CN104303288A - Fingerprint sensor package and method for manufacturing same - Google Patents
Fingerprint sensor package and method for manufacturing same Download PDFInfo
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- CN104303288A CN104303288A CN201380025789.XA CN201380025789A CN104303288A CN 104303288 A CN104303288 A CN 104303288A CN 201380025789 A CN201380025789 A CN 201380025789A CN 104303288 A CN104303288 A CN 104303288A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 238000004806 packaging method and process Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 abstract description 8
- 230000005540 biological transmission Effects 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q20/00—Payment architectures, schemes or protocols
- G06Q20/38—Payment protocols; Details thereof
- G06Q20/40—Authorisation, e.g. identification of payer or payee, verification of customer or shop credentials; Review and approval of payers, e.g. check credit lines or negative lists
- G06Q20/401—Transaction verification
- G06Q20/4014—Identity check for transactions
- G06Q20/40145—Biometric identity checks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
- G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
- G07F7/0806—Details of the card
- G07F7/0833—Card having specific functional components
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F7/00—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus
- G07F7/08—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means
- G07F7/10—Mechanisms actuated by objects other than coins to free or to actuate vending, hiring, coin or paper currency dispensing or refunding apparatus by coded identity card or credit card or other personal identification means together with a coded signal, e.g. in the form of personal identification information, like personal identification number [PIN] or biometric data
- G07F7/1008—Active credit-cards provided with means to personalise their use, e.g. with PIN-introduction/comparison system
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Business, Economics & Management (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Accounting & Taxation (AREA)
- Computer Security & Cryptography (AREA)
- Manufacturing & Machinery (AREA)
- Finance (AREA)
- Strategic Management (AREA)
- General Business, Economics & Management (AREA)
- Theoretical Computer Science (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention discloses a fingerprint package and a method for manufacturing same, the fingerprint package which enables transmission of a driving signal required for scanning a fingerprint image, improve obtainment sensitivity of a fingerprint sensor by means of smooth swiping, and which has a simple structure so that productivity can be improved during manufacturing. The fingerprint package according to the present invention comprises: a base substrate comprising an interior area, on which a conductive pattern including a bond finger portion is formed and which includes a fingerprint sensor die paddle portion, and an exterior area which is positioned on the outer shell of the interior area and includes a driving electrode die paddle; the fingerprint sensor, which is attached to the fingerprint sensor die paddle on the base substrate and which is provided on the upper surface thereof with a sensor portion and a plurality of input/output pads; a bonding wire for electrically connecting the fingerprint sensor and the bond finger portion on the base substrate; and a mold body for integrally forming the fingerprint sensor and the driving electrode, which are positioned on the base substrate, and for protecting same from the external environment, wherein the driving electrode is formed to have the same height as that of the mold body so that the surface of the driving electrode is exposed to the exterior of the mold body, and wherein the driving electrode is formed around the fingerprint sensor and is connected to the fingerprint sensor through the conductive pattern on the base substrate.
Description
Technical field
The present invention relates to a kind of fingerprint sensor package part, more particularly, relate to simple in a kind of structure and make mechanical strength and be improved for the durability of static discharge and slip (swipe) smoothly can be passed through improve packaging part and the manufacture method thereof of the acquisition sensitivity of fingerprint sensor.
Background technology
Usually; fingerprint identification technology is as being mainly used in being registered by user and authentication procedure prevents the technology of security incident, and the secure access (access) being applied to the protection of the cyber-defence of individual and tissue, content and data, computer or mobile device etc. controls.
Recently, along with the development of mobile technology, as the positioning equipment utilizing the view data of finger print to carry out mouse pointer operation, also fingerprint identification technology is applied to its ranges of application such as the device of bio-identification Trackpad (BTP:Biometric TrackPad) etc. in further expansion.
Fingerprint sensor is used in order to such fingerprint identification technology, described fingerprint sensor is the device of the pattern of fingerprint for identifying human finger, fingerprint sensor is divided into optical sensor, electric-type (capacitance-type and electrically conducting manner), ultrasonic waves mode transducer, heat seeking transducer according to sensing principle, and various types of fingerprint sensor obtains fingerprint image data according to respective drive principle from finger.
Along with electronic product realizes miniaturized and multifunction, the semiconductor package part comprising fingerprint sensor is also required miniaturization/densification, low electric power, multi-functional, ultra high speed signal process, high reliability, low price and picture etc. clearly.In order to meet such requirement, carry out multiple research.
