electrode, plastic cement insulation course; Described sensing wafer is arranged on base plate for packaging, for the information that approaches of sensing finger; Described routing electrode is comprised of routing line segment and conductive layer; Described packaging and routing connection encapsulation substrate and sensing wafer; Described routing line segment is electrically connected sensing wafer and base plate for packaging; Described plastic cement insulation course encapsulation covers base plate for packaging, sensing wafer, packaging and routing and routing electrode; A part for described routing line segment is exposed from the upper surface of plastic cement insulation course; Described plastic cement insulation course upper surface need arrange conductive layer and with routing segment link, as the surface with finger contact.When finger contact lotus root composite electrode as one group of transmitting electric charge during to the metal level of molding bed of material upper surface.
Accompanying drawing explanation
Fig. 1 is structural representation Fig. 1 of fingerprint induction installation described in the utility model;
Fig. 2 is structural representation Fig. 2 of fingerprint induction installation described in the utility model;
Fig. 3 is structural representation Fig. 3 of fingerprint induction installation described in the utility model;
Fig. 4 is structural representation Fig. 4 of fingerprint induction installation described in the utility model.
Embodiment
For more detailed description technical scheme described in the utility model, by following enforcement, further set forth.
In embodiment described in the utility model, described fingerprint induction installation is in order to finger sensing fingerprint F.
In semiconductor package process, generally used routing, so-called routing is generally the aluminium/gold/copper/silver-colored line of very fine, and its line is through being generally 20 to 50 microns, has high conductivity and naked eyes visual characteristic hardly.Technical scheme described in the utility model utilizes the characteristic of routing, allows one end of routing expose and mixes in the molding bed of material, electrostatic defending to be provided or to provide, drives or for the electric connection point of sensing signal; At routing electrode, partly enclose the thin metal of plating one deck, to strengthen strengthening the induction area driving simultaneously.
Because routing has naked eyes visual characteristic hardly, therefore one of them characteristic of technical scheme described in the utility model is formed in one, and does not have the error open defect that two different materials assemblings cause, traditional sheet metal electrode can only provide simple function in addition, electrostatic defending or drive signal for example, technical scheme described in the utility model, adopt routing to make routing electrode, can be that many routings interconnect, also can there is part routing to carry out separately different functions, for example can design the function that it has sensing, for example by impedance, measure mode and can be used as to confirm the resistance of skin the input that prevents prosthetic finger, utilize the mode of routing to make routing electrode, allow routing electrode can with finger contact, the signal lotus root that provides and point is closed, for carrying out electrostatic protection function and/or driving sensing function to use, secondly, the one end by the routing electrode exposing covers a conductor layer again, and metal level, conductive adhesive layer etc., can effectively strengthen and the contact area of pointing in this way, has good identity.
As shown in Figure 1, a kind of fingerprint induction installation described in the utility model at least comprises a base plate for packaging 10, a sensing wafer 20, a plurality of packaging and routings 30, at least one routing electrode 40 and a plastic cement insulation course 50.
Described sensing wafer 20 is arranged on base plate for packaging 10, the information that approaches for sensing finger F, as the line peak of finger and line paddy and the approaching information of sensing wafer 20, the information of distance particularly, comprehensive these approaching information, can obtain the pattern of hand fingerprint peaks and line paddy, namely the fingerprint pattern of common name.
A plurality of packaging and routings 30 by the weld pad of base plate for packaging 10 19 respectively routing be connected to the weld pad 29 of sensing wafer 20, for transmit power supply or electric signal between base plate for packaging 10 and sensing wafer 20.
Described routing electrode 40 is electrically connected to sensing wafer 20 and base plate for packaging 10 or one of at least described sensing wafer 20 and base plate for packaging 10.The quantity of described routing electrode 40 is not limited especially, as long as can reach good signal transmission.
The formation technology of described packaging and routing 30 adopts existing technology.It needs to be noted: in routing encapsulation process, described packaging and routing 30 can form with routing electrode 40 simultaneously, and the camber line vertical height of described packaging and routing 30 is not higher than 80 microns of sensing wafer upper surfaces; The vertical summit of camber line of described routing electrode 40 is higher than the camber line vertical height of packaging and routing 30 and contact with plastic cement insulation course 50 upper surfaces.
The vertical summit of the camber line optimum height of described routing electrode 40 is between 100 to 200 microns of sensing wafer upper surfaces.
Connected mode for routing electrode 40 can be carried out flexible design as required, and the connection sensing wafer 20 of the line electrode 40 of fighting each other below and/or the mode of base plate for packaging 10 conduct further description.