Such fingerprint sensor is the same with common semiconductor chip to be sealed by resin materials such as epoxy-plastic packaging materials (EMC:Epoxy Molding Compound), and the mainboard of electronic equipment is assemblied in as fingerprint sensor package part, time in the prior art with packaging part form exploitation fingerprint sensor, once there is the shortcoming needing a kind of extra parts for exporting the drive singal when scanning fingerprint shape.
In addition, the interval of top (top) between face and fingerprint that such fingerprint sensor package part only minimizes the detecting part of fingerprint sensor could obtain fingerprint image data accurately.
In addition; acquisition sensitivity for finger print data is higher; then thicker compared to can make the protective finish of the detecting part for fingerprint sensor in the past, the mechanical strength of fingerprint sensor package part and the tolerance for static discharge (electrostatic discharge) can be improved thus.
And then, if the finger print data improving fingerprint sensor obtains sensitivity, then when per unit area has identical pixel quantity, even if minimizing pixel count compared with the pixel of existing fingerprint sensor, also can obtain the view data of identical or further improvement, therefore can reduce the size of fingerprint sensor package part.
Further, when carrying out the sliding action for fingerprint recognition, only having the difference in height eliminated between the transducer position different with other, the identification maneuver of fingerprint could be carried out smoothly, and the high identification of precision can be maintained.
Therefore, actual conditions are, need to develop to export the required drive singal when scanning fingerprint shape and the fingerprint sensor package part that can improve the new construction of the acquisition sensitivity of fingerprint sensor in packaging part.
Summary of the invention
Technical problem
The present invention is for solving the problem of above-mentioned proposition, its object is to, there is provided a kind of to export the required drive singal when scanning fingerprint shape and improve the acquisition sensitivity of fingerprint sensor by slide smoothly (swipe) in packaging part, and in structure simple and can improve manufacture time the fingerprint sensor package part of productivity ratio and manufacture method.
Technical scheme
A kind of fingerprint sensor package part is the invention provides for what solve the problem of above-mentioned proposition, it is characterized in that, comprise: substrate, be made up of inside region and exterior lateral area, described inside region is formed with the conductive pattern that comprises bond fingers portion and comprises fingerprint sensor placement portion (die pad (die paddle)), and described exterior lateral area is positioned at the periphery of described inside region and the drive electrode placement portion (signal electrode pad (signal electrode paddle)) comprised for settling drive electrode; Fingerprint sensor, is attached to the fingerprint sensor placement portion of described substrate and has detecting part and multiple input/output pads above; Bonding line, makes the bond fingers portion of described fingerprint sensor and substrate be electrically connected; Drive electrode, with output drive signal around the described fingerprint sensor being arranged in described substrate; Plastic-sealed body, make to be positioned at fingerprint sensor on described substrate and drive electrode integration and make them avoid being subject to the impact of external environment condition, wherein, the surface that described drive electrode is formed identical with the height of plastic-sealed body and described drive electrode exposes outside plastic-sealed body, and described drive electrode to be arranged in around described fingerprint sensor and to be configured to be electrically connected to described fingerprint sensor.
In the present invention, described drive electrode is also connected to described fingerprint sensor by the conductive pattern of described substrate.
Further, described drive electrode is formed at around described fingerprint sensor, and the edge that can be positioned at substrate is to form the form around described plastic-sealed body.
Described drive electrode is connected with the conductive pattern of described mainboard and substrate by being mounted on the mainboard of described substrate.
The cross sectional shape being positioned at the drive electrode of the outermost of described substrate can be formed as "
" font state.
The feature of fingerprint sensor package part is, on described drive electrode and plastic-sealed body, be formed with coating, outside to avoid described drive electrode to be exposed to described coating.
In addition, according to the another kind of form of the present invention of the problem for solving above-mentioned proposition, a kind of fingerprint sensor package part manufacture method is provided, it is characterized in that, comprise the steps: the substrate preparing to be formed by inside region and exterior lateral area, described inside region is formed with the conductive pattern that comprises bond fingers portion and comprises fingerprint sensor placement portion (die pad (die paddle)), described exterior lateral area is positioned at the periphery of described inside region and the drive electrode placement portion (signal electrode pad (signal electrode paddle)) comprised for settling drive electrode, fingerprint sensor is attached to the fingerprint sensor placement portion of described substrate, the drive electrode being used for output drive signal is arranged in around described fingerprint sensor, the input/output pads of described fingerprint sensor and the bond fingers portion electrical connection of substrate is made by wire-bonded, plastic packaging is carried out to make the surface of described drive electrode be exposed and the fingerprint sensor making to be positioned on described substrate and drive electrode avoid being subject to the impact of external environment condition by encapsulation agent.
Beneficial effect
The beneficial effect of fingerprint sensor package part of the present invention and manufacture method thereof is as follows.
First, according to the present invention, boosted productivity by the structure simplifying fingerprint sensor package part.
And, according to the present invention, because the distance of top (top) between face and fingerprint of the detecting part in fingerprint sensor is very little, therefore more clear and fingerprint image data accurately can be obtained, ensure that coating layer thickness fully thus, thus mechanical strength and the tolerance for static discharge can be improved compared with existing fingerprint sensor package part.
In addition, fingerprint sensor package part of the present invention has following effect: by eliminating the difference in height of plastic-sealed body and drive electrode, thus the finger more easily realizing being used for fingerprint recognition moves.
In addition, the present invention, when realizing extra-thin fingerprint sensor package part, can manufacture as not being the wafer-level packaging part manufacture of indivedual encapsulation.
Namely, by the pre-prepd fingerprint sensor of the upper layout of die pad (Die Paddle) that predetermined pattern is arranged on the substrate of wide area with the degree that can manufacture multiple packaging part, and individually carry out the packaging technology such as nude film bonding (Die attach), wire bonding, plastic packaging, then perform separation (Singulation) technique being separated into indivedual packaging part, thus can contribute to boosting productivity when manufacturing fingerprint sensor.
Accompanying drawing explanation
By referring to for the detailed description of embodiments of the invention and the accompanying drawing that will illustrate below, feature of the present invention and advantage will become and be easier to understand, in the drawing:
Fig. 1 is the profile of the formation illustrated according to fingerprint sensor package part of the present invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the profile of another embodiment illustrated according to fingerprint sensor package part of the present invention;
Fig. 4 is the vertical view of Fig. 3;
Fig. 5 illustrates that the fingerprint sensor package part of Fig. 3 is mounted on mainboard and enables drive electrode be electrically connected to the profile of the state of fingerprint sensor.
Embodiment
Below, referring to figs. 1 through Fig. 5, embodiments of the invention are described as follows.The formation identical when being described embodiments of the invention uses identical symbol.
[embodiment 1]
Fig. 1 is the profile of the formation illustrated according to fingerprint sensor package part of the present invention, and Fig. 2 is the vertical view of Fig. 1.
With reference to Fig. 1 and Fig. 2, according to the fingerprint sensor package part of the present embodiment, be configured to comprise: substrate 2, be made up of inside region and exterior lateral area, described inside region is formed with the conductive pattern that comprises bond fingers (bond finger) portion 200 and comprises fingerprint sensor placement portion (die pad (die paddle)) 210, and described exterior lateral area is positioned at the periphery of described inside region and the drive electrode placement portion (signal electrode pad (signal electrode paddle)) 220 comprised for settling drive electrode 3; Fingerprint sensor 1, is attached to the fingerprint sensor placement portion 210 of described substrate 2 and has detecting part 100 and multiple input/output pads 110 above; Bonding line 4, makes the bond fingers portion 200 of described fingerprint sensor 1 and substrate 2 be electrically connected; Drive electrode 3, with output drive signal around the described fingerprint sensor 1 being arranged in described substrate 2; Plastic-sealed body 5, makes to be positioned at fingerprint sensor 1 on described substrate 2 and drive electrode 3 integration and makes them avoid being subject to the impact of external environment condition.
Now, the surface that described drive electrode 3 is formed identical in fact with the height of plastic-sealed body 5 and described drive electrode 3 exposes outside plastic-sealed body 5.
Further, described drive electrode 3 is configured to by the conductive pattern of described substrate 2 and is connected to described fingerprint sensor 1.
Described drive electrode 3 receives drive singal and by its medium radiation to such as finger etc. from the conductive pattern of substrate 2.Described drive singal is the signal of telecommunication comprising RF, for the generation ridge of fingerprint and the electrical characteristics difference of paddy.Such as, the difference of the static capacity caused because of the ridge of fingerprint and the difference in height of paddy is produced.
In addition, described substrate 2 forms conductive pattern in above and below centered by resin bed, and the conductive pattern of described above and below is connected by conductive through hole (not shown).