The connected mode one of routing electrode 40:
As shown in Figure 2, described plastic cement insulation course 50 covers base plate for packaging 10, sensing wafer 20, packaging and routing 30 and routing electrode 40 and forms the molding bed of material; The two ends 40A of described routing electrode 40 and 40B are all connected on base plate for packaging 10, and the camber line top of routing electrode is exposed to the upper surface 51 of plastic cement insulation course 50, and the upper surface 51 of plastic cement insulation course 50 is as a surface contacting with finger F.When finger F touches the upper surface 51 of plastic cement insulation course 50, can be bonded to the end face that routing electrode 40 exposes by direct lotus root, meanwhile, finger F also can contact or approach the sensing face of sensing wafer 20.Thus, technical scheme described in the utility model can provide electrostatic protection function and/or drive sensing function to use.
The connected mode two of routing electrode 40:
As shown in Figure 2, described routing electrode 40 can also be an open routing line segment 41, the first end 41A of described routing line segment 41 is connected with base plate for packaging 10 by weld pad, and the second end 41B of described routing line segment 41 is connected with the weld pad that is arranged on plastic cement insulation course 50 upper surfaces 51.
The connected mode three of routing electrode 40:
As shown in Figure 3, routing electrode 40 or routing line segment 41 between described base plate for packaging 10 and the upper surface 51 of plastic cement insulation course 50 can be many groups, to increase the sensitivity of fingerprint induction installation.
The connected mode four of routing electrode 40:
As shown in Figure 4, have a groove 45 on the upper surface 51 of described plastic cement insulation course 50, the two ends of described electric wire electrode 40 are connection encapsulation substrate 10 and described groove 45 respectively, in described groove 45, fills up conductive layer.
No matter how the connected mode of electrode routing 40 changes, and described plastic cement insulation course 50 upper surfaces 51 all need wire mark or vacuum coating or electroplated conductive layer, and described conductive layer is electrically connected to routing electrode or routing line segment.
Further, described routing electrode 40 is decomposed, it at least comprises: routing line segment 41 and conductive layer; Described routing line segment is soldered at least one of sensing wafer 20 and base plate for packaging 10; Described conductive layer is positioned at the upper surface of plastic cement insulation course 50 and is electrically connected to routing line segment 41.
The preparation method of induction fingerprint device described in the utility model is:
The first step: sensing wafer 20 is arranged on base plate for packaging 10;
Second step: utilize a plurality of packaging and routings 30 that base plate for packaging 10 routings are connected to sensing wafer 20, and utilize routing electrode to be electrically connected at least one of sensing wafer 20 and base plate for packaging 10;
The 3rd step: use plastic cement insulation course 50 to cover base plate for packaging 10, sensing wafer 20, packaging and routing 30 and routing electrode, and an end points of routing electrode is exposed from the upper surface of plastic cement insulation course 50;
The 5th step: the upper surface of plastic cement insulation course 50 is returned to mill, make the upper surface exposed portions serve routing of plastic cement insulation course 50;
The 5th step: adopt wire mark or vacuum coating or plating mode, at described plastic cement insulation course 50 upper surfaces, conductive layer is set, and described conductive layer is electrically connected to routing electrode.
Utilize technical scheme described in the utility model, can form and take routing electrode 40 as medium, for electrostatic protection function and/or driving sensing function, use.Because routing electrode 40 and packaging and routing 30 can directly complete in encapsulation factory, can effectively dwindle the volume of fingerprint acquisition apparatus.Even use a lot of routing electrodes 40, because its wire diameter is quite small, it is that naked eyes are visual hardly, and mixes in plastic cement insulation course, almost only demonstrates the outward appearance of single moulding compound, can not show routing, can allow product appearance more beautiful.
In technical scheme described in the utility model, by one groove being set at plastic cement insulation course 50 upper surfaces, and use conductive to fill up the groove of plastic cement insulation course 50, effectively like this avoid plastic cement insulation course 50 upper surfaces that weld pad is set and affect the planarization of finger contact face.Simultaneously due to conductive layer higher than plastic cement insulation course 50, and conductive layer is covered in packaging and routing 30 tops, can cover the extraneous noise for packaging and routing 30 and disturb.
Utilize technical scheme described in the utility model routing electrode 40 can be designed to it and there is the function of sensing, for example two routing electrodes 40 touch finger F simultaneously, by impedance, measure mode to confirm the resistance of skin, can be used as the input that prevents prosthetic finger; Also can see through the various physical features that treatment circuit and routing electrode 40 measure finger F, as temperature, sliding speed, electrostatic belt electric weight etc.It should be noted that: above-mentioned antistatic protection function, driving signal provide function and physical features measurement brake to be independently present in fingerprint sensing device, or all or part of being jointly present in fingerprint sensing device.