Described fingerprint sensor 1 comes synthetic image or its model (template) by aforesaid electrical characteristics difference.Further, the fingerprint image of generation or model not only for identifying, certification fingerprint but also follow the trail of the movement of finger.
In this specification, the device that the identification of fingerprint, certification, the tracking that is used for the movement of navigating all perform is referred to as " fingerprint sensor ".
The manufacturing process of the fingerprint sensor package part of the present invention formed as mentioned above is described as follows.
First, prepared substrate 2.Described substrate 2 is for being formed with the circuit board of conductive pattern, and it has relatively larger area compared with fingerprint sensor 1.
That is, prepare to be formed with the conductive pattern that comprises bond fingers portion 200 and the substrate 2 with the drive electrode placement portion (electrode pad (electrode paddle)) 220 of fingerprint sensor placement portion (die pad (die paddle)) 210 and outside thereof.
Next, after adhesive being coated on the fingerprint sensor placement portion 210 of described substrate 2, fingerprint sensor 1 is attached to described fingerprint sensor placement portion 210.
Further, the drive electrode 3 being used for output drive signal is attached to described fingerprint sensor 1 around.
Afterwards, by wire bonding, the input/output pads 110 of described fingerprint sensor 1 and the bond fingers portion 200 of substrate 2 are electrically connected.
After making described input/output pads 110 and bond fingers portion 200 electrical connection, carry out plastic packaging by encapsulation agent and form plastic-sealed body 5, now, plastic packaging is carried out as make the surface of described drive electrode 3 be exposed to impact that plastic-sealed body 5 outside and the fingerprint sensor 1 making to be positioned on described substrate 2 and drive electrode 3 avoid being subject to external environment condition.
The fingerprint sensor package part of the present embodiment come by technique as above can be mounted on mobile device and comprise computer electric appliance and electronic product mainboard 6 and perform self function, now the fingerprint sensor package part of the present embodiment can export the drive singal required when scanning fingerprint shape in packaging part, and make described drive electrode 3 form identical height with plastic-sealed body 5 surface, thus improve the acquisition sensitivity of fingerprint sensor by slide smoothly (swipe).
[embodiment 2]
Fig. 3 is the profile of another embodiment illustrated according to fingerprint sensor package part of the present invention, Fig. 4 is the vertical view of Fig. 3, and Fig. 5 illustrates that the fingerprint sensor package part of Fig. 3 is mounted on mainboard and enables drive electrode be electrically connected to the profile of the state of fingerprint sensor.
With reference to accompanying drawing, according to the fingerprint sensor package part of the present embodiment, be configured to comprise: substrate 2, be made up of inside region and exterior lateral area, described inside region is formed with the conductive pattern that comprises bond fingers portion 200 and comprises fingerprint sensor placement portion (die pad (die paddle)) 210, and described exterior lateral area is positioned at the periphery of described inside region and the drive electrode placement portion (signal electrode pad (signal electrode paddle)) 220 comprised for settling drive electrode 3; Fingerprint sensor 1, is attached to the fingerprint sensor placement portion 210 of described substrate 2 and has detecting part 100 and multiple input/output pads 110 above; Closing line 4, makes the bond fingers portion 200 of described fingerprint sensor 1 and substrate 2 be electrically connected; Drive electrode 3, is arranged in edge above described substrate 2 with output drive signal; Plastic-sealed body 5, makes to be positioned at fingerprint sensor 1 on described substrate 2 and drive electrode 3 integration and makes them avoid being subject to the impact of external environment condition.
Now, the surface that described drive electrode 3 is formed identical with the height of plastic-sealed body 5 and described drive electrode 3 exposes outside plastic-sealed body 5.
In addition, basic comprising is although it is so identical with the packaging part of above-mentioned [embodiment 1], but the fingerprint sensor package part of the present embodiment is unlike the electrical connection being realized drive electrode 3 and fingerprint sensor 1 as [embodiment 1] by the conductive pattern of substrate 2 and bonding line 4, and is through other paths.
Namely, fingerprint sensor package part according to the present embodiment is mounted on mainboard 6, and described drive electrode 3 is configured to be connected to described fingerprint sensor 1 by bonding line after by the conductive pattern (not shown) of mainboard 6 and the conductive pattern of substrate 2 that is connected electrically.
In addition, make the sectional area shape of the drive electrode 3 of the outermost being arranged in described substrate 2 be formed as "
" font state, thus the adhesion for plastic-sealed body 5 can be improved.
In a word, although according to the basic comprising principle of the fingerprint sensor package part of the present embodiment and the packaging part of above-mentioned [embodiment 1] similar, the position of described drive electrode 3 and shape, with the electrical connection of fingerprint sensor on there is structural differences.
Namely, feature according to the fingerprint sensor of the present embodiment is, described drive electrode 3 is formed at around fingerprint sensor 1, and the upper side being formed the edge being positioned at substrate 2 is to form the form around plastic-sealed body 5, and is electrically connected with fingerprint sensor 1 when being mounted on mainboard 6.
[embodiment 1] of the manufacturing process also with above-mentioned of the fingerprint sensor package part according to the present embodiment of formation described above is substantially the same, and difference is only, makes drive electrode 3 be positioned at the edge of substrate 2 in this manufacturing process.
As shown in Figure 5, the mainboard that the fingerprint sensor package part of the present embodiment completed by technique as above is only installed to the electric appliance and electronic product comprising mobile device and computer just can make drive electrode 3 be electrically connected to fingerprint sensor 1 side by mainboard and substrate thus perform self function.
And, the fingerprint sensor package part of the present embodiment also can export the drive singal required when scan fingerprint image in packaging part, and make described drive electrode 3 form identical height with plastic-sealed body 5 surface, thus improve the acquisition sensitivity of fingerprint sensor by sliding smoothly.
In addition, the invention is not restricted to above-described embodiment, when not departing from the scope of technical conceive of the present invention, can carry out changing and revising with various form.
Such as, although above-described embodiment illustrates being exposed above of drive electrode, by stating drive electrode 3 described in being formed at by the coating (not shown) such as black coating and plastic-sealed body 5 makes described drive electrode not be exposed above.
Therefore, will be understood that, described embodiment is not restrictive but exemplary, it should be appreciated by those skilled in the art that thus and the invention is not restricted to above-mentioned explanation, can modify when not departing from by when claim and equivalency range thereof.
Utilizability in industry
The present invention can be used to the safety utilizing fingerprint sensing, the multiple fields such as the interface of certification and electronic installation, and due to simple in structure and can improve manufacture time productivity ratio, and the top of the detecting part due to fingerprint sensor (top) distance between face and fingerprint becomes and minimizes and can obtain fingerprint image data accurately, and mechanical strength and the tolerance for static discharge can be improved, thus can be effectively applied to need to utilize by the mobile device of the certification of fingerprint recognition and the pointer functionality of fingerprint recognition or computer at interior various equipment, therefore be the invention that utilizability in industry is very high.
Claims (7)
1. a fingerprint sensor package part, is characterized in that, comprising:
Substrate, be made up of inside region and exterior lateral area, described inside region is formed with the conductive pattern that comprises bond fingers portion and comprises fingerprint sensor placement portion, and described exterior lateral area is positioned at the periphery of described inside region and the drive electrode placement portion comprised for settling drive electrode;
Fingerprint sensor, is attached to the fingerprint sensor placement portion of described substrate and has detecting part and multiple input/output pads above;
Bonding line, makes the bond fingers portion of described fingerprint sensor and substrate be electrically connected;
Drive electrode, with output drive signal around the described fingerprint sensor being arranged in described substrate;
Plastic-sealed body, makes to be positioned at fingerprint sensor on described substrate and drive electrode integration and makes them avoid being subject to the impact of external environment condition,
Wherein, described drive electrode is formed and the surface of described drive electrode identical in fact with the height of plastic-sealed body and exposes outside plastic-sealed body, and described drive electrode to be arranged in around described fingerprint sensor and drive singal is supplied to described fingerprint sensor as medium by the finger of contact.
2. fingerprint sensor package part according to claim 1, is characterized in that,
Described drive electrode is connected to described fingerprint sensor by the conductive pattern of described substrate.
3. fingerprint sensor package part according to claim 1, is characterized in that,
Described drive electrode is formed at around described fingerprint sensor, and the edge being positioned at substrate is to form the form around described plastic-sealed body.
4. fingerprint sensor package part according to claim 3, is characterized in that,
Described drive electrode is connected with the conductive pattern of described mainboard and substrate by being mounted on the mainboard of described substrate.
5. fingerprint sensor package part according to claim 1, is characterized in that,
The cross sectional shape being positioned at the drive electrode of the outermost of described substrate is formed as
font state.
6. fingerprint sensor package part according to claim 1, is characterized in that,
Coating is formed on described drive electrode and plastic-sealed body, outside to avoid described drive electrode to be exposed to described coating.