Described in the utility model a kind ofly have anti-fraud functional fingerprint induction installation to realize fingerprint detection be that two groups of coupling electrodes that comprise by fingerprint induction installation are realized, first group of electrode is routing electrode, routing electrode mainly completes and sends electric charge and to finger, go up and see through the corium of pointing and reflex to finger surface, second group of receiver that electrode is comprised of packaging and routing connection sensing wafer and base plate for packaging, main current potential, resistance or the temperature that receives finger reaches the true and false of distinguishing finger.
A kind of fingerprint induction installation described in the utility model is when practical application, and user's finger can touch the plastic cement insulation course 50 of fingerprint induction installation; The square wave of first group of routing limit 40 transmitting can directive finger, and the energy of square wave can be through the reflection of finger epidermis lines, and this energy can penetrate plastic cement insulation course 50 via user's finger and the contact between fingerprint induction installation; When the energy of square wave is pointed after reflection certainly, can be by the 20 active receptions of induction wafer.When induction wafer 20 senses after the square wave of reflection, can calculate information or the energy of the square wave being reflected back, and obtain the lines pattern of user's finger print F.When induction wafer 20 obtains after user's the lines pattern of finger print F, the lines pattern of finger print F can be passed to electronic processing wafer, for electronic processing wafer, carry out the functions such as status identification, data encryption, data storage, financial function, Electronic Signature.
Claims (7)
1. have an anti-fraud functional fingerprint induction installation, it is characterized in that, described fingerprint induction installation at least comprises: base plate for packaging, sensing wafer, packaging and routing, routing electrode and plastic cement insulation course; Described plastic cement insulation course encapsulation covers base plate for packaging, sensing wafer, packaging and routing and routing electrode;
Described packaging and routing connection encapsulation substrate and sensing wafer;
Described sensing wafer is arranged on base plate for packaging, for the information that approaches of sensing finger;
Described routing electrode is comprised of routing line segment and conductive layer;
Described routing line segment is electrically connected sensing wafer and base plate for packaging, and a part for routing line segment is exposed from the upper surface of plastic cement insulation course;
The plastic cement insulation course upper surface that described conductive layer is arranged at and with routing segment link.
2. a kind of anti-fraud functional fingerprint induction installation that has as claimed in claim 1, is characterized in that: the two ends of described routing electrode all can be connected on base plate for packaging.
3. a kind of anti-fraud functional fingerprint induction installation that has as claimed in claim 1, is characterized in that: one end of described routing electrode is connected on base plate for packaging, and one end is connected in the upper surface of plastic cement insulation course.
4. a kind of anti-fraud functional fingerprint induction installation that has as claimed in claim 1, is characterized in that: adopt wire mark or vacuum coating or plating mode, at described plastic cement insulation course upper surface, conductive layer is set, and described conductive layer is electrically connected to routing electrode.
5. a kind of anti-fraud functional fingerprint induction installation that has as claimed in claim 1, is characterized in that: described plastic cement insulation course upper surface can also arrange a groove, in described groove, fills up conductive material, and described conductive material is electrically connected to routing line segment.
6. a kind of anti-fraud functional fingerprint induction installation that has as claimed in claim 1, is characterized in that: the camber line vertical height of described packaging and routing is not higher than 80 microns of sensing wafer upper surfaces; The vertical summit of camber line of described routing electrode is higher than the camber line vertical height of packaging and routing and contact with plastic cement insulation course upper surface.
7. a kind of anti-fraud functional fingerprint induction installation that has as claimed in claim 1, is characterized in that: the vertical summit of the camber line optimum height of described routing electrode 40 is between 100 to 200 microns of sensing wafer upper surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420092798.2U CN203733134U (en) | 2014-03-03 | 2014-03-03 | Fingerprint sensing device with anti-counterfeiting function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420092798.2U CN203733134U (en) | 2014-03-03 | 2014-03-03 | Fingerprint sensing device with anti-counterfeiting function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733134U true CN203733134U (en) | 2014-07-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420092798.2U Expired - Fee Related CN203733134U (en) | 2014-03-03 | 2014-03-03 | Fingerprint sensing device with anti-counterfeiting function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203733134U (en) |
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2014
- 2014-03-03 CN CN201420092798.2U patent/CN203733134U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20170303 |