7. a fingerprint sensor package part manufacture method, is characterized in that, comprises the steps:
Prepare the substrate formed by inside region and exterior lateral area, described inside region is formed with the conductive pattern that comprises bond fingers portion and comprises fingerprint sensor placement portion, and described exterior lateral area is positioned at the periphery of described inside region and the drive electrode placement portion comprised for settling drive electrode;
Fingerprint sensor is attached to the fingerprint sensor placement portion of described substrate;
The drive electrode being used for output drive signal is arranged in around described fingerprint sensor;
The input/output pads of described fingerprint sensor and the bond fingers portion electrical connection of substrate is made by wire bonding;
Plastic packaging is carried out to make the surface of described drive electrode be exposed and the fingerprint sensor making to be positioned on described substrate and drive electrode avoid being subject to the impact of external environment condition by encapsulation agent.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120051487A KR101362348B1 (en) | 2012-05-15 | 2012-05-15 | Finger Print Sensor Package and Method for Fabricating The Same |
| KR10-2012-0051487 | 2012-05-15 | ||
| PCT/KR2013/004202 WO2013172609A1 (en) | 2012-05-15 | 2013-05-13 | Fingerprint sensor package and method for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104303288A true CN104303288A (en) | 2015-01-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380025789.XA Pending CN104303288A (en) | 2012-05-15 | 2013-05-13 | Fingerprint sensor package and method for manufacturing same |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR101362348B1 (en) |
| CN (1) | CN104303288A (en) |
| WO (1) | WO2013172609A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576594A (en) * | 2014-12-31 | 2015-04-29 | 华天科技（西安）有限公司 | Fingerprint design packaging structure through dispensing technology and preparation method thereof |
| CN106252345A (en) * | 2016-09-20 | 2016-12-21 | 苏州科阳光电科技有限公司 | Fingerprint sensor module and preparation method thereof |
| CN107273854A (en) * | 2017-06-16 | 2017-10-20 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN110058719A (en) * | 2017-12-28 | 2019-07-26 | 乐金显示有限公司 | Fingerprint sensing shows equipment |
| US11288481B2 (en) * | 2019-07-04 | 2022-03-29 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051368A (en) | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method for fingerprint recognition chip |
| CN104051367A (en) | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method for fingerprint recognition chip |
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- 2012-05-15 KR KR1020120051487A patent/KR101362348B1/en active IP Right Grant
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- 2013-05-13 CN CN201380025789.XA patent/CN104303288A/en active Pending
- 2013-05-13 WO PCT/KR2013/004202 patent/WO2013172609A1/en active Application Filing
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| CN1163477A (en) * | 1996-01-26 | 1997-10-29 | 哈里公司 | Integrated circuit device with displaying integrated circuit chip window and its relative method |
| CN1533741A (en) * | 2003-03-31 | 2004-10-06 | ��ʿͨ��ʽ���� | Semiconductor device for fingerprint identification |
| CN101512765A (en) * | 2006-09-15 | 2009-08-19 | 富士通微电子株式会社 | Semiconductor device and manufacturing method thereof |
| CN101441840A (en) * | 2007-11-20 | 2009-05-27 | 索尼株式会社 | Display apparatus |
| US20110215484A1 (en) * | 2010-03-05 | 2011-09-08 | Upek, Inc. | Integrally Molded Die And Bezel Structure For Fingerprint Sensors And The Like |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576594A (en) * | 2014-12-31 | 2015-04-29 | 华天科技（西安）有限公司 | Fingerprint design packaging structure through dispensing technology and preparation method thereof |
| CN106252345A (en) * | 2016-09-20 | 2016-12-21 | 苏州科阳光电科技有限公司 | Fingerprint sensor module and preparation method thereof |
| CN107273854A (en) * | 2017-06-16 | 2017-10-20 | 广东欧珀移动通信有限公司 | The preparation method of fingerprint recognition module and the preparation method of input module |
| CN110058719A (en) * | 2017-12-28 | 2019-07-26 | 乐金显示有限公司 | Fingerprint sensing shows equipment |
| US11288481B2 (en) * | 2019-07-04 | 2022-03-29 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensor, fingerprint recognition module and fingerprint recognition system |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130127740A (en) | 2013-11-25 |
| KR101362348B1 (en) | 2014-02-13 |
| WO2013172609A1 (en) | 2013-11-21 |
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Application publication date: 20150121 |